JPH01169034U - - Google Patents
Info
- Publication number
- JPH01169034U JPH01169034U JP6612288U JP6612288U JPH01169034U JP H01169034 U JPH01169034 U JP H01169034U JP 6612288 U JP6612288 U JP 6612288U JP 6612288 U JP6612288 U JP 6612288U JP H01169034 U JPH01169034 U JP H01169034U
- Authority
- JP
- Japan
- Prior art keywords
- tray
- spring
- semiconductor substrate
- storing
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の半導体基板梱包用トレイの一
実施例を示す分解図、第２図は従来のトレイの分
解図である。
１：トレイ、２：半導体基板、３：蓋、４：底
、５：スプリング、６：コーテイング部。
FIG. 1 is an exploded view showing an embodiment of the semiconductor substrate packaging tray of the present invention, and FIG. 2 is an exploded view of a conventional tray. 1: tray, 2: semiconductor substrate, 3: lid, 4: bottom, 5: spring, 6: coating section.
Claims (1)
、前記半導体基板を収納して保管する半導体基板
梱包用トレイにおいて、該トレイおよび前記スプ
リングの表面に、フツ素樹脂、ポリエステル、ポ
リアミドおよびポリウレタンの何れかを用いてな
るコーテイング部が設けてあることを特徴とする
半導体基板梱包用トレイ。 In a semiconductor substrate packaging tray for storing and storing the semiconductor substrate, the tray is equipped with a spring to prevent the semiconductor substrate from shaking, and the tray and the spring are made of any one of fluororesin, polyester, polyamide, and polyurethane on the surfaces of the tray and the spring. A tray for packaging semiconductor substrates, characterized by being provided with a coating portion made of
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6612288U JPH01169034U (en) | 1988-05-19 | 1988-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6612288U JPH01169034U (en) | 1988-05-19 | 1988-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01169034U true JPH01169034U (en) | 1989-11-29 |
Family
ID=31291537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6612288U Pending JPH01169034U (en) | 1988-05-19 | 1988-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169034U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112106A1 (en) * | 2004-05-19 | 2005-11-24 | Nippon Mining & Metals Co., Ltd. | Wafer storage container |
| JP2008531416A (en) * | 2005-02-27 | 2008-08-14 | インテグリス・インコーポレーテッド | Reticle pod with insulation system |
| JP2010165882A (en) * | 2009-01-16 | 2010-07-29 | Lintec Corp | Carrying device for semiconductor wafer, and carrying method therefor |
-
1988
- 1988-05-19 JP JP6612288U patent/JPH01169034U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112106A1 (en) * | 2004-05-19 | 2005-11-24 | Nippon Mining & Metals Co., Ltd. | Wafer storage container |
| JPWO2005112106A1 (en) * | 2004-05-19 | 2008-07-31 | 日鉱金属株式会社 | Wafer storage container |
| US7510082B2 (en) | 2004-05-19 | 2009-03-31 | Nippon Mining & Metals Co., Ltd. | Wafer storage container |
| JP4676430B2 (en) * | 2004-05-19 | 2011-04-27 | Ｊｘ日鉱日石金属株式会社 | Wafer storage container |
| JP2008531416A (en) * | 2005-02-27 | 2008-08-14 | インテグリス・インコーポレーテッド | Reticle pod with insulation system |
| JP2010165882A (en) * | 2009-01-16 | 2010-07-29 | Lintec Corp | Carrying device for semiconductor wafer, and carrying method therefor |