TW202205397A - Appratus for detaching die and method for detaching die using the same - Google Patents

Abstract

The present invention relates to a die detaching apparatus capable of precisely detaching a die by minimizing errors occurring in the die detaching process, and a die detaching method using the same. A die detaching apparatus according to an embodiment of the present invention is an apparatus for detaching a die disposed on a adhesive sheet from the adhesive sheet by pressing the adhesive sheet from below, comprising a plurality of contact members contacting the adhesive sheet. It includes a head unit, a pressing unit including a plurality of pressing members for moving the plurality of contact members in the vertical direction and a driving unit for moving the plurality of pressing members in the vertical direction wherein the driving unit has a stage for integrally moving the pressing members in a vertical direction, a driving unit integrally moving with the stage, and a driving unit for independently moving at least one of the plurality of pressing members in the vertical direction; and a driving control unit for controlling the stage and the driving unit.

Description

Grain separation device and grain separation method using the same

The present invention relates to an apparatus and method for use in semiconductor manufacturing, and, more particularly, to a die separation apparatus employing a plurality of contact members and drive units and a method of separating dies using the same.

Die reprocessing, that is, semiconductor wafers, is fabricated by dicing the wafer at predetermined intervals along scribe lines. The cut dies are attached to the die while being separated by a die bonder and picked up from the die, and then mounted on a lead frame or circuit board for packaging.

The following methods are used to separate and pick up dies attached to conventional bonding sheets. First, the lower surface of the bonding sheet is pressed from below using a die bonder, and the peripheral portion of the die to be separated is separated from the bonding sheet. At this time, the die bonder presses only the surface of the bonding sheet corresponding to the peripheral portion of the die. Next, the surface of the bonding sheet corresponding to the central portion of the target die is pressed to separate the target die from the bonding sheet. Then, the separated die are picked up and conveyed to the next step.

Then, in the conventional die bonding machine, the blocks divided into several pieces move up and down respectively, and form a bonding surface with a height different from that of the bonding sheet.

During this process, however, it can happen that the surfaces of the block in contact with the lamination sheet are located at different heights. This is a separate drive unit for raising and lowering each contact member, and moves up and down according to each control signal, such as the movement of the drive unit of the motor. Therefore, it is difficult to establish a common reference plane for contacting the block and the bonding sheet. This is because it is difficult to precisely remove the lamination sheet due to errors that inevitably occur during separation and pickup (such as mechanical errors that occur when many contact members and drive units work, or errors that occur during control) Grains are separated, and the defect rate may increase.

In order to use various separation methods, there are cases where control is performed by applying a single drive unit to a plurality of contact members, but the above-mentioned problems still exist. In addition, in order to control the entire contact member, such as the cam, physically, the entire contact member can be collectively controlled according to the shape of the cam.

The above-mentioned background art is the technical information possessed by the inventor to realize the present invention, or the technical information obtained during the derivation process of the present invention, and is not necessarily a known technology disclosed to the public before the present invention is submitted.

Background Art Documents

Patent document: Patent document 1 is Japanese Patent Laid-Open No. 1994-295930

The present invention provides a crystal grain separating device and a crystal grain separating method using the same, which can improve the separation rate of crystal grains by precisely pressing a plurality of contact members on a bonding sheet on which crystal grains are arranged. Separation and pickup quality.

According to the die separation device of the embodiment of the present invention, the die separation device separates the die arranged on the lamination sheet from the lamination sheet by pressing the lamination sheet from below, and includes a plurality of A contact member of a sticking sheet; it includes a head unit including a pressing unit including a plurality of pressing members for moving a plurality of contact members in an upright direction, and a driving unit for Move the plurality of pressing members in the upright direction. The driving unit is a plurality of, including a platform for integrally moving the pressing member in the upright direction, a driving unit for arranging at least one of the plurality of pressing members in the upright direction, and a driving unit for controlling the platform and the driving unit drive control unit.

In the grain separation apparatus according to the embodiment of the present invention, the pressing members are connected to correspond to the contact members, respectively, so that the contact members can move in the upright direction.

In the grain separation apparatus according to an embodiment of the present invention, the driving unit includes a member having an inclined portion provided on a flat surface The table is moved in a direction upright to the upright direction; at least one pressing member of the plurality of pressing members. It can move independently in the upright direction according to the movement of the member having the inclined portion.

In the grain separation apparatus according to the embodiment of the present invention, the plurality of pressing members is three or more, and the driving unit may be provided less than the number of pressing members.

In the die separation apparatus according to the embodiment of the present invention, the driving unit is provided on one side of the member having the inclined portion, and may have at least one guide relative to the member having the inclined portion.

