JP7344655B2 - processing equipment - Google Patents

Description

The present invention relates to a processing device including a guide rail.

In various processing equipment, such as cutting equipment and laser processing equipment, in which the workpiece is fixed to an annular frame and transported, a cassette for multiple types of frame units is set in the equipment, and the frame units are pulled out onto the guide rails and transferred to the processing section. (for example, a chuck table, a cleaning section, etc.) (for example, see Patent Document 1). These various processing devices always recognize where the frame unit is currently located. For example, a frame unit pulled out from a cassette onto a guide rail is detected as being on the guide rail by a reflective photoelectric sensor installed on the support surface of the guide rail.

Japanese Patent Application Publication No. 11-204461

However, with conventional processing equipment, if the reflective photoelectric sensor installed on the support surface is contaminated by the frame unit sliding on the support surface, or if the frame unit has a long moving area, multiple reflective photoelectric sensors must be installed. There was an issue of not being able to do so.

The present invention has been made in view of such problems, and an object of the present invention is to provide a processing device that can prevent a sensor that detects a frame unit from being contaminated, and can also suppress the number of installed sensors. That's true.

In order to solve the above-mentioned problems and achieve the objects, the processing apparatus of the present invention includes a cassette mounter in which a cassette accommodating a plurality of frame units each having a workpiece fixed to it with an adhesive tape is placed in an opening of an annular frame. a placing section; a guide rail for temporarily placing the frame unit to be carried out or carried in from the cassette placed on the cassette placing section; a moving unit for moving the frame unit along the guide rail; and the frame. A processing device comprising a processing section that processes a unit, a transport unit that transports the frame unit between the guide rail and the processing section, and a position detection section that detects the position of the frame unit, The guide rail has a pair of support surfaces that extend in parallel and support the frame unit from below, and the position detection section has a light emitting section or a light receiving section and is disposed on the outside of the pair of guide rails. The transmission type photoelectric sensor is provided in a through hole that penetrates a positioning wall that is erected from an end on a side where the pair of guide rails are separated from each other on the support surface, and that transmits light. The sensor cover is made of a transparent material and faces the frame unit that slides on the support surface, so that the frame unit supported on the support surface blocks light from the light emitting section. The present invention is characterized in that it is detected that the frame unit is positioned on the guide rail.

In the processing device, the position detection section detects that the frame unit supported by the guide rail is positioned within a predetermined range, and the frame unit is positioned at one end of the predetermined range; The transmission type photoelectric sensor may be arranged at a position where the light is blocked by the frame unit located at the other end of the predetermined range.

Advantageous Effects of Invention The present invention has the advantage that it is possible to prevent a sensor that detects a frame unit from being contaminated, and it is also possible to suppress the number of sensors that are installed.

FIG. 1 is a perspective view showing a configuration example of a processing device according to a first embodiment. FIG. 2 is a cross-sectional view of the guide rail of the processing apparatus along line II-II in FIG. FIG. 3 is a perspective view showing a frame unit temporarily placed on the guide rail of the processing apparatus shown in FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Further, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A processing device according to Embodiment 1 of the present invention will be explained based on the drawings. FIG. 1 is a perspective view showing a configuration example of a processing device according to a first embodiment. FIG. 2 is a cross-sectional view of the guide rail of the processing apparatus along line II-II in FIG. FIG. 3 is a perspective view showing a frame unit temporarily placed on the guide rail of the processing apparatus shown in FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

The processing apparatus 1 shown in FIG. 1 according to the first embodiment is a cutting apparatus that cuts (corresponds to machining) a workpiece 201 of a frame unit 200. In the first embodiment, the workpiece 201 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer that uses silicon, sapphire, gallium, or the like as a base material. Devices 204 are formed on the workpiece 201 in areas partitioned in a grid pattern by a plurality of dividing lines 203 formed in a grid pattern on the surface 202 .

