JP2004147007A - Solid-state image pickup device and method and device for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device which improves positioning precision of a solid-state image pickup element and which corresponds to high pixel and to provide manufacturing method/device of the device. <P>SOLUTION: A head end part 96 of a head part 86 sucks and holds a rear part 2b-side of a package 2 and it abuts on abutment reference faces 76a, 76b and 76c of an abutment reference stopper 62 forming an installation reference face S through a joint face 2f of an installation edge part 2c by an ascending operation of the head part 86 so as to be kept. The solid-state image pickup element 4 is sucked and held by an adsorption face 58a of an adsorption part 58 whose parallelism against the installation reference face S is controlled, and it is depressed to a base part 2a of the package 2 through adhesive 3 by a descending operation of the adsorption part 58 so as to be bonded. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state imaging device configured by mounting a package containing a solid-state imaging device in which a plurality of photoelectric conversion units are two-dimensionally arranged on a lens holder that holds a condenser lens, a manufacturing method thereof, and a manufacturing method thereof Relates to the device.
[0002]
[Prior art]
In order to prevent so-called image blur as much as possible, a solid-state imaging device such as a charge coupled device (CCD) is provided on a focal plane of a lens in a solid-state imaging device provided in an electronic camera or the like. On the other hand, it is necessary to arrange with high accuracy.
[0003]
In this case, for example, as shown in FIG. 7, the solid-state imaging device 1 fixes the solid-state imaging device 4 to a bottom surface portion 2 a in a package 2 formed of ceramic or the like by bonding via an adhesive 3. The solid-state imaging unit 5 and the lens holder 7 to which the lens 6 is attached are configured such that the mounting edge 2 c of the package 2 is fitted to the opening end 7 a of the lens holder 7.
[0004]
In addition, prior to the fitting, the solid-state imaging unit 5 is configured such that each electrode of the solid-state imaging element 4 and each terminal in the package 2 are connected by bonding wires or the like, and the surface of the package 2 to which the solid-state imaging element 4 is fixed. The side is sealed with a transparent body such as glass (not shown).
[0005]
By the way, in the manufacturing process in which the solid-state imaging device 4 is fixed to the bottom surface portion 2a in the package 2, the adhesive 3 is applied to the bottom surface portion 2a in the package 2 in a state where the package 2 is placed on a table such as a conveying means (not shown). After applying, the solid-state imaging device 4 is bonded to the bottom surface portion 2a by pressing the solid-state imaging element 4 with the adhesive 3 by a transfer means (not shown).
[0006]
In this case, the back surface 2b of the package 2 in contact with the table has irregularities and distortions. Especially when the package 2 is made of ceramic, the irregularities and distortions are compared because they are fired at a high temperature. It is said to be big. In FIG. 7, in order to facilitate understanding, the unevenness and distortion of the back surface portion 2 b of the package 2 are shown as inclined surfaces.
[0007]
When the solid-state imaging unit 5 manufactured using such a package 2 is assembled to the lens holder 7 with reference to the inclined back surface portion 2b of the package 2, as shown in FIG. There is a risk of being disposed in an inclined state with respect to the focal plane P (this inclination is referred to as so-called tilting, and the tilt difference in the plane direction of the solid-state imaging device 4 with respect to the focal plane P is defined as the tilt amount A. To do).
[0008]
When the tilt amount (tilt amount) A exceeds a predetermined value, the image obtained by the solid-state imaging device 1 is blurred. With the recent increase in the number of pixels of the solid-state imaging device 1, there is a further demand for higher accuracy of the tilt amount A, that is, lowering of the tilt amount A.
[0009]
For this reason, the technique using the resin-made package 2 considered that surface precision is good compared with the product made from a ceramic is disclosed (refer patent document 1). Further, in the ceramic package 2, a technique is disclosed in which the edge portion of the back surface portion 2b, which is assumed to have large irregularities, is chamfered and the chamfered portion is used as a positioning reference (see Patent Document 2).
[0010]
Further, when the accuracy of the tilt amount A is further required, the entire surface of the back surface 2b of the package 2 may be precisely polished to satisfy the surface accuracy. Alternatively, as shown in FIG. 8, a plate-like auxiliary member 8 may be newly bonded to the back surface portion 2b of the package 2, and the solid-state imaging device 4 may be mounted on the basis of one surface 8a of the auxiliary member 8.
