JP2000101294A - Part mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a part mounting machine which allows adjustment of the tilt of a spindle. SOLUTION: An attaching head part 210 for sucking a part, a first adjusting part 220 which adjusts the tilt of the attaching head part in two orthogonal directions (P direction and R direction), a rotation part 230 which rotates the attaching head part, and a second adjusting part 240 which adjusts the tilt of the spindle of the rotation part in two orthogonal directions (P direction and R direction), are provided. So, the tilt in orthogonal two directions related to the attaching head as well as the spindle of it is adjusted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting electronic components on a substrate.

[0002]

2. Description of the Related Art Generally, a component mounting apparatus is provided with a mounting head for sucking electronic components and mounting them on a substrate. In this component mounting process, if the mounting head is tilted with respect to the board, the bumps of the electronic component will hit the board at the time of mounting the electronic components, and the bumps will be deformed incorrectly and the mounting reliability will not be secured. Become. Therefore, it is necessary to maintain high parallelism (1 μm or less) between the suction surface of the mounting head and the mounting surface of the substrate. Therefore, the component mounting apparatus is provided with a mechanism for adjusting the inclination of the mounting head.

FIG. 5A is a sectional side view showing an example of a mounting mechanism of a conventional component mounting apparatus. The mounting mechanism 100 includes a mounting head 1 for vacuum-sucking the electronic component 10.
10, a mounting head tilt adjusting unit 120 that holds the mounting head unit 110 to adjust the tilt and a mounting head rotating unit 130 that rotates the mounting head unit 110. The mounting head unit 110 includes a mounting head 111 that vacuum-adsorbs the electronic component 10 on a lower surface, and a mounting head shaft 112 that supports the mounting head 111.

The mounting head shaft 112 has one end fixed to the upper surface of the mounting head 111. A portion 112a of the mounting head shaft 112 near the mounting head 111 is
It is formed in a spherical shape. A suction hole 113 for vacuum-sucking the electronic component 10 is provided to penetrate from the lower surface of the mounting head 111 to the other end of the mounting head shaft 112. According to such a configuration, the suction hole 1
By connecting a vacuum pump or the like to 13 and performing vacuum suction, the electronic component 10 can be vacuum-sucked to the lower surface of the mounting head 111 and transported to the substrate 20.

[0005] The mounting head tilt adjusting section 120 includes a mounting head holder 121 having a hollow cylindrical shape into which the mounting head shaft 112 is inserted, a mounting head holding spring 122 for holding the mounting head section 110, and two stoppers 1.
23, 124, a mounting head tilt adjusting micro 125 for adjusting the tilt of the mounting head unit 110, and a mounting head tilt adjusting spring 126. Stopper 1
23, mounting head holding spring 122 and stopper 1
24 are inserted in this order from the other end of the mounting head shaft 112, and are disposed between the spherical portion 112a and the vicinity of the other end. These are inserted into the mounting head holder 121, and the stopper 123 is fixed to one end of the mounting head holder 121. Mounting head tilt adjustment micro 1
The mounting head 25 and the mounting head inclination adjusting spring 126 are fixed to the side surface of the mounting head holder 121 so that the other side surface of the mounting head shaft 112 can be pressed from both sides.

According to such a configuration, the mounting head tilt adjusting spring 125 is rotated and the tip is pushed out and retracted to thereby adjust the mounting head tilt adjusting spring 126.
The mounting head holding spring 122 attempts to hold the mounting head shaft 112 substantially vertically. For this reason, the mounting head shaft 112 swings precisely in one direction (P direction in the drawing) around the spherical portion 112a, and the inclination of the mounting head portion 110 can be adjusted in one direction (P direction in the drawing). it can.

The mounting head rotating unit 130 includes a mounting head rotating shaft 131 for rotating the mounting head unit 110 and a hollow cylindrical rotating shaft holder 133 into which the mounting head rotating shaft 131 is inserted via a bearing 132. I have. The mounting head rotation shaft 131 has one end fixed to the other end of the mounting head holder 121 and the other end fixed to a head rotation actuator (not shown). The rotating shaft holder 133 is fixed to an apparatus main body (not shown). According to such a configuration, the mounting head unit 110 can be rotated together with the mounting head tilt adjustment unit 120 by the rotation of the mounting head rotation shaft 131.