Further, the workpiece 201 of the present invention may be a so-called TAIKO (registered trademark) wafer having a thinner central portion and a thicker portion formed on the outer periphery. A rectangular package substrate having a plurality of nickel, a ceramic substrate, a ferrite substrate, a substrate containing at least one of nickel and iron, or the like may be used. In the first embodiment, the frame unit 200 has a back surface 205 on the back side of the front surface 202 of the workpiece 201 attached to an adhesive tape 207 having an annular frame 206 attached to the outer periphery, so that the frame unit 200 is adhered to the opening 208 of the annular frame 206. A workpiece 201 is fixed with tape 207.

The processing apparatus 1 shown in FIG. 1 is an apparatus that holds a workpiece 201 of a frame unit 200 on a chuck table 40 and cuts it along a planned dividing line 203 with a cutting blade 51. As shown in FIG. 1, the processing apparatus 1 includes a cassette elevator 10, which is a cassette mounting section on which a cassette 11 is placed, a guide rail 20, a movement unit 30, a chuck table 40, a cutting unit 50, It includes an imaging unit 60, a cleaning unit 70, a transport unit 80, and a control unit 100.

In addition, as shown in FIG. 1, the processing apparatus 1 also includes an unit, a Y-axis moving unit that is an indexing feed unit that relatively moves the chuck table 40 and the cutting unit 50 in the Y-axis direction parallel to the holding surface 41 and perpendicular to the X-axis direction, and the chuck table 40 and the cutting unit. 50 in a Z-axis direction perpendicular to the holding surface 41 and parallel to the vertical direction. As shown in FIG. 1, the processing device 1 is a so-called facing dual type cutting device that includes two cutting units 50, that is, a two-spindle dicer.

The cassette 11 is a container that is formed into a box shape and accommodates a plurality of frame units 200 at intervals in the Z-axis direction. The cassette 11 includes an opening 11-1 through which the frame unit 200 is inserted and removed. The opening 11-1 faces the guide rail 20. In the first embodiment, the cassette elevator 10 has a cassette 11 placed on its upper surface, and a motor (not shown) moves the cassette 11 up and down in the Z-axis direction.

The guide rail 20 temporarily stores the frame unit 200 carried out from the cassette 11 placed on the cassette elevator 10 or the frame unit 200 carried into the cassette 11. A pair of guide rails 20 are provided at intervals in the X-axis direction, each extending in a straight line parallel to the Y-axis direction, and arranged in parallel to each other. The pair of guide rails 20 are arranged at positions facing both ends of the opening 11-1 of the cassette 11 in the X-axis direction and in the Y-axis direction.

The pair of guide rails 20 are provided so as to be movable toward and away from each other in the X-axis direction by a moving mechanism (not shown). As shown in FIG. 2, each of the pair of guide rails 20 has a support surface 21 extending parallel to each other in the Y-axis direction, and a support surface 21 that stands up from the end of the support surface 21 on the side where the pair of guide rails 20 are separated from each other. It has a positioning wall 22 provided therein. Since each guide rail 20 includes a support surface 21, the processing apparatus 1 has a pair of support surfaces 21.

The annular frame 206 of the frame unit 200 that has been temporarily placed is placed on the support surface 21 and supports the annular frame 206 of the frame unit 200 from below. The positioning wall 22 extends linearly parallel to the Y-axis direction. When the pair of guide rails 20 supporting the frame unit 200 from below are brought close to each other, the positioning wall 22 contacts the outer edge of the annular frame 206 and positions the annular frame 206 in the X-axis direction.

The moving unit 30 carries out the frame unit 200 from the cassette 11 placed on the cassette elevator 10 and places it on the guide rail 20, and also carries the frame unit 200 placed on the guide rail 20 into the cassette 11. It is. Moreover, the moving unit 30 moves the frame unit 200 along the guide rail 20 when carrying it out from the cassette 11 and when carrying it into the cassette 11. The moving unit 30 includes a grip part 31 that grips the annular frame 206 of the frame unit 200 housed in the cassette 11.

