JPH11135992A - Components mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely confirm the holding condition of components from the image thereof taken by a TV camera by forming a vertical through-hole through component carrying means so that this hole may not obstruct the photographing of the camera from above. SOLUTION: An LD chip 17 is generally smaller than other components. When it is sucked from above by a suction collet 4, other TV camera must photographs obliquely. To cope with this, the collet 4 sucks the chip 17 from obliquely above and the head 21 on the collet 4 is provided with a vertical through-hole 21a for photographing it by a camera 5, without providing other TV camera.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting a leadless chip component at a predetermined position on a workpiece such as a substrate.

[0002]

2. Description of the Related Art FIGS. 26 and 27 show a conventional component mounting apparatus, in which a supply station 1 and a mounting station 3 are arranged in a horizontal direction. The supply station 1 has an xy stage on which components are set in advance, and the mounting station 3 has an xy stage on which a workpiece such as a substrate on which components are mounted at predetermined positions is set in advance. A head 6 movable horizontally between the stations 1 and 3 and up and down is disposed above the stations 1 and 3, and a tip of the head 6 sucks a component in the supply station 1 as shown in FIG. Then, a suction collet 4 for transporting to the mounting station 3 is attached. The suction collet 4 is rotatable in the θ direction.

A TV camera 5-1 is fixed above the supply station 1, and above the mounting station 3 and below the head 6, a TV camera 5-2 for picking up an image of the head 6 and the mounting station 3 are mounted. A TV camera 5-3 that captures an image of the top is integrally movably arranged in the horizontal direction.

In such a configuration, when a component is transported from the supply station 1 to the mounting station 3 and the position of the component is aligned with the work on the mounting station 3 side, first, the supply image picked up by the TV camera 5-1 is supplied. Based on the image in the station 1, the stage of the supply station 1 is moved in the xy directions so that the supply component comes to the suction position of the head 6, and then the head 6 descends in this state to suction the supply component, and then suction. In this state, it moves upward, then moves horizontally and waits at a position above the mounting station 3.

When the head 6 has moved above the mounting station 3, the TV cameras 5-2 and 5-3
In this state, the TV cameras 5-2 and 5-5 are moved in order to align the parts supported by the suction collet 4 with the work on the mounting station 3. The suction collet 4 is rotated in the θ direction on the basis of the image captured by 3. Next, after retreating the TV cameras 5-2 and 5-3 from between the head 6 and the mounting station 3, the head 6 is lowered to mount the component at a predetermined position on the work.

[0006]

However, in the above-described conventional component mounting apparatus, when the state in which the suction collet 4 is sucking the component is checked by imaging with the TV camera 5-1, when the component is extremely small, If the suction is performed from directly above by the suction collet 4, it is necessary to take an image obliquely by another fourth TV camera, and there is a problem that the cost is increased. It is desirable that the suction hole of the suction collet 4 is as small as possible in order to stably suck the component. However, if the suction hole is made as small as possible and the component sucked by the suction hole is to be imaged from above, However, since there is a limit in making the outer shape of the suction collet 4 smaller than the outer shape of the component, there is a problem that the image pickup signal is blurred by the vertical wall of the suction collet 4 and the component becomes difficult to catch. Also, as the size of the component becomes smaller, the image needs to be enlarged. In this case, since the depth of field becomes shallow, this phenomenon becomes remarkable.

In the above-described conventional component mounting apparatus, the head 6 temporarily stops at a position above the mounting station 3, and the cameras 5-2 and 5-3 are moved to the positions of the head 6 and the mounting station 3. Since the positioning is performed by taking an image, and then the cameras 5-2 and 5-3 are retracted and mounted, there is a problem that the component mounting time becomes long.
Further, since the cameras 5-2 and 5-3 are not fixed and are interrupted between the head 6 and the mounting station 3, the head 6
However, there is a problem that the vertical stroke becomes longer, so that the positioning accuracy is deteriorated.

