JPS63172126U - - Google Patents

Info

Publication number
JPS63172126U
JPS63172126U JP1987064472U JP6447287U JPS63172126U JP S63172126 U JPS63172126 U JP S63172126U JP 1987064472 U JP1987064472 U JP 1987064472U JP 6447287 U JP6447287 U JP 6447287U JP S63172126 U JPS63172126 U JP S63172126U
Authority
JP
Japan
Prior art keywords
hole
accommodation
chip
shaped electronic
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987064472U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987064472U priority Critical patent/JPS63172126U/ja
Publication of JPS63172126U publication Critical patent/JPS63172126U/ja
Pending legal-status Critical Current

Links

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図と第2図は本考案に係るチツプ状電子部
品並べ治具の一実施例を示す平面図と側面図、第
3図と第4図は第1図のA―A線断面図と要部平
面図、第5図と第6図は第1図のB―B線断面図
、第7図と第8図は従来のチツプ状電子部品並べ
治具の一具体例を示す部分平面図とそのC―C線
断面図、第9図は従来の問題点を示す第7図の並
べ治具の部分平面図、第10図と第11図は第9
図のD―D線断面図とE―E線断面図である。 2……チツプ状電子部品、6……固定板、6a
……収容孔、7……移動板、7a……貫通孔、6
a,7a……重なり孔。
1 and 2 are a plan view and a side view showing an embodiment of a jig for arranging chip-shaped electronic components according to the present invention, and FIGS. 3 and 4 are a sectional view taken along the line AA in FIG. A plan view of the main part, FIGS. 5 and 6 are sectional views taken along the line BB in FIG. 1, and FIGS. 7 and 8 are partial plan views showing a specific example of a conventional chip-shaped electronic component arrangement jig. 9 is a partial plan view of the arranging jig shown in FIG. 7 showing the conventional problems, and FIGS. 10 and 11 are
They are a sectional view taken along the line DD and a sectional view taken along the line EE in the figure. 2... Chip-shaped electronic component, 6... Fixing plate, 6a
...Accommodation hole, 7...Moving plate, 7a...Through hole, 6
a, 7a...Overlapping holes.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に、適度の余裕をもつたチツプ状電子部品
の収容孔を複数個穿設した固定板と、上記固定板
に重合して、各収容孔と略重なる位置に収容孔と
は異なる寸法の貫通孔が穿設された移動板とを具
備し、上記移動板の移動により上記収容孔と貫通
孔との重なり孔の寸法を調節することを特徴とす
るチツプ状電子部品並べ治具。
A fixing plate with a plurality of accommodation holes for chip-shaped electronic components with an appropriate margin on its surface, and a through hole with different dimensions from the accommodation holes at a position that overlaps with the fixing plate and almost overlaps each accommodation hole. 1. A jig for arranging chip-shaped electronic components, comprising: a movable plate having holes drilled therein; and a size of an overlapping hole between the accommodation hole and the through hole is adjusted by moving the movable plate.
JP1987064472U 1987-04-28 1987-04-28 Pending JPS63172126U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987064472U JPS63172126U (en) 1987-04-28 1987-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987064472U JPS63172126U (en) 1987-04-28 1987-04-28

Publications (1)

Publication Number Publication Date
JPS63172126U true JPS63172126U (en) 1988-11-09

Family

ID=30900663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987064472U Pending JPS63172126U (en) 1987-04-28 1987-04-28

Country Status (1)

Country Link
JP (1) JPS63172126U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010137546A1 (en) * 2009-05-27 2010-12-02 株式会社村田製作所 Component alignment device and method for producing electronic components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010137546A1 (en) * 2009-05-27 2010-12-02 株式会社村田製作所 Component alignment device and method for producing electronic components
JP2010278153A (en) * 2009-05-27 2010-12-09 Murata Mfg Co Ltd Component alignment device, and method for producing electronic components
JP4636196B2 (en) * 2009-05-27 2011-02-23 株式会社村田製作所 Component alignment apparatus and electronic component manufacturing method
TWI417915B (en) * 2009-05-27 2013-12-01 Murata Manufacturing Co Method for manufacturing parts and electronic parts
US8938875B2 (en) 2009-05-27 2015-01-27 Murata Manufacturing Co., Ltd. Component aligning apparatus and electronic component manufacturing method

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