The chuck table 40 is a processing section that suctions and holds (corresponds to processing) the workpiece 201 of the frame unit 200 transported from the guide rail 20 with a holding surface 41 . The chuck table 40 has a disk shape, and a holding surface 41 that holds the workpiece 201 is made of porous ceramic or the like. The chuck table 40 is moved in the X-axis direction by an X-axis moving unit across a processing area below the cutting unit 50 and a carry-in/out area where the frame unit 200 is carried in and out of the cassette 11 at a distance from below the cutting unit 50. It is provided movably and rotatably about an axis parallel to the Z-axis direction by a rotational drive source.

The chuck table 40 is connected to a vacuum suction source (not shown), and is suctioned by the vacuum suction source to suction and hold the workpiece 201 placed on the holding surface 41, thereby fixing the frame unit 200. In the first embodiment, the chuck table 40 suction-holds the back surface 205 side of the workpiece 201 via the adhesive tape 207 . Further, around the chuck table 40, as shown in FIG. 1, a plurality of clamp parts 42 for clamping the annular frame 206 are provided.

The cutting unit 50 cuts (corresponds to machining) the workpiece 201 held on the chuck table 40. The cutting units 50 are each provided to be movable in the Y-axis direction by a Y-axis movement unit with respect to the workpiece 201 held on the chuck table 40, and are movable in the Z-axis direction by a Z-axis movement unit 110. It is set freely.

As shown in FIG. 1, one cutting unit 50 is installed on one column 4 of a gate-shaped support frame 3 erected from the apparatus main body 2 via a Y-axis moving unit, a Z-axis moving unit 110, etc. It is being As shown in FIG. 1, the other cutting unit 50 is provided on the other column 4 of the support frame 3 via a Y-axis moving unit, a Z-axis moving unit 110, and the like. Note that, in the support frame 3, the upper ends of the column parts 4, 4 are connected to each other by a horizontal beam 5.

The cutting unit 50 can position the cutting blade 51 at any position on the holding surface 41 of the chuck table 40 by the Y-axis moving unit and the Z-axis moving unit 110. The cutting unit 50 includes a spindle housing 53 that is movably provided in the Y-axis direction and the Z-axis direction by a Y-axis movement unit and a Z-axis movement unit 110, and a motor that is provided in the spindle housing 53 so as to be rotatable around its axis. The cutting blade 51 is rotated by a spindle (not shown) and has a cutting blade 51 attached to its tip. The cutting blade 51 is an extremely thin cutting whetstone having a substantially ring shape.

The imaging unit 60 takes an image of the workpiece 201 held by the holding surface 41 of the chuck table 40. In the first embodiment, the imaging unit 60 is fixed to the cutting unit 50 so as to move integrally with the cutting unit 50. The imaging unit 60 includes an imaging element that images the region to be divided of the workpiece 201 held by the chuck table 40 before cutting. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The imaging unit 60 images the workpiece 201 held on the chuck table 40 to obtain an image for performing alignment for aligning the workpiece 201 and the cutting blade 51. Output to control unit 100.

The X-axis moving unit is for processing and feeding the chuck table 40 in the X-axis direction, which is the processing and feeding direction. The Y-axis moving unit indexes and feeds the cutting unit 50 in the Y-axis direction, which is the indexing and feeding direction. The Z-axis moving unit 110 feeds the cutting unit 50 in the Z-axis direction, which is the cutting feed direction.

The X-axis moving unit, the Y-axis moving unit, and the Z-axis moving unit 110 include a known ball screw rotatably provided around the axis, a known pulse motor that rotates the ball screw around the axis, and a chuck table 40. A well-known guide rail is provided that supports the cutting unit 50 so as to be movable in the X-axis direction, Y-axis direction, or Z-axis direction.