The present invention has been made in consideration of the above-described conventional problems, and has as its object to provide a component mounting apparatus that can reliably capture and confirm a state in which components are held by a TV camera.

[0009]

According to the present invention, in order to achieve the above object, a through hole is formed in a vertical direction of a component conveying means. That is, according to the present invention, there is provided a component transport unit that holds and transports a component, and a TV camera that images a state in which the component is held by the component transport unit from above, and is held by the component transport unit. There is provided a component mounting apparatus in which a through-hole is formed in a vertical direction of the component conveying means so as not to hinder the imaging of the component from above by the TV camera.

According to the present invention, a first stage on which a component to be mounted is mounted, a second stage movable in x, y, and θ directions, and a work on which the component is mounted are mounted. A third stage to be transported from the first stage to the second stage, and the component is placed on the second stage, and then transported from the second stage to the third stage. Means for transporting components mounted on a workpiece, a TV camera for capturing at least the second and third stages from above, and a component for transferring the components to the second stage based on signals captured by the TV camera. The second stage is moved in the x, y, and θ directions so that the position of the component on the second stage and the position of the component on the work on the third stage are aligned when mounted on the second stage. And positioning means for moving the Further, there is provided a component mounting apparatus in which a through-hole is formed in a vertical direction of the component conveying means so as not to hinder the imaging of the component held by the component conveying means from above by the TV camera.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1 is an external view showing a main part of an embodiment of the component mounting apparatus according to the present invention, FIG. 2 is a plan view showing the component mounting apparatus of FIG. 1, FIG. 3 is a front view showing the component mounting apparatus of FIG. FIG. 4 is an explanatory diagram showing the operation of positioning by the correction stage shown in FIGS.

As shown in FIGS. 1 to 3, a supply station 1, a correction station 2, and a mounting station 3 are arranged horizontally from left to right, and at regular intervals in this order. The supply station 1 and the mounting station 3 each include a supply stage 1a movable in the xy directions.
And the correction stage 2 have x,
It has a correction stage 2a movable in the y and θ directions. TVs are located above these stations 1, 2, and 3, respectively.
The cameras 5-1, 5-2, and 5-3 are fixed, and the TV cameras 5-1 to 5-3 image components on the stages 1a to 3a, respectively.

A support member 20 is fixed above the stations 1 to 3 so as to extend in the horizontal direction. A head base 21 is attached to the support member 20 so as to be movable in the horizontal direction. Two suction collets 4a and 4b are attached to the head base 21 so as to be vertically movable,
The distance between the suction collets 4a and 4b corresponds to the distance between the supply station 1 and the correction station 2 and the distance between the correction station 2 and the mounting station 3.

In such a configuration, the suction collet 4
a reciprocates between the supply station 1 and the correction station 2, and the suction collet 4b
The parts are conveyed from the supply station 1 to the correction station 2 and from the correction station 2 to the mounting station 3 by reciprocating between the and the mounting station 3.

At this time, first, the suction collets 4a, 4b
Are located between the supply station 1 and the correction station 2 and between the correction station 2 and the mounting station 3, respectively, so as not to hinder the imaging of the TV cameras 5-1 to 5-3 as shown in FIGS. Waiting in the upper position.
Then, the operation of the suction collet 4a will be described.
First, the components on the supply stage 1a are imaged by the TV camera 5-1 and the supply stage 1
The supply component is positioned at the suction position by moving a in the xy directions. Next, after the suction collet 4a moves to the position of the supply station 1 in the horizontal direction and then descends to suck the supply components on the supply stage 1a, and then moves upward to move to the position of the correction station 2 in the horizontal direction, respectively, As shown in FIG. 3, it is lowered and mounted on the correction stage 2a.

