JP3044840B2 - Semiconductor parts joining equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for joining semiconductor components to a semiconductor device and a wiring board.

[0002]

2. Description of the Related Art In recent years, a semiconductor element has been bonded to a wiring board by an adhesive. An important point in joining the wiring board and the semiconductor element is the parallelism between the wiring board and the semiconductor element parts.

A conventional semiconductor component bonding apparatus will be described below with reference to FIGS.

In the drawing, 21 is an XY robot, 22 is a transport system for transporting the wiring board 1, 4 is a stage on which the wiring board 1 is mounted and fixed by suction, 2 is a semiconductor element, 23 is the wiring board 1 and the semiconductor element. 2, an ultraviolet light emitter for curing an adhesive 24 for bonding the semiconductor element 2, 6 a pressure head for joining the semiconductor element 2 and the wiring board 4, 25 a parts cassette in which the semiconductor element 2 is taped, and 26 a position of the semiconductor element 2. A recognition camera 27 for recognizing a wiring board is a camera for recognizing a position of the wiring board 1.

FIG. 4 shows details of the stage 4 and the pressure head 6, reference numeral 7 denotes a pressure cylinder, reference numeral 9 denotes a shaft for transmitting a pressing force, and reference numeral 8 denotes a suction head for sucking and pressing the semiconductor element 2. Reference numeral 3 denotes an XY table, 4 denotes a stage supported on the XY table 3 by adjusting screws 5, and 1 denotes a wiring board mounted on the stage 4.

[0006] In the above-described configuration of each member, after the XY robot 21 provided with the pressure head 6 returns to the mechanical center, first, the pressure head 6 is moved to the parts cassette 2.
5 to the position of the semiconductor element 2. Meanwhile, the wiring substrate 1 is placed on the stage 4 by the transfer system 22 and fixed. After that, the suction head 8 sucks the semiconductor element 2 and the position of the semiconductor element 2 is recognized by the semiconductor element recognition camera 26, and the position is corrected by comparing the position with the normal position.
Then, when the suction head 8 moves to a position above the wiring board 1, the position of the wiring board 1 is recognized by the wiring board recognition camera 27, and the position is corrected by comparing the position with the normal position. When these operations are completed, the suction head 8 is lowered by the pressure cylinder 7 via the shaft 9 and the semiconductor element 2 is moved to the wiring board 1.
To press the two protruding electrodes together. Then, the ultraviolet light emitter 23 is applied to the adhesive 24 applied on the wiring board 1.
Then, the semiconductor element 2 is bonded onto the wiring board 1 by irradiating it with ultraviolet light.

In the above configuration and operation, the mounting accuracy of the suction head 8 and the pressure cylinder 7 disposed on the head 6 is determined by the accuracy of the components. The stage 4 provided on the XY table 3 is adjusted by adjusting screws 5 to adjust the parallelism between the stage 4 and the suction head 8.

After the parallelism is adjusted in this way, the wiring board 1 is mounted and fixed on the stage 4 and the semiconductor element 2 is mounted.

[0009]

In such a conventional semiconductor device bonding apparatus, not only does it take a considerable amount of time to adjust and maintain the parallelism between the stage 4 and the suction head 8, but also to achieve a permanent parallelism. There was a problem that it was difficult to maintain.

An object of the present invention is to solve the above-mentioned problem, and an object of the present invention is to provide an apparatus for joining semiconductor components which can absorb a certain degree of non-parallelism.

[0011]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a suction tweezer for holding a pressure head to a semiconductor element, a holder for holding the suction tweezers in a swingable manner, and mounting the holder. And a resilient body interposed between the suction tweezers and the base to swingably support the suction tweezers. It oscillates following the surface.

[0012]

According to the present invention, as described above, an elastic body is interposed between the suction tweezers and the base, and the suction tweezers are slidably supported by the elastic body. Since the swing follows the movement, it is possible to easily adjust and maintain the parallelism between the stage and the suction head.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. The same parts as those shown in the conventional example are denoted by the same reference numerals and described.

As shown in FIG. 1, reference numeral 8 denotes a suction head, which is a base 11, an elastic body guide 12, an elastic body 13, and a holder 1.
4, suction tweezers 15 and bolts 16.

An intake hole 11a is formed in the center of the base 11, and a concave portion 11b in which the elastic guide 12 is mounted is formed in the lower surface of the center. And the holder 1 on the outer circumference
A step portion 11c to which the wire 4 is fitted is formed. The elastic body guide 12 is provided with a suction hole 12a communicating with the suction hole 11a of the base 12 at a central portion thereof, and is fitted into the concave portion 11b of the base 12. The elastic body 13 has an elastic body guide 1 at the center.
An intake hole 13a communicating with the second intake hole 12a is formed,
A recess 13b is formed at the center. This recess 13b
Is positioned at the lower end of the elastic body guide 12 so that the elastic body 13 is not displaced in the radial direction. The suction tweezers 15 has an intake hole 13a of the elastic body 13 at the center.
A suction hole 15a for adsorbing the semiconductor element 2 is formed, and a large-diameter portion 15b having an arcuate side surface and a small-diameter portion 15c extending downward are formed. Are elastically supported by the lower surface of the elastic body 13, and the side surfaces of the elastic member 13 are swingably held in the holder 14 with a gap from the inner surface of the holder 14. The small diameter portion 15c is for adsorbing the semiconductor element 2 at its tip. The holder 14 is formed in an annular shape, and has a step portion 14 a fitted on the step portion 11 c of the base 11 on the inner periphery.
Is formed. Then, the elastic body 13,
The suction tweezers 15b is swingably included, and the bolt 16
Is attached to the base 11. The bolt 16 attaches the holder 14 to the base 11, and has a fastening surface of the head abutting on and holding the lower surface of the large-diameter portion 15 b of the suction forceps 15.