The processing apparatus 1 also includes an X-axis position detection unit (not shown) for detecting the position of the chuck table 40 in the X-axis direction, and a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 50 in the Y-axis direction. It includes a detection unit and a Z-axis direction position detection unit (not shown) for detecting the position of the cutting unit 50 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit are movable in the X-axis or Y-axis direction using a linear scale parallel to the X-axis or Y-axis direction, and an X-axis movement unit or a Y-axis movement unit. A reading head is provided on the linear scale and reads the scale of the linear scale. The X-axis direction position detection unit and the Y-axis direction position detection unit detect the position of the chuck table 40 in the X-axis direction or the position of the cutting unit 50 in the Y-axis direction from information indicating the scale of the linear scale read by the reading head. The information is output to the control unit 100 as information indicating. The Z-axis position detection unit detects the position of the cutting unit 50 in the Z-axis direction using the number of pulses of a pulse motor that rotates the ball screw around its axis, and indicates the detected position of the cutting unit 50 in the Z-axis direction. The information is output to the control unit 100.

The cleaning unit 70 cleans the frame unit 200 from which the workpiece 201 has been cut. The cleaning unit 70 includes a chuck table 71, which is a processing section that sucks and holds (corresponds to processing) the workpiece 201 of the frame unit 200 on a holding surface 72 and rotates around an axis parallel to the Z-axis direction, and a chuck table 71. A cleaning water nozzle 73 is provided for supplying cleaning water to the workpiece 201 sucked and held by the cleaning water nozzle 71 . Further, in the first embodiment, the chuck table 71 of the cleaning unit 70 is provided so as to be movable up and down in the Z-axis direction using an air cylinder as shown.

The cleaning unit 70 suction-holds the workpiece 201 placed on the holding surface 72 of the chuck table 71 via the adhesive tape 207, fixes the frame unit 200, and rotates the chuck table 71 around its axis. At the same time, cleaning water is supplied from the cleaning water nozzle 73 to the workpiece 201 to clean the workpiece 201.

The transport unit 80 transports the frame unit 200 between the guide rail 20 and the chuck tables 40 and 71. In the first embodiment, the transport unit 80 carries the frame unit 200 into or out of the chuck tables 40 and 71. In the first embodiment, the transport unit 80 includes a first transport unit 81 that transports the frame unit 200 from the guide rail 20 to the chuck table 40, and a first transport unit 81 that transports the frame unit 200 from the chuck table 40 to the chuck table 71 of the cleaning unit 70. and a second transport unit 82. Further, the first transport unit 81 transports the frame unit 200 from the chuck table 71 of the cleaning unit 70 to the guide rail 20.

As shown in FIGS. 1 and 2, the transport units 81 and 82 include a holding unit 83 that holds the annular frame 206 of the frame unit 200, and a moving unit 84 that moves the holding unit 83. The moving unit 84 includes a Y-axis moving mechanism 86 that moves a unit support arm 85, which is provided with a holding unit 83 at the tip, in the Y-axis direction, and a Y-axis moving mechanism 86, which is provided at the tip of the unit support arm 85 and moves the holding unit 83 in the Z-axis direction. It is provided with an elevating mechanism 87 for raising and lowering. The Y-axis moving mechanism 86 is a horizontal beam that connects a pair of pillars 7, 7 of a gate-shaped second support frame 6 that stands upright from the device main body 2 and is closer to the loading/unloading area than the support frame 3. 8. The Y-axis moving mechanism 86 supports a well-known ball screw rotatably provided around the axis, a well-known pulse motor that rotates the ball screw around the axis, and a unit support arm 85 so as to be movable in the Y-axis direction. It is composed of well-known guide rails. The elevating mechanism 87 is constituted by a well-known air cylinder.

Furthermore, in the first transport unit 81, the grip portion 31 of the moving unit 30 is attached to the holding unit 83. For this reason, the grip portion 31 of the moving unit 30 is movable in the Y-axis direction by the Y-axis moving mechanism 86 of the first transport unit 81. The moving unit 30 moves the frame unit 200 onto the guide rail 20 by moving the gripping part 31 that grips the annular frame 206 of the frame unit 200 in the Y-axis direction by the Y-axis moving mechanism 86 of the first transport unit 81. move along.