[0008]

In the mounting mechanism 100 of the component mounting apparatus described above, the inclination of only the mounting head 110 is adjusted. Therefore, it is effective to mount the electronic component 10 on the substrate 20 in a fixed direction.
Is mounted on the substrate 20 in an arbitrary rotation direction. For example, as shown in FIG. 5A, when the rotation axis a of the mounting head rotating unit 130 has an inclination of an angle γ, the mounting head tilt adjustment micro 125 is adjusted to make the axis b of the mounting head unit 110 vertical. Then, the suction surface of the mounting head 111 and the mounting surface of the substrate 20 are made parallel. This prevents the bumps 11 of the electronic component 10 from hitting the substrate 20, and allows the electronic component 10 to be securely mounted on the substrate 20.

However, with the tilt adjusted,
When the electronic component 10 is rotated by 180 ° for mounting, as shown in FIG. 5B, the axis b of the mounting head unit 110 has a tilt of an angle 2γ, and the mounting head 111
Is not parallel to the mounting surface of the substrate 20.
Therefore, the bump 11 of the electronic component 10 hits the substrate 20, and the bump 11 is deformed improperly, and the mounting reliability cannot be secured. Conventionally, in such a case, the mounting head rotating unit 130 is not rotated, and a storage tray aligned in a direction in which the electronic component 10 is mounted in advance is used.
There has been a problem that it takes too many parts mounting steps. In addition, the pad pitch of electronic components is becoming increasingly narrower. When the pad pitch becomes, for example, 100 μm or less, there is a problem that if the inclination of the rotation axis a of the mounting head rotating unit 130 cannot be adjusted, it cannot be dealt with. there were.

[0010] The present invention has been made in view of the above circumstances, and has as its object to provide a component mounting apparatus capable of adjusting the inclination of the rotating shaft of the rotating portion of the mounting head.

[0011]

According to the present invention, there is provided a mounting head for sucking a component, and the inclination of the mounting head in two orthogonal directions (P direction and R direction). A first adjusting unit; and a rotating unit that rotates the mounting head unit. The tilt of the mounting head unit is adjusted by the first adjusting unit as needed, and the component is sucked to the mounting head unit. A component mounting apparatus that rotates the mounting head unit by the rotating unit as needed and mounts the mounting head unit on a substrate, wherein inclinations in two directions (P direction and R direction) orthogonal to a rotation axis of the rotating unit are determined. This is achieved by providing a second adjusting unit for adjusting.

According to the above configuration, not only the mounting head but also the rotation axis of the mounting head can adjust the inclination in two orthogonal directions. Accordingly, the degree of perpendicularity of the rotating shaft to which the mounting head is mounted with respect to the substrate can be made highly accurate, and, for example, it is possible to cope with mounting where the electrode pitch of the IC chip is reduced and the mounting angle is not limited. Further, the bumps formed on the electrode pad portions can be uniformly mounted on the electrode patterns on the substrate, and the mounting reliability can be improved.

[0013]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 is a sectional plan view showing an embodiment of a mounting mechanism of a component mounting apparatus according to the present invention, and FIG. 2 is a cross-sectional side view thereof. The mounting mechanism 200 includes a mounting head 210 that vacuum-adsorbs the electronic component 10, a mounting head tilt adjuster 220 that holds the mounting head 210 and adjusts the tilt,
The mounting head rotating unit 23 that rotates the mounting head unit 210
The rotation axis tilt adjusting section 240 for adjusting the tilt while holding the rotating head 230 and the mounting head rotating section 230 is roughly constituted.

