JP3194328B2 - Die bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus used for mounting a semiconductor chip on a package body having an open top.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view showing a main part of a conventional die bonding apparatus. In the illustrated conventional die bonding apparatus 50, a ball screw unit 5 connected to a motor 51 is provided.
2, a support plate 53 is attached. An L-shaped block 54 is attached to the support plate 53,
Further, a support rod 55 is attached to the L-shaped block 54. On the other hand, above the support rod 55, a chip holder 57 holding the semiconductor chip 56 is arranged.

In the above-mentioned conventional die bonding apparatus, first, a package body 59 placed on a carrier 58 is positioned and arranged above a support rod 55. Next, the support plate 53 attached to the ball screw unit 52 is raised by the drive of the motor 51, whereby the support rod 55 attached to the L-shaped block 54 pushes up the package body 59. Thereby, the support rod 55
The package body 59 is placed and supported on the lower surface of the package body 59 at the tip end, and the chip holder 57 is lowered in this state to mount the semiconductor chip 56 on the package body 59. Subsequently, the chip holder 57 is separated upward from the package body 59, and then the support rod 55 is lowered by driving the motor 51. During this lowering, the package body 59
Is transferred from the support rod 55 to the carrier 58. Thereafter, the carrier 58 is conveyed at a predetermined feed pitch in the direction of the arrow in the figure, whereby the support rod 55
Is positioned above the package body 59, and the semiconductor chip 56 is mounted on the package body 59 in the same procedure as described above.

[0004]

Here, in the above-described conventional die bonding apparatus 50, since the semiconductor chip 56 is mounted on the basis of the lower surface side of the package body 59, the lower surface of the package body 59 is naturally used. Is mounted in parallel with the semiconductor chip 56. However, since the package body 59 called a sardip type is formed by laminating and integrating a ceramic base and a lead frame with a bonding agent, the parallelism between the upper and lower surfaces of the package body 59 is not sufficiently guaranteed. Therefore, for example, in the assembling process of a two-plate or three-plate color camera, when the CCD image pickup device is attached to the color separation prism, the upper surface side of the package body 59 is directly brought into contact with the light emission surface of the color separation prism. A semiconductor chip (CCD) for the light exit surface of the prism
The parallelism of the chip) is greatly shifted. For this reason, conventionally, a holder is interposed between the color separation prism and the package body 59, and the mounting position of the holder is finely adjusted at the time of registration adjustment.
The parallelism of the CCD image pickup device was adjusted with respect to the light exit surface of the color separation prism, and the two were combined.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to simplify the work of adjusting the mounting of a CCD image pickup device in a color camera assembling process.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and a die bonding apparatus for mounting a semiconductor chip on a package body having an opening at an upper portion corresponds to a size of the package body. A reference plate having a perforated chip insertion hole, the lower surface of which is abutted as a reference surface, and a chip holder disposed above the reference plate so as to be able to advance to the lower surface side of the reference plate via the chip insertion hole. And a package push-up mechanism arranged to be able to move up and down below the reference plate. The package push-up mechanism includes a support rod for placing and supporting the package body from the lower surface side at a tip end surface thereof, and a tip end of the support rod. And a copying unit that supports the support rod so as to be swingable in two axial directions orthogonal to each other with the portion as a rotation center.

[0007]

In the die bonding apparatus of the present invention, the package body is pushed up by the support rod with the rise of the package pushing up mechanism. At this time, the package body
The support rod is abutted against the reference plate while being placed and supported on the distal end surface of the support rod. At this time, the support rod supported by the copying unit swings around the tip portion as the center of rotation, so that the upper surface side of the package body is pressed against the abutting reference surface of the reference plate without any gap. From this state, the chip holder advances to the lower surface side of the reference plate through the chip insertion hole, and the semiconductor chip is mounted on the package body abutted against the reference plate, so that the semiconductor is positioned with respect to the upper surface side of the package body. The chip is mounted with high precision.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view of a main part showing an embodiment of a die bonding apparatus according to the present invention. The die bonding apparatus 1 of the present embodiment mainly includes a reference plate 2, a chip holder 3, and a package push-up mechanism as main components. The reference plate 2 has a chip insertion hole 5 formed in accordance with the size of the package body 4. That is, the size of the chip insertion hole 5 is formed to be slightly smaller than the size of the package body 4, and is provided so as to penetrate the reference plate 2. The lower surface of the reference plate 2 is finished smoothly by, for example, surface grinding, and the lower surface is used as an abutting reference surface 2a.