The control unit 100 controls each of the above-mentioned units of the processing apparatus 1 and causes the processing apparatus 1 to perform a processing operation on the workpiece 201 of the frame unit 200. Specifically, the control unit 100 causes the gripping portion 31 of the moving unit 30 to grip the annular frame 206 of the frame unit 200 before cutting, with the pair of guide rails 20 separated from each other, and performs the first conveyance. The Y-axis moving mechanism 86 of the unit 81 moves the gripping part 31 of the moving unit 30 away from the cassette 11 on the support surface 21 of the guide rail 20 along the Y-axis direction, and moves the frame unit 200 to the loading/unloading area. It is positioned directly above the chuck table 40 between the position shown by the solid line in FIG. 3 and the position shown by the two-dot chain line. Note that FIG. 3 shows only the annular frame 206 of the frame unit 200 and omits the others.

After positioning the frame unit 200 in the X-axis direction by bringing the pair of guide rails 20 close to each other, the control unit 100 holds the annular frame 206 of the positioned frame unit 200 with the holding unit 83 of the first transport unit 81. . The control unit 100 moves the pair of guide rails 20 away from each other to a distance that allows the frame unit 200 to pass between the guide rails 20, and moves the frame held by the holding unit 83 using the first transport unit 81. The workpiece 201 of the unit 200 is placed on the holding surface 41 of the chuck table 40 via the adhesive tape 207. The control unit 100 suction-holds the workpiece 201 on the chuck table 40 , clamps the annular frame 206 with the clamp section 42 , moves the chuck table 40 to the X-axis moving unit, and moves the chuck table 40 to the imaging unit 60 . The upper workpiece 201 is imaged. The control unit 100 performs alignment to align the workpiece 201 and the cutting blade 51, and relatively moves the chuck table 40 and the cutting blade 51 of the cutting unit 50 along the dividing line 203. The cutting blade 51 is made to cut into the planned dividing line 203.

The control unit 100 cuts the cutting blade 51 into all the planned division lines 203, moves the chuck table 40 to the loading/unloading area, and then releases the suction holding of the chuck table 40 and the clamping of the clamp part 42. , the holding unit 83 of the second transport unit 82 holds the annular frame 206 of the frame unit 200 on the chuck table 40, and the second transport unit 82 holds the workpiece 201 of the frame unit 200 held on the holding unit 83. It is placed on the holding surface 72 of the chuck table 71 of the cleaning unit 70 via the adhesive tape 207.

The control unit 100 causes the cleaning unit 70 to clean the frame unit 200, and the holding unit 83 of the first transport unit 81 holds the annular frame 206 of the frame unit 200 on the chuck table 71 of the cleaning unit 70. The control unit 100 uses the first transport unit 81 to place the frame unit 200 on the support surfaces 21 of the pair of guide rails 20, and positions it between the position shown by the solid line and the position shown by the two-dot chain line in FIG. . In the first embodiment, a portion of the annular frame 206 overlaps in the position shown by the solid line in FIG. 3 and the position shown by the two-dot chain line in FIG.

After the control unit 100 positions the frame unit 200 in the X-axis direction by bringing the pair of guide rails 20 close to each other, the control unit 100 moves the annular frame of the frame unit 200 on the guide rail 20 after cutting with the grip part 31 of the moving unit 30. 206 is held. The control unit 100 moves the gripping part 31 of the moving unit 30 on the support surface 21 of the guide rail 20 along the Y-axis direction in a direction toward the cassette 11 using the Y-axis moving mechanism 86 of the first transport unit 81. , the frame unit 200 is carried into the cassette 11.

The control unit 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output interface device. It is a computer having the following. The arithmetic processing device of the control unit 100 performs arithmetic processing according to a computer program stored in a storage device, and sends a control signal for controlling the processing device 1 to the above-mentioned processing device 1 via an input/output interface device. output to each unit.

Further, the control unit 100 is connected to a display unit (not shown) that displays the state of the machining operation, images captured by the imaging unit 60, and the like, and an input unit used by the operator to register machining content information and the like. The display unit is composed of a liquid crystal display device or the like. The input unit includes an external input device such as a touch panel or a keyboard provided on the display screen of the display unit.

