JP2894807B2 - Semiconductor chip pickup device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for picking up a semiconductor chip attached to an expanded sheet by a suction collet.

[Conventional technology]

In general, when manufacturing semiconductor components such as ICs, a wafer is attached to an expanded sheet, and in this state, the wafer is broken for each semiconductor chip, and the semiconductor chips are sucked one by one from the expanded sheet by a suction collet. After being picked up, it is transferred and supplied to a lead frame or a substrate.

An apparatus for picking up a semiconductor chip attached to the expanded sheet by an adsorption collet includes: On the lower surface side of the expanded sheet, a sleeve body having a needle-like body that moves up and down is provided, and the needle-like body is moved upward while the suction collet is brought close to the semiconductor chip on the upper surface of the expandable sheet. By doing so, the semiconductor chip is pushed up by the needle-like body so as to break through the expanded sheet, and is adsorbed to the adsorption collet.

And. On the lower surface side of the expanded sheet, a sleeve body provided with a needle-like body is disposed so as to be able to move up and down. With this sleeve body, the expanded sheet is moved so that the semiconductor chip on the upper surface is close to the suction collet. Pushing up, in this state, the needle-like body protrudes from the tip of the sleeve body by lowering only the sleeve body without vertically moving the needle-like body inside the needle-like body. The semiconductor chip is pushed up so as to pierce the expanded sheet, and is adsorbed on the adsorption collet.

It is well known that there are two forms.

[Problems to be solved by the invention]

Conventionally, in the first type of apparatus, the needle-shaped body is moved up and down, and in the second type of apparatus, the sleeve is moved down by a pneumatic cylinder. Therefore, the speed at which the needle-shaped body is moved up or the speed at which the sleeve body is moved down cannot be changed during these ascending or descending movements. It caused problems.

That is, in order to improve the certainty that the needle-shaped body breaks through the expanded sheet, the speed at which the needle-shaped body is moved up or the speed at which the sleeve body is moved down may be increased. However, if these speeds are set to a high value, the speed at which the semiconductor chip pushed up by the needle-shaped body comes into contact with the suction collet increases, in other words, the semiconductor chip moves at a high speed with respect to the suction collet. Because of the contact, the incidence of damaging the semiconductor chip increases.

Further, in order to reduce the incidence of damaging the semiconductor chip, if the speed at which the needle is moved up or the speed at which the sleeve is moved down is set to a low value, the needle is The reliability of piercing through the expanded sheet is reduced, and the detachability of the semiconductor chip from the expanded sheet is reduced. there were.

In addition, in each of the above-described conventional devices, in order to surely adsorb the semiconductor chip pushed up by the needle-like body by the suction collet, the center of the needle-like body must be accurately positioned with respect to the center of the suction collet. It is necessary to align the needles and the sleeve in such a way that both the needle-shaped body and the sleeve body can be adjusted in the lateral direction. This complicates the structure. At the same time, there is a problem that a great deal of trouble is required for alignment.

An object of the present invention is to provide a pickup device that solves these problems at once.

[Means for solving the problem]

In order to achieve this technical object, a first aspect of the present invention is to provide a sleeve body having an expanded sheet provided with a large number of semiconductor chips on an upper surface, and a lower end side of which is in contact with a lower surface of the expanded sheet. A pickup device in which a suction collet for the semiconductor chip is disposed on the upper surface side thereof, and a needle-like body which pushes up the semiconductor chip by upward movement is provided in the sleeve body so as to be vertically movable. And attaching the sleeve body to a bracket configured to be movable and adjustable in an X direction perpendicular to the axis of the sleeve body and in a Y direction perpendicular to the axis of the sleeve body and the X direction. The needle-shaped body in the sleeve body is mounted so as to be movable up and down, and the needle-shaped body is initially moved up at a high speed and then smelled. A vertical movement mechanism for moving up and down at a slow speed, and further, a first operation means for moving and adjusting the bracket in the X direction, and moving and adjusting the bracket in the Y direction. And a second operating means for performing the operation. "

