TW202230596A - Frame accommodating device and frame accommodating method comprising accommodating means having a take-out opening, shielding means selectively shielding the take-out opening, and moving means for moving the shielding means - Google Patents
Frame accommodating device and frame accommodating method comprising accommodating means having a take-out opening, shielding means selectively shielding the take-out opening, and moving means for moving the shielding means Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G57/00—Stacking of articles
- B65G57/02—Stacking of articles by adding to the top of the stack
- B65G57/03—Stacking of articles by adding to the top of the stack from above
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
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- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0019—End effectors other than grippers
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/02—Wrappers or flexible covers
- B65D65/14—Wrappers or flexible covers with areas coated with adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2313/00—Connecting or fastening means
- B65D2313/10—Adhesive or cohesive means for holding the contents attached to the container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/041—Camera
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
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Abstract
Description
本發明係關於框架收容裝置以及框架收容方法。The present invention relates to a frame accommodating device and a frame accommodating method.
為人所知者有一種將框架構件收容於複數個收容手段之框架收容裝置(例如參照文獻1:日本特開2014-27015號公報)。此外,為人所知者有一種藉由遮蔽構件來遮蔽收容手段中之框架構件的取出口之框架收容裝置(例如參照文獻2:日本特開2020-77737號公報)。
於文獻1所記載之薄片貼著裝置1(框架收容裝置)之第1框架收容手段3A及第2框架收容手段3B(收容手段)的各手段上,例如設置文獻2所記載之卡匣載置機構10的門部28(遮蔽構件)之情形時,遮蔽構件的數量增加,而有裝置變得大型化之缺失。
There is known a frame accommodating device for accommodating a frame member in a plurality of accommodating means (for example, refer to Document 1: Japanese Patent Laid-Open No. 2014-27015). In addition, there is known a frame housing device in which an extraction port of a frame member in a housing means is covered by a mask member (for example, refer to Document 2: Japanese Patent Application Laid-Open No. 2020-77737).
On each of the first frame housing means 3A and the second frame housing means 3B (housing means) of the sheet sticking device 1 (frame housing device) described in Document 1, for example, the cassette mounting device described in Document 2 is provided. In the case of the door portion 28 (shielding member) of the
本發明之目的在於提供一種可防止裝置的大型化之框架收容裝置以及框架收容方法。 本發明係採用請求項所記載之構成。 根據本發明,由於使遮蔽構件在複數個收容手段間移動,所以可削減遮蔽構件的數量而防止裝置的大型化。 此外,若藉由取出手段來構成移動手段,則不需設置另與取出手段不同之移動手段,可進一步防止裝置的大型化。 【圖示簡單說明】 [圖1A]為有關本發明的實施型態之框架收容裝置之說明圖。 [圖1B]為有關本發明的實施型態之框架收容裝置之說明圖。 An object of the present invention is to provide a frame accommodating device and a frame accommodating method which can prevent the enlargement of the device. The present invention adopts the configuration described in the claims. According to the present invention, since the shielding member is moved between the plurality of storage means, the number of the shielding member can be reduced and the enlargement of the apparatus can be prevented. In addition, if the moving means is constituted by the extracting means, it is not necessary to provide another moving means different from the extracting means, and the enlargement of the apparatus can be further prevented. [Brief Description of Illustration] [Fig. 1A] is an explanatory view of the frame storage device according to the embodiment of the present invention. [ Fig. 1B ] is an explanatory diagram of the frame storage device according to the embodiment of the present invention.
