JP2011086698A - Bonding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding device enabling both a simultaneous imaging of a semiconductor chip and a mounted part and a prevention of a bubble in a thin chip. <P>SOLUTION: In the bonding device which bonds the semiconductor chip sucked by a suction head on an end of a bonding arm in a mounting position, the bonding arm 2 has a translucent portion for imaging which reaches the suction head 30, the suction head 30 includes a head body 31 having a translucent portion, a lower surface of the head body 31 is in a downward convex bending shape, and the head body 31 can elastically deform so that the lower bottom becomes a flat shape by receiving a force of pressing down while contacting a top face of the semiconductor chip. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a bonding apparatus for mounting a chip such as a semiconductor on a substrate such as a lead frame.

  In manufacturing a semiconductor device, die bonding for mounting a semiconductor chip on a lead frame is performed by a bonding apparatus. The bonding apparatus adsorbs one of the semiconductor chips that are subdivided and arranged on the wafer sheet with an adsorption head, positions and places it on the island of the lead frame to be bonded, and bonds the semiconductor chip to the lead frame. . Joining is performed by, for example, soldering the bump on the lower surface of the semiconductor chip by soldering to the lead frame by using a heater built in the suction head, or by heating and curing the adhesive applied to the lower surface of the semiconductor chip. .

  This step is performed, for example, as shown in FIG. That is, the semiconductor chip T is sucked by the suction head 110 having the intake passage 111 and the heater 112 and is brought onto the lead frame F of the substrate St. At this time, the position of the semiconductor chip T is detected by the position detection device 120.

  The position detection device 120 includes, for example, prisms 121a and 121b and imaging devices 122 and 123. The prisms 121a and 121b are arranged with their inclined surfaces facing each other, and both the semiconductor chip T and the lead are arranged. It is moved between the frame F. The imaging devices 122 and 123 each include an illumination unit and an imaging unit such as a CCD camera, and are disposed at opposite positions on the left and right sides of the inclined surfaces of the prisms 121a and 121b.

  The light emitted from the illumination unit of the imaging device 122 is reflected upward by the prism 121a to irradiate the lower surface of the semiconductor chip T, and the light emitted from the illumination unit of the imaging device 123 is reflected downward by the prism 121b and led to the lead frame F. Irradiate the top surface. Then, the reflected light from the semiconductor chip T is reflected again by the prism 121a and reaches the imaging device 122, and the position of the image is detected. The reflected light from the lead frame F is reflected by the prism 121b and reaches the imaging device 123, and the position of the image is detected.

  The position detection is performed on a portion related to a position to be bonded, such as a bump of the semiconductor chip T and the lead frame F. In this way, while detecting the position of the semiconductor chip T with respect to the lead frame F, the position of the suction head 110 is adjusted via the bonding arm to perform accurate positioning. When the positioning is completed, the prisms 121a and 121b are retracted from the position between the semiconductor chip T and the lead frame F, the bonding arm and the suction head 110 are lowered, the semiconductor chip T is brought into contact with the lead frame F, and the heater 112. The semiconductor chip T is bonded to the lead frame F under heating by the above.

  However, when the semiconductor chip T and the lead frame F are formed with an adhesive or the like, there are cases where there is no portion to be detected such as a bump on one or both of the facing surfaces. In such a case, as shown in FIG. 8 (b), infrared light is irradiated from the illumination unit of the position detection device 120 so that the irradiation light reaches the opposite surface (the upper surface of the semiconductor chip T, etc.) Positioning can be performed by detecting the position of the image of the wiring portion C or the like there.

  However, when the semiconductor chip T and the lead frame F are joined by DAF, the DAF layer D provided on the lower surface of the semiconductor chip T does not allow infrared light to pass as shown in FIG. As a result, the irradiated light cannot reach the wiring C or the like on the opposite surface (such as the upper surface of the semiconductor chip T), and positioning by imaging becomes impossible.

  In order to eliminate such inconvenience and to eliminate the necessity of advancing / retreating the position of the prism each time the position is detected, the position of the semiconductor chip T is detected from above the suction head, for example, as shown in Patent Document 1. Techniques to do this have been proposed.