In addition, claim 2 of the present invention is to provide an up-and-down moving type sleeve body which sandwiches an expand sheet provided with a large number of semiconductor chips on the upper surface and pushes up the expand sheet by upward movement on the lower surface side. On the upper surface side, a suction collet for the semiconductor chip is arranged, while inside the sleeve body,
In a pick-up device provided with a needle-like body protruding from its tip when the sleeve body descends and pushing up the semiconductor chip, the needle-like body is moved by X perpendicular to the axis of the needle-like body. Direction and the Y direction perpendicular to the axis and the X direction of the needle-like body, the sleeve body is mounted on the bracket so as to be adjustable. And a first operating means for adjusting the movement of the bracket in the X direction by attaching a vertically moving mechanism which is moved down at a high speed, then moved down at a slow speed and then moved up. And a second operating means for moving and adjusting the position in the Y direction. "

[Functions and effects of the invention]

In this manner, the speed at which the needle-shaped body is moved up to push up the semiconductor chip on the upper surface of the expanded sheet, or the speed at which the sleeve body is moved down, is early in the initial stage of the up movement and the down movement, The structure is configured to be delayed later, so that the needle-shaped body can pierce the expanded sheet at a high speed, but the semiconductor chip comes into contact with the suction collet by pushing up the needle-shaped body. Since the speed of the contact can be reduced, the occurrence rate of damage to the semiconductor chip and the occurrence rate of a pickup error can be reliably reduced when the semiconductor chip attached to the expanded sheet is picked up.

Moreover, both the sleeve body and the needle-like body are attached to the bracket configured to be movable in the X direction and the Y direction perpendicular thereto, and a vertical movement mechanism for the needle-like body is attached to the bracket. By mounting both the needle body and the vertical movement mechanism with respect to the sleeve body, the sleeve body and the needle body provided inside the sleeve body are simultaneously moved in the X direction with respect to the suction collet on the upper surface of the expanded sheet. Since the movement can be adjusted in the Y direction, the center of the needle-shaped body in the sleeve body can exactly coincide with the center of the suction collet.
In this movement adjustment, it is not necessary to cancel or adjust the interlocking relationship between the sleeve body or the needle-shaped body and the up-down movement mechanism for these.

In addition, a first operating means for moving and adjusting the bracket in the X direction, and
With the provision of the second operating means for adjusting the movement in the direction, as described above, an adjusting operation in which the center of the needle-shaped body in the sleeve body exactly matches the center of the suction collet can be performed by both operating mechanisms. In this movement adjustment, as described above, it is not necessary to release or adjust the interlocking relationship between the sleeve body or the needle-shaped body and the up-down movement mechanism with respect to them, and it is extremely simple because of the dust. And accurately.

That is, according to the present invention, damage such as cracks or chips occurs in the semiconductor chip when the semiconductor chip is pushed up, because the center of the needle-shaped body does not coincide with the center of the suction collet in the sleeve body. Or
In the course of lifting by the suction collet, the semiconductor chip falls and damages another semiconductor chip remaining on the upper surface of the expanded sheet, or the semiconductor chip is sucked while being tilted by the suction collet, and the lead frame or By being supplied to a position shifted to the substrate or the like, it is possible to prevent the occurrence of wire bonding during the next wire bonding, by the above-described extremely simple adjustment operation,
It can be prevented before it happens.

〔Example〕

 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 to 5 show a first embodiment corresponding to the first aspect.

In this figure, reference numeral 1 denotes an expanded sheet formed by attaching a wafer 2 to the upper surface, and the expanded sheet 1 is attached to an XY table (not shown) in a horizontal state. It is configured to move in two directions of an X direction and a Y direction which intersect at right angles to each other, and a vertically movable suction collet 3 is disposed above it.

Reference numeral 4 denotes a machine base, and reference numeral 5 denotes a bracket, respectively. The bracket 5 is disposed on the upper surface of the machine base 4 via an XY slide member 6 in the X direction and the Y direction in plan view. A screw shaft 7 extending in the X direction and a screw shaft 8 extending in the Y direction are rotatably supported on the machine base 4 while being movably mounted in two directions. ,
8, one of the screw shafts 7 is screwed into the XY slide member 6, and the other of the screw shafts 7 is rotated by a first operation handle 13 fixed to one end of the XY slide member 6. , So as to reciprocate in the X direction to adjust the movement.