以下係根據圖面來說明本發明的實施型態。
本實施型態中的X軸、Y軸及Z軸分別處於正交之關係,X軸及Y軸構成為預定平面內之軸,Z軸構成為與前述預定平面正交之軸。再者,於本實施型態中,在以從與Y軸平行之圖1B的面前方向觀看者為基準來表示方向之情形時,「上」為Z軸的箭頭方向且「下」為其反方向,「左」為X軸的箭頭方向且「右」為其反方向,「前」為Y軸的箭頭方向且「後」為其反方向。
本發明之框架收容裝置EA係具備:具有取出作為框架構件的環框架RF之取出口14、24,並以可取出的方式收容環框架RF之作為複數個收容手段的第1收容手段10及第2收容手段20;及具有選擇性地遮蔽第1、第2收容手段10、20的取出口14、24之遮蔽構件32之遮蔽手段30;及使遮蔽構件32於第1、第2收容手段10、20間移動之移動手段40;以及從第1、第2收容手段10、20的取出口14、24中取出環框架RF之取出手段50。於本實施型態之情形時,框架收容裝置EA係配置在對環框架RF施以預定處理之處理裝置EA1的附近。
第1收容手段10係具備:支撐於圖中未顯示之本體臂之複數個滑軌11,及支撐於滑軌11的滑動器11A並層合環框架RF而收容之收容台12,及支撐於收容台12且定位環框架RF之複數個定位構件13,以及以由定位構件13所包圍之朝上的開口所構成之取出口14。
第2收容手段20與第1收容手段10為相同之構成,由於可將第1收容手段10的各構成之附加圖號之前頭的號碼1取代為2來說明,故在此省略其說明。
遮蔽手段30係具備:支撐於圖中未顯示之本體臂之線性導軌31,及支撐於線性導軌31的滑動器31A且由金屬板、樹脂板、玻璃板等板狀構件所構成之遮蔽構件32,以及隔著托架33支撐於遮蔽構件32且從該托架33往上方突出之銷34。
移動手段40於本實施型態中,係採用與取出手段50兼用之構成,且由取出手段50所構成。
取出手段50係具備:作為驅動機器的多關節機器人51;及隔著托架52支撐於多關節機器人51的前端臂51A,並可藉由減壓泵或真空抽氣器等圖中未顯示的減壓手段(保持手段)來吸附保持之複數個吸附墊53;及支撐於托架52且具有插入有銷34而卡止之卡止孔54A之卡止構件54;以及由攝影機或投影機等攝像手段或是光學感測器或超音波感測器等各種感測器等所構成,並偵測遮蔽構件32之偵測手段55。本實施型態之偵測手段55亦可偵測收容於收容台12、22上之環框架RF。
多關節機器人51係由複數個臂所構成,並且於該作業範圍內,不論在哪一位置、哪一角度下,皆可將由作為作業部的前端臂51A所支撐者進行位移之所謂6軸機器人。
接著說明以上之框架收容裝置EA的動作。
首先,相對於各構件配置在圖1A及圖1B中以實線所示之初期位置之框架收容裝置EA,該框架收容裝置EA的使用者(以下僅稱為「使用者」),係如同一圖中以兩點虛線所示般將收容台12、22拉往左方,並在將環框架RF層合於其上方而收容後,將該收容台12、22回復至初期位置。接著,使用者透過圖中未顯示的操作面板或個人電腦等操作手段來輸入自動運轉開始的訊號時,取出手段50驅動偵測手段55來偵測遮蔽構件32,並根據該偵測結果,從未被遮蔽構件32所遮蔽之收容手段(於本實施型態中為第1收容手段10)中取出環框架RF。亦即,取出手段50係驅動多關節機器人51及圖中未顯示的減壓手段,且如圖1B中以兩點虛線所示般將吸附墊53插入於第1收容手段10的取出口14,並藉由該吸附墊53來吸附保持環框架RF。然後,取出手段50係驅動多關節機器人51,如圖1A中以兩點虛線所示般將藉由吸附墊53所保持之環框架RF載置於處理裝置EA1的作業台TA後,停止圖中未顯示的減壓手段的驅動,之後重複進行與上述相同之動作。
載置於作業台TA之環框架RF係藉由處理裝置EA1來施以預定的處理或預定的加工。
