TW202018853A - Cassette placing mechanism capable of preventing an operator from accidentally contacting a cassette during the transportation of a wafer unit or processing a wafer - Google Patents

Cassette placing mechanism capable of preventing an operator from accidentally contacting a cassette during the transportation of a wafer unit or processing a wafer Download PDF

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TW202018853A
TW202018853A TW108140132A TW108140132A TW202018853A TW 202018853 A TW202018853 A TW 202018853A TW 108140132 A TW108140132 A TW 108140132A TW 108140132 A TW108140132 A TW 108140132A TW 202018853 A TW202018853 A TW 202018853A
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cassette
mounting table
wafer
cover
opening
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TW108140132A
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Chinese (zh)
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TWI827722B (en
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富樫謙
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An object of the present invention is to prevent an operator from accidentally contacting a cassette during the transportation of a wafer unit or processing a wafer. The solution of the present invention is to provide a cassette placing mechanism. The cassette placing mechanism is provided in parallel with a processing device for processing a plate-shaped workpiece, and includes a mounting table on which a cassette for accommodating the workpiece is mounted; a frame portion arranged on a side of the mounting table and having an opening portion for allowing the workpiece to pass through when the workpiece is transported from the cassette mounted on the mounting table; a door portion disposed on a side of the frame portion opposite to the mounting table for closing the opening portion; a cover portion disposed on the mounting table side of the frame portion and configured to protect a side portion of the cassette mounted on the mounting table except a portion of the frame portion side; and a lifting mechanism for raising and lowering the cover portion between a protection position and a retracted position. The protection position is a position for protecting the side portion of the cassette except the portion of the frame portion side. The retracted position is a position lower than the protection position.

Description

片匣載置機構Cartridge mounting mechanism

發明領域 本發明是有關於一種供容置晶圓等的片匣載置之片匣載置機構。Field of invention The invention relates to a magazine mounting mechanism for accommodating wafers.

發明背景 於正面側形成有IC(積體電路，integrated circuit)、LSI(大型積體電路，Large Scale Integration)等器件的矽晶圓等的被加工物，在例如將背面側磨削成預定的厚度之後，是藉由切割裝置等而被分割成一個個的器件晶片。Background of the invention On the front side, a processed object such as a silicon wafer on which devices such as IC (integrated circuit) and LSI (large scale integration) are formed is ground to a predetermined thickness, for example , Is divided into individual device wafers by a dicing device or the like.

通常，在使用磨削裝置或切割裝置等之加工裝置來加工晶圓之前，首先是形成晶圓單元。例如，在金屬製的環狀框架的開口部上配置晶圓，且將面積比環狀框架的開口部更大的圓形膠帶貼附到環狀框架與晶圓。藉此，可形成將晶圓、環狀框架及膠帶一體化而成之晶圓單元。Generally, before processing a wafer using a processing device such as a grinding device or a cutting device, a wafer unit is first formed. For example, a wafer is placed on the opening of a ring frame made of metal, and a circular tape having a larger area than the opening of the ring frame is attached to the ring frame and the wafer. Thereby, a wafer unit formed by integrating a wafer, a ring frame and an adhesive tape can be formed.

此晶圓單元是容置在可容置複數個晶圓單元的片匣內(參照例如專利文獻1)。藉由在片匣內容置複數個晶圓單元，即變得容易將複數個晶圓單元集合到一起來搬送。This wafer unit is accommodated in a cassette that can accommodate a plurality of wafer units (see, for example, Patent Document 1). By placing a plurality of wafer units in the cassette, it becomes easy to collect and transport the plurality of wafer units together.

於加工裝置設有用於載置此片匣的片匣載置機構。於將片匣載置於片匣載置機構後，是藉由設置於加工裝置內的搬送單元來將各晶圓單元從片匣搬出到加工裝置內。已在加工裝置內加工晶圓後，是將晶圓單元從加工裝置內搬入到片匣。像這樣，可藉由搬送單元而在片匣與加工裝置之間搬送各晶圓單元。 先前技術文獻 專利文獻The processing device is provided with a cassette mounting mechanism for mounting the cassette. After the cassette is placed in the cassette mounting mechanism, each wafer unit is carried out from the cassette to the processing device by the transfer unit provided in the processing device. After the wafer has been processed in the processing device, the wafer unit is carried into the cassette from the processing device. In this way, each wafer unit can be transported between the cassette and the processing apparatus by the transport unit. Prior technical literature Patent Literature

專利文獻1：日本專利特開2000-91411號公報Patent Document 1: Japanese Patent Laid-Open No. 2000-91411

發明概要 發明欲解決之課題 然而，在片匣及加工裝置之間搬送晶圓單元時、或在加工裝置內加工晶圓時，會有以下情況：因作業人員誤接觸到片匣而導致片匣移動。當片匣被移動時，通常會為了安全而停止加工裝置，並中斷晶圓單元的搬送或晶圓的加工等。Summary of the invention Problems to be solved by invention However, when the wafer unit is transferred between the cassette and the processing device, or when the wafer is processed in the processing device, there may be a case where the cassette moves due to an operator accidentally touching the cassette. When the cassette is moved, the processing device is usually stopped for safety, and the transfer of the wafer unit or the processing of the wafer is interrupted.

本發明是有鑒於所述的問題點而作成的發明，其目的在於防止在晶圓單元的搬送中或晶圓的加工中，作業人員誤接觸到片匣之情形。 用以解決課題之手段The present invention was made in view of the above-mentioned problems, and its purpose is to prevent the operator from accidentally touching the cassette during the transfer of the wafer unit or the processing of the wafer. Means to solve the problem

根據本發明之一態樣，可提供一種片匣載置機構，前述片匣載置機構是併設在加工板狀的被加工物的加工裝置上，並具備： 載置台，供容置該被加工物的片匣載置； 框架部，配置於該載置台的側邊，且具有從載置於該載置台的該片匣搬送該被加工物時使該被加工物通過的開口部； 門部，設置在該框架部之與該載置台為相反的相反側，且將該開口部關閉； 罩蓋部，設置在該框架部的該載置台側，且構成為可以保護載置於該載置台之該片匣的除了該框架部側的一部分以外的側部；及 升降機構，使該罩蓋部在保護位置與退避位置之間升降，前述保護位置是保護該片匣的除了該框架部側的該一部分以外的該側部的位置，前述退避位置是比該保護位置更下方的位置。According to one aspect of the present invention, it is possible to provide a magazine mounting mechanism, which is provided in parallel with a processing device for processing a plate-shaped object and includes: The loading table is used for placing the film cassette containing the processed object; The frame portion is arranged on the side of the mounting table, and has an opening for passing the processed object when the processed object is conveyed from the cassette placed on the mounting table; The door portion is provided on the opposite side of the frame portion from the mounting table, and closes the opening portion; The cover portion is provided on the mounting table side of the frame portion, and is configured to protect the side portion of the cassette mounted on the mounting table except for a portion of the frame portion side; and A lifting mechanism that raises and lowers the cover portion between a protection position and a retreat position, the protection position is a position that protects the side portion of the cassette except the frame portion side, and the retreat position is more than the protection position The position further below.

較佳的是，該片匣載置機構是構成為：以該罩蓋部已上升至該保護位置作為條件，來使該門部從關閉該開口部的關閉位置往打開該開口部的打開位置移動，且以該門部已從該打開位置移動至該關閉位置作為條件，來使該罩蓋部朝該退避位置下降。Preferably, the magazine mounting mechanism is configured to make the door portion from the closed position closing the opening to the open position opening the opening on the condition that the cover portion has been raised to the protection position Move, and on the condition that the door portion has moved from the open position to the closed position, the cover portion is lowered toward the retracted position.

又，較佳的是，該片匣載置機構更具備腳踏開關部，前述腳踏開關部是設置於該載置台的下方，且可以使該升降機構動作。 發明效果Furthermore, it is preferable that the cassette mounting mechanism further includes a foot switch portion, the foot switch portion is provided below the mounting table, and the lifting mechanism can be operated. Invention effect

本發明的一態樣之片匣載置機構具備罩蓋部，前述罩蓋部是構成為可以保護載置在載置台之片匣的除了框架部側的一部分以外的側部。藉此，當在片匣與加工裝置之間搬送被加工物時、或在加工裝置內加工被加工物時，可以防止作業人員誤接觸到片匣之情形。因此，可以防止加工裝置中的板狀的被加工物的加工或搬送被中斷之情形。The magazine mounting mechanism according to an aspect of the present invention includes a cover part configured to protect a side part of the magazine mounted on the mounting table except a part of the frame part side. Thereby, when the object to be processed is transferred between the cassette and the processing device, or when the object to be processed is processed in the processing device, it is possible to prevent the operator from accidentally touching the cassette. Therefore, it is possible to prevent the processing or transportation of the plate-shaped workpiece in the processing apparatus from being interrupted.

