TW202347581A - Semiconductor component or electronic component batch transfer device for achieving the effect of batch transfer and accurately adjusting and pressing the transfer plate on the substrate to be transferred - Google Patents

Abstract

A semiconductor component or electronic component batch transfer device comprises: a base; a lower transfer platform; a carrying platform disposed on the lower transfer platform; a temporary tray platform; an upper transfer platform; a compression unit having at least one lifting drive device and a compression plate disposed on the at least one lifting drive device; a suction member disposed at the bottom of the compression plate and provided with a downward-facing compression surface, wherein the suction member sucks/releases a transfer plate in a manner of negative pressure; and at least one plate camera directly or indirectly arranged on the base for capturing the image of the transfer plate adhered to the suction member.

Description

Semiconductor component or electronic component batch transfer device

The present invention relates to the transfer technology of micro-light emitting diodes, and particularly refers to a batch transfer device of semiconductor components or electronic components that flatly presses the transfer material plate onto the substrate to be transferred and welds it during the transfer process.

Micro LED Display (Micro LED Display) is the next generation display actively developed in the display industry after liquid crystal display and organic light emitting diode display. It mainly combines 1 micron (μm) to 100 micron in size. The LED chip is directly used as a display to display the luminous point.

my country's patent announcement No. 201929265 discloses a transfer head of a porous component with pores, which transfers micro-light emitting diodes through negative pressure suction. The patent specification in this case disclosed a variety of techniques for transferring micro-light-emitting diodes to panels in the prior art. However, most of the prior art technologies may cause damage to the micro-light-emitting diodes during the transfer process, or use glue. For bonding, the transfer manufacturing technology is still not mature enough.

The main purpose of the present invention is to provide a batch transfer device for semiconductor components or electronic components, which presses a transfer material plate with a plurality of micro-light emitting diodes against the substrate to be transferred, thereby performing the pressing process. Optical welding can achieve batch transfer effects through pressing and welding technology.

Another object of the present invention is to provide a batch transfer device for semiconductor components or electronic components, which can accurately adjust the transfer material plate to completely press it on the substrate to be transferred.

In order to achieve the above object, the present invention proposes a semiconductor component or electronic component batch transfer device, which includes: a base; a lower transfer platform with movement capabilities in the X direction, Y direction and rotation capability in the θ direction, and is located on The base, the lower transfer platform has a hollow part; a support platform is provided on the lower transfer platform and is located above the hollow part, and the upper surface of the support platform has a support platform that is recessed downward for air extraction. Structure, the platform is used to carry a substrate to be transferred, and the platform air extraction structure is connected to an air extraction source to adsorb the substrate to be transferred to the platform during air extraction; a material tray temporarily The temporary storage platform is provided directly or indirectly on the base. The surface of the temporary storage platform has a plurality of receiving slots for placing a plurality of transfer plates. Each of the transfer plates is rectangular and has a plurality of waiting plates at the bottom. The components are rotated and arranged in a matrix; an upper transfer platform has the ability to move in the X direction and the Y direction and the rotation ability in the θ direction, and is located on the base and is positioned higher than the lower transfer platform; a pressing unit, It has at least one lifting drive device and a pressing plate provided on the at least one lifting driving device. The at least one lifting driving device is provided on the upper transfer platform. The pressing plate is driven below the at least one lifting driving device. Lifting; an adsorption member located at the bottom of the pressing plate. The adsorption member has a downward pressing surface. The adsorption member is used to adsorb/release a transfer material plate through negative pressure suction; and at least one material A plate camera is provided directly or indirectly on the base for taking images of a transfer plate adsorbed on the adsorbent part; wherein at least one of the platform or the combination of the pressing plate and the adsorbent part is It is transparent or partially hollow to allow predetermined light to penetrate.

It can be seen from the above that the present invention presses a transfer material plate with a plurality of micro-light emitting diodes against the substrate to be transferred by pressing and welding, and performs optical welding during the pressing process, thereby enabling The effect of batch transfer is achieved through transfer technology. In addition, when pressing, the present invention can accurately adjust the transfer plate to completely press it on the substrate to be transferred.