In parallel with the operations of the TV camera 5-1 and the suction collet 4a, the components on the correction stage 2a and the mounting positions on the mounting stage 3a are imaged by the TV cameras 5-2 and 5-3, respectively. First, based on the image signal, the work is positioned by moving the mounting stage 3a in the xy directions, and then the x, y, and θ directions of the component are set in the mounting position on the work by moving the correction stage 2a. Is aligned with Next, after the suction collet 4b moves to the position of the correction station 2 in the horizontal direction, it descends to suck the components on the correction stage 2a, and then moves upward to move to the position of the mounting station 3 in the horizontal direction. As shown, it is lowered and mounted on a predetermined position of the work on the mounting stage 3a.

FIG. 4 (a) shows an image before the positioning taken by the TV cameras 5-2 and 5-3, and the position of the component on the correction stage 2a and the mounting on the work on the mounting stage 3a. The position is different. Therefore, the characteristics of the component on the correction stage 2a are extracted, and the components are extracted by the correction stage 2a as shown in FIG. 4B so that the characteristic matches the position to be mounted on the work on the mounting stage 3a. Position in the x, y, and θ directions.

Therefore, according to such a configuration, although the component goes through the correction stage 2a, the TV camera 5
Since -2 and 5-3 do not move, the component mounting time can be greatly reduced as compared with the conventional example, and the alignment accuracy can be improved. In addition, according to the above configuration, the suction collets 4a and 4b move simultaneously to simultaneously move the components from the supply station 1 to the correction station 2 and the components from the correction station 2 to the mounting station 3, respectively. Can be shortened. Although the component mounting time will be somewhat longer,
The number of the suction collets 4a and 4b may be one.

According to the above configuration, parts having various characteristics can be mounted on the work. FIG. 5 shows a light-emitting / light-receiving assembly mounted on an optical pickup main body as an example of components mounted on the component mounting apparatus according to the present invention. The light emitting / receiving assembly includes a resin package 14 in which a lead frame 13 is sealed, and a photodiode chip 1 mounted on the lead frame 13.
2, a submount member 11 and a micromirror 15 mounted on the photodiode chip 12, and a semiconductor laser chip 17 mounted on the submount member 11.
And a hologram element 16 mounted on the resin package 14. When such an assembly is mounted on the optical pickup main body, the laser light emitted from the semiconductor laser chip 17 is reflected by the 45 ° reflecting surface of the micro mirror 15, and the reflected light is not shown via the hologram element 16. The light is condensed by the objective lens and irradiated on the disk surface, and the reflected light is received by the light receiving surface of the photodiode chip 12 via the hologram element 16.

When assembling such a light emitting / receiving assembly, first, a submount member (hereinafter, also referred to as SM) 11 is mounted on a photodiode chip (hereinafter, also referred to as PD) 12 by a first component mounting apparatus. The semiconductor laser chip (hereinafter, also referred to as LD) 17 is mounted on the sub-mount member 11 by the second component mounting device, and then mounted by the third component mounting device. Micro mirror (hereinafter M
Also called M. ) 15 is mounted on the PD chip 12. Next, the photodiode wafer is diced for each PD chip 12, and the PD component is then diced by a fourth component mounting apparatus.
The chip 12 is mounted on the resin package 14, and then the hologram element 16 is mounted on the resin package 14 by a fifth component mounting device.

The basic structure of the above-described first to fifth component mounting apparatuses is the same as that of FIGS. 1 to 3, but the configuration is slightly different depending on the mounted components as described later. FIG. 6 shows a first component mounting apparatus, and as shown in detail in FIG.
An SM sheet 31 in which a number of SM chips 11 are supported by an adhesive tape in advance is set on a, and a PD wafer 32 is set on the mounting stage 3a. The PD wafer 32 is supported by a PD pallet 33 as shown in FIG.
3 is positioned with respect to the positioning pins 34 on the mounting stage 3a side. Then, as shown in FIG. 8, each SM chip 11 is mounted at a mounting position on the PD chip 12 constituting the PD wafer 32 where an adhesive is applied in advance.

