JPS59186333A - Bonding apparatus - Google Patents

Abstract

PURPOSE:To correct a discrepancy between a pad and a lead easily by a method wherein each pellet of a semiconductor wafer, transferred onto an X-Y table, is attracted by an attractive collet provided to a pattern recognition equipment and transferred onto a bonding arm and dropped onto a substrate provided on a rotary table by turning the bonding arm 180 deg.. CONSTITUTION:A pellet 22 is positioned to a prescribed position by a pattern recognition equipment 21 and an X-Y table 20. The pellet 22 is attracted by an attractive collet 24 provided to the tip of a moving arm 23 and transferred to an attractive collet 29 provided to the tip of a bonding arm 28. On the other hand, the position of a substrate 27 placed beneath the arm 28 is corrected by an X-Y table 25 and a pattern recognition equipment 34 attached on a Z-axis table 36 for a camera and the position of a pad of the pellet 33 on the arm 28 and the position of a lead of the substrate 27 are adjusted. After that, the arm 28 is turned 180 deg. and the pellet 33 is dropped onto the substrate 27.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a bonding device for bonding semiconductor chips or other electronic component chips onto a substrate or lead frame made of ceramic, phosphor, aluminum, glass epoxy, or the like.

Conventional configurations and their problems In general, as a method for connecting the pad part of a semiconductor chip to a lead frame part on a substrate made of ceramics, aluminum, glass epoxy, etc., Frisop chip is used due to the relationship between the time required for connection and the area of the connection part. A bonding method called bonding has been put into practical use. The conventional flip chip bonding equipment has a 10X-Y
There are 2 pellets on the table. Three connection pads are formed on the pellet.

4a and 4b are suction collets, and it is possible to evacuate the space in the suction collets 6 through the vacuum tube 5. Reference numeral 7 denotes an arm to which the suction collet is slidably attached and is movable in the IBIC and D directions. 8 is a pressure spring, and 9 is a collar provided to prevent the suction collet from falling off from the arm. Reference numeral 10 denotes an intermediate position adjustment stage, and reference numeral 11 and 12 denote adjustment claws for adjusting the position of the pellet on the intermediate position adjustment stage. A mounting head 13 is supported by a bearing 14 and is movable in the direction of the arrow EF. Reference numeral 15 denotes an X-Y table on which 16 substrates are mounted, and is arranged parallel to the surface 17 of the mounting head.

Reference numeral 18 represents a lead portion on the substrate, which can be connected to a pad of the pellet. The operation of the conventional bonding apparatus configured as described above will be explained below with reference to the drawings. As shown in FIG. 1, a pellet 2 placed on an X-Y table 1 is provided with a pad 3 for connection to a lead frame portion of a substrate. This pellet 2 is positioned so that it comes to the stop of the suction collet 4a. Next, the arm 7 descends in the direction of arrow C and is attracted by the suction collet 4a. At the same time, the pellet 2 whose position has been regulated by the regulating claws 11 and 12 on the intermediate position regulating stage is sucked by the suction collet 4b. When suction is completed, the position regulating claw is released. Next, the arm 7 moves in the direction of the arrow A, and at the point where the centers of the suction collets 4a and 4b have moved by the amount A, the arm 7 moves in the direction of the arrow C. The adsorption is released at the position where the pellet 2 contacts the intermediate position adjustment stage 10 and the mounting pad 13, and the adsorbed cholera 1-4a, 4b moves in the direction of the arrow and the direction of the arrow B, and returns to its original position. The pellet on the intermediate positioning stage has a positioning claw 11%2
The position is adjusted by. Further, the pellet 2 placed on the mounting head 13 is lifted in the direction of arrow E as the mounting head 13 is supported by the bearing 14. At this time, the substrate 16 has already been positioned at a predetermined position by the substrate XY table 15. When the raised pad of the pellet 2 comes into contact with the lead portion 18 of the substrate and bonding is completed, the mounting head 13 descends to complete the process. Thereafter, this operation is repeated to perform bonding.

However, in the above configuration, the distance between the suction collens 4a and 4b attached to the arm 7 and A,
It is necessary to make the B dimension the same, but this position adjustment is very difficult. In addition, in this type of bonding method, in order to improve the reliability of bonding, it is necessary to position the lead part on the substrate and the pad part of the pellet with high precision.
In the conventional method, highly accurate positioning and bonding are impossible due to variations in the position of the pad part relative to the outer periphery of the pellet and variations in the position of the lead part on the substrate.

OBJECTS OF THE INVENTION In view of the above-mentioned drawbacks, the present invention provides a bonding device that connects the pad portion of a pellet and the lead portion of a substrate with high precision.

Structure of the Invention The present invention comprises a pellet positioning table that holds pellets and is movable in two orthogonal directions, a recognition device that detects the position of the pellets, and a transfer means that picks up and transfers the positioned pellets one by one. a suction means for suctioning the pellets transferred by the transfer means; a rotation mechanism for reversing the suction means by 180 degrees; a positioning table movable in two directions perpendicular to the suction means; and a positioning table for holding the substrate. It is equipped with a positioning table that can be moved in two orthogonal directions and in the rotational direction, and a recognition device that can detect the position of the reed part on the board and the pad of the pellet 7), and can adjust the position of the pellet at an intermediate position. becomes unnecessary. Furthermore, it has the unique effect of directly detecting the pad portion of the pellet and the lead portion of the substrate, correcting positional deviations, and then performing bonding, thereby enabling highly accurate bonding.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In Figures 2 to 4, 19 is a wafer and 2
It is installed on the X-Y table at o. A pattern recognition device 21 detects the position of the pellets 22 on the XY table. Reference numeral 23 denotes a movable arm, which has a suction collet 24 at its tip for suctioning the pellets, and is movable up and down and back and forth by means of a cam, cylinder, etc.