[0011]
[Patent Document 1]
JP-A-6-5726 (paragraphs [0011], [0015], [0037])
[Patent Document 2]
JP 7-161951 A (paragraphs [0016] to [0020])
[0012]
[Problems to be solved by the invention]
However, it has been pointed out that the resin package 2 of Patent Document 1 has a lower strength than the ceramic package 2.
[0013]
Further, when the back surface 2b of the ceramic package 2 is chamfered or precisely polished as in Patent Document 2, a great amount of time and cost are required, and a new auxiliary member 8 is provided. In such a case, there arises a problem that the number of parts increases. For this reason, the cost increase of the solid-state imaging device 1 is caused.
[0014]
The present invention has been made in view of the above problems, and does not increase the cost, improves the positioning accuracy of the solid-state imaging element with respect to the focal plane of the lens in the solid-state imaging device, and increases the number of pixels of the solid-state imaging device. It is an object of the present invention to provide a solid-state imaging device, a manufacturing method thereof, and a manufacturing apparatus that can easily cope with the above.
[0015]
[Means for Solving the Problems]
The solid-state imaging device according to the present invention is a solid-state imaging device configured by mounting a package that houses a solid-state imaging device in which a plurality of photoelectric conversion units are two-dimensionally arranged on a lens holder that holds a condenser lens. The solid-state imaging device is adhesively housed in the package so as to be disposed on a focal plane of the condenser lens with reference to a joint surface between the lens holder and the package.
[0016]
According to the solid-state imaging device according to the present invention, the solid-state imaging device is adhered and accommodated in the package with reference to the joint surface between the lens holder that holds the condenser lens and the package. The solid-state imaging device is positioned and arranged with high accuracy on the focal plane of the condenser lens without being affected by surface accuracy. As a result, it is possible to easily apply the solid-state imaging device to the demand for further higher pixels.
[0017]
In addition, the method for manufacturing a solid-state imaging device according to the present invention is configured by mounting a package that houses a solid-state imaging device in which a plurality of photoelectric conversion units are two-dimensionally arranged on a lens holder that holds a condenser lens. And a bonding surface of the package bonded to the lens holder corresponding to a bonding surface of the lens holder. A step of abutting a positioning jig and positioning the package; and a step of adhering and housing the solid-state imaging device in the package via the adhesive with the positioning jig as a reference. To do.
[0018]
According to the method for manufacturing a solid-state imaging device according to the present invention, the package is positioned by the positioning jig formed corresponding to the bonding surface of the lens holder via the bonding surface of the package that is bonded to the lens holder. The solid-state image sensor is bonded and accommodated in the package via an adhesive applied in the package. For this reason, the solid-state imaging device is positioned and arranged with high accuracy on the focal plane of the condenser lens without being affected by the parallelism or surface accuracy of the back surface of the package. As a result, it is possible to easily manufacture a solid-state imaging device capable of meeting the demand for further higher pixels. In addition, it is not necessary to chamfer or polish the back surface of the ceramic package, or to provide an auxiliary member, so that the manufacturing cost of the solid-state imaging device can be reduced.
[0019]
In the method for manufacturing a solid-state imaging device according to the present invention, the adhesive may be an adhesive having thixotropy and a viscosity of 5 to 50 [Pa · s]. Thus, by setting the viscosity of the adhesive within the above range, it can be easily and reliably positioned and held at the position pressed by the solid-state imaging device.
[0020]
Furthermore, the solid-state imaging device manufacturing apparatus according to the present invention is configured by mounting a package that houses a solid-state imaging device in which a plurality of photoelectric conversion units are two-dimensionally arranged on a lens holder that holds a condenser lens. A solid-state imaging device manufacturing apparatus comprising: an adhesive application mechanism that applies an adhesive into the package that houses the solid-state imaging device; and a positioning surface that corresponds to a bonding surface of the lens holder to which the package is bonded A positioning jig having a position where the bonding surface of the package is brought into contact with the positioning surface of the positioning jig, and holding the package relative to the positioning surface of the positioning jig. A solid-state image sensor mounting mechanism for mounting the solid-state image sensor on the package positioned by a mechanism via the adhesive; Characterized in that it comprises.
[0021]
According to the solid-state imaging device manufacturing apparatus according to the present invention, the positioning of the positioning jig formed corresponding to the bonding surface of the lens holder via the bonding surface of the package is bonded to the lens holder. It is positioned by being brought into contact with the surface by a displacement operation of the package positioning mechanism. In this state, the solid-state image sensor is mounted in the package by the solid-state image sensor mounting mechanism that holds the solid-state image sensor with reference to the positioning surface of the positioning jig through the adhesive applied in the package by the adhesive application mechanism. Like to do. For this reason, the solid-state imaging device is positioned and arranged with higher accuracy on the focal plane of the condenser lens without being affected by the parallelism or surface accuracy of the back surface of the package. As a result, it is possible to more easily manufacture a solid-state imaging device that can meet the demand for higher pixel count. In addition, it is not necessary to chamfer or polish the back surface of the ceramic package, or to provide an auxiliary member, so that the manufacturing cost of the solid-state imaging device can be reduced.