On the other hand, a flat collet of, for example, a vacuum suction type is adopted as the chip holder 3, and its tip surface (chip suction holding surface) is arranged in parallel with the abutting reference surface 2a of the reference plate 2. ing. The chip holder 3 is arranged so as to be able to advance toward the lower surface (abutting reference surface 2a) of the reference plate 2 via the chip insertion hole 5 by a driving mechanism (not shown).

The package push-up mechanism is arranged below the reference plate 2 so as to be able to move up and down by a ball screw unit 7 connected to a motor 6, for example. That is, the support plate 8 is attached to the ball screw unit 7. A slide guide unit 9 composed of a guide rail 9a and a movable plate 9b slidably engaged with the guide rail 9a is attached to the support plate 8, and an L-shaped plate 1 is provided below the slide guide unit 9.
0 is attached.

Further, a copying unit 11 is attached to the movable plate 9b of the slide guide unit 9. As shown in FIG. 2, the copying unit 11 includes a rod mounting block 12, a pair of guide plates 13 disposed on both sides of the rod mounting block 12, and a core mounted on the lower surface of the pair of guide plates 13. It is composed of a U-shaped plate 14 and a base plate 15 arranged outside the U-shaped plate 14.

An arcuate V-shaped groove 12a (FIG. 2) is formed on both side surfaces of the rod mounting block 12, and an arcuate V-shaped groove 13a (FIG. FIG. 2) is formed. The rod mounting block 12 and the pair of guide plates 13 are connected to each other with the steel balls 16 interposed therebetween to form the V-grooves 12a, 13
a are slidably coupled to each other with a. Incidentally, when the rod mounting block 12 and the guide plate 13 are connected, the rod mounting block 12
A slight gap is formed between the U-shaped plate 14 and the U-shaped plate 14.

On the other hand, arcuate V-shaped grooves 14a and 15a (FIG. 2) are formed on the outer surface of the U-shaped plate 14 and the inner surface of the base plate 15 facing the U-shaped plate 14, respectively. Are slidably connected to each other with a steel ball 17 interposed therebetween with the V-grooves 14a and 15a facing each other. Here, the rod mounting block 12
V-grooves 12a, 13 formed in the guide plate 13
a and V grooves 14a and 15a formed in the U-shaped plate 14 and the base plate 15 are formed in directions orthogonal to each other (see FIG. 2).

A support rod 18 is integrally fixed to the upper surface of the rod mounting block 12. The support rod 18 has a distal end surface 18a at its distal end surface 18a.
Is mounted and supported from the lower surface side. here,
The V-shaped grooves 12a and 13a formed in the rod mounting block 12 and the guide plate 13 are formed in an arc shape centering on the x-axis at the distal end P of the support rod 18 (FIG. 2). The V-shaped grooves 14a and 15a formed in the U-shaped plate 14 and the base plate 15 are formed in an arc shape centering on the y-axis at the distal end P of the support rod 18, that is, the axis orthogonal to the x-axis. Therefore, the rod mounting block 12 is swingably connected to the guide plate 13 around the x-axis, and the U-shaped plate 14 is swingably connected to the base plate 15 around the y-axis. I have. In other words, the copying unit 11 is arranged so that the tip end P of the support rod 18 is a rotation center and
The support rod 18 is swingably supported in the axial (x-axis, y-axis) directions.