用以實施發明之形態 參照附加圖式，說明本發明的一個態樣之實施形態。圖1是第1實施形態之加工裝置2及片匣載置機構10的立體圖。加工裝置2是用於加工被加工物之裝置，可為例如對被加工物照射雷射光束之雷射加工裝置、切割被加工物之切割裝置、磨削被加工物之磨削裝置、或是研磨被加工物之研磨裝置。Forms for carrying out the invention With reference to the attached drawings, an embodiment of the present invention will be described. FIG. 1 is a perspective view of a processing device 2 and a cassette mounting mechanism 10 of the first embodiment. The processing device 2 is a device for processing a processed object, and may be, for example, a laser processing device that irradiates a processed object with a laser beam, a cutting device that cuts the processed object, a grinding device that grinds the processed object, or Grinding device for grinding workpieces.

加工裝置2具有以金屬等所形成的殼體，且在此殼體的正面2a配置有觸控面板式的監視器4。監視器4是兼作為作業人員對加工裝置2輸入指示的輸入裝置、及顯示被加工物的圖像、加工條件、加工結果等的顯示裝置。The processing device 2 has a casing formed of metal or the like, and a touch panel-type monitor 4 is arranged on the front surface 2a of the casing. The monitor 4 is an input device that also serves as an input instruction for the worker to the processing device 2 and a display device that displays an image of the object, processing conditions, processing results, and the like.

例如，作業人員可以藉由觸碰顯示於監視器4的按鈕等，而透過監視器4對加工裝置2設定加工條件。又，可在監視器4上顯示藉由設置於加工裝置2內之未圖示的拍攝裝置所拍攝到的被加工物的圖像等。For example, the operator can set the processing conditions for the processing device 2 through the monitor 4 by touching a button or the like displayed on the monitor 4. In addition, an image of the object to be processed captured by an imaging device (not shown) provided in the processing device 2 can be displayed on the monitor 4.

在加工裝置2的殼體之正面2a當中，於與監視器4不同的預定的位置上併設有片匣載置機構10。本實施形態之片匣載置機構10與加工裝置2為分開的個體，且為以附加的方式對加工裝置2安裝的構造物。On the front surface 2a of the casing of the processing device 2, a cassette mounting mechanism 10 is provided at a predetermined position different from the monitor 4. The cassette mounting mechanism 10 and the processing device 2 of this embodiment are separate bodies, and are structures attached to the processing device 2 in an additional manner.

片匣載置機構10具備基台部12，前述基台部12具有以不鏽鋼等金屬材料所形成之大致長方體形狀的殼體。基台部12的上部設有開口部，在此開口部的上方設置有供供片匣30載置的載置台14。The cassette mounting mechanism 10 includes a base portion 12 that has a substantially rectangular parallelepiped-shaped housing formed of a metal material such as stainless steel. An opening is provided in the upper portion of the base portion 12, and a mounting table 14 for mounting the cassette 30 is provided above the opening.

載置台14是以不鏽鋼等金屬材料所形成之矩形的板狀構件，且為大致水平地配置在基台部12的上部。載置台14具有比基台部12的開口部更小，且比片匣30的底面部更大的面積。The mounting table 14 is a rectangular plate-shaped member formed of a metal material such as stainless steel, and is arranged substantially horizontally on the upper portion of the base portion 12. The mounting table 14 has a smaller area than the opening of the base 12 and a larger area than the bottom surface of the cassette 30.

載置台14是受到可在高度方向(Z軸方向)上移動的升降單元(未圖示)所支撐。升降單元是位於基台部12之殼體的內側。升降單元可以使載置台14沿著高度方向移動，而調節載置台14的高度位置。The mounting table 14 is supported by a lifting unit (not shown) movable in the height direction (Z-axis direction). The lifting unit is located inside the housing of the base 12. The lifting unit can move the mounting table 14 in the height direction and adjust the height position of the mounting table 14.

於載置台14的上表面，是以從該上表面突出之態樣而設置有可上下移動之按壓銷(未圖示)，且在載置台14內部設置有檢測按壓銷的接觸的第1感測器部(未圖示)。A pressing pin (not shown) that can move up and down is provided on the upper surface of the mounting table 14 so as to protrude from the upper surface, and a first sense for detecting contact of the pressing pin is provided inside the mounting table 14 Measuring device (not shown).

當將片匣30載置於載置台14時，此按壓銷即被往下壓而接觸於設在載置台14內的第1感測器部，並將表示於載置台14載置有片匣30之意旨的預定的訊號從第1感測器部傳送到後述的控制部8。When the cassette 30 is placed on the mounting table 14, the pressing pin is pushed down to contact the first sensor portion provided in the mounting table 14, and the cassette is placed on the mounting table 14 A predetermined signal of 30 is transmitted from the first sensor unit to the control unit 8 described later.

又，於配置在載置台14的側邊的框架部26(詳細內容容後敘述)設置有具有發光元件及受光元件的第2感測器部(未圖示)，且此第2感測器部是檢測片匣30內是否存在晶圓單元9。In addition, a second sensor portion (not shown) having a light-emitting element and a light-receiving element is provided on the frame portion 26 (details will be described later) disposed on the side of the mounting table 14, and this second sensor The part detects whether the wafer unit 9 exists in the cassette 30.

在載置台14的上表面可載置以金屬或樹脂所形成之大致長方體狀的片匣30。片匣30是用於容置複數個被加工物的容置容器。本實施形態的片匣30具有板狀的一對側面部(亦即，第1側面部32a及第2側面部32b)。On the upper surface of the mounting table 14, a generally rectangular parallelepiped cassette 30 formed of metal or resin can be placed. The cassette 30 is a container for accommodating a plurality of workpieces. The cassette 30 of the present embodiment has a pair of side portions in a plate shape (that is, the first side portion 32a and the second side portion 32b).

第1側面部32a及第2側面部32b的各上部，是藉由棒狀的複數個連接部32c而相互連結。又，第1側面部32a及第2側面部32b的各下部也是同樣地藉由棒狀的複數個連接部32c而相互連結。The upper portions of the first side portion 32a and the second side portion 32b are connected to each other by a plurality of rod-shaped connecting portions 32c. In addition, the lower portions of the first side portion 32a and the second side portion 32b are similarly connected to each other by a plurality of rod-shaped connecting portions 32c.

再者，如圖1所示，雖然在第1側面部32a的上部設置有2個連接部32c，但連接部32c的數量並非限定為2個，亦可為1個或3個以上。又，連接部32c的形狀並非限定為棒狀，亦可為板狀。In addition, as shown in FIG. 1, although two connection portions 32c are provided on the upper portion of the first side surface portion 32a, the number of connection portions 32c is not limited to two, and may be one or more than three. In addition, the shape of the connection portion 32c is not limited to a rod shape, and may be a plate shape.

第1側面部32a及第2側面部32b的上部側中的複數個連接部32c是以把手32d來相互連結。藉由具有把手32d，作業人員可以搬運片匣30。The plurality of connecting portions 32c on the upper side of the first side portion 32a and the second side portion 32b are connected to each other by a handle 32d. With the handle 32d, the operator can carry the cassette 30.

第1側面部32a及第2側面部32b的每一個在相互相向的內側側面具有複數個架板32e。各架板32e是沿著片匣30的高度方向以預定的間隔設置有複數個。在本實施形態中，是藉由相互相向的架板32e當中位於相同高度位置的一對架板32e，來支撐1個晶圓單元9。Each of the first side surface portion 32a and the second side surface portion 32b has a plurality of shelf plates 32e on the inner side surfaces facing each other. Each shelf plate 32e is provided in plural at predetermined intervals along the height direction of the cassette 30. In this embodiment, one wafer unit 9 is supported by a pair of shelf plates 32e located at the same height among the shelf plates 32e facing each other.

晶圓單元9是藉由以下方式而形成：將晶圓(被加工物)1配置在金屬製的環狀框架5的開口部，且藉由具有比環狀框架5的開口部更大的面積之圓形的膠帶3來接著環狀框架5與晶圓1。The wafer unit 9 is formed by arranging the wafer (workpiece) 1 in the opening of the metal ring frame 5 and having a larger area than the opening of the ring frame 5 The circular tape 3 is used to connect the ring frame 5 and the wafer 1.

在本實施形態中，是藉由複數對架板32e，而將複數個晶圓單元9容置成於片匣30的高度方向上重疊。像這樣，複數對架板32e形成有容置複數個晶圓1的容置空間。再者，亦可藉由一對架板32e來直接支撐1個晶圓1，而非1個晶圓單元9。In the present embodiment, the plurality of wafer units 9 are accommodated so as to overlap in the height direction of the cassette 30 by the plurality of pairs of shelf plates 32e. In this way, the plurality of pairs of shelf plates 32e are formed with accommodating spaces for accommodating the plurality of wafers 1. Furthermore, instead of one wafer unit 9, one wafer 1 can be directly supported by a pair of shelf plates 32e.