[0022]
In the solid-state imaging device manufacturing apparatus according to the present invention, it is preferable that the package positioning mechanism includes a swingable displacement portion including a suction end portion for sucking the package. As a result, regardless of the parallelism or surface accuracy of the back surface of the package, the joint surface of the package can be accurately brought into contact with the positioning surface of the positioning jig by the swingable displacement portion.
[0023]
Further, in the solid-state imaging device manufacturing apparatus according to the present invention, it is preferable that the displacement portion has a spherical support portion and is swingably supported by an air bearing mechanism. Thereby, the bonding surface of the package can be brought into contact with the positioning surface of the positioning jig more accurately.
[0024]
In the solid-state imaging device manufacturing apparatus according to the present invention, it is preferable that the displacement portion has a planar support portion and is swingably supported by a spring. Thereby, the bonding surface of the package can be brought into contact with the positioning surface of the positioning jig more accurately. In addition, since the structure of the package positioning mechanism can be simplified, the manufacturing cost of the solid-state imaging device can be reduced.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of the solid-state imaging device, the manufacturing method thereof, and the manufacturing device according to the present invention will be described below in detail with reference to the accompanying drawings. The same components as those shown in the prior art may be denoted by the same reference numerals and detailed description thereof may be omitted.
[0026]
FIG. 1 is a schematic cross-sectional explanatory diagram showing a state in which a solid-state imaging unit 10 is incorporated in a solid-state imaging device 12 according to an embodiment of the present invention.
[0027]
The solid-state imaging unit 10 includes a package 2 made of ceramic or the like, and a solid-state imaging device 4 made of a CCD (charge coupled device) or the like housed inside the package 2 with an adhesive 3.
[0028]
The package 2 has an open box shape including a bottom surface portion 2a to which the solid-state imaging device 4 is bonded, a back surface portion 2b that forms a pair with the bottom surface portion 2a, and a peripheral wall 2e that extends substantially perpendicularly from the periphery of the bottom surface portion 2a. Presents. The back surface portion 2b has irregularities, distortions, and the like. In particular, when the package 2 is made of ceramic, the irregularities, distortions, and the like are relatively large because the package 2 is fired at a high temperature. In the present embodiment, in order to facilitate understanding, the unevenness or distortion of the back surface 2b of the package 2 is shown as an inclined state.
[0029]
The package 2 has a mounting edge 2c that extends outward from the peripheral wall 2e. In the solid-state imaging unit 10, the solid-state imaging device 12 is configured by joining the joint surface 2 f of the package 2 to the joint surface 7 b of the opening end 7 a of the lens holder 7 to which the lens (condenser lens) 6 is attached.
[0030]
The adhesive 3 has a predetermined amount near the center of the bottom surface portion 2a of the package 2, for example, an area 1 [cm of the solid-state imaging device 4 ² ] [7] about 7 [mg] is applied. The adhesive 3 has a sufficient amount so that the bottom surface portion 2a of the package 2 and the peripheral edge portion of the back surface 4b of the solid-state image sensor 4 do not contact each other, that is, the back surface 4b of the solid-state image sensor 4 and the bottom surface portion 2a of the package 2. A sufficient amount is applied to maintain the separation distance B. In addition, it is preferable that the separation interval B held by the adhesive 3 is 30 to 50 [μm]. This is to avoid the influence of the undulation (30 [μm]) of the bottom surface portion 2 a of the package 2. On the other hand, when the separation interval B is larger than the above range, that is, when the thickness of the adhesive 3 is excessively large, the dimensional change due to the shrinkage action at the time of curing of the adhesive 3 becomes larger than the allowable range. It is.
[0031]
In the present embodiment, the adhesive 3 is a paste material having a thixotropy and a viscosity of 10 [Pa · s]. In this case, the adhesive 3 has a viscosity of 5 It is preferable to use a paste material of ˜50 [Pa · s] (5,000 to 50,000 [cp]). This is because the paste material needs to conform to the unevenness of the package 2, while the displacement of the solid-state imaging device 4 is avoided until the paste material, that is, the adhesive 3 is cured.
