JPH022899U - - Google Patents
Info
- Publication number
- JPH022899U JPH022899U JP8078688U JP8078688U JPH022899U JP H022899 U JPH022899 U JP H022899U JP 8078688 U JP8078688 U JP 8078688U JP 8078688 U JP8078688 U JP 8078688U JP H022899 U JPH022899 U JP H022899U
- Authority
- JP
- Japan
- Prior art keywords
- circuit component
- positioning
- suction
- adhesive
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例の平面図、第２図は
その側面図、第３図は位置決め手段２２の概略的
構成を示す図、第４図は回路部品１３の取付動作
を説明するための図、第５図は典型的な先行技術
の平面図である。
１２……配線基板、１３……回路部品、１４…
…リール、１７……回転テーブル、１８……回転
軸、１９……吸着手段、２２……位置決め手段、
２３ａ，２３ｂ；２４ａ，２４ｂ……位置決め治
具、５０……ノズル部材、５１……ノズル。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a side view thereof, FIG. 3 is a diagram showing the schematic configuration of the positioning means 22, and FIG. 4 is an explanation of the mounting operation of the circuit component 13. Figure 5 is a typical prior art top view. 12...Wiring board, 13...Circuit components, 14...
... Reel, 17 ... Rotating table, 18 ... Rotating shaft, 19 ... Adsorption means, 22 ... Positioning means,
23a, 23b; 24a, 24b... positioning jig, 50... nozzle member, 51... nozzle.
Claims (1)
と配線基板への前記回路部品の取付位置との間に
配置され、それぞれ相互に近接／離反駆動され、
複数対の位置決め治具が設けられた位置決め手段
とを含み、 前記位置決め手段は、位置決め治具に関して吸
着手段と反対側に配置された接着剤の塗布手段を
備え、位置決め手段によつて回路部品を位置決め
した後に、その回路部品に塗布手段によつて接着
剤を塗布するようにしたことを特徴とする回路部
品の取付装置。[Claims for Utility Model Registration] A circuit component conveying means provided with a suction means, a circuit component conveying means disposed between a circuit component suction position along the moving direction of the suction means and a mounting position of the circuit component on a wiring board. , are driven close to each other/away from each other,
a positioning means provided with a plurality of pairs of positioning jigs, the positioning means comprising an adhesive application means disposed on the opposite side of the adsorption means with respect to the positioning jig, and the positioning means is arranged to hold the circuit component. 1. A circuit component mounting device characterized in that, after positioning, an adhesive is applied to the circuit component by a coating means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988080786U JPH0648960Y2 (en) | 1988-06-17 | 1988-06-17 | Circuit component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988080786U JPH0648960Y2 (en) | 1988-06-17 | 1988-06-17 | Circuit component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH022899U true JPH022899U (en) | 1990-01-10 |
| JPH0648960Y2 JPH0648960Y2 (en) | 1994-12-12 |
Family
ID=31305603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988080786U Expired - Lifetime JPH0648960Y2 (en) | 1988-06-17 | 1988-06-17 | Circuit component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648960Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853887A (en) * | 1981-09-26 | 1983-03-30 | 富士機械製造株式会社 | Method of mounting leadless electronic part on printed board or the like |
-
1988
- 1988-06-17 JP JP1988080786U patent/JPH0648960Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853887A (en) * | 1981-09-26 | 1983-03-30 | 富士機械製造株式会社 | Method of mounting leadless electronic part on printed board or the like |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648960Y2 (en) | 1994-12-12 |
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