TWI813825B - Processing device - Google Patents

Processing device Download PDF

Info

Publication number
TWI813825B
TWI813825B TW108144483A TW108144483A TWI813825B TW I813825 B TWI813825 B TW I813825B TW 108144483 A TW108144483 A TW 108144483A TW 108144483 A TW108144483 A TW 108144483A TW I813825 B TWI813825 B TW I813825B
Authority
TW
Taiwan
Prior art keywords
workpiece
cassette
unit
suction cup
processing device
Prior art date
Application number
TW108144483A
Other languages
Chinese (zh)
Other versions
TW202031419A (en
Inventor
大高小由紀
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202031419A publication Critical patent/TW202031419A/en
Application granted granted Critical
Publication of TWI813825B publication Critical patent/TWI813825B/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/409—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using manual data input [MDI] or by using control panel, e.g. controlling functions with the panel; characterised by control panel details or by setting parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Numerical Control (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

本發明的課題是在於提供一種可掌握被加工物的加工的進行狀況的加工裝置。 其解決手段，加工裝置係具備：吸盤、切削單元、暫置被加工物的軌道、洗淨單元、顯示畫面(111)、及設定被顯示於顯示畫面(111)的進行狀況顯示畫面(112)的顯示資訊設定部。 進行狀況顯示畫面(112)係設定有： 裝置內地圖(120)，其係具有與軌道、吸盤及洗淨單元對應顯示預定的色(301，303，304)的對應區域(121，123，124)； 被加工物標記，其係將被加工物的現在位置重疊於裝置內地圖(120)而顯示；及 複數的方格(131)，其係表示卡匣的收容架。 在方格(131)，係顯示有對應於被收容在方格(131)所示的卡匣的收容架的被加工物的現在位置之對應區域(121，123，124)的色(301，303，304)。An object of the present invention is to provide a processing device capable of grasping the progress of processing of a workpiece. As a solution, the processing device is equipped with: a suction cup, a cutting unit, a rail for temporarily placing the workpiece, a cleaning unit, a display screen (111), and a progress status display screen (112) set to be displayed on the display screen (111). Display information setting part. The settings of the progress status display screen (112) include: A map (120) in the device, which has corresponding areas (121, 123, 124) displaying predetermined colors (301, 303, 304) corresponding to the track, suction cup and cleaning unit; The processed object mark is displayed by overlaying the current position of the processed object on the map (120) in the device; and The plural squares (131) represent the storage racks of the cassette. In the square (131), the color (301) corresponding to the current position of the workpiece stored in the storage rack of the cassette shown in the square (131) is displayed. 303, 304).

Description

加工裝置Processing equipment

本發明是有關加工裝置。The present invention relates to processing equipment.

將板狀的被加工物保持於吸盤，以切削刀刃來切削，或以研削砥石來薄化，或以雷射光線來加工的各種加工裝置為人所知。在該等的加工裝置中，各層會支撐1片的被加工物，從形成複數層的卡匣(cassette)取出被加工物，在吸盤加工被加工物，在洗淨台洗淨，再度回到卡匣的全自動型的加工裝置多數被利用(例如參照專利文獻1)。Various processing devices are known that hold a plate-shaped workpiece on a suction cup and cut it with a cutting blade, thin it with a grinding stone, or process it with a laser beam. In such processing equipment, each layer supports one piece of workpiece, takes out the workpiece from a cassette forming multiple layers, processes the workpiece on the suction cup, washes it on the washing table, and returns it to the machine again. Fully automatic processing devices for cassettes are often used (for example, see Patent Document 1).

在專利文獻1等所示的加工裝置基於防止異物附著於被加工物，或防止操作員意外受傷的目的，卡匣以外的區域會以外裝罩所覆蓋。 [先前技術文獻] [專利文獻]In the processing apparatus shown in Patent Document 1 and the like, the area other than the cassette is covered with an exterior cover in order to prevent foreign matter from adhering to the workpiece or accidental injury to the operator. [Prior technical literature] [Patent Document]

[專利文獻1]日本特開2016-15042號公報[Patent Document 1] Japanese Patent Application Publication No. 2016-15042

(發明所欲解決的課題)(The problem that the invention aims to solve)

由於在專利文獻1等所示的加工裝置是卡匣以外的區域會以外裝罩所覆蓋，因此無法一目了然被加工物到底被定位於裝置內的何處。而且，在專利文獻1等所示的加工裝置，收容於卡匣的被加工物之中，加工進展到哪裡，雖可顯示數字，但難以一目了然，難以從離開的場所來看顯示裝置的畫面而理解進展狀況。In the processing device shown in Patent Document 1 and the like, the area other than the cassette is covered by the outer cover, so it is not possible to clearly see where the workpiece is positioned within the device. Moreover, in the processing device shown in Patent Document 1 and the like, although the processing progress of the workpiece stored in the cassette can be displayed, it is difficult to see at a glance, and it is difficult to view the screen of the display device from a separate place. Understand progress.

本發明是有鑑於如此的問題點而研發者，其目的是在於提供一種可掌握被加工物的加工的進行狀況之加工裝置。 (用以解決課題的手段)The present invention was developed in view of such problems, and its purpose is to provide a processing device that can grasp the progress of processing of a workpiece. (Means used to solve problems)

為了解決上述的課題，達成目的，本發明的加工裝置係具備： 吸盤，其係保持被加工物； 加工單元，其係加工被保持於該吸盤的被加工物； 卡匣載置區域，其係載置具備複數個收容該被加工物的層的卡匣； 洗淨區域，其係洗淨該被加工物； 搬送單元，其係在該卡匣、該吸盤及該洗淨區域之間搬送被加工物； 顯示畫面，其係顯示該被加工物的加工的進行狀況；及 顯示資訊設定部，其係設定顯示於該顯示畫面的資訊， 其特徵為： 在該顯示資訊設定部，係設定有： 裝置內地圖，其係具有該吸盤及該洗淨區域，各區域係顯示有預定的色或預定的識別標記； 被加工物標記，其係將從該卡匣搬出的被加工物的現在位置重疊於該裝置內地圖而顯示；及 複數的方格，其係表示該卡匣的該層， 作為顯示資訊， 在該方格，係顯示有對應於被收容在該方格所示的該卡匣的該層的該被加工物的現在位置之該區域的該色或預定的識別標記。In order to solve the above problems and achieve the purpose, the processing device of the present invention is equipped with: Suction cup, which holds the workpiece; a processing unit that processes the workpiece held by the suction cup; A cassette holding area is used to place a cassette having a plurality of layers for accommodating the workpiece; The cleaning area is used to clean the processed objects; A transport unit is used to transport the processed objects between the cassette, the suction cup and the cleaning area; A display screen shows the progress of the processing of the object to be processed; and The display information setting part is used to set the information displayed on the display screen, Its characteristics are: In the display information setting section, the system settings include: A map in the device, which has the suction cup and the cleaning area, and each area is displayed with a predetermined color or a predetermined identification mark; The processed object mark is displayed by overlaying the current position of the processed object removed from the cassette on the map in the device; and A plurality of squares represents that layer of the cassette, As display information, In this square, the color or the predetermined identification mark corresponding to the area corresponding to the current position of the workpiece stored in the layer of the cassette shown in the square is displayed.

在前述加工裝置中，該裝置內地圖，係亦可包含搬送該被加工物的搬送單元。In the aforementioned processing device, the map in the device may include a transport unit for transporting the workpiece.

在前述加工裝置中，在表示收容從該卡匣搬出之後再度回到該卡匣的被加工物的層之該方格，係亦可顯示有表示搬入完了的色或識別標記。In the aforementioned processing device, a color or an identification mark indicating the completion of loading may be displayed on the square indicating the layer containing the workpiece that is returned to the cassette after being carried out from the cassette.

前述加工裝置，係更具備：暫置從被載置於該卡匣載置區域的該卡匣搬出的被加工物之暫置區域， 該搬送單元係在該卡匣、該暫置區域、該吸盤及該洗淨區域之間搬送被加工物，該裝置內地圖係亦可包含該暫置區域。 [發明的效果]The aforementioned processing device further includes: a temporary storage area for temporarily storing the processed objects carried out from the cassette placed in the cassette storage area, The transport unit transports the processed objects between the cassette, the temporary storage area, the suction cup and the cleaning area. The map system in the device may also include the temporary storage area. [Effects of the invention]

本發明是取得可掌握被加工物的加工的進行狀況的效果。The present invention has the effect of being able to grasp the progress of processing of a workpiece.

一面參照圖面，一面詳細說明有關用以實施本發明的形態(實施形態)。並非藉由以下的實施形態所記載的內容來限定本發明。並且，在以下記載的構成要素是包括該當業者所容易假想者，實質上相同者。而且，以下記載的構成是可適當組合。又，可在不脫離本發明的主旨範圍進行構成的各種的省略、置換或變更。Modes (embodiments) for implementing the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily imagined by the relevant industry and are substantially the same. Furthermore, the structures described below can be combined appropriately. In addition, various omissions, substitutions or changes in the structure can be made without departing from the scope of the invention.

[實施形態1] 根據圖面來說明本發明的實施形態1的加工裝置。圖1是表示實施形態1的加工裝置的構成例的立體圖。圖2是表示圖1所示的加工裝置的卡匣的立體圖。圖3是表示被顯示於圖1所示的加工裝置的顯示單元的顯示畫面的進行狀況顯示畫面的圖。圖4是表示被顯示於圖1所示的加工裝置的顯示單元的顯示畫面的被加工物標記之一例的圖。圖5是表示被顯示於圖1所示的加工裝置的顯示單元的顯示畫面的被加工物標記的其他的例子的圖。[Embodiment 1] The processing device according to Embodiment 1 of the present invention will be described based on the drawings. Fig. 1 is a perspective view showing a structural example of a processing device according to Embodiment 1. FIG. 2 is a perspective view showing the cassette of the processing device shown in FIG. 1 . FIG. 3 is a diagram showing a progress display screen displayed on the display screen of the display unit of the processing device shown in FIG. 1 . FIG. 4 is a diagram showing an example of a workpiece mark displayed on the display screen of the display unit of the processing apparatus shown in FIG. 1 . FIG. 5 is a diagram showing another example of a workpiece mark displayed on the display screen of the display unit of the processing apparatus shown in FIG. 1 .

實施形態1的加工裝置1是切削(相當於加工)圖1所示的被加工物200的加工裝置1。在實施形態1中，被加工物200是以矽、藍寶石、鎵等作為母材的圓板狀的半導體晶圓或光裝置晶圓等的晶圓。被加工物200是在藉由被格子狀形成於表面201的複數的分割預定線202所區劃成格子狀的區域形成有裝置203。The processing device 1 of Embodiment 1 is a processing device 1 that cuts (corresponds to processing) the workpiece 200 shown in FIG. 1 . In Embodiment 1, the workpiece 200 is a wafer such as a disc-shaped semiconductor wafer or an optical device wafer using silicon, sapphire, gallium, or the like as a base material. The workpiece 200 has the device 203 formed in a lattice-like area divided by a plurality of planned dividing lines 202 formed on the surface 201 in a lattice-like manner.