Furthermore, the processing device 1 includes a position detection section 90 that detects the position of the frame unit 200, as shown in FIGS. 1, 2, 3, and 4. In the first embodiment, the position detection unit 90 detects whether the frame unit 200 is temporarily placed on the guide rail 20 or not. The position detection unit 90 includes a pair of transmission type photoelectric sensors 91 and 92 attached to the positioning walls 22 of the pair of guide rails 20, respectively. The pair of transmission type photoelectric sensors 91 and 92 include sensor covers 93 that are provided in the through hole 23 that penetrates the positioning wall 22 and that face each other in the X-axis direction. The sensor cover 93 is made of a material that can transmit light, and in the first embodiment is formed flush with the positioning wall 22 .

One transmission type photoelectric sensor 91 has a light emitting part 95 that emits light 94 toward the sensor cover 93 of the other transmission type photoelectric sensor 92, and the other transmission type photoelectric sensor 92 has a light emitting part 95 that emits light 94 toward the sensor cover 93 of the other transmission type photoelectric sensor It has a light receiving section 96 that receives the light emitted from the light emitting section 95 of 91 . The other transmission type photoelectric sensor 92 outputs to the control unit 100 a detection result indicating the result of receiving the light 94 emitted by the light emitting unit 95 of the one transmission type photoelectric sensor 91 of the light receiving unit 96 . As shown in FIGS. 3 and 4, the pair of transmission-type photoelectric sensors 91 and 92 have one transmission-type photoelectric sensor 91 emitted by an annular frame 206 of a frame unit 200 supported by the support surface 21 of the guide rail 20. When the light 94 is blocked, the other transmission type photoelectric sensor 92 detects that it does not receive the light 94, that is, the frame unit 200 is positioned on the guide rail 20, and sends the detection result to the control unit 100. Output.

Further, the pair of transmission type photoelectric sensors 91 and 92 are mounted on the annular frame 206 of the frame unit 200 at a position close to the cassette 11 shown by the solid line in FIG. The annular frame 206 of the frame unit 200 is placed at a position opposite to the position where the annular frame 206 of the frame unit 200 overlaps in the X-axis direction. For this purpose, the processing apparatus 1 is configured such that the frame unit 200 supported by the guide rail 20 is positioned between the position shown by the solid line in FIG. 3 and the position shown by the chain double-dashed line in FIG. can be detected by a position detecting section 90 composed of a pair of transmission type photoelectric sensors 91 and 92. Furthermore, the processing device 1 is located at a frame unit 200 located at one end of the predetermined range, indicated by a solid line in FIG. 3, and at a position indicated by a chain double-dashed line in FIG. Transmissive photoelectric sensors 91 and 92 are arranged in the frame unit 200 at positions where the light 94 is blocked.

After the control unit 100 of the processing device 1 causes the movement unit 30 to carry out the frame unit 200 before cutting from the cassette 11, the control unit 100 controls the guide based on the detection result of the other transmissive photoelectric sensor 92 of the position detection unit 90. It is recognized that the frame unit 200 is positioned on the rail 20. After determining that the frame unit 200 has been positioned on the guide rails 20, the control unit 100 executes the next operation, such as moving the pair of guide rails 20 closer together to position the frame unit 200 in the X-axis direction.

Further, the control unit 100 of the processing apparatus 1 causes the first transport unit 81 to carry out the cut frame unit 200 from the chuck table 71 of the cleaning unit 70, and then transfers the frame unit 200 to the other transmissive photoelectric sensor of the position detection unit 90. Based on the detection result 92, it is determined that the frame unit 200 is positioned on the guide rail 20. After determining that the frame unit 200 has been positioned on the guide rails 20, the control unit 100 executes the next operation, such as moving the pair of guide rails 20 closer together to position the frame unit 200 in the X-axis direction.

The processing apparatus 1 according to the first embodiment described above detects the frame unit 200 by a pair of transmission type photoelectric sensors 91 and 92 provided on the outside of the positioning wall 22 of the pair of guide rails 20, This avoids the possibility that the type photoelectric sensors 91 and 92 become dirty.

