JP7330606B2 - Processing device and cassette mounting mechanism - Google Patents

Processing device and cassette mounting mechanism Download PDF

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Publication number
JP7330606B2
JP7330606B2 JP2018209753A JP2018209753A JP7330606B2 JP 7330606 B2 JP7330606 B2 JP 7330606B2 JP 2018209753 A JP2018209753 A JP 2018209753A JP 2018209753 A JP2018209753 A JP 2018209753A JP 7330606 B2 JP7330606 B2 JP 7330606B2
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cassette
mounting table
cover
workpiece
processing apparatus
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JP2020077737A (en
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謙 富樫
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Disco Corp
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Disco Corp
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Priority to KR1020190137284A priority patent/KR102721340B1/en
Priority to CN201911059612.7A priority patent/CN111162033A/en
Priority to TW108140132A priority patent/TWI827722B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

本発明は、ウェーハ等の被加工物を加工する加工装置及び該加工装置に併設され該被加工物を収容するカセットが載置されるカセット載置機構に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for processing a workpiece such as a wafer, and a cassette mounting mechanism which is provided in parallel with the processing apparatus and on which a cassette containing the workpiece is mounted.

表面側にＩＣ（integrated circuit）、ＬＳＩ（Large Scale Integration）等のデバイスが形成されたシリコンウェーハ等の被加工物は、例えば、所定の厚さになるように裏面側が研削された後、切削装置等によって個々のデバイスチップに分割される。 A workpiece such as a silicon wafer having a device such as an IC (integrated circuit) or LSI (Large Scale Integration) formed on its front side is ground, for example, to a predetermined thickness on its back side, and then cut by a cutting device. etc. into individual device chips.

通常、研削装置や切削装置等の加工装置を用いてウェーハを加工する前には、まず、ウェーハユニットを形成する。例えば、金属製の環状フレームの開口部にウェーハを配置し、環状フレームの開口部よりも大きな面積の円形のテープを環状フレームとウェーハとに貼り付ける。これにより、ウェーハ、環状フレーム及びテープが一体化されたウェーハユニットが形成される。 Usually, before processing a wafer using a processing device such as a grinding device or a cutting device, first, a wafer unit is formed. For example, a wafer is placed in the opening of an annular frame made of metal, and a circular tape having an area larger than the opening of the annular frame is attached to the annular frame and the wafer. Thereby, a wafer unit is formed in which the wafer, the annular frame and the tape are integrated.

このウェーハユニットは、複数のウェーハユニットを収容可能なカセット内に収容される（例えば、特許文献１参照）。カセット内に複数のウェーハユニットを収容することで、複数のウェーハユニットをまとめて搬送し易くなる。 This wafer unit is housed in a cassette capable of housing a plurality of wafer units (see Patent Document 1, for example). By accommodating a plurality of wafer units in the cassette, it becomes easier to collectively transport the plurality of wafer units.

加工装置には、このカセットを載置するためのカセット載置機構が設けられている。カセットをカセット載置機構に載置した後、加工装置内に設けられている搬送ユニットにより、カセットから加工装置内へ各ウェーハユニットは搬出される。ウェーハが加工装置内で加工された後、ウェーハユニットは加工装置内からカセットへ搬入される。このように、各ウェーハユニットは、搬送ユニットによりカセットと加工装置との間で搬送される。 The processing apparatus is provided with a cassette mounting mechanism for mounting the cassette. After the cassette is placed on the cassette placing mechanism, each wafer unit is unloaded from the cassette into the processing apparatus by a transfer unit provided in the processing apparatus. After the wafers have been processed in the processing equipment, the wafer unit is loaded into the cassette from within the processing equipment. In this way, each wafer unit is transferred between the cassette and the processing apparatus by the transfer unit.

特開２０００－９１４１１号公報JP-A-2000-91411

ところで、カセット及び加工装置間でウェーハユニットが搬送されているときや、加工装置内でウェーハが加工されているときに、作業者が誤ってカセットに接触して、カセットを動かしてしまう場合がある。カセットが動かされると、通常、安全のために加工装置は停止し、ウェーハユニットの搬送やウェーハの加工等が中断される。 By the way, when the wafer unit is being transferred between the cassette and the processing equipment, or when the wafers are being processed in the processing equipment, an operator may accidentally touch the cassette and move the cassette. . When the cassette is moved, the processing equipment is usually stopped for safety reasons, interrupting transfer of the wafer unit, processing of the wafers, and the like.

本発明は係る問題点に鑑みてなされたものであり、ウェーハユニットの搬送中又はウェーハの加工中に、作業者が誤ってカセットに接触することを防ぐことを目的とする。 SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and it is an object of the present invention to prevent an operator from accidentally touching a cassette during transfer of a wafer unit or processing of wafers.

本発明の一態様によれば、板状の被加工物を加工する加工装置及び該加工装置に併設されるカセット載置機構であって、該加工装置は、該カセット載置機構に電気的に接続された制御部を備え、該カセット載置機構は、該被加工物を収容するカセットが載置される載置台と、該載置台の側方に配置され、該載置台に載置された該カセットから該被加工物を搬送するときに該被加工物を通過させる開口部を有するフレーム部と、該フレーム部の該載置台とは反対側に設けられ、該開口部を閉じるドア部と、該フレーム部の該載置台側に設けられ、該載置台に載置される該カセットの該フレーム部側の一部を除く側部を保護できるように構成されたカバー部と、該カセットの該フレーム部側の該一部を除く該側部を保護する保護位置と、該保護位置よりも下方の退避位置との間で該カバー部を昇降させる昇降機構と、該載置台の下方に設けられており、該昇降機構を動作させることができるフットスイッチ部と、該載置台に該カセットが載置されている旨を示す所定の情報を該制御部へ送るセンサー部と、を備え、該カバー部は、互いに向かい合う様に配置された各々板状の第１側面部及び第２側面部と、該第１側面部及び該第２側面部における該フレーム部側とは反対側に位置する一端側を接続する板状の正面部と、を有し、該載置台の上方に位置する該カバー部の上部は、常に開放されており、該制御部が該センサー部から該所定の情報を受信し、且つ、該カバー部を上昇させる旨の指示が該フットスイッチ部を介して該制御部へ送られた場合に、該制御部は、該カバー部を該退避位置から該保護位置へ移動させる加工装置及びカセット載置機構が提供される。 According to one aspect of the present invention, there is provided a processing apparatus for processing a plate-shaped workpiece and a cassette mounting mechanism provided side by side with the processing apparatus , wherein the processing apparatus electrically connects to the cassette mounting mechanism. The cassette mounting mechanism is provided with a control unit connected thereto, and the cassette mounting mechanism includes a mounting table on which a cassette containing the workpiece is mounted, and a mounting table disposed on the side of the mounting table and mounted on the mounting table. a frame portion having an opening through which the work piece passes when the work piece is conveyed from the cassette; and a door portion provided on the opposite side of the frame portion from the mounting table to close the opening. a cover portion provided on the mounting table side of the frame portion and configured to protect a side portion of the cassette mounted on the mounting table, excluding a portion of the cassette on the frame portion side; an elevating mechanism for elevating the cover portion between a protective position for protecting the side portion of the frame portion except for the portion and a retracted position below the protective position; a footswitch unit capable of operating the lifting mechanism; and a sensor unit for sending predetermined information indicating that the cassette is placed on the placing table to the control unit; The cover portion includes a plate-like first side portion and a second side portion arranged to face each other, and one end of the first side portion and the second side portion located on the side opposite to the frame portion side. and a plate-like front portion connecting the sides, the upper portion of the cover portion located above the mounting table is always open, and the control portion receives the predetermined information from the sensor portion. and when an instruction to raise the cover is sent to the controller via the foot switch, the controller moves the cover from the retracted position to the protective position. A processing device and a cassette mounting mechanism are provided.

好ましくは、該カセット載置機構は、該カバー部が該保護位置に上昇させられたことを条件として、該ドア部が該開口部を閉じる閉位置から該開口部を開く開位置へ移動させられ、且つ、該ドア部が該開位置から該閉位置に移動させられたことを条件として、該カバー部が該退避位置に下降させられるように構成されている。 Preferably, the cassette mounting mechanism is moved from the closed position in which the door closes the opening to the open position in which the opening opens on condition that the cover has been raised to the protective position. And, on condition that the door portion is moved from the open position to the closed position, the cover portion is lowered to the retracted position.

また、好ましくは、該被加工物の搬送中及び該被加工物の加工中に、該カバー部を上昇させる旨の指示が該フットスイッチ部を介して該制御部へ送られた場合、該制御部は、該カバー部を該保護位置から該退避位置へ移動させない。また、好ましくは、該フットスイッチ部は、発光素子及び受光素子を有する透過検出方式又は反射検出方式の他のセンサー部を含む。該加工装置は、該被加工物にレーザービームを照射するレーザー加工装置、該被加工物を切削する切削装置、該被加工物を研削する研削装置、又は、該被加工物を研磨する研磨装置である。 Further, preferably, when an instruction to raise the cover portion is sent to the control portion via the foot switch portion while the work piece is being transported and the work piece is being processed, the control portion does not move the cover portion from the protective position to the retracted position. Further, preferably, the foot switch section includes another sensor section of transmission detection type or reflection detection type having a light-emitting element and a light-receiving element. The processing apparatus includes a laser processing apparatus for irradiating the workpiece with a laser beam, a cutting apparatus for cutting the workpiece, a grinding apparatus for grinding the workpiece, or a polishing apparatus for polishing the workpiece. is.

