JPH0397087U - - Google Patents
Info
- Publication number
- JPH0397087U JPH0397087U JP319390U JP319390U JPH0397087U JP H0397087 U JPH0397087 U JP H0397087U JP 319390 U JP319390 U JP 319390U JP 319390 U JP319390 U JP 319390U JP H0397087 U JPH0397087 U JP H0397087U
- Authority
- JP
- Japan
- Prior art keywords
- package
- sectional
- view
- protrusion
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Packaging Frangible Articles (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案によるＩＣパツケージの実施
例を示す要部断面図。第２図は、別の実施例を示
す要部断面図。第３図は、ＩＣパツケージの従来
例を示す断面図であり、第４図は、第３図のＩＣ
パツケージを収納容器に収納した時の要部断面図
。
１……筒状収納容器、２……溝、３……ＤＩＰ
形ＩＣパツケージ、４……突起、５……ＳＯＰ形
ＩＣパツケージ、６……溝、７……突起。
FIG. 1 is a sectional view of essential parts showing an embodiment of an IC package according to the present invention. FIG. 2 is a sectional view of main parts showing another embodiment. 3 is a sectional view showing a conventional example of an IC package, and FIG. 4 is a sectional view of the IC package shown in FIG.
A sectional view of the main parts when the package cage is stored in the storage container. 1... Cylindrical storage container, 2... Groove, 3... DIP
Type IC package cage, 4... protrusion, 5... SOP type IC package cage, 6... groove, 7... protrusion.
Claims (1)
なくとも一条の突起あるいは溝を非対象の位置に
有することを特徴とするＩＣパツケージ。 An IC package characterized by having at least one protrusion or groove at asymmetrical positions on the top or bottom surface of the IC package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP319390U JPH0397087U (en) | 1990-01-18 | 1990-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP319390U JPH0397087U (en) | 1990-01-18 | 1990-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0397087U true JPH0397087U (en) | 1991-10-04 |
Family
ID=31507028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP319390U Pending JPH0397087U (en) | 1990-01-18 | 1990-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0397087U (en) |
-
1990
- 1990-01-18 JP JP319390U patent/JPH0397087U/ja active Pending