又，本發明的被加工物200是亦可為中央部被薄化，在外周部形成厚部的所謂TAIKO(註冊商標)晶圓，除了晶圓以外，亦可為藉由樹脂來密封的具有複數個裝置的矩形狀的封裝基板、陶瓷基板、肥粒鐵(ferrite)基板、或含鎳及鐵的至少一方的基板等。在實施形態1中，被加工物200是背面204會被貼附於在外周緣安置有環狀框205的黏著膠帶206，而被環狀框205支撐。In addition, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which the central portion is thinned and a thick portion is formed in the outer peripheral portion. In addition to the wafer, the workpiece 200 may also be a wafer sealed with resin. A rectangular package substrate for a plurality of devices, a ceramic substrate, a ferrite substrate, a substrate containing at least one of nickel and iron, or the like. In Embodiment 1, the back surface 204 of the workpiece 200 is attached to the adhesive tape 206 with the annular frame 205 installed on the outer periphery, and is supported by the annular frame 205 .

圖1所示的加工裝置1是吸盤10來保持被加工物200，沿著分割預定線202來以切削刀刃21切削的裝置。如圖1所示般，加工裝置1是具備：以保持面11來吸引保持被加工物200的吸盤10、以切削刀刃21來切削被保持於吸盤10的被加工物200的加工單元的切削單元20、攝取被保持於吸盤10的被加工物200的攝像單元30、及控制單元100。The processing device 1 shown in FIG. 1 is a device in which a workpiece 200 is held by a suction cup 10 and is cut with a cutting blade 21 along a planned division line 202 . As shown in FIG. 1 , the processing device 1 is a cutting unit including a suction cup 10 that attracts and holds a workpiece 200 with a holding surface 11 , and a processing unit that cuts the workpiece 200 held by the suction cup 10 with a cutting blade 21 . 20. The imaging unit 30 and the control unit 100 that capture the workpiece 200 held on the suction cup 10 .

又，如圖1所示般，加工裝置1是至少具備：將吸盤10加工進給於與水平方向平行的X軸方向之未圖示的X軸移動單元、將切削單元20分度進給於與水平方向平行且與X軸方向正交的Y軸方向之未圖示的Y軸移動單元、及將切削單元20切入進給於與和X軸方向及Y軸方向的雙方正交的鉛直方向平行的Z軸方向之Z軸移動單元40。如圖1所示般，加工裝置1是具備2個切削單元20，亦即2主軸的切割機，所謂的雙面向型(facing dual type)的加工裝置1。In addition, as shown in FIG. 1 , the processing device 1 at least includes an X-axis moving unit (not shown) for processing and feeding the suction cup 10 in the X-axis direction parallel to the horizontal direction, and a cutting unit 20 for indexing and feeding. A Y-axis moving unit (not shown) in the Y-axis direction that is parallel to the horizontal direction and orthogonal to the X-axis direction, and the cutting unit 20 cuts in and feeds in the vertical direction that is orthogonal to both the X-axis direction and the Y-axis direction. The Z-axis moving unit 40 is parallel to the Z-axis direction. As shown in FIG. 1 , the processing device 1 is a so-called facing dual type processing device 1 including two cutting units 20 , that is, a two-spindle cutting machine.

吸盤10是圓盤形狀，保持被加工物200的保持面11是由多孔陶瓷等所形成。又，吸盤10是藉由X軸移動單元，跨越切削單元20的下方的加工區域與從切削單元20的下方離開來搬出入被加工物200的搬出入區域，在X軸方向移動自如地設置，且藉由旋轉驅動源，繞著與Z軸方向平行的軸心旋轉自如地設置。吸盤10是與未圖示的真空吸引源連接，藉由真空吸引源來吸引，藉此吸引、保持被載置於保持面11的被加工物200。在實施形態1中，吸盤10是經由黏著膠帶206來吸引、保持被加工物200的背面204側。又，如圖1所示般，在吸盤10的周圍是設有複數個夾緊環狀框205的夾緊部12。The suction cup 10 is disk-shaped, and the holding surface 11 holding the workpiece 200 is formed of porous ceramics or the like. In addition, the suction cup 10 is provided movably in the X-axis direction by the X-axis moving unit, spanning the processing area below the cutting unit 20 and the carry-out area separated from the bottom of the cutting unit 20 for loading and unloading the workpiece 200. And it is installed freely around the axis parallel to the Z-axis direction by the rotation drive source. The suction cup 10 is connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source, thereby sucking and holding the workpiece 200 placed on the holding surface 11 . In Embodiment 1, the suction cup 10 attracts and holds the back surface 204 side of the workpiece 200 via the adhesive tape 206 . Moreover, as shown in FIG. 1 , around the suction cup 10 is a clamping portion 12 provided with a plurality of clamping annular frames 205 .

切削單元20是裝卸自如地安裝切削被保持於吸盤10的被加工物200的切削刀刃21之切削手段。切削單元20是分別對於被保持於吸盤10的被加工物200，藉由Y軸移動單元，在Y軸方向移動自如地設置，且藉由Z軸移動單元40，在Z軸方向移動自如地設置。The cutting unit 20 is a cutting means that is detachably mounted with a cutting edge 21 for cutting the workpiece 200 held by the suction cup 10 . The cutting unit 20 is provided movably in the Y-axis direction by the Y-axis moving unit, and is movably provided in the Z-axis direction by the Z-axis moving unit 40 with respect to the workpiece 200 held by the suction cup 10 . .

如圖1所示般，一方的切削單元20是經由Y軸移動單元、Z軸移動單元40等來設於從裝置本體2立設的門型的支持框3的一方的柱部4。如圖1所示般，另一方的切削單元20是經由Y軸移動單元、Z軸移動單元40等來設於支持框3的另一方的柱部5。另外，支持框3是藉由水平樑6來連結柱部4，5的上端彼此間。As shown in FIG. 1 , one cutting unit 20 is provided on one column 4 of a door-shaped support frame 3 standing upright from the apparatus body 2 via a Y-axis movement unit, a Z-axis movement unit 40 and the like. As shown in FIG. 1 , the other cutting unit 20 is provided on the other column portion 5 of the support frame 3 via the Y-axis moving unit, the Z-axis moving unit 40 and the like. In addition, the support frame 3 connects the upper ends of the column portions 4 and 5 with the horizontal beam 6 .

切削單元20是可藉由Y軸移動單元及Z軸移動單元40來將切削刀刃21定位於吸盤10的保持面11的任意的位置。切削單元20是具備：藉由Y軸移動單元及Z軸移動單元40在Y軸方向及Z軸方向移動自如地設置的主軸外殼22、及在主軸外殼22繞著軸心旋轉自如地設置且藉由馬達來旋轉的同時在前端安裝有切削刀刃21之未圖示的主軸。The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the suction cup 10 through the Y-axis moving unit and the Z-axis moving unit 40 . The cutting unit 20 includes a spindle housing 22 that is movably provided in the Y-axis direction and the Z-axis direction by a Y-axis movement unit and a Z-axis movement unit 40, and a spindle housing 22 that is rotatably provided around an axis and is While being rotated by a motor, a spindle (not shown) having a cutting edge 21 is attached to the front end.

攝像單元30是以和切削單元20一體地移動的方式固定於切削單元20。攝像單元30是具備攝取被保持於吸盤10的切削前的被加工物200的應分割的區域的攝像元件。攝像元件是例如CCD(Charge-Coupled Device)攝像元件或CMOS(Complementary MOS)攝像元件。攝像單元30是用以攝取被保持於吸盤10的被加工物200，取得執行進行被加工物200與切削刀刃21的對位之對準等的畫像，將取得的畫像輸出至控制單元100。The imaging unit 30 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20 . The imaging unit 30 is provided with an imaging element that captures a region to be divided of the workpiece 200 held by the suction cup 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit 30 is used to capture the workpiece 200 held on the suction cup 10 , obtain an image of the alignment of the workpiece 200 and the cutting blade 21 , and output the obtained image to the control unit 100 .

X軸移動單元是使吸盤10移動於加工進給方向的X軸方向，藉此將吸盤10與切削單元20相對地沿著X軸方向來加工進給者。Y軸移動單元是使切削單元20移動於分度進給方向的Y軸方向，藉此將吸盤10與切削單元20相對地沿著Y軸方向來分度進給者。Z軸移動單元40是使切削單元20移動於切入進給方向的Z軸方向，藉此將吸盤10與切削單元20相對地沿著Z軸方向來切入進給者。The X-axis moving unit moves the suction cup 10 in the X-axis direction of the processing feed direction, thereby processing the suction cup 10 and the cutting unit 20 in the X-axis direction relative to each other. The Y-axis moving unit moves the cutting unit 20 in the Y-axis direction of the indexing feed direction, thereby indexing and feeding the suction cup 10 relative to the cutting unit 20 along the Y-axis direction. The Z-axis moving unit 40 moves the cutting unit 20 in the Z-axis direction of the cutting feed direction, thereby making the suction cup 10 and the cutting unit 20 face cutting and feeding along the Z-axis direction.

X軸移動單元、Y軸移動單元及Z軸移動單元40是具備： 繞著軸心旋轉自如地設置的周知的滾珠螺桿； 使滾珠螺桿繞著軸心旋轉的周知的馬達；及 在X軸方向、Y軸方向或Z軸方向移動自如地支撐吸盤10或切削單元20的周知的導軌。The X-axis moving unit, Y-axis moving unit and Z-axis moving unit 40 are equipped with: A well-known ball screw that is freely rotatable around an axis; A well-known motor that rotates a ball screw around an axis; and A well-known guide rail supports the suction cup 10 or the cutting unit 20 movably in the X-axis direction, the Y-axis direction, or the Z-axis direction.

