JPH0340585Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an improvement of a bonding tool holding device using a parallel spring mechanism.

[Conventional technology]

A conventional example of a bonding tool holding device for a die bonder is shown in FIG. 4, for example. In the figure, 1 is a bonding arm, and 3 is an arm attached to the bonding arm 1 directly or via a tool position adjustment device 2 as shown. 4 is a rear column fixed to the arm 3, 5 is a front column with a tool holder 6 at the lower end, and 7 and 8 are a pair of leaf springs stretched parallel to each other between the front column 5 and the rear column 4. It is.
These rear struts 4, front struts 5, and a pair of leaf springs 7, 8 constitute a parallel spring mechanism. 9
A bonding tool is inserted into the tool holder 6 and fixed by a set screw 10, and in this conventional example, it is a vacuum suction type needle. 11 is the front strut 5
The collar 12 is a fork fixed to the rear support 4. Normally, the lower end of the collar 11 is in contact with the tip of the fork 12, so that the front support 5 does not sag downward due to its own weight. It is designed to prevent 13 is a leaf spring for applying a bonding load, the rear end of which is fixed to the rear column 4;
Its tip is in contact with the leaf spring 7. 14 is a bolt for adjusting the bonding load, and is screwed onto the arm 3. 15 is a pedestal, 16 is a workpiece placed on the pedestal 15, and 17 is a bonding tool 9
This is the die that is attracted to the 18 is adhesive,
Bonding surface 16a of workpiece 16 before bonding process
applied on top. Note that 19 is a hole for vacuum suction provided in the bonding tool 9, and 20 is a hole for vacuum suction provided in the center of the front support column 5 so as to be connected to the hole 19. Connected to a negative pressure source via a switching valve.

Next, to explain its operation, when one die 17 attracted to the bonding tool 9 comes to the bonding position, that is, a position directly above the adhesive 18 as shown in FIG. 4 by the movement of the bonding arm 1,
The bonding arm 1 descends and the die 17 is pressed against the bonding surface 16a via the adhesive 18. At this time, the downward stroke of the bonding arm 1 is set to an appropriate level, so that the front strut 5 ultimately The shape rises slightly relative to the rear strut 4, and the leaf springs 7 and 8 remain parallel to the fourth
It is slightly upward to the left in the figure. In other words, the die 17 is attached to the adhesive surface 16 of the workpiece by the elastic restoring force of the leaf springs 7 and 8.
A is pressed and crimped. The pressing force against the workpiece can be adjusted by turning the load adjustment bolt 14 and changing the pressing force exerted on the leaf spring 7 by the leaf spring 13.

When the bonding operation of the die 7 by the bonding tool 9 is completed, the negative pressure in the holes 19 and 20 is released, and the bonding tool 9 rises as the bonding arm 1 rises to adsorb the next die. move for.

[Problem that the invention attempts to solve]

However, such a conventional bonding tool holding device is based on a combination of many components such as the bonding arm 1, the tool position adjustment device 2, the arm 3, and the parallel spring mechanism. It is extremely difficult to achieve parallelism between the tip surface 9a of the bonding tool 9 and the workpiece bonding surface 16a, and if the parallelism is poor,
As shown in an exaggerated manner in FIG. 5, there was a problem in that the die 17 was adhered onto the adhesive surface 16a in an inclined state.

[Means for solving problems]

This idea was made by focusing on these conventional problems, and as shown in FIGS. 1 to 3, the rear strut 4 is divided into an upper block 21 and a lower block 22, and this divided A tool tilt adjustment device 23 is provided between the two blocks, which allows the lower block 22 to move relative to the upper block 21 in the X direction, Y direction, or XY composite direction. An object of the present invention is to provide a bonding tool holding device that can accurately align the bonding tool with the bonding tool.

[Example of idea]

This invention will be explained below based on the embodiments shown in FIGS. 1 to 3. 1 to 3 are a side view, a bottom view, and a perspective view of a slider showing one embodiment of this invention, respectively, and members that perform the same function as the conventional example shown in FIG. The same reference numerals as those in the drawings are given, redundant explanations thereof will be omitted, and only the configurations of different parts will be explained.

In this embodiment, the rear support column 4 in the conventional example is divided into an upper block 21 and a lower block 22, and between these upper and lower blocks, the lower block 22 is arranged in the X direction with respect to the upper block 21. A tool tilt adjustment device 23 is provided so that the tool can be moved in the Y direction or in the XY composite direction.

This tool tilt adjustment device 23 has a configuration as described below.

That is, a block 25 having a dovetail groove 24 extending in the X direction (direction perpendicular to the plane of the paper) is fixed to the bottom surface of the upper block 21, and a spring receiving plate 26 and a bracket plate 2 are respectively provided on both end surfaces in the X direction.
7 is fixed. A slope 30 provided on a slider 29, shown in detail in FIG. 3, is fitted into the dovetail groove 24 so as to be movable in the X direction. The slider 29 includes a slope 31 extending in a direction perpendicular to the slope 30 (Y direction). As shown in FIG. 2, a spring 32 is compressed between the spring receiving plate 26 and one end surface of the slider 29, and a spring 32 is compressed between the spring receiving plate 26 and the end surface of one side of the slider 29.
An adjustment screw 28 is screwed into 7, and its tip abuts against the other end surface of the slider 29.