In order to explain in detail the technical characteristics of the present invention, the following preferred embodiments are cited and described with reference to the drawings, wherein:

As shown in Figures 1 to 10, the first preferred embodiment of the present invention proposes a batch transfer device 10 for semiconductor components or electronic components, which mainly consists of a base 11, a lower transfer platform 21, a platform 28, and a material The disk temporary setting platform 29 is composed of an upper transfer platform 31, a pressing unit 41, an adsorption part 51, a plurality of distance measuring devices 61 and two plate cameras 71, among which:

The lower transfer platform 21 has a base 211, an X-axis driving slide rail 212, a Y-axis driving slide rail 213, a rotating motor 214 and a rotating platform 215, and has the ability to move in the X direction and Y direction, and Has the ability to rotate in the θ direction. The lower transfer platform 21 is provided on the base 11 , and the lower transfer platform 21 has a hollow portion 22 . Since the moving and rotating mechanisms (such as direct drive motors) in the X, Y and θ directions are well-known technologies and can be directly understood by those skilled in the art, their detailed structures and assembly methods will not be described again.

The platform 28 is provided on the lower transfer platform 21 and is located above the hollow part 22. The upper surface of the platform 28 has a platform air extraction structure 281 for communicating with an air extraction source (not shown in the figure). Connection, the platform 28 is used to carry a substrate 99 to be transferred. In this embodiment, the substrate 99 to be transferred is a micro light emitting diode (Micro LED) panel. In the first embodiment, the platform air extraction structure 281 is configured in a groove shape, but in other implementation states, it can also be configured in a porous form. The platform air extraction structure 281 is connected to an air extraction source. (not shown in the figure), the substrate 99 to be transferred is adsorbed to the platform 281 during air extraction. In the first embodiment, the platform 281 is transparent and allows predetermined light to penetrate, such as laser light or other light.

The material tray temporary platform 29 is provided on the lower transfer platform 21 and is indirectly installed on the base 11. The surface of the material tray temporary platform 29 has a plurality of receiving grooves 291 for placing a plurality of transfers. Material plates 91. Each of the transfer material plates 91 is rectangular and has a plurality of components to be transferred (not shown in the figure) arranged in a matrix at the bottom. In the first embodiment, micro-light emitting diodes are used as the For example, because the micro-light emitting diode is extremely small, it is difficult to represent it in a diagram, and such a structure is well known to those skilled in the art, so it cannot be represented in a diagram. In other implementation states, the material tray temporary holding platform 29 can also be directly disposed on the base 11 , that is, it is not limited to being disposed on the lower transfer platform 21 , because this arrangement method can be directly used in this field. Technical personnel understand it directly, so it is not allowed to be represented by diagrams.

The upper transfer platform 31 has a base 311, an X-axis drive slide rail 312, a Y-axis drive slide rail 313, a rotation motor 314 and a rotation platform 315, and has the ability to move in the X and Y directions and θ Directional rotation ability. The upper transfer platform 31 is provided on the base 11 and is positioned higher than the lower transfer platform 21 .

The pressing unit 41 has three lifting driving devices 42 and a pressing plate 44 provided on the three lifting driving devices 42. The three lifting driving devices 42 are provided on the upper transfer platform 31. In practice, the three lifting driving devices 42 are Equiangular distribution is better because it facilitates subsequent calculation and adjustment of pressure and angle. The three lifting driving devices 42 move and rotate as the upper transfer platform 31 moves and rotates. The pressing plate 44 is located below the three lifting driving devices 42 and is driven to rise and fall. In actual implementation, the three lifting driving devices 42 can use servo motors, and each has a driving rod 421. The pressing plate 44 can be selected as an equiangular triangular plate, and three corners are respectively provided on the three lifting driving devices 42. The bottom end of the drive rod 421. In addition, each driving rod 421 is provided with a force sensor 422, and each force sensor 422 is used to sense the force fed back to each driving rod 421 by the pressing plate 44.