  FIG. 9 shows an example of such a device, which has a structure in which a light-transmitting portion (transparent portion) is provided on the suction head 141 and arm main body 142 of the bonding arm 140, and an imaging device is disposed above the light-transmitting portion. The imaging devices 150 and 160 are separately provided corresponding to the pick-up position above the wafer holder 170 and the mounting position on the lead frame F, and the conveying means 180 indicates the bonding arm 140 between the two by the arrow A. Move to.

  The positioning of the semiconductor chip T can be performed by simultaneously detecting the chip and the mounted portion (island portion) on the same screen by the light emitted from the illumination portions of the imaging devices 150 and 160. As a result, accurate positioning is possible, and the problem of imaging from below the chip is temporarily eliminated.

  By the way, another problem that occurs in the bonding of thin semiconductor chips is that, when bonding to the lead frame via an adhesive, air is entrained between the adhesive layer and the bonding surface, and the bonding state with bubbles interposed It is a point. The presence of such bubbles may cause problems such as poor adhesion, chip deformation and damage, and heat storage.

  In order to cope with this problem, it has been proposed that the suction head (collet) is made of an elastically deformable material and the lower surface is convex (Patent Document 2). This is because the lower surface of the suction head provided with suction holes is made convex so that the thin chip is sucked along the convex surface at the time of pick-up, and at the time of bonding to the substrate, the suction head is pressed by the downward pressure. The lower surface is elastically deformed flat and the thin chip is joined in a flat shape. An adhesive film is attached to the lower surface of the thin chip. As the suction head descends, the contact with the substrate starts from the center of the convex surface and spreads to both sides, and along with this, adhesion progresses while expelling air to both sides. Is prevented.

JP 2008-124382 A JP 2003-203964 A

  As described above, the suction head provided with the translucent portion disclosed in Patent Document 1 enables accurate positioning of the semiconductor chip by simultaneously imaging the semiconductor chip and the mounted portion from above. The problem of bubbles generated in the case cannot be solved. On the other hand, although the suction head formed of the elastically deformable material shown in Patent Document 2 can solve the problem of air bubble inclusion, it does not have a structure that enables imaging from above. Accurate positioning by simultaneous imaging with the mounted part cannot be performed.

  An object of the present invention is to provide a bonding apparatus that solves these problems and enables both simultaneous imaging of a semiconductor chip and a mounted portion of a substrate and prevention of bubbles in a thin chip.

  In order to achieve the above object, the present invention provides a bonding apparatus for bonding a semiconductor chip adsorbed to a suction head at the tip of a bonding arm at a mounting position, wherein the bonding arm has a translucent portion for imaging reaching the suction head. The suction head includes a head body having a translucent portion, the lower surface of the head body has a downwardly convex curved shape, and the head body is pressed down in a state of being in contact with the upper surface of the semiconductor chip. Accordingly, the present invention provides a bonding apparatus characterized in that it can be elastically deformed so that its lower surface becomes planar.

  In the bonding apparatus according to the present invention, the bonding arm includes a light-transmitting portion for imaging that reaches the suction head, and the suction head includes a head body having the light-transmitting portion. Therefore, it is possible to image the situation below the suction head through the light-transmitting part of the bonding arm, and it is possible to accurately position the semiconductor chip with respect to the mounted part by simultaneous imaging of the semiconductor chip and the mounted part. Further, if necessary, the suction positioning by the suction head can be accurately performed based on the imaging of the semiconductor chip even when the semiconductor chip is sucked.

  Further, the lower surface of the suction head and the head main body has a downwardly convex curved shape, and the lower surface of the head main body becomes flat by receiving a pressing force with the transparent conductive film heater in contact with the upper surface of the chip. It is elastically deformed. Therefore, when adsorbing a semiconductor chip with an adsorption head and joining it to a mounted part such as a lead frame, as the adsorption head descends, the contact area with the mounted part moves air from the center of the convex surface to both sides. Since it extends while being expelled and becomes planar, air is not caught and bubbles are prevented from interposing at the joint.

  The suction head may include a transparent conductive film heater provided along the lower surface of the head body. In this way, after the semiconductor chip finally comes into contact with the mounted portion, the contact portion can be heated by the transparent conductive film heater on the lower surface of the head body, so that the adhesive can be quickly cured and bonded. .