In the die separation apparatus according to the embodiment of the present invention, the stage is directly connected to the innermost pressing member among the plurality of pressing members, the driving unit is provided on the stage, and the remaining pressing members except the innermost pressing member Can move up and down independently. The arrangement relationship among the platform, the plurality of pressing members, and the driving unit is not particularly limited, and various configuration relationships are possible. For example, the platform may be directly connected to the outermost pressing member of the plurality of pressing members.

In the die separating apparatus according to the embodiment of the present invention, the driving unit may integrally move the head unit and the pressing unit in the upright direction.

In another embodiment of the present invention, a die separating device is a die separating device that presses a bonding sheet from below to separate the dies provided on the bonding sheet from the bonding sheet; and , including many Several contact members are in contact with the adhesive sheet. It includes a head unit that includes: a pressing unit that includes a plurality of pressing members for moving a plurality of contact members in an upright direction; and a drive unit that moves a plurality of pressing members in the upright direction components, wherein the driving unit is that a plurality of contact members and a plurality of pressing members are integrally raised to make the fitting sheet and the entire plurality of contact members contact each other, and some of the plurality of pressing members are raised or lowered to raise or lower Lower the lamination and multiple contact parts. The die is separated from the laminate by changing its contact state.

According to another embodiment of the present invention, the die separation method includes pressurizing the lamination sheet by a die separation device including a plurality of contact members, so as to separate the die arranged on the lamination sheet from the lamination sheet. Grain separation method. It is to align the plurality of contact members to the same height, raise the plurality of aligned contact members integrally, and contact the fitting sheet, and raise or lower a part of the plurality of contact members, so that the The laminate is raised or lowered, and the contact state of the plurality of contact members is changed.

In the grain separation method according to another embodiment of the present invention, the step of changing the contact state may selectively raise or lower at least one contact member among a plurality of contact members that are concentrically arranged.

In the die separation method according to another embodiment of the present invention, the die separation device moves a head unit in an upright direction, the head unit including a plurality of contact members pressing the bonding sheet from below and a plurality of Contact member in upright orientation. It includes: a pressing unit, which includes: A plurality of pressing members for pressing the fitting sheet; and a driving unit for moving the plurality of pressing members in the upright direction; and the driving unit for integrally moving the plurality of pressing members in the upright direction. The platform and the driving unit are integrally moved, and at least one of the plurality of pressing members is independently moved in the upright direction, and the steps of contacting the fitting sheet by raising the platform, the plurality of contacting members are in contact with the fitting sheet. In the step of contacting the entire upper surface with the bonding sheet and changing the contact state, at least one of the plurality of contact members may be separated from the bonding sheet by raising or lowering the driving unit.

Aspects, features and advantages in addition to those described above will become apparent from the following detailed description for carrying out the invention, the scope of the claims and the accompanying drawings.

According to the crystal grain separation device and the crystal grain separation method using the same according to the embodiment of the present invention, a plurality of contact members can be in a state of contacting at the same height with respect to the bonded sheet on which the crystal grains are provided. Change the bonding state of the contact member and the bonding sheet. Thereby, the separation and bonding process can be performed in a state where the plurality of contact members are more accurately aligned, thereby improving the quality and quantity of die separation.

In particular, according to the crystal grain separating apparatus and the crystal grain separating method using the same, the plurality of pressing members are integrally moved in the vertical direction, and a part and/or all of them Both move independently in the upright direction, so that the die can be precisely pressed and separated from the laminate.

In addition, according to the grain separation apparatus and the grain separation method using the same, according to the embodiment of the present invention, the pressing member can be controlled to move up and down individually, thereby reducing the number of driving members, and reducing the parts and cost of the entire system .

1: Die bonding system

10: Die separation device

100: Head unit

110: Subject

120: top cover

121: adsorption hole

122: Guide slot

130: Support frame

140: Contact components

140A: Protrusion

140B: Contact member body

141: First contact block

142: Second contact block

143: Third contact block

150: The first pin body

20: Support device

21: First wafer support member

22: Second wafer support member

23: Third wafer support member

200: Press unit

210: Press the member

210A: Upper pressing member

210B: Lower pressing member

211: The first pressing block

212: Second pressing block

213: The third pressing block

220: Second pin body

221: 2a pin body of the first pressing block

222: 2b pin body of the second pressing block

223: 2c pin of the third pressing block

300: Drive unit

310: Platform

320: Drive Mechanism

321: Guide

322: Slider

323: Push Component

324: Roller

D: grain

G: Groove

M1: first drive member

M2: Second drive member

P: Protrusion

P1: The first pin body

S: Lamination sheet

W: Wafer

FIG. 1 shows a die bonding system including a die separation device according to an embodiment of the present invention.

Figure 2 shows the die placed on the laminate.

FIG. 3 shows the die separation apparatus shown in FIG. 1 .

FIG. 4 shows a cross-sectional view taken along the line IV-IV shown in FIG. 3 .