於架板32e的一端側設置有卡止被加工物的卡止構造(未圖示)。在本實施形態中，是將架板32e的一端側稱為卡止部側32f，並將架板32e的另一端側(亦即，與卡止部側32f為相反的相反側)稱為搬出入部側32g。A locking structure (not shown) for locking the workpiece is provided on one end side of the shelf plate 32e. In this embodiment, the one end side of the shelf plate 32e is referred to as the locking portion side 32f, and the other end side of the shelf plate 32e (that is, the opposite side to the locking portion side 32f) is referred to as the carry-out 32g on the entrance side.

片匣30的卡止部側32f以及搬出入部側32g，是未設置有板狀的平面構件的開放區域。晶圓單元9是進行成通過片匣30的搬出入部側32g，而從片匣30往外部搬出，並從外部往片匣30搬入。The locking portion side 32f and the carrying-in/out portion side 32g of the cassette 30 are open areas where no plate-shaped planar member is provided. The wafer unit 9 is carried out through the carrying-in/out part side 32g of the cassette 30, and is carried out from the cassette 30 to the outside, and carried into the cassette 30 from the outside.

再者，片匣30並非限定於圖1所示之形狀。例如，亦可於片匣30的卡止部側32f、上部及下部設置板狀的平面構件，而僅將搬出入部側32g完全地開放。又，片匣30亦可是FOUP(前開式晶圓傳送盒，Front Opening Unified Pod)型的片匣。Furthermore, the cassette 30 is not limited to the shape shown in FIG. 1. For example, a plate-shaped planar member may be provided on the locking portion side 32f, upper and lower portions of the cassette 30, and only the carrying-in/out portion side 32g may be completely opened. In addition, the cassette 30 may be a FOUP (Front Opening Unified Pod) type cassette.

於基台部12的內側以及載置台14的側邊的外側設置有罩蓋部16。本實施形態的罩蓋部16是由3個大致矩形形狀的樹脂製的板構件所構成，且是構成為在載置台14載置有片匣30的情況下，可以保護片匣30的除了一部分(亦即搬出入部側32g)以外的側部(亦即，第1側面部32a、第2側面部32b以及卡止部側32f)。A cover part 16 is provided inside the base part 12 and outside the side of the mounting table 14. The cover portion 16 of the present embodiment is composed of three substantially rectangular resin plate members, and is configured to protect a part of the cassette 30 except for the cassette 30 when the cassette 30 is placed on the mounting table 14 Side portions other than (that is, the carrying-in/out portion side 32g) (that is, the first side portion 32a, the second side portion 32b, and the locking portion side 32f).

罩蓋部16具有相互相向的第1側面部16a及第2側面部16b、以及連接於第1側面部16a及第2側面部16b的一端側的正面部16c。第1側面部16a、第2側面部16b及正面部16c是高度方向(亦即Z軸方向)的長度相同，且各自的長度比片匣30之從下端部起到上端部的長度更長。The cover portion 16 has a first side portion 16a and a second side portion 16b facing each other, and a front portion 16c connected to one end side of the first side portion 16a and the second side portion 16b. The first side portion 16a, the second side portion 16b, and the front portion 16c have the same length in the height direction (that is, the Z-axis direction), and each length is longer than the length from the lower end to the upper end of the cassette 30.

第1側面部16a及第2側面部16b的內側面是相互平行，且正面部16c的內側面是與第1側面部16a及第2側面部16b的內側面正交。第1側面部16a以及第2側面部16b的另一端側、與罩蓋部16的上部及下部是完全地開放。The inner side surfaces of the first side portion 16a and the second side portion 16b are parallel to each other, and the inner side surface of the front portion 16c is orthogonal to the inner side surfaces of the first side portion 16a and the second side portion 16b. The other end sides of the first side portion 16a and the second side portion 16b are completely open to the upper and lower portions of the cover portion 16.

罩蓋部16是連接於升降機構18(參照圖2及圖3)，前述升降機構18是容置於基台部12之殼體的內側。罩蓋部16可藉由此升降機構18而相對於載置於載置台14上的片匣30升降。在此，利用圖2及圖3來說明升降機構18。The cover portion 16 is connected to the elevating mechanism 18 (see FIGS. 2 and 3 ). The elevating mechanism 18 is housed inside the housing of the base portion 12. The cover portion 16 can be raised and lowered with respect to the cassette 30 mounted on the mounting table 14 by this lifting mechanism 18. Here, the lifting mechanism 18 will be described using FIGS. 2 and 3.

圖2是罩蓋部16及升降機構18的立體圖。升降機構18具有以金屬所形成的托架20。托架20是連接於罩蓋部16的下部，而與罩蓋部16一體化。2 is a perspective view of the cover portion 16 and the elevating mechanism 18. The lifting mechanism 18 has a bracket 20 formed of metal. The bracket 20 is connected to the lower portion of the cover portion 16 and is integrated with the cover portion 16.

托架20是以連接於罩蓋部16的第1側面部16a之下部的第1直線部20a、連接於第2側面部16b之下部的第2直線部20b、及連接於正面部16c之下部的第3直線部20c所構成。The bracket 20 is a first linear portion 20a connected to the lower portion of the first side portion 16a of the cover portion 16, a second linear portion 20b connected to the lower portion of the second side portion 16b, and a lower portion connected to the front portion 16c Constituted by the third straight portion 20c.

第1直線部20a及第3直線部20c構成有第1角部20d，第2直線部20b及第3直線部20c構成有第2角部20e。在第1角部20d的附近設置有第1線性導引部，且在第2角部20e設置有第2線性導引部。The first linear portion 20a and the third linear portion 20c constitute a first corner portion 20d, and the second linear portion 20b and the third linear portion 20c constitute a second corner portion 20e. A first linear guide is provided near the first corner 20d, and a second linear guide is provided at the second corner 20e.

第1線性導引部是由大致長方體狀之金屬製的滑件24g、及細長之板狀的金屬製的導軌24i所形成，第2線性導引部也是同樣地由大致長方體狀之金屬製的滑件24h、及細長之板狀的金屬製的導軌24j所形成。The first linear guide portion is formed by a substantially rectangular parallelepiped metal slider 24g and an elongated plate-shaped metal guide rail 24i, and the second linear guide portion is similarly made of substantially rectangular parallelepiped metal The slider 24h and the elongated metal guide rail 24j are formed.

導軌24i及24j是配置於托架20的外側，且導軌24i及24j的側面是大致平行於第1直線部20a及第2直線部20b的側面、與第1側面部16a及第2側面部16b。The guide rails 24i and 24j are arranged outside the bracket 20, and the side surfaces of the guide rails 24i and 24j are substantially parallel to the side surfaces of the first linear portion 20a and the second linear portion 20b, and the first side surface portion 16a and the second side surface portion 16b .

在導軌24i及24j上，是將滑件24g及24h的一邊的側部以可在上下方向上移動的方式連結。在滑件24g的上部連接有托架20的第1角部20d，在滑件24h的上部連接有托架20的第2角部20e。On the guide rails 24i and 24j, the side portions of one side of the sliders 24g and 24h are movably connected in the vertical direction. The first corner 20d of the bracket 20 is connected to the upper portion of the slider 24g, and the second corner 20e of the bracket 20 is connected to the upper portion of the slider 24h.

在相對於第1直線部20a而比第1線性導引部更內側，設置有無桿氣缸(rodless cylinder)22a，且在相對於第2直線部20b而比第2線性導引部更內側設置有另1個無桿氣缸22b。無桿氣缸22a及22b具有以金屬所形成之長方體形狀的主體部24a及24b。A rodless cylinder 22a is provided inside the first linear portion 20a relative to the first linear guide portion, and inside the second linear portion 20b relative to the second linear portion 20b Another rodless cylinder 22b. The rodless cylinders 22a and 22b have rectangular parallelepiped body portions 24a and 24b formed of metal.

位於與滑件24g的一邊的側部為相反的相反側之滑件24g的另一側部，是固定在無桿氣缸22a的主體部24a。同樣地，滑件24h的另一側部是固定在無桿氣缸22b的主體部24b。像這樣，托架20是透過第1及第2線性導引部，而受到無桿氣缸22a及22b所支撐。The other side of the slider 24g located on the opposite side from the side of the slider 24g is fixed to the main body 24a of the rodless cylinder 22a. Similarly, the other side portion of the slider 24h is fixed to the main body portion 24b of the rodless cylinder 22b. In this way, the bracket 20 is supported by the rodless cylinders 22a and 22b through the first and second linear guides.

主體部24a及24b具有圓筒狀的貫通開口。在此貫通開口配置有圓筒狀的壓缸管24c及24d，前述壓缸管24c及24d是沿著導軌24i及24j的延伸方向而設置且以金屬形成。主體部24a及24b是構成為可沿著壓缸管24c及24d的高度方向移動。The main body portions 24a and 24b have cylindrical through openings. Cylindrical cylinder tubes 24c and 24d are arranged in the through opening, and the cylinder tubes 24c and 24d are provided along the extending direction of the guide rails 24i and 24j and formed of metal. The main body portions 24a and 24b are configured to be movable in the height direction of the cylinder tubes 24c and 24d.