Here, as shown in FIG. 9, when a large number of SM chips 11 (chip components) adsorb one SM chip 11 from the SM sheet 31 supported by the adhesive tape 31a by the suction collet 4a, the adhesive is used. Tape 31a
A method is known in which the SM chip 11 is raised from the adhesive tape 31a by abutting a pin 36 from the back surface of the SM chip 11 and sucked. In such a method, it is necessary to take an image of the tip of the pin 36 with the TV camera 5-1 and adjust the position of the pin 36 and the suction position of the suction collet 4a in advance. TV camera 5
No image can be obtained even if the image is taken with -1. Therefore, in the first component mounting apparatus that handles components supported by the adhesive tape 31a, the tip of the pin 36 can be imaged by ring illumination (shown in FIG. 37) on the supply stage 1a as shown in FIG. it can. Note that the TV camera 5-1 may capture an image obliquely.

FIG. 10 shows a second component mounting apparatus, and FIG.
As shown in FIG. 1A, an LD sheet 37 on which a large number of LD chips 17 are supported in advance by an adhesive tape is set on the supply stage 1a. In addition, mounting stage 3
As shown in FIG. 11B, a PD wafer 32 supported by a PD pallet 33 is set on a as shown in FIG. 11B. Then, as shown in FIG. 12, the LD chip 17 is mounted on the mounting position of the SM chip 11 mounted on the PD wafer 32 where the adhesive is applied in advance. Similarly, in the second (and later described) component mounting apparatus, since the LD chip 17 is supported by the adhesive tape, the supply stage 1a is configured to be ring-illuminated.

Here, since the parts are conveyed between the stations while being sucked by the suction collets 4a and 4b,
Although there is a possibility that the positioning accuracy may be degraded during the conveyance in the suction state, depending on the components, very high positioning accuracy may be required in one direction and may not be required in the other direction. The LD chip 17 is one example, and as shown in FIG. 13, high accuracy is required in the emission direction (Y direction) of the laser beam, but high accuracy is not required in the X direction. Therefore, in the second component mounting apparatus, conveyance is performed in the X direction, in which extremely high positioning accuracy is not required, in a suction state.

The feature of a component serving as a reference for positioning is usually the outer shape of the imageable component or the pattern of the upper surface. Such a feature is located on the surface opposite to the suction surface. There are also parts. In the case of such a part, a method of temporarily stopping while moving between stations and taking an image of the opposite side of the part with another fourth camera to extract the feature can be considered. And costly. Therefore, for example, the LD chip 1 as a mounting component
In the case where 7 is such a component, the correction stage 2a is replaced with a transparent glass as shown in FIG.
The TV camera 5-2 captures an image of the part from below through the glass to extract the feature.

When a part is sucked and conveyed by the suction collets 4a and 4b, it is necessary to take an image with a camera to check whether the part is actually sucked. However, since the LD chip 17 is generally much smaller than other components, as shown in FIG.
When the suction collet 4 sucks 7 from directly above, an image must be obliquely picked up by another fourth TV camera. Therefore, in this second component mounting apparatus, FIG.
As shown in (b), another TV camera is provided by the suction collet 4 sucking the LD chip 17 from obliquely above and forming a vertical through hole 21a in the head 21 above the suction collet 4. Without camera 5-1
An image can be taken according to 5-3.

It is desirable that the suction hole of the suction collet 4 be as small as possible in order to stably suck the parts. However, make the suction hole as small as possible,
Further, when an image of the component sucked by the suction hole is to be taken from above, there is a limit to making the outer shape of the suction collet 4 smaller than the outer shape of the component as shown in FIG. Due to the vertical wall of the suction collet 4, the components are blurred and components are difficult to catch. Also, as the size of the component becomes smaller, the image needs to be enlarged. In this case, since the depth of field becomes shallow, this phenomenon becomes remarkable. Therefore, as shown in FIG. 16B, by forming the wall surface of the suction collet 4 near the component 17 being sucked by the suction hole at an angle, blurring due to the wall surface of the suction collet 4 is prevented, and the component is lifted. Can be reliably captured.

