WO2015056720A1 - Method for manufacturing imaging module and device for manufacturing imaging module - Google Patents

Abstract

　The purpose of the invention is to provide a method and device for manufacturing an imaging module capable of positioning an imaging element unit and a lens unit in a highly accurate manner. In the manufacturing device (200), in a state in which the back surface of a substrate (21)　of the imaging element unit (20) is attached to the attachment surface (115a) of an attachment head (115) and the imaging element unit (20) is held on a Z-axis, and the lens unit (10) is held on the Z-axis, the Z-axis position of the imaging element unit (20) is changed relative to the lens unit (10), and a measurement chart (89) is imaged using an imaging element (27). The position and the tilt of the imaging element unit (20) relative to the lens unit (10) is adjusted on the basis of an imaging signal obtained by the above imaging.

Description

Imaging module manufacturing method and imaging module manufacturing apparatus

The present invention relates to an imaging module manufacturing method and an imaging module manufacturing apparatus.

In portable electronic devices such as a mobile phone having a photographing function, a small and thin imaging module is mounted. This imaging module has a structure in which a lens unit in which a photographing lens is incorporated and an imaging element unit in which an imaging element such as a CCD image sensor or a CMOS image sensor is incorporated are integrated.

The imaging module has an auto-focus (AF) mechanism for adjusting the focus by moving the lens in the lens unit, and the lens unit and the image sensor unit are moved relative to each other in the direction perpendicular to the optical axis to capture an image. Some have an optical image blur correction mechanism for optically correcting image blur.

For example, Patent Documents 1 and 2 describe an imaging module having an AF mechanism.

In recent years, image sensors used in image pickup modules have been widely used having a low pixel number of about 1 million to 2 million pixels to a high number of pixels of 3 million to 10 million pixels or more. ing.

When using an image sensor with a low number of pixels, high accuracy was not required for alignment between the lens unit and the image sensor unit. However, when using an image sensor with a high number of pixels, alignment with high accuracy was not required. Necessary.

Patent Documents 1 to 3 describe techniques for fixing a lens unit and an image sensor unit after aligning the lens unit and the image sensor unit.

In Patent Document 1, after setting a lens unit and an image sensor unit to an initial position, a chart is imaged by the image sensor while moving the image sensor unit in the optical axis direction, and the lens unit and the image sensor are obtained from the obtained captured image. Adjust the unit position. After this adjustment, the lens unit and the image sensor unit are bonded and fixed.

Patent Document 3 describes a method of holding an image pickup element unit by sucking and holding the back surface of a circuit board on which an image pickup element is formed by a suction nozzle.

Japanese Unexamined Patent Publication No. 2010-21985 Japanese Unexamined Patent Publication No. 2011-133509 Japanese Unexamined Patent Publication No. 2008-46630

The camera module manufacturing apparatus described in Patent Document 1 holds the side surface of the image sensor unit with a chuck hand when the image sensor unit is held in the manufacturing apparatus. As the image sensor unit becomes thinner, there is a possibility that the image sensor unit will warp in the holding state when the chuck hand holds the side surface.

As described in Patent Document 3, it is also conceivable to hold the image sensor unit by suction. However, in Patent Document 3, a pair of nozzles is applied to a substrate on which an image sensor is formed to adsorb the substrate.

In this method, there is a high possibility that the image sensor unit is warped, and it is difficult to accurately align the lens unit and the image sensor unit. In particular, in an image pickup device in which the pixel pitch is narrow due to the increase in the number of pixels, a slight warp has a large influence on the image quality, and thus countermeasures against the warp are important.

The present invention has been made in view of the above circumstances, and a method of manufacturing an imaging module capable of accurately determining the position of the imaging element unit when aligning the imaging element unit and the lens unit and improving imaging quality. And it aims at providing a manufacturing apparatus.

The manufacturing method of an imaging module of the present invention is a manufacturing method of an imaging module having a lens unit having a lens group, and an imaging element unit having an imaging element fixed to the lens unit and imaging a subject through the lens group. And changing the relative position in the axial direction of at least one of the image sensor unit, the lens unit, and the measurement chart on an axis orthogonal to the measurement chart, and the image sensor at each relative position. The imaging element unit for the lens unit based on a first step of imaging the measurement chart through the lens group by the imaging element and an imaging signal obtained by imaging the measurement chart by the imaging element At least to adjust the inclination of the image sensor unit. A suction head having a suction surface perpendicular to the axis and a suction hole surrounded by the suction surface, the first step including the suction surface. Air is sucked from the suction hole of the suction head having a straight line passing through the suction hole twice across the suction surface on a plane, and the image sensor unit is sucked to the suction surface to suck the image sensor. The imaging is performed while the unit is held.

An imaging module manufacturing apparatus according to the present invention includes a measurement chart installation unit for installing a measurement chart, and a subject through a lens unit having a lens group on an axis orthogonal to the measurement chart installed in the measurement chart installation unit. An image sensor unit holding unit for holding an image sensor unit having an image sensor for imaging, and a lens unit for holding the lens unit on the axis between the measurement chart setting unit and the image sensor unit holding unit. At least one of the lens unit holding unit, the measurement chart setting unit, the lens unit holding unit, and the image sensor unit holding unit is changed in the axial direction, and the image sensor is changed at each relative position. The image sensor of the unit is driven, and the measurement is performed through the lens unit by the image sensor. A control unit that images the chart, an adjustment unit that adjusts at least an inclination of the image sensor unit with respect to the lens unit based on an image signal obtained by imaging the measurement chart by the image sensor, and an adjustment by the adjustment unit A unit fixing portion that fixes the subsequent imaging element unit to the lens unit, and the imaging element unit holding portion has a suction surface orthogonal to the axis and a suction hole surrounded by the suction surface And a suction part that sucks air from the suction hole, and the suction head has a straight line passing through the suction hole twice across the suction surface on a plane including the suction surface. is there.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method and manufacturing apparatus of an imaging module which can determine the position of an image sensor unit at the time of alignment of an image sensor unit and a lens unit, and can improve imaging quality can be provided. .

1 is an external perspective view of an imaging module 100. FIG. FIG. 2 is an external perspective view of an image sensor unit 20 in a state where a lens unit 10 is omitted in the image pickup module 100 shown in FIG. 1. FIG. 2 is a cross-sectional view of the imaging module 100 shown in FIG. The figure which shows the electrical connection structure in the lens unit 10 shown in FIG. 2 is a side view illustrating a schematic configuration of a manufacturing apparatus 200 of the imaging module 100. It is a front view of a measurement chart. 6 is an explanatory diagram illustrating a holding state of the lens unit 10 and the imaging element unit 20 by the imaging module manufacturing apparatus 200. FIG. It is a figure which shows the structure of the adsorption | suction head of the imaging module manufacturing apparatus. It is a figure for demonstrating arrangement | positioning of the ultraviolet lamp of the imaging module manufacturing apparatus. 2 is a block diagram illustrating an internal configuration of an imaging module manufacturing apparatus 200. FIG. 4 is a flowchart for explaining a manufacturing process of an imaging module by the imaging module manufacturing apparatus 200. It is a figure which shows the modification of a structure of the adsorption | suction head of the imaging module manufacturing apparatus. It is a figure which shows the modification of a structure of the adsorption | suction head of the imaging module manufacturing apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is an external perspective view of the imaging module 100.

The imaging module 100 includes a lens unit 10 having a lens group 12 and an imaging element unit 20 having an imaging element (not shown in FIG. 1) that is fixed to the lens unit 10 and images a subject through the lens group 12.

In FIG. 1, the direction along the optical axis Ax of the lens group 12 is defined as the z direction, and the two directions orthogonal to the z direction and orthogonal to each other are defined as the x direction and the y direction, respectively.

The lens unit 10 includes a casing 11 that accommodates each component described later.

On the top surface 11 a of the housing 11, an opening 11 b centering on the optical axis Ax of the lens group 12 is formed. The imaging module 100 captures subject light from the opening 11b into the lens group 12 for imaging.

