TWM629742U - Pre-alignment device for thin substrate - Google Patents

Abstract

The present invention refers to a pre-alignment device for thinning a substrate, wherein the pre-alignment device has a base, and the base is provided with a drive unit and a sensor unit that are allowed to selectively relative displacement , the drive unit has an output shaft that extends through the base and is rotated, and the output shaft is provided with a substrate platform for placing the thinned substrate, and the substrate platform can be selectively generated to attract the The electrostatic field of the thinned substrate, and the sensor unit can detect the orientation notch of the thinned substrate placed on the substrate platform within the detection range, so as to perform the orientation of the thinned substrate pre-alignment, thereby making The substrate platform can generate an electrostatic field relative to the thinned substrate, so that the thinned substrate can be completely flatly attached to the substrate platform, which can improve the accuracy of the thinned substrate when performing pre-alignment, and reduce the failure of pre-alignment. The number of times of re-inspection occurs due to the needle, thereby improving the process yield.

Description

Pre-alignment device for thinning substrates

The present invention belongs to the technical field of positioning of thinned substrates, in particular, a pre-alignment device for thinned substrates, so as to reduce the influence of warpage of the pre-aligned device due to thinned substrates, so as to improve the detection orientation of the pre-alignment device. Accuracy and detection efficiency.

Press, when performing various processing operations (such as inspection, imaging, printing, laser or dicing, etc.) on substrates (such as semiconductor wafers or glass filters, etc.), due to any misalignment during the processing flow, it will lead to Serious and irreparable defects that must scrap the substrate such as a wafer, so the substrate must be oriented before entering the process flow, and the methods used to identify the substrate orientation include placing orientation scores on the perimeter of the substrate Such as Notch or Flat, and use a pre-alignment device to rotate the substrate, so that the sensor can detect these directional nicks to determine the substrate in the mechanical equipment of the processing process. The correct position, otherwise it will lead to the failure of the subsequent processing flow, the pre-alignment device can be an independent device or a part of the process equipment;

In recent years, due to the miniaturization of semiconductor processes, such as memory and power devices, their miniaturization is developing towards smaller size, higher performance and lower cost. In order to make the wafer area smaller, semiconductor The design scheme adopted by the industry is to replace the original horizontal chip design with a vertical stacking method, which is the so-called 3D IC stacking package. Due to 3D IC Stacked packages are stacked vertically. Through-Silicon Via (TSV) technology is used to physically and electrically connect various functional chips in the IC package. Therefore, the thickness of the wafer will be compressed to less than 100 microns. In addition, in recent years, the photographic quality of smartphones is comparable to that of professional SLR cameras, and one of the keys to the substantial improvement in the image quality of smartphone camera lenses is the introduction of ultra-thin blue glass filters into the camera lenses of mobile phones, which can absorb excess infrared light. Light, restore the true color of the object.

Whether the aforementioned thinned substrate is a thinned wafer or an ultra-thin filter, when the thickness is less than 200 μm, 100 μm or even less than 50 μm, and the surface area is larger (such as 8 inches, 12 inches or more semiconductor wafers) , Because the multi-composite crystal back material has different ductility for each metal, especially after grinding, polishing, and annealing, there are more changes, resulting in the phenomenon of warpage. In the prior art, during the pre-alignment step, a gripping device with a vacuum chuck (Fork), such as a robotic arm (Robot), is used to load the substrate to the substrate platform of the pre-alignment device that is independent or part of the process machine , and the suction holes formed on the surface of the substrate platform are used to generate a vacuum suction force relative to the substrate to fix it for subsequent rotation of the substrate platform to detect the notch (Notch) or flat edge (Flat) on the substrate for orientation. As shown in FIG. 1, when the warpage of the thinned substrate (100) is large, the suction port (201) corresponding to the substrate platform (200) will not be covered and exposed to the air, and the airflow will flow to the These uncovered suction ports (201) make those covered suction ports (201) not have enough vacuum suction to grab the substrate (100), so that the thinned substrate (100) cannot be completely flat on the substrate platform (200). ) surface, in addition to possibly inaccurate pre-alignment due to flatness issues, chipping is more likely to occur during the rotation of the substrate platform (200). Furthermore, the change of the stress that can be endured inside the thinned substrate will also become smaller. When the vacuum suction force is too large, internal cracks may occur in the thinned substrate (100), and the thinned substrate (100) may be easily damaged. The adsorption traces left on the surface of the suction port (201) may affect the subsequent quality and yield of the thinned substrate (100).