本発明の一態様に係るカセット載置機構は、載置台に載置されるカセットのフレーム部側の一部を除く側部を保護できるように構成されたカバー部を備える。これにより、カセットと加工装置との間で被加工物が搬送されているときや、加工装置内で被加工物が加工されているときに、作業者が誤ってカセットに接触することを防止できる。それゆえ、加工装置における板状の被加工物の加工や搬送が中断されることを防ぐことができる。 A cassette placing mechanism according to an aspect of the present invention includes a cover portion configured to protect a side portion of a cassette placed on a placing table, excluding a part of the frame portion side. As a result, it is possible to prevent the operator from accidentally contacting the cassette while the workpiece is being conveyed between the cassette and the processing device, or while the workpiece is being processed within the processing device. . Therefore, it is possible to prevent the processing and transportation of the plate-shaped workpiece in the processing apparatus from being interrupted.

第１実施形態に係る加工装置及びカセット載置機構の斜視図である。It is a perspective view of a processing device and a cassette mounting mechanism according to the first embodiment. カバー部及び移動機構の斜視図である。It is a perspective view of a cover part and a moving mechanism. 図２の領域Ａを拡大した一部断面側面図である。FIG. 3 is a partial cross-sectional side view enlarging a region A of FIG. 2; 搬送作業中の様子を示す斜視図である。It is a perspective view which shows the mode during conveyance work. 加工及び搬送作業終了後の様子を示す斜視図である。FIG. 11 is a perspective view showing a state after processing and transportation work are finished; 図６（Ａ）は、カセットを載置台に載置する段階Ｓ１０を示す図であり、図６（Ｂ）は、カバー部を保護位置へ上昇させる段階Ｓ２０を示す図であり、図６（Ｃ）は、ドア部を開位置に移動させた後、搬送及び加工作業を行う段階Ｓ３０を示す図であり、図６（Ｄ）は、ドア部を閉位置に移動させる段階Ｓ４０を示す図であり、図６（Ｅ）は、カバー部を退避位置へ下降させる段階Ｓ５０を示す図である。FIG. 6(A) is a diagram showing step S10 of placing the cassette on the mounting table, FIG. 6(B) is a diagram showing step S20 of raising the cover portion to the protective position, and FIG. ) is a diagram showing the step S30 of moving the door portion to the open position and carrying out the transportation and processing operations, and FIG. 6(D) is a diagram showing the step S40 of moving the door portion to the closed position. 6(E) is a diagram showing step S50 for lowering the cover portion to the retracted position. 第２実施形態に係る加工装置及びカセット載置機構の斜視図である。It is a perspective view of a processing device and a cassette mounting mechanism according to a second embodiment. 第３実施形態に係るフットスイッチ部の斜視図である。It is a perspective view of the footswitch part which concerns on 3rd Embodiment.

添付図面を参照して、本発明の一態様に係る実施形態について説明する。図１は、第１実施形態に係る加工装置２及びカセット載置機構１０の斜視図である。加工装置２は、被加工物を加工するための装置であり、例えば、被加工物にレーザービームを照射するレーザー加工装置、被加工物を切削する切削装置、被加工物を研削する研削装置、又は、被加工物を研磨する研磨装置である。 An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a processing device 2 and a cassette mounting mechanism 10 according to the first embodiment. The processing device 2 is a device for processing a workpiece. Alternatively, it is a polishing apparatus for polishing a workpiece.

加工装置２は金属等で形成された筐体を有し、この筐体の正面２ａにはタッチパネル式のモニター４が配置されている。モニター４は、作業者が加工装置２に対して指示を入力する入力装置と、被加工物の画像、加工条件、加工結果等を表示する表示装置とを兼ねている。 The processing apparatus 2 has a housing made of metal or the like, and a touch panel type monitor 4 is arranged on the front surface 2a of the housing. The monitor 4 serves both as an input device for an operator to input instructions to the processing device 2 and as a display device for displaying an image of a workpiece, processing conditions, processing results, and the like.

例えば、作業者は、モニター４に表示されるボタン等に触れることにより、モニター４を介して加工装置２に対して加工条件を設定できる。また、モニター４には、加工装置２内に設置されている不図示の撮像装置により撮像された被加工物の画像等が表示される。 For example, the operator can set processing conditions for the processing device 2 via the monitor 4 by touching buttons or the like displayed on the monitor 4 . The monitor 4 also displays an image of the workpiece captured by an imaging device (not shown) installed in the processing device 2, and the like.

加工装置２の筐体の正面２ａのうちモニター４とは異なる所定の位置には、カセット載置機構１０が併設される。本実施形態のカセット載置機構１０は加工装置２とは別体であり、加工装置２に対して付加的に取り付けられる構造物である。 A cassette mounting mechanism 10 is provided at a predetermined position different from the monitor 4 on the front surface 2a of the housing of the processing apparatus 2. As shown in FIG. The cassette mounting mechanism 10 of this embodiment is a separate body from the processing device 2 and is a structure that is additionally attached to the processing device 2 .

カセット載置機構１０は、ステンレス鋼等の金属材料で形成された略直方体形状の筐体を有する基台部１２を備える。基台部１２の上部には開口部が設けられており、この開口部の上方には、カセット３０が載置される載置台１４が設けられている。 The cassette mounting mechanism 10 includes a base portion 12 having a substantially rectangular parallelepiped housing made of a metal material such as stainless steel. An opening is provided in the upper portion of the base portion 12, and a mounting table 14 on which the cassette 30 is mounted is provided above the opening.

載置台１４は、ステンレス鋼等の金属材料で形成された矩形状の板状部材であり、基台部１２の上部に略水平に配置されている。載置台１４は、基台部１２の開口部よりも小さく、カセット３０の底面部よりも大きい面積を有する。 The mounting table 14 is a rectangular plate member made of a metal material such as stainless steel, and is arranged substantially horizontally above the base section 12 . The mounting table 14 has an area smaller than the opening of the base 12 and larger than the bottom surface of the cassette 30 .

載置台１４は、高さ方向（Ｚ軸方向）に移動可能な昇降ユニット（不図示）により支持されている。昇降ユニットは、基台部１２の筐体の内側に位置する。昇降ユニットは、載置台１４を高さ方向に沿って移動させ、載置台１４の高さ位置を調節できる。 The mounting table 14 is supported by an elevating unit (not shown) that is movable in the height direction (Z-axis direction). The lifting unit is located inside the housing of the base section 12 . The lifting unit can adjust the height position of the mounting table 14 by moving the mounting table 14 along the height direction.

載置台１４の上面には、上下移動可能な押圧ピン（不図示）が当該上面から突出する態様で設けられており、載置台１４の内部には押圧ピンの接触を検知する第１のセンサー部（不図示）が設けられている。 A vertically movable pressing pin (not shown) is provided on the upper surface of the mounting table 14 so as to protrude from the upper surface. (not shown) are provided.

載置台１４にカセット３０が載置されると、この押圧ピンが押し下げられ載置台１４内に設けられた第１のセンサー部に接触し、載置台１４にカセット３０が載置された旨を示す所定の信号が、第１のセンサー部から後述する制御部８へ送られる。 When the cassette 30 is placed on the mounting table 14 , the pressing pin is pushed down and comes into contact with the first sensor provided in the mounting table 14 to indicate that the cassette 30 has been mounted on the mounting table 14 . A predetermined signal is sent from the first sensor unit to the control unit 8, which will be described later.

また、載置台１４の側方に配置されたフレーム部２６（詳細は後述する）には発光素子及び受光素子を有する第２のセンサー部（不図示）が設けられており、この第２のセンサー部はカセット３０内にウェーハユニット９が存在するか否かを検知する。 A frame portion 26 (details will be described later) disposed on the side of the mounting table 14 is provided with a second sensor portion (not shown) having a light emitting element and a light receiving element. The part detects whether or not the wafer unit 9 is present in the cassette 30 .

載置台１４の上面には、金属又は樹脂で形成された略直方体状のカセット３０が載置される。カセット３０は、複数の被加工物を収容するための収容容器である。本実施形態のカセット３０は、板状の一対の側面部（即ち、第１側面部３２ａ及び第２側面部３２ｂ）を有する。 A substantially rectangular parallelepiped cassette 30 made of metal or resin is mounted on the upper surface of the mounting table 14 . The cassette 30 is a storage container for storing a plurality of workpieces. The cassette 30 of this embodiment has a pair of plate-shaped side portions (that is, a first side portion 32a and a second side portion 32b).

第１側面部３２ａ及び第２側面部３２ｂの各上部は、棒状の複数の接続部３２ｃにより互いに連結されている。また、第１側面部３２ａ及び第２側面部３２ｂの各下部も同様に、棒状の複数の接続部３２ｃにより互いに連結されている。 The upper portions of the first side surface portion 32a and the second side surface portion 32b are connected to each other by a plurality of rod-like connecting portions 32c. Likewise, the lower portions of the first side portion 32a and the second side portion 32b are connected to each other by a plurality of rod-like connecting portions 32c.

なお、図１に示す様に、第１側面部３２ａの上部には２個の接続部３２ｃが設けられているが、接続部３２ｃの数は２個に限定されず、１個又は３個以上であってもよい。また、接続部３２ｃの形状は、棒状に限定されず、板状であってもよい。 As shown in FIG. 1, two connection portions 32c are provided on the upper portion of the first side surface portion 32a, but the number of connection portions 32c is not limited to two, and may be one or three or more. may be Moreover, the shape of the connecting portion 32c is not limited to a rod shape, and may be a plate shape.

第１側面部３２ａ及び第２側面部３２ｂの上部側における複数の接続部３２ｃは、把手３２ｄで互いに連結されている。作業者は、把手３２ｄを持つことによりカセット３０を運ぶことができる。 A plurality of connection portions 32c on the upper side of the first side portion 32a and the second side portion 32b are connected to each other by a handle 32d. An operator can carry the cassette 30 by holding the handle 32d.