  The term “transparent” is not limited to being colorless and completely transparent, but includes colored or translucent ones.

  As described above, according to the present invention, it is possible to provide a bonding apparatus that enables both simultaneous imaging of a semiconductor chip and a mounted part and prevention of bubbles in a thin chip.

It is sectional drawing which shows the bonding arm in the bonding apparatus which concerns on one Embodiment of this invention with an imaging device. It is a figure which shows the process from the pick-up of a semiconductor chip by the bonding arm of FIG. 1 to adhesion | attachment to a board | substrate. It is a figure which shows the process from the pick-up of the semiconductor chip by the bonding arm to the adhesion | attachment to a board | substrate about the bonding apparatus which concerns on other embodiment of this invention. It is a figure which shows the process from the pick-up of the semiconductor chip by the bonding arm to the adhesion | attachment to a board | substrate about the bonding apparatus which concerns on further another embodiment of this invention. It is a perspective view which shows the other example of the adsorption | suction head in the bonding apparatus of this invention. It is a perspective view of the adsorption head in the bonding apparatus concerning other embodiments of the present invention. It is a longitudinal cross-sectional view of the adsorption | suction head in three types of bonding apparatuses which concern on other embodiment of this invention. It shows the main part of an example of a conventional bonding apparatus, (a) is a sectional view of an example of a suction head and an imaging device, (b) is a sectional view of another example of a suction head and an imaging device, (c) FIG. 3 is a cross-sectional view of a semiconductor chip to be bonded. It is a perspective view which shows the other example of the conventional bonding apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The same or similar parts in the drawings are denoted by the same reference numerals and description thereof is partially omitted.

  FIG. 1 is a cross-sectional view showing a bonding arm together with an imaging device for a bonding apparatus according to an embodiment of the present invention. FIG. 2 is a diagram showing a process from picking up a semiconductor chip by the bonding arm of FIG. 1 to adhesion to the substrate. FIG. 2 (a) is before adsorption of the semiconductor chip, (b) is before adhesion to the substrate, c) shows the state before bonding to the substrate, and (d) shows the state after bonding to the substrate.

  Since the overall configuration of the bonding apparatus is the same as that shown in FIG. 9, the description of the common parts is omitted, and the following description will focus on the bonding arm and the suction head located at the tip thereof.

  The illustrated bonding arm 2 includes an arm body 20 that is elongated in the vertical direction and a suction head 30 that is fixed to a lower end portion of the arm body 20. The arm body 20 is held by the holding portion 40 of the transfer means 4 (corresponding to the transfer means 180 in FIG. 9) that can move in the horizontal direction, and can move in the vertical direction and rotate around the vertical axis. ing.

  The arm body 20 includes a cylindrical side wall 21 extending in the vertical direction and a bottom wall 22 at the lower end, and the upper end is open. The bottom wall 22 is transparent for imaging under the suction head 30 by the imaging device.

  The imaging device 5 is disposed above the arm body 20 and is supported by a frame (not shown) of the bonding device. Although the imaging device 5 is a CCD camera in this example, various imaging devices capable of imaging under the suction head 30 can be used.

  The arm body 20 may have a cylindrical shape with a polygonal cross section, a U-shaped cross section, or a N-shaped side wall in addition to the above shape. Moreover, the upper end of the arm main body 20 may be closed with a member having translucency.

  The suction head 30 has a substantially rectangular parallelepiped shape as a whole, and the head main body 31 is fixed to the lower end of the side wall 32 extending in the vertical direction. An outward flange 37 is provided at the upper end of the side wall 32, and the flange 37 is fixed to the bottom wall 22 of the arm body 20 by a bolt 34 a and a nut 34 b. A seal member (not shown) is interposed between the flange 37 and the bottom wall 22 in order to maintain airtightness in the suction head 30.

  The head body 31 is composed of a transparent plate-like member 310 having a downwardly convex curved shape, and a transparent conductive film heater 33 is provided along the lower surface of the plate-like member 310. The plate-like member 310 can be made of, for example, polycarbonate, and can be made of another plastic having heat resistance and translucency.

