JPH04291936A - Bonding apparatus of lead part for semiconductor chip use - Google Patents

Abstract

PURPOSE:To prevent an unbalanced force from being exerted on a semiconductor chip at a bonding operation even when the parallelism between a bonding head and the face of a chip stage is not adjusted regarding the bonding apparatus, of a lead part for semiconductor chip use, which is used to bond the lead part to the semiconductor chip. CONSTITUTION:The title apparatus is provided with the following: a chip stage 1 on which a semiconductor chip 1 is placed; and a bonding head 3 which bonds a lead part 4A for semiconductor chip use to the semiconductor chip 2 by exerting heat and pressure on the semiconductor chip 2 together with a film 4 while the film 4 on which the lead part 4A has been formed is attached to the semiconductor chip 2 on the chip stage 1 from the upper part. The rear surface 1A of the chip stage 1 and the receiving face 6A on the rear surface 1A of the chip stage 1 are constituted respectively as spherical surfaces. The apparatus is constituted to place the semiconductor chip 2 on the chip stage 1 in such a way that the center on the surface of the semiconductor chip 2 coincides with the center O of rotation of the chip stage 1.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip lead bonding apparatus for bonding a lead to a semiconductor chip.

[0002] In recent years, a film on which a lead portion for the semiconductor chip is formed is applied from above to a semiconductor chip on a chip stage, and heat and pressure are applied to the semiconductor chip together with the film, thereby forming a lead portion to the semiconductor chip. TAB (tape automated bonding) technology has been proposed for bonding.

[0003] Such TAB technology is attracting attention because it allows batch bonding to semiconductor chips regardless of the number of leads.

0004

2. Description of the Related Art FIG. 9 is a schematic diagram showing a conventional semiconductor chip lead bonding apparatus. In FIG. 9, 101 is a chip stage on which a semiconductor chip 102 is placed, and 103 is a bonding head [ILB Inner lead bonding) tool], this bonding head 103 connects the semiconductor chip 102 on the chip stage 101 from above to the semiconductor chip lead part 104A.
The lead portion 104A is bonded to the semiconductor chip 102 by applying the film 104 formed thereon and applying heat and pressure to the semiconductor chip 102 together with the film 104.

[0005] Reference numeral 102A denotes a bump as a lead joining portion to the semiconductor chip 102.
is made of gold or tin.

Further, 105 is a film carrier, and this film carrier 105 is used to feed the film 104 and set the semiconductor chip lead portion 104A in the film 104 on the semiconductor chip 102.

With such a configuration, the semiconductor chip 10
2 is placed on the chip stage 101, the semiconductor chip lead portion 104A in the film 104 is set on the semiconductor chip 102 using the film carrier 105.

After that, the bonding head 103 is lowered and the semiconductor chip 102 is bonded together with the film 104.
By applying heat and pressure to the semiconductor chip 102, the lead portion 104A is bonded to the semiconductor chip 102.

[0009]

However, with such a conventional semiconductor chip lead bonding apparatus, when the semiconductor chip 102 becomes large in size or has a large number of pins, it is difficult to bond the leads all at once. One of the reasons
The first point is that high parallelism is required between the tool and the stage surface. In other words, as shown in FIG. 10, if the parallelism is not adjusted reliably, the pressure applied to the bump 102A during bonding will be uneven, resulting in damage to the chip (see section A in FIG. 8) or insufficient parallelism. This causes a severe bonding (see part B in FIG. 10).

Therefore, the parallelism between the bonding head and the chip stage surface is usually adjusted so that the parallelism is, for example, 5.
It is necessary to keep the deviation within microns.

However, as a practical matter, this parallelism adjustment is difficult and time-consuming, and it is not possible to correct deviations due to variations in bump formation or dirt on the chip stage or chip.

The present invention was devised in view of these problems, and it is possible to prevent unbalanced force from being applied to the semiconductor chip during bonding even if the parallelism between the bonding head and the chip stage surface is not adjusted. An object of the present invention is to provide a lead bonding device for semiconductor chips.

[0013]

[Means for Solving the Problems] Therefore, the semiconductor chip lead bonding apparatus of the present invention includes a chip stage on which a semiconductor chip is placed, and a semiconductor chip lead bonding device that connects the semiconductor chip from above to the semiconductor chip on the chip stage. By applying heat and pressure to the semiconductor chip together with the film formed with the part,
A bonding head for bonding the lead portion to the semiconductor chip is provided, the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage are each configured as a spherical surface, and the center of the surface of the semiconductor chip is located on the surface of the chip stage. The semiconductor chip is placed on the chip stage so as to coincide with the center of rotation (
Claim 1).