25 is an XY table for the substrate, 26 is a rotatable θ table, and 27 is a substrate held on the θ table. A bonding arm 28 has heating means and a pellet adsorption collet 29 at its tip. 30 is a reversing table which rotates the bonding arm by 180 degrees. Reference numeral 31 denotes two tables for bonding arms, which are movable in the direction of arrow G and are mounted on the x-y table 32. 32 is a lead portion of the substrate, and 33 is a pellet adsorbed to the bonding arm. 34 is a pattern recognition device that detects the positions of the lead portions and pellets on the substrate.

36 is a Z-axis table for a camera that positions the pattern recognition device at any vertical position.

The operation of the bonding apparatus configured as described above will be explained below. The pattern recognition device 21 and the X-Y table 2o position the P/N 22 at a predetermined position. Next, a moving arm 23 having a suction collet 24 at its tip is moved downward by a cam cylinder or the like. When the pellet 22 comes into contact with the above-mentioned adsorbed cholera, the pellet is vacuum-adsorbed.When the adsorption is completed, the moving arm moves upward and further moves along the trajectory H. The pellet held by the adsorption collet 24 is transferred to the adsorption collet 29 provided at the tip of the bonding arm 28 equipped with a heating means, the adsorption of the bonding collet 24 is released, and then the pellet 24 is held by the adsorption collet 24.
The pellet is held by vacuum suction using the suction collet No. 9. The substrate 27 is positioned at a predetermined position by the X-Y table 25 and the pattern recognition device 34.

At this time, the camera focus of the pattern recognition device 34 is on the substrate 2.
The camera Z-axis table 36 is moved so that it is aligned with 7, and the bonding arm 28 is moved to
- Move and escape using the Y table 32. After the substrate positioning is completed, the camera Z-axis table 36 of the pattern recognition device 27 is moved so that the camera focuses on the pellet 22 on the bonding arm 28.

Next, the bonding arm 28 is positioned at a predetermined position by the XY table 32. Therefore, the pattern recognition device 34 detects the positional shift of the scipere note 33, and
The table 32 corrects the Shibele note 33 by the detected deviation amount and positions it at the normal position. Then, the positional deviation between the center position of the pad 33 of the pellet and the rotation center 35 of the rotary table 30 is calculated. Next, the pellet is rotated 1800 times by the rotary table 30 until the substrate 27 and the pellet 33 face each other, and then the position of the substrate is corrected by the positional deviation by the X-Y table 25. If there is an angular deviation in the position of the pad, the position of the substrate is corrected using the θ table 26. When the position correction is completed, the Z table 31 moves the lead part 32 in the direction of the arrow ■ to the pellet 33.
Connect by thermocompression bonding, etc. When the connection is completed, the vacuum suction of the suction collet is released, and the arm 28 (d) rises to complete the bonding.

As described below, according to this embodiment, there is a pellet positioning table that holds the Benz and is movable in orthogonal directions, a recognition device that detects the position of the pellets, and a pellet positioning table that picks up the positioned pellets one by one. a bonding arm capable of adsorbing pellets transferred by the transfer arm, a rotation mechanism for reversing the bonding arm 1800 degrees, a positioning table movable in a direction perpendicular to the arm, and a positioning table that holds the substrate. By providing a positioning table that can be moved in two orthogonal directions and a recognition device that can detect the positions of the leads on the board and the pads of the pellet, it is not necessary to adjust the position of the pellet in the middle, and the device can be adjusted. It becomes very easy.

In addition, although all conventional positional adjustments were made using the outer periphery of the pellet as a reference, the recognition device can directly detect the pad and IJ-domain, making it possible to perform bonding with high precision. Moreover, highly accurate bonding can be performed even when there is an angular misalignment between the pad and the lead portion.

Although the heating means is provided on the bonding arm 28, it may also be provided on the θ table that holds the substrate 27, and the same effect can be expected. Here it is, bonding arm 2
If an ultrasonic horn is used in step 8, bonding at low temperature or room temperature is also possible.

Effects of the Invention As described above, the present invention provides a recognition device capable of detecting the pad position of a pellet transferred from a pellet positioning table and the position of a lead portion of a substrate, and a positioning table capable of correcting a detected positional deviation. , the position detected pellet is 18
By providing a bonding arm that rotates 00 degrees to bond to the substrate, there is no need to adjust the position at an intermediate position, and the pad part of the pellet and the lead part of the board are directly detected and bonding is performed after correcting the misalignment, making it possible to achieve high precision. Bonding can be made possible, and its practical effects are great.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional bonding device, FIG. 2 is a perspective view of a bonding device according to an embodiment of the present invention, and FIGS. 3 and 4 are front views of a recognition device and a positioning table. 22... Pellet, 27... Substrate, 28
...Bonding arm, 3o...Rotary table, 25°26-...Positioning table, 34...Recognition device. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 6 Figure 3 Figure 4

Claims (1)

[Claims] A pellet positioning table that holds pellets and is movable in two orthogonal directions; a recognition device that detects the position of the pellet; a transfer means that picks up and transfers the positioned pellets one by one; A suction means for suctioning the loaded pellets, a rotation mechanism for reversing the suction means by 180 degrees, a positioning table movable in two orthogonal directions to the suction means, and a positioning table for holding the substrate and moving in two orthogonal directions. A bonding device equipped with a positioning table movable in the rotational direction and a recognition device capable of detecting the positions of the lead portion on the substrate and the pad of the pellet.