Further, on the top surface 11a of the casing 11, concave portions 95A, 95B, and 95C for positioning for holding the lens unit 10 in the manufacturing apparatus when the imaging module 100 is manufactured are formed. Recesses 95A1 and 95C1 smaller than the recesses 95A and 95C are formed on the bottom surfaces of the recesses 95A and 95C arranged on the diagonal line of the top surface 11a.

A part of the flexible substrate 13 accommodated in the housing 11 is exposed outside the housing 11. A lens unit terminal portion 14 including terminals 14A to 14F is connected to the tip of the exposed portion of the flexible substrate 13.

As will be described later, the lens unit terminal portion 14 includes terminals other than the terminals 14A to 14F. However, in FIG. 1, only the terminals 14A to 14F are illustrated for simplification, and the other terminals are not illustrated. is doing.

FIG. 2 is an external perspective view of the imaging module 100 shown in FIG. 1 with the lens unit 10 omitted.

As shown in FIG. 2, the image pickup device unit 20 includes a substrate 21 on which an image pickup device 27 such as a CCD image sensor or a CMOS image sensor is formed, and a flexible substrate 22 that is electrically connected to the substrate 21.

The pixel pitch of the image sensor 27 is not particularly limited, but a pixel pitch of 1.0 μm or less is used. Here, the pixel pitch refers to the smallest distance among the distances between the centers of the photoelectric conversion regions included in the pixels included in the image sensor 27.

In recent years, with the increase in the number of pixels, the pixel pitch of the image sensor has become narrower, but when the pixel pitch becomes narrower, the area per pixel becomes smaller. As a result, the radius of the allowable circle of confusion is reduced and the depth of focus is reduced. Furthermore, since it is necessary to increase the amount of light collected per pixel, the F number of the lens tends to be small.

For these reasons, recent imaging modules are required to have a very small depth of focus and high alignment accuracy between the lens unit and the imaging element unit.

A cylindrical cover holder 25 is formed on the substrate 21, and an image sensor 27 is disposed inside the cover holder 25. A cover glass (not shown) is fitted in the hollow portion of the cover holder 25 above the image sensor 27.

On the surface of the substrate 21 outside the cover holder 25, an image sensor unit terminal portion including terminals 24A to 24F for electrical connection with the lens unit 10 is provided. Similarly to the lens unit terminal unit 14, only a part of the image sensor unit terminal unit is illustrated.

The substrate 21 is provided with an image sensor wiring connected to a data output terminal and a drive terminal of the image sensor 27. The imaging element wiring is connected to the external connection terminal portion 23 provided at the end of the flexible substrate 22 via the wiring provided on the flexible substrate 22. The external connection terminal portion 23 functions as an electrical connection portion that is electrically connected to the image sensor 27.

In addition, the substrate 21 is provided with a lens unit wiring connected to each terminal included in the image sensor unit terminal portion. The lens unit wiring is connected to the external connection terminal portion 23 provided at the end of the flexible substrate 22 via the wiring provided on the flexible substrate 22.

In a state where the lens unit 10 and the image sensor unit 20 are fixed, each terminal of the lens unit terminal unit and each terminal of the image sensor unit terminal unit corresponding thereto are electrically connected.

In FIG. 1, the terminal 14A and the terminal 24A are electrically connected, the terminal 14B and the terminal 24B are electrically connected, the terminal 14C and the terminal 24C are electrically connected, and the terminal 14D and the terminal 24D are connected. The terminals 14E and 24E are electrically connected, and the terminals 14F and 24F are electrically connected.

FIG. 3 is a cross-sectional view taken along line AA of the imaging module 100 shown in FIG.

As shown in FIG. 3, the image sensor 27 is disposed in a recess provided in the substrate 21 and is sealed by a cover holder 25 provided on the substrate 21 and a cover glass 26 fitted in the cover holder 25. ing.

As shown in FIG. 3, the lens unit 10 includes a lens group 12 including a plurality of lenses (four lenses 12A to 12D in the example of FIG. 3) disposed above the cover glass 26, and supports the lens group 12. A cylindrical lens barrel 15, a bottom block 19 placed on the upper surface of the cover holder 25 of the image sensor unit 20, a flexible substrate 13 fixed on the bottom block 19, and a lens connected to the flexible substrate 13 A unit terminal portion (only the terminal 14 </ b> C is shown because of a cross section in FIG. 3) and a lens driving device 16 formed above the flexible substrate 13 are provided.

The lens group 12, the lens barrel 15, the bottom block 19, the flexible substrate 13, and the lens driving device 16 are accommodated in the housing 11.

The lens driving device 16 includes a first lens driving unit, a second lens driving unit, a third lens driving unit, and a Hall element as a position detection element that detects the position of the lens.

The first lens driving unit sets at least a part of the lenses in the lens group 12 (all the lenses in the lens group 12 in the example of FIG. 3) in a first direction along the optical axis Ax of the lens group 12 ( It is a drive unit for performing focus adjustment by moving in the z direction in FIG.

The second lens driving unit and the third lens driving unit have at least some of the lenses in the lens group 12 (all the lenses in the lens group 12 in the example of FIG. 3) as the optical axis Ax of the lens group 12. It is a drive unit for correcting blurring of an image picked up by the image sensor 27 by moving in a second direction (x direction in FIG. 1) and a third direction (y direction in FIG. 1) orthogonal to each other.

The first lens driving unit, the second lens driving unit, and the third lens driving unit are actuators for moving the lens, respectively. In this embodiment, a voice coil motor (VCM) is used. Other known means may be employed.

FIG. 4 is a block diagram showing an electrical connection configuration of the lens unit 10 shown in FIG.

As shown in FIG. 4, the lens driving device 16 detects an x-direction VCM 16A (the second lens driving unit) for moving the lens group 12 in the x direction and a position of the lens group 12 in the x direction. an x-direction hall element 16B, a y-direction VCM 16C (the third lens driving unit) for moving the lens group 12 in the y-direction, and a y-direction hall element 16D for detecting the y-direction position of the lens group 12; The z-direction VCM 16E (the first lens driving unit) for moving the lens group 12 in the z-direction and the z-direction hall element 16F for detecting the z-direction position of the lens group 12 are provided.

The x-direction VCM 16A has two terminals, and each of the two terminals is electrically connected to the terminal 14A and the terminal 14B via a wiring formed on the flexible substrate 13.

The x-direction hall element 16B has four terminals, and each of the four terminals is electrically connected to the terminal 14a, the terminal 14b, the terminal 14c, and the terminal 14d through a wiring formed on the flexible substrate 13. ing.

The y-direction VCM 16C has two terminals, and each of the two terminals is electrically connected to the terminal 14C and the terminal 14D through wiring formed on the flexible substrate 13.

The y-direction hall element 16D has four terminals, and each of the four terminals is electrically connected to the terminal 14e, the terminal 14f, the terminal 14g, and the terminal 14h via wiring formed on the flexible substrate 13. ing.

There are two terminals in the z-direction VCM 16E, and each of the two terminals is electrically connected to the terminal 14E and the terminal 14F via a wiring formed on the flexible substrate 13.

The z-direction hall element 16F has four terminals, and each of the four terminals is electrically connected to the terminal 14i, the terminal 14j, the terminal 14k, and the terminal 14l through the wiring formed on the flexible substrate 13. ing.

The number of terminals required for each lens driving unit and each Hall element is an example, and is not limited to the above.

In the imaging module 100 having the above configuration, first, the lens unit 10 and the imaging element unit 20 are separately manufactured. Then, an adjustment process for aligning the lens unit 10 and the image sensor unit 20 is performed so that the imaging surface of the subject imaged by the lens group 12 coincides with the image pickup surface of the image sensor 27, and then the lens. The unit 10 and the image sensor unit 20 are bonded and fixed.

The above adjustment process is performed by moving the image sensor unit 20 in a state where the lens unit 10 is held in a predetermined posture by the manufacturing apparatus.

FIG. 5 is a side view showing a schematic configuration of the manufacturing apparatus 200 for the imaging module 100.