On the other hand, a hanging rod 19 extends from the bottom of the copying unit 11, and the hanging rod 19 is coaxially and integrally connected to the support rod 18. The hanging rod 19 is inserted with a slight play into a fitting hole 10a formed in the L-shaped plate 10, and a spherical washer 20 is attached to a lower end thereof. Here, the lower side of the fitting hole 10a of the L-shaped plate 10 is formed in a conical shape, and the spherical washer 20 is engaged therewith. In addition, a pair of springs 21 are interposed between the L-shaped plate 10 and the copying unit 11, and the copying unit 11 is urged toward the reference plate 2 by the elastic force of these springs 21. . Then, the spherical washer 2 attached to the hanging rod 19
0 is the L-shaped plate 10 with the elastic force of the spring 21.
Of the copying unit 1
1 and the swinging motion of the support rod 18 are restricted.

Next, the operation of the die bonding apparatus of this embodiment will be described. In this embodiment, a case where the package body 4 is transported while being mounted on a carrier 22 (see FIG. 4) will be described as an example. First, the package body 4 placed on the carrier 22 is positioned and disposed above the support rod 18 between the reference plate 2 and the package push-up mechanism. Next, the support plate 8 attached to the ball screw unit 7 is raised by the drive of the motor 6, and the copying unit 11 is also raised in cooperation with this. At this time, the support rod 18 supported by the copying unit 11 pushes up the package main body 4 placed on the carrier 22, and places the package main body 4 on the front end surface of the package main body 4 from the lower surface side.

The package body 4 thus pushed up is abutted against the lower surface of the reference plate 2, that is, the abutment reference surface 2a, as shown in FIGS. At this time, the upper surface side of the package body 4 is abutted against the abutting reference surface 2a of the reference plate 2. Here, as described above, the parallelism of the upper and lower surfaces of the package body 4 is not sufficiently guaranteed. Therefore, even if the abutting reference surface 2a of the reference plate 2 and the distal end surface of the support rod 18 are arranged in parallel,
In a configuration in which the upper surface of the package body 4 is merely abutted against the reference plate 2, if the upper and lower surfaces of the package body 4 are not formed in parallel, the upper surface of the package body 4 and the abutting reference surface 2 a of the reference plate 2 are not aligned. As a result, a gap is generated between the semiconductor chips, resulting in a disadvantage that the semiconductor chip is not mounted with high accuracy based on the upper surface side of the package body 4. Therefore, in this embodiment, such inconveniences are solved as follows.

That is, from the state where the package body 4 abuts against the reference plate 2, the support plate 8 is further raised by the driving force of the motor 6. At this time, since the package body 4 has already abutted the reference plate 2, only the L-shaped plate 10 rises against the elastic force of the spring 21 with the slide operation of the slide guide unit 9. As a result, as shown in FIG. 3, the spherical washer 20 attached to the hanging rod 19 is disengaged from the fitting hole 10a of the L-shaped plate 10, so that the copying unit has a play between the hanging rod 19 and the fitting hole 10a. The support rod 18 supported by 11 can freely swing about its tip P as the center of rotation.

Therefore, even if the upper and lower surfaces of the package body 4 are not parallel, the upper surface side of the package body 4 pushed up by the support rod 18 is not arranged in parallel with the butted reference surface 2a of the reference plate 2. When the support rod 18 supported by the copying unit 11 swings in two axial directions (x, y directions) orthogonal to each other with the tip end P as the center of rotation, the entire package body 4 abuts against the reference surface 2a. Accordingly, a state is obtained in which the upper surface side of the package body 4 is necessarily pressed against the abutting reference surface 2a of the reference plate 2 without any gap.

When the package body 4 abuts against the reference plate 2 in this manner, the chip holder 3 holding the semiconductor chip (not shown) descends. At this time, the chip holder 3 holds the semiconductor chip (not shown) by suction while holding it.
The semiconductor chip advances to the lower surface side of the reference plate 2 through the chip insertion hole 5, and a semiconductor chip (not shown) is mounted on the package body 4 arranged there. As a result, the semiconductor chip is mounted on the package body 4 abutted against the reference plate 2 with high accuracy based on the upper surface side.