In the above configuration, the parallelism between the stage 4 and the suction head 8, in other words, the wiring board 1 and the semiconductor element 2
The stage 4 has an adjustment screw 5 (see Fig. 4)
Thus, the suction head 8 is adjusted by the tightening amount of the bolt 16.

The required value of the parallelism is 1
It is also called μm, and mechanical adjustment is extremely difficult.

On the other hand, in this embodiment, the holder 14
The suction tweezers 15 are swingably held in the annular space, and the suction tweezers are swingably supported by the elastic body 13 interposed between the lower surface of the base 11 and the upper surface of the suction tweezers 15. The attraction tweezers 15 can swing by a biasing force applied upward to the distal end thereof, that is, a force to tilt the attraction tweezers 15. Therefore, the semiconductor element 2 sucked by the suction tweezers 15 and the stage 4
When the pressure is applied in a state in which the wiring board 1 mounted and fixed thereon is not parallel, the suction tweezers 15
Swings along the surface of the wiring board 1 through the
It is possible to prevent the non-uniformity between the pressure and the wiring substrate 1 by absorbing the degree of non-parallelism.

As described above, according to the semiconductor component bonding apparatus of the embodiment of the present invention, the suction head 8 is swung along the surface of the wiring board 1 so that the stage 4 and the suction head 6 can be connected. Since the strictness of the value of the parallelism between them can be relaxed, the time required for the adjustment of the parallelism and the maintenance can be shortened, and there is an effect that the permanent parallelism can be maintained.

Next, a second embodiment of the present invention is shown in FIG. The same parts as those shown in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in the figure, reference numeral 17 denotes an annular plate, which is an elastic body 13 contained in an annular space of the holder 14.
The lower part of the suction tweezers 15 is held and attached by bolts 18.

In the first embodiment, the suction forceps 15 are held in contact with the tightening surface of the head of the bolt 16, but the tightening surface of the bolt 16 is not necessarily perpendicular to the axis of the bolt 16. Is not necessarily formed, and the surface is not always flat. Therefore,
There is a problem that the fine adjustment of the parallelism between the suction head 8 and the stage 4 becomes unstable due to the rotation of the bolt 16.

On the other hand, in this embodiment, the large diameter portion 15b of the suction forceps 15 is held by the plate 17 and the bolt 1
Since the parallelism between the attraction tweezers 15 and the stage 4 is adjusted by the rotation of 8, the fine adjustment of the parallelism can be performed without being affected by the inclination and flatness of the tightening surface of the bolt 18.

Next, the large diameter portion 15b of the suction forceps 15
Is formed in a circular shape, the suction tweezers 15 may rotate during the joining operation and the parallelism may be deviated.

On the other hand, in the present embodiment, a shaft 20 having a bearing 19 mounted thereon is implanted in the suction tweezers 15 and the bearing 19 is inserted into a lifting groove (not shown) to prevent the suction tweezers 15 from rotating. Thus, it is possible to solve the problem that the suction tweezers 15 rotates during the joining operation and the parallelism goes out of order.

[0026]

As is apparent from the above description of the embodiment, according to the present invention, an elastic body is interposed between the suction tweezers and the base to swingably support the suction tweezers, and the semiconductor device The suction tweezers oscillate following the wiring board during the pressure bonding of the wiring board and the wiring board, thereby absorbing the non-parallelism between the semiconductor element and the wiring board and preventing the applied pressure between them from becoming uneven. can do.

This makes it possible to reduce the severity of the parallelism value between the stage and the suction head, to reduce the time required for adjusting the parallelism and performing maintenance, and to achieve a permanent parallelism. It is possible to provide a semiconductor component bonding apparatus capable of maintaining the above.

[Brief description of the drawings]

FIG. 1 is a side sectional view of a main part of a first embodiment of a semiconductor component bonding apparatus according to the present invention.

FIG. 2 is a side sectional view of a main part of the second embodiment.

FIG. 3 is a perspective view of an apparatus for joining semiconductor components.

FIG. 4 is a perspective view of a main part of a conventional semiconductor component bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 2 Semiconductor element 4 Stage 8 Suction head 11 Base 13 Elastic body 14 Holder 15 Suction tweezers 17 Plate 18 Bolt

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shinji Kanayama 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Shinya Matsumura 1006 Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 311

Claims (2)

(57) [Claims] 1. A joining device for a semiconductor component for pressure-bonding a semiconductor element sucked by a suction head to a wiring board mounted on a stage, wherein the suction head comprises a suction pin set for sucking the semiconductor element. A holder for swingably holding the suction tweezers, a base on which the holder is mounted, and an elastic body interposed between the suction tweezers and the base to swingably support the suction tweezers. A semiconductor device joining apparatus, wherein the suction tweezers swing along the surface of the wiring board during the pressurization. 2. The lower surface of the suction forceps is held by a plate, and the plate is mounted on a base with bolts.
An apparatus for joining semiconductor components according to the above.