JPS63182567U - - Google Patents

Info

Publication number
JPS63182567U
JPS63182567U JP7422387U JP7422387U JPS63182567U JP S63182567 U JPS63182567 U JP S63182567U JP 7422387 U JP7422387 U JP 7422387U JP 7422387 U JP7422387 U JP 7422387U JP S63182567 U JPS63182567 U JP S63182567U
Authority
JP
Japan
Prior art keywords
board
printed wiring
kit
parts
extracted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7422387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7422387U priority Critical patent/JPS63182567U/ja
Publication of JPS63182567U publication Critical patent/JPS63182567U/ja
Pending legal-status Critical Current

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Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のキツト基板の平面図、第2図
は第1図に示すキツト基板から抜取られた印刷配
線板の平面図、第3図及び第5図はそれぞれ従来
のキツト基板の平面図、第4図は第3図に示すキ
ツト基板から抜取られた印刷配線板の平面図、第
6図は第5図に示すキツト基板から抜取られた印
刷配線板の平面図である。 7……キツト基板、8……印刷配線板、9……
抜取り部、10……透孔。
FIG. 1 is a plan view of the kit board of the present invention, FIG. 2 is a plan view of a printed wiring board extracted from the kit board shown in FIG. 1, and FIGS. 3 and 5 are plan views of a conventional kit board, respectively. 4 is a plan view of the printed wiring board taken out from the kit board shown in FIG. 3, and FIG. 6 is a plan view of the printed wiring board taken out from the kit board shown in FIG. 7...Kittsu board, 8...Printed wiring board, 9...
Extraction part, 10...through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一枚の基板から幾つかの印刷配線板を抜取り成
形するキツト基板において、同一線上に形成され
る金型の抜取り部同士が互いに近接する箇所で且
つ必要とする印刷配線板寄りの部分に透孔を穿設
したことを特徴とするキツト基板。
In a kit board in which several printed wiring boards are extracted and molded from one board, through-holes are formed in the parts where the extraction parts of the mold formed on the same line are close to each other and in the part closer to the printed wiring board where it is needed. A kit board characterized by having a perforation.
JP7422387U 1987-05-18 1987-05-18 Pending JPS63182567U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7422387U JPS63182567U (en) 1987-05-18 1987-05-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7422387U JPS63182567U (en) 1987-05-18 1987-05-18

Publications (1)

Publication Number Publication Date
JPS63182567U true JPS63182567U (en) 1988-11-24

Family

ID=30919241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7422387U Pending JPS63182567U (en) 1987-05-18 1987-05-18

Country Status (1)

Country Link
JP (1) JPS63182567U (en)

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