In other words, when the existing pre-alignment process is used to deal with the thinned substrate, the phenomenon of insufficient vacuum suction and uneven suction due to the warpage of the thinned substrate will result in insufficient vacuum suction to grasp the thinned substrate, which will cause the thinned substrate to be Inaccurate detection and poor alignment efficiency occur during pre-alignment, or even chipping or fragmentation, or internal cracks or suction marks due to excessive suction, both of which will affect the yield and efficiency of subsequent processes. Therefore, how to overcome The above-mentioned pre-alignment problem of thinned substrates is expected by the industry and users, and it is also the solution that this creation intends to explore.

In view of the above-mentioned shortcomings, the creator believes that it is necessary to correct it, so with years of experience in related technologies and product design and manufacturing, adhering to the good design concept, research and improvement for the above shortcomings, after continuous efforts, the trial work was finally successfully developed. A pre-alignment device for thinned substrates, so as to overcome the troubles and inconveniences faced by the existing thinned substrates during pre-alignment.

Therefore, the main purpose of the present invention is to provide a pre-alignment device for thinning substrates, which can provide a stable and uniform adsorption force on the thinned substrates by the pre-alignment device, and can effectively flatten warped thin substrates step by step. The thinned substrate can be further greatly enhanced by the pre-alignment device's adsorption effect on the thinned substrate.

In addition, another main purpose of the present invention is to provide a pre-alignment device for thinned substrates, so as to provide a stable grasping force for thinned substrates, so as to improve the accuracy of pre-alignment of thinned substrates, and to shorten the The alignment time of the subsequent process and the phenomenon of re-alignment are reduced, thereby improving the process efficiency and yield.

Furthermore, the second main purpose of the present invention is to provide a pre-alignment device for thinned substrates, which enables the thinned substrates to be effectively aligned during pre-alignment. position, which can avoid the chipping phenomenon of the thinned substrate during high-speed rotation and pre-alignment, so as to reduce unnecessary losses.

Based on this, this creation mainly realizes the aforementioned purpose and effectiveness through the following technical means; it includes at least:

a machine base;

A substrate stage, which is mounted on the drive unit described later, the top surface of the substrate stage has a first bonding plate surface for placing the thinned substrate, and a static electricity can be selectively generated inside the first bonding plate surface A plurality of electrodes of the field, and the outer diameter of the substrate platform is smaller than the range of the directional notch of the thinned substrate, and larger than the radius of the thinned substrate, so that the edge with the directional notch can be supported to be flat when the thinned substrate is adsorbed shape;

A drive unit is disposed in the base, and the drive unit has a rotary drive group with an output shaft extending through the base, and the substrate platform can be fixed to the end of the output shaft part, so that the substrate platform can be driven synchronously by the rotation of the output shaft of the rotary drive group;

A sensor unit is disposed on the base, the sensor unit has a read head, and the read head has an optical sensor facing the upper surface of the substrate platform, and the optical sensor can Directional scribes of the thinned substrate placed on the substrate platform are sensed within the detection range.

Thereby, the pre-alignment device used for the thinned substrate of the present invention can generate an electrostatic field facing the thinned substrate through the first bonding plate of the substrate platform, so that the electrostatic field can gradually lift up the thinned substrate Pull down and flatten, so that the thinned substrate can be completely flat on the upper surface of the first bonding plate, and be firmly adsorbed, so as to avoid the phenomenon of the thinned substrate falling off during the pre-rotation alignment, and further improve the Thinning the accuracy of the pre-alignment of the substrate reduces the number of re-inspections due to inability to pre-align the needle, thereby improving process efficiency and yield.

In order to enable your reviewers to further understand the composition, features and other purposes of this creation, some preferred embodiments are listed below, and are described in detail with the drawings, and at the same time, those who are familiar with the technical field can implement it.