Further, in the semiconductor chip lead bonding apparatus of the present invention, at least three elastic bodies are interposed along the circumference between the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage. (Claim 2).

Furthermore, in the semiconductor chip lead bonding apparatus of the present invention, at least three bearings are interposed along the circumference between the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage. (Claim 3)

Further, the semiconductor chip lead bonding apparatus of the present invention is provided with a vacuum suction passage opening on the semiconductor chip mounting surface of the chip stage in order to fix the semiconductor chip on the chip stage. (Claim 4).

[0017]

[Operation] In the above-described semiconductor chip lead bonding apparatus (claim 1) of the present invention, after the semiconductor chip is placed on the chip stage, the semiconductor chip lead part in the film is set on the semiconductor chip.

Thereafter, the bonding head is lowered and heat and pressure are applied to the semiconductor chip together with the film, thereby bonding the lead portion to the semiconductor chip.

Even if the parallelism between the bonding head and the chip stage surface is not adjusted, the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage are configured as spherical surfaces, and the center of the surface of the semiconductor chip so that it coincides with the center of rotation of the chip stage.
Since the semiconductor chip is placed on the chip stage, when pressure is applied by the bonding head, the chip stage slightly swings the chip stage supporting concave surface of the chip stage support portion. This prevents unbalanced force from being applied to the semiconductor chip during bonding.

Further, in the semiconductor chip lead bonding apparatus (claim 2) of the present invention, after bonding, each elastic body interposed between the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage, When the semiconductor chip is removed,
The chip stage automatically returns to its original position.

Furthermore, in the semiconductor chip lead bonding apparatus (claim 3) of the present invention, the movement of the chip stage is controlled by each bearing interposed between the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage. smoothen.

Furthermore, in the semiconductor chip lead bonding apparatus (claim 4) of the present invention, the semiconductor chip on the chip stage is fixed by the vacuum suction passage that opens on the semiconductor chip mounting surface of the chip stage. It will be done.

[0023]

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view showing an embodiment of the present invention. In FIG. 1, numeral 1 denotes a chip stage on which a semiconductor chip 2 is placed, and this chip stage 1 is used for supporting the chip stage. It is supported by a chip stage support portion 6 having a concave surface 6A.

The lower surface 1A of this chip stage 1
A concave surface 6A formed on the chip stage support portion 6 and serving as a receiving surface for the lower surface 1A of the chip stage 1 is configured as a spherical surface.

As a result, the chip stage 1 is supported by the chip stage support portion 6 so as to be able to swing freely within a small range in the direction of the arrow.

Further, the semiconductor chip 2 is placed on the chip stage 1 so that the center of the surface of the semiconductor chip 2 coincides with the rotation center O of the chip stage 1.

Incidentally, reference numeral 2A denotes a bump as a lead portion joining portion to the semiconductor chip 2, and this bump 2A is made of gold or tin.

Further, 3 is a bonding head [ILB(
Inner lead bonding) tool], this bonding head 3 connects the semiconductor chip 2 on the chip stage 1.
By applying the film 4 on which the semiconductor chip lead portion 4A is formed from above to the film 4 and applying heat and pressure to the semiconductor chip 2 together with the film 4,
This is for joining the lead portion 4A to the semiconductor chip 2.

Further, 5 is a film carrier, and this film carrier 5 is used to feed the film 4 and set the semiconductor chip lead portion 4A in the film 4 on the semiconductor chip 2.

Furthermore, as shown in FIG. 2, the chip stage 1
Between the lower surface 1A and the chip stage supporting concave surface 6A of the chip stage support part 6, three solid rubbers 7 as elastic bodies are interposed along the circumference at 120° intervals, and the solid rubbers 7 are disposed. Similarly, three bearings 8 are interposed along the circumference at intervals of 120 degrees between the provided portions.

Note that, as shown in FIG. 3, the solid rubber 7 and the bearing 8 may be arranged in the same phase.

Furthermore, as shown in FIG. 1, a vacuum suction passage 9 is provided which opens on the semiconductor chip mounting surface 1B of the chip stage 1. It is connected to a vacuum pump (not shown) through the stage support section 6.

Note that the chip stage 1 of the vacuum suction passage 9
The boundary between the lower surface 1A of the chip stage supporting part 6 and the chip stage supporting concave surface 6A of the chip stage supporting part 6 is set to be wide at the part of the vacuum suction passage 9 on the chip stage supporting part side. This is to prevent the vacuum suction passage 9 from being cut off even if the chip stage 1 slightly swings the chip stage support concave surface 6A of the chip stage support portion 6. In this way, the semiconductor chip 2 on the chip stage 1 can be fixed.