The imaging module manufacturing apparatus 200 adjusts the position and inclination of the imaging element unit 20 with respect to the lens unit 10, and after the adjustment, fixes the imaging element unit 20 to the lens unit 10 to complete the imaging module 100.

The imaging module manufacturing apparatus 200 includes a chart unit 71, a collimator unit 73, a lens positioning plate 75, a lens holding mechanism 77, an imaging element unit holding unit 79, an adhesive supply unit 81, and an ultraviolet lamp 83a as a light source. 83b and a control unit 85 for controlling them. These are supported by a surface 87 parallel to the direction of gravity, and are arranged in one direction on the surface 87.

The chart unit 71 includes a box-shaped casing 71a, a measurement chart 89 fitted in the casing 71a, and a light source 91 that is incorporated in the casing 71a and illuminates the measurement chart 89 from the back with parallel light. It is configured. The measurement chart 89 is formed of, for example, a plastic plate having light diffusibility. The chart surface of the measurement chart 89 is perpendicular to the direction of gravity. The chart unit 71 functions as a measurement chart installation unit for installing a measurement chart. The measurement chart 89 may be removable and replaceable with another one.

FIG. 6 is a diagram showing a chart surface of the measurement chart 89. The measurement chart 89 has a rectangular shape, and a plurality of chart images CH1, CH2, CH3, CH4, and CH5 are printed on the chart surface on which the chart pattern is provided.

The plurality of chart images are all the same image, and are so-called ladder-like chart patterns in which black lines are arranged at predetermined intervals. Each chart image is composed of a horizontal chart image Px arranged in the horizontal direction of the image and a vertical chart image Py arranged in the vertical direction of the image.

The collimator unit 73 is arranged to face the chart unit 71 on the Z axis which is a perpendicular to the chart surface of the measurement chart 89 and passes through the chart surface center 89a.

The collimator unit 73 includes a bracket 73a fixed to a work table 87 and a collimator lens 73b.

The collimator lens 73b collects the light emitted from the chart unit 71, and causes the collected light to enter the lens positioning plate 75 through the opening 73c formed in the bracket 73a. By adjusting the distance between the chart unit 71 and the collimator unit 73, the virtual image position of the measurement chart 89 imaged by the lens unit 10 can be set to an arbitrary distance (for example, a standard suitable for an infinite position or imaging assumed by the lens unit 10). The subject distance).

The lens positioning plate 75 and the lens holding mechanism 77 constitute a lens unit holding unit that holds the lens unit 10 on the Z axis between the chart unit 71 and the image sensor unit holding unit 79.

The lens positioning plate 75 is formed to have rigidity, for example, by metal, and is provided with an opening 75c through which the light condensed by the collimator unit 73 passes. The lens positioning plate 75 is disposed facing the collimator unit 73 on the Z axis.

FIG. 7 is an explanatory diagram showing a holding state of the lens unit 10 and the imaging element unit 20 by the imaging module manufacturing apparatus 200.

As shown in FIG. 7, on the lens holding mechanism 77 side surface of the lens positioning plate 75, three contact pins 93A, 93B, and 93C are provided around the opening 75a.

Of the three contact pins 93A, 93B, 93C, insertion pins 93A1, 93C1 having a smaller diameter than the contact pins are provided at the tips of the two contact pins 93A, 93C arranged diagonally. Yes.

The contact pins 93A, 93B, and 93C receive the recesses 95A, 95B, and 95C of the lens unit 10 shown in FIG.

In the state where the lens unit 10 is positioned in this way, the Z axis coincides with the optical axis Ax of the lens unit 10. That is, in the lens unit 10, the x direction and the y direction in FIG. 1 are perpendicular to the gravity direction, and the z direction is parallel to the gravity direction.

Returning to FIG. 5, the lens holding mechanism 77 holds the lens unit 10 so that the top surface 11 a of the housing 11 faces the chart unit 71 on the Z axis, and the holding plate 97 in the Z axis direction. The first slide stage 99 is moved.

The first slide stage 99 is an electric precision stage that rotates a ball screw by rotation of a motor (not shown) and moves a stage portion 99a meshed with the ball screw in the Z-axis direction.

By moving the holding plate 97 in the Z-axis direction and pressing the holding plate 97 against the bottom block 19 of the lens unit 10 positioned by the lens positioning plate 75, the lens unit 10 is held by the manufacturing apparatus 200. Become.

On the stage part 99a of the first slide stage 99, a probe unit 113 having six probe pins 113a (only one is shown in FIG. 5) is provided.

The probe unit 113 brings the probe pins 113a into contact with the terminals 14A to 14F of the lens unit 10 and energizes the terminals 14A to 14F. The first lens driving unit (z-direction VCM 16E) and the second lens driving unit ( The x-direction VCM 16A) and the third lens driving unit (y-direction VCM 16C) are driven.

The image sensor unit holding unit 79 is for holding the image sensor unit 20 on the Z axis. Further, the image sensor unit holding unit 79 can change the position and inclination of the image sensor unit 20 in the Z-axis direction under the control of the control unit 85.

Here, the inclination of the imaging element unit 20 means the inclination of the imaging surface 27a of the imaging element 27 with respect to a plane orthogonal to the Z-axis.

The imaging element unit holding unit 79 holds the suction head 115, a suction unit 116 (see FIG. 10), which will be described later, connected to the suction head 115 through a pipe 115c, and two suction axes (see FIG. 10) perpendicular to the Z axis. A second slide that moves the Z-axis direction while holding a biaxial rotary stage 119 that adjusts the inclination of the suction head 115 around the horizontal X axis and vertical Y axis) and a bracket 121 to which the biaxial rotary stage 119 is attached. The stage 123 is comprised.

FIG. 8 is a view of the suction head 115 as viewed from the lens positioning plate 75 side. The surface on the lens positioning plate 75 side of the suction head 115 is a surface 115a perpendicular to the Z axis.

This surface 115a is an adsorption surface for adsorbing the surface opposite to the surface on which the image sensor 27 of the substrate 21 of the image sensor unit 20 is formed (the back surface of the substrate 21). In FIG. 8, the outer edge of the image sensor unit 20 in a state where the image sensor unit 20 is in contact with the suction surface 115a is indicated by a one-dot chain line.

The suction head 115 is provided with two suction holes 115b surrounded by the suction surface 115a. The suction hole 115b is connected to the suction part 116 through a pipe 115c shown in FIG.

The suction part 116 is composed of a vacuum source that applies a negative pressure to the suction hole 115b. When the suction part 116 applies a negative pressure to the suction hole 115b, air is sucked from the suction hole 115b, and an object in contact with the suction surface 115a is attracted to the suction surface 115a by the suction force. The suction unit 116 is controlled by the control unit 85.

The biaxial rotary stage 119 shown in FIG. 5 is an electric biaxial goniometer stage, and the center position of the imaging surface 27a of the imaging device unit 20 adsorbed by the adsorption head 115 by the rotation of two motors (not shown). The image sensor unit 20 is tilted in the θx direction around the X axis and the θy direction around the Y axis orthogonal to the Z axis and the X axis, with the rotation center as the center. Thereby, when the imaging element unit 20 is tilted in each direction, the positional relationship between the center position of the imaging surface 27a and the Z axis does not shift.

The second slide stage 123 is an electric precision stage that rotates a ball screw by rotation of a motor (not shown) and moves a stage portion 123a engaged with the ball screw in the Z-axis direction. A bracket 121 is fixed to the stage portion 123a.

The connector cable 127 connected to the external connection terminal portion 23 provided at the tip of the flexible substrate 22 of the image sensor unit 20 is attached to the biaxial rotation stage 119. The connector cable 127 inputs a drive signal for the image sensor 27 and outputs a captured image signal output from the image sensor 27.

The adhesive supply unit 81 and the ultraviolet lamps 83a and 83b as light sources constitute a unit fixing unit that fixes the lens unit 10 and the image sensor unit 20.

After the adjustment of the position and inclination of the image sensor unit 20 with respect to the lens unit 10 is finished, the adhesive supply unit 81 is an adhesive that cures by light in the gap between the lens unit 10 and the image sensor unit 20 (here as an example) Supply UV curable adhesive.