Next, the lower block 22 is provided with a dovetail groove extending in a direction perpendicular to the dovetail groove 24 (Y direction).
The slope 31 of the slider 29 is fitted into this dovetail groove so as to be slidable in the Y direction.

33 is a spring receiving plate fixed near the front end (left end in FIG. 2) of the lower block 22, and 34 is the rear end (right end in FIG. 2) of the lower block 22.
This is a bracket plate fixed to. A spring 35 is compressed between the spring receiving plate 33 and the slider 29, and an adjusting screw 36 is screwed into the bracket plate 34, the tip of which is in contact with the slider 29.

As shown in FIG. 3, a relatively large diameter through hole 37 is provided in the center of the slider 29.
A through hole (not shown in the figure) provided on the lower block 22 side and a female thread (not shown in the figure) provided on the upper block 21 side are used to allow the bolt 38 that fixes both to pass through. It's getting old.

In this embodiment, the tool inclination adjustment device 23 has the above-mentioned configuration, but it is not limited to this, and an X-Y direction adjustment mechanism with a well-known structure can be used instead of the above-mentioned adjustment device.

Next, to explain the action, bonding tool 9
When the die 17 that is attracted to the die 17 is pressed against the workpiece 16 in an inclined state, as shown in FIG. This corrects the inclination of the tool 9. That is, by turning the adjusting screw 28, the slider 29 moves in the X direction with respect to the upper block 21, and the adjusting screw 3
By turning 6, the lower block 22 moves in the Y direction relative to the slider 29. Lower block 2
2 is transmitted to the front support column 5 via the leaf spring 8, thereby correcting the inclination of the bonding tool 9.

The above adjustment work is preferably performed using a dummy part having the same shape and size as the die 17. Once the inclination adjustment is completed in this way, the desired adjustment is completed by turning the bolt 38 to tighten and fix the lower block 22 to the upper block 21.

[Summary of the idea]

As described above, the present invention consists of a front strut 5 with a bonding tool 9 attached to its tip, a rear strut 4 attached to the bonding arm 1 side, and a pair of leaf springs 7 and 8 stretched between these two struts. In the bonding tool holding device having a parallel spring mechanism, the rear support 4 is connected to an upper block 21.
and a lower block 22, and a tool tilt adjustment device 23 is provided between these two blocks, allowing the lower block 22 to move relative to the upper block 21 in the X direction, Y direction, or XY composite direction. This is a bonding tool holding device.

[Effect of idea]

Therefore, according to this invention, the rear strut is divided into an upper block 21 and a lower block 22, and between these two blocks, the lower block 22 is arranged in the X direction, Y direction, or XY direction with respect to the upper block 21.
Since the structure includes a tool tilt adjustment device 23 that allows movement in the composite direction of the bonding tool, even if the bonding tool is tilted due to manufacturing errors, assembly errors, etc. of each component around the bonding tool holding device, Tool tilt can be corrected very easily using the tool tilt adjustment device.
This provides the effect that the die can be accurately bonded to the workpiece.

[Brief explanation of the drawing]

FIG. 1 is a side view showing an embodiment of the invention, FIG. 2 is a bottom view of FIG. 1, and FIG. 3 is a perspective view of a slider that is one of the components of the tool tilt adjustment device.
FIG. 4 is a side view showing an example of a conventional bonding tool holding device, and FIG. 5 is an explanatory diagram showing defective die attachment. DESCRIPTION OF SYMBOLS 1...Bonding arm, 2...Tool position adjustment device, 3...Arm, 4...Rear column, 5...
...Front support, 6... Tool holder, 7... Leaf spring, 8... Leaf spring, 9... Bonding tool,
10... Set screw, 11... Tsuba, 12... Fork, 13... Leaf spring, 14... Bolt, 15...
Pedestal, 16...Work, 17...Die, 18...
Adhesive, 19... hole (for vacuum suction), 20... hole (for vacuum suction), 21... upper block, 22...
Lower block, 23... Tool tilt adjustment device, 2
4...Dovetail groove, 25...Block, 26...Spring receiving plate, 27...Bracket plate, 28...Adjustment screw, 29...Slider, 30...Slope, 31...
... Slope, 32 ... Spring, 33 ... Spring receiving plate, 34 ... Bracket plate, 35 ... Spring, 36 ... Adjustment screw, 37 ... Through hole, 38
……bolt.

Claims (1)

[Scope of utility model registration request] It has a parallel spring mechanism consisting of a front strut 5 with a bonding tool 9 attached to its tip, a rear strut 4 attached to the bonding arm 1 side, and a pair of leaf springs 7 and 8 stretched between these two struts. In the bonding tool holding device, the rear column 4 is divided into an upper block 21 and a lower block 22, and a lower block 2 is inserted between these two blocks.
1. A bonding tool holding device characterized in that a tool tilt adjustment device 23 is provided which can move the tool tilt adjustment device 23 relative to an upper block 21 in the X direction, Y direction, or XY composite direction.