FIG. 5 is a cross-sectional view showing the head unit shown in FIG. 4 .

Fig. 6 is a diagram showing the arrangement of the contact members of Fig. 5 as viewed from the top.

FIG. 7 shows the protrusion of the contact member shown in FIG. 5 .

FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 5. FIG.

FIG. 9 is a schematic front view of the pressing unit shown in FIG. 4 .

FIG. 10 shows a cross-sectional view taken along line X-X shown in FIG. 9 .

Fig. 11 shows a section along the line XI-XI shown in Fig. 9 picture.

FIG. 12 is a perspective view of the pressing unit and the driving unit shown in FIG. 4 .

FIG. 13 is an explanatory diagram showing the drive unit shown in FIG. 4 .

FIG. 14 is a flowchart of a method for separating die according to an embodiment of the present invention.

Figures 15a to 15d show the progress of the grain separation according to the embodiment of the present invention.

Figures 16a to 16d show the state of progress of die separation according to another embodiment of the present invention.

The present invention can be applied to various states and can have various embodiments. Specific embodiments are shown in the accompanying drawings and are described in detail in the following description of embodiments of the invention. However, this is not intended to limit the present invention to the specific embodiments, but should be understood to include all modifications, equivalents and alternatives included within the spirit and scope of the present invention. In describing the present invention, the same reference numerals are used for the same components even if described in other embodiments.

Terms such as first and second may be used to describe various components, but these components should not be limited by these terms. These terms are only used to distinguish one component from another.

The terms used in this application are used to describe specific embodiments only, and are not intended to limit the invention. In this application, the terms " comprising " or " having " are intended to indicate the presence of a feature, number, step, act, component or combination thereof, one or more of the other features described herein. It should be understood that it does not preclude the presence or addition of fields or numbers, steps, operations, components, parts or combinations thereof.

Hereinafter, the present invention will be described in detail with reference to embodiments related to the present invention shown in the accompanying drawings.

FIG. 1 shows a die bonding system 1 including a die separation apparatus 10 according to an embodiment of the present invention, and FIG. 2 shows a die D arranged on a lamination sheet S. As shown in FIG.

Referring to FIGS. 1 and 2 , the die separation apparatus 10 according to the present invention may be included in the die bonding system 1 .

The die bonding system 1 is mounted on the wafer W by separating and picking up the wafer W arranged on the bonding sheet S, and more specifically, the wafer W can be divided into a plurality of dies D for separation and pickup. on the substrate.

The die bonding system 1 may include a die separating device 10 , a die supporting device 20 and a die picking device 30 .

The supporting device 20 includes: a first wafer supporting member 21 having an end portion for supporting the bonding sheet S provided with the die D; and a second wafer supporting member 22 for inserting the first wafer supporting member 21 (the second wafer support member 22 and the third wafer support member 23 on which the lower surface of the bonding sheet S is located).

When the bonding sheet S is placed on the third wafer support member 23 by a conveying device (not shown), the die separating apparatus 10 according to the embodiment of the present invention is disposed below the bonding sheet S. Then, in a state where the bonding sheet S is supported by the support device, the lower surface of the bonding sheet S may be pressed to separate the die D from the bonding sheet S. In addition, the die pick-up device 30 can pick up the die D from the bonding sheet S and mount it on the upper surface of a substrate or the like.

Fig. 3 shows the die separation apparatus 10 of Fig. 1, Fig. 4 shows a section taken along IV-IV of Fig. 3, Fig. 5 enlarges the head unit 100 of Fig. 4, and Fig. 4 Fig. 6 shows the contact member 140 viewed from the top of Fig. 5, Fig. 7 shows the protrusion 140A of the contact member 140 of Fig. 5, and Fig. 8 shows a section taken along the tangent line VII-VII of Fig. 5 constitute.

Referring to FIGS. 3 and 4 , the die separation apparatus 10 according to the embodiment of the present invention includes: a head unit 100 , a pressing unit 200 , and a driving unit 300 . It may include a drive control unit (not shown) for controlling.

The head unit 100 is disposed on the top of the die separation device 10, and can directly press the surface of the bonding sheet S.

5 to 8 , the head unit 100 may include a main body 110 , a top cover 120 , a support frame 130 and a contact member 140 .

The main body 110 is a main body portion of the head unit 100, and may have a space in which the contact member 140 is disposed. The shape of the main body 110 is not particularly limited, and may be cylindrical in one embodiment.

The top cover 120 is provided to cover the top of the main body 110 . A plurality of openings may be provided on the upper surface of the top cover 120 to allow the suction holes 121 and the guide grooves 122 of the contact member 140 to move in the upright direction.