  The transparent conductive film heater 33 can be formed as, for example, an ITO (indium tin oxide) film, and can be formed on the plate-like member 310 by sputtering or by heat-sealing with ink. .

  The head body 31 is also elastically deformed into a flat shape by receiving a pressing force with the transparent conductive film heater 33 in contact with the upper surface of the semiconductor chip. The thickness of the head body 31 is determined so as to impart this elastic deformability. Further, the degree of curvature of the head main body 31 can be set to have a convex of 50 to 100 μm downward with respect to a horizontal span of 5 to 15 mm. In the drawing, the thickness and the curvature of the plate-like member 310 and the transparent conductive film heater 33 are exaggerated from the actual values for easy understanding (the same applies to the following embodiments).

  The head body 31 and the transparent conductive film heater 33 are formed with minute through holes 35 for adsorbing the semiconductor chip. Although a plurality of through holes 35 are provided in the illustrated example, a single through hole may be formed according to the size of the semiconductor chip and the suction capability of the suction source. The side wall 32 is provided with a suction port 36 (FIG. 2) for connecting a suction hose.

  This bonding apparatus is used as follows. As shown in FIG. 2A, a large number of semiconductor chips T are held on the holding sheet Sh. The bonding arm 2 is moved to the pickup stage by the transport means 4 and descends toward the semiconductor chip T to be picked up. At this time, based on the imaging of the semiconductor chip T by the imaging device 5, the suction positioning by the suction head 30 is performed. This is because the illumination unit of the image pickup apparatus 5 (FIG. 1) transmits the bottom wall 22 of the bonding arm 2 and the plate-like member 310 of the head body 31 to irradiate illumination light, and the reflected light is imaged by the image pickup unit. It is done by doing. At the time of positioning, the conveying unit 4 adjusts the position of the bonding arm 2 so that the suction head 30 is at a predetermined position with respect to the semiconductor chip T while recognizing the image by the imaging device 5.

  Next, as shown in FIG. 2B, the bonding arm 2 moves to the bonding stage St in a state where the semiconductor chip T is adsorbed to the adsorption head 30 and is positioned on the substrate B to be bonded. This positioning is performed based on imaging by an imaging device installed above the bonding arm 2 (or another imaging position) that has reached the bonding stage. In this imaging device, images of both the semiconductor chip T and the substrate B are obtained. The transport unit 4 accurately adjusts the position of the bonding arm 2 so that the semiconductor chip T reaches a predetermined position with respect to the substrate B while recognizing these images by the imaging device.

  Next, as shown in FIG. 2 (c), the bonding arm 2 is lowered by the operation of the conveying means 4. Since the semiconductor chip T attracted to the head body 31 is curved in a downwardly convex shape, the lowermost end first contacts the substrate B. From this state, as shown in FIG. 2 (d), the bonding arm 2 is further lowered. As a result, the head main body 31 is elastically deformed and flattened, and the semiconductor chip T is also formed into a flat shape along with the flattening so that the whole contacts the substrate B. Thus, as the suction head 30 is lowered, the contact portion of the semiconductor chip T is flattened while extruding air from the center of the convex surface to both sides of the convex surface, so that no air is caught. In this way, the inclusion of bubbles at the joint is prevented.

  Here, the transparent conductive film heater 33 is energized to generate heat. Since a thermosetting resin film Tf (die attach film) is attached to the lower surface of the semiconductor chip T, the semiconductor chip T and the substrate B are bonded to each other by being heated by the transparent conductive film heater 33. When the plate-like member 310 of the head main body 31 is deformed from a curved state to a flat shape, the distance between both end portions in the deformation direction slightly increases. In order to allow this change in distance, the side wall 32 of the bonding arm 2 is configured to be elastically deformable in the direction indicated by the arrow P in FIG. Thereby, the plate-like member 310 becomes planar with the semiconductor chip T. In the figure, the deformation amount is exaggerated for the sake of easy understanding. However, since the bending amount is actually very small, the side wall 32 has a certain degree of flexibility. The above modification is possible. In addition, after the lowermost end of the curved semiconductor chip T comes into contact with the substrate B, the plate-like member 310 is planarized together with the semiconductor chip T by pulling in the direction of arrow P acting on the side wall 32 simultaneously with the lowering of the bonding arm 2. You can also

  Thereafter, the suction of the suction head 30 is released, the bonding arm 2 is raised, and the substrate B to which the semiconductor chip T is bonded is transported to the next process.

