JP3252344B2 - Chip positioning device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip positioning device for positioning a chip in a bonding apparatus while being suctioned from above, in a bonding apparatus.
It was developed mainly with a focus on a chip positioning device in a flip chip bonding device.

[0002]

2. Description of the Related Art In a bonding apparatus, particularly a flip chip bonding apparatus, accurate positioning is performed by image processing before bonding. However, in order to perform accurate positioning, the magnification of the image processing camera becomes large, and a chip may be displaced to make it impossible to detect a target portion. Therefore, it is a reality that prior positioning for performing image processing is required before positioning by image processing.

Conventionally, as a positioning device for preparing image processing, there have been a method of positioning a chip by detaching it from a bonding tool and a method of positioning a chip while holding the chip on the bonding tool. The latter method is considered preferable in reducing the number of bonding steps,
A chip positioning device according to the present invention performs positioning while a bonding tool holds a chip from above.

The specific method of positioning the chip while holding it from above is as shown in FIGS. 2 and 3. The IC chip 9 is taken out by a vacuum using a bonding tool 3, and is placed in a pre-alignment jig 10. Then, the IC chip 9 sucked and held by the bonding tool 3 is lowered. Thereafter, the pre-alignment jig 10 is moved in the direction of the IC chip 9, pressed against the side surface of the IC chip 9, and is biased to position the IC chip 9.

[0005] However, with this means, if the height of the lowering of the bonding tool 3 is incorrectly set, the prealignment jig 10 and the bonding tool 3 interfere as shown in FIG. There was a risk that the alignment jig 10 would be damaged.

[0006]

SUMMARY OF THE INVENTION The present invention is directed to a method for preventing a pre-alignment jig and a bonding tool from interfering with each other.
An object of the present invention is to prevent the position holding means of the pre-alignment jig from coming off and prevent the bonding tool and the pre-alignment jig from being damaged.

[0007]

In order to achieve the above object, the present invention provides a bonding apparatus for positioning a chip while holding the chip from above by a bonding tool. A chip positioning device characterized in that the alignment jig is slidably mounted on a base and, at the same time, a position holding means is provided between the pre-alignment jig and the base so as to be released by interference between the bonding tool and the pre-alignment jig. Is provided.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view of a bonding apparatus to which the present invention is applied. The bonding apparatus shown in FIG. 1 is a flip-chip bonding apparatus, which flips up and down according to a Z-axis driving device 1. A tool 3 (here, a heat tool) that rotates according to the axis driving device 2 and an X-axis stage 4
And a substrate stage 6, a chip tray 7, and a chip positioning device 8 which move left and right by the operation of the Y-axis stage 5.

The chip positioning device 8 in the bonding apparatus is shown in the plan view of FIG. 5 and the cross-sectional view of FIG. 6, where 10 is a pre-alignment jig, and the pre-alignment jig 10 is located at the center. Provide a rectangular recess,
A chip positioning surface 18 is formed on the four sides inside the concave portion, and is fixed on the jig table 12.

In FIG. 1, reference numeral 11 denotes a base, and a jig table 12 is mounted on the base 11 so as to slide and stop and hold. Linear bearing 13 as slide mechanism
And a jig table 1 as a position holding means.
2, a spring plunger 14 provided on the lower surface and a position holding hole 15 formed in the base 11 at the corresponding position are used. When the spring plunger 14 receives a pressure higher than the pressure for positioning the tip 9, the position holding hole 15
The position of the jig table 12 is held with a light force that deviates more.

In the figure, reference numeral 17 denotes a detection sensor provided on the base 11 as a means for detecting the release of the position holding means.
Is a sensor dog provided on the lower surface of the jig table 12 at the position where the detection sensor 17 is disposed, and is set so that the detection sensor 17 is turned ON (or OFF) at the held position.

Next, the operation of the chip positioning device 8 will be described. When the X-axis stage 4 and the Y-axis stage 5 move while the bonding tool 3 is retracted upward, and the bonding tool 3 comes to a position above the chip tray 7, the bonding tool 3 is moved to the Z-axis driving device. 1
The chip 9 is sucked and held from above, and then rises.

Thereafter, when the bonding tool 3 is positioned above the pre-alignment jig 10 by the operation of the X-axis stage 4 and the Y-axis stage 5, both stages are stopped, and the bonding tool 3 is It is lowered by operation. The downward movement in the Z-axis direction ends when the chip 9 enters the recess of the pre-alignment jig 10.

At this height, the X-axis table 4 and the Y-axis table 5 are operated again, and the chip 9 sucked by the bonding tool 10 is pressed against the chip positioning surface 18 formed inside the pre-alignment jig 10. The chip 9 is positioned. The positioned chip 9 then proceeds to an image processing step.

If the Z-axis position is too low during the positioning operation and the bonding tool 3 and the pre-alignment jig 10 interfere with each other, the X-axis table is moved in the same direction after the bonding tool 3 contacts the pre-alignment jig 10. 4 or Y
When the axis table 5 moves, the pre-alignment jig 10
Is only held in the positioning hole 15 by the spring plunger 14, so that the spring plunger 14 is disengaged from the positioning hole 15 and slides along the slide mechanism including the linear motion bearing 13.

At this time, the sensor dog 16 provided on the lower surface of the jig table 12 is disengaged from the detection sensor 17, and the release of the holding unit is detected by the control unit of the bonding apparatus, and the operation of the bonding apparatus itself is stopped. .

[0017]

When the pre-alignment jig 10 and the bonding tool 3 interfere with each other, the position holding means comes off and the pre-alignment jig 10 is retracted, so that the pre-alignment jig 10 and the bonding tool 3 can be prevented from being damaged.

An effect of the embodiment of the present invention is that a detection sensor for detecting the release of the position holding means is provided, and when the release of the pre-alignment jig is detected, the bonding tool and the pre-alignment jig are used. Is controlled so as to stop the relative movement of the bonding tool and the pre-alignment jig, so that the breakage of the bonding tool and the pre-alignment jig can be more effectively prevented.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a bonding apparatus to which the present invention is applied.

FIG. 2 is a sectional view showing a relationship between a pre-alignment jig and a chip.

FIG. 3 is an explanatory view of the plane.

FIG. 4 is an explanatory diagram showing interference between a pre-alignment jig and a bonding tool.

FIG. 5 is a plan view of a pre-alignment jig according to the present invention.

FIG. 6 is a sectional view of the same.

[Explanation of symbols]

 1. . . 1. Z-axis drive device . . Θ axis drive device 3. . . Tools 4. . . X-axis stage . . 5. Y-axis stage . . Substrate stage 7. . . 7. Chip tray . . 8. Chip positioning device . . Tip 10. . . Pre-alignment jig 11. . . Base 12. . . Jig table 13. . . Linear motion bearing 14. . . Spring plunger 15. . . Position holding hole 16. . . Sensor dog 17. . . Detection sensor 18. . . Chip positioning surface

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60

Claims (1)

(57) [Claims] In a bonding apparatus for positioning a chip while holding the chip from above by a bonding tool, a pre-alignment jig having a chip positioning surface formed on an inner surface is slidably mounted on a base, and at the same time, a pre-alignment is performed. A chip positioning device, comprising: a position holding unit that is released between a jig and a base by interference between a bonding tool and a pre-alignment jig.