As a result, in a color camera assembling process, for example, when a CCD image pickup device is attached to a color separation prism, since a semiconductor chip (CCD chip) is mounted on the basis of the upper surface side of the package body 4, the color separation is performed. Only by directly abutting the upper surface side of the package body 4 against the light emitting surface of the prism, the parallelism of the CCD chip with respect to the light emitting surface of the color separation prism can be obtained with high accuracy.

Further, in the die bonding apparatus 1 of the present embodiment, it is possible to mount a semiconductor chip on the basis of the lower surface side of the package body 4 in the following procedure. That is, after the package main body 4 placed on the carrier 22 is pushed up by the support rod 18, the drive of the motor 6 is stopped just before the upper surface of the package main body 4 abuts against the abutment reference surface 2 a of the reference plate 2. In this state, since the spherical washer 20 attached to the lower end of the hanging rod 19 is engaged with the fitting hole 10a of the L-shaped plate 10 by the resilience of the spring 21, the posture of the support rod 18 is in the upright state. Is held. Therefore, the chip holder 3 is lowered from this state, and the semiconductor chip sucked and held by the chip holder 3 is mounted on the package body 4 supported by the support rod 18 via the chip insertion hole 5 of the reference plate 2. By doing so, the semiconductor chip can be mounted on the basis of the lower surface side of the package body 4 as in the conventional case. Thereby, the mounting operation of the semiconductor chip based on the upper surface side of the package body 4 and the package body 4
Mixed production with a semiconductor chip mounting operation based on the lower surface of the semiconductor chip.

[0023]

As described above, according to the die bonding apparatus of the present invention, the semiconductor chip is mounted on the basis of the upper surface side of the package body. When the CCD image pickup device is mounted, the parallelism of the CCD chip with respect to the light emission surface of the color separation prism can be obtained with high accuracy only by directly abutting the upper surface side of the package body with the light emission surface of the color separation prism. . As a result, when mounting the CCD image pickup device, the holder metal fittings and the like conventionally used become unnecessary, and the parallelism of the CCD chip with respect to the light emitting surface of the color separation prism does not need to be adjusted. CCD in camera assembly process
The attachment adjustment work of the imaging device is simplified.

Further, in the present invention, when the package body mounted and supported on the distal end surface of the support rod abuts against the reference plate, the support rod supported by the copying unit swings about the distal end portion as the center of rotation. By doing so, the upper surface of the package body is pressed against the abutting reference surface of the reference plate without any gap, so the semiconductor chip is always referenced to the upper surface of the package body regardless of the parallelism of the upper and lower surfaces of the package body. Can be implemented with high accuracy.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of an embodiment of a die bonding apparatus according to the present invention.

FIG. 2 is a perspective view illustrating a configuration of a copying unit in the push-up mechanism.

FIG. 3 is a schematic side view illustrating the operation of the die bonding apparatus according to the embodiment.

FIG. 4 is a perspective view of an essential part for explaining the operation of the die bonding apparatus in the embodiment.

FIG. 5 is a perspective view of a main part showing a conventional die bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Die-bonding apparatus 2 Reference plate 2a Butt reference surface 3 Chip holder 4 Package body 5 Chip insertion hole 11 Copying unit 18 Support rod

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/52 H01L 21/60

Claims (1)

(57) [Claims] 1. A die bonding apparatus for mounting a semiconductor chip on a package main body having an open upper part, the die bonding apparatus having a chip insertion hole formed in accordance with the size of the package main body, the lower surface of which is abutted against a reference plane. A reference plate, a chip holder arranged above the reference plate via the chip insertion hole so as to be able to advance to the lower surface side of the reference plate, and a package arranged to be able to move up and down below the reference plate A push-up mechanism, wherein the package push-up mechanism is configured to support the package main body from a lower surface side at a tip end surface thereof, and to support the package in a biaxial direction orthogonal to each other with the tip end of the support rod as a center of rotation. A copying unit for swingably supporting a rod.