JPS59117231A - Plane matching mechanism - Google Patents
Plane matching mechanismInfo
- Publication number
- JPS59117231A JPS59117231A JP22631582A JP22631582A JPS59117231A JP S59117231 A JPS59117231 A JP S59117231A JP 22631582 A JP22631582 A JP 22631582A JP 22631582 A JP22631582 A JP 22631582A JP S59117231 A JPS59117231 A JP S59117231A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- vacuum
- spherical
- spherical surface
- adsorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は平面合せ機構、特に、半導体製品の組立過程で
用いられる半導体ペレット用吸着コレット等の平面度合
せに好適な平面合せ機構に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plane alignment mechanism, and particularly to a plane alignment mechanism suitable for adjusting the flatness of a suction collet for semiconductor pellets used in the assembly process of semiconductor products.
一般に、たとえば半導体製品の組立過程で半導体ペレッ
トをリードフレームまたはパンケージの如きペレットを
何面に取シ付ける場合、真空吸着式の吸着コレットを使
用している。Generally, a vacuum suction type adsorption collet is used to attach semiconductor pellets to any surface such as a lead frame or a pan cage in the process of assembling semiconductor products.
たとえば、第１図はこのような場合に使用されるペレッ
ト付は装置の一例を示しているが、この装置において、
吸着コレット２はコレット保持！・ｔａ、ｌｂの先端の
下部に設値されている。トメ装量では、ペレット治具３
内に収容されたペレット４をコレット保持部１ｂの吸着
コレット２で真空吸着してペレット治具３から中間位置
決め部５に移載した後、そのベレット４全コレット保持
部１ａの吸着コレット２で真空吸着して中間位置決め部
５からリードフレーム６の所定位置に対してスクラブ動
作により溶着している。なお、符号７は吸着用の真空吸
引路、８は加圧空気供給路である。For example, Fig. 1 shows an example of a pellet-equipped device used in such cases;
Adsorption collet 2 holds the collet!・The value is set at the bottom of the tip of ta and lb. For tome loading, pellet jig 3
After the pellets 4 housed inside are vacuum-adsorbed by the suction collet 2 of the collet holding part 1b and transferred from the pellet jig 3 to the intermediate positioning part 5, all of the pellets 4 are vacuum-adsorbed by the suction collet 2 of the collet holding part 1a. It is adsorbed and welded from the intermediate positioning part 5 to a predetermined position of the lead frame 6 by a scrubbing operation. Note that 7 is a vacuum suction path for adsorption, and 8 is a pressurized air supply path.
ところで、このような装置において、ペレット４の種類
が変更されると、吸着コレット２もそれに合ぜて交換す
る必要が生じる。その場合、ペレット治具３、中間位置
決め部５およびリードフレーム６に対する吸着コレット
２の平行水平位置出し、ケ、コレット保持部１ａ、ｌｂ
への吸′着コレノト２の嵌め合いによって行なっている
。By the way, in such an apparatus, when the type of pellet 4 is changed, the suction collet 2 also needs to be replaced accordingly. In that case, parallel and horizontal positioning of the suction collet 2 with respect to the pellet jig 3, intermediate positioning part 5 and lead frame 6, collet holding parts 1a, lb.
This is done by fitting the adsorption part 2 onto the part.
しかし、この嵌合い部における吸着コレット２の偏心度
や加工精度等にエリ、吸着コレット２の平行水平位置出
しまたは平面合せは相当困難で、長い時間を袈し、平面
合せが不十分な場合にはペレット４がリードフレーム６
に対して片当り状態すなわち偏荷重状態のままスクラブ
されるので、溶着強度にばらつきが生じ、またペレット
４の表面に押し傷を作υ易い等、ペレット４の割れ、欠
けの原因になってしまうという問題も生じる。However, due to the eccentricity and machining accuracy of the suction collet 2 at this fitting part, it is quite difficult to align the suction collet 2 in parallel and horizontal positions or to align the planes, and it takes a long time to align the planes. pellet 4 is lead frame 6
Since the welding material is scrubbed in a state of uneven contact, that is, with an unbalanced load, the strength of the weld may vary, and the surface of the pellet 4 is likely to be scratched, resulting in cracking or chipping of the pellet 4. The problem also arises.