[0032]
A photoelectric conversion unit (not shown) is two-dimensionally arranged inside the light receiving surface 4 a side of the solid-state imaging device 4. In FIG. 1, reference symbol P indicates the focal plane of the lens 6.
[0033]
Further, although not shown, the solid-state imaging unit 10 is configured such that each electrode of the solid-state imaging device 4 and each terminal in the package 2 are connected by bonding wires or the like, and the surface side of the package 2 to which the solid-state imaging device 4 is fixed is, for example, It is sealed with a translucent material such as glass.
[0034]
Next, a manufacturing apparatus 20 for manufacturing the solid-state imaging unit 10 configured as described above will be described with reference to FIG. FIG. 2 is a partially broken perspective view of the manufacturing apparatus 20.
[0035]
The manufacturing apparatus 20 includes a transport unit 24 that transports the carrier 22 on which the package 2 is placed, an adhesive application unit (adhesive application mechanism) 26 that applies the adhesive 3 at the application position Q1, and a solid-state imaging device 4. The element supply unit 28 to be supplied, and the element transfer unit (solid-state image sensor mounting mechanism) for taking out the solid-state image sensor 4 from the take-out position Q2 in the element supply unit 28 and transferring the solid-state image sensor 4 to the package 2 at the assembly position Q3. ) 30, and at the assembly position Q3, the reference surface forming portion 32 where the package 2 is held in contact and the package 2 placed on the carrier 22 are displaced toward the reference surface forming portion 32 and held in contact And an elevating part (package positioning mechanism) 34 that performs.
[0036]
The carrier 22 has a carrier body 36 formed from a plate-like member. The carrier main body 36 is provided with mounting portions 38 for mounting the package 2 at equal intervals along the transport direction (the arrow X direction shown in FIG. 2). The mounting portion 38 is provided with positioning pins 40 for positioning and holding the package 2. In the present embodiment, five placement portions 38 are provided for one carrier 22, but it goes without saying that the number of placement portions 38 can be arbitrarily set.
[0037]
The carrier body 36 has a hole 42 (see FIG. 4) for avoiding interference with the elevating unit 34 when the package 2 is displaced toward the reference plane forming unit 32 by the elevating unit 34, and a conveying unit. In order to pitch-feed the carrier 22 by guide means and drive means (not shown) provided in 24, a plurality of holes 44a and 44b are formed along the side edge of the carrier body 36 and in accordance with the interval of the placement portion 38. Provided.
[0038]
The adhesive application unit 26 adheres from the container 46 to the bottom surface 2a of the package 2 by urging of a container 46 filled with the adhesive 3 and a pressure fluid supplied from a fluid supply means (not shown) via a hose 48. A nozzle 50 that discharges the agent 3 and a container drive mechanism 52 that moves the container 46 forward and backward together with the nozzle 50 toward the package 2 placed on the carrier 22 (in the directions of arrows Z1 and Z2 shown in FIG. 2). Have.
[0039]
The element supply unit 28 includes a conveyor 54 that conveys the solid-state imaging element 4 in the direction of arrow Y and sequentially supplies the solid-state imaging element 4 to the take-out position Q2. In the present embodiment, the solid-state imaging devices 4 are sequentially supplied by the conveyor 54. For example, a predetermined number of solid-state imaging devices 4 are supplied by containers or the like arranged on a plane. Of course.
[0040]
The element transfer unit 30 has a suction part 58 including a shaft 56 and a suction surface 58a. The suction portion 58 is formed by a packing member made of rubber or the like in order to suck and hold the light receiving surface 4a of the solid-state imaging device 4, and the shaft 56 and the suction portion 58 are provided inside. A flow path 60 communicating with a negative pressure source (not shown) is provided (see FIG. 4).
[0041]
The element transfer unit 30 is mounted on a known biaxial moving means or triaxial moving means (not shown). Thereby, the element transfer unit 30 takes out the solid-state image sensor 4 from the extraction position Q2 of the element supply unit 28, moves the solid-state image sensor 4 above the bottom surface 2a of the package 2 at the assembly position Q3, and further The solid-state imaging device 4 is bonded to the package 2 by being pressed toward the applied adhesive 3 that is moved toward the bottom surface portion 2a.