S11: Provide a thinned substrate with directional notch on the edge

S12: Use a grabbing device to move the thinned substrate into a pre-alignment device

S13: Generate an electrostatic field on the thinned substrate by the pre-alignment device

S14: Perform orientation by rotating the thinned substrate to detect the orientation nicks

S15: Pre-adsorb the thinned substrate through the grabbing device and then release the electrostatic field to remove the thinned substrate

100: Thinning the substrate

105: Orientation Score

106: Notch

107: Flat edge

10: base

11: Opening

20: Substrate Platform

21: The first joint board surface

22: Electrodes

23: Perforation

24: Top material group

25: Second joint board surface

28: Fork Slotting

30: Drive unit

31: Rotary drive group

32: Output shaft

33: Lifting drive group

34: Extension rod

35: Moving Mechanisms

40: Sensor unit

41: read head

42: Optical sensor

45: Moving Mechanisms

60: Base plate teeth

Fig. 1 is a partial cross-sectional schematic diagram of a conventional pre-alignment device using vacuum adsorption to fix a thinned substrate.

Figure 2A: is a schematic view of the appearance of a thinned substrate with directional nicks, illustrating that it is a state of notch-type directional nicks.

FIG. 2B is a schematic view of the appearance of a thinned substrate with directional nicks, illustrating that it is a state of flat-edge directional nicks.

Figure 3: A schematic diagram of the appearance of the pre-alignment device of this creation, for illustrating the state of the pre-alignment device and its relative relationship.

Figure 4: A partial cross-sectional schematic diagram of the pre-alignment device of the present creation, for illustrating its components and their relative relationship.

FIG. 5 is a schematic top plan view of another embodiment of the substrate platform in the pre-alignment device of the present invention.

Fig. 6: The flow structure of the pre-alignment method for thinning the substrate of the present invention.

Figure 7: The first action reference schematic diagram of the pre-alignment device of the present creation in actual use, for explaining the state of its moving into the thinned substrate.

Figure 8A: The second action reference schematic diagram of the pre-alignment device of the present creation in actual use, in order to illustrate the state of the electrostatic field generated by the pre-alignment device.

FIG. 8B : another reference schematic diagram of the second action of the pre-alignment device of the present invention in actual use, for illustrating the state of the flattening and thinning of the substrate.

Figure 9: The first stage of the actual use of the pre-alignment device for this creation The four-action reference diagram is used to illustrate the state of its rotation detection orientation.

Fig. 10 is a reference schematic diagram of the fourth action of the pre-alignment device of the present invention when it is actually used, to illustrate the state in which the pre-alignment device is removed from the thinned substrate.

The present invention is a pre-alignment device for thinning a substrate. The accompanying drawings illustrate the specific embodiment of the photomask holding container and its components, all about front and back, left and right, top and bottom, upper References to the lower part, and the horizontal and vertical, are for the convenience of description only, and do not limit the creation, nor restrict its components to any position or spatial orientation. The dimensions specified in the drawings and the description can be changed according to the design and requirements of the specific embodiments of the present creation without departing from the scope of the patent application of the present creation, so it is not affected by this structure in the patent application. limit.

The present invention is applied to the pre-alignment of thinned substrates. Please refer to FIG. 2. The thinned substrates (100) can be semiconductor wafers, ultra-thin optical filters, etc., and the thinned substrates (100) The perimeter has one or more directional notches (105), which can be selected from notches (106) [Notch], flat edges (107) [F1at], or combinations thereof, to improve thinning The accuracy of the substrate (100) in the pre-alignment process;

The pre-alignment device used in the present invention for the thinned substrate (100) may be a stand-alone device or a part of a process equipment, for the thinned substrate (100) to be oriented and aligned for inspection and/or It is used for process processing such as printing, laser or cutting, etc. As for the structural composition of the pre-alignment device, as shown in Figures 2 and 3, it at least includes a machine base (10), a substrate platform (20), a a drive unit (30) and a sensor unit (40), the base (10) may be a support mechanism, which can be used to set the drive unit (30) and the sensor unit (40), And the top surface of the base (10) has an opening (11) for a part of the driving unit (30) to extend therethrough, so as to assemble the aforementioned substrate platform (20), and allow the driving unit (30) to be connected with the The relative movement between the sensor units (40), and the base (10) can be of a type that can be independently fixed on the ground or a desktop, or a type that can be installed on the body of a process processing equipment;