第１側面部３２ａ及び第２側面部３２ｂの各々は、互いに対向する内側側面に複数の棚板３２ｅを有する。各棚板３２ｅは、カセット３０の高さ方向に沿って所定の間隔で複数設けられている。本実施形態では、互いに対向する棚板３２ｅのうち同じ高さ位置にある一対の棚板３２ｅにより、１つのウェーハユニット９が支持される。 Each of the first side portion 32a and the second side portion 32b has a plurality of shelf plates 32e on the inner side surfaces facing each other. A plurality of shelf plates 32 e are provided at predetermined intervals along the height direction of the cassette 30 . In this embodiment, one wafer unit 9 is supported by a pair of shelf plates 32e located at the same height among the shelf plates 32e facing each other.

ウェーハユニット９は、金属製の環状フレーム５の開口部にウェーハ（被加工物）１が配置され、環状フレーム５の開口部よりも大きな面積を有する円形のテープ３により環状フレーム５とウェーハ１とが接着されることで形成される。 In the wafer unit 9, a wafer (workpiece) 1 is placed in the opening of a metal annular frame 5, and the annular frame 5 and the wafer 1 are held together by a circular tape 3 having an area larger than the opening of the annular frame 5. are formed by bonding.

本実施形態では、複数対の棚板３２ｅにより、複数のウェーハユニット９がカセット３０の高さ方向に重なるように収容される。このように、複数対の棚板３２ｅは、複数のウェーハ１を収容する収容空間を形成している。なお、１つのウェーハユニット９ではなく１つのウェーハ１が、一対の棚板３２ｅにより直接支持されてもよい。 In this embodiment, a plurality of wafer units 9 are accommodated so as to overlap in the height direction of the cassette 30 by a plurality of pairs of shelf plates 32e. In this manner, the plurality of pairs of shelf plates 32e form storage spaces for storing a plurality of wafers 1. As shown in FIG. Note that one wafer 1 instead of one wafer unit 9 may be directly supported by a pair of shelf plates 32e.

棚板３２ｅの一端側には、被加工物を係止する係止構造（不図示）が設けられている。本実施形態では、棚板３２ｅの一端側を係止部側３２ｆと称し、棚板３２ｅの他端側（即ち、係止部側３２ｆとは反対側）を搬出入部側３２ｇと称する。 A locking structure (not shown) for locking a workpiece is provided on one end side of the shelf plate 32e. In this embodiment, one end side of the shelf plate 32e is referred to as the locking portion side 32f, and the other end side of the shelf plate 32e (that is, the opposite side to the locking portion side 32f) is referred to as the loading/unloading portion side 32g.

カセット３０の係止部側３２ｆ及び搬出入部側３２ｇは、板状の面部材が設けられていない開放領域である。ウェーハユニット９は、カセット３０の搬出入部側３２ｇを通る様にして、カセット３０から外部へ搬出され、外部からカセット３０へ搬入される。 An engaging portion side 32f and a loading/unloading portion side 32g of the cassette 30 are open areas where no plate-like surface member is provided. The wafer unit 9 is unloaded from the cassette 30 to the outside through the loading/unloading side 32g of the cassette 30, and loaded into the cassette 30 from the outside.

なお、カセット３０は、図１に示す形状に限定されない。例えば、カセット３０の係止部側３２ｆ、上部及び下部には、板状の面部材が設けられ、搬出入部側３２ｇのみが完全に解放されていてもよい。また、カセット３０は、ＦＯＵＰ（Front Opening Unify Pod）型のカセットであってもよい。 Note that the cassette 30 is not limited to the shape shown in FIG. For example, plate-like surface members may be provided on the locking portion side 32f, the upper portion and the lower portion of the cassette 30, and only the carry-in/out portion side 32g may be completely released. Moreover, the cassette 30 may be a FOUP (Front Opening Unify Pod) type cassette.

基台部１２の内側及び載置台１４の側方の外側には、カバー部１６が設けられている。本実施形態のカバー部１６は、３つの略矩形状の樹脂製の板部材で構成されており、載置台１４にカセット３０が載置された場合に、カセット３０の一部（即ち、搬出入部側３２ｇ）を除く側部（即ち、第１側面部３２ａ、第２側面部３２ｂ及び係止部側３２ｆ）を保護できるように構成されている。 A cover portion 16 is provided inside the base portion 12 and outside of the side of the mounting table 14 . The cover portion 16 of the present embodiment is composed of three substantially rectangular resin-made plate members, and when the cassette 30 is mounted on the mounting table 14, a part of the cassette 30 (that is, the loading/unloading portion) Side 32g) (that is, the first side 32a, the second side 32b, and the engaging portion side 32f) can be protected.

カバー部１６は、互いに向かい合う第１側面部１６ａ及び第２側面部１６ｂと、第１側面部１６ａ及び第２側面部１６ｂの一端側に接続する正面部１６ｃとを有する。第１側面部１６ａ、第２側面部１６ｂ及び正面部１６ｃは、高さ方向（即ち、Ｚ軸方向）の長さが同じであり、各々の長さは、カセット３０の下端部から上端部までの長さよりも長い。 The cover portion 16 has a first side portion 16a and a second side portion 16b facing each other, and a front portion 16c connected to one end side of the first side portion 16a and the second side portion 16b. The first side portion 16a, the second side portion 16b, and the front portion 16c have the same length in the height direction (that is, in the Z-axis direction), and each length extends from the lower end to the upper end of the cassette 30. longer than the length of

第１側面部１６ａ及び第２側面部１６ｂの内側面は、互いに平行であり、正面部１６ｃの内側面は、第１側面部１６ａ及び第２側面部１６ｂの内側面と直交する。第１側面部１６ａ及び第２側面部１６ｂの他端側と、カバー部１６の上部及び下部とは、完全に開放されている。 The inner surfaces of the first side portion 16a and the second side portion 16b are parallel to each other, and the inner surface of the front portion 16c is perpendicular to the inner surfaces of the first side portion 16a and the second side portion 16b. The other end sides of the first side portion 16a and the second side portion 16b and the upper and lower portions of the cover portion 16 are completely open.

カバー部１６は、基台部１２の筐体の内側に収容されている昇降機構１８（図２及び図３参照）に接続されている。カバー部１６は、この昇降機構１８により、載置台１４上に載置されたカセット３０に対して昇降させられる。ここで、図２及び図３を用いて昇降機構１８について説明する。 The cover portion 16 is connected to an elevating mechanism 18 (see FIGS. 2 and 3) housed inside the housing of the base portion 12 . The cover portion 16 is moved up and down with respect to the cassette 30 mounted on the mounting table 14 by the lifting mechanism 18 . Here, the lifting mechanism 18 will be described with reference to FIGS. 2 and 3. FIG.

図２は、カバー部１６及び昇降機構１８の斜視図である。昇降機構１８は、金属で形成されたブラケット２０を有する。ブラケット２０は、カバー部１６の下部に接続され、カバー部１６と一体化されている。 FIG. 2 is a perspective view of the cover portion 16 and the lifting mechanism 18. As shown in FIG. The lifting mechanism 18 has a bracket 20 made of metal. The bracket 20 is connected to the lower portion of the cover portion 16 and integrated with the cover portion 16 .

ブラケット２０は、カバー部１６の第１側面部１６ａの下部に接続された第１直線部２０ａと、第２側面部１６ｂの下部に接続された第２直線部２０ｂと、正面部１６ｃの下部に接続された第３直線部２０ｃとで構成されている。 The bracket 20 has a first linear portion 20a connected to the lower portion of the first side portion 16a of the cover portion 16, a second linear portion 20b connected to the lower portion of the second side portion 16b, and a lower portion of the front portion 16c. It is composed of a connected third linear portion 20c.

第１直線部２０ａ及び第３直線部２０ｃは、第１角部２０ｄを構成しており、第２直線部２０ｂ及び第３直線部２０ｃは、第２角部２０ｅを構成している。第１角部２０ｄの近傍には、第１のリニアガイド部が設けられ、第２角部２０ｅには、第２のリニアガイド部が設けられている。 The first straight portion 20a and the third straight portion 20c form a first corner portion 20d, and the second straight portion 20b and the third straight portion 20c form a second corner portion 20e. A first linear guide portion is provided near the first corner portion 20d, and a second linear guide portion is provided at the second corner portion 20e.

第１のリニアガイド部は、略直方体状の金属製のスライダ２４ｇと、細長い板状の金属製のガイドレール２４ｉとから成り、第２のリニアガイド部も同様に、略直方体状の金属製のスライダ２４ｈと、細長い板状の金属製のガイドレール２４ｊから成る。 The first linear guide portion is composed of a substantially rectangular parallelepiped metal slider 24g and an elongated plate-like metal guide rail 24i. It consists of a slider 24h and an elongated plate-like metal guide rail 24j.

ガイドレール２４ｉ及び２４ｊは、ブラケット２０の外側に配置されており、ガイドレール２４ｉ及び２４ｊの側面は、第１直線部２０ａ及び第２直線部２０ｂの側面と、第１側面部１６ａ及び第２側面部１６ｂに略平行である。 The guide rails 24i and 24j are arranged outside the bracket 20, and the side surfaces of the guide rails 24i and 24j are the side surfaces of the first linear portion 20a and the second linear portion 20b, the first side surface portion 16a and the second side surface. It is substantially parallel to the portion 16b.

ガイドレール２４ｉ及び２４ｊには、スライダ２４ｇ及び２４ｈの一方の側部が、上下方向に移動可能に連結されている。スライダ２４ｇの上部には、ブラケット２０の第１角部２０ｄが接続されており、スライダ２４ｈの上部には、ブラケット２０の第２角部２０ｅが接続されている。 One side portions of the sliders 24g and 24h are connected to the guide rails 24i and 24j so as to be vertically movable. A first corner portion 20d of the bracket 20 is connected to the upper portion of the slider 24g, and a second corner portion 20e of the bracket 20 is connected to the upper portion of the slider 24h.