The mounting head 210 has an electronic component 1 on the lower surface.
A mounting head 211 for vacuum-sucking 0 and a mounting head shaft 212 for supporting the mounting head 211 are provided. One end of the mounting head shaft 212 is
11 is fixed to the upper surface. Mounting head shaft 21
The portion 212a near the second mounting head 211 is formed in a spherical shape. A suction hole 213 for vacuum-sucking the electronic component 10 is provided to penetrate from the lower surface of the mounting head 211 to the other end of the mounting head shaft 212. According to such a configuration, by connecting a vacuum pump or the like to the suction hole 213 and performing vacuum suction, the electronic component 10 is vacuum-sucked on the lower surface of the mounting head 211 to make the XY
It can be transferred to the substrate 20 on the table 30.

The mounting head inclination adjusting section 220 includes a mounting head holder 221 having a hollow cylindrical shape into which the mounting head shaft 212 is inserted, a mounting head holding spring 222 for holding the mounting head section 210, and two stoppers 2.
23, and two sets of mounting head tilt adjusting micros 225 and mounting head tilt adjusting springs 226 for adjusting the tilt of the mounting head unit 210. The stopper 223, the mounting head holding spring 222, and the stopper 224 are inserted in this order from the other end of the mounting head shaft 212, and are disposed between the spherical portion 212a and the vicinity of the other end. And these are the mounting head holder 22
1 and the stopper 223 is attached to the mounting head holder 2.
21 is fixed to one end. Two sets of mounting head tilt adjusting micro 225 and mounting head tilt adjusting spring 2
26 is a mounting head holder 2 so that the other end side surface of the mounting head shaft 212 can be pressed in a cross shape from both sides.
21 is fixed to the side surface.

According to such a configuration, each mounting head tilt adjusting spring 225 is rotated by rotating each mounting head tilt adjusting micro 225 to push out and pull out the tip.
26 follows and expands and contracts, and the mounting head holding spring 222 tries to hold the mounting head shaft 212 substantially vertically. For this reason, the mounting head shaft 212 swings accurately in two directions (P direction and R direction in the drawing) orthogonal to the spherical portion 212a, and the inclination of the mounting head portion 210 is changed in two directions (P in the drawing). Direction and R
Direction). Note that the tilts in the P direction and the R direction refer to tilts in the X direction and the Y direction of the Z axis orthogonal to the XY axes of the XY table 30.

The mounting head rotating section 230 includes a mounting head rotating shaft 231 for rotating the mounting head section 210, a hollow cylindrical rotary shaft holder 233 into which the mounting head rotating shaft 231 is inserted via a bearing 232, A head rotation actuator 234 for rotating the head rotation shaft 231 is provided. One end of the mounting head rotation shaft 231 is fixed to the other end of the mounting head holder 221, and the other end is fixed to the head rotation actuator 234. The rotating shaft holder 233 is fixed to the rotating shaft inclination adjusting unit 240.
According to such a configuration, the mounting head unit 210 can be rotated together with the mounting head tilt adjustment unit 220 by the rotation of the mounting head rotation shaft 231.

The rotation axis inclination adjustment section 240 adjusts the inclination of the rotation axis of the mounting head rotation section 230 in two orthogonal directions (P direction and R direction in the drawing), and a P direction inclination adjustment section 250 and an R direction inclination adjustment section 260. It has. The P-direction tilt adjusting unit 250 includes a head mounting base 251 on which the mounting head rotating unit 230 is mounted and fixed, and a head mounting base 2.
A guide rail 252 for guiding the movement of the head 51 in the height direction (Z direction), a head drive actuator 253 for moving the head mounting base 251 in the height direction (Z direction),
A P-direction tilt adjustment base 254, a P-direction tilt adjustment micro 255, and a P-direction tilt adjustment spring 256 for adjusting the tilt of the rotation axis of the mounting head rotating unit 230 in the P direction.
It has.

The R-direction tilt adjustment section 260 has a P-direction tilt adjustment section 250 mounted and fixed thereon, and has an R-direction tilt adjustment base 261 for adjusting the tilt of the rotation axis of the mounting head rotation section 230 in the R direction. Head unit base 262,
A head unit base joint 263 and an adjustment bolt 264 with an R-direction tilt adjustment block, and a head unit base 262 are fixed, and a main body base 265 for fixing to the apparatus main body is provided.