The substrate platform (20) is mounted on a part of the top surface of the drive unit (30) passing out of the base (10), and the top surface of the substrate platform (20) has a surface for placing the thinned substrate (100). ) of the first joint plate surface (21), the first joint plate surface (21) has a plurality of electrodes (22) (as shown in Figure 4) that can selectively generate an electrostatic field inside, for connecting an electrostatic generation The control unit (not shown in the figure) selectively provides a power source for generating an electrostatic field, so as to utilize the electrostatic field generated by the electrodes (22) to provide the adsorption force of the first bonding plate surface (21) relative to the thinned substrate (100) , which can prevent the thinned substrate (100) from moving relative to the first bonding plate surface (21), and the outer diameter of the substrate platform (20) is smaller than the range of the thinned substrate (100) directional notch (105) and greater than One third of the diameter of the thinned substrate (100), when the thinned substrate (100) is attracted by the electrostatic field of the first bonding plate surface (21) of the substrate platform (20), the thinned substrate (100) The edge with the directional score (105) can be supported flat. Also according to some embodiments, the substrate platform (20) has a lifter group (24) that is selectively lifted and lifted to receive the thinned substrate (100), wherein the lifter group (24) may be located on the substrate platform (20). ) the single-column type of the axis or the equiangular equidistant multi-column type such as the three-column structure respectively on the substrate platform (20). The single-column type ejector group (24) is formed with a through hole (23) through the first joint surface (21) on the axis of the substrate platform (20), and the ejector can be selectively lifted and lowered A group (24) is arranged in the through hole (23) for ascending to receive the thinned substrate (100) (as shown in Figure 7), and the top surface of the top material group (24) has a second bonding plate surface (25), and the second joint plate surface (25) There are a plurality of electrodes (22) (as shown in Fig. 4) which can be selectively generated an electrostatic field inside, so as to use the electrostatic field generated by the electrodes (22) to provide the second bonding plate surface (25) relative to the thin plate The adsorption force of the thinned substrate (100) can prevent the thinned substrate (100) from moving relative to the second bonding board surface (25), and the height of the top surface of the second bonding board surface (25) is lower than or equal to the second bonding board surface (25) A top surface of a joint board surface (21), when the height of the top surface of the second joint board surface (25) is equal to the height of the top surface of the first joint board surface (21), the aforementioned first and second joint board surfaces ( 21, 25) can be rotated synchronously. Furthermore, as shown in FIG. 5, according to some embodiments, the substrate platform (20) is respectively formed with a fork slot (28) with opposite edge openings on both sides of the opposite axis, which can be used for substrate grabbing equipment such as machinery. One of the arm (Robot) fork (60) [Fork or End-effector] extends into;

And the drive unit (30) is arranged in the base (10), and the drive unit (30) has a rotary drive group (31), the rotary drive group (31) has a drive extending through the base (10) ) the output shaft (32) of the opening (11), and the aforementioned substrate platform (20) can be fixed to the end of the output shaft (32), so that the substrate platform (20) can be rotated by the drive group (31) to actuate the output shaft ( 32) The rotation is synchronously driven, and between the substrate platform (20) and the electrostatic generation control unit that actuates the first joint surface (21) electrode (22) to generate an electrostatic field, such as a collector slip ring (Slip Ring, also known as It is an electrical rotary joint] to maintain a rotary conduction. According to some embodiments, when the substrate platform (20) has an ejector group (24), the drive unit (30) further includes a lift drive group (33), and the lift drive group (33) has an extension The extension rod (34) of the perforation (23) is passed through the base plate platform (20), and the ejector group (24) can be fixed to the end of the extension rod (34), so that the ejector group (24) can be lifted and lowered The driving group (33) moves up and down to move up and down. Furthermore, the drive unit (30) can be disposed on the machine base (10) through a moving mechanism (35), such as a slide rail set that uses a motor and a lead screw to move and position, The drive unit (30) can drive the substrate platform (20) to selectively displace relative to the sensor unit (40), and the moving mechanism (35) can further enable the drive unit (30) to move relative to the base (10). ) is a selective movement of the X-axis, the Y-axis, the Z-axis or a combination thereof;