[0042]
The reference surface forming unit 32 includes a contact reference stopper (positioning jig) 62 that is held in contact with the package 2 ascending by the elevating unit 34. The contact reference stopper 62 is attached to the gantry 68 with screws 66 via the side edge portions 64a and 64b. An elastic member such as a spring washer or rubber (not shown) is interposed between the contact reference stopper 62 and the mount 68. Accordingly, by adjusting the tightening amount or the loosening amount of the screw 66 (four in this embodiment), the contact reference stopper 62 can adjust its parallelism, that is, the amount of inclination in the plane direction. It is supported.
[0043]
As shown in FIG. 3, the contact reference stopper 62 is provided with an opening 72 through which the suction portion 58 that sucks and holds the solid-state imaging device 4 at the assembly position Q3 can penetrate from the upper surface 70 side. Further, the contact surface 2f of the package 2 is brought into contact with the lower surface 74 side of the contact reference stopper 62, so that the contact surface 2f is kept flush with the mounting reference surface S (see FIG. 4). Contact reference surfaces (positioning surfaces) 76a, 76b and 76c are provided.
[0044]
These contact reference surfaces 76 a, 76 b and 76 c are formed so as to project from the stepped portion 78 toward the center of the opening 72. In this embodiment, three contact reference surfaces 76a, 76b, and 76c are provided, but at least three contact reference surfaces 76a, 76b, and 76c are provided to define the mounting reference surface S. It is enough if you keep it.
[0045]
Here, the mounting reference surface S corresponds to the joint surface 7b of the open end 7a of the lens holder 7 on which the solid-state imaging unit 10 including the package 2 is mounted. By adjusting the screw 66, the parallelism of the mounting reference surface S with respect to the suction surface 58a of the suction portion 58 can be defined. By precisely defining the parallelism, the tilt amount A of the solid-state imaging device 4 described above is adjusted precisely.
[0046]
In FIG. 3, reference numerals 82 and 84 denote an inclined portion and a relief portion for avoiding interference with a portion (not shown) protruding from the peripheral surface of the suction portion 58.
[0047]
The elevating part 34 sucks and holds the back surface part 2b of the package 2 and displaces the package 2 toward the contact reference stopper 62, and a head support part 88 that swingably supports the head part 86. And a sliding support portion 92 that slidably supports the head support portion 88 by an elastic member such as a spring 90, and a lifting support portion 94 that supports the sliding support portion 92 so as to be movable up and down.
[0048]
In order to adsorb the package 2, the head portion 86 has a head end portion 96 made of a packing member such as rubber, a hemispherical bottom portion (support portion) 98, and a flow path 100 communicated with a negative pressure source (not shown). (See FIG. 4).
[0049]
The head support portion 88 includes a support portion main body 104 including a flange portion 102 protruding outward from the peripheral surface, an air bearing mechanism 106 provided in the support portion main body 104, and a support shaft 108 coupled to the support portion main body 104. , A flow path 114 (one end is connected to the flow path 100 via a void 110 constituting the air bearing mechanism 106 and the other end is connected to a negative pressure source (not shown) via a flow path 112 of the support shaft 108. 4). The air bearing mechanism 106 supports the head portion 86 by a bottom portion 98 so as to be swingable.
[0050]
In FIG. 4, reference numeral 116 denotes the peripheral edge 118 in order to prevent the negative pressure source from communicating with the outside (in the atmosphere) from the peripheral edge 118 of the air bearing mechanism 106 and the bottom 98 of the head portion 86. And a telescopic closing body that seals between the support body 104 and the periphery of the support body 104.
[0051]
The sliding support portion 92 includes a housing 120 and a space 122 that slidably supports the support portion main body 104 inside the housing 120. Further, the sliding support portion 92 supports one end of the spring 90 by the bottom portion 124 of the housing 120, thereby biasing the support portion main body 104 upward (on the carrier main body 36 on which the package 2 is placed). doing. Therefore, as can be easily understood from FIG. 4, the support body 104 is supported under the elastic action of the spring 90 in a state where the flange portion 102 is in contact with the inner side of the upper end portion 126 of the housing 120. The In addition, the raising / lowering support part 94 which supports the sliding support part 92 so that raising / lowering is possible is comprised from well-known forward / backward drive means, such as a cylinder, for example.
[0052]
Next, operations and effects of the manufacturing apparatus 20 configured as described above will be described in relation to a method for manufacturing the solid-state imaging unit 10 manufactured by the manufacturing apparatus 20.
[0053]
The carrier body 36 on which a predetermined number of packages 2 are previously placed is pitch-fed through the holes 44a and 44b by the operation of guide means and drive means (not shown) of the transport unit 24.