The adsorption member 51 is located at the bottom of the pressing plate 44. The adsorption member 51 has a downward pressing surface 52. The adsorption member 51 is used to adsorb/release the transfer plate 91 through negative pressure suction. In the first embodiment, the adsorption member 51 is in the shape of a square plate, and an adsorption member air extraction structure 521 is formed on the bottom surface. In the first embodiment, a groove is used as an example, but it may also be provided with Being in a porous form, the air extraction structure 521 of the adsorption member is connected to the air extraction source (not shown in the figure), and is used to adsorb the transfer material plate 91 by means of negative pressure suction. The adsorption part 51 is attached to the bottom surface of the pressing plate 44, and the edge of the adsorbing part 51 does not exceed the edge of the pressing plate 44. In addition, the adsorbing part 51 and the pressing plate 44 have a penetrating structure and are located at opposite corners. Two observation holes 54. Since the adsorbing member 51 can be made of metal and be opaque, or it can be made of glass and be transparent. Therefore, when the adsorbing member 51 is opaque, the two observation holes 54 can penetrate the pressing plate 44 and the pressing plate 44 . When the adsorption member 51 is transparent, the two observation holes 54 only need to penetrate the pressing plate 44 .

The plurality of distance measuring devices 61 are arranged on the pressing plate 44 and face downwards, and are indirectly arranged on the base 11 . The plurality of distance measuring devices 61 are partially located at the bottom of the pressing plate 44 but not lower than the adsorption member. 51 bottom. In this first embodiment, the center enclosed by the driving rods 421 of the three lifting driving devices 42 is the center of the pressing plate 44, and the path from this center to each driving rod 421 is along the pressing plate 44. Board 44 is used to respectively define a virtual connection VL. For convenience of presentation, only one virtual connection VL is shown in FIG. 15 . The number of the plurality of distance measuring devices 61 is three and they are respectively located on the three virtual connections VL, and the plurality of distance measuring devices 61 pass through the pressing plate 44 but do not pass through the adsorption member 51 and are located on the adsorption part 51 . Next to item 51. In other implementation states, the plurality of distance measuring devices 61 can also be directly disposed on the base 11, and are not limited to being disposed on the pressing plate 44. Since this arrangement can be directly understood by those skilled in the art, Therefore, it cannot be represented graphically. Furthermore, when the adsorbing member 51 is transparent, the plurality of distance measuring devices 61 may also be disposed to pass through the pressing plate 44 but not through the adsorbing member 51 , and be located above the adsorbing member 51 . Alternatively, when the adsorbing member 51 is opaque, perforations may be provided in the adsorbing member 51 to allow ranging signals from the plurality of ranging devices 61 to pass through for distance measurement. In addition, even if the plurality of distance measuring devices 61 is not provided, without the function of measuring distance, as long as the entire machine is adjusted first, it can be directly operated with the preset distance parameters, but this is less difficult. Real-time distance measurement enables real-time adjustment. Therefore, setting up multiple distance measurement devices 61 can increase the convenience and efficiency of the overall machine operation.

The two-material plate camera 71 is disposed on the base 11 and captures images downward. The two-material plate camera 71 captures an image of a transfer material plate 91 adsorbed on the adsorption member 51. The transfer material plate 91 has two positioning features. The two positioning features can be additional positioning marks, or they can be the two diagonal contours of the transfer plate 91 itself, or they can be the plurality of parts to be transferred at the bottom of the transfer plate 91 The element's matrix corners. In the first embodiment, the two-plate camera 71 passes through the two observation holes 54 from top to bottom to image the plurality of components to be transferred that are adsorbed on the bottom of the transfer plate 91 of the adsorption member 51 . Take images at the corners of the matrix. Only one of the two-plate cameras 71 can be used in quantity, and another XY platform (not shown in the figure) can be used to move, and can be aimed at the plurality of components to be transferred at the bottom of the transfer plate 91 respectively. Matrix corner imaging, this technology of using the XY platform to move is already a well-known technology, so it is no longer represented in a diagram.

The above structure can be configured with an optical welding device 81, which can emit laser light or ultraviolet light or other high-energy light known to be used for welding. In this first embodiment, emitting laser light is used as an example. In practice, the optical welding device 81 can be installed on the base 11 and located below the lower transfer platform 21. During welding, laser light is emitted from bottom to top, and the laser light passes through the hollow part 22 and penetrates the The platform 28 is used to weld the plurality of components to be transferred on the bottom of the substrate 99 to be transferred.

