JPH0671023B2 - Wire bonding substrate support - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an improvement in a device such as a wire bonding substrate support, which requires positioning of a direction and a height in a semiconductor industry, an optical equipment industry, and the like. .

(Prior Art) Conventionally, this type of support base has a rotatable stage on which a work is placed, and an operator drives an electromagnetic motor as necessary during operation to rotate the stage. The work was positioned.

(Problems to be Solved by the Invention) However, the conventional supporting table has a problem that it is heavy and has a difficulty in operability by an operator, and that its mechanism is complicated and prone to failure.

Then, this invention aims at eliminating the said problem.

(Means for Solving the Problem) In order to achieve such an object, the present invention has the following configuration.

That is, the present invention, on the upper surface of the base, an annular inner piezoelectric element and an annular outer piezoelectric element are concentrically attached, an annular inner diaphragm is attached on the inner piezoelectric element, and an annular piezoelectric element is attached on the outer piezoelectric element. An outer diaphragm is attached, and a plurality of vibrating members are arranged on the inner diaphragm so that the thickness of the tip end side is flattened and the thickness is gradually reduced clockwise. A plurality of vibrating members, each having a flat upper surface with a flat upper surface and gradually thinning in a counterclockwise direction, are arranged, and a stage is rotatably mounted on each vibrating member.

(Operation) The support base of the present invention configured as described above is used, for example, while being placed on the XY table of the wire bonding apparatus and the work being placed on the stage.

When a voltage having a predetermined frequency is applied to the electrode of the inner piezoelectric element, each vibrating member moves up and down, and when each vibrating member pushes the stage upward, the vibrating member distorts and the upper end of the vibrating member makes an elliptical motion. A frictional force that pushes toward the tip direction is generated, and the stage rotates clockwise.

On the other hand, when a voltage of a predetermined frequency is applied to the electrode of the outer piezoelectric element, the stage rotates counterclockwise according to the same principle.

Therefore, in the present invention, the work on the stage can be rotated clockwise or counterclockwise as needed, either manually or automatically.

Embodiments Embodiments of the present invention will be described in detail below with reference to the drawings.

In the embodiment of the present invention, as shown in FIG.
An annular inner piezoelectric element 2 and an annular outer piezoelectric element 3 are concentrically attached to the flat upper surface of the.

An annular inner diaphragm 4 is attached to the upper surface of the inner piezoelectric element 2, and an annular outer diaphragm 5 is attached to the upper surface of the outer piezoelectric element 3.

On the inner vibrating plate 4, a plurality of vibrating members 6 having a flat top surface and a gradually decreasing thickness in the clockwise direction are arranged integrally (see FIGS. 2 and 3).

On the outer vibrating plate 5, a plurality of vibrating members 7 each having a flat top surface and a gradually decreasing thickness in the counterclockwise direction are integrally arranged (see FIGS. 2 and 4).

A cylindrical stage 8 having an open lower portion is placed on each row of the vibrating members 6 and 7. Then, when the stage 8 is placed, the four recesses 9 provided at equal intervals along the inner circumference of the cylindrical portion of the stage 8 and the recessed grooves 10 provided along the outer circumference of the upper portion of the base 1 It is configured so that four small balls 11 are interposed therebetween. With such a configuration, the stage 8 can be freely rotated on the vibrating members 6 and 7.

A recess 12 is provided on the bottom of the base 1, and a female screw is provided on the inner circumference of the recess 12.
13 is formed, and the female screw 13 is meshed with the male screw 15 provided at the center of the height adjusting base 14. With such a configuration, if the table 1 or the height adjusting table 14 is rotated, the height of the stage 8 can be arbitrarily set on the XY table 16 in the wire bonding apparatus, for example.

An adsorption hole 17 for adsorbing the work a to be machined is formed in the center of the upper portion of the stage 8, and the adsorption hole 17 is connected to an adsorption pump (not shown) via an intake passage 18.

By the way, the drive circuits (not shown) for the inner piezoelectric element 2 and the outer piezoelectric element 2 may also serve as a drive circuit for an ultrasonic vibration source that supplies ultrasonic waves to the capillaries in a wire bonding apparatus, or independently. May be provided.
In the former case, since the drive circuit can be omitted, the configuration is simple and the overall production cost is low.

Next, an operation example of the embodiment thus configured will be described.

In this example, the XY table 16 of the wire bonding device is used.
The work a is placed on the stage 8 and used on the stage 8.

When the work a is wire-bonded, the stage 8 is rotated clockwise or counterclockwise as required by, for example, an operator's switch operation or a command signal from the control device, and the work on the stage 8 is rotated. Position a by rotating a in the clockwise or counterclockwise direction.

That is, when a voltage having a predetermined frequency is applied to the electrode of the inner piezoelectric element 2, each vibrating member 6 moves up and down, and each vibrating member 6
Vibrating member 6 when pushing up the stage upwards
, The upper surface of the strain vibrating member 6 makes an elliptical motion, and a frictional force that pushes toward the tip direction is generated, and the stage 8 rotates clockwise.

On the other hand, when a voltage having a predetermined frequency is applied to the electrodes of the outer piezoelectric element 3, each vibrating member 7 moves up and down, and the stage 8 rotates counterclockwise by the same principle.

Therefore, if necessary, the stage 8 can be manually or automatically operated.
The upper work a can be rotated clockwise or counterclockwise.

Next, another embodiment of the present invention will be described with reference to FIG.

The inner diaphragm 4 shown in FIG. 2 is replaced with two first inner diaphragms 4A and second inner diaphragms 4B.

With such a configuration, the rotational force in the clockwise direction obtained by the inner diaphragms 4A and 4B becomes larger than the rotational force of the inner diaphragm 4.

(Effects of the Invention) According to the present invention, the stage is rotated clockwise or counterclockwise by the electrostrictive effect of the piezoelectric elements arranged in the inside and outside of the ring, so that the work can be aligned by automatic or semi-automatic operation. In addition to lightening the weight and improving the operability of the operator, the overall structure is simple and the production cost can be expected to be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view showing the overall construction of an embodiment of the present invention, FIG. 2 is a plan view with a stage removed, FIG. 3 is a sectional view of an inner diaphragm and a vibrating member, and FIG. 4 is an outer diaphragm. And FIG. 5 is a sectional view of the vibrating member, and FIG. 5 is a view corresponding to FIG. 2 of another embodiment of the present invention. 1 is a base, 2 is an inner piezoelectric element, 3 is an outer piezoelectric element, 4 is an inner vibrating plate, 5 is an outer vibrating plate, 6 and 7 are vibrating members, respectively.
8 is a stage.

Claims (1)

[Claims] 1. A plurality of ring-shaped piezoelectric elements are concentrically mounted on an upper surface of a table, ring-shaped diaphragms are mounted on the respective piezoelectric elements, and a stage is rotatably mounted on each of the diaphragms. A support base for a wire bonding substrate.