[0054]
First, the package 2 positioned and placed on the placement portion 38 of the carrier body 36 is transported to the application position Q1. At the application position Q 1, the operation of the container driving mechanism 52 of the adhesive application unit 26 moves the nozzle 50 together with the container 46 toward the package 2 (in the direction of the arrow Z 1 shown in FIG. 2), and the tip of the nozzle 50 is the tip of the package 2. Stopped at a predetermined interval from the bottom surface 2a.
[0055]
For example, the adhesive 3 filled in the container 46 by the urging of the pressure fluid whose pressure is controlled passes through the nozzle 50 and passes through the nozzle 50 to a predetermined amount, for example, in the center of the bottom surface portion 2a. In the case where the solid-state imaging device 4 is a 1/2 inch CCD, about 5 mg is applied. In this case, the adhesive 3 is a paste material having a thixotropic viscosity of 10 [Pa · s]. The viscosity of the adhesive 3 is preferably 5 to 50 [Pa · s].
[0056]
After the application of the adhesive 3 is completed, the nozzle 50 together with the container 46 is moved toward the original position by the operation of the container driving mechanism 52, that is, the origin position of the container driving mechanism 52 (in the direction of arrow Z2 shown in FIG. 2). Is done.
[0057]
Next, the package 2 to which the adhesive 3 has been applied is pitch-fed together with the carrier body 36 and conveyed to the assembly position Q3.
[0058]
During this time, the solid-state imaging device 4 is conveyed to the take-out position Q2 by the operation of the conveyor 54 of the element supply unit 28. Further, the element transfer unit 30 is operated by a biaxial moving unit or a triaxial moving unit (not shown), and the suction unit 58 is moved to the take-out position Q2. Then, due to urging from a negative pressure source (not shown), the suction unit 58 sucks and holds the solid-state imaging device 4 by the suction surface 58a. In this state, the element transfer unit 30 is operated again, and the suction unit 58 that sucks and holds the solid-state imaging device 4 moves to the assembly position Q3.
[0059]
At the assembly position Q3, as shown in FIG. 4, with the package 2 coated with the adhesive 3 in between, the suction part 58 that sucks and holds the solid-state imaging device 4 and the head part 86 of the elevating part 34 are Facing each other on a common axis.
[0060]
From this state, first, by the operation of the lifting support portion 94 of the lifting portion 34, the sliding support portion 92 is raised toward the carrier body 36 on which the package 2 is placed (in the direction of arrow Z3 shown in FIG. 4). When the sliding support portion 92 is raised, the flow path 100 of the head portion 86 is biased to the suction state via the flow paths 112 and 114 by the biasing of a negative pressure source (not shown).
[0061]
When this suction state is maintained and the sliding support portion 92 is further raised, the head end portion 96 of the head portion 86 passes through the hole portion 42 and comes into contact with the back surface portion 2b of the package 2, so that the package 2 The portion 96 is sucked and held. Further, the sliding support portion 92 is raised, and the package 2 sucked and held by the head end portion 96 is brought into contact with the contact reference surface 76a of the contact reference stopper 62 that forms the mounting reference surface S through the joint surface 2f. Abut against 76b and 76c.
[0062]
At this time, the package 2 is held by the head portion 86 that can be swung according to the unevenness or distortion of the back surface portion 2b, and under the elastic action of the spring 90 provided in the space 122 of the sliding support portion 92. Are held in contact with the contact reference surfaces 76a, 76b and 76c. Then, after the sliding support portion 92 is raised to a predetermined position, the operation is stopped (see FIG. 5).
[0063]
Next, the element transfer unit 30 is actuated, and the suction unit 58 that sucks and holds the solid-state imaging device 4 descends toward the contact reference stopper 62 side on which the package 2 is abutted and held (arrow shown in FIG. 4). Z4 direction). The suction part 58 passes through the opening 72 of the contact reference stopper 62, and the back surface 4 b of the solid-state imaging device 4 held by suction comes into contact with the adhesive 3 applied to the package 2 and further toward the adhesive 3. The solid-state imaging device 4 is bonded to the package 2 by being pressed. The solid-state imaging device 4 held by suction is stopped at a position having a predetermined separation interval B (see FIG. 1) from the bottom surface portion 2a (see FIG. 5).