FIG. 17 shows a third component mounting apparatus, and FIG.
As shown in FIG. 8A, an MM sheet 38 on which a large number of MM chips 15 are supported in advance by an adhesive tape is set on the supply stage 1a. In addition, mounting stage 3
As shown in FIG. 18 (b), the P supported by the PD pallet 33 is similar to the first and second component mounting devices.
The D wafer 32 is set. Then, as shown in FIG. 19, the MM chip 15 is mounted on the PD chip 12 mounted on the PD wafer 32 at a predetermined position where an adhesive is applied in advance. Similarly, in the third component mounting apparatus, since the MM chip 15 is supported by an adhesive tape, the supply stage 1a is configured to be ring-illuminated.

Here, the MM chip 15 is formed with a 45 ° reflecting surface for reflecting the laser light emitted from the LD chip 17 in parallel with the mounting surface, directly above, and the optical axis of the reflected light. Must match the objective lens on the optical pickup body side. When the distance between the MM chip 15 and the LD chip 17 is shifted, the optical axes do not match, but FIG.
As shown in (1), when the position of the tip of the MM chip 15 is imaged as a feature and alignment is performed, the optical axes do not coincide due to the variation in the chamfering of the tip of the MM chip 15.

Therefore, on the correction stage 2a of the third component mounting apparatus, a dummy component 39 having a horizontal ridge line at a position corresponding to the LD chip 17 is arranged as shown in FIG. At the same time, the light source 40 is arranged behind the dummy component 39, and the TV camera 5-2 captures an image of the silhouette 39a of the horizontal ridge line of the dummy component 39 reflected by the MM chip 15. At this time,
If the distance of the MM chip 15 from the horizontal ridge line of the dummy component 39 is shifted, the silhouette 39a imaged by the TV camera 5-2 is shifted by that amount. 39a is also rotated by that amount, so that the position adjustment in the x, y, and θ directions is performed so that the silhouette 39a is at a predetermined position and a predetermined angle.

As described above, the PD wafer 32 on which the SM chip 11, the LD chip 17, and the MM chip 15 are mounted by the first to third component mounting apparatuses is sent to the adhesive curing step, and the respective chips 11, 17 , 15 are fixed,
Next, the wafer is sent to a dicing process,
It is cut for each D chip 12 and then sent to a fourth component mounting apparatus.

FIG. 21 shows a fourth component mounting apparatus, and FIG.
As shown in FIG. 2A, a dicing plate 41 on which a PD wafer 32 cut in advance for each PD chip 12 is set on the supply stage 1a. An LF pallet 42 is set on the mounting stage 3a as shown in FIG.
2 supports a large number of resin packages 14 each having a lead frame (LF) 13 sealed therein. Then, as shown in FIG. 23, an Ag paste is previously applied to a mounting position in the resin package 14, and then the PD chip 12 is mounted at this applying position. When the mounting of the LF pallet 42 on all the resin packages 14 is completed, the LF pallet 42 is sent to an Ag paste curing process to fix the PD chip 12 and then the LD chip 17.
Then, wire bonding of each lead of the PD chip 12 and the lead frame 13 is performed, and then the lead is sent to the fifth component mounting apparatus.

FIG. 24 shows a fifth component mounting apparatus, and FIG.
As shown in FIG. 5A, a dicing plate 44 is set on the supply stage 1a.
Supports an HOE sheet 43 on which a number of hologram elements (HOE) 16 are supported in advance. Also,
As shown in FIG. 25B, an LF pallet 42 supporting the resin package 14 is set on the mounting stage 3a. Then, an adhesive is applied in advance to the mounting position in the resin package 14, and then the hologram element 16 is mounted in this application position.

[0034]

As described above, according to the present invention, since the through holes are formed in the vertical direction of the component conveying means, the state in which the components are held can be reliably imaged and confirmed by the TV camera. it can.

[Brief description of the drawings]

FIG. 1 is an external view showing a main part of an embodiment of a component mounting apparatus according to the present invention.

