JP2001308147A - Assembling apparatus for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an assembling apparatus for a semiconductor device which allows a collective bonding of a plurality of semiconductor chips on the surface of a solid-state device even if the semiconductor chips have different thicknesses. SOLUTION: The assembler comprises stages 201-204 having placement faces 201a-204a to place slave chips 101-104, a suction collet 400 having a suction face 400a for holding a master chip which is disposed face to face with the stages, and an elevation mechanism 410 for bonding the master chip 100 and the slave chips 101-104, The placement faces 201a-204a of the stages 201-204 can be adjusted in height by height adjustment screws 211-214.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembling apparatus for assembling a semiconductor device having a structure in which a plurality of semiconductor chips are joined to a solid surface (a surface of a wiring board or a semiconductor chip).

[0002]

2. Description of the Related Art As one form of a so-called multi-chip type semiconductor device, there is a chip-on-chip structure in which a plurality of semiconductor chips are stacked. In a semiconductor device having a chip-on-chip structure, a child chip smaller than the parent chip is bonded to the surface of the parent chip to be externally connected.
A plurality of child chips may be joined to the surface of one parent chip.

Another form of a multi-chip type semiconductor device is one in which a plurality of semiconductor chips are bonded at high density on a wiring board. In any case, by mounting a large number of semiconductor chips at a high density, the degree of integration of the semiconductor device can be substantially improved. Therefore, it is preferable that the semiconductor chips arranged on the parent chip or the wiring board are joined with the intervals as small as possible.

For example, a multi-chip type semiconductor device having a chip-on-chip structure is assembled by sequentially joining a plurality of child chips to the surface of a parent chip. In this case,
The child chip is bonded to the surface of the parent chip using a chip holding head called a suction collet. The suction collet holds, for example, a non-active surface of the child chip by vacuum suction, guides the child chip to the surface of the parent chip, and further presses the child chip against the surface of the parent chip. At this time, the bumps formed on the surfaces of the child chip and the parent chip are pressed against each other, and these bumps are joined to each other. This achieves electrical and mechanical connection between the parent chip and the child chip.

Although the size and thickness of the child chip bonded to the surface of the parent chip are not uniform, the size of the suction collet cannot be made different for each child chip. Therefore, in general, a suction collet adapted to a relatively large child chip is often used. This is because, when a small suction collet is used, when the child chip is pressed against the parent chip, external force from the suction collet concentrates on a part of the child chip, which may cause deterioration or breakage of the characteristics of the child chip. is there.

[0006]

However, in a case where child chips are to be arranged at very close positions,
If the suction surface of the suction collet is larger than the suctioned child chip, the suction collet may interfere with another child chip already bonded on the parent chip. That is, when the chip already bonded on the parent chip is thicker than the chip to be bonded, the above-described interference may occur.

[0007] Further, since a plurality of child chips must be bonded to the parent chip one by one, there has been a problem that the assembling time of the semiconductor device is lengthened and the productivity is poor. Therefore, an object of the present invention is to solve the above technical problem,
An object of the present invention is to provide a semiconductor device assembling apparatus capable of joining a plurality of semiconductor chips collectively even when the thickness of the plurality of semiconductor chips to be joined to the surface of the solid state device is different.

[0008]

According to a first aspect of the present invention, there is provided an apparatus for assembling a semiconductor device by bonding a plurality of semiconductor chips to a surface of a solid-state device. A plurality of stages each having a mounting surface on which at least one semiconductor chip can be mounted, a height adjustment mechanism for adjusting the relative height of the mounting surface of the plurality of stages, A solid device holding mechanism for holding the solid device in a posture in which the surface of the solid device is opposed to the mounting surfaces of the plurality of stages; and a lifting device for moving the solid device holding mechanism and the plurality of stages toward and away from each other. And a mechanism for assembling the semiconductor device.

According to this structure, the relative heights of the mounting surfaces of the plurality of stages are adjusted by the height adjusting mechanism, so that the heights of the surfaces of the plurality of semiconductor chips having different thicknesses from each other are adjusted. Can be aligned. By bringing the solid-state device held by the solid-state device holding mechanism close to the plurality of semiconductor chips having the same height in this manner,
A plurality of semiconductor chips can be collectively and satisfactorily joined to the surface of the solid-state device. Therefore, the productivity of the semiconductor device is significantly improved.

The height adjusting mechanism may be capable of independently adjusting the height of the mounting surface of each stage, or the mounting of another stage on the mounting surface of one stage. Only the relative height of the surface may be changeable. The solid state device may be another semiconductor chip.
In this case, a semiconductor device having a chip-on-chip structure in which a plurality of small semiconductor chips are joined to the surface of one large semiconductor chip is assembled.