[0064]
Subsequently, the urging of the suction unit 58 from the negative pressure source is stopped, the suction holding of the solid-state imaging device 4 by the suction unit 58 is released, and the element transfer unit 30 is operated to return the suction unit 58 to the original state. , That is, the origin position of the suction portion 58 (in the direction of arrow Z5 shown in FIG. 4). On the other hand, the slide support portion 92 is lowered toward the original position, that is, the origin position of the slide support portion 92 (in the direction of arrow Z6 shown in FIG. 4) by the operation of the lifting support portion 94, and the head portion. The biasing from the negative pressure source to 86 is stopped, and the package 2 to which the solid-state imaging device 4 is fixed, that is, the solid-state imaging unit 10 is placed on the placement portion 38 of the carrier body 36 again.
[0065]
In the solid-state imaging unit 10, the carrier body 36 is pitch-fed again by the operation of the transport unit 24, and after passing through a connection process such as a bonding wire (not shown), the transport body 24 is transported to a sealing process of a transparent body such as glass.
[0066]
Thus, according to the solid-state imaging unit 10 manufactured by the manufacturing apparatus 20 and the manufacturing method thereof, the parallelism of the package 2, that is, the adsorption, without being affected by the unevenness or distortion of the back surface portion 2 b of the package 2. The parallelism of the bonding surface 2f of the package 2 with respect to the suction surface 58a of the portion 58 is precisely defined by the contact reference surfaces 76a, 76b and 76c of the contact reference stopper 62. Therefore, in this way, the solid-state imaging unit 10 having the solid-state imaging device 4 fixed to the bottom surface portion 2a of the package 2 is fitted into the lens holder 7, and the joint surface 7b of the lens holder 7 and the joint surface 2f of the package 2 are Are joined to the focal plane P of the lens 6 in a state where the tilt amount A of the solid-state imaging device 4 is extremely small (see FIG. 1). As a result, it is possible to easily apply the solid-state imaging device 12 to the demand for further increase in pixels.
[0067]
Further, the package 2 is held by the contact reference surfaces 76a, 76b and 76c of the contact reference stopper 62 formed corresponding to the bonding surface 7b of the opening end portion 7a of the lens holder 7 through the bonding surface 2f. In this state, since the peripheral edge portion of the back surface 4b of the solid-state imaging device 4 is bonded so as not to contact the bottom surface portion 2a of the package 2 via the adhesive 3, the parallelism or surface accuracy of the bottom surface portion 2a and the bonding surface 2f The solid-state imaging device 4 can be positioned in a state where the tilt amount A is extremely small with respect to the focal plane P of the lens 6 in the solid-state imaging device 12.
[0068]
Furthermore, it is not necessary to chamfer or polish the back surface portion 2b of the ceramic package, or to provide the auxiliary member 8, so that the manufacturing cost of the solid-state imaging device 12 can be reduced.
[0069]
In order to accurately maintain the parallelism between the mounting reference surface S described above, that is, the suction surface 58a of the suction portion 58 and the contact reference surfaces 76a, 76b, and 76c, for example, optical means such as an autocollimator Use to adjust.
[0070]
For example, at the assembly position Q3 of the manufacturing apparatus 20, the suction portion 58 is held in a state of facing the contact reference stopper 62, and in this state, the contact reference stopper 62 facing the suction surface 58a of the suction portion 58 is contacted. Predetermined light is emitted from the light source of the autocollimator toward the flat surface (mounting reference surface S) defined by the contact reference surfaces 76a, 76b and 76c, and each reflected light is detected by a built-in CCD camera or the like. When inclination (deviation) is detected in the reflected light, as described above, the tightening amount or the loosening amount of the screw 66 of the contact reference stopper 62 is adjusted so that the inclinations coincide with each other. To do.
[0071]
Next, the raising / lowering part 128 as other embodiment in the manufacturing apparatus 20 mentioned above is demonstrated, referring FIG.
[0072]
In the following description, the same components as those of the manufacturing apparatus 20 shown in FIGS. 2, 4 and 5 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0073]
In the elevating part 128 in this embodiment, the head part 136 is disposed in the space 134 in the housing 132 of the sliding support part 130, and the recess 140 of the flange part (planar support part) 138 and the housing 132. It is supported under the biasing action of a spring 144 held by the bottom 142. In this case, a hole 148 is formed in the upper end portion 146 of the housing 132 so as not to interfere with the head portion 136 in order to support the head portion 136 in a swingable manner.
[0074]
The lift 128 can simplify the structure as compared to the lift 34. As a result, the manufacturing cost of the manufacturing apparatus 20 can be reduced.
[0075]
【The invention's effect】
According to the present invention, the following effects can be obtained.
[0076]
That is, when the package in which the solid-state imaging device is bonded and accommodated is fitted into the lens holder, it can be positioned with high accuracy on the focal plane of the condenser lens regardless of the accuracy of the package. As a result, the solid-state imaging device can be easily applied to the demand for higher pixels.