接著,於偵測手段55偵測到全部的環框架RF從第1收容手段10中被取出時,取出手段50係根據此偵測結果來驅動多關節機器人51,且如圖1A及圖1B中以兩點虛線所示般,在將移動卡止構件54並將銷34插入於卡止孔54A後,將遮蔽構件32往前方移動以遮蔽第1收容手段10的取出口14。然後,取出手段50驅動多關節機器人51及圖中未顯示的減壓手段,藉由與上述相同之動作從第2收容手段20中取出環框架RF,並重複進行將該環框架RF載置於處理裝置EA1的作業台TA之與上述相同之動作。於全部的環框架RF從第1收容手段10中被取出,且取出口14由遮蔽構件32所遮蔽時,使用者將收容台12拉往左方,並在將環框架RF層合於其上方而收容後,將該收容台12回復至初期位置。
根據以上實施型態,由於使遮蔽構件32在第1、第2收容手段10、20間移動,所以可削減遮蔽構件32的數量而防止裝置的大型化。
如以上所述,用以實施本發明之最佳構成、方法等係於前述記載內容中揭示,惟本發明並不限定於此。亦即,本發明主要是關於特定的實施型態來特別地進行圖示及說明,在不脫離本發明之技術性思想及目的的範圍內,對於以上所述之實施型態,該業者於形狀、材質、數量及其他詳細構成中可施加各種變形。此外,上述所揭示之限定了形狀、材質等之記載,係用以容易理解本發明而例示性記載,並非限定本發明,因此,移除彼等限定了形狀、材質等之一部分或全部的限定內容後之構件的名稱等記載,係包含於本發明。
例如,第1收容手段10及第2收容手段20於前側、後側及右側中,至少1側可藉由壁來區隔,亦可採用以複數個棚架所區隔並多段地收容框架構件之卡匣,來取代收容台12、22及定位構件13、23,取出口並不限於朝上,可為朝前、朝後、朝右、朝左或朝下,亦可採用腳輪來取代滑軌11、21或與其併用,亦可藉由線性馬達或多關節機器人等驅動機器,以可移動的方式來支撐收容台12、22或卡匣,亦可僅收容1個環框架RF或是收容貼著有接著薄片之環框架RF,或是收容隔著接著薄片來支撐被接著體之環框架RF,此外,在全部的環框架RF從第1收容手段10及第2收容手段20之一方的收容手段中被取出後,於該一方之收容手段的取出口14、24由遮蔽構件32所遮蔽前,可於該一方的收容手段中收容有框架構件,亦可於第1收容手段10及第2收容手段20中收容不同的框架構件,於第1收容手段10及第2收容手段20中亦可採用不同的構成。
收容手段於框架收容裝置EA中可具備有3具以上。
遮蔽手段30可採用作為驅動機器的線性馬達來取代線性導軌31,亦可於各個第1、第2收容手段10、20中設置支撐遮蔽構件32之夾頭壓缸或支柱等支撐手段,亦可於定位構件13、23上載置遮蔽構件32並藉由該遮蔽構件32來遮蔽取出口14、24,亦可藉由金屬、布、薄膜等構件來構成遮蔽構件32,亦可設置握持前端臂51A或托架52之夾頭壓缸或閂鎖等握持手段來取代銷34或與其併用。
移動手段40可於托架52上設置作為卡止構件的銷,並將該銷插入於遮蔽構件32上所設置之卡止孔而將卡止構件卡止於遮蔽構件32,亦可藉由多關節機器人51的前端臂51A來支撐機械夾頭或夾頭壓缸等握持手段或吸附墊等保持手段,並藉由該握持手段或保持手段來握持或保持遮蔽構件32,亦可不藉由取出手段50來構成,在不藉由取出手段50來構成之情形時,例如可藉由線性馬達或多關節機器人等驅動機器來取代線性導軌31或與其併用,以可移動的方式支撐遮蔽構件32,並藉由該驅動機器使遮蔽構件32於第1、第2收容手段10、20間移動。
取出手段50可獨立地設置從第1收容手段10中取出環框架RF者以及從第2收容手段20中取出環框架RF者,亦可從3具以上的收容手段中取出環框架RF,或是不與移動手段40兼用之構成,在不與移動手段40兼用之情形時,可採用獨立於移動手段40而從第1、第2收容手段10、20中取出環框架RF者,亦可不具備卡止構件54,亦可為不藉由偵測手段55來偵測收容於收容台12、22上之環框架RF之構成,在此情形時,可藉由與偵測手段55另外設置之由攝影機或投影機等攝像手段或是光學感測器或超音波感測器等各種感測器等所構成之框架偵測手段,來偵測環框架RF。