第１直線部２０ａに対して第１のリニアガイド部よりも内側には、ロッドレスシリンダ（rodless cylinder）２２ａが設けられており、第２直線部２０ｂに対して第２のリニアガイド部よりも内側には、もう１つのロッドレスシリンダ２２ｂが設けられている。ロッドレスシリンダ２２ａ及び２２ｂは、金属で形成された直方体形状のボディ部２４ａ及び２４ｂを有する。 A rodless cylinder 22a is provided inside the first linear guide portion with respect to the first linear portion 20a, and is arranged with respect to the second linear portion 20b more than the second linear guide portion. Inside, another rodless cylinder 22b is provided. The rodless cylinders 22a and 22b have rectangular parallelepiped body portions 24a and 24b made of metal.

スライダ２４ｇの一方の側部とは反対側に位置するスライダ２４ｇの他の側部は、ロッドレスシリンダ２２ａのボディ部２４ａに固定されている。同様に、スライダ２４ｈの他の側部は、ロッドレスシリンダ２２ｂのボディ部２４ｂに固定されている。この様に、ブラケット２０は、第１及び第２のリニアガイド部を介して、ロッドレスシリンダ２２ａ及び２２ｂにより支持されている。 The other side portion of the slider 24g located on the side opposite to the one side portion of the slider 24g is fixed to the body portion 24a of the rodless cylinder 22a. Similarly, the other side portion of the slider 24h is fixed to the body portion 24b of the rodless cylinder 22b. Thus, the bracket 20 is supported by the rodless cylinders 22a and 22b via the first and second linear guides.

ボディ部２４ａ及び２４ｂは、円筒状の貫通開口を有する。この貫通開口には、ガイドレール２４ｉ及び２４ｊの延伸方向に沿って設けられ金属で形成された円筒状のシリンダチューブ２４ｃ及び２４ｄが配置されている。ボディ部２４ａ及び２４ｂは、シリンダチューブ２４ｃ及び２４ｄの高さ方向に沿って移動可能に構成されている。 Body portions 24a and 24b have cylindrical through openings. Cylindrical cylinder tubes 24c and 24d made of metal are arranged in the through openings along the extending direction of the guide rails 24i and 24j. The body portions 24a and 24b are configured to be movable along the height direction of the cylinder tubes 24c and 24d.

シリンダチューブ２４ｃ及び２４ｄの内部には、シリンダチューブ２４ｃ及び２４ｄの長手方向にスライド可能な円柱状のピストン（不図示）が設けられている。ピストンには磁石が設けられており、ボディ部２４ａ及び２４ｂにはピストンを囲むように磁石が設けられている。ピストンの磁石とボディ部２４ａ及び２４ｂの磁石とは互いに磁気的に結合している。 Inside the cylinder tubes 24c and 24d, cylindrical pistons (not shown) are provided which are slidable in the longitudinal direction of the cylinder tubes 24c and 24d. Magnets are provided on the pistons, and magnets are provided on the body portions 24a and 24b so as to surround the pistons. The magnets in the piston and the magnets in body portions 24a and 24b are magnetically coupled to each other.

シリンダチューブ２４ｃ及び２４ｄの底部には基部２４ｅ及び２４ｆが設けられており、頂部にはヘッドカバー（不図示）が設けられている。例えば、基部２４ｅ及び２４ｆからシリンダチューブ２４ｃ及び２４ｄの内部にエアーが供給され、ヘッドカバーからエアーが排出されると、シリンダチューブ２４ｃ及び２４ｄに対してピストンが上昇する。 Base portions 24e and 24f are provided at the bottom portions of the cylinder tubes 24c and 24d, and a head cover (not shown) is provided at the top portion. For example, when air is supplied to the inside of the cylinder tubes 24c and 24d from the bases 24e and 24f and discharged from the head cover, the pistons rise with respect to the cylinder tubes 24c and 24d.

同様に、基部２４ｅ及び２４ｆからエアーが排出され、ヘッドカバーからシリンダチューブ２４ｃ及び２４ｄの内部にエアーが供給されると、シリンダチューブ２４ｃ及び２４ｄに対して、ピストンが下降する。このように、ピストンがシリンダチューブ２４ｃ及び２４ｄの内部を上下方向にスライドすることに伴い、ボディ部２４ａ及び２４ｂも上下方向にスライドする。 Similarly, when air is discharged from the bases 24e and 24f and supplied from the head cover to the insides of the cylinder tubes 24c and 24d, the pistons descend relative to the cylinder tubes 24c and 24d. As the pistons slide vertically inside the cylinder tubes 24c and 24d, the body portions 24a and 24b also slide vertically.

上述の様に、ボディ部２４ａ及び２４ｂは、スライダ２４ｇ及び２４ｈを介してブラケット２０に固定されているので、ボディ部２４ａ及び２４ｂを上下にスライドさせることで、ブラケット２０を介してカバー部１６を上昇又は下降させることができる。図３は、図２の領域Ａを拡大した一部断面側面図である。 As described above, the body portions 24a and 24b are fixed to the bracket 20 via the sliders 24g and 24h. Can be raised or lowered. FIG. 3 is a partial cross-sectional side view enlarging the area A of FIG. 2. FIG.

カバー部１６は、昇降機構１８により、カセット３０を保護する保護位置（図１参照）と、基台部１２の内側に退避する退避位置（図５参照）との間で移動（即ち、昇降）する。本実施形態における保護位置とは、載置台１４に載置されたカセット３０の第１側面部３２ａ、第２側面部３２ｂ及び係止部側３２ｆを、カバー部１６が覆う位置である。 The cover portion 16 is moved (i.e., moved up and down) between a protection position (see FIG. 1) where the cassette 30 is protected and a retracted position (see FIG. 5) where the cover portion 16 is retracted inside the base portion 12 by the elevating mechanism 18. do. The protection position in this embodiment is a position where the cover portion 16 covers the first side portion 32a, the second side portion 32b, and the locking portion side 32f of the cassette 30 placed on the mounting table 14. FIG.

カバー部１６が保護位置にあるとき、カバー部１６の各側部（即ち、第１側面部１６ａ、第２側面部１６ｂ及び正面部１６ｃ）の上端部１６ｄは、カセット３０の頂面部よりも上に位置する。これにより、カバー部１６は、カセット３０の側方を保護する。 The upper edge 16d of each side of the cover 16 (i.e., the first side 16a, the second side 16b and the front 16c) is above the top of the cassette 30 when the cover 16 is in the protective position. Located in Thereby, the cover portion 16 protects the sides of the cassette 30 .

また、本実施形態における退避位置とは、保護位置よりも下方に位置し、カバー部１６が基台部１２の内側に隠れる位置である。カバー部１６が退避位置にあるとき、カバー部１６の各側部の上端部１６ｄは、載置台１４と同じか又は載置台１４よりも低い位置にある。このとき、カバー部１６はカセット３０を保護しないので、作業者は、カセット３０に容易にアクセスできる。 Further, the retracted position in the present embodiment is a position located below the protection position, where the cover portion 16 is hidden inside the base portion 12 . When the cover portion 16 is at the retracted position, the upper end portion 16d of each side portion of the cover portion 16 is positioned at the same level as or lower than the mounting table 14 . Since the cover part 16 does not protect the cassette 30 at this time, the operator can easily access the cassette 30 .

ここで、図１に戻る。載置台１４に対して正面部１６ｃの反対側（即ち、載置台１４の背面側の側方）であって、第１側面部１６ａ及び第２側面部１６ｂの他端側から所定距離（例えば数ｍｍ）離れた位置には、フレーム部２６が配置されている。フレーム部２６は、ステンレス鋼等の金属材料で形成されている板状部材であり、床面に対して略垂直に立てられている。 Now, return to FIG. A predetermined distance (for example, a number of mm), a frame portion 26 is arranged. The frame portion 26 is a plate-like member made of a metal material such as stainless steel, and stands substantially perpendicular to the floor surface.

フレーム部２６の略上半分には、フレーム部２６の正面２６ａから背面２６ｂまで貫通している略矩形状の開口部２６ｃが設けられている。開口部２６ｃは直方体状の貫通開口であり、正面２６ａ及び背面２６ｂにおける開口部２６ｃの大きさは、カセット３０の搬出入部側３２ｇと略同じか又はこれよりも大きい。それゆえ、開口部２６ｃは、ウェーハユニット９を通過させることができる。 A substantially rectangular opening 26c penetrating from the front surface 26a to the back surface 26b of the frame portion 26 is provided in the substantially upper half of the frame portion 26. As shown in FIG. The opening 26c is a rectangular parallelepiped penetrating opening, and the size of the opening 26c on the front surface 26a and the back surface 26b is substantially the same as or larger than the loading/unloading portion side 32g of the cassette 30. As shown in FIG. Therefore, the opening 26c allows the wafer unit 9 to pass through.

フレーム部２６の略上半分の背面２６ｂ側には、略矩形状であり、開口部２６ｃの背面２６ｂにおける開口面積よりも大きな面積を有するドア部２８が配置されている。なお、ドア部２８は、カセット載置機構１０の一部である。本実施形態のドア部２８は、移動ユニット（不図示）により、フレーム部２６の高さ方向（即ち、Ｚ軸方向）に沿ってスライドして移動するよう構成されている。 A door portion 28 having a substantially rectangular shape and having a larger area than the opening area of the opening portion 26c at the rear surface 26b is arranged on the substantially upper half of the frame portion 26 on the side of the rear surface 26b. Note that the door portion 28 is a part of the cassette mounting mechanism 10 . The door portion 28 of this embodiment is configured to slide and move along the height direction (that is, the Z-axis direction) of the frame portion 26 by a moving unit (not shown).