又，加工裝置1是具備：用以檢測出吸盤10的X軸方向的位置的未圖示的X軸方向位置檢測單元、用以檢測出切削單元20的Y軸方向的位置的未圖示的Y軸方向位置檢測單元、及用以檢測出切削單元20的Z軸方向的位置的Z軸方向位置檢測單元。X軸方向位置檢測單元及Y軸方向位置檢測單元是可藉由與X軸方向或Y軸方向平行的線性刻度及讀取頭所構成。Z軸方向位置檢測單元是以馬達的脈衝來檢測出切削單元20的Z軸方向的位置。X軸方向位置檢測單元、Y軸方向位置檢測單元及Z軸方向位置檢測單元是將吸盤10的X軸方向、切削單元20的Y軸方向或Z軸方向的位置輸出至控制單元100。另外，在實施形態1中，加工裝置1的各構成要素的X軸方向、Y軸方向及Z軸方向的位置是被定於以預定的未圖示的基準位置作為基準的位置。In addition, the processing device 1 is provided with an X-axis direction position detection unit (not shown) for detecting the position of the suction cup 10 in the X-axis direction, and a unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction. A Y-axis direction position detection unit and a Z-axis direction position detection unit for detecting the Z-axis direction position of the cutting unit 20 . The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale and a reading head parallel to the X-axis direction or the Y-axis direction. The Z-axis direction position detection unit detects the Z-axis direction position of the cutting unit 20 using the pulses of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the positions of the suction cup 10 in the X-axis direction, the cutting unit 20 in the Y-axis direction, or the Z-axis direction to the control unit 100 . In addition, in Embodiment 1, the positions of each component of the processing device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on a predetermined reference position (not shown).

又，加工裝置1具備： 卡匣載置區域的卡匣升降機50，其係收容切削前後的被加工物200的卡匣60被載置於上面，且使卡匣60昇降移動於Z軸方向； 洗淨區域的洗淨單元70，其係洗淨切削後的被加工物200； 暫置單元80，其係將被加工物200存取於卡匣60；及 搬送單元90，其係搬送被加工物200。In addition, the processing device 1 is equipped with: The cassette elevator 50 in the cassette loading area has the cassette 60 that accommodates the workpiece 200 before and after cutting being placed on it, and makes the cassette 60 move up and down in the Z-axis direction; The cleaning unit 70 in the cleaning area cleans the processed object 200 after cutting; The temporary storage unit 80 stores the workpiece 200 in the cassette 60; and The transport unit 90 transports the workpiece 200 .

如圖2所示般，卡匣60是具備： 被載置於卡匣升降機50上的底板61； 取間隔來與底板61對向於Z軸方向的頂板62；及 連結底板61與頂板62的X軸方向的端彼此間的一對的側板63。 一對的側板63是在X軸方向取間隔而對向。一對的側板63是分別具備突出於互相接近的方向的層的收容架64。卡匣60是在各側板63在Z軸方向等間隔具備複數個收容架64，在實施形態1中，在各側板63具備10個。被配設於一對的側板63且互相在X軸方向對向的收容架64是上面會被配置於同一平面上。各收容架64是被加工物200會被載置於上面，而將被加工物200收容於卡匣60內。在實施形態1中，各收容架64是環狀框205會被載置於上面。As shown in Figure 2, the cassette 60 is equipped with: The base plate 61 placed on the cassette lift 50; The top plate 62 is spaced apart from the bottom plate 61 and faces the Z-axis direction; and A pair of side plates 63 connects the X-axis direction ends of the bottom plate 61 and the top plate 62 . The pair of side plates 63 are spaced apart in the X-axis direction and face each other. The pair of side plates 63 each include a storage rack 64 having a layer protruding in a direction approaching each other. The cassette 60 is provided with a plurality of storage racks 64 at equal intervals in the Z-axis direction on each side plate 63. In Embodiment 1, ten storage racks are provided on each side plate 63. The upper surfaces of the storage racks 64 arranged on the pair of side plates 63 and facing each other in the X-axis direction are arranged on the same plane. The workpiece 200 is placed on each storage rack 64 , and the workpiece 200 is stored in the cassette 60 . In Embodiment 1, each storage rack 64 has an annular frame 205 placed on it.

另外，本說明書是在區別各收容架64彼此間時，從下者起，由1開始依序在符號64附上大的自然數，以64-1，64-2，64-3･･･64-10來進行說明，在不區別收容架64彼此間時，只附上符號64進行說明。又，本說明書是在區別被收容於各收容架64的被加工物200彼此間時，從被收容於下面的收容架64的被加工物200起，由1開始依序在符號200附上大的自然數，以200-1，200-2，200-3･･･200-10來進行說明，在不區別被收容於收容架64的被加工物200彼此間時，只附上符號200進行說明。In addition, in this manual, when distinguishing each storage rack 64 from each other, large natural numbers are appended to the symbol 64 in order from 1, starting from the lower one, with 64-1, 64-2, 64-3･･･ 64-10 for description. When the storage racks 64 are not distinguished from each other, only the symbol 64 is attached for description. In addition, in this specification, when distinguishing between the workpieces 200 stored in each storage rack 64, starting from the workpiece 200 stored in the lower storage rack 64, the symbols 200 are sequentially appended with the numbers 200 starting from 1. The natural numbers of are explained with 200-1, 200-2, 200-3･･･200-10. When the workpieces 200 stored in the storage rack 64 are not distinguished from each other, only the symbol 200 is attached. instruction.

在實施形態1中，卡匣升降機50是在上面載置卡匣60，藉由未圖示的馬達來使卡匣60昇降於Z軸方向。In Embodiment 1, the cassette lifter 50 places the cassette 60 on it, and moves the cassette 60 up and down in the Z-axis direction by a motor (not shown).

洗淨單元70具備： 旋轉器台72，其係圓盤形狀，保持被加工物200的保持面71為由多孔陶瓷等所形成；及 未圖示的洗淨液供給噴嘴，其係供給純水等的洗淨液至被保持於旋轉器台72的保持面71的被加工物200。The cleaning unit 70 is equipped with: The rotator table 72 is in the shape of a disk, and the holding surface 71 for holding the workpiece 200 is formed of porous ceramics or the like; and A cleaning liquid supply nozzle (not shown) supplies cleaning liquid such as pure water to the workpiece 200 held on the holding surface 71 of the rotator table 72 .

旋轉器台72是與未圖示的真空吸引源連接，藉由真空吸引源來吸引，藉此吸引、保持被載置於保持面71的被加工物200。又，旋轉器台72是藉由未圖示的馬達等來繞著與Z軸方向平行的軸心旋轉自如地設置。在實施形態1中，洗淨單元70是經由黏著膠帶206來吸引保持被加工物200的背面204側的旋轉器台72會邊繞著軸心旋轉，邊從洗淨液供給噴嘴供給洗淨液至被加工物200，而洗淨保持於保持面71的被加工物200。The rotator table 72 is connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source, thereby sucking and holding the workpiece 200 placed on the holding surface 71 . In addition, the rotator table 72 is rotatably installed around an axis parallel to the Z-axis direction by a motor or the like (not shown). In Embodiment 1, the cleaning unit 70 sucks and holds the back surface 204 of the workpiece 200 via the adhesive tape 206. The rotator table 72 rotates around the axis while supplying the cleaning liquid from the cleaning liquid supply nozzle. to the workpiece 200, and the workpiece 200 held on the holding surface 71 is washed.

暫置單元80是從被載置於卡匣升降機50的卡匣60搬出一片切削前的被加工物200，且將切削後的被加工物200搬入至卡匣60內者。 暫置單元80的構成包括： 搬出入單元83，其係從卡匣60搬出切削前的被加工物200，且將切削後的被加工物200搬入至卡匣60內；及 暫置區域的一對的軌道81，其係從被載置於卡匣升降機50的卡匣60搬出的切削前的被加工物200會被一時的暫置，且切削後的被加工物200會被一時的暫置。 又，暫置單元80是具備檢測出被暫置於軌道81上的被加工物200的檢測感測器82。檢測感測器82是將檢測結果輸出至控制單元100。The temporary storage unit 80 unloads a piece of the workpiece 200 before cutting from the cassette 60 placed in the cassette elevator 50 , and carries the cut workpiece 200 into the cassette 60 . The composition of the temporary unit 80 includes: The unloading and unloading unit 83 unloads the workpiece 200 before cutting from the cassette 60, and moves the workpiece 200 after cutting into the cassette 60; and The pair of rails 81 in the temporary storage area are used to temporarily store the workpiece 200 before cutting that is carried out from the cassette 60 placed in the cassette lift 50, and the workpiece 200 after cutting is temporarily placed there. Be temporarily suspended. Moreover, the temporary placement unit 80 is equipped with the detection sensor 82 which detects the workpiece 200 temporarily placed on the rail 81. The detection sensor 82 outputs the detection result to the control unit 100 .

搬送單元90是在卡匣60、暫置單元80的軌道81、吸盤10及洗淨單元70的旋轉器台72之間搬送被加工物200者。搬送單元90是具備第1搬送單元91及第2搬送單元92。第1搬送單元91是將被暫置於暫置單元80的軌道81上的切削前的被加工物200搬送至吸盤10，且將洗淨單元70的旋轉器台72上的洗淨後的被加工物200搬送至暫置單元80的軌道81上者。第2搬送單元92是將吸盤10上的切削後的被加工物200搬送至洗淨單元70的旋轉器台72者。The transport unit 90 transports the workpiece 200 between the cassette 60 , the rail 81 of the temporary unit 80 , the suction cup 10 and the rotator table 72 of the cleaning unit 70 . The transport unit 90 includes a first transport unit 91 and a second transport unit 92 . The first transport unit 91 transports the pre-cut workpiece 200 temporarily placed on the rail 81 of the temporary storage unit 80 to the suction cup 10 , and transfers the cleaned workpiece 200 on the rotator table 72 of the cleaning unit 70 The processed object 200 is conveyed to the rail 81 of the temporary storage unit 80 . The second transport unit 92 transports the cut workpiece 200 on the suction cup 10 to the rotator table 72 of the cleaning unit 70 .

本說明書，第1搬送單元91與第2搬送單元92是構成有同樣的部分，因此以下以第1搬送單元91為代表進行說明，在第2搬送單元92之與第1搬送單元91同樣的部分附上同樣的符號而省略說明。 第1搬送單元91具備： 單元本體94，其係在從裝置本體2立設且被配置於比支持框3更靠搬出入區域的第2支持框7，在Y軸方向移動自如地設置，在Z軸方向昇降自如地設置；及 吸引構件93，其係被安裝於單元本體94，且被連接至未圖示的真空吸引源，且吸引保持支撐被加工物200的環狀框205。 第1搬送單元91是在吸引構件93吸引保持環狀框205，使單元本體94移動於Y軸方向及Z軸方向而搬送被加工物200。In this specification, the first transport unit 91 and the second transport unit 92 have the same structure, so the following description will be made with the first transport unit 91 as a representative. The second transport unit 92 has the same components as the first transport unit 91 The same symbols are attached and explanations are omitted. The first transfer unit 91 is equipped with: The unit body 94 is attached to the second support frame 7 that is erected from the device body 2 and is located closer to the carry-out area than the support frame 3. The unit body 94 is provided movably in the Y-axis direction and can be freely raised and lowered in the Z-axis direction. ;and The suction member 93 is attached to the unit body 94 and connected to a vacuum suction source (not shown), and attracts and holds the annular frame 205 supporting the workpiece 200 . The first transport unit 91 attracts and holds the annular frame 205 on the suction member 93, moves the unit body 94 in the Y-axis direction and the Z-axis direction, and transports the workpiece 200.