  FIG. 3 shows a process from picking up a semiconductor chip to bonding to a substrate by a bonding arm of a bonding apparatus according to another embodiment of the present invention. The bonding arm of this embodiment has the same basic structure as that shown in FIG. 2 and is different in the following points.

  That is, the head main body 31a of the suction head 30a includes a support member 311 fixed to the lower portion between the side walls 32 in addition to the plate-like member 310 similar to that shown in FIG. The plate-like member 310 is elastically deformable like the one shown in FIG. 2, whereas the support member 311 is made of a transparent material such as highly rigid glass or plastic. The lower surface of the support member 311 is flat and is in contact with the vicinity of the edge of the plate-like member 310.

  The support member 311 is formed with a suction path 312 extending from the lower surface to the side surface and communicating with the suction port 36 of the side wall 32. Further, a lateral groove 314 for communicating the through hole 35 of the plate-like member 310 and the suction path 312 when the lower surface comes into contact with the plate-like member 310 is formed along the lower surface of the support member 311. Is provided. As for the side surface of the support member 311, the upper part is bonded to the side wall 32, and the lower part is not bonded. In the figure, the diameter of the lower part of the support member 311 is reduced to clearly show the non-adhered state, and a gap 313 is formed between the side wall 32. However, such a reduced diameter and gap are not necessarily required.

  Since the usage form of the bonding apparatus provided with the suction head 30a is the same as that of FIG. 2, the description will focus on the differences. As shown in FIG. 3A, the bonding arm 2 is moved to the pickup stage and lowered toward the semiconductor chip T to be picked up. At this time, the suction head 30 is positioned based on the imaging of the semiconductor chip T by the imaging device installed above the bonding arm 2 that reaches the bonding stage (or another imaging position). In this positioning, the illumination unit of the image pickup apparatus (FIG. 1) transmits the bottom wall 22 of the bonding arm 2, the plate-like member 310 and the support member 311 of the head main body 31a, irradiates illumination light, and reflects the reflected light. Is performed by imaging with the imaging unit. As a result, an image of the semiconductor chip T is obtained in the imaging device, and the transport unit 4 adjusts the position of the bonding arm 2 so that the suction head 30 reaches a predetermined position with respect to the semiconductor chip T while recognizing the image. To do.

  Next, the bonding arm 2 that has adsorbed the semiconductor chip T to the adsorption head 30 moves to the bonding stage St and is positioned on the substrate B to be bonded, as shown in FIG. At the time of positioning, images of both the semiconductor chip T and the substrate B are obtained by the imaging device, and the transport unit 4 recognizes this image while the semiconductor chip T is in a predetermined position with respect to the substrate B. Then, the position of the bonding arm 2 is adjusted accurately.

  Next, as shown in FIG. 3 (c), the bonding arm 2 is lowered by the operation of the conveying means 4, and the lower end of the curved semiconductor chip T adsorbed by the head body 31 comes into contact with the substrate B. From this state, the bonding arm 2 further descends as shown in FIG. In this embodiment, when the lower surface of the support member 311 contacts the central portion of the plate-like member 310, the lowering can be stopped by detecting a change in the driving pressure for lowering.

  As a result, the plate-like member 310 is elastically deformed and flattened, and the semiconductor chip T also becomes flat while expelling air to both sides, thereby preventing the inclusion of bubbles at the joint. Here, the transparent conductive film heater 33 is energized to generate heat, and the semiconductor chip T and the substrate B are bonded.

  Since the lower portion of the support member 311 is not bonded to the side wall 32, the support member 311 is not restrained by the side wall 32, and the plate-like member 310 is deformed from the curved state to the flat shape, and thus the deformation direction is changed. It deforms so that the distance between both ends increases.

  Thereafter, the suction of the suction head 30 is released, the bonding arm 2 is raised, and the substrate B to which the semiconductor chip T is bonded is transported to the next process.