Further, the solid state device may be a wiring board. In this case, for example, a multi-chip semiconductor device in which a plurality of semiconductor chips are bonded on a wiring board is assembled. The solid device holding mechanism may be a device that sucks and holds the back surface of the solid device. The elevating mechanism may be one that raises and lowers the solid-state device holding mechanism. It is preferable that bumps are formed on the surface of the semiconductor chip facing the solid-state device. In this case, it is preferable that similar bumps are formed on the surface of the solid-state device.
Then, it is preferable that a plurality of semiconductor chips are simultaneously bonded to the surface of the solid-state device by bringing the solid-state device and the semiconductor chip close to each other and bonding the bumps to each other by an elevating mechanism.

[0012]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an illustrative view showing a configuration of a semiconductor device assembling apparatus according to an embodiment of the present invention. FIG. 2 is a plan view looking down on a stage on which a child chip is mounted. This device is used to assemble a semiconductor device having a chip-on-chip structure by joining a plurality of relatively small semiconductor chips 101 to 104 collectively to a relatively large semiconductor chip parent chip 100. Device.

This assembling apparatus includes a plurality of child chips 101.
Stages 201 and 2 for placing each of the to 104
04 and the parent chip 100 so as to face the child chips 101 to 104 placed on the stages 201 to 204.
And an adsorbing collet 400 for adsorbing and holding. The assembling apparatus further includes a mechanism (micro heads 311 to 313) for making the surface of the parent chip 100 and the surface of the children 101 to 104 parallel to each other, and a plurality of child chips 101 to 1
A height adjustment mechanism (height adjustment screws 211 to 214) for equalizing the heights of the surfaces (active surfaces) 101a to 104a of the device 04, and a mechanism (camera 500) for detecting a displacement between the parent chip 100 and the child chips 101 to 104 , A mechanism (controller 510, drive mechanism 430) for aligning the positions of parent chip 100 and child chips 101 to 104, and suction collet 4
An elevating mechanism 410 that raises and lowers 20 is provided.

Each of the four stages 201 to 204 has rectangular mounting surfaces 201a to 204a in plan view, and these mounting surfaces 201a to 204a are close to each other in a state where one corner is gathered. ing. Each mounting surface 2
The child chips 101 to 104 are mounted on 01a to 204a. Child chips 101 to 104
Are arranged unevenly on the mounting surfaces 201a to 204a of the stages 201 to 204 on each stage so as to be densely arranged on the surface of the parent chip 100, and are in a state of being close to each other.

The stages 201 to 204 are supported on a support table 300 via height adjusting screws 211 to 214 each composed of a micro head or the like. Stage 20
The heights of the mounting surfaces 201a to 204a of the mounting surfaces 201a to 204a from the support table 300 are the height adjusting screws 211 to 214.
Can be adjusted independently by adjusting. This allows
The relative height of the mounting surfaces 201a to 204a can be set to a desired value. The support 300 is provided with the micro head 31.
Three points are supported on the pedestal 320 via 1 to 313. By adjusting the micro heads 311 to 313, the mounting surface 2 of the stages 201 to 204 of the support base 300 is adjusted.
The directions of 01a to 204a can be adjusted.

The parent chip 100 has its active surface 100a
Are formed with bumps 110. Similarly, child chip 1
01 to 104, the active surfaces 101a to 104a
Bumps 111 to 114 are formed respectively. The child chips 101 to 104 are inactive surfaces 101b to 104b
Are the mounting surfaces 201a to 204a of the stages 201 to 204
It is placed in contact with That is, the active surface 101a
To 104a point upward. The parent chip 100 has a non-active surface 100b whose suction surface 400a of the suction collet 400
Is held by suction. Therefore, its active surface 100
a is directed downward and faces the active surfaces 101a to 104a of the child chips 101 to 104.

In this state, when the parent chip 100 is lowered by the lifting mechanism 410 and pressed against the child chips 101 to 104, the bumps 110 of the child chips 101 to 104 correspond to the bumps 110 of the parent chip 100. Are joined. Thereby, a plurality of child chips 101 to 104 can be mounted on the parent chip 100 collectively. At this time, the parent chip 100 and the child chips 101 to 10
A parallel alignment between 4 and 4 must be made in advance. Paralleling between the parent chip 100 and the child chips 101 to 104 means that the active surface 10 of the child chips 101 to 104
This means that 1a to 104a are parallel to the active surface 100a of the parent chip 100. Thereby, at the time of joining, 1
The plurality of bumps of one child chip are
It will come into contact almost simultaneously with the corresponding bump 110 above.