In addition, in the first embodiment, in order to position the substrate 99 to be transferred, two positioning marks (not shown in the figure) located at two diagonal positions can be provided on the substrate 99 to be transferred, wherein, due to the positioning Marking is a well-known technology in the related fields of panels or circuit boards and is not the focus of this application, so it cannot be represented in diagrams. In addition, in the first embodiment, two substrate cameras 88 are also provided on the base 11. The two substrate cameras 88 are located on one side of the upper transfer platform 31, and the lower transfer platform 21 can be moved from the upper transfer platform 31. The transfer platform 31 moves downward to an imaging position below the two substrate cameras 88, so that the two substrate cameras 88 can downwardly capture images of the two positioning marks for subsequent positioning. Similar to the above, the two substrate cameras 88 can also be located below and capture images upward, and their installation positions are not limited.

Furthermore, as shown in Figure 11, in other implementation situations, the two-material board camera 71' can also be disposed on the optical welding device 81' to capture images upward, and be in a state of being indirectly disposed on the base 11'. At this time, the two-material board camera 71' is located below the platform 28', and the adsorption member 51' can still be positioned above the two-material board camera 71' by moving the upper transfer platform 31'.

The structure of the first embodiment has been described above. Next, the operation state of the first embodiment will be described.

As shown in Figure 12, before operation, a substrate 99 to be transferred is first placed on the platform 28, and the platform air extraction structure 281 is connected to the air extraction source (not shown in the figure). The substrate 99 to be transferred is adsorbed to the platform 28 and fixed. In addition, a plurality of transfer material plates 91 are placed on the material tray temporary platform 29, and a plurality of micro-light emitting diodes (not shown in the figure) are provided on the bottom surface of each transfer material plate 91.

As shown in Figures 13 and 15, during operation, a computer or controller (not shown) can perform the following operations. First, the lower transfer platform 21 is moved so that the material tray temporary platform 29 is located below the adsorption member 51, and the pressing unit 41 is operated to raise and lower the adsorption member 51 to suck up a transfer material plate 91. At this time, the matrix corners of the plurality of components to be transferred at the bottom of the transfer plate 91 are just within the range covered by the two observation holes 54 . If the temporary tray 29 is disposed on the base 11 , the upper transfer platform 31 can be moved above the temporary tray 29 .

As shown in Figures 15 and 16, the lower transfer platform 21 is then moved so that the platform 28 is located below the two substrate cameras 88 to capture images, and the lower transfer platform 21 is adjusted according to the acquired images. position in the X direction and Y direction, and adjust the rotation angle to accurately position the substrate 99 to be transferred. During the aforementioned process of positioning the substrate 99 to be transferred, the two substrate cameras 88 are also used to capture the plurality of substrates to be transferred that are adsorbed on the bottom of the transfer material plate 91 of the adsorption member 51 through the two observation holes 54 The matrix corners of the components are imaged to determine whether there are errors in the position and angle of the transfer plate 91, and based on the judgment results, the positions of the upper transfer platform 31 in the X direction and the Y direction are adjusted, and the rotation angle is adjusted. The transfer plate 91 is rotated to the correct position. During rotation, the upper transfer platform 31 rotates the entire pressing unit 41 together with the pressing plate 44 and the adsorbing member 51 .

Next, as shown in FIGS. 17 and 18 , on the premise of maintaining the aforementioned positioning results, move the lower transfer platform 21 to below the upper transfer platform 31 , and then lower the adsorption member 51 to complete the transfer. The material plate 91 is pressed against the predetermined position of the substrate 99 to be transferred. At this time, the pressing surface 52 of the adsorption member is pressed against the transferred material plate 91 . During the descending process, the three distance measuring devices 61 are used to simultaneously measure the distance between the pressing plate 44 and the substrate to be transferred 99 , and after the transfer plate 91 is pressed against the substrate 99 to be transferred , that is, based on the results measured by the three distance measuring devices 61, each lifting driving device 42 is adjusted respectively, and then the horizontal state of the pressing plate 44 is adjusted. The equiangularly distributed structure of the three driving rods 421 can facilitate the calculation of the pressing force and The angle of the pressing plate 44 is easy to adjust, whereby the transfer plate 91 can be adjusted to completely abut the substrate 99 to be transferred. Since a plurality of micro-LEDs are provided on the bottom surface of the transfer plate 91 , the plurality of micro-LEDs of the transfer plate 91 are actually in contact with the substrate 99 to be transferred. In addition, in the aforementioned pressing state, the three force sensors 422 on the three driving rods 421 will also sense the force fed back from the transfer plate 91 to the pressing plate 44 through the adsorbing member 51. This The feedback force value can also be used to adjust the three-lift driving device 42 to adjust the pressing stroke of the pressing plate 44, thereby adjusting the amount of pressing force.