本発明の目的は、前記従来技術の問題点を解決し、平面
度合せを簡単かつ容易に、しかも正確に行なうことので
きる平面合せ機ｒｔ−提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art and to provide a flatness matching machine RT- which can simply and easily perform flatness matching, and moreover, accurately.
以下、本発明７図面に示す実施例にしたがって詐細に説
明する。Hereinafter, the present invention will be explained in detail according to an embodiment shown in the drawings.
第３図は本発明に：る平面合せ機構の一実施例の要部全
示す部分断面図である。FIG. 3 is a partial sectional view showing all the essential parts of an embodiment of the plane alignment mechanism according to the present invention.
本実施例において、吸着コレット２は真空吸引路９と加
圧空気供給路ＩＯに接続され、その基端（上端）は、上
部が半球状の球面形状？持つ球面座部材１１の下端部内
に嵌合して結合されている。In this embodiment, the suction collet 2 is connected to the vacuum suction path 9 and the pressurized air supply path IO, and its base end (upper end) has a spherical shape with a hemispherical upper part. It is fitted and coupled within the lower end of the spherical seat member 11.
一方、前記球面座部材１１はその上部の球面部を球面床
受１２の球面状凹部の中に相対摺動自在に嵌合され、該
球面床受１２の下端部周囲に螺合される保持部材１３に
より該球面床受１２に対して保持されている。また、球
面床受１２の側面部から球面状凹部の中心にかけて真空
吸着孔１４が穿設され、真空吸着孔１４は真空吸引路１
５と加圧空気供給路１６に連通している。したがって、
球面床受１２は真空吸引路１５から真空吸着孔１４を弁
して球面状凹部内に真空吸引力を加えることにより、球
面座部材１１は球面床受１２に対して真空吸着固定する
ことが可能である。球面床受１２けたとえは第１図に示
したペレット付は装置におけるコレット保持部］、 ａ
、 ｌ ｂに対して真空吸着力等で固定することがで
きる。On the other hand, the spherical seat member 11 has its upper spherical portion fitted into the spherical recess of the spherical floor support 12 so as to be relatively slidable, and a holding member that is screwed around the lower end of the spherical floor support 12. 13 to the spherical floor support 12. Further, a vacuum suction hole 14 is bored from the side surface of the spherical floor support 12 to the center of the spherical recess.
5 and a pressurized air supply path 16. therefore,
The spherical seat member 11 can be fixed to the spherical floor support 12 by vacuum suction by applying a vacuum suction force into the spherical recess by applying a vacuum suction hole 14 from the vacuum suction path 15 to the spherical floor support 12. It is. The spherical floor support 12 is the collet holding part in the device with the pellet shown in Figure 1], a
, lb can be fixed by vacuum suction force or the like.
次に、本実施例の作用について説明する。Next, the operation of this embodiment will be explained.
九とえはペレット４０品種交換により吸着コレット２を
交換する場合、交換した吸着ペレット２でダミーペレッ
ト、たとえば第１図および第２図のペレノ）４ｆＬ’に
真空吸着し、ペレット付は装置のリードフレーム６の上
のペレット取付位置、中間位置決め部５およびペレット
治具３に対して吸着ペレッ）１位置合せする。その位置
合せの時、真空吸引路１５の真空を逗断し、球面座部材
１１を球面床受１２に対して自由状態とし、球面座部材
ｔｔＶ球面座受１２に対して相対移動させて球面座部材
１１の平行平面度出しを行なった後、再び真空吸引路１
５からの真空吸引力で球面座部材１１を球面床受１２に
真空吸着固定を行なうことにより、吸着コレット２の平
行平面度出しは、簡単かつ容易に短時間で正確に行なう
ことができる。When replacing the adsorption collet 2 due to exchanging 40 types of pellets, the replaced adsorption pellet 2 vacuum-adsorbs the dummy pellet (for example, Pereno) 4fL' in Figures 1 and 2, and the pellet attached is connected to the device lead. Align the suction pellet (1) with respect to the pellet mounting position on the frame 6, the intermediate positioning portion 5, and the pellet jig 3. At the time of alignment, the vacuum of the vacuum suction path 15 is cut off, the spherical seat member 11 is set in a free state with respect to the spherical seat support 12, and the spherical seat member ttV is moved relative to the spherical seat support 12 to close the spherical seat member 11. After adjusting the parallel flatness of the member 11, the vacuum suction path 1 is opened again.