A drive shaft 253a of a rotary shaft holder 233, a rotary actuator 234, and a head drive actuator 253 is fixed to the head mounting base 251.
Then, the head mounting base 251 is
2 is slidably fitted. A guide rail 252 and a head drive actuator 253 are fixed to the P-direction tilt adjustment base 254. One end of the P-direction tilt adjustment base 254 is rotatably supported at one end of the R-direction tilt adjustment base 261 via a P-direction tilt adjustment pin 257, and the other end is a lock bolt 258 at the other end of the R-direction tilt adjustment base 261. It is supported so that it can be fixed and opened via. The P-direction tilt adjustment micro 255 and the P-direction tilt adjustment spring 256 are fixed to the R-direction tilt adjustment base 261 so that the side surface of the convex portion 254 a extending from the other end of the P-direction tilt adjustment base 254 can be pressed from both sides. I have.

The R-direction tilt adjustment base 261 and the head unit base 262 are overlapped at a predetermined interval, one end of which is sandwiched by a head unit base joint 263 having a U-shaped cross section and fixed by a joint bolt 266. Each other end is fixed via a lock bolt 267
It is supported so that it can be opened. Further, the other end of the head unit base 262 is screwed with a screw portion 264 a of an adjustment bolt 264 with an R-direction inclination adjustment block, and the other end of the R-direction inclination adjustment base 261 and the head unit base 26.
A wedge-shaped block portion 264b of an adjustment bolt 264 with an R-direction tilt adjustment block is inserted between the other ends of the two. Adjustment bolt 2 with R direction inclination adjustment block
A fixing screw 268 for preventing rotation and axial movement is screwed into the 64 screw portion 264a.

In such a configuration, first, the case of adjusting the inclination of the rotation axis of the mounting head rotation unit 230 in the P direction will be described. First, the lock bolt 258 is loosened so that the P-direction tilt adjustment base 254 can be rotated in the P direction about the axis of the P-direction tilt adjustment pin 257. In this state, rotate the P-direction tilt adjustment micro 255,
The tip of the P-direction tilt adjustment micro 255 is pressed against one side surface of the projection 254a of the P-direction tilt adjustment base 254. Then, the P-direction tilt adjusting spring 256 is moved to the convex portion 254a.
The other side is pressed and compressed. As a result, the P-direction tilt adjustment base 254 rotates, for example, by an angle α1 in the P direction about the P-direction tilt adjustment pin 257.

On the other hand, the P-direction tilt adjustment micro 255 is rotated in the reverse direction, and the tip of the P-direction tilt adjustment micro 255 is pulled down from one side surface of the projection 254a of the P-direction tilt adjustment base 254. Then, the P-direction inclination adjusting spring 256 extends and presses the other side surface of the convex portion 254a.
Thus, the P-direction tilt adjustment base 254 rotates about the P-direction tilt adjustment pin 257 in the P direction opposite to the above by, for example, an angle α2. By the above operation, the P-direction tilt adjustment base 254 can be tilted at a desired angle in the P direction, so that the tilt of the rotation axis of the mounting head rotating unit 230 in the P direction can be adjusted to 0 °. Then, when the inclination of the rotation axis of the mounting head rotation unit 230 in the P direction becomes 0 °, the lock bolt 258 is tightened, and the adjustment of the inclination of the rotation axis of the mounting head rotation unit 230 in the P direction is completed.

Next, a case where the inclination of the rotation axis of the mounting head rotation unit 230 in the R direction is adjusted will be described. First,
Loosen the lock bolt 267 and set the R-direction tilt adjustment base 2
61 is made rotatable in the R direction about the approximate center of the head unit base joint 263. In this state, the fixing screw 268 is loosened, and the screw portion of the adjustment bolt 264 with the R-direction tilt adjustment block is rotated to set the block portion to R.
It is inserted between the other end of the direction inclination adjustment base 261 and the other end of the head unit base 262. As a result, the gap between the R-direction tilt adjustment base 261 and the head unit base 262 gradually widens, so that the R-direction tilt adjustment base 261 rotates, for example, by an angle β1 in the R direction about the approximate center of the head unit base joint 263.

