JPH07161741A - Die bonder - Google Patents

Abstract

PURPOSE:To simplify the mounting and adjusting work for a CCD in a color camera assembling process. CONSTITUTION:A die bonder comprises a chip inserting hole 5 corresponding to the size of a package body 4, a reference plate 2 with the bottom surface used as a butt reference surface 2a, a chip holder 3 positioned so as to permit the ingress to the bottom surface side of a reference plate 2 through the chip inserting hole 5 above the reference plate 2, and a package pushing up mechanism positioned in a freely moving up and down below the reference plate 2. And the package pushing up mechanism has a supporting rod 18 for supporting the package body 4 with the tip end face of the rod at the bottom surface side and a profiling unit 11 for supporting the supporting rod 18 in an oscillating manner in two-axis direction perpendicular to each other with the center of rotation located at the tip portion of the supporting rod.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus used for mounting a semiconductor chip on a package body having an open top.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view of a main part of a conventional die bonding apparatus. In the illustrated conventional die bonding apparatus 50, the ball screw unit 5 connected to the motor 51
A support plate 53 is attached to the unit 2. Further, an L-shaped block 54 is attached to the support plate 53,
Further, a support rod 55 is attached to the L-shaped block 54. On the other hand, a chip holder 57 holding the semiconductor chip 56 is arranged above the support rod 55.

In the conventional die bonding apparatus described above, first, the package body 59 placed on the carrier 58 is positioned and arranged above the support rod 55. Next, the support plate 53 attached to the ball screw unit 52 moves up by the drive of the motor 51, whereby the support rod 55 attached to the L-shaped block 54 pushes up the package body 59. Thereby, the support rod 55
Mounts and supports the package main body 59 from the lower surface side on the tip surface thereof, and in this state the chip holder 57 descends to mount the semiconductor chip 56 on the package main body 59. Then, the chip holder 57 is separated upward from the package body 59, and then the support rod 55 is lowered by the drive of the motor 51. During this descent, the package body 59
Are transferred from the support rod 55 to the carrier 58. After that, the carrier 58 is conveyed in the direction of the arrow in the drawing at a predetermined feed pitch, and the support rod 55 is sequentially transferred.
The package main body 59 is positioned above, and the semiconductor chip 56 is mounted on the package main body 59 by the same procedure as above.

[0004]

In the conventional die bonder 50 described above, the semiconductor chip 56 is mounted on the lower surface side of the package body 59 as a reference. Therefore, the semiconductor chip 56 is mounted in parallel. However, since such a package body 59 called a sardip type is a ceramic base and a lead frame laminated and integrated by a bonding agent, the parallelism of the upper and lower surfaces of the package body 59 is not sufficiently guaranteed. Therefore, for example, in a two-plate or three-plate color camera assembly process, when the CCD image pickup device is attached to the color separation prism, when the upper surface side of the package body 59 is directly abutted with the light emitting surface of the color separation prism, the color separation is performed. A semiconductor chip (CCD) for the light exit surface of the prism
The parallelism of the chip) is greatly deviated. Therefore, conventionally, a holder metal fitting is purposely interposed between the color separation prism and the package body 59, and the mounting position of the holder metal fitting is finely adjusted during registration adjustment.
The parallelism of the CCD image pickup device with respect to the light emitting surface of the color separation prism was adjusted to combine the two.

The present invention has been made to solve the above problems, and it is an object of the present invention to simplify the attachment adjustment work of a CCD image pickup device in a color camera assembly process.

[0006]

The present invention has been made in order to achieve the above-mentioned object, and in a die bonding apparatus for mounting a semiconductor chip on a package body having an opening at the top, the size of the package body can be adjusted. A reference plate that has a chip insertion hole that is drilled and uses the lower surface side as a reference surface for abutting, and a chip holder that is arranged above the reference plate so that it can advance to the lower surface side of the reference plate through the chip insertion hole. And a package push-up mechanism that is arranged below the reference plate so as to be able to move up and down. The package push-up mechanism includes a support rod that mounts and supports the package body from the lower surface side at its tip surface, and a tip of the support rod. And a copying unit that swingably supports the support rod in two axial directions orthogonal to each other with the section as the center of rotation.