Note that L is the rotation center O of the chip stage 1.
is the vertical axis passing through .

With the above-described configuration, after the semiconductor chip 2 is placed on the chip stage 1, the semiconductor chip lead portion 4A in the film 4 is set on the semiconductor chip 2.

At this time, the semiconductor chip 2 on the chip stage 1 is reliably fixed by the vacuum suction passage 9 opened to the semiconductor chip mounting surface 1B of the chip stage 1.

Thereafter, the bonding head 3 is lowered to apply heat and pressure to the semiconductor chip 2 together with the film 4, thereby bonding the lead portion 4A to the semiconductor chip 2.

By the way, the bumps 2A on the semiconductor chip 2
Considering the case where the semiconductor chip 1 is tilted due to variations in formation or dust or dirt, in this case, the chip stage 1
Since the lower surface 1A and the receiving surface 6A of the lower surface of the chip stage 1 are each configured as a spherical surface, when the bonding head 3 applies pressure, the chip stage 1 causes the chip stage supporting concave surface 6A of the chip stage support part 6 to undergo minute vibrations. This prevents unbalanced force from being applied to the semiconductor chip 2 during bonding. This does not adversely affect bonding.

Furthermore, considering the case where the parallelism between the bonding head 3 and the chip stage surface is not adjusted,
In this case, since the lower surface 1A of the chip stage 1 and the receiving surface 6A of the lower surface of the chip stage 1 are each configured as a spherical surface, when the bonding head 3 applies pressure, the chip stage 1 Since the parallelism between the bonding head 3 and the chip stage surface is automatically adjusted by slightly swinging the supporting concave surface 6A, no unbalanced force is applied to the semiconductor chip 2 during bonding. As a result, bonding is not adversely affected in this case as well.

That is, this device has a self-alignment function in terms of parallelism adjustment.

Furthermore, since the semiconductor chip 2 is placed on the chip stage 1 so that the center of the surface of the semiconductor chip 2 coincides with the rotation center O of the chip stage 1, the chip stage 1 is placed on the chip stage support part. Even if the concave surface 6A for supporting the chip stage of No. 6 is slightly oscillated, the semiconductor chip 2
The position of the lead part to be joined will hardly go out of order.

In this way, the semiconductor chip 1 due to variations in the formation of the bumps 2A on the semiconductor chip 2, dust and dirt, etc.
Even if the bonding head 3 is tilted, it does not adversely affect the bonding, and furthermore, even if the parallelism between the bonding head 3 and the chip stage surface 1B is not adjusted, no biased force is applied to the semiconductor chip 2 during bonding. This eliminates damage to the semiconductor chip 2 and poor bonding.

Furthermore, as described above, the chip stage 1 is mounted on the chip stage support concave surface 6A of the chip stage support portion 6.
When the chip stage 1 is slightly oscillated, the chip stage 1 can be smoothly moved by each bearing 8 interposed between the lower surface 1A of the chip stage 1 and the receiving surface 6A of the lower surface 1A of the chip stage. can.

Further, after bonding, the semiconductor chip 2 is removed, and at this time, the chip stage 1 is held by each solid rubber 7 interposed between the lower surface 1A of the chip stage 1 and the receiving surface 6A of the chip stage lower surface 1A. It can be automatically returned to its original position.

Note that the same automatic return function of the chip stage can be obtained by using a coil spring instead of the solid rubber 7 as the elastic body.

Furthermore, in the above embodiment, an example was given in which all of the elastic body for automatic return of the chip stage, the bearing for smoothing the movement of the chip stage, and the vacuum suction passage for fixing the semiconductor chip were provided. As shown in FIG. 6, there are those equipped with only solid rubber 7 and coil springs 10 as elastic bodies for chip stage automatic return, those equipped with only bearings 8 as shown in FIG. 6, and those equipped with only a bearing 8 as shown in FIG. The present invention can be similarly applied to a device equipped with only the fixing vacuum suction passage 9.

In addition, in FIGS. 4 to 7, the lower surface 1A of the chip stage 1 and the receiving surface 6 of the lower surface 1A of the chip stage 1 are shown.
A is configured as a spherical surface, and the semiconductor chip 2 is placed on the chip stage 1 so that the center of the surface of the semiconductor chip 2 coincides with the center of rotation of the chip stage 1. Needless to say, the solid rubber 7, coil spring 10, and bearing 8 are further provided along the circumference between the lower surface 1A of the chip stage 1 and the concave surface 6A for chip stage support of the chip stage support part 6. Needless to say, there are three arranged at equal intervals.