處理裝置EA1只要是例如檢查框架構件之檢查裝置、定位框架構件之定位裝置、藉由按壓輥或按壓頭等按壓手段將接著薄片貼著於框架構件之薄片貼著裝置、剝離貼著於框架構件之接著薄片之薄片剝離裝置、清掃框架構件之清掃裝置等之對框架構件施以預定的處理者,就可為任意裝置。
框架構件除了環框架RF之外,亦可為非環狀(外周未連接者),或是圓形、橢圓形、多角形及其他形狀。
本發明中的手段及工序只要是可實現彼等手段及工序中所說明之動作、功能或工序者,就無特別限定,此外,完全不限定於前述實施型態中所表示之僅作為一實施型態的構成物或工序。例如,收容手段只要是具有取出框架構件之取出口並以可取出的方式收容框架構件者,就可為任意手段,只要是對照提出申請時的技術常識而位於其技術範圍內者,就無任何限定(其他手段及工序亦同)。
框架構件、接著薄片及被接著體的材質、種別、形狀等並無特別限定。例如,框架構件、接著薄片及被接著體可為圓形、橢圓形、三角形或四角形等多角形及其他形狀,接著薄片可為感壓接著性、感熱接著性等接著型態,在採用感熱接著性者之情形時,可藉由設置加熱該薄片之適當的線圈加熱器或加熱管的加熱側等加熱手段之適當方法來接著。此外,此接著薄片例如可為僅有接著劑層之單層者,亦可為於基材與接著劑層之間具有中間層者,亦可為於基材的上表面具有覆蓋層等3層以上者,再者,亦可為能夠從接著劑層中剝離基材之所謂雙面接著薄片者,雙面接著薄片可為具有單層或複數層中間層者,或是無中間層之單層或複數層者。此外,被接著體例如可為食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等半導體晶圓、電路基板、光碟等資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等單體物,亦可為由彼等2種以上所形成之複合物,任意型態的構件或物品等亦可成為對象。此外,接著薄片換以功能性、用途性的名稱來稱呼時,可為例如資訊記載用貼紙、裝飾用貼紙、保護薄片、切割膠帶、晶粒黏結薄膜、晶粒黏合膠帶、記錄層形成樹脂薄片等任意薄片、薄膜、膠帶等。
前述實施型態中的驅動機器可採用:轉動馬達、直動馬達、線性馬達、單軸機器人、具備2軸或3軸以上的關節之多關節機器人等電動機器、氣壓缸、油壓缸、無桿壓缸及旋轉壓缸等致動器等,且亦可採用直接或間接地組合彼等者。
於前述實施型態中採用輥等旋轉構件之情形時,可具備旋轉驅動該旋轉構件之驅動機器,亦可由橡膠或樹脂等可變形的構件來構成旋轉構件的表面或旋轉構件本身,亦可由不會變形的構件來構成旋轉構件的表面或旋轉構件本身,亦可採用旋轉或不旋轉的軸或旋翼等其他構件來取代輥,在採用按壓輥或按壓頭等按壓手段或按壓構件之按壓被按壓物者之情形時,除了輥、圓棒、旋翼材、刷狀構件之外,亦可採用藉由大氣或氣體等氣體的吹送者來取代上述所例示者或與其併用,亦可由橡膠、樹脂、海綿等可變形的構件來構成進行按壓者,或是由金屬或樹脂等不會變形的構件來構成,在採用支撐(保持)手段或支撐(保持)構件等將被支撐構件(被保持構件)予以支撐(保持)者之情形時,可採用藉由機械夾頭或夾頭壓缸等握持手段、庫侖力、接著劑(接著薄片、接著膠帶)、黏著劑(黏著薄片、黏著膠帶)、磁力、白努利吸附、吸引吸附、驅動機器等,將被支撐構件予以支撐(保持)之構成。
Embodiments of the present invention will be described below based on the drawings.