控制單元100是分別控制加工裝置1的上述的各單元，使對於被加工物200的加工動作實施於加工裝置1者。具體而言，控制單元100是使切削加工前的被加工物200搬出至暫置單元80而使暫置於軌道81上，在第1搬送單元91使被暫置於軌道81上的被加工物200搬送至吸盤10。控制單元100是將被加工物200吸引保持於吸盤10，使環狀框205夾緊於夾緊部12之後，使吸盤10移動至X軸移動單元，使吸盤10上的被加工物200攝像於攝像單元30。控制單元100是執行進行被加工物200與切削刀刃21的對位之對準，邊使吸盤10與切削單元20的切削刀刃21沿著分割預定線202來相對地移動，邊使切削刀刃21切入至分割預定線202。The control unit 100 controls each of the above-mentioned units of the processing device 1 individually so that the processing operation for the workpiece 200 is performed on the processing device 1 . Specifically, the control unit 100 causes the workpiece 200 before cutting to be carried out to the temporary placement unit 80 and temporarily placed on the rail 81 , and the first transfer unit 91 moves the workpiece temporarily placed on the rail 81 200 is moved to suction cup 10. The control unit 100 attracts and holds the workpiece 200 on the suction cup 10, clamps the annular frame 205 on the clamping part 12, moves the suction cup 10 to the X-axis moving unit, and takes an image of the workpiece 200 on the suction cup 10. Camera unit 30. The control unit 100 performs alignment of the workpiece 200 and the cutting blade 21 , and causes the cutting blade 21 to cut in while relatively moving the suction cup 10 and the cutting blade 21 of the cutting unit 20 along the planned division line 202 . to the scheduled dividing line 202.

控制單元100是切削刀刃21切入至全部的分割預定線202之後，解除吸盤10的吸引保持及夾緊部12的夾緊，在第2搬送單元92使吸盤10上的被加工物200搬送至旋轉器台72上。控制單元100是使被加工物200吸引保持於旋轉器台72，在洗淨單元70使被加工物200洗淨之後，解除旋轉器台72的吸引保持，在第1搬送單元91使旋轉器台72上的被加工物200搬送至軌道81上。控制單元100是在卡匣升降機50將支撐軌道81上的被加工物200的環狀框205的下面與和搬出前相同的收容架64的上面定位於同一平面上之後，在暫置單元80將軌道81上的被加工物200搬入至卡匣60內。After the cutting blade 21 cuts into all the planned dividing lines 202, the control unit 100 releases the suction and holding of the suction cup 10 and the clamping of the clamping part 12, and causes the second transport unit 92 to transport the workpiece 200 on the suction cup 10 to the rotating state. On the instrument table 72. The control unit 100 suctions and holds the workpiece 200 on the rotator table 72 . After the washing unit 70 washes the workpiece 200 , the control unit 100 releases the suction and hold of the rotator table 72 , and causes the first transport unit 91 to move the rotator table. The workpiece 200 on the 72 is conveyed to the track 81 . The control unit 100 positions the lower surface of the annular frame 205 of the workpiece 200 on the support rail 81 and the upper surface of the same storage rack 64 as before unloading by the cassette elevator 50, and then the temporary unit 80 The workpiece 200 on the rail 81 is loaded into the cassette 60 .

另外，控制單元100是具有：具有CPU (central processing unit)之類的微處理器的運算處理裝置，及具有ROM(read only memory)或RAM(random access memory)之類的記憶體的記憶裝置，以及輸出入介面裝置的電腦。控制單元100的運算處理裝置是按照被記憶於記憶裝置的電腦程式來實施運算處理，將用以控制加工裝置1的控制訊號經由輸出入介面裝置來輸出至加工裝置1的上述的各單元。In addition, the control unit 100 is a computing processing device having a microprocessor such as a CPU (central processing unit), and a memory device having a memory such as a ROM (read only memory) or a RAM (random access memory), and computers with input/output interface devices. The arithmetic processing device of the control unit 100 performs arithmetic processing according to the computer program stored in the memory device, and outputs control signals for controlling the processing device 1 to the above-mentioned units of the processing device 1 through the input/output interface device.

控制單元100是根據檢測感測器82的檢測結果，判定被加工物200是否被暫置於軌道81上。控制單元100是根據連接至吸盤10的真空吸引源的負壓等來判定吸盤10是否將被加工物200吸引保持於保持面11。控制單元100是根據連接至旋轉器台72的真空吸引源的負壓等來判定旋轉器台72是否將被加工物200吸引保持於保持面71。控制單元100是根據連接至各搬送單元91，92的吸引構件93的真空吸引源的負壓等來判定各搬送單元91，92是否將被加工物200吸引保持於吸引構件93。The control unit 100 determines whether the workpiece 200 is temporarily placed on the track 81 based on the detection result of the detection sensor 82 . The control unit 100 determines whether the suction cup 10 suctions and holds the workpiece 200 on the holding surface 11 based on the negative pressure of the vacuum suction source connected to the suction cup 10 . The control unit 100 determines whether the rotator table 72 suctions and holds the workpiece 200 on the holding surface 71 based on the negative pressure of the vacuum suction source connected to the rotator table 72 or the like. The control unit 100 determines whether each transport unit 91 or 92 suctions and holds the workpiece 200 to the suction member 93 based on the negative pressure of the vacuum suction source connected to the suction member 93 of each transport unit 91 or 92.

加工裝置1具備： 顯示單元110(圖1所示)，其係被連接至控制單元100，且具有顯示加工動作的狀態或畫像等的顯示畫面111； 輸入單元，其係被連接至控制單元100，且用在操作員登錄加工內容資訊等時。 顯示單元110是藉由液晶顯示裝置等所構成。輸入單元是藉由被設在顯示單元110的顯示畫面111的觸控面板或鍵盤等的外部輸入裝置等所構成。Processing device 1 is equipped with: The display unit 110 (shown in FIG. 1 ) is connected to the control unit 100 and has a display screen 111 that displays the status of the processing operation or images; The input unit is connected to the control unit 100 and is used when the operator logs in processing content information and the like. The display unit 110 is composed of a liquid crystal display device or the like. The input unit is configured by an external input device such as a touch panel or a keyboard provided on the display screen 111 of the display unit 110 .

顯示單元110是藉由控制單元100來控制，藉此在加工裝置1的加工動作中圖3所示的顯示資訊的進行狀況顯示畫面112會被顯示於顯示畫面111。進行狀況顯示畫面112是顯示加工裝置1的被加工物200的切削加工的進行狀況者。The display unit 110 is controlled by the control unit 100 , whereby the progress status display screen 112 of the display information shown in FIG. 3 is displayed on the display screen 111 during the processing operation of the processing device 1 . The progress status display screen 112 displays the progress status of the cutting process of the workpiece 200 of the processing device 1 .

如圖3所示般，進行狀況顯示畫面112是具備：用以輸入加工裝置1的切削加工的開始及停止的開始停止輸入區域113、顯示攝像單元30所攝取的畫像的攝像畫像顯示區域114、裝置內地圖120及卡匣內地圖130。As shown in FIG. 3 , the progress status display screen 112 includes a start and stop input area 113 for inputting the start and stop of the cutting process of the processing device 1 , a photographic image display area 114 for displaying the image captured by the imaging unit 30 , The map 120 in the device and the map 130 in the cartridge.

裝置內地圖120是具有：對應於暫置單元的軌道81的暫置對應區域121、對應於第1搬送單元91的第1搬送單元對應區域122、對應於吸盤10的吸盤對應區域123、對應於洗淨單元70的旋轉器台72的洗淨對應區域124及對應於第2搬送單元92的第2搬送單元對應區域125。各對應區域121，122，123，124，125是顯示預定的色或預定的識別標記。在實施形態1中，各對應區域121，122，123，124，125是顯示彼此不同的色301，302，303，304，305。並且，在實施形態1中，裝置內地圖120是具有加工裝置1的各單元的哪個也未對應的空閒區域126。空閒區域126是亦可被用在為了對應於加工裝置1的其他的單元或被追加於加工裝置1的單元。The in-device map 120 has a temporary placement corresponding area 121 corresponding to the rail 81 of the temporary placement unit, a first transportation unit corresponding area 122 corresponding to the first transportation unit 91, a suction cup corresponding area 123 corresponding to the suction cup 10, and a suction cup corresponding area 123 corresponding to the suction cup 10. The washing corresponding area 124 of the rotator table 72 of the washing unit 70 corresponds to the second transport unit corresponding area 125 of the second transport unit 92 . Each corresponding area 121, 122, 123, 124, 125 displays a predetermined color or a predetermined identification mark. In Embodiment 1, the respective corresponding areas 121, 122, 123, 124, and 125 display colors 301, 302, 303, 304, and 305 that are different from each other. Furthermore, in Embodiment 1, the in-device map 120 has an empty area 126 that does not correspond to any of the units of the processing device 1 . The free area 126 can be used for other units corresponding to the processing apparatus 1 or for units added to the processing apparatus 1 .

卡匣內地圖130是具備與收容架64對應的複數的方格131。在實施形態1中，方格131是1對1來與收容架64對應，在顯示畫面111的上下方向排列10個，由下往上依序對應於卡匣60的複數的收容架64之中，從下側的收容架64到上側的收容架64。另外，本說明書是在區別方格131彼此間時，從下者起，由1開始依序在符號131附上大的自然數，以131-1，131-2，131-3･･･131-10來進行說明，在不區別方格131彼此間時，只附上符號131進行說明。The map 130 in the cassette includes a plurality of squares 131 corresponding to the storage rack 64 . In the first embodiment, the grids 131 correspond to the storage racks 64 on a one-to-one basis. Ten blocks are arranged in the vertical direction of the display screen 111 and correspond to the plurality of storage racks 64 of the cassette 60 in order from bottom to top. , from the lower receiving rack 64 to the upper receiving rack 64 . In addition, when distinguishing between squares 131 in this manual, large natural numbers are appended to the symbols 131 in order from 1, starting from the lower one, so that 131-1, 131-2, 131-3･･･131 -10 for explanation. When the squares 131 are not distinguished from each other, only the symbol 131 is attached for explanation.

