JPH0249161U - - Google Patents

Info

Publication number
JPH0249161U
JPH0249161U JP12631088U JP12631088U JPH0249161U JP H0249161 U JPH0249161 U JP H0249161U JP 12631088 U JP12631088 U JP 12631088U JP 12631088 U JP12631088 U JP 12631088U JP H0249161 U JPH0249161 U JP H0249161U
Authority
JP
Japan
Prior art keywords
guide hole
printed wiring
wiring board
parting line
dividing means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12631088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12631088U priority Critical patent/JPH0249161U/ja
Publication of JPH0249161U publication Critical patent/JPH0249161U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図はこの考案の一実施例に係り
、第1図Aは耳部を分割除去する前の基板原板を
示す平面図、第1図Bは耳部を分割除去した後の
印刷配線板を示す平面図、第2図Aは第1図のa
−a線断面図、第2図Bは第1図のb−b線断面
図、第3図は他の実施例を示す平面図、第4図は
従来例を示す平面図である。 11……基板原板、12……印刷配線板、13
……耳部、14……ガイド孔、15……分割手段
、16……分割線、17……連通孔。
Figures 1 and 2 relate to an embodiment of this invention, where Figure 1A is a plan view showing the original board before the edges are divided and removed, and Figure 1B is after the edges are divided and removed. A plan view showing the printed wiring board, FIG. 2A is the same as a in FIG. 1.
2B is a sectional view taken along the line bb--a of FIG. 1, FIG. 3 is a plan view showing another embodiment, and FIG. 4 is a plan view showing a conventional example. 11... Original board, 12... Printed wiring board, 13
... Ear portion, 14 ... Guide hole, 15 ... Division means, 16 ... Partition line, 17 ... Communication hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ガイド孔を有する基板原板の周辺不要部を該ガ
イド孔に近接した分割線に沿つて分割除去して形
成する印刷配線板であつて、前記分割線上に分割
手段を設けると共に、前記ガイド孔をこの分割手
段に連通したことを特徴とする印刷配線板。
A printed wiring board is formed by dividing and removing an unnecessary peripheral part of a substrate original plate having a guide hole along a parting line close to the guide hole, in which a dividing means is provided on the parting line, and the guide hole is separated from the guide hole. A printed wiring board characterized by communicating with a dividing means.
JP12631088U 1988-09-29 1988-09-29 Pending JPH0249161U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12631088U JPH0249161U (en) 1988-09-29 1988-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12631088U JPH0249161U (en) 1988-09-29 1988-09-29

Publications (1)

Publication Number Publication Date
JPH0249161U true JPH0249161U (en) 1990-04-05

Family

ID=31377722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12631088U Pending JPH0249161U (en) 1988-09-29 1988-09-29

Country Status (1)

Country Link
JP (1) JPH0249161U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286163U (en) * 1988-12-22 1990-07-09
JP2006222153A (en) * 2005-02-08 2006-08-24 Alps Electric Co Ltd Method for manufacturing electronic substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286163U (en) * 1988-12-22 1990-07-09
JP2006222153A (en) * 2005-02-08 2006-08-24 Alps Electric Co Ltd Method for manufacturing electronic substrate
JP4599186B2 (en) * 2005-02-08 2010-12-15 アルプス電気株式会社 Manufacturing method of electronic substrate

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