  FIG. 4 shows a process from picking up a semiconductor chip to bonding to a substrate by a bonding arm of a bonding apparatus according to still another embodiment of the present invention. Since the basic structure of the bonding arm of this embodiment is the same as that shown in FIG. 3, the difference will be mainly described.

  The head main body 31b of the suction head 30b is the same as that shown in FIG. 3 in that a support member 311 fixed to the lower part between the side walls 32 is provided, but instead of the plate-like member 310, it faces downward. A translucent block 315 having a convexly curved lower surface is provided.

  The support member 311 is made of a transparent material such as a highly rigid plastic, while the block 315 has elastic deformation. The support member 311 can be made of a light-transmitting plastic such as quartz glass, sapphire glass, or polycarbonate. The block 315 can be made of a soft and translucent plastic such as a silicone resin. The lower surface of the support member 311 is flat and is in contact with the flat upper surface of the block 315.

  The support member 311 and the block 315 are formed with suction paths 316 that extend upward from the lower surface of the block 315 and communicate with the suction port 36 of the side wall 32 through the support member 311. The side surface of the support member 311 is bonded to the side wall 32. The side wall 32 has a lower end that is the same height as the support member 311 and is covered with a block 315 on the lower surface. It can also be.

  Since the usage pattern of the bonding apparatus provided with the suction head 30b is the same as that in FIG. 3, the description will focus on the differences.

  As shown in FIG. 4A, the bonding arm 2 is lowered toward the semiconductor chip T to be picked up by the pickup stage. At this time, the suction head 30 is positioned based on the imaging of the semiconductor chip T by the imaging device installed on the bonding stage. This positioning is performed by the imaging device transmitting through the bottom wall 22 of the bonding arm 2, the block 31 and the support member 311 of the head main body 31b, irradiating illumination light, and imaging the reflected light. As a result, an image of the semiconductor chip T is obtained in the imaging device, and the transport unit 4 adjusts the position of the bonding arm 2 so that the suction head 30 reaches a predetermined position with respect to the semiconductor chip T while recognizing the image. To do.

  The bonding arm 2 that has adsorbed the semiconductor chip T to the adsorption head 30 is positioned on the substrate B to be bonded on the bonding stage St as shown in FIG. 4B. This positioning is also performed based on imaging by the imaging device. The transport unit 4 accurately adjusts the position of the bonding arm 2 so that the semiconductor chip T reaches a predetermined position with respect to the substrate B while recognizing the image.

  Next, as shown in FIG. 4C, the bonding arm 2 is lowered, and the lower end of the semiconductor chip T that is attracted and curved by the head body 31 comes into contact with the substrate B.

  From this state, as shown in FIG. 4 (d), the bonding arm 2 is further lowered. Accordingly, the block 315 is elastically deformed by receiving pressure from the lower surface of the support member 311 and the lower surface becomes flat. Along with this, the semiconductor chip T also becomes planar while expelling air to both sides, and the inclusion of bubbles at the joint is prevented. Here, the transparent conductive film heater 33 is energized to generate heat, and the semiconductor chip T and the substrate B are bonded.

  The block 315 preferably has a thickness of 1 to 5 mm. If the thickness is less than the lower limit, the change from a convex shape to a planar shape cannot be obtained sufficiently. On the other hand, when the thickness exceeds the upper limit, the deformability becomes higher than necessary, and accurate positioning becomes difficult. Further, it is desirable that the curvature of the head main body 31 is set so as to form a convex of 50 to 100 μm downward with respect to a horizontal span of 5 to 15 mm. When the lower surface of the block 315 is deformed from a curved state to a flat shape, the distance between both ends is elastically deformed in the direction indicated by the arrow Q and slightly increases. In this embodiment, the descent can be stopped by detecting a change in driving pressure accompanying deformation of the lower surface of the block 315.

  Thereafter, the suction of the suction head 30 is released, the bonding arm 2 is raised, and the substrate B to which the semiconductor chip T is bonded is transported to the next process.

  The curved shape of the lower surface of the head main body is preferably formed by a part of the circumferential surface of a cylinder as shown in FIG. In addition, it is desirable to provide the mark M along the axis L at the center which is the lowermost end. In the direction along the mark M, the length of the head body does not change when it is deformed into a flat shape. Therefore, by adhering a high-precision portion, which is not preferable to cause a change in length in the semiconductor chip, to the head body in a direction along the mark M, an adhesion state to the substrate can be obtained with high accuracy.