The parent chip 100 and the child chips 101 to 104
Before holding the parent chip 100 and placing the child chips 101 to 104, the stages 201 to 20 with respect to the suction surface 400a of the suction collet 400 are arranged in parallel.
The direction of the mounting surfaces 201a to 204a of the fourth is adjusted. Stages 201 to 201 commonly attached to the support base 300
The mounting surfaces 201a to 204a of the 204 can be adjusted in advance so as to be parallel to each other. Therefore,
The mounting surface 20 of one stage, for example, the stage 201
1a and the suction surface 400a of the suction collet 400 may be adjusted in parallel.

For this purpose, the micro heads 311 to 313 provided on the pedestal 320 are adjusted. The micro heads 311 to 313 support the support table 300 on the pedestal 320 at three points. Thereby, the stage support 300
Can be freely adjusted, and the inclination of the mounting surface 201a of the stage 201 fixed to the stage support base 300 via the height adjusting screw 211 can be adjusted. Thus, the suction surface 400a of the suction collet 400 and the mounting surface 201a of the stage 201 can be made parallel. Thereby, the other mounting surface 2
02a to 204a are also parallel to the suction surface 400a.

By the above operation, the child chips 101 to 10
4 are bonded to the parent chip 100, the child chips 101 to 101 mounted on the mounting surfaces 201 a to 204 a of the stage 201.
The active surfaces 101a to 104a of the
No. 00 is parallel to the active surface 100a of the parent chip 100 sucked on the suction surface 400a. On the other hand, parent chip 10
Prior to the bonding of 0 and the child chips 101 to 104, the heights of the child chips 101 to 104 must also be adjusted. The height adjustment of the child chips 101 to 104 means that the active surfaces 101a to 104a of the child chips 101 to 104 are aligned at the same height. Thereby, even when the child chips 101 to 104 having different thicknesses are used, the bumps 111 to 114 of all the child chips 101 to 104 are joined at the time of bonding.
Will contact the corresponding bumps 110 on the parent chip 100 almost simultaneously.

The height adjustment of the child chips 101 to 104 is as follows.
By operating the height adjustment screws 211 to 214, the stage 20 is adjusted.
This is performed by independently adjusting the heights of the mounting surfaces 201a to 204a of the mounting surfaces 201 to 204. Height adjustment screws 211-
By rotating 214, the stages 101-104
Moves vertically up and down with respect to the respective mounting surfaces 201a to 204a. Thus, even if the thicknesses of the child chips 101 to 104 mounted on the mounting surfaces 201a to 204a are different, the active surfaces 101 of the child chips 101 to 104 are different.
The heights of a to 104a can be made uniform.

The active surface 1 of the child chips 101 to 104
Since the relative heights of 01a to 104a should be the same,
For any one of the stages 201 to 204, it is not necessary to adjust the height with respect to the support table 300. That is, one of the stages 201 to 204 may be a fixed stage having no height adjustment screw, and a mechanism for adjusting the height of the mounting surface of the remaining three stages. Prior to joining the parent chip 100 and the child chips 101 to 104,
In-plane alignment between the parent chip 100 and the child chips 101 to 104 must also be performed. Parent chip 10
0 and the in-plane alignment of the child chips 101 to 104 are defined by the bump 110 on the parent chip 100 and the child chip 10.
At the time of bonding, the bumps 111 to 114 on the
This refers to adjusting the positions so that mutually corresponding ones overlap in plan view.

The parent chip 100 and the child chips 101 to 104
Of the parent chip 100 and the child chip 1
Camera 500 (CCD)
Camera). That is, the camera 50
0 indicates the parent chip 100 and the child chips 101 to 104
Are detected. Thus, before bonding, the bumps 110 of the parent chip 100 and the child chips 10
The positional deviation between the bumps 111 to 114 and the bumps 111 to 114 is detected. Under the control of the controller 510, the support mechanism 42 is driven by the drive mechanism 430 in accordance with the detected position shift.
0 is moved, and the positioning of the bump 110 and the bumps 111 to 114 is performed. The movement of the suction collet 420 by the driving mechanism 430 moves the active surface 100 of the parent chip 100.
This is performed with respect to the parallel movement in the X and Y directions, which are two orthogonal directions in a, and the rotation direction θ about the vertical axis.