As shown in Figure 17 with reference to Figures 3 and 6, the optical welding device 81 is operated to irradiate the plurality of micro-light emitting diodes (ie the plurality of components to be transferred) with laser light for welding, and the laser light passes through the hollow Part 22 and penetrate the platform 28 and penetrate the substrate 99 to be transferred for welding. After the welding is completed, the adsorption member 51 is raised to cause the transfer material plate 91 to rise accordingly. The plurality of micro-light emitting diodes on the board 91 remain on the substrate 99 to be transferred due to the aforementioned welding action. In this first embodiment, the plurality of micro-light-emitting diodes on the transfer plate 91 all emit light of the same color, for example, they are all micro-light-emitting diodes that emit red light, or they all emit green light or All are blue lights. Therefore, since a pixel on the substrate 99 to be transferred is composed of at least three colors of light (i.e. red, green and blue), the transferred material will not be transferred at one time during actual welding. All the micro-light emitting diodes on the board 91 are soldered to the substrate 99 to be transferred, but only a partial number of the micro-light emitting diodes are soldered to the substrate 99 to be transferred, for example, at each pixel position Only one micro-light emitting diode is welded, so there are still some micro-light emitting diodes remaining on the transfer plate 91 .

Then, the lower transfer platform 21 is moved to move the substrate 99 to be transferred to a new position to be welded, and then the adsorption member 51 is lowered, so that the transferred material still retains the remaining plurality of micro-light emitting diodes. The plate 91 is pressed against the position that needs to be welded on the substrate 99 to be transferred, and then the optical welding device 81 is used to perform welding according to the aforementioned actions. The aforementioned lifting and lowering of the adsorbing member 51 and the welding operations are repeated until all the micro-light emitting diodes that should be welded on the transfer plate 91 are welded to the substrate 99 to be transferred.

As shown in Figures 13 and 14, the lower transfer platform 21 is moved so that the material tray temporary setting platform 29 is located below the adsorption member 51, and the adsorption member 51 is lowered to place the transfer material plate 91 that has just been welded. Return to the temporary storage platform 29 of the material tray, and move to suck up another unused transfer material plate 91, and then repeat the aforementioned welding action.

Since the area of a transfer plate 91 is smaller than the area of the substrate 99 to be transferred, the above steps can be repeated multiple times to transfer the plurality of micro-luminescent diodes of different colors on the multiple transfer plates 91 The body is transferred and welded to various positions on the substrate 99 to be transferred by optical welding, thereby completing a complete micro-light emitting diode panel.

It can be seen from the above that the present invention presses a transfer material plate 91 with a plurality of micro-light emitting diodes against the substrate 99 to be transferred in a pressing manner, so as to perform optical welding during the pressing process, and thus can Transfer completed. Since the number of micro-light-emitting diodes on a transfer plate 91 may be as high as one million, the actual optical welding technology may be insufficient for welding these one million micro-light-emitting diodes. In one welding operation, only tens of thousands of micro-light-emitting diodes need to be welded. In fact, it only takes less than one second to weld these tens of thousands of micro-light-emitting diodes with the optical welding device 81 clock, therefore, the present invention determines that the effect of batch transfer can be achieved.

In addition, by adjusting the three-lift driving device 42 with the plurality of distance measuring devices 61, the horizontal inclination angle of the pressing plate 44 can be adjusted, so that the transfer plate 91 can accurately fit the substrate to be transferred. 99 surface.

As can be seen from the foregoing, the technical focus of the present invention lies in the accurate and complete pressing effect of the pressing plate 44 . As for the optical welding device 81, it can be integrated into the same machine or installed at the next workstation of the production line to perform welding as needed. In addition, the positioning mechanism of the substrate to be transferred 99 can also be integrated into the same machine or processed by other known positioning means as needed.