又，控制單元100是如圖1等所示般，具備設定顯示於顯示畫面111的資訊的顯示資訊設定部101。在顯示資訊設定部101為了將前述的裝置內地圖120及卡匣內地圖130顯示於顯示畫面111，而設定裝置內地圖120及卡匣內地圖130作為顯示資訊。亦即，顯示資訊設定部101是記憶表示裝置內地圖120及卡匣內地圖130的資訊，及用以使裝置內地圖120及卡匣內地圖130顯示於顯示畫面111的程式等。Moreover, the control unit 100 is equipped with the display information setting part 101 which sets the information displayed on the display screen 111, as shown in FIG. 1 etc. In order to display the aforementioned in-device map 120 and in-cassette map 130 on the display screen 111, the display information setting unit 101 sets the in-device map 120 and the in-cassette map 130 as display information. That is, the display information setting unit 101 stores information indicating the in-device map 120 and the in-cassette map 130 , and a program for displaying the in-device map 120 and the in-cassette map 130 on the display screen 111 .

又，顯示資訊設定部101為了表示從卡匣60搬出的被加工物200的現在位置，而設定重疊顯示於顯示畫面111的裝置內地圖120的圖4及圖5所示的被加工物標記140，141作為顯示資訊。在實施形態1中，圖4及圖5所示的被加工物標記140，141是模式性地表示被加工物200及環狀框205的平面形狀。另外，本說明書是在區別被加工物標記140，141所示的被加工物200在切削加工前被收容的收容架64彼此間時，從表示被收容於下面的收容架64的被加工物200者起，由1開始依序在符號140，141附上大的自然數，以140-1，140-2，140-3･･･140-10及141-1，141-2，141-3･･･141-10來進行說明，在不區別被加工物標記140，141所示的被加工物200在切削加工前被收容的收容架64彼此間時，只附上符號140，141進行說明。In addition, the display information setting unit 101 sets the workpiece mark 140 shown in FIGS. 4 and 5 that is superimposed on the in-device map 120 on the display screen 111 to indicate the current position of the workpiece 200 unloaded from the cassette 60 . , 141 as display information. In Embodiment 1, the workpiece marks 140 and 141 shown in FIGS. 4 and 5 schematically represent the planar shapes of the workpiece 200 and the annular frame 205 . In addition, in this description, when the workpiece 200 shown by the workpiece symbols 140 and 141 is distinguished from each other between the storage racks 64 in which the workpiece 200 is stored before the cutting process, the workpiece 200 is shown to be stored in the lower storage rack 64. Starting from 1, append large natural numbers to symbols 140 and 141 in order, with 140-1, 140-2, 140-3･･･140-10 and 141-1, 141-2, 141-3 ･･･141-10 will be explained. If the storage racks 64 in which the workpiece 200 shown by the workpiece symbols 140 and 141 are stored before the cutting process are not distinguished from each other, only the symbols 140 and 141 will be used for explanation. .

顯示資訊設定部101是在對應於被加工物200的加工裝置1內的現在位置之各對應區域121，122，123，124，125重疊顯示被加工物標記140，141。在實施形態1中，圖4所示的被加工物標記140是從卡匣60搬出而被保持於吸盤10之前使用，圖5所示的被加工物標記141是從被保持於吸盤10之後到被搬入卡匣60為止使用。亦即，顯示資訊設定部101是記憶表示被加工物標記140，141的資訊，及用以使被加工物標記140，141重疊顯示於顯示畫面111的對應區域121，122，123，124，125的程式等。The display information setting unit 101 overlays and displays the workpiece marks 140 and 141 in corresponding areas 121, 122, 123, 124, and 125 corresponding to the current position of the workpiece 200 in the processing apparatus 1. In Embodiment 1, the workpiece mark 140 shown in FIG. 4 is used before being carried out from the cassette 60 and held on the suction cup 10 , and the workpiece mark 141 shown in FIG. 5 is used after being held on the suction cup 10 . It is used until it is moved into the cassette 60. That is, the display information setting unit 101 stores information indicating the workpiece marks 140 and 141 and causes the workpiece marks 140 and 141 to be overlapped and displayed in the corresponding areas 121, 122, 123, 124, and 125 of the display screen 111. program etc.

又，顯示資訊設定部101是記憶方格顯示程式150，在加工裝置1的切削加工中實行方格顯示程式150。方格顯示程式150是用以在方格131顯示對應於被收容在方格131所示的卡匣60的收容架64的被加工物200的現在位置之各對應區域121，122，123，124，125的色301，302，303，304，305或預定的識別標記的程式。在實施形態1中，方格顯示程式150是在各方格131顯示與對應於在切削加工前被收容於各方格131所對應的收容架64的被加工物200的加工裝置1內的現在位置之各對應區域121，122，123，124，125對應的色(在實施形態1是與各對應區域121，122，123，124，125相同的色301，302，303，304，305)。In addition, the display information setting unit 101 stores the grid display program 150 and executes the grid display program 150 during the cutting process of the processing device 1 . The grid display program 150 is used to display in the grid 131 corresponding areas 121, 122, 123, 124 corresponding to the current position of the workpiece 200 stored in the storage rack 64 of the cassette 60 shown in the grid 131. , 125 colors 301, 302, 303, 304, 305 or a predetermined identification mark program. In Embodiment 1, the grid display program 150 displays in each grid 131 the current status in the processing device 1 corresponding to the workpiece 200 stored in the storage rack 64 corresponding to each grid 131 before cutting processing. The color corresponding to each corresponding area 121, 122, 123, 124, 125 of the position (in the first embodiment, the same color 301, 302, 303, 304, 305 as each corresponding area 121, 122, 123, 124, 125).

又，方格顯示程式150是用以在表示從卡匣60搬出之後再度回到卡匣60的被加工物200所被收容的收容架64之方格131顯示表示搬入完了的色306或識別標記的程式。方格顯示程式150是在對應於從卡匣60搬出之後再度回到卡匣60的被加工物200所被收容的收容架64之方格131顯示表示搬入完了的色306(例如灰色，在圖3中以密的平行斜線所示)。In addition, the grid display program 150 is used to display the color 306 or the identification mark indicating that the loading is completed on the grid 131 of the storage rack 64 indicating that the workpiece 200 returned to the cassette 60 after being moved out from the cassette 60 is stored. program. The grid display program 150 displays a color 306 (for example, gray, in FIG. 3 shown by dense parallel diagonal lines).

顯示資訊設定部101的機能，是藉由控制單元100的記憶裝置記憶：表示裝置內地圖120的資訊、表示卡匣內地圖130的資訊、表示被加工物標記140，141的資訊、方格顯示程式150，且運算處理裝置按照被記憶於記憶裝置的電腦程式來實施運算處理而實現。The function of the display information setting part 101 is to use the memory device of the control unit 100 to store: information indicating the map 120 in the device, information indicating the map 130 in the cartridge, information indicating the workpiece marks 140 and 141, and grid display. Program 150 is implemented by the arithmetic processing device executing the arithmetic processing according to the computer program stored in the memory device.

又，加工裝置1是裝置本體2上的卡匣60以外會以未圖示的外裝罩所覆蓋，且顯示單元110會被安裝於外裝罩。In addition, the processing device 1 is covered with an exterior cover (not shown) except for the cassette 60 on the device body 2, and the display unit 110 is mounted on the exterior cover.

其次，本說明書是說明前述的構成的加工裝置1的加工動作。圖6是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被暫置於軌道上時的進行狀況顯示畫面的圖。圖7是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被搬送於第1搬送單元時的進行狀況顯示畫面的圖。圖8是表示被收容於圖1所示的加工裝置的卡匣的從下面算起第2個的收容架的被加工物被暫置於軌道上時的進行狀況顯示畫面的圖。圖9是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被保持於吸盤，被收容於從下面算起第2個的收容架的被加工物被搬送於第1搬送單元時的進行狀況顯示畫面的圖。圖10是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被搬送於第2搬送單元，被收容於從下面算起第2個的收容架的被加工物被保持於吸盤，被收容於卡匣的從下面算起第3個的收容架的被加工物被暫置於軌道上時的進行狀況顯示畫面的圖。圖11是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被保持於旋轉器台，被收容於卡匣的從下面算起第3個的收容架的被加工物被搬送於第1搬送單元時的進行狀況顯示畫面的圖。圖12是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被搬送於第1搬送單元，被收容於從下面算起第2個的收容架的被加工物被搬送於第2搬送單元，被收容於卡匣的從下面算起第3個的收容架的被加工物被保持於吸盤時的進行狀況顯示畫面的圖。圖13是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被暫置於軌道上，被收容於從下面算起第2個的收容架的被加工物被保持於旋轉器台時的進行狀況顯示畫面的圖。圖14是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被搬入至卡匣內，被收容於從下面算起第4個的收容架的被加工物被暫置於軌道上時的進行狀況顯示畫面的圖。圖15是表示被收容於圖1所示的加工裝置的卡匣的最上的收容架的被加工物在切削加工後被暫置於軌道上時的進行狀況顯示畫面的圖。 Next, this description explains the processing operation of the processing device 1 having the above-mentioned structure. FIG. 6 is a diagram showing a progress status display screen when the workpiece accommodated in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is temporarily placed on the rail. 7 is a diagram illustrating a progress display screen when the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is transported to the first transport unit. 8 is a diagram illustrating a progress display screen when the workpiece stored in the second storage rack from the bottom of the cassette of the processing device shown in FIG. 1 is temporarily placed on the rail. Fig. 9 is a diagram showing that the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in Fig. 1 is held by a suction cup, and the workpiece stored in the second storage rack from the bottom is held; Diagram of the progress status display screen when transporting to the first transport unit. FIG. 10 shows that the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is transported to the second transport unit, and the workpiece stored in the second storage rack from the bottom is shown. The picture of the progress display screen when the workpiece is held by the suction cup and is temporarily placed on the rail while the workpiece stored in the third storage rack from the bottom of the cassette is placed. FIG. 11 shows that the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is held on the rotator table and stored in the third storage rack from the bottom of the cassette. Diagram of the progress status display screen when the workpiece is transported to the first transport unit. FIG. 12 shows that the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is transported to the first transport unit, and the workpiece stored in the second storage rack from the bottom is shown. This is a diagram of the progress display screen when the workpiece is transported to the second transport unit and the workpiece stored in the third storage rack from the bottom of the cassette is held on the suction cup. FIG. 13 shows a workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 being temporarily placed on a rail and being processed in the second storage rack from the bottom. Diagram of the progress display screen when the object is held on the rotator table. FIG. 14 shows a workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 being carried into the cassette and being processed in the fourth storage rack from the bottom. Picture of the progress display screen when the object is temporarily placed on the track. FIG. 15 is a diagram showing a progress display screen when the workpiece accommodated in the uppermost storage rack of the cassette of the processing device shown in FIG. 1 is temporarily placed on the rail after cutting processing.