Furthermore, as shown in FIG. 8, the lower surface 1A of the chip stage 1 and the receiving surface 6 of the lower surface 1A of the chip stage 1
A is configured as a spherical surface, and the semiconductor chip 2 is placed on the chip stage 1 so that the center of the surface of the semiconductor chip 2 coincides with the center of rotation of the chip stage 1. The chip stage automatic return elastic bodies 7 and 10, the bearing 8 for smoothing the movement of the chip stage 1, and the vacuum suction passage 9 for fixing the semiconductor chip are all omitted in the same manner.
This is to which the present invention can be applied.

Note that the solid rubber 7 and the coil spring 10
, it is of course possible to arrange four or more bearings 8 along the circumference between the lower surface 1A of the chip stage 1 and the chip stage supporting concave surface 6A of the chip stage support section 6.

[0051]

As described in detail above, according to the semiconductor chip lead bonding apparatus (claim 1) of the present invention, the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage are each configured as a spherical surface. In addition, since the semiconductor chip is configured to be placed on the chip stage so that the center of the surface of the semiconductor chip coincides with the center of rotation of the chip stage, variations in bump formation on the semiconductor chip, dust, etc. Even if the semiconductor chip is tilted due to dirt, bonding will not be adversely affected.
Furthermore, even if the parallelism between the bonding head and the chip stage surface is not adjusted, no biased force is applied to the semiconductor chip during bonding, so there is an advantage that damage to the semiconductor chip and defective bonding are eliminated.

Further, in the semiconductor chip lead bonding apparatus (claim 2) of the present invention, at least three elastic bodies are interposed along the circumference between the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage. Because it is equipped with
When the semiconductor chip is removed after bonding, there is an advantage that the chip stage can be automatically returned to its original position.

Furthermore, in the semiconductor chip lead bonding apparatus (claim 3) of the present invention, at least three bearings are interposed along the circumference between the lower surface of the chip stage and the receiving surface of the lower surface of the chip stage. Therefore, in addition to the effects obtained by the inventions according to claims 1 and 2, there is an advantage that the movement of the chip stage can be made smooth.

Furthermore, in the semiconductor chip lead bonding apparatus (claim 4) of the present invention, since the vacuum suction passageway is provided which opens on the semiconductor chip mounting surface of the chip stage, the semiconductor chip on the chip stage is It has the advantage of being securely fixed.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view showing one embodiment of the present invention.

FIG. 2 is a schematic plan view showing one embodiment of the present invention.

FIG. 3 is a schematic plan view showing a modification of one embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view showing a modification of one embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view showing a modification of one embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view showing a modification of one embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view showing a modification of one embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view showing a modification of one embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view showing a conventional example.

FIG. 10 is a schematic cross-sectional view for explaining the problems of the conventional example.

[Explanation of symbols]

1 Chip stage 1A　Bottom surface of chip stage 1B Semiconductor chip mounting surface 2 Semiconductor chip 2A Bump 3 Bonding head 4 Film 4A Lead part 5 Film carrier 6 Chip stage support part 6A Chip stage receiving surface 7 Solid rubber (elastic body) 8 Bearing 9 Vacuum suction passage 10 Coil spring (elastic body) 101 Chip stage 101A Bottom surface of chip stage 102 Semiconductor chip 102A Bump 103 Bonding head 104 Film 104A Lead part 105 Film carrier

Claims (4)

[Claims] 1. A chip stage (1) on which a semiconductor chip (2) is placed, and a semiconductor chip lead part (4A) formed from above on the semiconductor chip (2) on the chip stage (1). A bonding head (for bonding the lead part (4A) to the semiconductor chip (2) by applying the film (4) and applying heat and pressure to the semiconductor chip (2) together with the film (4) 3)
The lower surface (1A) of the chip stage (1) and the receiving surface (6
A) are each configured as a spherical surface, and the center of the surface of the semiconductor chip (2) is located at the chip stage (1).
The semiconductor chip (
2) is placed on the chip stage (1). 2. The lower surface (1A) of the chip stage (1)
) and the receiving surface (6) of the lower surface (1A) of the chip stage (1).
2. The semiconductor chip lead part bonding apparatus according to claim 1, wherein at least three elastic bodies (7, 10) are interposed along the circumference between the semiconductor chip lead part and the lead part A). 3. The lower surface (1A) of the chip stage (1)
) and the receiving surface (6) of the lower surface (1A) of the chip stage (1).
3. The semiconductor chip lead bonding apparatus according to claim 1, wherein at least three bearings (8) are interposed along the circumference between the semiconductor chip lead bonding apparatus and the lead part A). 4. In order to fix the semiconductor chip (2) on the chip stage (1), a vacuum suction passage (
9). The semiconductor chip lead bonding apparatus according to claim 1, further comprising: 9).