A plurality of adsorption holes 121 are formed on the upper surface of the top cover 120, and the number is not particularly limited. The adsorption hole 121 may be connected to an adsorption device (not shown) provided in the peeling device 10 or provided separately therefrom. When the contact member 140 pushes the bonding sheet S, the suction device sucks the bonding sheet S through the suction holes 121 , so that the crystal grains D can be separated more stably.

The guide groove 122 may be formed at the center of the upper surface of the top cover 120 . The size and shape of the guide groove 122 are not particularly limited, but may preferably correspond to the size and shape of the protrusion 140A of the contact member 140 described later.

The support bracket 130 is disposed at the bottom of the main body 110 and may connect the head unit 100 to the pressing unit 200 .

The contact member 140 is provided inside the main body 110, and may be provided in plural to press the surface of the fitting sheet S. As shown in FIG.

In an embodiment, the contact member 140 may be a plurality of concentrically arranged blocks. More specifically, as shown in FIGS. 5 and 8 , the first contact blocks 141 , the second contact blocks 142 and the third contact blocks 143 , each of which are annular, are concentric in the contact member 140 .

The first contact block 141 is a contact block disposed on the innermost side of the contact member 140 . In addition, the second contact blocks 142 may be arranged in a radial direction It is spaced upward from the first contact block 141 to surround the first contact block 141 . In addition, the third contact block 143 may be arranged to be spaced apart from the second contact block 142 in the radial direction to surround the second contact block 142 .

The number of the contact members 140 is not particularly limited. In one embodiment of the present invention, three contact members 140 are shown, but the die separation device 10 considers the specific specifications of the die D and the bonding sheet S, so various contact members 140 may be included. This also applies to the pressing member 210 described later. However, in the following, for ease of understanding, the state in which the three contact members 140 are provided is mainly described.

In one embodiment, the plurality of contact members 140 are independently movable. More specifically, the first contact block 141, the second contact block 142, and the third contact block 143 are not constrained by each other's movement, and independently contact the bonding sheet S when moving in the vertical direction or the upright direction. Therefore, the contact state between the bonding sheet S and the contact member 140 can be changed.

In an embodiment, the contact member 140 may include a protrusion 140A and a body portion 140B.

The protrusion 140A may be provided on the top of the contact member 140 . More specifically, as shown in FIGS. 5 and 7 , the protruding portion 140A is formed by protruding a plurality of contact members 140 upward. The upper end of the protrusion 140A may directly contact the lower surface of the bonding sheet S.

The shape of the protrusion 140A is not particularly limited. In one embodiment, as shown in FIG. 7, the protrusion 140A may have a plurality of A shape in which the square-shaped contact members 140 are arranged in layers.

The main body portion 140B may extend in the radial and height directions from the lower end of the protruding portion 140A, and may have a cylindrical shape.

In one embodiment, the contact member 140 according to an embodiment of the present invention may have an upwardly narrowed shape.

In one embodiment, the protrusion 140A may include a plurality of protrusions P and grooves G.

More specifically, as shown in FIG. 7 , a plurality of protrusions P may be formed on the top surface of the first contact block 141 . Each of these protrusions P may directly contact the lower surface of the fitting sheet S when the first contact block 141 moves upward. In addition, grooves G may be formed between the protrusions P of the first contact blocks 141 .

Similarly, a plurality of protrusions P and grooves G may be alternately and repeatedly formed on the upper surfaces of the second contact block 142 and the third contact block 143 .

Therefore, the bonding sheet S is not entirely supported on the upper surface of each contact block, but may be supported in a partially bent state by the protrusions P and grooves G formed in the contact blocks.

That is, according to the die separation device 10 of the embodiment of the present invention, in addition to changing the contact state between the plurality of contact members 140 and the lamination sheet S, by setting the arrangement of the protrusions P and the grooves G on the contact members 140 , the die D can be more easily separated from the bonding sheet S.

In one embodiment, the groove G in the longitudinal and width directions The size may be smaller than that of the protrusion P. Therefore, the bonding sheet S can be prevented from being formed in the space of the groove G from being pulled in excessively.

In another embodiment, the size of the groove G formed in any one of the contact blocks in the length direction and the width direction may be smaller than the size of the protrusion P formed in the adjacent contact block. For example, as shown in FIG. 7, the groove G formed in the second contact block 142 is the projection P formed in the first contact block 141 and the third contact block 143 adjacent to the adjacent contact blocks For comparison, the dimensions in both the length and width directions may be smaller. In this way, the bonding sheet S can be prevented from being bent excessively.

As shown in FIG. 5 , the head unit 100 may further include a plurality of first pin bodies 150 . The first pin body 150 is provided at the lower end of the head unit 100 to transmit the movement of the pressing member 210 of the pressing unit 200 to be described later to the contact member 140 . Although only the first pin body 150 connected to the first contact block 141 is shown in FIG. 5 , the first contact pin body 150 connected to the second contact block 142 and the third contact block 143 may be further increased.