在壓缸管24c及24d的內部設置有可在壓缸管24c及24d的長度方向上滑動的圓柱狀的活塞(未圖示)。在活塞設有磁鐵，且在主體部24a及24b是將磁鐵設置成包圍活塞。活塞的磁鐵與主體部24a及24b的磁鐵是相互磁性地耦合。Inside the cylinder tubes 24c and 24d, a cylindrical piston (not shown) slidable in the longitudinal direction of the cylinder tubes 24c and 24d is provided. The piston is provided with a magnet, and the body portions 24a and 24b are provided with a magnet to surround the piston. The magnet of the piston and the magnets of the main body portions 24a and 24b are magnetically coupled to each other.

在壓缸管24c及24d的底部設置有基部24e及24f，且在頂部設置有頭蓋(未圖示)。例如，當從基部24e及24f將空氣供給至壓缸管24c及24d的內部，且從頭蓋排出空氣時，會使活塞相對於壓缸管24c及24d而上升。Base portions 24e and 24f are provided at the bottom of the cylinder tubes 24c and 24d, and a head cover (not shown) is provided at the top. For example, when air is supplied into the cylinder tubes 24c and 24d from the bases 24e and 24f and air is discharged from the head cover, the piston is raised relative to the cylinder tubes 24c and 24d.

同樣地，當從基部24e及24f排出空氣，並從頭蓋將空氣供給至壓缸管24c及24d的內部時，會使活塞相對於壓缸管24c及24d而下降。像這樣，隨著活塞在壓缸管24c及24d的內部朝上下方向滑動，主體部24a及24b也朝上下方向滑動。Similarly, when air is discharged from the bases 24e and 24f and air is supplied from the head cover into the cylinder tubes 24c and 24d, the piston is lowered relative to the cylinder tubes 24c and 24d. In this way, as the piston slides in the vertical direction inside the cylinder tubes 24c and 24d, the main body portions 24a and 24b also slide in the vertical direction.

如上述，由於主體部24a及24b是透過滑件24g及24h而固定在托架20，因此可以藉由使主體部24a及24b朝上下滑動，而透過托架20來使罩蓋部16上升或下降。圖3是將圖2之區域A放大的局部截面側視圖。As described above, since the body portions 24a and 24b are fixed to the bracket 20 through the sliders 24g and 24h, the cover portion 16 can be raised or moved through the bracket 20 by sliding the body portions 24a and 24b up and down decline. FIG. 3 is a partial cross-sectional side view enlarging area A of FIG. 2.

罩蓋部16是藉由升降機構18，而在保護片匣30的保護位置(參照圖1)、及退避到基台部12的內側的退避位置(參照圖5)之間移動(亦即，升降)。本實施形態中的保護位置是指罩蓋部16覆蓋已載置在載置台14之片匣30的第1側面部32a、第2側面部32b及卡止部側32f的位置。The cover portion 16 is moved between the protection position (refer to FIG. 1) for protecting the cassette 30 and the retracted position (refer to FIG. 5) retracted to the inside of the base portion 12 by the lifting mechanism 18 (that is, Lift). The protection position in this embodiment refers to a position where the cover portion 16 covers the first side portion 32a, the second side portion 32b, and the locking portion side 32f of the cassette 30 placed on the mounting table 14.

罩蓋部16位於保護位置時，罩蓋部16的各側部(亦即，第1側面部16a、第2側面部16b及正面部16c)的上端部16d，是位於比片匣30的頂面部更上方。藉此，罩蓋部16會保護片匣30的側邊。When the cover portion 16 is in the protection position, the upper end portion 16d of each side portion of the cover portion 16 (that is, the first side portion 16a, the second side portion 16b, and the front portion 16c) is located on the top of the cassette 30 Face up. As a result, the cover 16 protects the side of the cassette 30.

又，本實施形態中的退避位置，是位於比保護位置更下方，且是將罩蓋部16隱藏於基台部12的內側之位置。罩蓋部16位於退避位置時，罩蓋部16的各側部的上端部16d是位於與載置台14相同或比載置台14更低的位置。此時，由於罩蓋部16未保護片匣30，因此作業人員能夠容易地對片匣30進行存取。In addition, the retreat position in this embodiment is located below the protection position, and is a position where the cover portion 16 is hidden inside the base portion 12. When the cover portion 16 is in the retracted position, the upper end portions 16 d of the side portions of the cover portion 16 are located at the same position as or lower than the mounting table 14. At this time, since the cover portion 16 does not protect the cassette 30, the operator can easily access the cassette 30.

在此，返回到圖1。在相對於載置台14為正面部16c的相反側(亦即，載置台14的背面側的側邊)，並且在從第1側面部16a及第2側面部16b的另一端側起距離預定距離(例如數mm)的位置上，配置有框架部26。框架部26是以不鏽鋼等金屬材料所形成的板狀構件，且相對於地面大致垂直地豎立。Here, return to FIG. 1. On the side opposite to the front surface portion 16c with respect to the mounting table 14 (that is, the side of the back surface side of the mounting table 14), and at a predetermined distance from the other end sides of the first side surface portion 16a and the second side surface portion 16b The frame portion 26 is arranged at a position (for example, several mm). The frame portion 26 is a plate-shaped member formed of a metal material such as stainless steel, and stands substantially perpendicular to the ground.

在框架部26的大致上半部，設置有從框架部26的正面26a貫通到背面26b之大致矩形的開口部26c。開口部26c是長方體狀的貫通開口，且正面26a及背面26b中的開口部26c的大小，與片匣30的搬出入部側32g大致相同或比其更大。因此，開口部26c可以使晶圓單元9通過。A substantially rectangular opening 26c penetrating from the front surface 26a to the back surface 26b of the frame portion 26 is provided in the substantially upper half of the frame portion 26. The opening 26c is a rectangular parallelepiped through opening, and the size of the opening 26c in the front surface 26a and the back surface 26b is substantially the same as or larger than the 32g side of the cassette 30 in and out. Therefore, the opening 26c allows the wafer unit 9 to pass through.

於框架部26的大致上半部的背面26b側配置有大致矩形形狀，且具有比開口部26c的背面26b中的開口面積更大的面積的門部28。再者，門部28是片匣載置機構10的一部分。本實施形態之門部28是構成為藉由移動單元(未圖示)，而沿著框架部26的高度方向(亦即Z軸方向)滑動並移動。A door portion 28 having a larger area than the opening area in the back surface 26b of the opening 26c is arranged on the back surface 26b side of the substantially upper half of the frame portion 26. In addition, the door 28 is a part of the cassette mounting mechanism 10. The door portion 28 of this embodiment is configured to slide and move along the height direction of the frame portion 26 (that is, the Z-axis direction) by a moving unit (not shown).

本實施形態的門部28是可藉由移動單元而移動成例如位於將開口部26c的背面26b側完全關閉的關閉位置(亦即圖1所示之門部28的位置，亦即上方位置)、與將開口部26c的背面26b側完全打開的打開位置(亦即圖4所示之門部28的位置，亦即下方位置)。The door 28 of the present embodiment can be moved to a closed position where the back 26b side of the opening 26c is completely closed by the moving unit (that is, the position of the door 28 shown in FIG. 1, that is, the upper position) And an open position that completely opens the back surface 26b side of the opening 26c (that is, the position of the door 28 shown in FIG. 4, that is, the lower position).

在框架部26的大致下半部的區域(亦即比開口部26c更下方的區域)連結有上述之基台部12的背面側。又，於框架部26的下方設置有與地面相接的複數個腳輪26d。The back side of the base portion 12 described above is connected to a region of the substantially lower half of the frame portion 26 (that is, a region lower than the opening 26c). In addition, a plurality of casters 26d that are in contact with the ground are provided below the frame portion 26.

腳輪26d是設置在例如框架部26的寬度方向(圖1的Y軸方向)的兩端部。腳輪26d是為了要使片匣載置機構10從加工裝置2獨立並移動而使用。The casters 26d are provided at both ends of the frame portion 26 in the width direction (Y-axis direction in FIG. 1 ), for example. The caster 26d is used to move the cassette placement mechanism 10 independently from the processing device 2.

如圖1所示，本實施形態之片匣載置機構10是安裝於加工裝置2。特別地，將框架部26及門部28嵌入加工裝置2，以使框架部26的正面26a成為與加工裝置2之殼體的正面2a大致平行。As shown in FIG. 1, the cassette mounting mechanism 10 of this embodiment is attached to the processing device 2. In particular, the frame portion 26 and the door portion 28 are fitted into the processing device 2 so that the front surface 26a of the frame portion 26 becomes substantially parallel to the front surface 2a of the housing of the processing device 2.