[0007]

In the die-bonding apparatus of the present invention, the package body is pushed up by the support rod as the package push-up mechanism rises. At this time, the package body is
It is abutted against the reference plate while being placed and supported on the tip end surface of the support rod. At this time, the support rod supported by the copying unit swings about its tip as the center of rotation, so that the upper surface side of the package body is pressed against the abutting reference surface of the reference plate without a gap. From this state, the chip holder advances to the lower surface side of the reference plate through the chip insertion hole, and the semiconductor chip is mounted on the package body that is abutted against the reference plate. The chip is mounted with high precision.

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a perspective view of an essential part showing an embodiment of a die bonding apparatus according to the present invention. The die-bonding apparatus 1 of this embodiment mainly includes a reference plate 2, a chip holder 3, and a package pushing-up mechanism as its main components. The reference plate 2 has a chip insertion hole 5 formed corresponding to the size of the package body 4. That is, the size of the chip insertion hole 5 is formed to be slightly smaller than the size of the package body 4, and this is provided so as to penetrate the reference plate 2. The lower surface side of the reference plate 2 is smoothed by, for example, surface grinding, and this lower surface side is used as the abutting reference surface 2a.

On the other hand, as the chip holder 3, for example, a vacuum suction type flat collet is adopted, and its tip end surface (chip suction holding surface) is arranged parallel to the abutting reference surface 2a of the reference plate 2. ing. Further, the chip holder 3 is arranged so as to be able to advance to the lower surface (abutting reference surface 2a) side of the reference plate 2 via the chip insertion hole 5 by a drive mechanism (not shown).

The package pushing-up mechanism is arranged below the reference plate 2 so that it can be raised and lowered by a ball screw unit 7 connected to a motor 6, for example. That is, the support plate 8 is attached to the ball screw unit 7. A slide guide unit 9 including a guide rail 9a and a movable plate 9b slidably engaged with the guide rail 9a is attached to the support plate 8, and the L-shaped plate 1 is provided below the slide guide unit 9.
0 is attached.

Further, a copying unit 11 is attached to the movable plate 9b of the slide guide unit 9. As shown in FIG. 2, the copying unit 11 includes a rod mounting block 12, a pair of guide plates 13 arranged on both sides of the rod mounting block 12, and a pair of guide plates mounted on the lower surfaces of the pair of guide plates 13. It is constituted by a U-shaped plate 14 and a base plate 15 arranged outside the U-shaped plate 14.

Arc-shaped V grooves 12a (FIG. 2) are formed on both side surfaces of the rod mounting block 12, and the arc-shaped V grooves 13a ( 2) has been formed. Then, the rod mounting block 12 and the pair of guide plates 13 have steel balls 16 interposed therebetween, so that the V grooves 12a and 13 of each other are inserted.
It is slidably connected in a state where a is abutted. By the way, when the rod mounting block 12 and the guide plate 13 are connected, the rod mounting block 12
A slight gap is formed between the and U-shaped plate 14.

On the other hand, arcuate V-shaped grooves 14a and 15a (FIG. 2) are formed on the outer side surface of the U-shaped plate 14 and the inner side surface of the base plate 15 which faces the U-shaped plate 14, respectively, and both of them are formed between them. A steel ball 17 is interposed between the V groove 14a and the V groove 15a, and the V grooves 14a and 15a are slidably coupled to each other. Here, the rod mounting block 12
And V-grooves 12a and 13 formed in the guide plate 13
The “a” and the V-shaped grooves 14a and 15a formed in the U-shaped plate 14 and the base plate 15 are formed in directions orthogonal to each other (see FIG. 2).

A support rod 18 is integrally fixed to the upper surface of the rod mounting block 12. The support rod 18 has a tip end surface 18a at the package body 4
Is for placing and supporting from the lower surface side. here,
The V grooves 12a and 13a formed in the rod mounting block 12 and the guide plate 13 are formed in an arc shape around the x axis at the tip P (FIG. 2) of the support rod 18. The V-shaped grooves 14a and 15a formed in the U-shaped plate 14 and the base plate 15 are formed in an arc shape around the y-axis, that is, the axis orthogonal to the x-axis, at the tip P of the support rod 18. Therefore, the rod mounting block 12 is swingably connected to the guide plate 13 about the x axis, and the U-shaped plate 14 is swingably connected to the base plate 15 about the y axis. There is. That is, the copying units 11 are orthogonal to each other with the tip P of the support rod 18 as the center of rotation.
The support rod 18 is swingably supported in the axial (x-axis, y-axis) direction.