On the other hand, the screw portion of the adjustment bolt 264 with the R-direction tilt adjustment block is rotated in the reverse direction, and the block portion is pulled out from between the other end of the R-direction tilt adjustment base 261 and the other end of the head unit base 262. . This allows
With the restoring force of the head unit base joint 263, R
Direction tilt adjustment base 261 and head unit base 26
2 gradually narrows, so the R-direction tilt adjustment base 2
Numeral 61 rotates about the center of the head unit base joint 263 in the R direction opposite to the above, for example, by an angle β2. With the above operation, the R-direction tilt adjustment base 261 can be tilted at a desired angle in the R direction, so that the tilt of the rotation axis of the mounting head rotating unit 230 in the R direction can be adjusted to 0 °. When the inclination of the rotation axis of the mounting head rotating unit 230 in the R direction becomes 0 °, the fixing screw 2
68 and the lock bolt 267 are tightened, and the inclination adjustment of the rotation axis of the mounting head rotation unit 230 in the R direction is completed.

FIG. 3 is a schematic plan view showing another embodiment of the mounting mechanism of the component mounting apparatus of the present invention. This mounting mechanism 300 is different from the mounting mechanism 200 shown in FIGS.
Other configurations are the same. Accordingly, only a part of the P-direction tilt adjustment unit 350 is shown, and the P-direction tilt adjustment unit 25 is shown.
The same numbers are assigned to the same components of 0.

The P-direction tilt adjusting section 350 includes a P-direction tilt adjusting base 254 and a P-direction tilt adjusting bolt 351 for adjusting the tilt of the rotation axis of the mounting head rotating section 230 in the P direction. P direction tilt adjustment bolt 351
Has a configuration in which screw portions 351b are provided on both sides of the head portion 351a, and both side surfaces of the head portion 351a are P
The screw 351 is inserted between the U-shaped protrusions 352 attached to the other end of the directional inclination adjustment base 254.
b is rotatably fixed to the R-direction tilt adjustment base 261.

According to such a configuration, by rotating the head portion 351a of the P-direction tilt adjustment bolt 351, the screw portion 351b moves in the axial direction, so that the head portion 351a presses the projection 352. Accordingly, the P-direction tilt adjustment base 254 rotates in the P direction about the P-direction tilt adjustment pin 257, so that the tilt of the rotation axis of the mounting head rotating unit 230 in the P direction can be adjusted to 0 °.

FIG. 4 is a schematic plan view showing still another embodiment of the mounting mechanism of the component mounting apparatus of the present invention. This mounting mechanism 400 also differs from the mounting mechanism 200 of FIGS. 1 and 2 in part of the configuration of the P-direction tilt adjustment section 450, and has the same other configuration. Therefore, only a part of the P-direction tilt adjustment unit 450 is shown, and the same components of the P-direction tilt adjustment unit 250 are given the same numbers.

The P-direction tilt adjustment section 450 includes a P-direction tilt adjustment base 254, a P-direction tilt adjustment spring 256, and a P-direction tilt adjustment eccentric cam for adjusting the tilt of the rotation axis of the mounting head rotating section 230 in the P direction. 451 are provided. The P-direction tilt adjustment spring 256 and the P-direction tilt adjustment eccentric cam 451 are fixed to the R-direction tilt adjustment base 261 so that the side surface of the convex portion 254a extending from the other end of the P-direction tilt adjustment base 254 can be pressed from both sides. ing.

According to such a configuration, the eccentric cam 451 for adjusting the inclination in the P direction is rotated so that the peripheral surface of the eccentric cam 451 for adjusting the inclination in the P direction is fixed to the convex portion 25 of the inclination adjusting base 254 in the P direction.
4a. Then, the P-direction tilt adjustment spring 256 is pressed against the other side surface of the convex portion 254a and is compressed, or the P-direction tilt adjustment spring 256 is extended and presses the other side surface of the convex portion 254a. This allows
The P-direction tilt adjustment base 254 is a P-direction tilt adjustment pin 25.
7 rotates in the P direction, so that the mounting head rotating unit 2
The inclination of the rotation axis of the rotation axis 30 in the P direction can be adjusted to 0 °.