However, the first pin body P1 does not necessarily have to be provided, and the pressing member 210 may directly press and move the contact member 140 without the first pin body P1.

Fig. 9 shows the pressing unit 200 of Fig. 4; Fig. 10 shows a cross-sectional view taken along the cutting line XX of Fig. 9, and Fig. 11 shows a cross-sectional view taken along the line XI-XI of Fig. 9; In Fig. 12, the pressing unit 200 and the driving unit 300 in Fig. 4 are enlarged and displayed.

Referring to FIGS. 9 to 12 , the pressing unit 200 may move the plurality of contact members 140 of the head unit 100 in the upright direction to press the lower surface of the fitting sheet S. FIG.

The pressing unit 200 may include a plurality of pressing members 210 .

The pressing members 210 are connected to correspond to the contact members 140, respectively, and move the contact members 140 in the upright direction. These pressing members 210 can move independently of each other in the upright direction.

In one embodiment, the pressing member 210 may include a first pressing block 211 , a second pressing block 212 and a third pressing block 213 . The first pressing block 211 , the second pressing block 212 and the third pressing block 213 can move up and down independently of the first contact block 141 , the second contact block 142 and the third contact block 143 respectively. The number of pressing blocks is not particularly limited, and may correspond to the number of contact blocks.

In one embodiment, as shown in FIG. 9 , the pressing member 210 may be divided into an upper pressing member 210A and a lower pressing member 210B.

In addition, the pressing unit 200 may further include a second pin body 220, and the second pin body 220 is connected to the upper pressing member 210A and the lower pressing member 210B. The second pin body 220 may connect each pressing block included in the upper pressing member 210A and the lower pressing member 210B. More specifically, the second pin body 220 includes a 2a pin body 221 connected to the first pressing block 211 , a 2b pin body 222 connected to the second pressing block 212 , and a 2c pin body 223 connected to the third pressing block 213 .

Therefore, as described later, when the pressing block of the lower pressing member 210B is moved in the upright direction by the driving unit 300, the movement is The body 220 is transmitted to the upper pressing member 210A. In addition, the upper pressing member 210A can independently move the contact member 140 of the head unit 100 in the upright direction.

In another embodiment, the pressing unit 200 does not include the second pin body 220, and the upper pressing member 210A and the lower pressing member 210B may be integrally formed. In this case, the upper part and the lower part may be used to conceptually separate the meanings of the pressing member 210 .

In one embodiment, as shown in FIG. 10, the upper end of the upper pressing member 210A may be composed of a plurality of polygonal blocks. More specifically, at the upper end of the upper pressing member 210A, the first pressing piece 211 is arranged in the center, the second pressing piece 212 is arranged on both sides thereof, and the outermost may be provided as the third pressing piece 213 . That is, the second pressing block 212 and the third pressing block 213 may include a plurality of physically separated blocks.

In one embodiment, the lower end of the upper pressing member 210A may be composed of a plurality of blocks arranged concentrically. More specifically, at the lower end of the upper pressing member 210A, the first pressing block 211 is disposed at the center, the second pressing block 212 is disposed to surround the first pressing block 211, and the third pressing block 213 may be arranged to surround the second pressing block again Block 212.

Also, the pressing member 210, more specifically, the upper pressing member 210A may have a shape narrowed upward.

In FIGS. 10 and 11, each pressing block is shown to have a polygonal shape, but is not limited thereto. For example, the pressing block may have various shapes, such as annular and oval.

Although not shown in the drawings, the upper end of the lower pressing member 210B may have the same shape as the lower end of the upper pressing member 210A. More specifically, the section indicated by XI'-XI' in Fig. 9 may have the same shape as the section indicated by XI-XI.

In one embodiment, the lower pressing members 210B may be connected to the second pin bodies 220, respectively. More specifically, as shown in FIGS. 9 and 12, the lower pressing member 210B has a first pressing block 211 arranged in the center and a second pressing block 212 surrounding the first pressing block 211, and can The three pressing blocks 213 are arranged to surround the second pressing block 212 again. In addition, the first pressing block 211 is connected to the 2a pin 221 , the second pressing block 212 is connected to the 2b pin 222 , and the third pressing block 213 is connected to the 2c pin 223 . Therefore, when each of the second pin bodies 220 moves up and down according to the operation of the driving unit 300 to be described later, the pressing members 210 also move up and down, respectively. In FIG. 12, two second pin bodies 220 are connected to each pressing member 210, but the number or positions to be connected are not particularly limited.

In addition, the lower end of the lower pressing member 210B may be arranged to be connected to the driving unit 300, which will be described later.

FIG. 13 shows the drive unit 300 of FIG. 4 . More specifically, FIG. 12 shows a side view of the drive unit 300 .