[0077]
In addition, the manufacturing cost of the solid-state imaging device can be reduced.
[Brief description of the drawings]
FIG. 1 is a cross-sectional explanatory view showing a solid-state imaging device according to an embodiment of the present invention.
2 is a partially broken perspective explanatory view of a manufacturing apparatus for manufacturing a solid-state imaging unit to be mounted on the solid-state imaging apparatus shown in FIG. 1;
FIG. 3 is an enlarged perspective view of a main part of the manufacturing apparatus shown in FIG.
4 is an explanatory cross-sectional view of a main part of the manufacturing apparatus shown in FIG. 2. FIG.
5 is an explanatory cross-sectional view of a main part in an operating state of the manufacturing apparatus shown in FIG.
6 is an explanatory cross-sectional view of a main part of an operation state of another embodiment in the manufacturing apparatus shown in FIG. 5. FIG.
FIG. 7 is a cross-sectional explanatory view showing a solid-state imaging device according to the prior art.
FIG. 8 is an explanatory cross-sectional view showing a solid-state imaging device according to another conventional technique.
[Explanation of symbols]
2 ... Package 2a ... Bottom
2b ... back side 2c ... mounting edge
2e ... peripheral wall 2f, 76 ... joint surface
3 ... Adhesive 4 ... Solid-state image sensor
DESCRIPTION OF SYMBOLS 10 ... Solid-state imaging unit 12 ... Solid-state imaging device
20 ... Manufacturing equipment 22 ... Carrier
24 ... Conveying unit 28 ... Element supply unit
30 ... Element transfer portion 32 ... Reference plane forming portion
34, 128 ... Elevating part 58 ... Adsorption part
58a ... Suction surface 62 ... Contact reference stopper
76a to 76c: contact reference surface 86, 136: head portion
88 ... Head support 92, 130 ... Sliding support
96 ... Head end A ... Amount of tilt
B ... Separation interval S ... Mounting reference plane

Claims (7)

In a solid-state imaging device configured by mounting a package containing a solid-state imaging device in which a plurality of photoelectric conversion units are two-dimensionally arranged on a lens holder that holds a condenser lens,
The solid-state imaging device is characterized in that the solid-state imaging device is adhesively accommodated in the package so as to be disposed on a focal plane of the condenser lens with reference to a joint surface between the lens holder and the package. In a manufacturing method of a solid-state imaging device configured by mounting a package containing a solid-state imaging device in which a plurality of photoelectric conversion units are two-dimensionally arranged on a lens holder that holds a condenser lens,
Applying an adhesive in the package containing the solid-state imaging device;
Contacting the bonding surface of the package to be bonded to the lens holder with a positioning jig corresponding to the bonding surface of the lens holder, and positioning the package;
Adhering and housing the solid-state imaging device in the package via the adhesive with the positioning jig as a reference;
A method for manufacturing a solid-state imaging device, comprising: In the manufacturing method of Claim 2,
The method of manufacturing a solid-state imaging device, wherein the adhesive is an adhesive having thixotropy and a viscosity of 5 to 50 [Pa · s]. A solid-state imaging device manufacturing apparatus configured by mounting a package containing a solid-state imaging device in which a plurality of photoelectric conversion units are two-dimensionally arranged on a lens holder that holds a condenser lens,
An adhesive application mechanism for applying an adhesive in the package that houses the solid-state imaging device;
A positioning jig having a positioning surface corresponding to the bonding surface of the lens holder to which the package is bonded;
A package positioning mechanism for positioning the bonding surface of the package in contact with the positioning surface of the positioning jig;
A solid-state image sensor mounting mechanism that holds the positioning surface of the positioning jig as a reference and mounts the solid-state image sensor on the package positioned by the package positioning mechanism via the adhesive;
An apparatus for manufacturing a solid-state imaging device. The manufacturing apparatus according to claim 4, wherein
The apparatus for manufacturing a solid-state imaging device, wherein the package positioning mechanism has a swingable displacement portion including a suction end portion for sucking the package. The manufacturing apparatus according to claim 5, wherein
The apparatus for manufacturing a solid-state imaging device, wherein the displacement portion has a spherical support portion and is swingably supported by an air bearing mechanism. The manufacturing apparatus according to claim 5, wherein
The apparatus for manufacturing a solid-state imaging device, wherein the displacement portion has a planar support portion and is swingably supported by a spring.

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