By using the component mounting apparatus having the above-described configuration, the electronic component can be mounted on the board with high accuracy in any direction. Further, even when the pad pitch of the electronic component is as fine as 100 μm or less, the mounting reliability can be improved. Further, by adjusting the mounting head to the size of the electronic component, interference with adjacent components can be avoided, and high-density mounting can be achieved. In addition, since skill is not required for adjusting the inclination at the time of assembling the mounting head, productivity can be improved. further,
Eliminates the need for skills for regular maintenance and service tasks.

[0034]

As described above, according to the present invention,
The inclination of the rotation shaft to which the mounting head is attached with respect to the substrate can be adjusted.

[Brief description of the drawings]

FIG. 1 is a sectional plan view showing an embodiment of a mounting mechanism of a component mounting apparatus according to the present invention.

FIG. 2 is a sectional side view showing a mounting mechanism of the component mounting apparatus of FIG. 1;

FIG. 3 is a schematic plan view showing another embodiment of the mounting mechanism of the component mounting apparatus of the present invention.

FIG. 4 is a schematic plan view showing still another embodiment of the mounting mechanism of the component mounting apparatus of the present invention.

FIG. 5 is a cross-sectional side view illustrating an example of a mounting mechanism of a conventional component mounting apparatus.

[Explanation of symbols]

Reference numeral 10: electronic component, 20: substrate, 200, 30
0, 400: mounting mechanism section, 210: mounting head section, 211: mounting head, 212: mounting head shaft, 213: suction hole, 220: mounting head tilt adjustment section, 221, mounting head holder, 222
... Mounting head holding springs, 223, 224 ...
Stopper, 225: Mounting head tilt adjustment micro, 226: Mounting head tilt adjustment spring, 23
0: mounting head rotating part, 231, mounting head rotating shaft, 232, bearing, 233, rotating shaft holder,
234 ... Head rotation actuator, 240 ...
Rotation axis inclination adjustment unit, 250... P direction inclination adjustment unit, 2
51: Head mounting base, 252: Guide rail, 253: Head drive actuator, 254
..P-direction tilt adjustment base, 255 ... P-direction tilt adjustment micro, 256 ... P-direction tilt adjustment spring,
257: P-direction tilt adjustment pin, 258: Lock bolt, 260: R-direction tilt adjustment unit, 261:
R direction inclination adjustment base, 262: Head unit base, 263: Head unit base joint,
264 ··· Adjustment bolt with R direction tilt adjustment block
265: Body base, 266: Joint bolt, 267: Lock bolt, 268: Fixing screw, 351: P-direction tilt adjustment bolt, 352 ...
Projection, 451: P-direction tilt adjustment eccentric cam

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Manabu Yamauchi, 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Kazumasa Dasiwa 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo No. Sony Corporation F term (reference) 3C030 AA08 AA23 5E313 AA02 AA11 CC03 CC07 CD06 FF05 FF24 FF29 FF40

Claims (3)

[Claims] 1. A mounting head for adsorbing a component, a first adjusting unit for adjusting the inclination of the mounting head in two orthogonal directions (P direction and R direction), and a rotation for rotating the mounting head. The first adjustment unit adjusts the inclination of the mounting head unit as necessary, causes the component to be sucked to the mounting head unit, and causes the mounting head unit to rotate by the rotating unit as necessary. A component mounting apparatus that is rotated and mounted on a substrate, comprising: a second adjustment unit that adjusts inclinations in two directions (P direction and R direction) orthogonal to a rotation axis of the rotation unit. Component mounting device. A second base mounted with the rotating part and swingable in a P direction; and a second base mounted with the first base and swingable in an R direction. The component mounting apparatus according to claim 1, further comprising two bases. 3. The second adjusting section is fixed to one end of the first base and one end of the second base so as to be rotatable, and is fixed to the other end of the second base. Pressing means for pressing the other end of the first base in the P direction, holding means for holding one end of the second base and one end of the third base, fixed to the other end of the third base 4. The component mounting apparatus according to claim 3, further comprising opening / closing means for opening / closing the other end of the second base in the R direction.