本実施形態のドア部２８は、例えば、開口部２６ｃの背面２６ｂ側を完全に閉じる閉位置（即ち、図１に示すドア部２８の位置、即ち、上方位置）と、開口部２６ｃの背面２６ｂ側を完全に開く開位置（即ち、図４に示すドア部２８の位置、即ち、下方位置）とに位置するように、移動ユニットにより移動させられる。 The door portion 28 of the present embodiment has, for example, a closed position (that is, the position of the door portion 28 shown in FIG. 1, that is, an upper position) in which the rear surface 26b side of the opening 26c is completely closed, and a rear surface 26b of the opening 26c. It is moved by the moving unit so that it is in the fully open position (ie the position of the door part 28 shown in FIG. 4, ie the downward position).

フレーム部２６の略下半分の領域（即ち、開口部２６ｃよりも下の領域）には、上述の基台部１２の背面側が連結している。また、フレーム部２６の下方には、床面に接する複数のキャスター２６ｄが設けられている。 The rear side of the base 12 described above is connected to a substantially lower half region of the frame portion 26 (that is, a region below the opening 26c). A plurality of casters 26d are provided below the frame portion 26 so as to contact the floor surface.

キャスター２６ｄは、例えば、フレーム部２６の幅方向（図１のＹ軸方向）の両端部に設けられている。キャスター２６ｄは、加工装置２から独立してカセット載置機構１０を移動させるために用いられる。 The casters 26d are provided, for example, at both ends of the frame portion 26 in the width direction (the Y-axis direction in FIG. 1). The casters 26 d are used to move the cassette mounting mechanism 10 independently of the processing device 2 .

図１に示す様に、本実施形態のカセット載置機構１０は、加工装置２に取り付けられている。特に、フレーム部２６及びドア部２８は、フレーム部２６の正面２６ａが加工装置２の筐体の正面２ａと略平行になるように、加工装置２に埋め込まれている。 As shown in FIG. 1, the cassette mounting mechanism 10 of this embodiment is attached to the processing device 2 . In particular, the frame portion 26 and the door portion 28 are embedded in the processing device 2 such that the front surface 26a of the frame portion 26 is substantially parallel to the front surface 2a of the housing of the processing device 2. As shown in FIG.

加工装置２の内部の開口部２６ｃに対向する位置には、搬送アーム６が配置されている。この搬送アーム６は、略Ｕ字状のハンド部を有しており、ハンド部の一方側の面にはウェーハユニット９を吸着する吸着パッド等の吸着機構が設けられている。 A transfer arm 6 is arranged at a position facing the opening 26 c inside the processing device 2 . The transfer arm 6 has a substantially U-shaped hand portion, and a suction mechanism such as a suction pad for sucking the wafer unit 9 is provided on one side of the hand portion.

搬送アーム６は、例えば、カセット３０に収容されているウェーハユニット９の下方にハンド部を移動させて、ハンド部でウェーハユニット９を吸着して、加工装置２の内部に配置されている位置合わせテーブル（不図示）等へウェーハユニット９を搬送する。 The transfer arm 6 moves, for example, the hand portion below the wafer unit 9 housed in the cassette 30 and sucks the wafer unit 9 with the hand portion to perform an alignment process arranged inside the processing apparatus 2 . The wafer unit 9 is transferred to a table (not shown) or the like.

搬送アーム６等の動きは、加工装置２内に設けられた制御部８により制御される。制御部８は、例えばコンピュータであり、ホスト・コントローラを介して相互に接続されるＣＰＵ、ＲＡＭ、ハードディスクドライブ等を有する。 Movements of the transfer arm 6 and the like are controlled by a control unit 8 provided within the processing apparatus 2 . The control unit 8 is a computer, for example, and has a CPU, a RAM, a hard disk drive, etc., which are interconnected via a host controller.

ＣＰＵは、ＲＡＭ、ハードディスクドライブ等の記憶部分に格納されたプログラム、データ等に基づいて演算処理等を行う。ＣＰＵが記憶部分に格納されたプログラムを読み込むことにより、制御部８は、ソフトウェアと上述のハードウェア資源とが協働した具体的手段として機能できる。 The CPU performs arithmetic processing and the like based on programs, data, and the like stored in storage portions such as RAM and hard disk drives. By reading the program stored in the storage section by the CPU, the control unit 8 can function as concrete means in which the software and the above-described hardware resources cooperate.

制御部８は、搬送アーム６に加えて、モニター４にも電気的に接続している。また、カセット載置機構１０を加工装置２に取り付けたときに、制御部８は、カセット載置機構１０と電気的に接続する。 The controller 8 is electrically connected to the monitor 4 in addition to the transfer arm 6 . Also, when the cassette mounting mechanism 10 is attached to the processing apparatus 2 , the control unit 8 is electrically connected to the cassette mounting mechanism 10 .

制御部８は、モニター４を介して作業者からの指示を受け、各部の動作を制御する。例えば、制御部８は、モニター４を介してカバー部１６及びドア部２８等を移動させる旨の指示を受け、その指示を反映するべく昇降機構１８及び移動ユニットの動きを制御する。 The control unit 8 receives instructions from the operator via the monitor 4 and controls the operation of each unit. For example, the control section 8 receives an instruction to move the cover section 16, the door section 28, etc. via the monitor 4, and controls the movements of the lifting mechanism 18 and the moving unit so as to reflect the instruction.

次に、図１、図４及び図５を用いて、加工装置２でウェーハ１を加工するときの搬送アーム６、カバー部１６及びドア部２８の動きについて説明する。ドア部２８が閉位置にあり、且つ、カバー部１６が退避位置にあるとき、作業者は、載置台１４にカセット３０を載置する。 Next, movements of the transfer arm 6, the cover portion 16 and the door portion 28 when the wafer 1 is processed by the processing apparatus 2 will be described with reference to FIGS. 1, 4 and 5. FIG. When the door portion 28 is at the closed position and the cover portion 16 is at the retracted position, the operator places the cassette 30 on the placing table 14 .

載置台１４にカセット３０が載置されると、上述の押圧ピンが押圧され、載置台１４の第１のセンサー部から制御部８へ、載置台１４上にカセット３０が存在することを示す情報ａが送られる。 When the cassette 30 is placed on the mounting table 14 , the above-described pressing pin is pressed, and information indicating that the cassette 30 is present on the mounting table 14 is transmitted from the first sensor section of the mounting table 14 to the control section 8 . a is sent.

また、上述の第２のセンサー部は、カセット３０内にウェーハユニット９が存在する場合に、その旨を示す情報ｂを制御部８へ送る。情報ａ及びｂは、例えば、加工装置２がカセット３０からウェーハユニット９の搬出を開始するときの前提条件として利用される。 Further, the above-described second sensor section sends information b indicating that fact to the control section 8 when the wafer unit 9 is present in the cassette 30 . The information a and b are used as preconditions when the processing apparatus 2 starts unloading the wafer unit 9 from the cassette 30, for example.

次に、作業者は、モニター４を介して制御部８にカバー部１６を保護位置へ上昇させる旨の指示を送る。制御部８は、例えば、情報ａ及びｂを受信していることを条件として、昇降機構１８の動きを制御し、カバー部１６を保護位置へ上昇させる（図１参照）。 Next, the operator sends an instruction to the control section 8 via the monitor 4 to raise the cover section 16 to the protective position. For example, on the condition that the information a and b are received, the control section 8 controls the movement of the lifting mechanism 18 to raise the cover section 16 to the protection position (see FIG. 1).

カバー部１６が保護位置に到達した後、制御部８は、移動ユニットの動きを制御して、開位置までドア部２８を下降させる（図４参照）。ドア部２８を開位置に移動させた後、カセット３０内のウェーハユニット９の高さ位置を搬送アーム６の高さ位置に合わせるために、制御部８は、昇降ユニットの動きを制御して載置台１４の高さ位置を調節する。 After the cover part 16 reaches the protective position, the control part 8 controls the movement of the moving unit to lower the door part 28 to the open position (see FIG. 4). After the door section 28 is moved to the open position, the control section 8 controls the movement of the lifting unit to match the height position of the wafer unit 9 in the cassette 30 with the height position of the transfer arm 6. The height position of the stand 14 is adjusted.

そして、制御部８が搬送アーム６の動きを制御することにより、搬送アーム６は、ウェーハユニット９をカセット３０から加工装置２内に搬出する。その後、加工装置２内で、ウェーハ１は加工される。図４は、搬送作業中の様子を示す斜視図である。 The control unit 8 controls the movement of the transfer arm 6 so that the transfer arm 6 unloads the wafer unit 9 from the cassette 30 into the processing apparatus 2 . After that, the wafer 1 is processed within the processing apparatus 2 . FIG. 4 is a perspective view showing a state during transportation work.

本実施形態では、ウェーハユニット９の搬送中及びウェーハ１の加工中に、カバー部１６がカセット３０の第１側面部３２ａ、第２側面部３２ｂ及び係止部側３２ｆ（即ち、搬出入部側３２ｇ以外のカセット３０の外周側面）を囲む。 In the present embodiment, the cover portion 16 is positioned on the first side portion 32a, the second side portion 32b , and the locking portion side 32f (that is, the loading/unloading portion side) of the cassette 30 while the wafer unit 9 is being transported and the wafers 1 are being processed. 32g of the cassette 30).

これにより、ウェーハユニット９の搬送中及びウェーハ１の加工中に、作業者が誤ってカセット３０及びウェーハユニット９に接触することを防止できる。それゆえ、搬送や加工が中断されることを防ぐことができる。 This prevents the operator from accidentally contacting the cassette 30 and the wafer unit 9 while the wafer unit 9 is being transported and the wafers 1 are being processed. Therefore, interruption of transportation and processing can be prevented.

