JPS6424900U - - Google Patents
Info
- Publication number
- JPS6424900U JPS6424900U JP11887187U JP11887187U JPS6424900U JP S6424900 U JPS6424900 U JP S6424900U JP 11887187 U JP11887187 U JP 11887187U JP 11887187 U JP11887187 U JP 11887187U JP S6424900 U JPS6424900 U JP S6424900U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chuck
- attachment
- stand
- storage hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
Description
第１図は本考案の電子部品着脱装置の１実施例
を示す要部断面図、第２図は従来の電子部品装填
装置を示す断面図、第３図、第４図、第５図及び
第６図は従来の別の装置を示す断面図、第７図及
び第８図は従来の更に別の装置を示す平面図及び
断面図、第９図及び第１０図は従来のマウント装
置を示す断面図である。
１……包装テープ、２……ボトムテープ、３…
…部品収納穴、４……台、５……吸着ノズル（チ
ヤツク）、６……電子部品、７……カバーテープ
、１５……磁石。
FIG. 1 is a sectional view of essential parts showing one embodiment of the electronic component loading/unloading device of the present invention, FIG. 2 is a sectional view showing a conventional electronic component loading device, FIGS. 3, 4, 5, and 5. 6 is a sectional view showing another conventional device, FIGS. 7 and 8 are a plan view and sectional view showing still another conventional device, and FIGS. 9 and 10 are sectional views showing a conventional mounting device. It is a diagram. 1...Packaging tape, 2...Bottom tape, 3...
...Component storage hole, 4...stand, 5...adsorption nozzle (chuck), 6...electronic component, 7...cover tape, 15...magnet.
Claims (1)
装テープを載置・搬送する台と、電子部品を吸着
して搬送するチヤツクとを備え、該チヤツクの移
動により前記電子部品を前記部品収納穴に対して
装填または取出すようにした電子部品着脱装置に
おいて、前記台の上面に、少なくとも前記チヤツ
クの着脱部位から前記カバーテープの剥離・貼着
部位に至る長さの磁石を設けたことを特徴とする
電子部品着脱装置。 It is equipped with a stand on which a packaging tape is placed and conveyed to cover the component storage hole with a cover tape, and a chuck that adsorbs and conveys the electronic component, and by moving the chuck, the electronic component is moved to the component storage hole. An electronic component attachment/detachment device for loading or unloading an electronic component, characterized in that a magnet having a length extending from at least the attachment/detachment area of the chuck to the peel/adhesion area of the cover tape is provided on the top surface of the stand. Parts attachment/detachment device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11887187U JPS6424900U (en) | 1987-08-04 | 1987-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11887187U JPS6424900U (en) | 1987-08-04 | 1987-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424900U true JPS6424900U (en) | 1989-02-10 |
Family
ID=31363598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11887187U Pending JPS6424900U (en) | 1987-08-04 | 1987-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424900U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04112008U (en) * | 1991-01-18 | 1992-09-29 | 株式会社 東京ウエルズ | Electronic component taping equipment |
| JPH0581004U (en) * | 1992-04-02 | 1993-11-02 | 澁谷工業株式会社 | Chip component insertion device |
| WO1997024912A1 (en) * | 1995-12-28 | 1997-07-10 | Matsushita Electric Industrial Co., Ltd. | Part supplying device |
| JPH10163684A (en) * | 1996-12-02 | 1998-06-19 | Taiyo Yuden Co Ltd | Parts supply device |
| JP2000228600A (en) * | 1999-02-05 | 2000-08-15 | Matsushita Electric Ind Co Ltd | Parts supply device |
-
1987
- 1987-08-04 JP JP11887187U patent/JPS6424900U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04112008U (en) * | 1991-01-18 | 1992-09-29 | 株式会社 東京ウエルズ | Electronic component taping equipment |
| JPH0581004U (en) * | 1992-04-02 | 1993-11-02 | 澁谷工業株式会社 | Chip component insertion device |
| WO1997024912A1 (en) * | 1995-12-28 | 1997-07-10 | Matsushita Electric Industrial Co., Ltd. | Part supplying device |
| US6082428A (en) * | 1995-12-28 | 2000-07-04 | Matsushita Electric Industrial Co., Ltd. | Part supplying device |
| JPH10163684A (en) * | 1996-12-02 | 1998-06-19 | Taiyo Yuden Co Ltd | Parts supply device |
| JP2000228600A (en) * | 1999-02-05 | 2000-08-15 | Matsushita Electric Ind Co Ltd | Parts supply device |
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