  FIG. 6 shows still another example of the suction head used in the bonding apparatus according to the present invention. The suction head 30c has basically the same structure as that shown in FIG. 2, but includes a prism 38 just above the head body 31 (plate member 310). It is arranged at a position for receiving reflected light of light incident in the vertical direction from below. Further, the side wall 39 portion located in the optical path between the prism 38 and the imaging device 5 is assumed to have translucency. For example, as shown in the figure, if the inclined surface of the prism 38 is inclined 45 degrees, the imaging device 5 is disposed at a position away from the prism 38 in the horizontal direction, and is positioned between the prism 38 and the imaging device 5. The side wall 39 is transparent or translucent. Based on this arrangement, the imaging device 5 can irradiate illumination light through the side wall 39, the prism 38, and the head main body 31, and image the reflected light.

  The change of the optical path using such a prism can also be performed by installing a prism at the position of the side wall 21 of the bonding arm 2 and providing the side wall with translucency.

  The present invention is not limited to the above embodiment, and various modifications can be made. In the above-described embodiment, the members described as transparent, such as the plate-like member 310, the support member 311, and the block 315, do not have to be transparent as a whole. As means for bending the optical path of the image pickup apparatus, a reflecting mirror can be used in addition to the prism.

In the above-described embodiment, the suction head is provided with the transparent conductive film heater at the bottom, but the transparent conductive film heater is not necessarily provided. FIG. 7 shows an example of a suction head that does not include a transparent conductive film heater. (A) is a form corresponding to FIG. 2, (b) is FIG. 3, and (c) is a form corresponding to FIG. 30e and 30f are shown respectively. The lower surfaces of the head main bodies 31d and 31e of these suction heads are formed of a plate-like member 310, and the lower surface of the head main body 31f is formed of a block 315. The heating necessary for bonding can be performed by, for example, the heater Ht installed on the bonding stage, or by irradiating the bonding site with an infrared laser from above the arm using the translucency of the bonding arm. Can do.
The

2: Bonding arm 4: Conveying means 5: Imaging device 20: Arm body 30, 30a, 30b, 30c, 30d, 30e: Adsorption head 31, 31a, 31b, 31d, 31e, 31f: Head body 33: Transparent conductive film heater 36: Suction port 310: Plate member 311: Support member 315: Block B: Substrate F: Lead frame
St: Bonding stage T: Semiconductor chip

Claims (5)

In a bonding device that bonds the semiconductor chip adsorbed to the adsorption head at the tip of the bonding arm at the mounting position,
The bonding arm includes a translucent part for imaging that reaches the suction head,
The suction head includes a head body having a translucent portion;
The lower surface of the head main body has a downwardly convex curved shape, and the head main body can be elastically deformed so that the lower surface becomes flat when receiving a pressing force in contact with the upper surface of the semiconductor chip. A bonding apparatus characterized by the above.   The head body is provided with a plate-like member having a downwardly convex curved shape and having translucency at the lower end, and the head body receives a pressing force with the head body in contact with the upper surface of the semiconductor chip. The bonding apparatus according to claim 1, wherein the member is elastically deformed so as to be planar.   The head body is provided with a translucent support member having a flat bottom surface above the plate member, the edge of the plate member being supported by the support member, and the head body is a semiconductor chip. 3. The plate member according to claim 2, wherein the plate member is elastically deformed so as to be in a planar shape in contact with the upper surface of the semiconductor chip and the lower surface of the support member by receiving a pressing force in contact with the upper surface. Bonding equipment.   The head body includes a translucent support member having a flat bottom surface, and a translucent elastic material block having a bottom surface that is in contact with the bottom surface of the support member and has a downwardly convex curved shape. 2. The bonding apparatus according to claim 1, wherein the block can be elastically deformed so that the lower surface becomes flat when receiving a pressing force through the support member in a state of being in contact with the upper surface of the semiconductor chip.   The bonding apparatus according to claim 1, wherein the curved shape of the lower surface of the head main body is formed by a part of a circumferential surface of a cylinder.

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