在加工裝置2的內部之相向於開口部26c的位置上配置有搬送臂6。此搬送臂6具有大致U字形的手部，且在手部的一側之面上設置有吸附晶圓單元9的吸附墊等的吸附機構。The transport arm 6 is arranged at a position facing the opening 26c inside the processing device 2. The transfer arm 6 has a substantially U-shaped hand, and a suction mechanism such as a suction pad that suctions the wafer unit 9 is provided on one side of the hand.

搬送臂6是使手部移動到例如容置於片匣30的晶圓單元9的下方，並且以手部吸附晶圓單元9，來將晶圓單元9往配置於加工裝置2的內部之對位工作台(未圖示)等搬送。The transport arm 6 moves the hand below, for example, the wafer unit 9 accommodated in the cassette 30, and sucks the wafer unit 9 with the hand to arrange the wafer unit 9 inside the processing device 2 Transported by a workbench (not shown).

搬送臂6等的動作是由設置於加工裝置2內的控制部8所控制。控制部8是例如電腦，並具有透過主機/控制器而相互地連接的CPU、RAM、硬磁碟驅動機等。The operation of the transport arm 6 and the like is controlled by the control unit 8 provided in the processing device 2. The control unit 8 is, for example, a computer, and has a CPU, RAM, hard disk drive, and the like connected to each other through a host/controller.

CPU是依據保存於RAM、硬磁碟驅動機等之儲存部分的程式、資料等來進行運算處理等。控制部8可以藉由讀取CPU已保存於儲存部分的程式，而作為使軟體與上述之硬體資源協同合作之具體的組件來發揮功能。The CPU performs calculation processing based on the programs and data stored in the storage part of the RAM, hard disk drive, etc. The control unit 8 can function as a specific component that causes the software to cooperate with the aforementioned hardware resources by reading the program that the CPU has saved in the storage section.

控制部8除了搬送臂6以外，還電連接於監視器4。又，已將片匣載置機構10安裝到加工裝置2時，控制部8是與片匣載置機構10電連接。The control unit 8 is electrically connected to the monitor 4 in addition to the transport arm 6. In addition, when the cartridge mounting mechanism 10 has been mounted on the processing device 2, the control unit 8 is electrically connected to the cartridge mounting mechanism 10.

控制部8是透過監視器4接受來自作業人員的指示，而控制各部的動作。例如，控制部8會透過監視器4接受使罩蓋部16及門部28等移動之意旨的指示，並控制用以反映該指示的升降機構18及移動單元的動作。The control unit 8 receives the instruction from the operator through the monitor 4 and controls the operation of each unit. For example, the control unit 8 receives an instruction to move the cover 16, the door 28, and the like through the monitor 4, and controls the operation of the elevating mechanism 18 and the moving unit to reflect the instruction.

接著，使用圖1、圖4及圖5，來說明在加工裝置2加工晶圓1時的搬送臂6、罩蓋部16及門部28的動作。作業人員是在門部28位於關閉位置，且罩蓋部16位於退避位置時，將片匣30載置於載置台14。Next, the operations of the transfer arm 6, the cover portion 16 and the door portion 28 when the processing device 2 processes the wafer 1 will be described using FIGS. 1, 4 and 5. The operator places the cassette 30 on the mounting table 14 when the door 28 is in the closed position and the cover 16 is in the retracted position.

當將片匣30載置於載置台14時，即可按壓上述之按壓銷，而將表示載置台14上存在片匣30之情形的資訊a從載置台14的第1感測器部往控制部8傳送。When the cassette 30 is placed on the mounting table 14, the above-mentioned pressing pin can be pressed, and the information a indicating the presence of the cassette 30 on the mounting table 14 is controlled from the first sensor portion of the mounting table 14 Department 8 transmission.

又，上述之第2感測器部是在片匣30內存在晶圓單元9的情況下，將表示該意旨之資訊b往控制部8傳送。資訊a及b是被利用為例如加工裝置2開始進行晶圓單元9從片匣30的搬出時的前提條件。In addition, in the case where the wafer unit 9 exists in the cassette 30, the second sensor unit described above transmits the information b indicating the purpose to the control unit 8. The information a and b are used as a prerequisite when the processing device 2 starts carrying out the wafer unit 9 from the cassette 30, for example.

接著，作業人員是透過監視器4將使罩蓋部16往保護位置上升之意旨的指示傳送到控制部8。控制部8是以例如接收資訊a及b為條件來控制升降機構18的動作，而使罩蓋部16往保護位置上升(參照圖1)。Next, the operator transmits an instruction to raise the cover 16 to the protection position to the control unit 8 through the monitor 4. The control unit 8 controls the operation of the elevating mechanism 18 on the condition that the information a and b are received, for example, and raises the cover 16 to the protection position (see FIG. 1 ).

在罩蓋部16已到達保護位置後，控制部8會控制移動單元的動作，並使使門部28下降至打開位置(參照圖4)。在使門部28移動至打開位置後，為了讓片匣30內的晶圓單元9的高度位置對齊於搬送臂6的高度位置，控制部8會控制升降單元的動作來調節載置台14的高度位置。After the cover portion 16 has reached the protection position, the control portion 8 controls the movement of the moving unit and lowers the door portion 28 to the open position (see FIG. 4). After moving the door 28 to the open position, in order to align the height position of the wafer unit 9 in the cassette 30 with the height position of the transfer arm 6, the control unit 8 controls the movement of the lifting unit to adjust the height of the mounting table 14 position.

然後，搬送臂6是藉由控制部8控制搬送臂6的動作，而將晶圓單元9從片匣30搬出至加工裝置2內。之後，可在加工裝置2內加工晶圓1。圖4是顯示搬送作業中的情形的立體圖。Then, the transfer arm 6 controls the movement of the transfer arm 6 by the control unit 8 to transfer the wafer unit 9 from the cassette 30 into the processing device 2. After that, the wafer 1 can be processed in the processing device 2. FIG. 4 is a perspective view showing the situation during the transfer operation.

在本實施形態中，是在晶圓單元9的搬送中及晶圓1的加工中，讓罩蓋部16包圍片匣30的第1側面部32a、第2側面部32b及卡止部側32f(亦即搬出入部側32g以外的片匣30的外周側面)。In the present embodiment, the cover unit 16 surrounds the first side portion 32a, the second side portion 32b, and the locking portion side 32f of the cassette 30 during the transfer of the wafer unit 9 and the processing of the wafer 1 (That is, the outer peripheral side of the cassette 30 other than the 32 g of the carrying-in/out side).

藉此，能夠防止以下情形：在晶圓單元9的搬送中及晶圓1的加工中，作業人員誤接觸到片匣30及晶圓單元9。因此，可以防止搬送或加工被中斷之情形。With this, it is possible to prevent a situation in which the operator accidentally touches the cassette 30 and the wafer unit 9 during the transfer of the wafer unit 9 and the processing of the wafer 1. Therefore, it is possible to prevent the situation where the conveyance or processing is interrupted.

又，在本實施形態的片匣30中，是與FOUP型的片匣不同，所容置的晶圓單元9為暴露於外部環境。因此，在搬出入部側32g以外的片匣30的外周側面未被罩蓋部16所包圍的情況下，恐有以下疑慮：作業人員誤接觸到晶圓單元9且作業人員讓手受傷、或移動晶圓1。In addition, in the cassette 30 of the present embodiment, unlike the FOUP type cassette, the wafer unit 9 accommodated is exposed to the external environment. Therefore, when the outer peripheral side of the cassette 30 other than the carry-in/out part side 32g is not surrounded by the cover part 16, there is a possibility that the operator accidentally touches the wafer unit 9 and the operator injures his hand or moves the crystal Round 1.

然而，在本實施形態中，由於是藉由罩蓋部16包圍搬出入部側32g以外的片匣30的外周側面，因此可以防止以下情形：作業人員誤接觸到晶圓1，且作業人員讓手受傷、或移動晶圓1。However, in the present embodiment, since the outer peripheral side of the cassette 30 other than the carrying-in/out side 32g is surrounded by the cover portion 16, it is possible to prevent the following situation: the operator accidentally touches the wafer 1 and the operator gives the hand Was injured, or moved wafer 1.

加工結束後，是將各晶圓1藉由搬送臂6而搬入到片匣30。已將全部的晶圓1搬入片匣30後，控制部8是使門部28移動到關閉位置，接著，使罩蓋部16下降至退避位置。藉此，結束晶圓1的加工及搬送作業。圖5是顯示加工及搬送作業結束後之情形的立體圖。After the processing is completed, each wafer 1 is transferred into the cassette 30 by the transfer arm 6. After all the wafers 1 have been loaded into the cassette 30, the control unit 8 moves the door 28 to the closed position, and then lowers the cover 16 to the retracted position. With this, the processing and transfer operations of the wafer 1 are ended. FIG. 5 is a perspective view showing the state after the processing and the transfer operation are completed.