As shown in FIGS. 4 and 13 , the driving unit 300 is provided below the die separation device 10 and can move the pressing member 210 in the up-down direction.

The drive unit 300 may include a platform 310 and a drive mechanism 320 .

The platform 310 is disposed under the driving unit 300, and the plurality of pressing members 210 can move integrally in the upright direction. More specifically, the platform 310 is a single plate, which is connected to the first drive member M1 and can move in an upright direction. In addition, the first pressing block 211 , the second pressing block 212 and the third pressing block 213 may be disposed on the upper surface of the platform 310 . Therefore, when the platform 310 moves in the upright direction, the first pressing block 211 , the second pressing block 212 and the third pressing block 213 can also move integrally in the upright direction.

The driving mechanism 320 moves integrally with the platform 310, and independently moves at least one of the plurality of pressing members 210 in the upright direction. For example, the driving mechanism 320 may have a roller structure for moving the pressing member 210 in the upright direction.

The driving mechanism 320 may include a guide 321 , a slider 322 , a pushing member 323 having an inclined portion, and a roller 324 .

The guide 321 may be disposed on the platform 310 perpendicular to the upright direction. For example, the guides 321 may be arranged in the X-axis direction or the Y-axis direction which is perpendicular to the Z-axis as the upright direction.

The slider 322 is provided on the guide 321 and can reciprocate in one direction along the guide 321 . For example, the slider 322 may be inserted into a groove formed on the side surface of the guide 321 at a reciprocating movement in the direction.

The pushing member 323 having an inclined portion has an inclined surface of a predetermined angle, and is connected to the slider 322 so as to be movable in one direction. For example, when the slider 322 is moved in one direction by the operation of the second driving member M2, the pushing member 323 having the inclined portion connected with the slider 322 is also moved in the same direction.

As such, the drive mechanism 320 is used to provide upright up-and-down movement relative to the pressing member 210 , and in one embodiment, the drive mechanism 320 has a guide 321 , a slider 322 and a push member 323 with an inclined surface, and a roller 324 . However, the pushing member 323 having the inclined portion is one having the inclined surface, but is not limited thereto. For example, the driving mechanism 320 may be provided with grooves on the sides to cause the upright up-and-down movement of the pressing member 210 . Alternatively, the drive mechanism 320 may be configured such that cams are formed on an upper or side surface having a cylindrical annular shape, and when each cam is rotated, an upright motion may be induced in association with movement of the upper or side surface.

In one embodiment, the first driving member M1 and the second driving member M2 are any one of various driving means for moving the platform 310 and the slider 322 (or the pushing member 323 having the inclined portion), respectively. More specifically, the first driving member M1 and the second driving member M2 may be a stepping motor, a linear motor, or a servo motor as a driving mechanism.

The second drive member M2 is provided in a pusher having an inclined portion The members 323 are arranged in front of the moving direction of the members 323, and are arranged side by side on the sides of the pushing members 323 having inclined portions, or at the bottom, to provide a driving force. When the second driving member M2 is disposed below, the second driving member M2 may include the function of the slider 322 of the driving mechanism 320 .

The roller 324 is provided on one side of the pressing member 210, and can maintain a contact state with the inclined surface of the pushing member 323 having the inclined portion. More specifically, as shown in FIG. 12, the roller 324 may be provided at the lower end of the second pressing block 212, so that the pushing member 323 having the inclined portion moves in one direction therewith, and rolls while being in contact with the inclined surface. Likewise, the roller 324 may also be provided at the lower end of the third pressing block 213 so that the pushing member 323 having the inclined portion moves in one direction and rolls while being in contact with the inclined surface. Therefore, the movement of the pushing member 323 having the inclined portion in one direction can cause the movement of the pressing member 210 in the upright direction.

In a specific embodiment, the first pressing block 211 may be directly connected to the platform 310 . That is, unlike the second pressing block 212 and the third pressing block 213, the movement of the first pressing block 211 may be independent of the pushing member 323 having the inclined portion.

In a specific embodiment, the number of the pressing members 210 may be three or more, and the driving mechanism 320 may be provided less than the number of the pressing members 210 . For example, as described above, three pressing members 210 may be provided as the first pressing block 211, the second pressing block 212 and the third pressing block 213, and And a drive mechanism 320 may be provided. The second pressing block 212 and the third pressing block 213 may be connected to each driving mechanism 320 , and the first pressing block 211 may also be directly connected to the platform 310 without being connected to the driving mechanism 320 .

Therefore, as the platform 310 moves in the upright direction, the first pressing blocks 211 also move in the upright direction, and at the same time, the second pressing blocks 212 serving as the respective driving mechanisms 320 also move in the upright direction. And the third pressing block 213 also moves in the upright direction. That is, the plurality of pressing members 210 can be moved as a whole by the movement of the platform 310 . In addition, as the plurality of pressing members 210 move integrally, the head unit 100 and the pressing unit 200 may integrally move in the upright direction. That is, the platform 310 may integrally move the head unit 100 and the pressing unit 200 in the upright direction.

