JPH01122463U - - Google Patents
Info
- Publication number
- JPH01122463U JPH01122463U JP1988012999U JP1299988U JPH01122463U JP H01122463 U JPH01122463 U JP H01122463U JP 1988012999 U JP1988012999 U JP 1988012999U JP 1299988 U JP1299988 U JP 1299988U JP H01122463 U JPH01122463 U JP H01122463U
- Authority
- JP
- Japan
- Prior art keywords
- storage holes
- tape
- electronic components
- base tape
- packaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 claims description 3
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第1図は本考案による電子部品の包装装置の一
実施例を示す要部斜視図、第2図は第1図の拡大
縦断面図、第3図は従来の電子部品の包装装置の
要部斜視図、第4図は第3図の縦断面図である。
10……ベーステープ、11……収納穴、12
……電子部品、13……カバーテープ、14……
小突起部。
FIG. 1 is a perspective view of the main parts of an embodiment of the packaging device for electronic components according to the present invention, FIG. 2 is an enlarged vertical sectional view of FIG. 1, and FIG. 3 is the main parts of the conventional packaging device for electronic parts. The perspective view, FIG. 4, is a longitudinal sectional view of FIG. 3. 10...Base tape, 11...Storage hole, 12
...Electronic parts, 13...Cover tape, 14...
Small projection.
Claims (1)
てテープ長手方向へ間欠的に形成されたベーステ
ープと、前記収納穴に収納された電子部品が脱落
しないように該収納穴の開口を被覆するように前
記ベーステープに取付けられ、少なくとも電子部
品に対向する部分には多数の小突起部を形成して
なるカバーテープとを具備したことを特徴とする
電子部品の包装装置。 A base tape in which storage holes for storing components are formed intermittently in the longitudinal direction of the tape with at least one side open, and the openings of the storage holes are covered to prevent electronic components stored in the storage holes from falling out. 1. A packaging device for electronic components, comprising: a cover tape attached to the base tape and having a large number of small protrusions formed at least in a portion facing the electronic component.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988012999U JPH076124Y2 (en) | 1988-02-04 | 1988-02-04 | Electronic component packaging equipment |
KR2019880016735U KR920008600Y1 (en) | 1988-02-04 | 1988-10-02 | Package for packing electrical members |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988012999U JPH076124Y2 (en) | 1988-02-04 | 1988-02-04 | Electronic component packaging equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01122463U true JPH01122463U (en) | 1989-08-21 |
JPH076124Y2 JPH076124Y2 (en) | 1995-02-15 |
Family
ID=31222932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988012999U Expired - Lifetime JPH076124Y2 (en) | 1988-02-04 | 1988-02-04 | Electronic component packaging equipment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH076124Y2 (en) |
KR (1) | KR920008600Y1 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58129697U (en) * | 1982-02-26 | 1983-09-02 | 株式会社東芝 | Chip parts packaging equipment |
JPS63183067U (en) * | 1987-05-18 | 1988-11-25 |
-
1988
- 1988-02-04 JP JP1988012999U patent/JPH076124Y2/en not_active Expired - Lifetime
- 1988-10-02 KR KR2019880016735U patent/KR920008600Y1/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58129697U (en) * | 1982-02-26 | 1983-09-02 | 株式会社東芝 | Chip parts packaging equipment |
JPS63183067U (en) * | 1987-05-18 | 1988-11-25 |
Also Published As
Publication number | Publication date |
---|---|
JPH076124Y2 (en) | 1995-02-15 |
KR920008600Y1 (en) | 1992-12-05 |
KR890018229U (en) | 1989-09-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH01122463U (en) | ||
JPH0211020U (en) | ||
JPH0410066U (en) | ||
JPH0456662U (en) | ||
JPH0377312U (en) | ||
JPS62132982U (en) | ||
JPS58151579U (en) | packaging equipment | |
JPS58129697U (en) | Chip parts packaging equipment | |
JPH01154182U (en) | ||
JPH0387420U (en) | ||
JPH0163139U (en) | ||
JPS61119973U (en) | ||
JPS6310083U (en) | ||
JPH0477835U (en) | ||
JPS60192488U (en) | Wiring board storage case | |
JPH0244389U (en) | ||
JPS61103379U (en) | ||
JPH0390496U (en) | ||
JPS6228780U (en) | ||
JPH01152574U (en) | ||
JPS6117073U (en) | dispensing equipment | |
JPH0438766U (en) | ||
JPH041171U (en) | ||
JPS5938760U (en) | artificial reef | |
JPH01170681U (en) |