Furthermore, the sensor unit (40) is arranged on a side of the base (10) corresponding to the edge of the substrate platform (20), so that it is used to detect the thin film placed on the substrate platform (20). A chemical substrate (100), the sensor unit (40) can be an optical, image or mechanical detection technology, the sensor unit (40) of the present invention includes a read head (41), and the The read head (41) has an optical sensor (42) facing the upper surface of the substrate platform (20), and the optical sensor (42) can sense the edge orientation of the thinned substrate (100) within the detection range scoring (105) so that the sensor unit (40) can detect directional scoring (105) such as notches or flat edges of the thinned substrate (100) on the substrate platform (20) for the thinned substrate (105) 100) For inspection and/or for pre-alignment of process processing, and the optical sensor (42) can be arranged in the read head (41) through a moving mechanism (45), such as using a motor and a guide A set of slide rails for moving and positioning a screw, so that the optical sensor (42) can selectively move up and down relative to the thinned substrate (100), so as to adjust it to detect the directional notch ( 105) focal length;

Thereby, the thinned substrate (100) can be acted on by the electrostatic field generated by the first bonding plate surface (21) of the substrate platform (20), so that the thinned substrate (100) can be effectively flatly attached to the On the substrate platform (20), a pre-alignment device capable of effectively flattening and stably positioning the thinned substrate (100) is formed, so as to improve the detection accuracy of the orientation of the thinned substrate (100) during pre-alignment and detection efficiency.

And the pre-alignment device of the present invention is performing a thinning of the substrate (100) During the pre-alignment process, as shown in the flow structure of FIG. 6, the execution steps include providing a thinned substrate with directional notches on the edge (S11), and using a grasping device to move the thinned substrate into the In a pre-alignment device (S12), an electrostatic field is generated on the thinned substrate by the pre-alignment device (S13), the alignment is performed by rotating the thinned substrate to detect the alignment marks (S14); The grasping device pre-adsorbs the thinned substrate and releases the electrostatic field to move out the thinned substrate (S15), so that the thinned substrate (100) can be cleaned by using the directional notch (105) detected on the edge of the thinned substrate (100). orientation;

As for the detailed description of the steps of this creative pre-alignment method, it is as disclosed in Figures 6 to 10, wherein:

Step (S11), providing a thinned substrate with directional nicks on the edge: providing a thinned substrate (100) to be inspected and/or processed, the thinned substrate (100) with at least directional nicks ( 105) to perform an orientation procedure for pre-aligning the thinned substrate (100);

Step (S12), using a grabbing device to move the above-mentioned thinned substrate into a pre-alignment device: using a grabbing device such as a substrate fork (60) of a robotic arm (Robot) to absorb the above-mentioned thinned substrate (100) ), and the thinned substrate (100) is placed on the top surface of the substrate platform (20) of the pre-alignment device. According to some embodiments, as shown in FIG. 7 , when moving the thinned substrate (100) into the substrate platform (20), the gripping device utilizes the lift drive group (33) of the drive unit (30). ) actuate the ejector group (24) of the substrate platform (20) to rise, and the gripping device operates the substrate fork (60) to place the thinned substrate (100) on the second joint of the ejector group (24) on the plate surface (25), and an electrostatic field is generated by the second bonding plate surface (25) to adsorb the thinned substrate (100), and the substrate fork (60) is released from the thinned substrate (100) Move out below, so that the top material group (24) can be lowered to place the thinned substrate (100) on the substrate The surface of the first joint plate surface (21) of the platform (20). Also according to some embodiments, when the gripping device is moved into the thinned substrate (100) and placed on the substrate platform (20), such as when the substrate platform (20) has a fork slot (28) (eg, fifth ], the grasping device controls the substrate fork (60) to place the thinned substrate (100) on the substrate platform (20) through the fork slot (28) extending into the substrate platform (20). on the first joint plate surface (21), and make the substrate fork (60) release the thinned substrate (100) and then move out from the fork slot (28) below it;

