JPH01122463U - - Google Patents

Info

Publication number
JPH01122463U
JPH01122463U JP1988012999U JP1299988U JPH01122463U JP H01122463 U JPH01122463 U JP H01122463U JP 1988012999 U JP1988012999 U JP 1988012999U JP 1299988 U JP1299988 U JP 1299988U JP H01122463 U JPH01122463 U JP H01122463U
Authority
JP
Japan
Prior art keywords
storage holes
tape
electronic components
base tape
packaging device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988012999U
Other languages
Japanese (ja)
Other versions
JPH076124Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988012999U priority Critical patent/JPH076124Y2/en
Priority to KR2019880016735U priority patent/KR920008600Y1/en
Publication of JPH01122463U publication Critical patent/JPH01122463U/ja
Application granted granted Critical
Publication of JPH076124Y2 publication Critical patent/JPH076124Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による電子部品の包装装置の一
実施例を示す要部斜視図、第2図は第1図の拡大
縦断面図、第3図は従来の電子部品の包装装置の
要部斜視図、第4図は第3図の縦断面図である。 10……ベーステープ、11……収納穴、12
……電子部品、13……カバーテープ、14……
小突起部。
FIG. 1 is a perspective view of the main parts of an embodiment of the packaging device for electronic components according to the present invention, FIG. 2 is an enlarged vertical sectional view of FIG. 1, and FIG. 3 is the main parts of the conventional packaging device for electronic parts. The perspective view, FIG. 4, is a longitudinal sectional view of FIG. 3. 10...Base tape, 11...Storage hole, 12
...Electronic parts, 13...Cover tape, 14...
Small projection.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品収納用の収納穴が少なくとも一方を開口し
てテープ長手方向へ間欠的に形成されたベーステ
ープと、前記収納穴に収納された電子部品が脱落
しないように該収納穴の開口を被覆するように前
記ベーステープに取付けられ、少なくとも電子部
品に対向する部分には多数の小突起部を形成して
なるカバーテープとを具備したことを特徴とする
電子部品の包装装置。
A base tape in which storage holes for storing components are formed intermittently in the longitudinal direction of the tape with at least one side open, and the openings of the storage holes are covered to prevent electronic components stored in the storage holes from falling out. 1. A packaging device for electronic components, comprising: a cover tape attached to the base tape and having a large number of small protrusions formed at least in a portion facing the electronic component.
JP1988012999U 1988-02-04 1988-02-04 Electronic component packaging equipment Expired - Lifetime JPH076124Y2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988012999U JPH076124Y2 (en) 1988-02-04 1988-02-04 Electronic component packaging equipment
KR2019880016735U KR920008600Y1 (en) 1988-02-04 1988-10-02 Package for packing electrical members

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988012999U JPH076124Y2 (en) 1988-02-04 1988-02-04 Electronic component packaging equipment

Publications (2)

Publication Number Publication Date
JPH01122463U true JPH01122463U (en) 1989-08-21
JPH076124Y2 JPH076124Y2 (en) 1995-02-15

Family

ID=31222932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988012999U Expired - Lifetime JPH076124Y2 (en) 1988-02-04 1988-02-04 Electronic component packaging equipment

Country Status (2)

Country Link
JP (1) JPH076124Y2 (en)
KR (1) KR920008600Y1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58129697U (en) * 1982-02-26 1983-09-02 株式会社東芝 Chip parts packaging equipment
JPS63183067U (en) * 1987-05-18 1988-11-25

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58129697U (en) * 1982-02-26 1983-09-02 株式会社東芝 Chip parts packaging equipment
JPS63183067U (en) * 1987-05-18 1988-11-25

Also Published As

Publication number Publication date
JPH076124Y2 (en) 1995-02-15
KR920008600Y1 (en) 1992-12-05
KR890018229U (en) 1989-09-09

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