接著，使用圖6來說明罩蓋部16及門部28等的動作順序的詳細內容。作業人員是在罩蓋部16位於退避位置，且門部28位於關閉位置時，將片匣30載置到載置台14上(階段S10)。圖6(A)是顯示將片匣30載置在載置台14的階段S10的圖。Next, the details of the operation sequence of the cover portion 16 and the door portion 28 and the like will be described using FIG. 6. The operator places the cassette 30 on the mounting table 14 when the cover 16 is in the retracted position and the door 28 is in the closed position (stage S10). FIG. 6(A) is a diagram showing the stage S10 of placing the cassette 30 on the mounting table 14.

在S10之後，可將上述之資訊a及b往控制部8傳送，而以控制部8確認以下情形：在載置台14上存在片匣30，且在片匣30內存在晶圓單元9。再者，控制部8亦可將於資訊a及b中所接收到的意旨顯示在監視器4，來使作業人員確認片匣30及晶圓單元9的存在。After S10, the above information a and b can be transmitted to the control unit 8, and the control unit 8 can confirm the following situation: the cassette 30 exists on the mounting table 14, and the wafer unit 9 exists in the cassette 30. In addition, the control unit 8 may display the intention received in the information a and b on the monitor 4 to allow the operator to confirm the existence of the cassette 30 and the wafer unit 9.

之後，當作業人員透過監視器4將使罩蓋部16上升之意旨的指示傳送到控制部8時，控制部8即控制升降機構18的動作而使罩蓋部16上升(S20)。圖6(B)是顯示使罩蓋部16上升到保護位置的階段S20的圖。再者，圖6(B)所示之片匣載置機構10的狀態是對應於圖1所示之片匣載置機構10的狀態。Thereafter, when the operator transmits an instruction to raise the cover 16 to the control unit 8 through the monitor 4, the control unit 8 controls the operation of the lifting mechanism 18 to raise the cover 16 (S20). FIG. 6(B) is a diagram showing the stage S20 of raising the cover portion 16 to the protection position. In addition, the state of the cassette mounting mechanism 10 shown in FIG. 6(B) corresponds to the state of the cassette mounting mechanism 10 shown in FIG. 1.

在階段S20中，當罩蓋部16藉由升降機構18上升到保護位置時，罩蓋部16即包圍片匣30的搬出入部側32g以外的外周側面。再者，此時，門部28的位置是維持在關閉開口部26c的關閉位置。In step S20, when the cover portion 16 is raised to the protection position by the elevating mechanism 18, the cover portion 16 surrounds the outer peripheral side surface of the cassette 30 except for the carrying-in/out portion side 32g. Furthermore, at this time, the position of the door 28 is maintained at the closed position for closing the opening 26c.

在S20之後，作業人員是透過監視器4將加工開始的指示傳送到控制部8。控制部8在接收到加工開始的指示後，是以罩蓋部16已上升到保護位置之情形作為條件，來使門部28從關閉位置移動到打開位置。之後，控制部8是控制搬送臂6的動作，來使晶圓單元9從片匣30搬出到加工裝置2(S30)。After S20, the operator transmits the instruction to start the processing to the control unit 8 via the monitor 4. After receiving the instruction to start the processing, the control unit 8 moves the door 28 from the closed position to the open position on the condition that the cover 16 has been raised to the protection position. After that, the control unit 8 controls the operation of the transport arm 6 to transport the wafer unit 9 from the cassette 30 to the processing device 2 (S30).

之後，可在加工裝置2的內部加工晶圓1(S30)。圖6(C)是顯示使門部28移動至打開位置後，進行搬送及加工作業的階段S30的圖。再者，圖6(C)所示之片匣載置機構10的狀態是對應於圖4所示之片匣載置機構10的狀態。Thereafter, the wafer 1 can be processed inside the processing device 2 (S30). FIG. 6(C) is a diagram showing the stage S30 after the door 28 is moved to the open position, and the conveyance and processing operations are performed. In addition, the state of the cassette mounting mechanism 10 shown in FIG. 6(C) corresponds to the state of the cassette mounting mechanism 10 shown in FIG. 4.

當晶圓單元9的加工結束，且將全部的晶圓單元9搬入到片匣30時，S30即結束。S30之後，控制部8是控制移動單元的動作，而使門部28從打開位置移動至關閉位置(S40)。圖6(D)是顯示使門部28移動至關閉位置的階段S40的圖。When the processing of the wafer unit 9 is completed, and all the wafer units 9 are loaded into the cassette 30, S30 ends. After S30, the control unit 8 controls the operation of the moving unit to move the door 28 from the open position to the closed position (S40). FIG. 6(D) is a diagram showing the stage S40 in which the door 28 is moved to the closed position.

在階段S40之後，控制部8是以已將門部28從打開位置移動至關閉位置之情形作為條件，來控制升降機構18的動作而使罩蓋部16下降至退避位置(S50)。藉此，形成為作業人員可以對載置台14進行存取。例如，作業人員可將容置有加工完畢之晶圓單元9的片匣30從載置台14搬出。After stage S40, the control unit 8 controls the operation of the lifting mechanism 18 to lower the cover 16 to the retracted position on the condition that the door 28 has been moved from the open position to the closed position (S50). As a result, the operator can access the mounting table 14. For example, an operator may carry out the cassette 30 containing the processed wafer unit 9 from the mounting table 14.

圖6(E)是顯示使罩蓋部16下降到退避位置的階段(S50)的圖。再者，圖6(E)所示之片匣載置機構10的狀態是對應於圖5所示之片匣載置機構10的狀態。FIG. 6(E) is a diagram showing the stage (S50) in which the cover portion 16 is lowered to the retracted position. In addition, the state of the cassette mounting mechanism 10 shown in FIG. 6(E) corresponds to the state of the cassette mounting mechanism 10 shown in FIG. 5.

S50之後，作業人員亦可將容置有未加工之晶圓1的新的片匣30載置到載置台14。作業人員在S50之後，亦可再次返回到S10，且將S20、S30及S40的各階段依此順序來重複。After S50, the operator may also mount the new cassette 30 containing the unprocessed wafer 1 on the mounting table 14. After S50, the operator can also return to S10 again, and repeat the stages of S20, S30, and S40 in this order.

其次說明第2實施形態。第2實施形態之片匣載置機構10是以下述的態樣來設置：於基台部12的正面側之比載置台14更下方具有開口部12a，且在此開口部12a使踏板(腳踏開關部)12b露出於外部。例如，踏板12b的至少一部分是以從開口部12a突出的態樣來設置。圖7是第2實施形態之加工裝置2及片匣載置機構10的立體圖。Next, the second embodiment will be described. The cassette mounting mechanism 10 of the second embodiment is provided in such a manner that an opening 12a is provided below the mounting table 14 on the front side of the base 12 and the pedal 12 The step switch portion 12b is exposed to the outside. For example, at least a part of the pedal 12b is provided so as to protrude from the opening 12a. 7 is a perspective view of the processing device 2 and the cassette mounting mechanism 10 of the second embodiment.

作業人員除了藉由以手觸碰監視器4的方式來使升降機構18動作以外，還可以或取代於此，而藉由以腳來踩踏踏板12b的方式來透過控制部8使升降機構18動作，並使罩蓋部16在保護位置與退避位置之間升降。In addition to operating the lifting mechanism 18 by touching the monitor 4 with a hand, the operator may or may replace it, and the lifting mechanism 18 is operated by the control unit 8 by stepping on the pedal 12b with the foot , And lift the cover 16 between the protection position and the retreat position.

例如，如圖6(A)所示，在載置台14上存在片匣30(亦即，控制部8接收到上述之資訊a)的情況下，當作業人員踩踏踏板12b時，控制部8即控制升降機構18的動作而使罩蓋部16上升至保護位置。相對於此，在載置台14上不存在片匣30的情況下，即使作業人員踩踏踏板12b，控制部8仍然不會使罩蓋部16移動。For example, as shown in FIG. 6(A), when there is a cassette 30 on the mounting table 14 (that is, the control unit 8 receives the above-mentioned information a), when the operator depresses the pedal 12b, the control unit 8 The operation of the lifting mechanism 18 is controlled to raise the cover portion 16 to the protection position. In contrast, when the cassette 30 is not present on the mounting table 14, even if the worker steps on the pedal 12 b, the control unit 8 does not move the cover 16.

再者，若是在晶圓單元9的搬送或晶圓1的加工作業前，控制部8亦可在作業人員於使罩蓋部16上升到保護位置後再次踩踏踏板12b時，使罩蓋部16下降至退避位置。In addition, if the wafer unit 9 is transferred or the wafer 1 is processed, the control unit 8 may also cause the cover unit 16 to step on the cover unit 16 when the worker steps on the pedal 12b again after raising the cover unit 16 to the protection position. Descend to the retreat position.