In addition, the second pressing block 212 and the third pressing block 213 can be independently moved in the upright direction by the movement of each driving mechanism 320 connected thereto.

In a specific embodiment, the plurality of pressing members 210 are concentrically arranged and are a plurality of blocks having a shape that narrows upward, and the platform 310 is the innermost pressing member ( For example, it can be directly connected to the first pressing block 211).

In addition, the driving mechanism 320 can independently move the remaining pressing members (eg, the second pressing block 212 and the third pressing block 213 ) except the innermost pressing member in the upright direction.

However, the platform 310, the plurality of pressing members 210 and the driving machine The arrangement relationship between the structures 320 is not limited to this. For example, the platform 310 may be directly connected to the outermost pressing member of the plurality of pressing members 210 . In addition, the driving mechanism 320 may move the remaining pressing members (eg, the first pressing block 211 and the second pressing block 212 ) in the upright direction independently of the outermost pressing member.

Therefore, according to the die separation device 10 of the embodiment of the present invention, the plurality of contact members 140 and the plurality of pressing members 210 can be raised integrally to form the bonding sheet S and the plurality of contact members 140 . By contacting the whole of the plurality of pressing members 210 and raising or lowering a part thereof, the contact state between the bonding sheet S and the plurality of contact members 140 is changed, thereby removing the die D from the bonding sheet S, instead it can be separated.

Although not shown in the drawings, the die separation apparatus 10 may include a drive control unit (not shown). The driving control unit may control the driving unit 300, more specifically, the platform 310 and the driving mechanism 320, according to a preset program or a user's operation.

FIG. 14 shows a method for separating grains according to another embodiment of the present invention.

Referring to FIG. 14, according to another embodiment of the die separation method of the present invention, a die separation device 10 including a plurality of contact members 140 is used to press the bonding sheet S, thereby forming a bonding sheet S for a purpose In order to separate the dies D disposed on the bonding sheet S, it is possible to first align a plurality of contact members 140 to the same height.

More specifically, as shown in Figure 15a, the first contact block 141, the second contact block 142 and the third contact block 143 are all located at the same height L1. In this state, the contact member 140 is not in contact with the bonding sheet S.

Next, the aligned plurality of contact members 140 are raised integrally to come into contact with the fitting sheet S. As shown in FIG.

More specifically, as shown in FIG. 15b, the first contact block 141, the second contact block 142 and the third contact block 143, which are aligned at the same height L1, are raised integrally, which are located at the same height L2. Therefore, all the contact members 140 are kept in contact with the bonding sheet S.

Next, a part of the plurality of contact members 140 is raised or lowered to change the contact state between the fitting sheet S and the plurality of contact members 140 . In one embodiment, at least one contact member 140 of the plurality of concentrically configured and aligned contact members 140 can be selectively raised or lowered to change the contact state of the contact member 140 .

More specifically, as shown in FIG. 15c, the third contact block 143 can be lowered by using the driving mechanism 320, and then the third pressing block 213 can be lowered. Therefore, as shown in Fig. 15c, the area of the bonding sheet S supported by the contact member 140 can be reduced.

Next, as shown in FIG. 15d , the second contact block 142 can be lowered by using the driving mechanism 320 , thereby lowering the second pressing block 212 . Therefore, as shown in Fig. 15d, the area of the bonding sheet S supported by the contact member 140 can be further reduced. Therefore, as the contact state of the bonding sheet S and the contact member 140 changes (the contact area decreases), the die D can be removed from the bonding Separation on the sheet S.

FIGS. 15a to 15d show the case where the contact member 140 is lowered, but it is not limited to this case.

For example, the first contact block 141, the second contact block 142 and the third contact block 143 are all located at the same height L1 as in Fig. 15a (Fig. 16a).

Next, as shown in Fig. 15b, the first contact block 141, the second contact block 142 and the third contact block 143 are raised integrally and all positioned at the same height L2 (same as Fig. 16b).

Next, the driving mechanism 320 may be used to raise the second pressing block 212 , thereby raising the second contact block 142 . Therefore, as shown in Fig. 16c, the area of the bonding sheet S supported by the contact member 140 is reduced. Also, since the bonding sheet S is only supported by the second contact block 142, the remaining portion is bent downward, so that the die D can be separated from the bonding sheet S.

Continuing, the third pressing block 213 may be raised by using the driving mechanism 320 , thereby raising the third contact block 143 . As a result, as shown in Fig. 16d, the contact state between the contact member 140 and the bonding sheet S is changed. In addition, since the bonding sheet S is only supported by the third contact block 143, the remaining portion is bent downward, so that the die D can be separated from the bonding sheet S more easily.

