KR890018229U - Packaging device for electronic parts - Google Patents

Packaging device for electronic parts

Info

Publication number
KR890018229U
KR890018229U KR2019880016735U KR880016735U KR890018229U KR 890018229 U KR890018229 U KR 890018229U KR 2019880016735 U KR2019880016735 U KR 2019880016735U KR 880016735 U KR880016735 U KR 880016735U KR 890018229 U KR890018229 U KR 890018229U
Authority
KR
South Korea
Prior art keywords
electronic parts
packaging device
packaging
electronic
parts
Prior art date
Application number
KR2019880016735U
Other languages
Korean (ko)
Other versions
KR920008600Y1 (en
Inventor
이사오 미카미
Original Assignee
알프스뎅키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알프스뎅키 가부시키가이샤 filed Critical 알프스뎅키 가부시키가이샤
Publication of KR890018229U publication Critical patent/KR890018229U/en
Application granted granted Critical
Publication of KR920008600Y1 publication Critical patent/KR920008600Y1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
KR2019880016735U 1988-02-04 1988-10-02 Package for packing electrical members KR920008600Y1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP88-12999 1988-02-04
JP1988012999U JPH076124Y2 (en) 1988-02-04 1988-02-04 Electronic component packaging equipment

Publications (2)

Publication Number Publication Date
KR890018229U true KR890018229U (en) 1989-09-09
KR920008600Y1 KR920008600Y1 (en) 1992-12-05

Family

ID=31222932

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019880016735U KR920008600Y1 (en) 1988-02-04 1988-10-02 Package for packing electrical members

Country Status (2)

Country Link
JP (1) JPH076124Y2 (en)
KR (1) KR920008600Y1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58129697U (en) * 1982-02-26 1983-09-02 株式会社東芝 Chip parts packaging equipment
JPS63183067U (en) * 1987-05-18 1988-11-25

Also Published As

Publication number Publication date
JPH076124Y2 (en) 1995-02-15
KR920008600Y1 (en) 1992-12-05
JPH01122463U (en) 1989-08-21

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20021126

Year of fee payment: 11

EXPY Expiration of term