The ultraviolet lamps 83a and 83b cure the adhesive by irradiating the ultraviolet curable adhesive supplied to the gap with ultraviolet rays. As the adhesive, in addition to the ultraviolet curable adhesive, an instantaneous adhesive, a thermosetting adhesive, a natural curable adhesive, and the like can be used.

FIG. 9 is a diagram of a state in which the lens unit 10 is brought into contact with the lens positioning plate 75 as viewed from the imaging element unit holding unit 79 side. As for the lens unit 10, only the outer edge of the top surface 11a of the housing 11 and the opening 11b. Is indicated by a broken line.

As shown in FIG. 9, when the lens unit 10 is divided into two by a straight line L2 that passes through the optical axis Ax of the lens group 12 and is orthogonal to the optical axis Ax when viewed in the Z-axis direction, ultraviolet light is present on one divided area side. A lamp 83a is disposed, and an ultraviolet lamp 83b is disposed on the other divided area side.

That is, the ultraviolet lamps 83a and 83b cure the ultraviolet curable adhesive supplied to the gap by irradiating light from two directions. Thereby, compared with the case of irradiating ultraviolet rays from one direction, the ultraviolet curable adhesive can be cured more uniformly in the entire module, and the lens unit 10 and the imaging element unit 20 can be stably fixed. be able to.

As shown in FIG. 9, the lens unit 10 is divided into four by a straight line L1 and a straight line L2 that pass through the optical axis Ax of the lens group 12 and are orthogonal to the optical axis Ax as viewed in the Z-axis direction. And it is good also as a structure which arrange | positions an ultraviolet lamp in each division area side, and irradiates an ultraviolet-ray from four directions. According to this configuration, the lens unit 10 and the image sensor unit 20 can be more stably fixed.

FIG. 10 is a block diagram showing the internal configuration of the imaging module manufacturing apparatus 200.

As shown in FIG. 10, each unit described above is connected to the control unit 85. The control unit 85 is, for example, a microcomputer including a CPU, a ROM, a RAM, and the like, and controls each unit based on a control program stored in the ROM. The control unit 85 is connected to an input unit 131 such as a keyboard and a mouse for performing various settings, and a display unit 133 that displays setting contents, work contents, work results, and the like.

The lens driving driver 145 is a driving circuit for driving each of the first lens driving unit, the second lens driving unit, and the third lens driving unit, and the first lens driving is performed via the probe unit 113. The driving current is supplied to each of the first lens driving unit, the second lens driving unit, and the third lens driving unit.

The image sensor driver 147 is a drive circuit for driving the image sensor 27, and inputs a drive signal to the image sensor 27 via the connector cable 127.

The in-focus coordinate value acquisition circuit 149 performs Z for a plurality of imaging positions (positions corresponding to the chart images CH1, CH2, CH3, CH4, and CH5 of the measurement chart 89) set on the imaging surface 27a of the imaging element 27. In-focus coordinate values that are positions with a high degree of focus in the axial direction are acquired.

The control unit 85 controls the second slide stage 123 when acquiring the in-focus coordinate values of a plurality of imaging positions, and a plurality of measurement positions (Z0, Z1, Z2) discretely set in advance on the Z axis. ,... Are sequentially moved.

Further, the control unit 85 controls the image sensor driver 147 to display chart images of a plurality of chart images CH1, CH2, CH3, CH4, and CH5 of the measurement chart 89 formed by the lens group 12 at each measurement position. Let's take an image.

The focused coordinate value acquisition circuit 149 extracts pixel signals corresponding to the plurality of imaging positions from the imaging signal input via the connector cable 127, and individually focuses evaluation on the plurality of imaging positions from the pixel signals. Each value is calculated. The measurement position when a predetermined focus evaluation value is obtained for each imaging position is set as a focus coordinate value on the Z axis.

As the focus evaluation value, for example, a contrast transfer function value (hereinafter referred to as CTF value) can be used. The CTF value is a value representing the contrast of the image with respect to the spatial frequency, and when the CTF value is high, the degree of focus is considered high.

The in-focus coordinate value acquisition circuit 149 has a plurality of directions set on the XY coordinate plane for each of a plurality of measurement positions (Z0, Z1, Z2,...) Set on the Z axis for each of a plurality of imaging positions. CTF values are calculated for each.

The direction in which the CTF value is calculated is, for example, a horizontal direction (X-axis direction) that is the horizontal direction of the imaging surface 27a and a vertical direction (Y-axis direction) orthogonal thereto, and the CTF value in each direction is X -CTF value and Y-CTF value are calculated respectively.

The in-focus coordinate value acquisition circuit 149, for a plurality of imaging positions corresponding to each chart image CH1, CH2, CH3, CH4, CH5, coordinates on the Z axis (Zp1, Zp2) of the measurement position where the X-CTF value is maximum , Zp3, Zp4, Zp5) are acquired as the horizontal in-focus coordinate values. Similarly, the coordinate on the Z axis of the measurement position where the Y-CTF value is maximized is acquired as the vertical focus coordinate value.

The image plane calculation circuit 151 receives the horizontal focus coordinate value and the vertical focus coordinate value of each imaging position from the focus coordinate value acquisition circuit 149.

The imaging plane calculation circuit 151 includes the XY coordinate value of each imaging position when the imaging surface 27a is made to correspond to the XY coordinate plane, the horizontal in-focus coordinate value on the Z axis and the vertical value obtained for each imaging position. A plurality of evaluation points expressed in combination with the in-focus coordinate values are expanded into a three-dimensional coordinate system combining the XY coordinate plane and the Z axis, and the three-dimensional coordinate system is based on the relative positions of these evaluation points. An approximate imaging plane expressed as one plane is calculated.

Approximate image plane information is input from the image plane calculation circuit 151 to the adjustment value calculation circuit 153.

The adjustment value calculation circuit 153 has an imaging plane coordinate value F1 on the Z axis that is an intersection of the approximate imaging plane and the Z axis, and an inclination about the X axis and the Y axis of the approximate imaging plane with respect to the XY coordinate plane. A certain XY direction rotation angle is calculated and input to the control unit 85.

The control unit 85 drives the image sensor unit holding unit 79 based on the imaging plane coordinate value and the XY direction rotation angle input from the adjustment value calculation circuit 153, and adjusts the Z-axis direction position and inclination of the image sensor unit 20. Then, the imaging surface 27a is made to coincide with the approximate imaging surface. The control unit 85 functions as an adjustment unit that adjusts the Z-axis direction position and inclination of the image sensor unit 20 with respect to the lens unit 10.

The imaging module manufacturing apparatus 200 described above generally performs the following steps.
(1) Step of holding the lens unit 10 and the image sensor unit 20 on the Z axis orthogonal to the chart surface of the measurement chart 89 (2) Changing the position of the image sensor unit 20 held on the Z axis in the Z axis direction Then, at each position, the imaging element 27 is driven while the first to third lens driving units of the lens unit 10 held on the Z-axis are energized, and the measurement chart 89 is imaged by the imaging element 27. Step (3) Based on the imaging signal obtained by imaging the measurement chart 89 by the imaging device 27, the position and inclination of the imaging device unit 20 with respect to the lens unit 10 are adjusted, and the imaging device unit 20 is fixed to the lens unit 10. Process

Hereinafter, details of the manufacturing process of the imaging module 100 by the imaging module manufacturing apparatus 200 will be described with reference to the flowchart of FIG.

First, the holding (S1) of the lens unit 10 by the lens holding mechanism 77 will be described.

The control unit 85 controls the first slide stage 99 to move the holding plate 97 along the Z-axis direction, thereby providing a space in which the lens unit 10 can be inserted between the lens positioning plate 75 and the holding plate 97. Form. The lens unit 10 is held by a robot (not shown) and transferred between the lens positioning plate 75 and the holding plate 97.

The control unit 85 detects the movement of the lens unit 10 with an optical sensor or the like, and moves the stage unit 99a of the first slide stage 99 in a direction approaching the lens positioning plate 75. As a result, the holding plate 97 holds the lens unit 10. The probe pin 113a of the probe unit 113 is in contact with the terminals 14A to 14F of the lens unit 10 to electrically connect the first to third lens driving units and the lens driving driver 145.