By vacuum suctioning and fixing the spherical seat member 11 to the spherical floor support 12 using the vacuum suction force from the vacuum suction force 5, the parallel flatness of the suction collet 2 can be easily and accurately achieved in a short time.
したがって、ペレットの片当シによる溶着強度のばらつ
きやペレットの割れ、欠は等全防止できる。Therefore, variation in welding strength due to uneven contact of the pellets, cracking and chipping of the pellets, etc. can be completely prevented.
なお、本発明は吸着コレットの平面度合せ以外の目的の
ためにも同様に有利に適用できる。Note that the present invention can be similarly advantageously applied to purposes other than adjusting the flatness of a suction collet.
第４図は本発明を第１図における中間位置決め部５の平
面度合せに用いた実施例である。FIG. 4 shows an embodiment in which the present invention is used to adjust the flatness of the intermediate positioning portion 5 in FIG. 1.
この実施例では、中間位置決め部５の下側に球面座部材
１１ａが設けられ、この球面座部材１１ａの下端は半球
状の球面状部を有し、この球面状部はその下側の球面床
受１２ａの球面状凹部の中に相対摺動自在に嵌め合わさ
れている。マタ、球面床受１２ａの側面から球面状凹部
にかけて真空吸着孔１７が穿設されており、この真空吸
着孔１，７は真空吸引路１８と加圧空気供給路１９に連
辿し、真空吸引路１８からの真空吸引力によ、り球面座
部材／
１１ａを球面座受１２ａＫ刻して真空吸着固定すること
ができる。In this embodiment, a spherical seat member 11a is provided below the intermediate positioning part 5, and the lower end of the spherical seat member 11a has a hemispherical spherical part, and this spherical part is connected to the spherical floor below the spherical seat member 11a. It is fitted into the spherical recess of the receiver 12a so as to be relatively slidable. A vacuum suction hole 17 is bored from the side surface of the spherical floor support 12a to the spherical recess, and the vacuum suction holes 1 and 7 are connected to the vacuum suction path 18 and the pressurized air supply path 19, and are vacuum suctioned. By the vacuum suction force from the passage 18, the spherical seat member/11a can be carved into the spherical seat support 12aK and fixed by vacuum suction.
第４図の実施例においても、中間位置決め部５の平面度
出しを行なう場合、真空吸引路１Ｂによる真空吸引を逗
断した状態で球面厚部材１１ａｉ球面座受１２ａに対し
て調整移動させて平面度出しを行なった後、真空吸引路
１Ｂからの真空吸引力により球面座部材Ｌｌａを球面床
受１２ａに真空吸着固定すれば工く、簡単かつ容易に正
確な平面合せを行なうことができる。In the embodiment shown in FIG. 4 as well, when adjusting the flatness of the intermediate positioning part 5, the spherical thick member 11ai is adjusted and moved relative to the spherical bearing 12a with the vacuum suction through the vacuum suction path 1B cut off. After alignment, the spherical seat member Lla is fixed to the spherical floor support 12a by vacuum suction using the vacuum suction force from the vacuum suction path 1B, thereby making it possible to easily and easily perform accurate plane alignment.
なお、本発明は前記実施例に限定されるものではなく、
他の様々な変形が可能であシ、たとえは真空吸着固定以
外の方式で固定を行なったり、本発、明を前記以外の対
象物に適用してもよい。Note that the present invention is not limited to the above embodiments,
Various other modifications are possible, for example, fixing may be performed by a method other than vacuum suction fixing, or the present invention may be applied to objects other than those described above.
以上説明したように、本発明によれば、平面合せ’ｒ：
ｆｔｌかつ容易に、しかも正確に行なうことができる。As explained above, according to the present invention, plane alignment 'r:
ftl, easy and accurate.