また、本実施形態のカセット３０では、ＦＯＵＰ型のカセットと異なり、収容されるウェーハユニット９が外部環境に曝される。それゆえ、搬出入部側３２ｇ以外のカセット３０の外周側面がカバー部１６で囲まれていない場合には、作業者が誤ってウェーハユニット９に接触し作業者が手を怪我したり、ウェーハ１が動かされる恐れがある。 Further, in the cassette 30 of the present embodiment, unlike the FOUP-type cassette, the wafer units 9 housed therein are exposed to the external environment. Therefore, if the outer peripheral side surface of the cassette 30 other than the loading/unloading portion side 32g is not surrounded by the cover portion 16, the operator may accidentally touch the wafer unit 9 and injure the operator's hand, or the wafer 1 may be damaged. It is likely to be moved.

しかしながら、本実施形態では、カバー部１６により、搬出入部側３２ｇ以外のカセット３０の外周側面が囲まれるので、作業者が誤ってウェーハ１に接触し、作業者が手を怪我したり、ウェーハ１が動かされることを防ぐことができる。 However, in the present embodiment, the cover portion 16 surrounds the outer peripheral side surface of the cassette 30 other than the loading/unloading portion side 32g. can be prevented from being moved.

加工終了後、各ウェーハ１は、搬送アーム６によりカセット３０に搬入される。全てのウェーハ１がカセット３０に搬入された後、制御部８は、ドア部２８を閉位置に移動させ、次いで、カバー部１６を退避位置まで下降させる。これにより、ウェーハ１の加工及び搬送作業を終了する。図５は、加工及び搬送作業終了後の様子を示す斜視図である。 After finishing the processing, each wafer 1 is carried into the cassette 30 by the carrier arm 6 . After all the wafers 1 have been loaded into the cassette 30, the control section 8 moves the door section 28 to the closed position and then lowers the cover section 16 to the retracted position. Thus, the processing and transfer of the wafer 1 are completed. FIG. 5 is a perspective view showing a state after processing and transportation work are completed.

次に、図６を用いて、カバー部１６及びドア部２８等の動作手順の詳細を説明する。作業者は、カバー部１６が退避位置にあり、ドア部２８が閉位置にあるときに、カセット３０を載置台１４上に載置する（段階Ｓ１０）。図６（Ａ）は、カセット３０を載置台１４に載置する段階Ｓ１０を示す図である。 Next, with reference to FIG. 6, details of operation procedures of the cover portion 16, the door portion 28, etc. will be described. The operator places the cassette 30 on the platform 14 when the cover portion 16 is at the retracted position and the door portion 28 is at the closed position (step S10). FIG. 6A is a diagram showing step S10 of placing the cassette 30 on the placing table 14. FIG.

Ｓ１０の後、上述の情報ａ及びｂが制御部８へ送られ、載置台１４上にカセット３０が存在し、カセット３０内にウェーハユニット９が存在することが制御部８で確認される。なお、制御部８は、情報ａ及びｂを受領した旨をモニター４に表示させ、作業者が、カセット３０及びウェーハユニット９の存在を確認してもよい。 After S10, the above information a and b are sent to the control section 8, and the control section 8 confirms that the cassette 30 is present on the mounting table 14 and the wafer unit 9 is present in the cassette 30. FIG. The controller 8 may cause the monitor 4 to display that the information a and b have been received, and the operator may confirm the presence of the cassette 30 and the wafer unit 9 .

その後、作業者がモニター４を介してカバー部１６を上昇させる旨の指示を制御部８へ送ると、制御部８は昇降機構１８の動きを制御してカバー部１６を上昇させる（Ｓ２０）。図６（Ｂ）は、カバー部１６を保護位置へ上昇させる段階Ｓ２０を示す図である。なお、図６（Ｂ）に示すカセット載置機構１０の状態は、図１に示すカセット載置機構１０の状態に対応する。 After that, when the operator sends an instruction to the control unit 8 via the monitor 4 to lift the cover part 16, the control part 8 controls the movement of the lifting mechanism 18 to lift the cover part 16 (S20). FIG. 6B is a diagram showing step S20 of raising the cover portion 16 to the protective position. The state of the cassette mounting mechanism 10 shown in FIG. 6B corresponds to the state of the cassette mounting mechanism 10 shown in FIG.

段階Ｓ２０において、カバー部１６が昇降機構１８により保護位置に上昇させられると、カバー部１６は、カセット３０の搬出入部側３２ｇ以外の外周側面を囲む。なお、このとき、ドア部２８の位置は、開口部２６ｃを閉じる閉位置に維持されている。 In step S20, when the cover part 16 is lifted to the protective position by the lifting mechanism 18, the cover part 16 surrounds the outer peripheral side surface of the cassette 30 other than the loading/unloading part side 32g. At this time, the position of the door portion 28 is maintained at the closed position that closes the opening portion 26c.

Ｓ２０の後、作業者は、モニター４を介して制御部８へ加工開始の指示を送る。制御部８は、加工開始の指示を受けると、カバー部１６が保護位置に上昇させられていることを条件として、ドア部２８を閉位置から開位置へ移動させる。その後、制御部８は、搬送アーム６の動きを制御してウェーハユニット９をカセット３０から加工装置２へ搬出させる（Ｓ３０）。 After S<b>20 , the operator sends an instruction to start machining to the control unit 8 via the monitor 4 . Upon receiving the instruction to start processing, the control section 8 moves the door section 28 from the closed position to the open position on condition that the cover section 16 is raised to the protective position. After that, the controller 8 controls the movement of the transfer arm 6 to unload the wafer unit 9 from the cassette 30 to the processing apparatus 2 (S30).

その後、加工装置２の内部において、ウェーハ１は加工される（Ｓ３０）。図６（Ｃ）は、ドア部２８を開位置に移動させた後、搬送及び加工作業を行う段階Ｓ３０を示す図である。なお、図６（Ｃ）に示すカセット載置機構１０の状態は、図４に示すカセット載置機構１０の状態に対応する。 After that, the wafer 1 is processed inside the processing apparatus 2 (S30). FIG. 6(C) is a diagram showing a step S30 of performing transportation and processing operations after moving the door section 28 to the open position. The state of the cassette mounting mechanism 10 shown in FIG. 6C corresponds to the state of the cassette mounting mechanism 10 shown in FIG.

ウェーハユニット９の加工が終了し、全てのウェーハユニット９がカセット３０へ搬入されると、Ｓ３０が終了する。Ｓ３０の後、制御部８は、移動ユニットの動きを制御して、ドア部２８を開位置から閉位置に移動させる（Ｓ４０）。図６（Ｄ）は、ドア部２８を閉位置に移動させる段階Ｓ４０を示す図である。 When the processing of the wafer units 9 is completed and all the wafer units 9 are carried into the cassette 30, S30 is completed. After S30, the control section 8 controls the movement of the moving unit to move the door section 28 from the open position to the closed position (S40). FIG. 6D shows step S40 of moving the door portion 28 to the closed position.

段階Ｓ４０の後、制御部８は、ドア部２８が開位置から閉位置に移動させられていることを条件として、昇降機構１８の動きを制御してカバー部１６を退避位置に下降させる（Ｓ５０）。これにより、作業者は、載置台１４にアクセスできるようになる。例えば、作業者は、加工済のウェーハユニット９が収容されたカセット３０を載置台１４から搬出する。 After step S40, the control section 8 controls the movement of the lifting mechanism 18 to lower the cover section 16 to the retracted position on condition that the door section 28 has been moved from the open position to the closed position (S50). ). This allows the operator to access the mounting table 14 . For example, the operator unloads the cassette 30 containing the processed wafer units 9 from the mounting table 14 .

図６（Ｅ）は、カバー部１６を退避位置へ下降させる段階（Ｓ５０）を示す図である。なお、図６（Ｅ）に示すカセット載置機構１０の状態は、図５に示すカセット載置機構１０の状態に対応する。 FIG. 6(E) is a diagram showing the step (S50) of lowering the cover portion 16 to the retracted position. The state of the cassette mounting mechanism 10 shown in FIG. 6E corresponds to the state of the cassette mounting mechanism 10 shown in FIG.

Ｓ５０の後、作業者は、未加工のウェーハ１が収容された新たなカセット３０を載置台１４へ載置してよい。作業者は、Ｓ５０の後、再びＳ１０に戻って、Ｓ２０、Ｓ３０及びＳ４０の各段階をこの順で繰り返してよい。 After S<b>50 , the operator may place a new cassette 30 containing unprocessed wafers 1 on the mounting table 14 . After S50, the operator may return to S10 and repeat steps S20, S30 and S40 in this order.

次に、第２実施形態について説明する。第２実施形態のカセット載置機構１０は、基台部１２の正面側の載置台１４よりも下方に開口部１２ａを有し、この開口部１２ａにおいてペダル（フットスイッチ部）１２ｂが外部に露出する態様で設けられている。例えば、ペダル１２ｂの少なくとも一部は、開口部１２ａから突出する態様で設けられている。図７は、第２実施形態に係る加工装置２及びカセット載置機構１０の斜視図である。 Next, a second embodiment will be described. The cassette mounting mechanism 10 of the second embodiment has an opening 12a below the mounting table 14 on the front side of the base 12, and a pedal (foot switch) 12b is exposed to the outside at the opening 12a. It is provided in a manner to For example, at least part of the pedal 12b is provided so as to protrude from the opening 12a. FIG. 7 is a perspective view of the processing device 2 and cassette mounting mechanism 10 according to the second embodiment.

作業者は、手でモニター４に触れることにより昇降機構１８を動作させることに加えて、又は、これに代えて、ペダル１２ｂを足で踏むことにより制御部８を介して昇降機構１８を動作させ、カバー部１６を保護位置と退避位置との間で昇降させることができる。 In addition to operating the lifting mechanism 18 by touching the monitor 4 with a hand, or instead of this, the operator operates the lifting mechanism 18 via the control unit 8 by stepping on the pedal 12b. , the cover portion 16 can be moved up and down between the protection position and the retracted position.