又，例如，如圖6(E)所示，在搬送及加工作業的結束後，當作業人員踩踏踏板12b時，控制部8即控制升降機構18的動作而使罩蓋部16降下至退避位置。相對於此，在搬送及加工作業中的情況下，即使作業人員踩踏踏板12b，控制部8仍然不會使罩蓋部16移動。藉此，可以防止以下情形：因錯誤的踏板12b的操作而中斷搬送或加工。Also, for example, as shown in FIG. 6(E), when the worker steps on the pedal 12b after the completion of the conveyance and processing operations, the control unit 8 controls the operation of the lifting mechanism 18 to lower the cover 16 to the retracted position . In contrast, in the case of transportation and processing operations, even if the worker steps on the pedal 12b, the control unit 8 does not move the cover 16. With this, it is possible to prevent a situation in which the conveyance or processing is interrupted due to an erroneous operation of the pedal 12b.

如此，作業人員可以只用腳來踩踏踏板12b而使罩蓋部16上升或下降。由於在作業人員站立在片匣載置機構10的正面側，且為手無法構著監視器4的情況下、或作業人員的手正在忙碌未能空出的情況下，作業人員可以使用腳來使罩蓋部16升降，因此讓作業效率提升。In this way, the operator can step on the pedal 12b with only his feet to raise or lower the cover 16. When the operator is standing on the front side of the cassette mounting mechanism 10 and the monitor 4 cannot be constructed by the hand, or the operator's hand is busy and vacant, the operator can use the foot to Since the cover part 16 is raised and lowered, the work efficiency is improved.

其次說明第3實施形態。第3實施形態的片匣載置機構10，是具備具有發光元件40及受受光元件42的腳踏開關部來取代踏板12b。在所述之點上，與第2實施形態不同。圖8是第3實施形態之腳踏開關部的立體圖。Next, the third embodiment will be described. The cassette mounting mechanism 10 of the third embodiment is provided with a foot switch unit having a light-emitting element 40 and a light-receiving element 42 instead of the pedal 12b. This point is different from the second embodiment. Fig. 8 is a perspective view of a foot switch unit according to a third embodiment.

發光元件40及受光元件42是比開口部12a更配置在基台部12的內側。受光元件42是配置在基台部12的一側面的內側。相對於此，發光元件40是在基台部12的內部配置成與受光元件42相向。發光元件40的發光面與受光元件42的受光面是比開口部12a的橫寬的長度更相遠離而配置，以夾持從開口部12a延續到基台部12的內側的空間。The light-emitting element 40 and the light-receiving element 42 are arranged inside the base portion 12 more than the opening 12a. The light-receiving element 42 is arranged inside one side surface of the base portion 12. On the other hand, the light emitting element 40 is arranged inside the base portion 12 so as to face the light receiving element 42. The light-emitting surface of the light-emitting element 40 and the light-receiving surface of the light-receiving element 42 are arranged farther apart than the laterally wide length of the opening 12a so as to sandwich the space continuing from the opening 12a to the inside of the base portion 12.

於發光元件40的發光面設置有透鏡等光學系統(未圖示)，發光元件40是通過此光學系統來將紅外線或近紅外線之光L朝向受光元件42的受光面照射。藉此，可在基台部12之比開口部12a更內側形成由光L所構成的檢測線。An optical system (not shown) such as a lens is provided on the light-emitting surface of the light-emitting element 40. The light-emitting element 40 irradiates infrared light or near-infrared light L toward the light-receiving surface of the light-receiving element 42 through this optical system. With this, the detection line composed of the light L can be formed inside the base portion 12 more than the opening portion 12a.

例如，藉由作業人員將腳伸入開口部12a，光L即暫時被遮蔽。此時，受光元件42是將使升降機構18動作的預定的訊號傳送至控制部8。控制部8是依此預定的訊號來使升降機構18動作，而使罩蓋部16在保護位置與退避位置之間升降。For example, when the operator extends his foot into the opening 12a, the light L is temporarily blocked. At this time, the light-receiving element 42 transmits a predetermined signal for operating the elevating mechanism 18 to the control unit 8. The control unit 8 operates the elevating mechanism 18 according to the predetermined signal, and elevates the cover 16 between the protection position and the retreat position.

在第3實施形態中，也是作業人員除了藉由以手來觸碰監視器4的方式來使升降機構18動作以外，還可以或取代於此，而藉由以腳來遮蔽光L的方式來使升降機構18動作，並使罩蓋部16在保護位置與退避位置之間升降。In the third embodiment, in addition to the operation of the lifting mechanism 18 by touching the monitor 4 with the hand, the operator may or may replace it by blocking the light L with the foot. The lifting mechanism 18 is operated, and the cover portion 16 is raised and lowered between the protection position and the retracted position.

因此，作業人員只要將腳伸入開口部12a，就可以使罩蓋部16上升或下降。由於在作業人員站立在片匣載置機構10的正面側，且為手無法構著監視器4的情況下、或作業人員的手正在忙碌未能空出的情況下，作業人員可以使用腳來使罩蓋部16升降，因此讓作業效率提升。Therefore, the operator can raise or lower the cover portion 16 only by extending his foot into the opening 12a. When the operator is standing on the front side of the cassette mounting mechanism 10 and the monitor 4 cannot be constructed by the hand, or the operator's hand is busy and vacant, the operator can use the foot to Since the cover part 16 is raised and lowered, the work efficiency is improved.

再者，圖8所示之發光元件40及受光元件42雖然是構成所謂的透射檢測方式之感測器部，但是亦可構成所謂的反射檢測方式之感測器部。例如，可將發光元件40的發光面與受光元件42的受光面，以相向於基台部12的一側面的內側的方式於基台部12的內部並排配置。Furthermore, although the light-emitting element 40 and the light-receiving element 42 shown in FIG. 8 constitute a sensor portion of a so-called transmission detection method, they may also constitute a sensor portion of a so-called reflection detection method. For example, the light-emitting surface of the light-emitting element 40 and the light-receiving surface of the light-receiving element 42 may be arranged side by side inside the base portion 12 so as to face the inside of one side surface of the base portion 12.

此時，可藉由發光元件40以及受光元件42與基台部12的一側面的內側，來夾持從開口部12a延續到基台部12的內側的空間。發光元件40是通過透鏡等光學系統(未圖示)而讓光L朝基台部12的一側面的內側發光，且受光元件42是接收來自基台部12的一側面的內側的反射光。亦即，基台部12之一側面的內側是作為反射器而發揮功能。At this time, the space extending from the opening 12 a to the inside of the base 12 can be sandwiched by the light emitting element 40 and the light receiving element 42 and the inside of one side of the base 12. The light emitting element 40 emits light L toward the inside of one side of the base 12 through an optical system (not shown) such as a lens, and the light receiving element 42 receives reflected light from the inside of one side of the base 12. That is, the inner side of one side surface of the base portion 12 functions as a reflector.

由於可藉由作業人員將腳伸入開口部12a，而將光L及其反射光遮蔽，因此讓受光元件42的受光光量改變。受光元件42在受光光量已改變到預定量以上的情況下，是將使升降機構18動作的預定的訊號傳送到控制部8。控制部8會依此預定的訊號來使升降機構18動作，而使罩蓋部16在保護位置與退避位置之間升降。Since the operator can extend the foot into the opening 12a to shield the light L and its reflected light, the amount of light received by the light receiving element 42 is changed. The light receiving element 42 transmits a predetermined signal to the control unit 8 when the amount of received light has changed to a predetermined amount or more. The control unit 8 operates the lifting mechanism 18 according to the predetermined signal, and raises and lowers the cover portion 16 between the protection position and the retreat position.

再者，亦可將光L利用作為用於使加工裝置2辨識片匣搬運裝置等之自動搬送裝置(AGV(自動導引車輛)：Automatic Guided Vehicle)的辨識感測器。例如，在地面上移動的自動搬送裝置(未圖示)具有在其移動方向的前方朝水平方向突出的突起部。In addition, the light L can also be used as a recognition sensor for an automatic conveying device (AGV (Automatic Guided Vehicle): Automatic Guided Vehicle) for the processing device 2 to recognize a cassette conveying device or the like. For example, an automatic transfer device (not shown) that moves on the ground has a protrusion that protrudes horizontally in front of the moving direction.

在這種情況下，當自動搬送裝置來到片匣載置機構10的正面，且此突起部進入開口部12a，而藉由突起部遮蔽光L時，加工裝置2即可以辨識自動搬送裝置已來到片匣載置機構10的正面之情形。之後，可將片匣30從自動搬送裝置載置到載置台14上(階段S10)，並接著依序進行上述之階段S20到階段S50。In this case, when the automatic transport device comes to the front of the cassette mounting mechanism 10, and the protrusion enters the opening 12a, and the projection portion blocks the light L, the processing device 2 can recognize that the automatic transport device has Come to the front of the magazine mounting mechanism 10. Thereafter, the cassette 30 can be placed on the mounting table 14 from the automatic transfer device (stage S10), and then the above-mentioned stage S20 to stage S50 are sequentially performed.