Thus, the parent chip 100 and the child chip 101
After the in-plane alignment with .about.104 is achieved, the camera 500 is moved so as not to interfere with the joining.
And the child chips 101-104. Next, the suction collet 400 is advanced by the elevating mechanism 410 in a direction to increase the distance from the support table 420, that is, downward. As a result, the bumps 110 of the parent chip 100
Are pressed against and bonded to the bumps 111 to 114 of the child chips 101 to 104.

If the mutual positions of the child chips 101 to 104 do not have a predetermined relationship, it is not possible to adjust the positions so that all the corresponding bumps overlap with each other only by adjusting the position of the parent chip 100. Therefore, a mechanism for positioning the daughter chips 101 to 104 may be provided on the mounting surfaces 201a to 204a of the stages 201 to 204. Alternatively, the stages 201 to 204
An alignment mechanism that moves relatively in a direction parallel to the respective mounting surfaces 201a to 204a may be provided to correct the relative positions of the child chips 101 to 104.

As described above, according to this embodiment, by using a plurality of stages 201 to 204 whose height can be adjusted, a plurality of child chips 1
01 to 104 can be joined together. Thus, the productivity of a chip-on-chip type semiconductor device can be improved. The in-plane alignment between the parent chip 100 and the child chips 101 to 104 must be performed at the time of each joining operation, but the height adjustment of the child chips 101 to 104 depends on, for example, the part number of the semiconductor device to be assembled. It may be performed every time it changes, or performed every processing lot. Further, since the parallel setting is an adjustment for correcting the inclination of the support table 300 with respect to the pedestal 320, it is sufficient to perform the parallel setting immediately after installation of the apparatus or at the time of periodic maintenance.

Although one embodiment of the present invention has been described, the present invention can be embodied in other forms. For example, in the above-described embodiment, four stages 201 to 20
4 is provided, but a configuration having only two stages may be employed. Further, two or more child chips having substantially the same thickness may be placed on one stage.
In the above-described embodiment, the parent chip 10 is moved up and down by the suction collet 400 holding the parent chip 100 by suction.
0 and the sub-tips 101 to 104 are joined, but the stage 201 to 204 side may be moved up and down, or the suction collet 400 and the stages 201 to 20 may be connected.
4 may be moved up and down.

Further, in the above embodiment, the stage 2
Although the heights of 01 to 204 are manually adjusted, the active surfaces 101a to 104 of the child chips 101 to 104 are adjusted.
a mechanism for detecting the height of the stage 2 is provided, and the stage 2 is driven by a driving mechanism such as a motor in accordance with the detected height of the active surface.
The height of 01 to 204 may be automatically adjusted.
In addition, it is possible to make various design changes within the technical scope described in the claims.

[Brief description of the drawings]

FIG. 1 is an illustrative view for explaining a configuration of a semiconductor device assembling apparatus according to an embodiment of the present invention;

FIG. 2 is an illustrative plan view looking down on a plurality of stages on which child chips are mounted.

[Brief description of reference numerals]

 100 Active surface of parent chip 100a Active surface of parent chip 101 Child chip 101a Active surface of child chip 101 102 Child chip 102a Active surface of child chip 102 Child chip 103a Active surface of child chip 103 Child chip 104a Active surface of child chip 104 110 Bumps on the parent chip 111 Bumps on the child chip 101 112 Bumps on the child chip 101 113 Bumps on the child chip 103 114 Bumps on the child chip 104 201 Mounting stage 201 a for the child chip 201 a Mounting surface 202 of the stage 201 Stage for mounting chip 102 202a Mounting surface of stage 202 203 Stage for mounting sub chip 103 203a Mounting surface of stage 203 204 Stage for mounting sub chip 104 204a Mounting surface of stage 204 211 Stage 201 Height adjustment screw 212 Height adjustment screw of stage 202 213 Height adjustment screw of stage 203 214 Height adjustment screw of stage 204 300 Stage support 311 Micro head 312 Micro head 313 Micro head 320 Pedestal 400 Adsorption collet 400a Adsorption collet Suction surface 410 elevating mechanism

Claims (1)

[Claims] An apparatus for assembling a semiconductor device by bonding a plurality of semiconductor chips to a surface of a solid-state device, wherein a plurality of stages each having a mounting surface on which at least one semiconductor chip can be mounted. A height adjustment mechanism for adjusting the relative height of the mounting surface of the plurality of stages, and the solid device in a posture in which the surface of the solid device faces the mounting surface of the plurality of stages. An assembling apparatus for a semiconductor device, comprising: a solid device holding mechanism for holding; and a lifting mechanism for moving the solid device holding mechanism and the plurality of stages toward and away from each other.