例えば、図６（Ａ）に示す様に、載置台１４上にカセット３０が存在する（即ち、制御部８が上述の情報ａを受信している）場合、作業者がペダル１２ｂを踏むと、制御部８は、昇降機構１８の動きを制御してカバー部１６を保護位置に上昇させる。これに対して、載置台１４上にカセット３０が存在しない場合、作業者がペダル１２ｂを踏んでも、制御部８は、カバー部１６を移動させない。 For example, as shown in FIG. 6A, when the cassette 30 is present on the mounting table 14 (that is, the control unit 8 has received the above information a), when the operator steps on the pedal 12b, The control unit 8 controls the movement of the lifting mechanism 18 to raise the cover unit 16 to the protection position. On the other hand, when the cassette 30 does not exist on the mounting table 14, the control section 8 does not move the cover section 16 even if the operator steps on the pedal 12b.

なお、ウェーハユニット９の搬送やウェーハ１の加工作業前であれば、カバー部１６を保護位置に上昇させた後に作業者がもう一度ペダル１２ｂを踏むと、制御部８は、カバー部１６を退避位置に下降させてもよい。 Before the wafer unit 9 is transported or the wafers 1 are processed, when the operator steps on the pedal 12b again after raising the cover 16 to the protective position, the controller 8 moves the cover 16 to the retracted position. can be lowered to

また、例えば、図６（Ｅ）に示す様に、搬送及び加工作業の終了後、作業者がペダル１２ｂを踏むと、制御部８は、昇降機構１８の動きを制御してカバー部１６を退避位置に下降させる。これに対して、搬送及び加工作業中である場合、作業者がペダル１２ｂを踏んでも、制御部８は、カバー部１６を移動させない。これにより、誤ったペダル１２ｂの操作により搬送や加工が中断されることを防ぐことができる。 Further, for example, as shown in FIG. 6(E), when the operator steps on the pedal 12b after the completion of the transportation and processing work, the control section 8 controls the movement of the lifting mechanism 18 to retract the cover section 16. lower into position. On the other hand, during the transportation and processing work, the control section 8 does not move the cover section 16 even if the operator steps on the pedal 12b. As a result, it is possible to prevent interruption of transportation or processing due to an erroneous operation of the pedal 12b.

このように、作業者は、ペダル１２ｂを足で踏むだけでカバー部１６を上昇又は下降させることができる。作業者がカセット載置機構１０の正面側に立っており、モニター４まで手が届かない場合や、作業者の手がふさがっている場合に、作業者は、足を用いてカバー部１６を昇降させることができるので、作業効率が向上する。 Thus, the operator can raise or lower the cover portion 16 simply by stepping on the pedal 12b. When the operator stands on the front side of the cassette placing mechanism 10 and cannot reach the monitor 4 or when the operator's hands are occupied, the operator raises and lowers the cover part 16 with his feet. work efficiency is improved.

次に、第３実施形態について説明する。第３実施形態のカセット載置機構１０は、ペダル１２ｂに代えて、発光素子４０及び受光素子４２を有するフットスイッチ部を備える。係る点において、第２実施形態と異なる。図８は、第３実施形態に係るフットスイッチ部の斜視図である。 Next, a third embodiment will be described. The cassette mounting mechanism 10 of the third embodiment includes a foot switch section having a light emitting element 40 and a light receiving element 42 instead of the pedal 12b. This point differs from the second embodiment. FIG. 8 is a perspective view of a foot switch section according to the third embodiment.

発光素子４０及び受光素子４２は、開口部１２ａよりも基台部１２の内側に配置されている。受光素子４２は、基台部１２の一側面の内側に配置されている。これに対して、発光素子４０は、受光素子４２から対向する様に、基台部１２の内部に配置されている。発光素子４０の発光面と受光素子４２の受光面とは、開口部１２ａから基台部１２の内側へ続く空間を挟むように、開口部１２ａの横幅の長さよりも離れて配置されている。 The light emitting element 40 and the light receiving element 42 are arranged inside the base portion 12 from the opening portion 12a. The light receiving element 42 is arranged inside one side surface of the base portion 12 . On the other hand, the light emitting element 40 is arranged inside the base portion 12 so as to face the light receiving element 42 . The light-emitting surface of the light-emitting element 40 and the light-receiving surface of the light-receiving element 42 are arranged at a distance greater than the width of the opening 12a so as to sandwich a space extending from the opening 12a to the inside of the base 12. As shown in FIG.

発光素子４０の発光面には、レンズ等の光学系（不図示）が設けられており、発光素子４０は、この光学系を通じて赤外線や近赤外線の光Ｌを受光素子４２の受光面に向けて照射する。これにより、開口部１２ａよりも基台部１２の内側には、光Ｌから成る検出ラインが形成される。 An optical system (not shown) such as a lens is provided on the light emitting surface of the light emitting element 40, and the light emitting element 40 directs infrared or near infrared light L toward the light receiving surface of the light receiving element 42 through this optical system. Irradiate. As a result, a detection line composed of the light L is formed inside the base portion 12 with respect to the opening portion 12a.

例えば、作業者が足を開口部１２ａに入れることにより、光Ｌは一時的に遮られる。この場合に、受光素子４２は、制御部８に昇降機構１８を動作させる所定の信号を送る。制御部８は、この所定の信号に基づいて昇降機構１８を動作させ、カバー部１６を保護位置と退避位置との間で昇降させる。 For example, the light L is temporarily blocked by putting the operator's foot into the opening 12a. In this case, the light-receiving element 42 sends a predetermined signal for operating the lifting mechanism 18 to the controller 8 . Based on this predetermined signal, the controller 8 operates the lifting mechanism 18 to lift the cover 16 between the protection position and the retracted position.

第３実施形態においても、作業者は、手でモニター４に触れることにより昇降機構１８を動作させることに加えて、又は、これに代えて、足で光Ｌを遮ることにより昇降機構１８を動作させ、カバー部１６を保護位置と退避位置との間で昇降させることができる。 Also in the third embodiment, in addition to operating the lifting mechanism 18 by touching the monitor 4 with a hand, or instead of this, the worker operates the lifting mechanism 18 by blocking the light L with his foot. , and the cover portion 16 can be moved up and down between the protection position and the retracted position.

それゆえ、作業者は、開口部１２ａに足を入れるだけでカバー部１６を上昇又は下降させることができる。作業者がカセット載置機構１０の正面側に立っており、モニター４まで手が届かない場合や、作業者の手がふさがっている場合に、作業者は、足を用いてカバー部１６を昇降させることができるので、作業効率が向上する。 Therefore, the operator can raise or lower the cover portion 16 simply by putting his or her foot into the opening 12a. When the operator stands on the front side of the cassette placing mechanism 10 and cannot reach the monitor 4 or when the operator's hands are occupied, the operator raises and lowers the cover part 16 with his feet. work efficiency is improved.

なお、図８に示す発光素子４０及び受光素子４２は、いわゆる透過検出方式のセンサー部を構成しているが、いわゆる反射検出方式のセンサー部を構成してもよい。例えば、発光素子４０の発光面と受光素子４２の受光面とは、基台部１２の一側面の内側に対向する様に、基台部１２の内部に並んで配置される。 Although the light-emitting element 40 and the light-receiving element 42 shown in FIG. 8 constitute a so-called transmission detection type sensor section, they may constitute a so-called reflection detection type sensor section. For example, the light-emitting surface of the light-emitting element 40 and the light-receiving surface of the light-receiving element 42 are arranged side by side inside the base portion 12 so as to face the inside of one side surface of the base portion 12 .

この場合、発光素子４０及び受光素子４２と基台部１２の一側面の内側とにより、開口部１２ａから基台部１２の内側へ続く空間が挟まれる。発光素子４０は、レンズ等の光学系（不図示）を通じて光Ｌを基台部１２の一側面の内側に発光し、受光素子４２は、基台部１２の一側面の内側からの反射光を受光する。つまり、基台部１２の一側面の内側は、リフレクタとして機能する。 In this case, the light-emitting element 40 and the light-receiving element 42 and the inside of one side surface of the base portion 12 sandwich a space extending from the opening portion 12 a to the inside of the base portion 12 . The light emitting element 40 emits light L toward the inside of one side surface of the base portion 12 through an optical system (not shown) such as a lens, and the light receiving element 42 receives reflected light from the inside of the one side surface of the base portion 12. receive light. That is, the inside of one side surface of the base portion 12 functions as a reflector.

作業者が足を開口部１２ａに入れることにより、光Ｌ及びその反射光は遮られるので、受光素子４２の受光光量は変化する。受光素子４２は、受光光量が所定量以上変化した場合に、制御部８に昇降機構１８を動作させる所定の信号を送る。制御部８は、この所定の信号に基づいて昇降機構１８を動作させ、カバー部１６を保護位置と退避位置との間で昇降させる。 When the operator puts his/her foot into the opening 12a, the light L and its reflected light are blocked, so the amount of light received by the light receiving element 42 changes. The light-receiving element 42 sends a predetermined signal for operating the lifting mechanism 18 to the control section 8 when the amount of received light changes by a predetermined amount or more. Based on this predetermined signal, the controller 8 operates the lifting mechanism 18 to lift the cover 16 between the protection position and the retracted position.

なお、光Ｌは、加工装置２がカセット運搬装置等の自動搬送装置（ＡＧＶ：Automatic Guided Vehicle）を認識するための認識センサーとして利用されてもよい。例えば、床面上を移動する自動搬送装置（不図示）は、その移動方向の前方において水平方向に突出する突起部を有している。 The light L may be used as a recognition sensor for the processing device 2 to recognize an automatic transport device (AGV: Automatic Guided Vehicle) such as a cassette transport device. For example, an automatic transport device (not shown) that moves on the floor surface has a protrusion that projects horizontally in front of its moving direction.