Further, the other screw shaft 8 of the dowel shafts 7 and 8 is screwed into one end of a link 10 whose middle part is pivotally connected to the machine base 4 with a pin 9, and the other end of the link 10 is connected to the other end of the link 10. A second operating handle, in which a pin 12 fixed to the bracket 5 is fitted and engaged in the slot 11, and the other screw shaft 8 is fixed to one end thereof.
By rotating at 14, the bracket 5 is configured to reciprocate in the Y direction to adjust its movement.

And a member projecting upward from the bracket 5
5a, a sleeve body 15 whose tip is in contact with the lower surface of the expanded seat 1 is attached so as to protrude upward, and the upper end of a spindle shaft 16 slidably inserted into the sleeve body 15, A needle-like body 17 is provided, and the lower end of the spindle shaft 16 is fixed to a slide member 18 slidably supported on the side surface of the bracket 5 in a vertical direction, and a roller 19 is provided on the slide member 18. Bracket 5
A step motor (pulse motor) 20 is mounted on the upper surface of the motor, and the roller 19 is mounted on the eccentric cam plate 21 fitted to the output shaft of the step motor 20 between the slide member 18 and the bracket 5. When the stepping motor 20 rotates, only the needle 17 moves up and down by being pressed and contacted by the spring 22.

In this case, by appropriately controlling the pulse signal input to the step motor 20, the speed at which the needle-shaped body 17 is moved upward is set to be early in the initial stage of the upward movement and to be slow thereafter. It is.

With this configuration, the needle 17 moves upwardly,
As shown in FIG. 4, when the expandable sheet 1 is pierced, the speed of the upward movement of the needle 17 can be increased, and the semiconductor chip 2a of the wafer 2 is As shown in FIG. 5, when the needle 17 comes into contact with the suction collet 3, the speed of the upward movement of the needle 17 can be reduced.

In addition, both the sleeve body 15 and the needle-like body 17 are mounted on the bracket 5 configured to be movable in two directions of the X direction and the Y direction in plan view, and the step motor 20 and the eccentric cam plate 21 are mounted. By attaching the vertical movement mechanism for the needle-like body 17 composed of the roller 19, the spring 22, and the like, the sleeve body 15 and the needle-like body 17 provided therein are combined with the vertical movement mechanism for the needle-like body 17. The movement of the suction collet 3 on the upper surface of the expanded sheet 1 can be adjusted in the X direction and the Y direction.
The movement adjustment in the direction and the Y direction can be extremely easily performed by turning the first operation handle 13 and the second operation handle 14.

FIG. 6 shows a second embodiment of the present invention.

In the second embodiment, a sleeve member 15 is fixed to a slide member 18 which is movably supported in a vertical direction with respect to a bracket 5, and a spindle shaft 16 with a needle-like member 17 in the sleeve member 15 is moved by a step. The roller 19 fixed to the support member 23 attached to the upper surface of the motor 20 and the roller 19 provided on the slide member 18 is attached to the support member 22 with respect to the eccentric cam plate 21 fitted to the output shaft of the step motor 20. By pressing and contacting with a spring 24 mounted between the sliding member 18 and the sleeve member 15 by the rotation of the step motor 20.
Only one of them is configured to move up and down.

Note that the bracket 5, the sleeve body 15, the spindle shaft 16 with the needle-like body 17, the step motor 20, and the eccentric cam plate 21 in the second embodiment are constituted by the same components as those in the first embodiment. Parts are shared between the two embodiments.

In the case of the second embodiment, by appropriately controlling the pulse signal input to the step motor 20, the speed at which the sleeve body 15 is moved down is increased in the early stage of the down movement, and thereafter, , The needle-like body 17 projects from the tip of the sleeve body 15 with the downward movement of the sleeve body 15 to increase the speed at which the needle-like body 17 breaks through the expanded seat 1. On the other hand, the speed at which the semiconductor chip 2a on the wafer 2 comes into contact with the suction collet 3 by the needle 17 can be reduced.