From the foregoing description, it can be seen that the installation positions of the material tray temporary platform 29, the installation positions of the two material plate cameras 71, the installation positions of the two substrate cameras 88, and the installation positions of the plurality of distance measuring devices 61, The installation positions of these four components can be adjusted as needed and are not limited to any one of them. That is to say, one of the installation positions cannot be used to limit the patent scope of this case.

As shown in Figures 19 to 22, the second preferred embodiment of the present invention provides a semiconductor component or electronic component batch transfer device 10'', which is mainly similar to the first embodiment mentioned above, except that:

The optical welding device 81'' is not located below the lower transfer platform like the first embodiment, but is located on the base 11'' and above the lower transfer platform 21''. The adsorption member 51'' is is transparent, and the pressing plate 44'' can be set to be transparent or hollowed out to allow laser light to pass through. The optical welding device 81'' emits laser light downward through the pressing plate 44'' and penetrates the The adsorbing member 51'' irradiates the substrate to be transferred (not shown in the figure), thereby welding the substrate to be transferred (not shown in the figure).

As can be seen in the figure, since the optical welding device 81'' is located above and illuminates downward, and the laser light must pass through the pressing plate 44'' and the adsorption part 51'', the bottom surface of the adsorption part 51'' is The air extraction structure 521'' of the adsorbing part must be arranged at the edge of the adsorbing part 51'' to avoid the irradiation area of the laser light and thereby avoid interference with the laser light.

The remaining structures and achievable functions of the second embodiment are the same as those of the first embodiment and will not be described again.

As shown in Figure 23, the third preferred embodiment of the present invention provides a semiconductor component or electronic component batch transfer device 10''', which is mainly similar to the first embodiment mentioned above, except that:

In this third embodiment, instead of using three lifting driving devices, only one lifting driving device 42''' is used. The pressing plate 44'' is swingable through a universal ball head 45'''. The driving rod 421'''' is provided on the lifting driving device 42''''.

When the third embodiment is in use, when the pressing plate 44'''' presses the transfer plate (not shown in the figure) against the substrate to be transferred (not shown in the figure), through the The adaptive angle characteristics of the ball head 45'''' are used to completely press the transfer plate (not shown in the figure) against the substrate to be transferred (not shown in the figure).

The remaining structures and achievable functions of the third embodiment are the same as those of the first embodiment, and will not be described again.

It should be added that although the present invention takes the batch transfer of micro light-emitting diodes (Micro LEDs) as an example, the technology of the present invention is not limited to this. The need for batch transfer of other small electronic or optical components can be met. For example, the technology of the present invention can also be applied to the batch transfer of transistors or optical detection components.

10: Semiconductor component or electronic component batch transfer device 11: base 21: Download platform 211:pedestal 212:X-axis drive slide rail 213:Y-axis drive slide rail 214: Rotary motor 215: Rotating platform 22: Hollow parts 28: Platform 281: Platform air extraction structure 29: Temporary setting table for material tray 291: Accommodation tank 31: Uploading platform 311:pedestal 312:X-axis drive slide rail 313: Y-axis drive slide rail 314: Rotary motor 315: Rotating platform 41: Suppression unit 42:Lifting drive device 421:Driving rod 422: Force sensor 44: Pressed board 51: Adsorption parts 52: Pressed surface 521: Air extraction structure of adsorption parts 54: Observation hole 61: Distance measuring device 71: Sheet camera 81: Optical welding device 88:Substrate camera 91:Transfer board 99:Substrate to be transferred VL: virtual link 11’: base 28’: platform 31’: Upper transfer platform 51’: Adsorption piece 71’: Sheet camera 81’: Optical welding device 10’’: Semiconductor component or electronic component batch transfer device 11’’: base 21’’: Download platform 44’’: pressed board 51’’: Adsorption piece 521’’: Air extraction structure of adsorption parts 81’’: Optical welding device 10’’’: Semiconductor component or electronic component batch transfer device 42’’’:Lifting drive device 421''': drive rod 44’’’: Pressed board 45’’’:Universal ball head