On the other hand, a hanging rod 19 extends from the bottom of the copying unit 11, and the hanging rod 19 is coaxially and integrally connected to the support rod 18. Further, the hanging rod 19 is inserted into the fitting hole 10a formed in the L-shaped plate 10 with some play, and the spherical washer 20 is attached to the lower end thereof. Here, the lower side of the fitting hole 10a of the L-shaped plate 10 is formed into a conical shape, and the spherical washer 20 is engaged therewith. In addition, a pair of springs 21 are interposed between the L-shaped plate 10 and the copying unit 11, and the copying unit 11 is biased toward the reference plate 2 side by the elastic force of these springs 21. . Then, the spherical washer 2 attached to the hanging rod 19
0 is the L-shaped plate 10 with the elastic force of the spring 21.
Of the copying unit 1
The vertical position of 1 and the swing motion of the support rod 18 are restricted.

Next, the operation of the die bonding apparatus of this embodiment will be described. In this embodiment, the case where the package body 4 is placed on the carrier 22 (see FIG. 4) and conveyed is described as an example. First, the package body 4 placed on the carrier 22 is positioned and arranged above the support rod 18 between the reference plate 2 and the package pushing-up mechanism. Next, the support plate 8 attached to the ball screw unit 7 moves up by the drive of the motor 6, and in cooperation with this, the copying unit 11 also moves up. At this time, the support rod 18 supported by the copying unit 11 pushes up the package body 4 placed on the carrier 22, and the tip surface of the support rod 18 places and supports the package body 4 from the lower surface side.

Further, the package body 4 thus pushed up is abutted against the lower surface of the reference plate 2, that is, the abutting reference surface 2a, as shown in FIGS. At this time, the upper surface side of the package body 4 is abutted against the abutting reference surface 2a of the reference plate 2. Here, as described above, the parallelism between the upper and lower surfaces of the package body 4 is not sufficiently guaranteed. Therefore, even if the abutting reference surface 2a of the reference plate 2 and the tip end surface of the support rod 18 are arranged in parallel,
In a configuration in which the upper surface of the package body 4 is simply abutted against the reference plate 2, the upper surface of the package body 4 and the abutting reference surface 2a of the reference plate 2 are not formed in parallel. A gap is generated between them, and as a result, there arises an inconvenience that the semiconductor chip is not mounted with high precision on the basis of the upper surface side of the package body 4. Therefore, in the present embodiment, such inconvenience is solved as follows.

That is, from the state where the package body 4 is abutted against the reference plate 2, the support plate 8 is further raised by the driving force of the motor 6. At this time, since the package body 4 has already abutted against the reference plate 2, only the L-shaped plate 10 rises against the elastic force of the spring 21 as the slide guide unit 9 slides. As a result, as shown in FIG. 3, the spherical washer 20 attached to the hanging rod 19 is disengaged from the fitting hole 10a of the L-shaped plate 10. The support rod 18 supported by 11 is in a state in which it can freely swing around the tip P of the support rod 18.

Therefore, even if the upper and lower surfaces of the package body 4 are not parallel to each other and the upper surface of the package body 4 pushed up by the support rod 18 is not parallel to the abutting reference surface 2a of the reference plate 2. The supporting rod 18 supported by the copying unit 11 swings about the tip portion P in the biaxial directions (x, y directions) orthogonal to each other, so that the entire package main body 4 hits the reference surface 2a. It follows the inclination, and thus the state in which the upper surface side of the package body 4 is inevitably pressed against the abutting reference surface 2a of the reference plate 2 without a gap is obtained.

When the package body 4 is abutted against the reference plate 2 in this manner, the chip holder 3 holding a semiconductor chip (not shown) descends. At this time, the chip holder 3 holds the semiconductor chip (not shown) by suction,
A semiconductor chip (not shown) is mounted on the package body 4 arranged there by advancing to the lower surface side of the reference plate 2 through the chip insertion hole 5. As a result, the semiconductor chip is mounted on the package body 4 abutted against the reference plate 2 with high accuracy, with the upper surface side as a reference.