After releasing the holding of the lens unit 10 by a robot (not shown), the holding plate 97 is further moved toward the lens positioning plate 75. Then, the concave portions 95A, 95B, and 95C of the lens unit 10 come into contact with the contact pins 93A, 93B, and 93C, and the insertion pins 93A1 and 93C1 are inserted into the concave portions 95C1 and 95A1. Accordingly, the lens unit 10 is positioned in the Z-axis direction, the X-axis direction, and the Y-axis direction.

Next, suction holding (S2) of the image sensor unit 20 by the image sensor unit holding unit 79 will be described.

The control unit 85 controls the second slide stage 123 to move the biaxial rotary stage 119 along the Z-axis direction, so that the image sensor unit 20 is located between the lens positioning plate 75 and the biaxial rotary stage 119. Create an insertable space. The image sensor unit 20 is held by a robot (not shown) and transferred between the lens positioning plate 75 and the biaxial rotation stage 119.

The control unit 85 detects the movement of the image sensor unit 20 with an optical sensor or the like, and moves the stage unit 123a of the second slide stage 123 in a direction approaching the lens positioning plate 75. When the back surface of the substrate 21 of the image sensor unit 20 is in contact with the suction surface 115 a of the suction head 115, the control unit 85 sucks air by the suction unit 116.

Thereby, air is sucked from the suction hole 115b, the substrate 21 of the image sensor unit 20 is sucked to the suction surface 115a, and the image sensor unit 20 is held. Thereafter, the holding of the image sensor unit 20 by a robot (not shown) is released.

After the lens unit 10 and the image sensor unit 20 are held on the Z axis in this way, the focus coordinate value acquisition circuit 149 causes the horizontal focus coordinate value and the vertical focus coordinate value of each image pickup position on the image pickup surface 27a. Is acquired (S3).

Specifically, the control unit 85 controls the second slide stage 123 to move the biaxial rotation stage 119 in a direction approaching the lens positioning plate 75, and the first measurement in which the image sensor 27 is closest to the lens unit 10. The image sensor unit 20 is moved to the position.

Control unit 85 causes light source 91 of chart unit 71 to emit light. In addition, the control unit 85 inputs a drive signal from the lens drive driver 145 to the terminals 14A to 14F and drives the first to third lens drive units to position the optical axis Ax of the lens group 12 in the x direction, The y-direction position and the z-direction position are held at a reference position (for example, an initial position during actual use).

Next, the control unit 85 controls the image sensor driver 147 to cause the image sensor 27 to capture the chart images CH1, CH2, CH3, CH4, and CH5 formed by the lens unit 10. The image sensor 27 inputs the captured image signal to the focused coordinate value acquisition circuit 149 via the connector cable 127.

The in-focus coordinate value acquisition circuit 149 extracts the pixel signal at the imaging position corresponding to each chart image CH1, CH2, CH3, CH4, and CH5 from the input imaging signal, and X for each imaging position from the pixel signal. -Calculate CTF and Y-CTF values. The control unit 85 stores information on the X-CTF value and the Y-CTF value in, for example, a RAM in the control unit 85.

The control unit 85 sequentially moves the image sensor unit 20 to a plurality of measurement positions (Z0, Z1, Z2,...) Set along the Z-axis direction, and the optical axis Ax of the lens group 12 at each measurement position. The image sensor 27 is caused to capture the chart image of the measurement chart 89 while maintaining the x-direction position, the y-direction position, and the z-direction position at the reference positions. The focused coordinate value acquisition circuit 149 calculates an X-CTF value and a Y-CTF value at each imaging position at each measurement position.

The focused coordinate value acquisition circuit 149 selects the maximum value from among the plurality of calculated X-CTF values and Y-CTF values for each of the imaging positions, and the Z-axis of the measurement position where the maximum value is obtained. The coordinates are acquired as the horizontal focus coordinate value and the vertical focus coordinate value of the imaging position.

The horizontal focus coordinate value and the vertical focus coordinate value acquired by the focus coordinate value acquisition circuit 149 are input to the imaging plane calculation circuit 151. The imaging plane calculation circuit 151 calculates the approximate imaging plane F that is approximated by a plane, for example, by the method of least squares (S5).

Information on the approximate image plane F calculated by the image plane calculation circuit 151 is input to the adjustment value calculation circuit 153. The adjustment value calculation circuit 153 includes an imaging plane coordinate value F1 that is an intersection of the approximate imaging plane F and the Z axis, and an XY direction that is an inclination around the X axis and the Y axis of the approximate imaging plane with respect to the XY coordinate plane. The rotation angle is calculated and input to the controller 85 (S6).

The control unit 85 controls the biaxial rotation stage 119 and the second slide stage 123 based on the imaging plane coordinate value F1 and the rotation angle in the XY direction, and the center position of the imaging plane 27a of the imaging element 27 is the imaging plane coordinate. The image sensor unit 20 is moved in the Z-axis direction so as to coincide with the value F1, and the angles of the θx direction and θy direction of the image sensor unit 20 are adjusted so that the inclination of the image sensing surface 27a coincides with the approximate imaging plane F. Adjust (S7).

The control unit 85 performs a confirmation step of confirming the in-focus position of each imaging position after adjusting the position and inclination of the imaging element unit 20 (S8).

In this confirmation step, each step of S3 described above is executed again. After the adjustment of the position and inclination of the image sensor unit 20, the variation in the evaluation value corresponding to the horizontal direction and the vertical direction becomes small for each of the image pickup positions.

After the confirmation step (S8) is completed (S4: YES), the control unit 85 moves the imaging element unit 20 in the Z-axis direction so that the center position of the imaging surface 27a coincides with the imaging plane coordinate value F1 (S9). ).

Further, the control unit 85 supplies UV curing adhesive to the gap between the lens unit 10 and the image sensor unit 20 from the adhesive supply unit 81 (S10), and turns on the UV lamps 83a and 83b, thereby curing the UV curing. The mold adhesive is cured (S11).

After the adhesive is cured and the lens unit 10 and the imaging element unit 20 are fixed, when the imaging module is gripped by a robot (not shown), the control unit 85 stops the suction of air by the suction unit 116. Thereby, the suction of air from the suction hole 115b is stopped, and the suction of the image sensor unit 20 is released (step S12). The completed imaging module 100 is taken out from the imaging module manufacturing apparatus 200 by a robot (not shown) (S13).

The lens unit 10 and the image sensor unit 20 can be fixed with an ultraviolet curable adhesive, but curing with the ultraviolet curable adhesive may be used as temporary fixing between the lens unit 10 and the image sensor unit 20.

For example, the imaging module 100 is removed from the imaging module manufacturing apparatus 200 in a state where the lens unit 10 and the imaging element unit 20 are temporarily fixed, and after performing a desired process such as a cleaning process, the lens unit 10 and the imaging element unit 20 May be completely fixed by a thermosetting adhesive or the like.

By manufacturing the imaging module 100 with the manufacturing apparatus 200 described above, it is possible to prevent the substrate of the imaging element unit 20 from being warped when the imaging element unit 20 is held in the manufacturing apparatus 200. For this reason, the lens unit 10 and the image sensor unit 20 can be aligned with high accuracy.

In particular, in the manufacturing method of this embodiment, as the suction head 115, as shown in FIG. 8, the suction head 115 is provided with two suction holes 115b surrounded by the suction surface 115a. As described in Patent Document 3, when the back surface of the substrate 21 of the image pickup device unit 20 is attracted by a pair of nozzles, the substrate 21 is supported only by the front end surface of each nozzle. The substrate 21 is warped when concentrated.

8, the suction surface 115a is present between the suction hole 115b and the suction hole 115b. For this reason, the back surface of the substrate 21 of the image pickup device unit 20 can be supported by the portion in between. As a result, even when air is sucked from the suction hole 115b, the substrate 21 of the image sensor unit 20 can be prevented from warping.

