JPS63183067U - - Google Patents
Info
- Publication number
- JPS63183067U JPS63183067U JP7419787U JP7419787U JPS63183067U JP S63183067 U JPS63183067 U JP S63183067U JP 7419787 U JP7419787 U JP 7419787U JP 7419787 U JP7419787 U JP 7419787U JP S63183067 U JPS63183067 U JP S63183067U
- Authority
- JP
- Japan
- Prior art keywords
- chip parts
- hole
- storage hole
- view
- carrier tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の一実施例によるチツプ部品包
装用キヤリアテープを示す平面図、第２図は第１
図のＡ−Ａ′線より見た拡大断面図、第３図は本
考案の第２の実施例の拡大断面図、第４図、第５
図は本考案の第３、第４の実施例の拡大断面図、
第６図は従来のチツプ部品包装用キヤリアテープ
を示す平面図、第７図は従来においてチツプ部品
キヤリアテープより装着機吸引ヘツドがチツプ部
品を吸引する状態を示す拡大断面図、第８図は従
来において下テープの接着材がしみ出し、チツプ
部品に付着している状態を示す拡大断面図である
。
１０……上テープ、１１……テープ基材、１２
……下テープ、１３……チツプ部品収納穴、１４
……貫通孔、１５，１５ａ，１５ｂ，１５ｃ……
貫通孔周辺の盛り上がり部、１６……送り孔。
FIG. 1 is a plan view showing a carrier tape for packaging chip parts according to an embodiment of the present invention, and FIG.
FIG. 3 is an enlarged sectional view of the second embodiment of the present invention, FIGS.
The figure is an enlarged sectional view of the third and fourth embodiments of the present invention.
Fig. 6 is a plan view showing a conventional carrier tape for packaging chip parts, Fig. 7 is an enlarged sectional view showing a state in which the suction head of the mounting machine sucks chip parts from the conventional chip part carrier tape, and Fig. 8 is a conventional FIG. 7 is an enlarged sectional view showing a state in which the adhesive of the lower tape has seeped out and is attached to the chip component. 10...Top tape, 11...Tape base material, 12
...Bottom tape, 13...Chip parts storage hole, 14
...Through holes, 15, 15a, 15b, 15c...
Swelled portion around the through hole, 16... feed hole.
Claims (1)
数個の貫通する孔を設け、且つその孔の周辺部に
チツプ部品収納穴側に盛り上がらせてなる盛り上
がり部を設けてなるチツプ部品包装用キヤリアテ
ープ。 A carrier tape for packaging chip parts, which has one or more penetrating holes in the center of the bottom of the chip parts storage hole, and a raised part raised toward the chip parts storage hole side around the hole. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7419787U JPS63183067U (en) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7419787U JPS63183067U (en) | 1987-05-18 | 1987-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63183067U true JPS63183067U (en) | 1988-11-25 |
Family
ID=30919193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7419787U Pending JPS63183067U (en) | 1987-05-18 | 1987-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63183067U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01122463U (en) * | 1988-02-04 | 1989-08-21 |
-
1987
- 1987-05-18 JP JP7419787U patent/JPS63183067U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01122463U (en) * | 1988-02-04 | 1989-08-21 |