FIG. 2 is a plan view showing the component mounting apparatus of FIG. 1;

FIG. 3 is a front view showing the component mounting apparatus of FIG. 1;

FIG. 4 is an explanatory diagram showing an operation of positioning by the correction stage of FIGS. 1 to 3;

FIG. 5 is an external view showing a specific example of a mounted component.

6 is a plan view showing a component mounting apparatus when the submount of FIG. 5 is mounted.

FIG. 7 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 6;

FIG. 8 is an explanatory diagram showing a mounting state in the component mounting apparatus of FIG. 6 in detail.

FIG. 9 is an explanatory view showing a ring light source in the component mounting apparatus of FIG. 6 in detail.

FIG. 10 is a plan view showing a component mounting apparatus when the LD chip of FIG. 5 is mounted.

FIG. 11 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 10;

FIG. 12 is an explanatory diagram showing a mounting state in the component mounting apparatus of FIG. 10 in detail.

FIG. 13 is an explanatory diagram showing in detail a transport direction of an LD chip by the component mounting apparatus of FIG. 10;

FIG. 14 is an explanatory diagram showing a correction stage in the component mounting apparatus of FIG. 10 in detail.

FIG. 15 is a configuration diagram showing a conventional example and a head in the component mounting apparatus of FIG. 10;

FIG. 16 is a configuration diagram showing a suction collet in the conventional example and the component mounting apparatus of FIG. 10;

FIG. 17 is a plan view showing a component mounting apparatus when the micromirror chip of FIG. 5 is mounted.

18 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 17;

FIG. 19 is an explanatory diagram showing a mounting state in the component mounting apparatus of FIG. 17 in detail.

20 is an explanatory diagram showing in detail a positioning method in the component mounting apparatus of FIG. 17;

FIG. 21 is a plan view showing a component mounting apparatus when the PD chip of FIG. 5 is mounted.

FIG. 22 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 21;

FIG. 23 is an explanatory diagram showing a mounting state in the component mounting apparatus of FIG. 21 in detail.

24 is a plan view showing a component mounting device when the hologram element of FIG. 5 is mounted.

FIG. 25 is an explanatory diagram showing in detail a mounted component and a work in the component mounting apparatus of FIG. 24;

FIG. 26 is an external view showing a conventional component mounting apparatus.

FIG. 27 is an explanatory diagram showing a mounting process by the component mounting apparatus of FIG. 26;

[Explanation of symbols]

1a Supply stage (first stage) 2a Correction stage (second stage) 3a Mounting stage (third stage) 4a, 4b Suction collet (component transfer means) 5-1 5-2-5 TV camera (Positioning means)

Claims (3)

[Claims] 1. A component conveying means for holding and conveying a component, and a TV camera for imaging a state in which the component is held by the component conveying device from above, and being held by the component conveying means. Replace the part with the TV
A component mounting apparatus in which a through-hole is formed in a vertical direction of the component transporting means so as not to hinder an image taken from above by a camera. 2. A first stage on which a component to be mounted is mounted, a second stage movable in x, y, and θ directions, and a third stage on which a workpiece on which the component is mounted is mounted. And a stage, wherein the component is transported from the first stage to the second stage and placed on the second stage, and the component is transported from the second stage to the third stage and placed on the workpiece. A component conveying means to be placed; a TV camera for capturing at least the second and third stages from above; and a component mounted on the second stage based on a signal captured by the TV camera. The second stage so that the component position on the second stage and the placement position on the workpiece on the third stage are aligned when the
And a positioning means for moving the stage in the x, y, and θ directions.
A component mounting apparatus in which a through-hole is formed in a vertical direction of the component transporting means so as not to hinder an image taken from above by a camera. 3. The device according to claim 2, wherein the component conveying means has a suction collet for sucking and holding the component, and is configured to be inclined so as not to hinder the imaging of the suction collet from above by a TV camera. The component mounting device according to claim 1.