Further, according to the manufacturing method of the present embodiment, it is not necessary to arrange means (such as a chuck hand in the conventional art) for holding the image sensor unit 20 around the image sensor unit 20.

As a result, devices such as a device for fixing the lens unit 10 and the image sensor unit 20 (adhesive supply unit 81, ultraviolet lamps 83a and 83b) and a device for supplying current to the lens unit 10 (probe unit 113) can be freely arranged. Thus, the design cost of the manufacturing apparatus 200 can be reduced and the maintainability can be improved.

Up to this point, a manufacturing apparatus for manufacturing a model in which the lens unit 10 has first to third lens driving units as an imaging module has been described. Even if the lens unit 10 is a model in which only the first lens driving unit is mounted and the lens unit 10 is a model in which only the second lens driving unit and the third lens driving unit are mounted, the method described above is used. By attracting and holding the image sensor unit 20, high-accuracy positioning is possible.

In a model in which the lens unit 10 includes the second lens driving unit and the third lens driving unit, such as the imaging module 100, the mechanism inside the housing 11 of the lens unit 10 is complicated. Low profile becomes difficult.

For this reason, the image sensor unit 20 can be reduced in height, but if the thin image sensor unit 20 is held by a chuck hand, warping is likely to occur. Therefore, in such a model, it is particularly effective to adopt the manufacturing method of the present embodiment.

Further, when the lens unit 10 is a model having only the first lens driving unit, the number of probes for energizing the lens unit 10 is at least two, but the second lens driving unit and the third lens driving unit If the model further includes a lens driving unit, at least six probes are required.

Also, when energizing the Hall element included in the lens driving device 16, 18 probes are required. That is, when the lens unit 10 has the first to third lens driving units, it is very difficult to secure a space around the lens unit 10. Also from this, the method of attracting and holding the image sensor unit 20 is effective.

In the step S3 in FIG. 11, the in-focus coordinate value is obtained by moving the image sensor unit 20 while the Z-axis direction position of the lens unit 10 is fixed.

However, the lens unit holding portion including the lens positioning plate 75 and the lens holding mechanism 77 is movable in the Z-axis direction, and the position of the image sensor unit holding portion 79 is fixed in the Z-axis direction while the lens unit holding portion is fixed to the Z-axis. It is also possible to change the measurement position by moving the lens unit holding part and the image sensor unit holding part 79 in the Z-axis direction, and acquire the in-focus coordinate value at each measurement position.

In addition, the coordinate position value may be acquired by changing the measurement position by moving the chart unit 71 in the Z-axis direction while the Z-axis direction positions of the lens unit holding unit and the image sensor unit holding unit 79 are fixed. . Further, the focus coordinate value may be acquired by changing the measurement position by changing the Z-axis direction position of each of the lens unit holding unit, the image sensor unit holding unit 79, and the chart unit 71.

That is, the measurement position is changed by changing the relative position in the Z-axis direction of the lens unit 10, the image sensor unit 20, and the measurement chart 89, and the measurement chart 89 is imaged by the image sensor 27 at each relative position to be focused. Any configuration that acquires coordinate values may be used.

In the description of FIG. 11, a plurality of measurement positions are realized by changing the relative position, and the measurement chart is imaged when each measurement position is reached. However, the measurement chart is continuously imaged. (I.e., taking a moving image), and the relative position may be changed so that each measurement position is reached during the imaging.

In step S7 in FIG. 11, the Z-axis direction position of the image sensor unit 20 with respect to the lens unit 10 is adjusted by moving the image sensor unit 20 while the Z-axis direction position of the lens unit 10 is fixed. ing. As a modified example, the lens unit holding unit is movable in the Z-axis direction, and the image sensor unit holding unit 79 moves the lens unit holding unit while the position is fixed, or the lens unit holding unit and the image sensor unit holding unit. 79 may be moved to adjust the position.

In the step S7 in FIG. 11, the Z-axis direction position and inclination of the image sensor unit 20 with respect to the lens unit 10 are adjusted, but the adjustment of the Z-axis direction position may be omitted.

In this way, in the manufacturing apparatus that performs the step of adjusting at least the inclination of the image sensor unit 20 with respect to the lens unit 10, high-accuracy alignment is possible by sucking and holding the image sensor unit 20 as described above. become.

In the process of S7 in FIG. 11, when adjusting the position and inclination of the image sensor unit 20 with respect to the lens unit 10 in the Z-axis direction, it is sufficient that there are at least three chart images provided on the chart surface of the measurement chart 89.

As described above, when four or more chart images are used, the tilt adjustment of the image sensor unit 20 with respect to the lens unit 10 can be performed with higher accuracy.

Further, so far, the measurement chart 89 is imaged while the lens driving unit is energized to obtain the focus evaluation value, but the energization to the lens driving unit may be omitted. By performing energization, alignment with higher accuracy becomes possible.

In addition, when energization is performed, it is not necessary for the lens drive units to be energized to be all of the first to third lens drive units, and only energize only those necessary according to the alignment accuracy. It may be.

In the above description, the adhesive supply unit 81 and the ultraviolet lamps 83a and 83b as light sources constitute a unit fixing unit that fixes the lens unit 10 and the image sensor unit 20. However, the unit fixing portion is not limited to this configuration as long as the adhesive supplied to the gap between the lens unit 10 and the imaging element unit 20 can be cured.

For example, after the imaging device unit 20 is held by the manufacturing apparatus 200 in a state where an adhesive is applied to the imaging device unit terminal portion of the imaging device unit 20 and the lens unit 10 and the imaging device unit 20 are aligned, the bonding is performed. The agent may be cured by the ultraviolet lamps 83a and 83b. That is, the unit fixing portion may be configured only by the ultraviolet lamps 83a and 83b.

Further, when a thermosetting resin is used as the adhesive, a heat source may be used instead of the light source as a means for curing the adhesive.

The configuration of the suction head 115 is not limited to that shown in FIG. 8, and may be the configuration shown in FIGS.

FIG. 12 is a view of the suction head 115A, which is a modification of the suction head 115, as viewed from the lens positioning plate 75 side.

The suction head 115A includes a suction surface 115a and four suction holes 115b surrounded by the suction surface 115a. Each suction hole 115b has an L shape disposed near the four corners of the suction head 115A.

According to the suction head 115A, the suction surface 115a always exists between two adjacent suction holes 115b. For this reason, this portion of the suction surface 115a supports the substrate 21 of the image sensor unit 20, and warpage of the substrate 21 during suction holding can be prevented.

Thus, by increasing the number of suction holes 115b as compared with FIG. 8 and further reducing the plane area of the suction holes 115b as compared with FIG. 8, the area for supporting the substrate 21 can be increased. Warpage of the substrate 21 can be effectively prevented.

Note that a suction head provided with three or five or more suction holes 115b surrounded by the suction surface 115a may be employed.

For example, when a porous material is used as the adsorption surface 115a, each of innumerable fine holes present in the porous material forms a suction hole 115b. In this case, since the suction hole 115b is small, the area for supporting the substrate 21 can be increased, and the warpage of the substrate 21 can be effectively prevented.

FIG. 13 is a view of a suction head 115B, which is a modification of the suction head 115, as viewed from the lens positioning plate 75 side.

The suction head 115B is provided with one suction hole 115b surrounded by the suction surface 115a. The suction hole 115b has a ring shape, and the suction surface 115a is always in contact with the inner edge and the outer edge of the suction hole 115b.

In such a suction head 115B, since the suction hole 115b exists at a location sandwiched between the suction surface 115a and the suction surface 115a, the number of surfaces that support the substrate 21 of the image sensor unit 20 is increased, and the substrate 21 during suction holding is held. Warpage can be prevented.

The suction head configuration shown in FIGS. 8, 12, and 13 and the suction head in which the suction surface 115a is formed of a porous member are all sucked across the suction surface 115a on the plane including the suction surface 115a. It can be said that there is always a straight line (symbol La in the drawing) that passes through the hole 115b twice.