As a result, in the color camera assembly process, for example, when the CCD image pickup device is attached to the color separation prism, since the semiconductor chip (CCD chip) is mounted on the upper surface side of the package body 4 as a reference, the color separation is performed. The parallelism of the CCD chip with respect to the light emitting surface of the color separation prism can be obtained with high accuracy simply by abutting the upper surface side of the package body 4 directly on the light emitting surface of the prism.

Further, in the die bonding apparatus 1 of this embodiment, it is possible to mount a semiconductor chip on the basis of the lower surface side of the package body 4 by the following procedure. That is, after the package body 4 placed on the carrier 22 is pushed up by the support rod 18, the driving of the motor 6 is stopped before the upper surface of the package body 4 abuts against the abutting reference surface 2a of the reference plate 2. In this state, since the spherical washer 20 attached to the lower end of the hanging rod 19 is engaged with the fitting hole 10a of the L-shaped plate 10 by the elastic force of the spring 21, the posture of the support rod 18 is in the upright state. Is held. Therefore, the chip holder 3 is lowered from this state, and the semiconductor chip sucked and held by the chip holder 3 is mounted on the package body 4 supported by the support rod 18 through the chip insertion hole 5 of the reference plate 2. By doing so, the semiconductor chip can be mounted based on the lower surface side of the package body 4 as in the conventional case. As a result, the semiconductor chip mounting operation based on the upper surface side of the package body 4 and the package body 4 are performed.
It becomes possible to carry out mixed production with semiconductor chip mounting work based on the lower surface side of the.

[0023]

As described above, according to the die bonding apparatus of the present invention, the semiconductor chip is mounted on the upper surface side of the package body as a reference. When the CCD image pickup device is attached, the parallelism of the CCD chip with respect to the light emitting surface of the color separation prism can be obtained with high accuracy only by directly abutting the light emitting surface of the color separation prism on the upper surface side of the package body. . As a result, when mounting the CCD image pickup device, the holder metal fittings and the like that have been conventionally used are not necessary, and it is not necessary to adjust the parallelism of the CCD chip with respect to the light emitting surface of the color separation prism. CCD in camera assembly process
It is possible to simplify the attachment adjustment work of the imaging device.

Further, in the present invention, when the package body mounted and supported on the tip end surface of the support rod is abutted against the reference plate, the support rod supported by the copying unit swings about its tip end as a rotation center. By doing so, the upper surface side of the package body is pressed against the abutting reference surface of the reference plate without a gap, so that the semiconductor chip is always referenced with the upper surface side of the package body as a reference regardless of the parallelism of the upper and lower surfaces of the package body. Can be implemented with high accuracy.

[Brief description of drawings]

FIG. 1 is a perspective view of an essential part showing an embodiment of a die bonding apparatus according to the present invention.

FIG. 2 is a perspective view illustrating a configuration of a copying unit in a push-up mechanism.

FIG. 3 is a schematic side view illustrating the operation of the die bonding apparatus in the example.

FIG. 4 is a perspective view of an essential part for explaining the operation of the die bonding apparatus in the example.

FIG. 5 is a perspective view of a main part of a conventional die bonding apparatus.

[Explanation of symbols]

 1 Die Bonding Device 2 Reference Plate 2a Abutting Reference Surface 3 Chip Holder 4 Package Body 5 Chip Insertion Hole 11 Copying Unit 18 Support Rod

Claims (1)

[Claims] 1. A die-bonding apparatus for mounting a semiconductor chip on a package body having an opening at the top, which has a chip insertion hole formed corresponding to the size of the package body, and the lower surface side is abutted against a reference surface. The reference plate, a chip holder arranged above the reference plate so as to be able to advance to the lower surface side of the reference plate through the chip insertion hole, and a package arranged below the reference plate so as to be vertically movable. A push-up mechanism, wherein the package push-up mechanism has a support rod that mounts and supports the package body from the lower surface side at its tip surface, and the support rod in the two axial directions orthogonal to each other with the tip portion of the support rod as the center of rotation. A die bonding apparatus comprising: a copying unit that swingably supports a rod.