Step (S13), generating an electrostatic field on the thinned substrate by the pre-alignment device: when the thinned substrate (100) is placed on the top surface of the first bonding plate surface (21) of the substrate platform (20), The electrode (22) in the first bonding plate surface (21) can be actuated by the electrostatic generation controller to generate an electrostatic field, as shown in Fig. 8A, the electrostatic field can lift the portion of the thinned substrate (100) The part is gradually pulled down, so that the part whose warped height exceeds the range of the electrostatic field will gradually enter the range of the electrostatic field. Finally, as shown in Fig. 8B, the thinned substrate (100) can be completely flat on the first bonding plate The upper surface of the surface (21) enables the thinned substrate (100) to be firmly adsorbed on the substrate platform (20), and the edge portion of the thinned substrate (100) beyond the range of the substrate platform (20) is subject to internal The edge part of the support can also be kept flat;

In step (S14), the above-mentioned thinned substrate is rotated to detect the above-mentioned orientation nicks to perform orientation: as shown in FIG. After the surface (21) is removed, the drive unit (30) can be selectively moved to adjust the thinned substrate (100) on the substrate platform (20) as required, so that the thinned substrate (100) has directional nicks (105). ) into the range of the optical sensor (42) of the read head (41) of the sensor unit (40), and further adjust the height of the optical sensor (42) of the read head (41) as required , and then through the rotary drive group (31) of the drive unit (30) to rotate the The substrate platform (20) drives the thinned substrate (100) to rotate synchronously, so as to use the optical sensor (42) of the sensor unit (40) to detect the directional notch (105) of the thinned substrate (100), performing pre-alignment orientation of the thinned substrate (100); and

Step ( S15 ), pre-adsorbing the thinned substrate through the grabbing device, releasing the electrostatic field and removing the thinned substrate: using a grabbing device to move the thinned substrate into a pre-alignment device: after completing the thinning After the pre-aligned orientation of the substrate (100), the thinned substrate (100) can be adsorbed using the substrate fork (60) of the aforementioned gripping device, and the thinned substrate (100) can be removed for inspection and/or use. in the process. According to some embodiments, as shown in FIG. 10, when the gripping device removes the thinned substrate (100), the second bonding plate surface ( 25) Generate an electrostatic field to adsorb the thinned substrate (100) (for example, when the second bonding plate surface (25) of the top material group (24) is lower than the first bonding plate surface (21), the top material group can be made to (24) Partially rising, so that the first and second bonding plate surfaces (21, 25) are on the same plane], so that the first bonding plate surface (21) of the substrate platform (20) eliminates the electrostatic field, and the driving unit ( 30) The lift drive group (33) actuates the extension rod (34) to drive the top material group (24) to move the thinned substrate (100) upward, so that the substrate fork (60) of the grabbing device can be used by the thinned substrate (100). The substrate (100) extends into and absorbs the thinned substrate (100), so that the substrate fork (60) removes the thinned substrate (100) for inspection and/or for process processing. Furthermore, according to some embodiments, when the substrate platform (20) has fork slots (28), the grasping device manipulates the substrate forks (60) to open through the forks extending into the substrate platform (20). The thinned substrate (100) is adsorbed in the groove (28), and the electrostatic field is eliminated by the first bonding plate surface (21) of the substrate platform (20), so that the substrate fork (60) can be removed from the thinned substrate (21). 100) For inspection and/or for in-process processing.

Through the above description, the pre-alignment device lithography method used in the present invention for thinning the substrate utilizes the first bonding plate surface (21) of the substrate platform (20) to correspond to the thinned substrate (100) placed thereon as required. ) generates an electrostatic field, so that the electrostatic field can gradually pull down the warped part of the thinned substrate (100), so that the part whose warped height exceeds the range of the electrostatic field will gradually enter the range of the electrostatic field, and then so that the thinned substrate (100) can be completely flatly attached to the upper surface of the first bonding plate surface (21) and be firmly adsorbed, so as to prevent the thinned substrate (100) from falling off during pre-rotational alignment, The accuracy of the thinned substrate (100) when performing pre-alignment can be further improved, the number of re-inspections due to inability to pre-align the needles can be reduced, and the process efficiency and yield can be improved.