首先，在加工動作，操作員會將加工內容資訊登錄至控制單元100，將切削加工前的被加工物200收容於卡匣60，而將卡匣60設置於卡匣升降機50的上面。然後，加工裝置1是一旦受理來自操作員的加工動作的開始指示，則開始加工動作。在實施形態1中，加工裝置1的控制單元100是在顯示單元110的顯示畫面111顯示進行狀況顯示畫面112，一旦受理操作員對於開始停止輸入區域113的操作，則開始加工裝置1的加工動作。在實施形態1中，在加工動作，加工裝置1是依序從被收容於卡匣60的複數的收容架64的被加工物200之中被收容於下側的收容架64的被加工物200到被收容於上側的收容架64的被加工物200來實施切削加工，但在本發明中，加工裝置1切削加工卡匣60內的被加工物200的順序是不被限定於實施形態1所示的順序。 First, during the processing operation, the operator will register the processing content information into the control unit 100, store the workpiece 200 before cutting in the cassette 60, and set the cassette 60 above the cassette lift 50. Then, upon receiving the instruction to start the processing operation from the operator, the processing device 1 starts the processing operation. In Embodiment 1, the control unit 100 of the processing device 1 displays the progress status display screen 112 on the display screen 111 of the display unit 110, and starts the processing operation of the processing device 1 upon accepting the operator's operation of the start/stop input area 113. . In Embodiment 1, during the processing operation, the processing device 1 sequentially selects the workpiece 200 stored in the lower storage rack 64 from among the workpieces 200 stored in the plurality of storage racks 64 of the cassette 60 The cutting process is performed on the workpiece 200 stored in the upper storage rack 64. However, in the present invention, the order in which the processing device 1 cuts the workpiece 200 in the cassette 60 is not limited to that in the first embodiment. the order shown.

加工裝置1是一旦開始加工動作，則在卡匣升降機50使卡匣60定位於支撐被收容在最下的收容架64-1的被加工物200-1之環狀框205的下面會成為與軌道81的上 面同一平面上的位置。控制單元100是在暫置單元80的搬出入單元83使被收容於最下的收容架64-1的被加工物200-1從卡匣60搬出，使搬出的被加工物200-1暫置於軌道81上。控制單元100是一旦檢測感測器82檢測出被暫置於軌道81上的被加工物200-1，則如圖6所示般，在進行狀況顯示畫面112的暫置對應區域121重疊顯示表示被收容於最下的收容架64-1的被加工物200-1的被加工物標記140-1。又，控制單元100是在對應於複數的方格131之中最下的收容架64-1之方格131-1顯示與暫置對應區域121相同的色301。 Once the processing operation of the processing device 1 is started, the cassette elevator 50 positions the cassette 60 below the annular frame 205 that supports the workpiece 200-1 stored in the lowermost storage rack 64-1. Track 81 on position on the same plane. The control unit 100 unloads the workpiece 200-1 stored in the lowermost storage rack 64-1 from the cassette 60 in the unloading/unloading unit 83 of the temporary storage unit 80, and temporarily stores the unloaded workpiece 200-1. On track 81. Once the detection sensor 82 detects the workpiece 200 - 1 temporarily placed on the track 81 , the control unit 100 displays the overlapping display in the temporary placement corresponding area 121 of the progress status display screen 112 as shown in FIG. 6 The workpiece mark 140-1 of the workpiece 200-1 stored in the lowermost storage rack 64-1. Furthermore, the control unit 100 displays the same color 301 as the temporary corresponding area 121 in the square 131 - 1 corresponding to the lowermost storage rack 64 - 1 among the plurality of squares 131 .

控制單元100是使支撐被暫置於暫置單元80的軌道81上的被加工物200-1之環狀框205吸引保持於第1搬送單元91，在X軸移動單元等使第1搬送單元91與吸盤10相對地移動，使第1搬送單元91朝向吸盤10的上方而移動。控制單元100是一旦根據連接至第1搬送單元91的吸引構件93之真空吸引源的負壓等來檢測出第1搬送單元91吸引保持環狀框205，則如圖7所示般，在進行狀況顯示畫面112的第1搬送單元對應區域122重疊顯示表示被收容於最下的收容架64-1的被加工物200-1的被加工物標記140-1。又，控制單元100是在對應於複數的方格131之中最下的收容架64-1之方格131-1顯示與第1搬送單元對應區域122相同的色302。 The control unit 100 attracts and holds the annular frame 205 supporting the workpiece 200 - 1 temporarily placed on the rail 81 of the temporary holding unit 80 in the first conveying unit 91 , and moves the first conveying unit in the X-axis moving unit and the like. 91 moves relatively to the suction cup 10 so that the first transport unit 91 moves above the suction cup 10 . Once the control unit 100 detects that the first transport unit 91 suctions and holds the annular frame 205 based on the negative pressure of the vacuum suction source connected to the suction member 93 of the first transport unit 91, the control unit 100 proceeds as shown in FIG. 7 The first transport unit corresponding area 122 of the status display screen 112 displays a workpiece mark 140-1 indicating the workpiece 200-1 stored in the lowermost storage rack 64-1 in a superimposed manner. Furthermore, the control unit 100 displays the same color 302 as the first transport unit corresponding area 122 in the square 131-1 corresponding to the lowermost storage rack 64-1 among the plurality of squares 131.

控制單元100是在卡匣升降機50使卡匣60定位於支撐被收容於從下面算起第2個的收容架64-2的被加工物200-2之環狀框205的下面會成為與軌道81的上面同一平面的位置。控制單元100是在暫置單元80的搬出入單元83使被收容於從下面算起第2個的收容架64-2的被加工物200-2從卡匣60搬出，使搬出的被加工物200-2暫置於軌道81上。控制單元100是一旦檢測感測器82檢測出被暫置於軌道81上的被加工物200-2，則如圖8所示般，在進行狀況顯示畫面112的暫置對應區域121重疊顯示表示被收容於從下面算起第2個的收容架64-2的被加工物200-2的被加工物標記140-2。又，控制單元100是在對應於複數的方格131之中從下面算起第2個的收容架64-2之方格131-2顯示與暫置對應區域121相同的色301。The control unit 100 positions the cassette 60 in the cassette elevator 50 so that the lower surface of the annular frame 205 supporting the workpiece 200-2 stored in the second storage rack 64-2 from the bottom will become a track. The position of the same plane above 81. The control unit 100 unloads the workpiece 200 - 2 stored in the second storage rack 64 - 2 from the bottom in the unloading and unloading unit 83 of the temporary storage unit 80 from the cassette 60 . 200-2 is temporarily placed on track 81. Once the detection sensor 82 detects the workpiece 200 - 2 temporarily placed on the rail 81 , the control unit 100 displays the overlapping display in the temporary placement corresponding area 121 of the progress status display screen 112 as shown in FIG. 8 The workpiece mark 140-2 of the workpiece 200-2 stored in the second storage rack 64-2 from the bottom. Furthermore, the control unit 100 displays the same color 301 as the temporary corresponding area 121 on the square 131 - 2 corresponding to the second storage rack 64 - 2 from the bottom among the plurality of squares 131 .

控制單元100是在第1搬送單元91使被加工物200-1載置於吸盤10的保持面11，使被加工物200-1吸引保持於吸盤10，且使環狀框205夾緊於夾緊部12。控制單元100是一旦根據連接至吸盤10的真空吸引源的負壓等來檢測出吸盤10吸引保持被加工物200-1，則如圖9所示般，在進行狀況顯示畫面112的吸盤對應區域123重疊顯示表示被收容於最下的收容架64-1的被加工物200-1的被加工物標記141-1。又，控制單元100是在對應於複數的方格131之中最下的收容架64-1之方格131-1顯示與吸盤對應區域123相同的色303。The control unit 100 places the workpiece 200-1 on the holding surface 11 of the suction cup 10 in the first transport unit 91, sucks and holds the workpiece 200-1 on the suction cup 10, and clamps the annular frame 205 on the clamp. Tight part 12. Once the control unit 100 detects that the suction cup 10 suctions and holds the workpiece 200 - 1 based on the negative pressure of the vacuum suction source connected to the suction cup 10 , as shown in FIG. 9 , in the suction cup corresponding area of the progress status display screen 112 123 displays the workpiece mark 141-1 indicating the workpiece 200-1 stored in the lowermost storage rack 64-1 in a superimposed manner. Furthermore, the control unit 100 displays the same color 303 as the suction cup corresponding area 123 in the square 131-1 corresponding to the lowermost storage rack 64-1 among the plurality of squares 131.

控制單元100是在X軸移動單元使吸盤10朝向加工區域而移動，在攝像單元30使攝取被加工物200-1，根據攝像單元30所攝取的畫像來執行對準。此時，控制單元100是在進行狀況顯示畫面112的攝像畫像顯示區域114顯示攝像單元30所攝取的畫像。The control unit 100 uses the X-axis moving unit to move the suction cup 10 toward the processing area, uses the imaging unit 30 to capture the object to be processed 200 - 1 , and performs alignment based on the image captured by the imaging unit 30 . At this time, the control unit 100 displays the image captured by the imaging unit 30 in the imaging image display area 114 of the status display screen 112 .

控制單元100是邊使被加工物200-1與切削單元20沿著分割預定線202來相對地移動，邊使切削刀刃21切入至各分割預定線202而將被加工物200-1分割成各個的裝置203。控制單元100是一旦使切削刀刃21切入至吸引保持於吸盤10的被加工物200-1的全部的分割預定線202，則解除吸盤10的吸引保持及夾緊部12的夾緊。The control unit 100 moves the workpiece 200-1 and the cutting unit 20 relatively along the planned dividing lines 202, and causes the cutting blade 21 to cut into the planned dividing lines 202 to divide the workpiece 200-1 into individual pieces. device 203. The control unit 100 releases the suction and holding of the suction cup 10 and the clamping of the clamping part 12 once the cutting blade 21 cuts into the entire planned dividing line 202 of the workpiece 200 - 1 held by the suction cup 10 .