Furthermore, while the circular frame unit 200 including the annular annular frame 206 is moving on the support surface 21 of the guide rail 20, the processing apparatus 1 can also operate at a position where the annular frame 206 is not supported on the support surface 21 of the guide rail 20. Light 94 emitted from the light emitting section 95 of one transmission type photoelectric sensor 91 is blocked by the frame unit 200. That is, in the case where the photoelectric sensor disposed on the support surface 21 detects the light 94 being blocked by the annular frame 206, the processing device 1 detects the annular frame at a position where the annular frame 206 is blocked by the photoelectric sensor in the Y-axis direction. However, since a pair of transmission type photoelectric sensors 91 and 92 are provided on the outside of the positioning wall 22 of the pair of guide rails 20 and the light 94 is emitted from the side to the frame unit 200, the annular frame The processing device 1 can detect the frame unit 200 over the entire length of the frame unit 206 in the Y-axis direction. This has the effect that the number of type photoelectric sensors 91 and 92 can be suppressed.

Therefore, the processing device 1 according to the first embodiment can prevent the transmission type photoelectric sensors 91 and 92 that detect the frame unit 200 from being contaminated, and can also suppress the installed transmission type photoelectric sensors 91 and 92. This effect is achieved.

Further, the processing device 1 includes a ring frame 206 of the frame unit 200 in which a pair of transmission photoelectric sensors 91 and 92 are carried out from the cassette 11 shown by solid lines in FIG. 3 on the guide rail 20 and positioned on the guide rail 20; The annular frame 206 of the frame unit 200, which is placed on the guide rail 20 before being carried into the cassette 11 shown by the two-dot chain line in FIG. As a result, the processing device 1 has the advantage that the frame unit 200 temporarily placed on the guide rail 20 can be detected using the pair of transmission type photoelectric sensors 91 and 92.

Note that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the invention. In the embodiment described above, a cutting device is shown as the processing device 1, but in the present invention, the processing device 1 is not limited to a cutting device, but is capable of laser processing for laser processing the workpiece 201 of the frame unit 200. Various processing devices that perform various processing on the workpiece 201 of the frame unit 200 may be used.

Further, in the embodiment described above, the chuck tables 40 and 71 are shown as the processing section, and suction and holding is shown as the processing, but in the present invention, the processing section is not limited to the chuck tables 40 and 71, and the processing is It is not limited to suction retention.

1 Processing device 10 Cassette elevator (cassette loading section)
11 Cassette 20 Guide rail 21 Support surface 30 Movement unit 40 Chuck table (processing section)
71 Chuck table (processing section)
80 Transport unit 90 Position detection section 91, 92 Transmission type photoelectric sensor 94 Light 95 Light emitting section 96 Light receiving section 200 Frame unit 201 Workpiece 206 Annular frame 207 Adhesive tape 208 Opening

Claims (2)

A cassette mounting section on which a cassette containing a plurality of frame units each having a workpiece fixed with an adhesive tape in an opening of an annular frame is placed, and a cassette placed on the cassette mounting section is carried out or carried in. a guide rail for temporarily placing the frame unit; a moving unit for moving the frame unit along the guide rail; a processing section for processing the frame unit; A processing device comprising a transport unit that transports a unit, and a position detection section that detects the position of the frame unit,
The guide rail is
having a pair of support surfaces extending in parallel and supporting the frame unit from below;
The position detection section is
A transmission type photoelectric sensor having a light emitting part or a light receiving part and disposed on the outside of the pair of guide rails, and the transmission type photoelectric sensor is arranged from the end of the side where the pair of guide rails are separated from each other on the support surface. The support is provided with a sensor cover provided in a through hole penetrating the erected positioning wall, made of a material that transmits light, and facing the frame unit that slides on the support surface. A processing device that detects that the frame unit is positioned on the guide rail when light from the light emitting section is blocked by the frame unit supported on the surface. The position detection section detects that the frame unit supported by the guide rail is positioned within a predetermined range, and the frame unit positioned at one end of the predetermined range and the other end of the predetermined range are detected. The processing device according to claim 1, wherein the transmission type photoelectric sensor is arranged at a position where the light is blocked by the frame unit located at an end.

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