To sum up, it can be understood that this creation is a new type of creation with excellent creativity. In addition to effectively solving the problems faced by habitual practitioners, it also greatly improves the effect, and there is no identical or similar product creation in the same technical field. Or public use, and at the same time, it has the effect of improving, so this creation has met the requirements of "novelty" and "progressiveness" of the new patent, and it is proposed to apply for a new patent in accordance with the law.

100: Thinning the substrate

10: base

20: Substrate Platform

21: The first joint board surface

22: Electrodes

23: Perforation

24: Top material group

25: Second joint board surface

30: Drive unit

31: Rotary drive group

32: Output shaft

33: Lifting drive group

34: Extension rod

35: Moving Mechanisms

40: Sensor unit

41: read head

42: Optical sensor

45: Moving Mechanisms

Claims (9)

A pre-alignment device for a thinned substrate for detecting a thinned substrate with an alignment notch to perform alignment, which at least comprises: a machine base; A substrate stage, which is mounted on the drive unit described later, the top surface of the substrate stage has a first bonding plate surface for placing the thinned substrate, and a static electricity can be selectively generated inside the first bonding plate surface the plurality of electrodes of the field; A drive unit is disposed in the base, and the drive unit has a rotary drive group with an output shaft extending through the base, and the substrate platform can be fixed to the end of the output shaft part, so that the substrate platform can be driven synchronously by the rotation of the output shaft of the rotary drive group; A sensor unit is disposed on the base, the sensor unit has a read head, and the read head has an optical sensor facing the upper surface of the substrate platform, and the optical sensor can Sensing directional nicks of the thinned substrate placed on the substrate platform within the detection range; In this way, the thinned substrate can be acted on by the electrostatic field generated by the first bonding surface of the substrate platform, so that the thinned substrate can be effectively flatly attached to the substrate platform, and the orientation of the thinned substrate can be performed. . The pre-alignment device for thinning a substrate according to claim 1, wherein the pre-alignment device can be part of a process equipment. The pre-alignment device for a thinned substrate according to claim 1, wherein the outer diameter of the substrate platform is smaller than the range of the orientation notch of the thinned substrate, and greater than one third of the diameter of the thinned substrate, so that the When the thinned substrate is adsorbed, the edge with the directional notch can be supported to be flat. The pre-alignment device for thinned substrates according to claim 1, wherein the substrate platform has a top material group that is selectively lifted and lifted to receive the thinned substrates. The pre-alignment device for thinning a substrate according to claim 4, wherein the top material group can be located at the axis of the substrate platform to form a through hole through the first joint surface, and the top material can be selectively lifted and lowered. The ejector group is arranged in the through hole, and the driving unit further includes a lift drive group, the lift drive group has an extension rod extending through the through hole of the base plate platform, and the ejector group can be fixed to the end of the extension rod , so that the top material group can be moved up and down by the lift drive group to move up and down to receive the thinned substrate and place it on the first bonding plate. The pre-alignment device for thinning a substrate according to claim 5, wherein the top surface of the top material group has a second bonding plate surface capable of selectively generating an electrostatic field. The pre-alignment device for thinning a substrate according to claim 1, wherein the substrate platform is respectively formed with a fork slot with opposite edge openings on both sides of the opposite axis, which can be used for a substrate of a substrate grasping device Forks stick in. The pre-alignment device for thinning a substrate according to claim 1, wherein the driving unit can be set on the base through a moving mechanism, so that the driving unit is allowed to be X-axis relative to the sensor unit, Selective displacement of Y-axis, Z-axis, or a combination thereof. A pre-alignment device for a thinned substrate, for detecting a thinned substrate with an orientation notch to perform orientation, has a base, and the base is provided with a drive unit that is allowed to selectively relative displacement and a sensor unit, the drive unit has an output shaft extending through the base and rotated, and the output shaft is provided with a substrate for placing the thinned substrate A platform, the substrate platform can be selectively generated an electrostatic field that attracts the thinned substrate, and the sensor unit can detect the directional notch of the thinned substrate placed on the substrate platform within the detection range, so as to execute the Orientation for thinning substrate pre-alignment.

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