第１図および第２図は本発明全適用できるペレット付は
装置の部分平面図と部分断面図、第３図は本発明を吸着
コレットに適用した一実施例の要部の部分断面図、
第４図は本発明を中間位置決め部に適用した実施例ｒ示
す要部の部分断面図である。
ｌａ、ｌｂ・・・コレット保持部、２・・・吸着コレッ
ト、３・・・ペレット治具、４・・・ペレット、５・・
・中間位置決め部、６・・・リードフレーム、１ｌｌｌ
ａ・・・球面座部材、１２．１２ａ・・・球面床受、１
４・・・真空吸着孔、１５・・・真空吸引路、１７・・
・真空吸着孔、１８・・・真空吸引路。
代理人 弁理士 薄 １）利 −ａ＊熱。1 and 2 are a partial plan view and a partial cross-sectional view of a device with pellets to which the present invention can be applied; FIG. 3 is a partial cross-sectional view of essential parts of an embodiment in which the present invention is applied to a suction collet; FIG. 4 is a partial sectional view of a main part showing an embodiment r in which the present invention is applied to an intermediate positioning section. la, lb...collet holding part, 2...adsorption collet, 3...pellet jig, 4...pellet, 5...
・Intermediate positioning part, 6...Lead frame, 1llll
a... Spherical seat member, 12.12a... Spherical floor support, 1
4... Vacuum suction hole, 15... Vacuum suction path, 17...
・Vacuum suction hole, 18...Vacuum suction path. Agent Patent Attorney Bo 1) Li -a*heat.
Claims (1)
機構において、先端が球面形状を有する球面座部材と、
この球面座部材の球面部を受は入れる球面状凹部を持つ
球面座受と、前記球面座部材を前記球面座受に固定する
固定手段とからなることを特徴とする平面合せ機構。 ２ 固定手段が、前記球面座堂内に形成されかつ罰記球
面状凹部内に開口する真空吸着孔を有することを特徴と
する特許請求の範囲第１項記載の平面合せ機構。[Claims] 1. In a plane alignment mechanism for a suction collet for semiconductor pellets, etc., a spherical seat member having a spherical tip;
A plane alignment mechanism comprising: a spherical bearing having a spherical recess for receiving the spherical portion of the spherical seating member; and a fixing means for fixing the spherical seating member to the spherical bearing. 2. The plane alignment mechanism according to claim 1, wherein the fixing means has a vacuum suction hole formed within the spherical seat and opening into the spherical recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22631582A JPS59117231A (en) | 1982-12-24 | 1982-12-24 | Plane matching mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22631582A JPS59117231A (en) | 1982-12-24 | 1982-12-24 | Plane matching mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59117231A true JPS59117231A (en) | 1984-07-06 |
Family
ID=16843270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22631582A Pending JPS59117231A (en) | 1982-12-24 | 1982-12-24 | Plane matching mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117231A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100501514B1 (en) * | 2002-09-02 | 2005-07-18 | 현대자동차주식회사 | Mounting structure of rear seat cushion for vehicle |
| WO2007079769A1 (en) * | 2005-12-23 | 2007-07-19 | Alphasem Gmbh | Tool for picking up, placing or pressing a flat object, and use of the tool |
| WO2008052594A1 (en) | 2006-10-31 | 2008-05-08 | Alphasem Gmbh | Device for positioning and/or pressing a planar component relative to a substrate and method for positioning a picking tool relative to a substrate |
-
1982
- 1982-12-24 JP JP22631582A patent/JPS59117231A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100501514B1 (en) * | 2002-09-02 | 2005-07-18 | 현대자동차주식회사 | Mounting structure of rear seat cushion for vehicle |
| WO2007079769A1 (en) * | 2005-12-23 | 2007-07-19 | Alphasem Gmbh | Tool for picking up, placing or pressing a flat object, and use of the tool |
| WO2008052594A1 (en) | 2006-10-31 | 2008-05-08 | Alphasem Gmbh | Device for positioning and/or pressing a planar component relative to a substrate and method for positioning a picking tool relative to a substrate |
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