Thus, on the plane including the suction surface 115a, there is a straight line La that passes through the suction hole 115b twice across the suction surface 115a, so that the suction surface 115a straddling the suction holes 115b supports the substrate 21. Thus, warping of the substrate 21 can be prevented.

In the suction head having the configuration described so far (except for the case where the suction surface 115a is formed of a porous member), the suction surface 115a can be formed of an elastic body such as rubber.

By using the suction surface 115a as an elastic body, the degree of adhesion between the suction hole 115b and the substrate 21 can be increased, and the flow of the sucked air can be prevented from reaching the periphery of the substrate 21.

Up to this point, the back surface of the substrate 21 of the image sensor unit 20 has been described as a surface perpendicular to the optical axis Ax of the lens group 12. The term “perpendicular” does not need to be strictly vertical, and if the manufacturing apparatus has a mechanism for adjusting the tilt of the image sensor unit 20 with respect to the lens unit 10, it may be within the stroke of tilt adjustment. When there is no tilt adjustment mechanism, a deviation of about 1 ° is allowed.

As described above, the following items are disclosed in this specification.

The disclosed method of manufacturing an imaging module is a method of manufacturing an imaging module having a lens unit having a lens group, and an image sensor unit that is fixed to the lens unit and has an image sensor that images a subject through the lens group. And changing the relative position in the axial direction of at least one of the image sensor unit, the lens unit, and the measurement chart on an axis orthogonal to the measurement chart, and the image sensor at each relative position. The imaging element unit for the lens unit based on a first step of imaging the measurement chart through the lens group by the imaging element and an imaging signal obtained by imaging the measurement chart by the imaging element At least to adjust the inclination of the image sensor unit A suction head having a suction surface perpendicular to the axis and a suction hole surrounded by the suction surface, the first step including the suction surface. Air is sucked from the suction hole of the suction head having a straight line passing through the suction hole twice across the suction surface on a plane, and the image sensor unit is sucked to the suction surface to suck the image sensor. The imaging is performed while the unit is held.

According to this method, since the imaging element unit is sucked and held by the suction head having a straight line passing through the suction hole twice across the suction face on the plane including the suction face, the suction hole is sandwiched between the suction faces. In the straight line portion that passes twice, the back surface of the image sensor unit is supported by the suction surface between the suction holes. For this reason, even when suction is performed, the warp of the image sensor unit can be reliably prevented, and the position adjustment of the image sensor unit and the lens unit can be performed with high accuracy.

The disclosed method for manufacturing an imaging module includes a method using a plurality of suction holes provided as the suction head in the first step.

According to this method, there is always a straight line that passes through the suction hole twice with the suction surface interposed therebetween on the plane including the suction surface, and thus the warp of the image sensor unit can be prevented even when suction is performed. .

The disclosed method for manufacturing an imaging module includes a method in which, in the first step, the suction head is provided with one suction hole.

According to this method, it is possible to enlarge the surface that supports the image sensor unit when the image sensor unit is attracted to the suction head, and it is possible to prevent the image sensor unit from warping.

The disclosed method for manufacturing an imaging module includes a method in which, in the first step, the suction head has a suction surface made of a porous material.

According to this method, it is possible to enlarge the surface that supports the image sensor unit when the image sensor unit is attracted to the suction head, and it is possible to prevent the image sensor unit from warping.

The disclosed method for manufacturing an imaging module includes a method in which, in the first step, as the suction head, the suction surface is made of an elastic body.

According to this method, the imaging element unit can be stably adsorbed to the adsorption head.

According to the disclosed imaging module manufacturing method, in the second step, one of the lens units divided into two by a straight line passing through the optical axis of the lens group and orthogonal to the optical axis when viewed in the axial direction. Light is irradiated from each of the divided area side and the other divided area side, the photocurable adhesive supplied to the gap between the lens unit and the imaging element unit is cured, and the lens unit and the imaging element unit are It is to be fixed.

According to this method, since light is irradiated from at least two directions between the lens unit and the image sensor unit, it is possible to uniformly cure the applied adhesive throughout the module, and the lens unit and the image sensor unit. Can be stably fixed.

In the disclosed imaging module manufacturing method, in the second step, the adhesive is cured by irradiating light from each divided area when the lens unit is divided into four by the two straight lines orthogonal to each other. The lens unit and the image sensor unit are fixed.

According to this method, since light is irradiated from four directions between the lens unit and the image sensor unit, the applied adhesive can be cured more uniformly in the entire module. Fixing can be performed more stably.

In the disclosed imaging module manufacturing method, the lens unit includes a first lens driving unit that moves at least a part of the lenses in the first direction along the optical axis of the lens group, and the lens unit. At least one of a second lens driving unit and a third lens driving unit for moving at least some of the lenses in a second direction and a third direction orthogonal to the optical axis of the lens group, respectively. It is what you have.

Since a lens unit equipped with a lens driving unit has a complicated structure and it is difficult to reduce the height, it is necessary to reduce the height of the image sensor unit. For this reason, the image sensor unit tends to warp, and a method of sucking and holding the image sensor unit by the suction head is particularly effective.

The disclosed imaging module manufacturing method includes the imaging element unit in which the imaging element is formed in the recess of the substrate in which the recess is formed.

Since the image pickup element unit in which the image pickup element is formed in the concave portion of the substrate in which the concave portion is formed is easy to warp the substrate, a method of sucking and holding the image pickup element unit by the suction head is particularly effective.

The disclosed imaging module manufacturing apparatus includes a measurement chart installation unit for installing a measurement chart, and a subject through a lens unit having a lens group on an axis orthogonal to the measurement chart installed in the measurement chart installation unit. An image sensor unit holding unit for holding an image sensor unit having an image sensor for imaging, and a lens unit for holding the lens unit on the axis between the measurement chart setting unit and the image sensor unit holding unit. At least one of the lens unit holding unit, the measurement chart setting unit, the lens unit holding unit, and the image sensor unit holding unit is changed in the axial direction, and the image sensor is changed at each relative position. The image sensor of the unit is driven, and the image sensor passes the lens unit through the lens unit. A control unit that images a constant chart, an adjustment unit that adjusts at least an inclination of the imaging element unit with respect to the lens unit based on an imaging signal obtained by imaging the measurement chart by the imaging element, and an adjustment unit. A unit fixing portion for fixing the adjusted image pickup device unit to the lens unit, and the image pickup device unit holding portion has a suction surface orthogonal to the axis and a suction hole surrounded by the suction surface. A suction section for sucking air from the suction hole, and the suction head has a straight line passing through the suction hole twice across the suction surface on a plane including the suction surface. It is.

According to this apparatus, since the imaging element unit is sucked and held by the suction head having a straight line passing through the suction hole twice across the suction surface on the plane including the suction surface, the suction hole is straddled across the suction surface. In the straight line portion that passes twice, the back surface of the image sensor unit is supported by the suction surface between the suction holes. For this reason, even when suction is performed, the warp of the image sensor unit can be prevented, and the position adjustment of the image sensor unit and the lens unit can be performed with high accuracy.

In the disclosed imaging module manufacturing apparatus, the suction head includes a plurality of the suction holes.

According to this apparatus, there is always a straight line that passes through the suction hole twice across the suction surface on the plane including the suction surface, and even when suction is performed, the image sensor unit can be prevented from warping. .

In the disclosed imaging module manufacturing apparatus, the suction head includes one in which one suction hole is provided.

According to this apparatus, it is possible to enlarge the surface that supports the image sensor unit when the image sensor unit is attracted to the suction head, and it is possible to prevent the image sensor unit from warping.

The disclosed imaging module manufacturing apparatus includes the suction head in which the suction surface is made of a porous material.

According to this apparatus, it is possible to enlarge the surface that supports the image sensor unit when the image sensor unit is attracted to the suction head, and it is possible to prevent the image sensor unit from warping.

In the disclosed imaging module manufacturing apparatus, the suction head includes one in which the suction surface is formed of an elastic body.

According to this apparatus, the image sensor unit can be stably adsorbed to the adsorption head.