Figure 1 is a perspective view of the first preferred embodiment of the present invention. Figure 2 is a side view of the first preferred embodiment of the present invention. FIG. 3 is a side view of some components of the first preferred embodiment of the present invention, showing the state after removing part of the base. Figure 4 is a perspective view of some components of the first preferred embodiment of the present invention, showing the structure of the lower transfer platform and the base. Figure 5 is a schematic diagram of some components of the first preferred embodiment of the present invention, showing the platform. Figure 6 is a top view of some components of the first preferred embodiment of the present invention, showing the lower transfer platform. Figure 7 is a perspective view of some components of the first preferred embodiment of the present invention, showing a bottom view of the upper transfer platform. Figure 8 is a perspective view of some components of the first preferred embodiment of the present invention, showing the mutual spatial relationship between the upper transfer platform and the lower transfer platform. Figure 9 is an enlarged view of some components of the first preferred embodiment of the present invention, showing the pressed plate and some components above it. Figure 10 is an enlarged view of another part of the components of the first preferred embodiment of the present invention, showing the pressing plate and some components above. Figure 11 is a schematic diagram of another implementation aspect of the first preferred embodiment of the present invention, showing the state where the material plate setting machine is installed below the platform. Figure 12 is an action diagram of the first preferred embodiment of the present invention, showing the state of the platform placing the substrate to be transferred. Figure 13 is another action diagram of the first preferred embodiment of the present invention, showing that the material tray temporary setting platform is located below the adsorption member. Figure 14 is another action diagram of the first preferred embodiment of the present invention, showing the state of the adsorption member being lowered to pick up materials. Figure 15 is an enlarged view of a partial component of the first preferred embodiment of the present invention, showing the state in which the adsorption member absorbs a transfer plate. Figure 16 is another action diagram of the first preferred embodiment of the present invention, showing the state when the platform moves below the material plate camera. Figure 17 is another action diagram of the first preferred embodiment of the present invention, showing the state in which the platform moves below the adsorption part and the adsorption part is pressed down. Figure 18 is a partial enlarged view of Figure 17. Figure 19 is a perspective view of the second preferred embodiment of the present invention. Figure 20 is a partial cross-sectional schematic view along line 20-20 in Figure 19. Figure 21 is a partial enlarged view of Figure 20. Figure 22 is a perspective view of some components of the second preferred embodiment of the present invention. Figure 23 is a schematic cross-sectional view of the third preferred embodiment of the present invention.

31: Uploading platform

311:pedestal

312:X-axis drive slide rail

313: Y-axis drive slide rail

314: Rotary motor

315: Rotating platform

41: Suppression unit

421:Driving rod

422: Force sensor

44: Pressed board

51: Adsorption parts

52: Pressed surface

521: Air extraction structure of adsorption parts

54: Observation hole

61: Distance measuring device

Claims (15)