又，控制單元100是使支撐被暫置於暫置單元80的軌道81上的被加工物200-2之環狀框205吸引保持於第1搬送單元91，在X軸移動單元等使第1搬送單元91與吸盤10相對地移動，使第1搬送單元91朝向吸盤10的上方而移動。控制單元100是一旦根據連接至第1搬送單元91的吸引構件93之真空吸引源的負壓等來檢測出第1搬送單元91吸引保持環狀框205，則如圖9所示般，在進行狀況顯示畫面112的第1搬送單元對應區域122重疊顯示表示被收容於從下面算起第2個的收容架64-2的被加工物200-2的被加工物標記140-2。又，控制單元100是在對應於複數的方格131之中從下面算起第2個的收容架64-2之方格131-2顯示與第1搬送單元對應區域122相同的色302。Furthermore, the control unit 100 attracts and holds the annular frame 205 supporting the workpiece 200-2 temporarily placed on the rail 81 of the temporary holding unit 80 in the first conveying unit 91, and moves the first conveying unit 91 in the X-axis moving unit or the like. The transport unit 91 moves relatively to the suction cup 10 so that the first transport unit 91 moves above the suction cup 10 . Once the control unit 100 detects that the first transport unit 91 suctions and holds the annular frame 205 based on the negative pressure of the vacuum suction source connected to the suction member 93 of the first transport unit 91, the control unit 100 proceeds as shown in FIG. 9 The first transport unit corresponding area 122 of the status display screen 112 displays a workpiece mark 140-2 indicating the workpiece 200-2 stored in the second storage rack 64-2 from the bottom in a superimposed manner. Furthermore, the control unit 100 displays the same color 302 as the first transport unit corresponding area 122 in the square 131-2 corresponding to the second storage rack 64-2 from the bottom among the plurality of squares 131.

控制單元100是使支撐被載置於吸盤10的保持面11的被加工物200-1之環狀框205吸引保持於第2搬送單元92，使第2搬送單元92朝向旋轉器台72的上方而移動。控制單元100是一旦根據連接至第2搬送單元92的吸引構件93之真空吸引源的負壓等來檢測出第2搬送單元92吸引保持環狀框205，則如圖10所示般，在進行狀況顯示畫面112的第2搬送單元對應區域125重疊顯示表示被收容於最下的收容架64-1的被加工物200-1的被加工物標記141-1。又，控制單元100是在對應於複數的方格131之中最下的收容架64-1之方格131-1顯示與第2搬送單元對應區域125相同的色305。The control unit 100 causes the annular frame 205 that supports the workpiece 200 - 1 placed on the holding surface 11 of the suction cup 10 to attract and hold the workpiece 200 - 1 placed on the holding surface 11 of the suction cup 10 to attract and hold the second transport unit 92 so that the second transport unit 92 faces above the rotator table 72 And move. Once the control unit 100 detects that the second transport unit 92 suctions and holds the annular frame 205 based on the negative pressure of the vacuum suction source connected to the suction member 93 of the second transport unit 92, the control unit 100 proceeds as shown in FIG. 10 In the second transport unit corresponding area 125 of the status display screen 112, a workpiece mark 141-1 indicating the workpiece 200-1 stored in the lowermost storage rack 64-1 is displayed in a superimposed manner. Furthermore, the control unit 100 displays the same color 305 as the second transport unit corresponding area 125 in the square 131-1 corresponding to the lowermost storage rack 64-1 among the plurality of squares 131.

控制單元100是在第1搬送單元91使被加工物200-2載置於吸盤10的保持面11，使被加工物200-2吸引保持於吸盤10，且使環狀框205夾緊於夾緊部12。控制單元100是一旦根據連接至吸盤10的真空吸引源的負壓等來檢測出吸盤10吸引保持被加工物200-2，則如圖10所示般，在進行狀況顯示畫面112的吸盤對應區域123重疊顯示表示被收容於從下面算起第2個的收容架64-2的被加工物200-2的被加工物標記141-2。又，控制單元100是在對應於複數的方格131之中從下面算起第2個的收容架64-2之方格131-2顯示與吸盤對應區域123相同的色303。控制單元100是與被加工物200-1同樣，將被加工物200-2分割成各個的裝置203。控制單元100是一旦使切削刀刃21切入至吸引保持於吸盤10的被加工物200-2的全部的分割預定線202，則解除吸盤10的吸引保持及夾緊部12的夾緊。The control unit 100 places the workpiece 200-2 on the holding surface 11 of the suction cup 10 in the first transport unit 91, suctions and holds the workpiece 200-2 on the suction cup 10, and clamps the annular frame 205 on the clamp. Tight part 12. Once the control unit 100 detects that the suction cup 10 suctions and holds the workpiece 200 - 2 based on the negative pressure of the vacuum suction source connected to the suction cup 10 , as shown in FIG. 10 , in the suction cup corresponding area of the progress status display screen 112 123 superimposes the workpiece mark 141-2 indicating the workpiece 200-2 stored in the second storage rack 64-2 from the bottom. Furthermore, the control unit 100 displays the same color 303 as the suction cup corresponding area 123 in the square 131 - 2 corresponding to the second storage rack 64 - 2 from the bottom among the plurality of squares 131 . The control unit 100 is a device 203 that divides the workpiece 200-2 into individual pieces like the workpiece 200-1. The control unit 100 releases the suction and holding of the suction cup 10 and the clamping of the clamping part 12 once the cutting blade 21 cuts into the entire planned dividing line 202 of the workpiece 200 - 2 held by the suction cup 10 .

又，控制單元100是在卡匣升降機50使卡匣60定位於支撐被收容於從下面算起第3個的收容架64-3的被加工物200-3之環狀框205的下面會成為與軌道81的上面同一平面的位置。控制單元100是在暫置單元80的搬出入單元83使被收容於從下面算起第3個的收容架64-3的被加工物200-3從卡匣60搬出，使搬出的被加工物200-3暫置於軌道81上。控制單元100是一旦檢測感測器82檢測出被暫置於軌道81上的被加工物200-3，則如圖10所示般，在進行狀況顯示畫面112的暫置對應區域121重疊顯示表示被收容於從下面算起第3個的收容架64-3的被加工物200-3的被加工物標記140-3。又，控制單元100是在對應於複數的方格131之中從下面算起第3個的收容架64-3之方格131-3顯示與暫置對應區域121相同的色301。Furthermore, when the cassette elevator 50 positions the cassette 60 below the annular frame 205 that supports the workpiece 200-3 stored in the third storage rack 64-3 from the bottom, the control unit 100 will The position is on the same plane as the top of track 81. The control unit 100 unloads the workpiece 200 - 3 stored in the third storage rack 64 - 3 from the bottom in the unloading and unloading unit 83 of the temporary storage unit 80 from the cassette 60 . 200-3 is temporarily placed on track 81. Once the detection sensor 82 detects the workpiece 200 - 3 temporarily placed on the track 81 , the control unit 100 displays the overlapping display in the temporary placement corresponding area 121 of the progress status display screen 112 as shown in FIG. 10 The workpiece mark 140-3 of the workpiece 200-3 stored in the third storage rack 64-3 from the bottom is the workpiece mark 140-3. Furthermore, the control unit 100 displays the same color 301 as the temporary corresponding area 121 in the square 131 - 3 corresponding to the third storage rack 64 - 3 from the bottom among the plurality of squares 131 .

控制單元100是在第2搬送單元92使被加工物200-1載置於旋轉器台72的保持面71，使被加工物200-1吸引保持於旋轉器台72。控制單元100是一旦根據連接至旋轉器台72的真空吸引源的負壓等來檢測出旋轉器台72吸引保持被加工物200-1，則如圖11所示般，在進行狀況顯示畫面112的洗淨對應區域124重疊顯示表示被收容於最下的收容架64-1的被加工物200-1的被加工物標記141-1。又，控制單元100是在對應於複數的方格131之中最下的收容架64-1之方格131-1顯示與洗淨對應區域124相同的色304。控制單元100是在洗淨單元70邊使旋轉器台72繞著軸心旋轉，邊從洗淨液供給噴嘴供給洗淨液，而使被加工物200-1洗淨。控制單元100是在洗淨單元70使被加工物200-1預定時間洗淨之後，使旋轉器台72的旋轉及洗淨液的供給停止，解除旋轉器台72的吸引保持。The control unit 100 places the workpiece 200-1 on the holding surface 71 of the rotator table 72 in the second transport unit 92, and attracts and holds the workpiece 200-1 on the rotator table 72. Once the control unit 100 detects that the rotator table 72 suctions and holds the workpiece 200 - 1 based on the negative pressure of the vacuum suction source connected to the rotator table 72 , the control unit 100 displays the progress status display screen 112 as shown in FIG. 11 The washing corresponding area 124 displays a workpiece mark 141-1 indicating the workpiece 200-1 stored in the lowermost storage rack 64-1 in a superimposed manner. Furthermore, the control unit 100 displays the same color 304 as the wash corresponding area 124 in the square 131 - 1 corresponding to the lowermost storage rack 64 - 1 among the plurality of squares 131 . The control unit 100 washes the workpiece 200 - 1 by supplying the cleaning liquid from the cleaning liquid supply nozzle in the cleaning unit 70 while rotating the rotator table 72 around the axis. After the washing unit 70 washes the workpiece 200 - 1 for a predetermined time, the control unit 100 stops the rotation of the rotator table 72 and the supply of the cleaning liquid, and releases the suction and holding of the rotator table 72 .

又，控制單元100是使支撐被暫置於暫置單元80的軌道81上的被加工物200-3之環狀框205吸引保持於第1搬送單元91，在X軸移動單元等使第1搬送單元91與吸盤10相對地移動，使第1搬送單元91朝向吸盤10的上方而移動。控制單元100是一旦根據連接至第1搬送單元91的吸引構件93之真空吸引源的負壓等來檢測出第1搬送單元91吸引保持環狀框205，則如圖11所示般，在進行狀況顯示畫面112的第1搬送單元對應區域122重疊顯示表示被收容於從下面算起第3個的收容架64-3的被加工物200-3的被加工物標記140-3。又，控制單元100是在對應於複數的方格131之中從下面算起第3個的收容架64-3之方格131-3顯示與第1搬送單元對應區域122相同的色302。Furthermore, the control unit 100 attracts and holds the annular frame 205 supporting the workpiece 200-3 temporarily placed on the rail 81 of the temporary holding unit 80 in the first conveying unit 91, and moves the first conveying unit 91 in the X-axis moving unit or the like. The transport unit 91 moves relatively to the suction cup 10 so that the first transport unit 91 moves above the suction cup 10 . Once the control unit 100 detects that the first transport unit 91 suctions and holds the annular frame 205 based on the negative pressure of the vacuum suction source connected to the suction member 93 of the first transport unit 91, the control unit 100 proceeds as shown in FIG. 11 The first transport unit corresponding area 122 of the status display screen 112 displays a workpiece mark 140-3 indicating the workpiece 200-3 stored in the third storage rack 64-3 from the bottom in a superimposed manner. Furthermore, the control unit 100 displays the same color 302 as the first transport unit corresponding area 122 in the square 131-3 corresponding to the third storage rack 64-3 from the bottom among the plurality of squares 131.