In the disclosed imaging module manufacturing apparatus, the unit fixing portion is divided into two when the lens unit is divided into two by a straight line passing through the optical axis of the lens group and orthogonal to the optical axis when viewed in the axial direction. A light source that is disposed on each of the divided area side and the other divided area side, irradiates light to the gap between the lens unit and the imaging element unit, and cures the photocurable adhesive supplied to the gap. Is included.

According to this apparatus, since light is irradiated from at least two directions between the lens unit and the image sensor unit, it is possible to uniformly cure the applied adhesive throughout the module, and the lens unit and the image sensor unit. Can be stably fixed.

In the disclosed imaging module manufacturing apparatus, the light source is installed in each divided area when the lens unit is divided into four by two straight lines orthogonal to each other.

According to this apparatus, since light is irradiated from four directions between the lens unit and the image sensor unit, the applied adhesive can be cured more uniformly in the entire module. Fixing can be performed more stably.

In the disclosed imaging module manufacturing apparatus, the unit fixing part includes an adhesive supply part that supplies the photocurable adhesive to a gap between the lens unit and the imaging element unit.

The method and apparatus for manufacturing an imaging module according to the present invention is particularly effective when applied to the manufacture of an imaging module mounted on an electronic device such as a mobile phone, a spectacle-type electronic device, or a wristwatch-type electronic device.

As mentioned above, although this invention was demonstrated by specific embodiment, this invention is not limited to this embodiment, A various change is possible in the range which does not deviate from the technical idea of the disclosed invention.
This application is based on a Japanese patent application filed on October 15, 2013 (Japanese Patent Application No. 2013-214731), the contents of which are incorporated herein.

DESCRIPTION OF SYMBOLS 100 Imaging module 10 Lens unit 11 Housing | casing 12 Lens group 13 Flexible board 14A-14F Lens unit terminal part 16 Lens drive device 16A X direction VCM
16B x direction hall element 16C y direction VCM
16D y-direction Hall element 16E z-direction VCM
16F z-direction Hall element 20 Imaging element unit 21 Substrate 22 Flexible substrate 23 External connection terminals 24A to 24F Imaging element unit terminal section 27 Imaging element 200 Imaging module manufacturing apparatus 71 Chart unit 89 Measurement chart 75 Lens positioning plate 115 Suction head 115a Suction Surface 115b Suction hole 115c Pipe 81 Adhesive supply part 83a, 83b Ultraviolet lamp 79 Image sensor unit holding part 85 Control part Ax Optical axis z Direction along optical axis x Direction orthogonal to yz direction Direction orthogonal to yz direction

Claims (17)

1. A method of manufacturing an imaging module, comprising: a lens unit having a lens group; and an imaging element unit having an imaging element fixed to the lens unit and imaging a subject through the lens group,
   On the axis orthogonal to the measurement chart, the relative position in the axial direction of at least one of the image sensor unit, the lens unit, and the measurement chart is changed, and the image sensor is driven at each relative position. A first step of imaging the measurement chart through the lens group by the imaging element;
   A second step of adjusting at least an inclination of the imaging element unit with respect to the lens unit based on an imaging signal obtained by imaging the measurement chart by the imaging element, and fixing the imaging element unit to the lens unit; With
   In the first step, a suction head having a suction surface perpendicular to the axis and a suction hole surrounded by the suction surface, the suction hole straddling the suction surface on a plane including the suction surface An image that causes the imaging to be performed in a state in which air is sucked from the suction hole of the suction head having a straight line that passes twice, and the imaging device unit is sucked to the suction surface and the imaging device unit is held. Module manufacturing method.
2. A method for manufacturing an imaging module according to claim 1,
   In the first step, an imaging module manufacturing method using a suction head provided with a plurality of suction holes.
3. A method for manufacturing an imaging module according to claim 1,
   In the first step, an imaging module manufacturing method using a suction head provided with one suction hole.
4. A method for manufacturing an imaging module according to claim 1,
   In the first step, an imaging module manufacturing method using the suction head in which the suction surface is made of a porous material.
5. A method for manufacturing an imaging module according to any one of claims 1 to 3,
   In the first step, an imaging module manufacturing method using the suction head in which the suction surface is made of an elastic body.
6. A method for manufacturing an imaging module according to any one of claims 1 to 5,
   In the second step, when the lens unit is divided into two by a straight line that passes through the optical axis of the lens group and is orthogonal to the optical axis when viewed in the axial direction, the one division area side and the other division area side A method of manufacturing an imaging module that irradiates light from each of them, cures a photocurable adhesive supplied to a gap between the lens unit and the imaging element unit, and fixes the lens unit and the imaging element unit.
7. It is a manufacturing method of the imaging module according to claim 6,
   In the second step, the lens unit and the lens unit are formed by irradiating light from each divided area side when the lens unit is divided into four by the two straight lines orthogonal to each other to cure the photocurable adhesive. An imaging module manufacturing method for fixing an imaging element unit.
8. A method for manufacturing an imaging module according to any one of claims 1 to 7,
   The lens unit includes: a first lens driving unit that moves at least a part of the lenses in the first direction along an optical axis of the lens group; and at least a part of the lenses in the lens group. A method for manufacturing an imaging module, comprising at least one of a second lens driving unit and a third lens driving unit that respectively move in a second direction and a third direction orthogonal to the optical axis of the lens group.
9. A method for manufacturing an imaging module according to any one of claims 1 to 8,
   The imaging device unit is a manufacturing method of an imaging module in which the imaging device is formed in the recess of the substrate in which the recess is formed.
10. A measurement chart setting part for setting a measurement chart;
    An image sensor unit holding unit for holding an image sensor unit having an image sensor that images a subject through a lens unit having a lens group on an axis orthogonal to the measurement chart installed in the measurement chart installation unit;
    A lens unit holding unit for holding the lens unit on the axis between the measurement chart setting unit and the imaging element unit holding unit;
    The relative position in the axial direction of at least one of the measurement chart setting unit, the lens unit holding unit, and the image sensor unit holding unit is changed, and the image sensor of the image sensor unit is changed at each relative position. A controller that drives and images the measurement chart through the lens unit by the imaging element;
    An adjustment unit that adjusts at least an inclination of the imaging element unit with respect to the lens unit based on an imaging signal obtained by imaging the measurement chart by the imaging element;
    A unit fixing unit that fixes the image sensor unit after adjustment by the adjustment unit to the lens unit;
    The imaging element unit holding unit includes a suction surface orthogonal to the axis and a suction head having a suction hole surrounded by the suction surface, and a suction unit that sucks air from the suction hole,
    The apparatus for manufacturing an imaging module, wherein the suction head has a straight line passing through the suction hole twice across the suction surface on a plane including the suction surface.
11. An apparatus for manufacturing an imaging module according to claim 10,
    The suction module is an imaging module manufacturing apparatus in which a plurality of suction holes are provided.
12. An apparatus for manufacturing an imaging module according to claim 10,
    The suction head is an imaging module manufacturing apparatus in which one suction hole is provided.
13. An apparatus for manufacturing an imaging module according to claim 10,
    The suction head is an imaging module manufacturing apparatus in which the suction surface is made of a porous material.
14. An imaging module manufacturing apparatus according to any one of claims 10 to 12,
    The suction head is an imaging module manufacturing apparatus in which the suction surface is configured by an elastic body.
15. The imaging module manufacturing apparatus according to any one of claims 10 to 14,
    The unit fixing portion is provided on one divided area side and the other divided area side when the lens unit is divided into two by a straight line that passes through the optical axis of the lens group and is orthogonal to the optical axis when viewed in the axial direction. An imaging module manufacturing apparatus including a light source that is disposed in each of the light sources and irradiates light to a gap between the lens unit and the imaging element unit to cure the photocurable adhesive supplied to the gap.
16. An apparatus for manufacturing an imaging module according to claim 15,
    The light source is an imaging module manufacturing apparatus installed in each divided area when the lens unit is divided into four by two straight lines orthogonal to each other.
17. An imaging module manufacturing apparatus according to claim 15 or 16,
    The unit fixing unit is an imaging module manufacturing apparatus including an adhesive supply unit that supplies the photocurable adhesive to a gap between the lens unit and the imaging element unit.

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