JP2811859B2 - Semiconductor chip suction device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to a semiconductor chip suction device, and swingably connects a die collet to a nozzle shaft so as to cope with an inclination of an upper surface of a substrate to which a semiconductor chip is bonded. It was done.

(Prior Art) FIG. 4 shows a state in which a semiconductor chip 101 is bonded to a substrate 102 by a conventional die collet 100. 103 is a nozzle shaft. Semiconductor chip 1
01 is a flip chip, on the lower surface of which are protruded a large number of micro bumps 104 having a size of about 7 μ,
The micro bumps 104 are bonded so as to match the electrode portions of the substrate 102.

(Problems to be Solved by the Invention) As the substrate 102, there are various substrates such as a ceramic substrate and a glass substrate, but the upper surface is not necessarily a complete horizontal plane, but may be inclined as shown by a chain line. is there. This slope is generally not very large,
Therefore, in the case of a normal flip chip having bumps of about 80 μm, for example, the inclination can be sufficiently absorbed and bonding to the substrate 102 can be performed. However, in the case of the flip chip 101 having the small micro bumps 104 as described above, this inclination cannot be absorbed, and there is a problem that all the micro bumps 104 cannot be landed on the substrate 102 and bonded.

Therefore, an object of the present invention is to provide a means capable of securely bonding a semiconductor chip such as a flip chip having micro-bumps that require horizontal accuracy on the upper surface of a substrate to the substrate.

(Means for Solving the Problems) The present invention includes a nozzle shaft and a die collet connected to a lower end portion of the nozzle shaft. The die collet is connected to the nozzle shaft via a universal joint. An upper plate, a lower plate, a small rig member disposed between the upper plate and the lower plate, and an elastic O-ring fitted to the small ring member and sandwiched between the upper plate and the lower plate. Consisting of
A semiconductor chip suction device characterized in that a die collet is made swingable by elastically deforming the elastic O-ring.

Also preferably, the upper plate is fitted on a ring body, and the outer peripheral surface of the upper plate that comes into contact with the inner peripheral surface of the ring body is a curved surface having a radius in the vertical direction.

(Operation) In the above configuration, the die collet that has absorbed the semiconductor chip is bonded by landing the semiconductor chip on the substrate. When the upper surface of the substrate is inclined, a universal joint is provided between the nozzle shaft and the die collet. Since the part is interposed, the die collet swings, and the lower surface of the semiconductor chip can be securely bonded along the upper surface of the substrate.

In addition, by forming the outer peripheral surface of the upper plate that is in contact with the inner peripheral surface of the ring body into a curved surface having a radius in the vertical direction, the die collet can be swung more smoothly and the semiconductor chip can be made to follow the upper surface of the substrate. it can.

Example Next, an example of the present invention will be described with reference to the drawings.

1 is a perspective view of a semiconductor chip suction device, FIG. 2 is a sectional view, and FIG. 3 is an exploded view. Reference numeral 1 denotes a pipe-shaped nozzle shaft, and a die collet 3 is swingably connected to a lower end of the nozzle shaft via a universal joint 2.

As shown in FIG. 3, the universal joint 2 is a disc-shaped upper plate.
21, a ring body 22 on which the upper plate 21 is fitted, a disk-shaped lower plate 23, and a small ring body fitted between the upper plate 21 and the lower plate 23.
24 and an elastic O-ring 25. Reference numeral 26 denotes a screw connecting the upper plate 21 and the lower plate 23, and reference numerals 27, 28, and 29 denote screw holes formed in the outer peripheral edge of the upper plate 21, the inner peripheral edge of the ring body 22, and the lower plate 23, respectively.

On the upper surface of the upper plate 21, a disk-shaped protrusion 30 is integrally provided. Reference numeral 31 denotes a screw. The screw 31 is screwed into the projection 30, whereby the upper plate 21 is assembled to the nozzle shaft 1. Also, as shown in FIG. 2, the head of the screw 26
26a prevents the upper plate 21 and the ring body 22 from separating from each other by pressing the upper surfaces of the upper plate 21 and the ring body 22 from above. The outer peripheral surface 21a of the upper plate 21 is a curved surface having a radius in the vertical direction, and the inner peripheral surface of the ring body 22 is in line contact with the outer peripheral surface 21a. The O-ring 25 is fitted on the small ring body 24 and is inside the ring body 22, the upper surface of which is in elastic contact with the lower surface of the upper plate 21, and the lower surface thereof is in elastic contact with the upper surface of the lower plate 23. A screw 32 connects the die collet 3 and the lower plate 23.

In FIG. 2, the upper plate 21 is fixed to the nozzle shaft 1 by screws 31, but includes a ring body 22, a lower plate 23 connected to the ring body 22 by screws 26, and a lower plate 23.
The die collet 3 joined to the upper plate 21 by a screw 32 has a circular outer peripheral surface 21a.
Is used as an axis of rotation, an elastic O pinched between the upper plate 21 and the lower plate 23
The ring 25 can be slightly swung in the direction of arrow N while elastically deforming the ring 25. In FIG. 2, reference numeral 33 denotes a flip chip, 34 denotes its micro bumps, and 35 denotes a substrate.

This suction device is configured as described above, and the die collet 3 that has sucked the flip chip 33 is bonded by landing the micro bumps 34 of the flip chip 33 on the upper surface of the substrate 35. As shown by the chain line in FIG. 2, when the upper surface of the substrate 35 is inclined, the die collet 3 descends and presses the micro bumps 34 against the substrate 35. When deformed, the die collet 3 swings in the direction of arrow N, and all the micro bumps 34 can be bonded along the upper surface of the substrate 35.

(Effect of the Invention) As described above, according to the present invention, by elastically deforming the elastic O-ring sandwiched between the upper plate and the lower plate,
Since the die collet can be swung, even if the top surface of the substrate is slightly inclined, a semiconductor chip such as a flip chip with micro bumps can be securely placed on the substrate by aligning it with the slightly inclined top surface of the substrate. Can be bonded. In addition, by making the outer peripheral surface of the upper plate that is in contact with the inner peripheral surface of the ring body a curved surface having a radius in the vertical direction, the die collet can be swung more smoothly, and the semiconductor chip can be moved along the upper surface of the substrate. Can be bonded.

[Brief description of the drawings]

1 to 3 show an embodiment of the present invention. FIG. 1 is a perspective view of a suction device, FIG. 2 is a sectional view, and FIG.
The figure is an exploded perspective view, and FIG. 4 is a sectional view of a conventional suction device. 1 ... Nozzle shaft 2 ... Universal joint 3 ... Die collet 21 ... Upper plate 21a ... Outer peripheral surface 22 ... Ring body 23 ... Lower plate 24 ... Small ring body 25 ... Elastic O-ring

Claims (2)

(57) [Claims] The present invention comprises a nozzle shaft and a die collet connected to a lower end of the nozzle shaft. The die collet is connected to the nozzle shaft via a universal joint. An upper plate, a lower plate, a small ring member disposed between the upper plate and the lower plate, and an elastic O-ring fitted to the small ring member and sandwiched between the upper plate and the lower plate. A semiconductor chip suction device characterized in that a die collet can be swung by elastically deforming the die collet. 2. An upper plate is fitted on a ring body, and an outer peripheral surface of the upper plate contacting an inner peripheral surface of the ring body is a curved surface having a radius in a vertical direction. 1
A device for adsorbing a semiconductor chip as described in the above.