As described above, the present invention raises or lowers a part of the plurality of contact members 140 in contact with the adhesive sheet S by integrally raising the plurality of contact members 140 to contact the adhesive sheet S. By changing the contact of member 140 state, the die D can be easily separated from the bonding sheet S.

In particular, according to the present invention, the plurality of contact members 140 are integrally elevated to contact the fitting sheet S, so that each contact member 140 can be positioned at the same height relative to the fitting sheet S. FIG. Therefore, the die D can be accurately separated from the bonding sheet S by minimizing the height difference between the contact members 140 generated during the operation of the device.

In addition, according to the present invention, the contact member 140 and the pressing member 210 have upwardly narrowed shapes, thereby smoothly transmitting power and maximizing the space efficiency of the device.

In this specification, the present invention is mainly described in a limited embodiment, but various embodiments are possible within the scope of the present invention. Additionally, although not explicitly described in this specification, example and equivalent arrangements are also incorporated into the present invention. Accordingly, the true scope of the present invention should be defined by the appended claims.

100: Head unit

200: Press unit

300: Drive unit

Claims (11)

A die separation device for pressing a lamination sheet from below to separate the die set on the lamination sheet from the lamination sheet, which has a die separation facility, comprising: a head unit, including a plurality of contact members in contact with the lamination sheet; a pressing unit, including a plurality of pressing members, which are used to move a plurality of abutting parts in a vertical direction; a drive unit for moving the plurality of pressing members in the upright direction; a drive control unit for controlling a platform and the drive unit; a drive unit stage that integrally moves the plurality of pressing members in an upright direction; and Yet another driving unit, which is provided on the platform and independently moves at least one of the plurality of pressing members in the upright direction. The die separating device of claim 1, wherein the pressing member is connected to each member corresponding to the contact member, so that the contact member can move in the upright direction. The die separation device of claim 1, wherein the drive unit includes a member having an inclined portion, the inclined portion is arranged on the platform to move in a direction perpendicular to the upright direction, and among the plurality of pressing members At least one of them can be independently moved in the up-down direction according to the movement of the member having the inclined portion. According to the die separation device of claim 1 of the scope of application, the plurality of pressing members is three or more, and the number of driving mechanisms is less than the number of pressing members and demolding devices. The die separation device according to claim 3, wherein the drive unit is disposed on one side of the member having the inclined portion, and has at least one guide relative to the member having the inclined portion. The die separating device of claim 4, wherein the platform is directly connected to the innermost pressing member among the plurality of pressing members, the driving unit demolding device is provided on the platform, and, except for the innermost pressing member The other pressing members move independently in the upright direction. According to the die separation device of claim 1 of the claimed scope, wherein the die separation device included in the driving unit is a device that makes the head unit and the pressing unit move integrally in the vertical direction. A die separation device that separates dies from a lamination sheet by changing the contact state of a plurality of contact members, as a means for pressing the lamination sheet from below to separate the die arranged on the lamination sheet from the lamination sheet A grain separation device, which includes: a head unit, which includes a plurality of contact members in contact with the lamination sheet; a pressing unit including a plurality of pressing members for moving the plurality of contact members in the upright direction and moving the plurality of pressing members in the upright direction; and A driving unit that integrally raises the plurality of contact members and the plurality of pressing members to integrally bring the fitting sheet into contact with the plurality of contact members, and raises or lowers at least one of the plurality of pressing members to form the fitting sheet. A die separation method using a die separation device, which is to align a plurality of contact members to the same height; raise a plurality of aligned contact members as a whole to contact a bonding sheet; and by raising or A part of the plurality of contact members is lowered to change the contact state between the lamination sheet and the plurality of contact members, so that the lamination sheet is pressed by the plurality of contact members, and the sheet provided on the lamination sheet is separated from the lamination sheet. Grainer. The die separation method of claim 9, which is a method of die separation by the step of changing the contact state, wherein at least one of a plurality of concentrically arranged and aligned contact members is selected increase or decrease sexually. The method for separating crystal grains as claimed in item 9 of the patent application scope, wherein the separating device comprises: a head unit, including a plurality of contact members, which press the fitting sheet from below; a pressing unit including a plurality of pressing members for moving the plurality of contact members in the upright direction to press the fitting sheet, and comprising a plurality of pressing members for moving the plurality of pressing members in the upright direction Drive unit; a drive unit platform that integrally moves the plurality of pressing members in the upright direction; a drive unit that moves integrally with the platform and moves at least one of the plurality of pressing members independently in the upright direction; and includes In the step of contacting the lamination sheet, by raising the platform, all the upper surfaces of the plurality of contact members are brought into contact with the lamination sheet; The step of changing the contact state, wherein at least one of the plurality of contact members is separated from the lamination sheet by raising or lowering the drive unit.

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