另外，上述實施形態之構造、方法等，只要在不脫離本發明的目的之範圍下，均可適當變更而實施。本實施形態的升降機構18，雖然是所謂的磁鐵式的無桿氣缸22a、22b，但是無桿氣缸22a、22b亦可是狹縫式等的其他構造。In addition, the structure, method, etc. of the above-mentioned embodiment can be implemented with appropriate changes as long as they do not deviate from the scope of the object of the invention. Although the lifting mechanism 18 of this embodiment is a so-called magnet-type rodless cylinders 22a and 22b, the rodless cylinders 22a and 22b may have other structures such as a slit type.

又，例如，上述的罩蓋部16雖然是以第1側面部16a、第2側面部16b及正面部16c之三個面所構成，但只要不阻礙罩蓋部16的升降動作，亦可在罩蓋部16的上部或位於與正面部16c為相反的相反側的背面部等的一部分設置罩蓋構件。Also, for example, the above-mentioned cover portion 16 is composed of three surfaces of the first side portion 16a, the second side portion 16b, and the front portion 16c, but as long as it does not hinder the lifting and lowering operation of the cover portion 16, A cover member is provided on the upper part of the cover part 16 or a part of the back part located on the opposite side from the front part 16c.

1:晶圓(被加工物) 2:加工裝置 2a、26a:正面 3:膠帶 4:監視器 5:環狀框架 6:搬送臂 8:控制部 9:晶圓單元 10:片匣載置機構 12:基台部 12a:開口部 12b:踏板(腳踏開關部) 14:載置台 16:罩蓋部 16a:第1側面部 16b:第2側面部 16c:正面部 16d:上端部 18:升降機構 20:托架 20a:第1直線部 20b:第2直線部 20c:第3直線部 20d:第1角部 20e:第2角部 22a、22b:無桿氣缸 24a、24b:主體部 24c、24d:壓缸管 24e、24f:基部 24g、24h:滑件 24i、24j:導軌 26:框架部 26b:背面 26c:開口部 26d:腳輪 28:門部 30:片匣 32a:第1側面部 32b:第2側面部 32c:連接部 32d:把手 32e:架板 32f:卡止部側 32g:搬出入部側 40:發光元件 42:受光元件 A:區域 L:光 X、Y、Z:方向 S10、S20、S30、S40、S50:階段1: Wafer (workpiece) 2: processing device 2a, 26a: front 3: tape 4: monitor 5: ring frame 6: Transport arm 8: Control Department 9: Wafer unit 10: Cartridge placement mechanism 12: Abutment Department 12a: opening 12b: Pedal (foot switch part) 14: Mounting table 16: Cover part 16a: 1st side 16b: 2nd side 16c: Front 16d: upper end 18: Lifting mechanism 20: bracket 20a: the first straight line 20b: 2nd straight line 20c: 3rd straight line 20d: 1st corner 20e: 2nd corner 22a, 22b: rodless cylinder 24a, 24b: main body 24c, 24d: Cylinder tube 24e, 24f: base 24g, 24h: slider 24i, 24j: guide rail 26: Frame Department 26b: back 26c: opening 26d: Caster 28: Door 30: cassette 32a: 1st side 32b: 2nd side 32c: Connection 32d: handle 32e: shelf 32f: locking part side 32g: Moving in and out side 40: Light emitting element 42: light receiving element A: area L: light X, Y, Z: direction S10, S20, S30, S40, S50: Phase

圖1是第1實施形態之加工裝置及片匣載置機構的立體圖。 圖2是罩蓋部及移動機構的立體圖。 圖3是將圖2之區域A放大的局部截面側視圖。 圖4是顯示搬送作業中的情形的立體圖。 圖5是顯示加工及搬送作業結束後之情形的立體圖。 圖6(A)是顯示將片匣載置在載置台之階段S10的圖，圖6(B)是顯示使罩蓋部上升到保護位置之階段S20的圖，圖6(C)是顯示在使門部移動至打開位置後，進行搬送及加工作業之階段S30的圖，圖6(D)是顯示使門部移動至關閉位置之階段S40的圖，圖6(E)是顯示使罩蓋部下降到退避位置之階段S50的圖。 圖7是第2實施形態之加工裝置及片匣載置機構的立體圖。 圖8是第3實施形態之腳踏開關部的立體圖。FIG. 1 is a perspective view of a processing device and a cassette mounting mechanism according to the first embodiment. Fig. 2 is a perspective view of a cover portion and a moving mechanism. FIG. 3 is a partial cross-sectional side view enlarging area A of FIG. 2. FIG. 4 is a perspective view showing the situation during the transfer operation. FIG. 5 is a perspective view showing the state after the processing and the transfer operation are completed. 6(A) is a diagram showing the stage S10 when the cassette is placed on the mounting table, FIG. 6(B) is a diagram showing the stage S20 when the cover portion is raised to the protection position, and FIG. 6(C) is shown in After moving the door to the open position, a diagram of the stage S30 of carrying out the transport and processing operations, FIG. 6(D) is a diagram showing the stage S40 of moving the door to the closed position, and FIG. 6(E) is a diagram showing the cover A diagram of the stage S50 when the unit has descended to the retreat position. 7 is a perspective view of a processing device and a cassette mounting mechanism of a second embodiment. Fig. 8 is a perspective view of a foot switch unit according to a third embodiment.

1:晶圓(被加工物) 1: Wafer (workpiece)

2:加工裝置 2: processing device

2a、26a:正面 2a, 26a: front

3:膠帶 3: tape

4:監視器 4: monitor

5:環狀框架 5: ring frame

6:搬送臂 6: Transport arm

8:控制部 8: Control Department

9:晶圓單元 9: Wafer unit

10:片匣載置機構 10: Cartridge placement mechanism

12:基台部 12: Abutment Department

14:載置台 14: Mounting table

16:罩蓋部 16: Cover part

16a:第1側面部 16a: 1st side

16b:第2側面部 16b: 2nd side

16c:正面部 16c: Front

16d:上端部 16d: upper end

26:框架部 26: Frame Department

26b:背面 26b: back

26c:開口部 26c: opening

26d:腳輪 26d: Caster

28:門部 28: Door

30:片匣 30: cassette

32a:第1側面部 32a: 1st side

32b:第2側面部 32b: 2nd side

32c:連接部 32c: Connection

32d:把手 32d: handle

32e:架板 32e: shelf

32f:卡止部側 32f: locking part side

32g:搬出入部側 32g: Moving in and out side

X、Y、Z:方向 X, Y, Z: direction

Claims (3)

一種片匣載置機構，是併設在加工板狀的被加工物的加工裝置上，前述片匣載置機構的特徵在於具備： 載置台，供容置該被加工物的片匣載置； 框架部，配置於該載置台的側邊，且具有從載置於該載置台的該片匣搬送該被加工物時使該被加工物通過的開口部； 門部，設置在該框架部之與該載置台為相反的相反側，且將該開口部關閉； 罩蓋部，設置在該框架部的該載置台側，且構成為可以保護載置於該載置台之該片匣的除了該框架部側的一部分以外的側部；及 升降機構，使該罩蓋部在保護位置與退避位置之間升降，前述保護位置是保護該片匣的除了該框架部側的該一部分以外的該側部的位置，前述退避位置是比該保護位置更下方的位置。A cassette loading mechanism is provided in parallel with a processing device for processing a plate-shaped workpiece. The foregoing cassette loading mechanism is characterized by having: The loading table is used for placing the film cassette containing the processed object; The frame portion is arranged on the side of the mounting table, and has an opening for passing the processed object when the processed object is conveyed from the cassette placed on the mounting table; The door portion is provided on the opposite side of the frame portion from the mounting table, and closes the opening portion; The cover portion is provided on the mounting table side of the frame portion, and is configured to protect the side portion of the cassette mounted on the mounting table except for a portion of the frame portion side; and A lifting mechanism that raises and lowers the cover portion between a protection position and a retreat position, the protection position is a position that protects the side portion of the cassette except the frame portion side, and the retreat position is more than the protection position The position further below. 如請求項1之片匣載置機構，其中該片匣載置機構是構成為： 以該罩蓋部已上升至該保護位置作為條件，來使該門部從關閉該開口部的關閉位置往打開該開口部的打開位置移動， 且以該門部已從該打開位置移動至該關閉位置作為條件，來使該罩蓋部朝該退避位置下降。For example, the magazine placing mechanism of claim 1, wherein the magazine placing mechanism is constituted as follows: On the condition that the cover part has been raised to the protection position, the door is moved from the closed position closing the opening to the open position opening the opening, And on the condition that the door portion has moved from the open position to the closed position, the cover portion is lowered toward the retracted position. 如請求項1或2之片匣載置機構，其更具備腳踏開關部，前述腳踏開關部是設置於該載置台的下方，且可以使該升降機構動作。The magazine mounting mechanism according to claim 1 or 2 further includes a foot switch portion, and the foot switch portion is provided below the mounting table, and the lift mechanism can be operated.
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