この場合、自動搬送装置がカセット載置機構１０の正面に来て、この突起部が開口部１２ａに入り、光Ｌが突起部によって遮られると、加工装置２は、自動搬送装置がカセット載置機構１０の正面にやってきたことを認識できる。その後、自動搬送装置からカセット３０が載置台１４上へ載置され（段階Ｓ１０）、次いで上述の段階Ｓ２０から段階Ｓ５０が順次行われる。 In this case, when the automatic transport device comes to the front of the cassette loading mechanism 10 and the projection enters the opening 12a, and the light L is blocked by the projection, the processing device 2 is operated so that the automatic transport device can load the cassette. It can be recognized that it has come in front of the mechanism 10 . After that, the cassette 30 is mounted on the mounting table 14 from the automatic transport device (step S10), and then the above-described steps S20 to S50 are sequentially performed.

その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。本実施形態の昇降機構１８は、いわゆるマグネット式のロッドレスシリンダ２２ａ、２２ｂであるが、ロッドレスシリンダ２２ａ、２２ｂは、スリット式等の他の構造であってもよい。 In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. The lifting mechanism 18 of the present embodiment is a so-called magnet-type rodless cylinder 22a, 22b, but the rodless cylinder 22a, 22b may have another structure such as a slit type.

また、例えば、上述のカバー部１６は、第１側面部１６ａ、第２側面部１６ｂ及び正面部１６ｃの三面で構成されているが、カバー部１６の昇降動作を阻害しない限り、カバー部１６の上部や正面部１６ｃとは反対側に位置する背面部等の一部にはカバー部材が設けられてもよい。 Further, for example, the cover portion 16 described above is composed of three surfaces, the first side portion 16a, the second side portion 16b, and the front portion 16c. A cover member may be provided on a part of the upper part, the rear part located on the side opposite to the front part 16c, or the like.

１ ウェーハ（被加工物）
２ 加工装置
２ａ 正面
３ テープ
４ モニター
５ 環状フレーム
６ 搬送アーム
８ 制御部
９ ウェーハユニット
１０ カセット載置機構
１２ 基台部
１２ａ 開口部
１２ｂ ペダル（フットスイッチ部）
１４ 載置台
１６ カバー部
１６ａ 第１側面部
１６ｂ 第２側面部
１６ｃ 正面部
１６ｄ 上端部
１８ 昇降機構
２０ ブラケット
２０ａ 第１直線部
２０ｂ 第２直線部
２０ｃ 第３直線部
２０ｄ 第１角部
２０ｅ 第２角部
２２ａ、２２ｂ ロッドレスシリンダ
２４ａ、２４ｂ ボディ部
２４ｃ、２４ｄ シリンダチューブ
２４ｅ、２４ｆ 基部
２４ｇ、２４ｈ スライダ
２４ｉ、２４ｊ ガイドレール
２６ フレーム部
２６ａ 正面
２６ｂ 背面
２６ｃ 開口部
２６ｄ キャスター
２８ ドア部
３０ カセット
３２ａ 第１側面部
３２ｂ 第２側面部
３２ｃ 接続部
３２ｄ 把手
３２ｅ 棚板
３２ｆ 係止部側
３２ｇ 搬出入部側
Ａ 領域
４０ 発光素子
４２ 受光素子 1 wafer (workpiece)
2 Processing Device 2a Front 3 Tape 4 Monitor 5 Annular Frame 6 Transfer Arm 8 Controller 9 Wafer Unit 10 Cassette Placement Mechanism 12 Base 12a Opening 12b Pedal (Foot Switch)
14 mounting table 16 cover portion 16a first side portion 16b second side portion 16c front portion 16d upper end portion 18 lifting mechanism 20 bracket 20a first straight portion 20b second straight portion 20c third straight portion 20d first corner 20e second second Corner portions 22a, 22b Rodless cylinders 24a, 24b Body portions 24c, 24d Cylinder tubes 24e, 24f Base portions 24g, 24h Sliders 24i, 24j Guide rails 26 Frame portion 26a Front surface 26b Rear surface 26c Opening portion 26d Caster 28 Door portion 30 Cassette 32a 1 side portion 32b 2nd side portion 32c connecting portion 32d handle 32e shelf plate 32f locking portion side 32g loading/unloading portion side A region 40 light emitting element 42 light receiving element

Claims (5)

板状の被加工物を加工する加工装置及び該加工装置に併設されるカセット載置機構であって、
該加工装置は、該カセット載置機構に電気的に接続された制御部を備え、
該カセット載置機構は、
該被加工物を収容するカセットが載置される載置台と、
該載置台の側方に配置され、該載置台に載置された該カセットから該被加工物を搬送するときに該被加工物を通過させる開口部を有するフレーム部と、
該フレーム部の該載置台とは反対側に設けられ、該開口部を閉じるドア部と、
該フレーム部の該載置台側に設けられ、該載置台に載置される該カセットの該フレーム部側の一部を除く側部を保護できるように構成されたカバー部と、
該カセットの該フレーム部側の該一部を除く該側部を保護する保護位置と、該保護位置よりも下方の退避位置との間で該カバー部を昇降させる昇降機構と、
該載置台の下方に設けられており、該昇降機構を動作させることができるフットスイッチ部と、
該載置台に該カセットが載置されている旨を示す所定の情報を該制御部へ送るセンサー部と、
を備え、
該カバー部は、互いに向かい合う様に配置された各々板状の第１側面部及び第２側面部と、該第１側面部及び該第２側面部における該フレーム部側とは反対側に位置する一端側を接続する板状の正面部と、を有し、該載置台の上方に位置する該カバー部の上部は、常に開放されており、
該制御部が該センサー部から該所定の情報を受信し、且つ、該カバー部を上昇させる旨の指示が該フットスイッチ部を介して該制御部へ送られた場合に、該制御部は、該カバー部を該退避位置から該保護位置へ移動させることを特徴とする加工装置及びカセット載置機構。 A processing device for processing a plate-shaped workpiece and a cassette mounting mechanism provided alongside the processing device ,
The processing apparatus includes a control unit electrically connected to the cassette mounting mechanism,
The cassette mounting mechanism is
a mounting table on which a cassette containing the workpiece is mounted;
a frame portion disposed on the side of the mounting table and having an opening through which the workpiece passes when the workpiece is transported from the cassette mounted on the mounting table;
a door portion provided on the opposite side of the frame portion from the mounting table and closing the opening;
a cover portion provided on the mounting table side of the frame portion and configured to protect a side portion of the cassette placed on the mounting table, excluding a portion of the cassette on the frame portion side;
an elevating mechanism for elevating the cover portion between a protection position protecting the side portion of the cassette excluding the portion on the frame portion side and a retracted position below the protection position;
a foot switch unit provided below the mounting table and capable of operating the lifting mechanism;
a sensor unit for sending predetermined information indicating that the cassette is mounted on the mounting table to the control unit;
with
The cover portion includes a plate-shaped first side portion and a plate-like second side portion arranged to face each other, and the first side portion and the second side portion located on the side opposite to the frame portion side. and a plate-like front portion connecting one end side, and the upper portion of the cover portion positioned above the mounting table is always open,
When the control unit receives the predetermined information from the sensor unit and an instruction to raise the cover unit is sent to the control unit via the foot switch unit, the control unit A processing apparatus and a cassette mounting mechanism , wherein the cover portion is moved from the retracted position to the protective position . 該カセット載置機構は、
該カバー部が該保護位置に上昇させられたことを条件として、該ドア部が該開口部を閉じる閉位置から該開口部を開く開位置へ移動させられ、且つ、
該ドア部が該開位置から該閉位置に移動させられたことを条件として、該カバー部が該退避位置に下降させられるように構成されていることを特徴とする請求項１に記載の加工装置及びカセット載置機構。 The cassette mounting mechanism is
The door portion is moved from a closed position that closes the opening to an open position that opens the opening, provided that the cover portion has been raised to the protective position, and
2. The processing according to claim 1, wherein the cover portion is lowered to the retracted position on condition that the door portion is moved from the open position to the closed position. Device and cassette loading mechanism. 該被加工物の搬送中及び該被加工物の加工中に、該カバー部を上昇させる旨の指示が該フットスイッチ部を介して該制御部へ送られた場合、該制御部は、該カバー部を該保護位置から該退避位置へ移動させないことを特徴とする請求項１又は２に記載の加工装置及びカセット載置機構。When an instruction to raise the cover portion is sent to the control portion via the foot switch portion while the work piece is being transported and the work piece is being processed, the control portion 3. The processing apparatus and the cassette mounting mechanism according to claim 1, wherein the portion is not moved from the protective position to the retracted position. 該フットスイッチ部は、発光素子及び受光素子を有する透過検出方式又は反射検出方式の他のセンサー部を含むことを特徴とする請求項１から３のいずれかに記載の加工装置及びカセット載置機構。 4. The processing apparatus and the cassette mounting mechanism according to claim 1, wherein the foot switch section includes another sensor section of transmission detection type or reflection detection type having a light-emitting element and a light-receiving element. . 該加工装置は、該被加工物にレーザービームを照射するレーザー加工装置、該被加工物を切削する切削装置、該被加工物を研削する研削装置、又は、該被加工物を研磨する研磨装置であることを特徴とする請求項１から４のいずれかに記載の加工装置及びカセット載置機構。The processing apparatus includes a laser processing apparatus for irradiating the workpiece with a laser beam, a cutting apparatus for cutting the workpiece, a grinding apparatus for grinding the workpiece, or a polishing apparatus for polishing the workpiece. 5. The processing apparatus and cassette mounting mechanism according to any one of claims 1 to 4, characterized in that:
JP2018209753A 2018-11-07 2018-11-07 Processing device and cassette mounting mechanism Active JP7330606B2 (en)

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CN201911059612.7A CN111162033A (en) 2018-11-07 2019-11-01 Box carrying mechanism
TW108140132A TWI827722B (en) 2018-11-07 2019-11-05 Processing device and cassette loading mechanism

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