In this embodiment, the X axis, the Y axis and the Z axis are respectively in an orthogonal relationship, the X axis and the Y axis constitute the axis in the predetermined plane, and the Z axis constitutes the axis orthogonal to the predetermined plane. Furthermore, in the present embodiment, when the direction is expressed based on the front of the viewer in FIG. 1B parallel to the Y axis, "up" is the arrow direction of the Z axis and "down" is the opposite. direction, "left" is the arrow direction of the X-axis and "right" is the opposite direction, "front" is the arrow direction of the Y-axis and "rear" is the opposite direction.
The frame accommodating device EA of the present invention includes a
10:第1收容手段
11,21:滑軌
11A,21A,31A:滑動器
12,22:收容台
13,23:定位構件
14,24:取出口
20:第2收容手段
30:遮蔽手段
31:線性導軌
32:遮蔽構件
33,52:托架
34:銷
40:移動手段
50:取出手段
51:多關節機器人
51A:前端臂
53:吸附墊
54:卡止構件
54A:卡止孔
55:偵測手段
EA:框架收容裝置
EA1:處理裝置
RF:環框架
TA:作業台
10:
10:第1收容手段 10: 1st Containment Method
11,21:滑軌 11,21: Slide rail
11A,21A,31A:滑動器 11A, 21A, 31A: Slider
12,22:收容台 12,22: Containment Table
13,23:定位構件 13,23: Positioning components
14,24:取出口 14,24: Take out port
20:第2收容手段 20: Second Containment Method
30:遮蔽手段 30: Shading Means
31:線性導軌 31: Linear guide
32:遮蔽構件 32: Shading components
33,52:托架 33,52: Bracket
34:銷 34: Pin
40:移動手段 40: Mobile Means
50:取出手段 50: Take out means
51:多關節機器人 51: Articulated Robot
51A:前端臂 51A: Front Arm
53:吸附墊 53: Adsorption pad
EA:框架收容裝置 EA: Frame Containment Device
EA1:處理裝置 EA1: Processing device
RF:環框架 RF: Ring Frame
TA:作業台 TA: workbench
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JP2020205748A JP6906674B1 (en) | 2020-12-11 | 2020-12-11 | Frame accommodating device and frame accommodating method |
JP2020-205748 | 2020-12-11 |
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TW202230596A true TW202230596A (en) | 2022-08-01 |
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TW110144307A TW202230596A (en) | 2020-12-11 | 2021-11-29 | Frame accommodating device and frame accommodating method comprising accommodating means having a take-out opening, shielding means selectively shielding the take-out opening, and moving means for moving the shielding means |
Country Status (4)
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JP (1) | JP6906674B1 (en) |
KR (1) | KR20220083580A (en) |
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TW495802B (en) * | 1999-04-13 | 2002-07-21 | Semiconductor 300 Gmbh & Amp C | Arrangement for storing objects, particularly for storing disklike objects such as wafers, flat panels or CDs |
JP2001244220A (en) * | 2000-02-29 | 2001-09-07 | Tokyo Seimitsu Co Ltd | Dicing device |
JP2004147540A (en) * | 2002-10-30 | 2004-05-27 | Kawasaki Kiko Co Ltd | Riding work type tea leaf-cutting machine |
CN104221136B (en) * | 2012-04-16 | 2017-05-31 | 日商乐华股份有限公司 | Accommodating container, the shutter opening/closing unit of accommodating container and use their wafer accumulator |
JP5914206B2 (en) * | 2012-06-20 | 2016-05-11 | リンテック株式会社 | Sheet pasting device |
JP2014007216A (en) * | 2012-06-22 | 2014-01-16 | Lintec Corp | Sheet application apparatus and application method |
JP2014027015A (en) * | 2012-07-24 | 2014-02-06 | Lintec Corp | Sheet sticking apparatus and sticking method |
JP6302765B2 (en) * | 2014-06-25 | 2018-03-28 | 株式会社ディスコ | Tape sticking device |
JP6607744B2 (en) * | 2015-09-04 | 2019-11-20 | リンテック株式会社 | Supply device and supply method |
JP7330606B2 (en) * | 2018-11-07 | 2023-08-22 | 株式会社ディスコ | Processing device and cassette mounting mechanism |
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