A batch transfer device for semiconductor components or electronic components, including: a base; The lower transfer platform has the ability to move in the X direction, the Y direction and the rotation ability in the θ direction, and is located on the base and has a hollow part; A platform is provided on the lower transfer platform and is located above the hollow part, and the upper surface of the platform has a platform air extraction structure recessed downward. The platform is used to carry a substrate to be transferred. , after the platform air extraction structure is connected to an air extraction source, the substrate to be transferred is adsorbed to the platform during air extraction; A material tray temporary platform is provided directly or indirectly on the base. The surface of the material tray temporary platform has a plurality of receiving slots for placing a plurality of transfer material plates. Each of the transfer material plates is rectangular and is provided at the bottom. There are a plurality of components to be transferred arranged in a matrix; An upper transfer platform has the ability to move in the X direction, the Y direction and the rotation ability in the θ direction, and is located on the base and is positioned higher than the lower transfer platform; A pressing unit has at least one lifting drive device and a pressing plate provided on the at least one lifting driving device. The at least one lifting driving device is provided on the upper transfer platform. The pressing plate is located on the at least one lifting driving device. The lower part is driven to rise and fall; An adsorption member is provided at the bottom of the pressing plate. The adsorption member has a pressing surface facing downward. The adsorption member is used to adsorb/release a transfer material plate through negative pressure suction; and At least one sheet camera is directly or indirectly provided on the base for capturing images of a transfer sheet adsorbed on the adsorbing member; Wherein, at least one of the platform or the combination of the pressing plate and the adsorbing member is transparent or partially hollow, allowing predetermined light to penetrate. The semiconductor component or electronic component batch transfer device according to claim 1, which further includes two substrate cameras, which are installed on the base to capture images of the substrate to be transferred. The semiconductor component or electronic component batch transfer device according to claim 2, wherein: the two substrate cameras are located on one side of the upper transfer platform, and the lower transfer platform can be moved to the two substrate cameras to capture images respectively. position and move to the bottom of the upper transfer platform. The batch transfer device of semiconductor components or electronic components according to claim 1, which further includes a plurality of distance measuring devices, which are directly or indirectly installed on the base to measure the transferred material plate and the substrate to be transferred. distance between. According to the batch transfer device of semiconductor components or electronic components according to claim 4, wherein: the plurality of distance measuring devices are provided on the pressing plate and are indirectly provided on the base, and the plurality of distance measuring devices are partially located on the pressing plate. The bottom of the plate but not lower than the bottom of the adsorption member. According to the batch transfer device of semiconductor components or electronic components according to claim 1, wherein: the number of the at least one lifting driving device is three, each of the three lifting driving devices has a driving rod, and the pressing plate is arranged on the three lifting driving devices. A driving rod of the driving device, and each driving rod is provided with a force sensor, and each force sensor is used to respectively sense the force fed back by the pressing plate to each driving rod. According to the batch transfer device of semiconductor components or electronic components according to claim 6, wherein: on the path from the center of the range enclosed by the three lifting driving devices to each lifting driving device, a virtual virtual device is defined along the pressing plate. The number of the plurality of distance measuring devices is three and they are respectively located on the three virtual connections, and the plurality of distance measuring devices pass through the pressing plate but not through the adsorption member. The semiconductor component or electronic component batch transfer device according to claim 1, wherein: the edge of the adsorption member does not exceed the edge of the pressing plate. The semiconductor component or electronic component batch transfer device according to claim 1, wherein: the transfer material plate has two positioning features, and the at least one board camera captures images of the two positioning features of the transfer material plate, respectively, The two positioning features may be positioning marks, diagonal contours of the transfer material plate or matrix corners of the plurality of components to be transferred at the bottom of the transfer material plate. According to the batch transfer device of semiconductor components or electronic components according to claim 9, wherein: the adsorption member is plate-shaped, and an adsorption member air extraction structure is formed on the bottom surface, and the adsorption member air extraction structure is used to connect to a The air extraction source is used to absorb a transfer material plate by means of negative pressure suction; the adsorption member is attached to the bottom surface of the pressing plate, and the pressing plate is provided with two observation holes that penetrate both and are located at opposite corners. The at least one sheet camera captures images of the transferred sheet through the two observation holes. The batch transfer device of semiconductor components or electronic components according to claim 1, which further includes an optical welding device located on the base and below the lower transfer platform, the platform is transparent, and the optical welding device The device is used to emit predetermined light through the hollow part and through the platform, thereby welding the plurality of components to be transferred at the bottom of the substrate to be transferred. The batch transfer device of semiconductor components or electronic components according to claim 1, which further includes an optical welding device located on the base and above the lower transfer platform, the adsorption member is transparent, and the optical welding device The device emits predetermined light through the adsorption member and irradiates the substrate to be transferred, thereby welding the plurality of components to be transferred at the bottom of the substrate to be transferred. The semiconductor component or electronic component batch transfer device according to claim 1, wherein: the platform is transparent, and the at least one material board camera is from below the platform and through the platform to capture the image of the transferred material board. . The semiconductor component or electronic component batch transfer device according to claim 1, wherein: the lower transfer platform has a base, an X-axis drive slide rail, a Y-axis drive slide rail, a rotation motor and a rotation platform; The upper transfer platform has a base, an X-axis driving slide rail, a Y-axis driving slide rail, a rotating motor and a rotating platform. According to the batch transfer device of semiconductor components or electronic components according to claim 1, wherein: the number of the at least one lifting driving device is one, the lifting driving device has a driving rod, and the pressing plate is driven by a universal ball head A drive rod is disposed on the lifting drive device in a swingable manner, and a force sensor is provided on the drive rod to sense the force fed back from the pressing plate to the drive rod.

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