Also in the second embodiment, both the sleeve body 15 and the needle-like body 17 are mounted on the bracket 5 configured to be movable and adjustable in two directions of the X direction and the Y direction in plan view. By attaching a vertical movement mechanism to the sleeve body 15 including the step motor 20, the eccentric cam plate 21, the roller 19, the spring 22, and the like, the sleeve body 15 and the needle-shaped body 17 provided therein are connected to the sleeve body 15. Along with the vertical movement mechanism with respect to the suction collet 3 on the upper surface of the expanded sheet 1, the movement can be adjusted by reciprocating in the X direction and the Y direction, and in the X direction and the Y direction. The movement adjustment is configured in the same manner as in the first embodiment.

In the first embodiment, when the needle 17 in the sleeve 15 is moved upward, or in the second embodiment, when the sleeve 15 outside the needle 17 is moved downward. Alternatively, the expanded sheet 1 may be configured to be vacuum-sucked to the upper end surface of the sleeve body 15.

[Brief description of the drawings]

The drawings show an embodiment of the present invention. FIG. 1 is a perspective view of the first embodiment, FIG. 2 is an enlarged vertical sectional front view of FIG. 1, and FIG.
4 and 5 are enlarged views showing the operation state, and FIG. 6 is a vertical sectional front view of the second embodiment. 1 ... Expanded sheet, 2 ... Wafer, 2a ... Semiconductor chip, 3 ... Suction collet, 4 ... Machine base, 5 ... Bracket, 6 ... XY slide member, 7,8 ... Screw shaft, 15
…… Sleeve body, 16 …… Spindle shaft, 17 …… Needle body,
18: Slide member, 19: Roller, 20: Step motor, 21: Eccentric cam plate.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazunori Fuji 21st, Ryoin-cho, Saiin-ku, Kyoto City, Kyoto Prefecture (56) References JP-A-62-213263 (JP, A) Jpn. (JP, U)

Claims (2)

(57) [Claims] An expandable sheet having a large number of semiconductor chips on an upper surface thereof is sandwiched, and a sleeve body whose leading end contacts the lower surface of the expandable sheet is provided on the lower surface side, and the sleeve body is attracted to the semiconductor chip on the upper surface side thereof. In a pickup device in which a collet is provided and a needle-like body that pushes up the semiconductor chip by upward movement is provided in the sleeve body so as to be movable up and down, the sleeve body is attached to the axis of the sleeve body. On the other hand, it is mounted on a bracket configured to be movable and adjustable in the X direction perpendicular to the direction and the Y direction perpendicular to the axis and the X direction of the sleeve body,
The needle-like body in the sleeve body is attached to the bracket so as to be vertically movable, and the needle-like body is moved up at an initial high speed, then moved up at a slow speed and then moved down. Attach the mechanism,
A first for moving and adjusting the bracket in the X direction;
A pickup device for a semiconductor chip, comprising: operating means; and second operating means for moving and adjusting the bracket in the Y direction. 2. An up / down moving sleeve body which pushes up the expand sheet by ascending movement on the lower surface side of an expand sheet provided with a large number of semiconductor chips on the upper surface. A pickup device comprising: a suction collet provided for the semiconductor chip; and a needle-shaped body provided in the sleeve body so as to protrude from the tip when the sleeve body moves downward to push up the semiconductor chip. The needle-like body is attached to a bracket configured to be movable in an X direction perpendicular to the axis of the needle-like body and in a Y direction perpendicular to the axis of the needle-like body and the X direction. At the same time, the sleeve body is mounted so as to be able to move up and down, and this sleeve body is moved down at a high speed in the initial stage and then at a low speed. A vertical movement mechanism that moves up and down is attached, and further, first operating means for moving and adjusting the bracket in the X direction, and second operating means for moving and adjusting the bracket in the Y direction. A pickup device for a semiconductor chip, comprising an operating means.