控制單元100是使支撐被載置於吸盤10的保持面11的被加工物200-2之環狀框205吸引保持於第2搬送單元92，使第2搬送單元92朝向旋轉器台72的上方而移動。控制單元100是一旦根據連接至第2搬送單元92的吸引構件93之真空吸引源的負壓等來檢測出第2搬送單元92吸引保持環狀框205，則如圖12所示般，在進行狀況顯示畫面112的第2搬送單元對應區域125重疊顯示表示被收容於從下面算起第2個的收容架64-2的被加工物200-2的被加工物標記141-2。又，控制單元100是在對應於複數的方格131之中從下面算起第2個的收容架64-2之方格131-2顯示與第2搬送單元對應區域125相同的色305。The control unit 100 causes the annular frame 205 that supports the workpiece 200 - 2 placed on the holding surface 11 of the suction cup 10 to attract and hold the workpiece 200 - 2 placed on the holding surface 11 of the suction cup 10 to attract and hold the second transport unit 92 so that the second transport unit 92 faces above the rotator table 72 And move. Once the control unit 100 detects that the second transport unit 92 suctions and holds the annular frame 205 based on the negative pressure of the vacuum suction source connected to the suction member 93 of the second transport unit 92, the control unit 100 proceeds as shown in FIG. 12 The second transport unit corresponding area 125 of the status display screen 112 displays a workpiece mark 141-2 indicating the workpiece 200-2 stored in the second storage rack 64-2 from the bottom in a superimposed manner. Furthermore, the control unit 100 displays the same color 305 as the second transport unit corresponding area 125 on the square 131 - 2 corresponding to the second storage rack 64 - 2 from the bottom among the plurality of squares 131 .

控制單元100是在第1搬送單元91使被加工物200-3載置於吸盤10的保持面11，使被加工物200-3吸引保持於吸盤10，且使環狀框205夾緊於夾緊部12。控制單元100是一旦根據連接至吸盤10的真空吸引源的負壓等來檢測出吸盤10吸引保持被加工物200-3，則如圖12所示般，在進行狀況顯示畫面112的吸盤對應區域123重疊顯示表示被收容於從下面算起第3個的收容架64-2的被加工物200-3的被加工物標記141-3。又，控制單元100是在對應於複數的方格131之中從下面算起第3個的收容架64-3之方格131-3顯示與吸盤對應區域123相同的色303。控制單元100是與被加工物200-1，200-2同樣，將被加工物200-3分割成各個的裝置203。控制單元100是一旦將吸引保持於吸盤10的被加工物200-3分割成各個的裝置203，則解除吸盤10的吸引保持及夾緊部12的夾緊。The control unit 100 places the workpiece 200-3 on the holding surface 11 of the suction cup 10 in the first transport unit 91, sucks and holds the workpiece 200-3 on the suction cup 10, and clamps the annular frame 205 on the clamp. Tight part 12. Once the control unit 100 detects that the suction cup 10 suctions and holds the workpiece 200 - 3 based on the negative pressure of the vacuum suction source connected to the suction cup 10 , as shown in FIG. 12 , in the suction cup corresponding area of the progress status display screen 112 123 superimposes the workpiece mark 141-3 indicating the workpiece 200-3 stored in the third storage rack 64-2 from the bottom. Furthermore, the control unit 100 displays the same color 303 as the suction cup corresponding area 123 in the square 131 - 3 corresponding to the third storage rack 64 - 3 from the bottom among the plurality of squares 131 . The control unit 100 is a device 203 that divides the workpiece 200-3 into individual pieces like the workpieces 200-1 and 200-2. The control unit 100 is a device 203 that once separates the workpiece 200 - 3 held by the suction cup 10 into individual parts, and then releases the suction and holding of the suction cup 10 and the clamping of the clamping part 12 .

又，控制單元100是將支撐被載置於旋轉器台72上的被加工物200-1之環狀框205吸引保持於第1搬送單元91，使第1搬送單元91朝向暫置單元80的軌道81的上方而移動。控制單元100是一旦根據連接至第1搬送單元91的吸引構件93之真空吸引源的負壓等來檢測出第1搬送單元91吸引保持環狀框205，則如圖12所示般，在進行狀況顯示畫面112的第1搬送單元對應區域122重疊顯示表示被收容於最下的收容架64-1的被加工物200-1的被加工物標記141-1。又，控制單元100是在對應於複數的方格131之中最下的收容架64-1之方格131-1顯示與第1搬送單元對應區域122相同的色302。Furthermore, the control unit 100 attracts and holds the annular frame 205 supporting the workpiece 200 - 1 placed on the rotator table 72 to the first transport unit 91 so that the first transport unit 91 faces the temporary storage unit 80 move above the track 81. Once the control unit 100 detects that the first transport unit 91 suctions and holds the annular frame 205 based on the negative pressure of the vacuum suction source connected to the suction member 93 of the first transport unit 91, the control unit 100 proceeds as shown in FIG. 12 The first transport unit corresponding area 122 of the status display screen 112 displays a workpiece mark 141-1 indicating the workpiece 200-1 stored in the lowermost storage rack 64-1 in a superimposed manner. Furthermore, the control unit 100 displays the same color 302 as the first transport unit corresponding area 122 in the square 131-1 corresponding to the lowermost storage rack 64-1 among the plurality of squares 131.

控制單元100是在第2搬送單元92使被加工物200-2載置於旋轉器台72的保持面71，使被加工物200-2吸引保持於旋轉器台72。控制單元100是一旦根據連接至旋轉器台72的真空吸引源的負壓等來檢測出旋轉器台72吸引保持被加工物200-2，則如圖13所示般，在進行狀況顯示畫面112的洗淨對應區域124重疊顯示表示被收容於從下面算起第2個的收容架64-2的被加工物200-2的被加工物標記141-2。又，控制單元100是在對應於複數的方格131之中從下面算起第2個的收容架64-2之方格131-2顯示與洗淨對應區域124同樣的色304。控制單元100是與被加工物200-1同樣，在洗淨單元70使被加工物200-2洗淨，一旦洗淨結束，則解除旋轉器台72的吸引保持。The control unit 100 places the workpiece 200-2 on the holding surface 71 of the rotator table 72 in the second transport unit 92, and attracts and holds the workpiece 200-2 on the rotator table 72. Once the control unit 100 detects that the rotator table 72 suctions and holds the workpiece 200 - 2 based on the negative pressure of the vacuum suction source connected to the rotator table 72 , the control unit 100 displays the progress status display screen 112 as shown in FIG. 13 The cleaning corresponding area 124 displays a workpiece mark 141-2 indicating the workpiece 200-2 stored in the second storage rack 64-2 from the bottom in a superimposed manner. Furthermore, the control unit 100 displays the same color 304 as the washing corresponding area 124 in the square 131-2 corresponding to the second storage rack 64-2 from the bottom among the plurality of squares 131. The control unit 100 washes the workpiece 200-2 in the washing unit 70 in the same manner as the workpiece 200-1, and releases the suction and holding of the rotator table 72 once the washing is completed.

又，控制單元100是在第1搬送單元91使被加工物200-1載置於暫置單元80的軌道81上，一旦檢測感測器82檢測出被載置於軌道81上的被加工物200-1，則如圖13所示般，在進行狀況顯示畫面112的暫置對應區域121重疊顯示表示被收容於最下的收容架64-1的被加工物200-1的被加工物標記141-1。又，控制單元100是在對應於複數的方格131之中最下的收容架64-1之方格131-1顯示與暫置對應區域121相同的色301。In addition, the control unit 100 places the workpiece 200-1 on the rail 81 of the temporary placement unit 80 in the first transport unit 91. Once the detection sensor 82 detects the workpiece 200-1 placed on the rail 81, 200-1, as shown in FIG. 13, the workpiece mark indicating the workpiece 200-1 accommodated in the lowermost storage rack 64-1 is superimposed and displayed in the temporary corresponding area 121 of the progress status display screen 112. 141-1. Furthermore, the control unit 100 displays the same color 301 as the temporary corresponding area 121 in the square 131 - 1 corresponding to the lowermost storage rack 64 - 1 among the plurality of squares 131 .

控制單元100是在卡匣升降機50使卡匣60定位於收容被載置於軌道81上的被加工物200-1的最下的收容架64-1的上面會成為與軌道81的上面同一平面上的位置。控制單元100是在暫置單元80的搬出入單元83使軌道81上的被加工物200-1搬入至最下的收容架64-1。控制單元100是一旦檢測感測器82不檢測出被暫置於軌道81上的被加工物200-1，則如圖14所示般，在對應於複數的方格131之中最下的收容架64-1之方格131-1顯示表示搬入完了的色306。The control unit 100 positions the cassette 60 in the cassette lift 50 so that the upper surface of the lowermost storage rack 64-1 that accommodates the workpiece 200-1 placed on the rail 81 becomes the same plane as the upper surface of the rail 81. position on. The control unit 100 carries the workpiece 200-1 on the rail 81 into the lowermost storage rack 64-1 in the loading/unloading unit 83 of the temporary storage unit 80. Once the detection sensor 82 does not detect the workpiece 200 - 1 temporarily placed on the track 81 , the control unit 100 stores the lowermost one among the squares 131 corresponding to the plurality as shown in FIG. 14 The square 131-1 of the shelf 64-1 displays the color 306 indicating that the move-in is completed.

控制單元100是在卡匣升降機50使卡匣60定位於支撐被收容在從下面算起第4個的收容架64-4的被加工物200-4之環狀框205的下面會成為與軌道81的上面同一平面的位置。控制單元100是在暫置單元80的搬出入單元83使被收容於從下面算起第4個的收容架64-4的被加工物200-4從卡匣60搬出，使搬出的被加工物200-4暫置於軌道81上。控制單元100是一旦檢測感測器82檢測出被暫置於軌道81上的被加工物200-4，則如圖14所示般，在進行狀況顯示畫面112的暫置對應區域121重疊顯示表示被收容於從下面算起第4個的收容架64-4的被加工物200-4的被加工物標記140-4。又，控制單元100是在對應於複數的方格131之中從下面算起第4個的收容架64-4之方格131-4顯示與暫置對應區域121相同的色301。The control unit 100 positions the cassette 60 in the cassette elevator 50 so that the lower surface of the annular frame 205 supporting the workpiece 200-4 accommodated in the fourth storage rack 64-4 from the bottom becomes the track. The position of the same plane above 81. The control unit 100 unloads the workpiece 200 - 4 stored in the fourth storage rack 64 - 4 from the bottom in the unloading and unloading unit 83 of the temporary storage unit 80 from the cassette 60 . 200-4 is temporarily placed on track 81. Once the detection sensor 82 detects the workpiece 200 - 4 temporarily placed on the rail 81 , the control unit 100 displays the overlapping display in the temporary placement corresponding area 121 of the progress status display screen 112 as shown in FIG. 14 The workpiece mark 140-4 of the workpiece 200-4 accommodated in the fourth storage rack 64-4 from the bottom. Furthermore, the control unit 100 displays the same color 301 as the temporary corresponding area 121 on the square 131 - 4 corresponding to the fourth storage rack 64 - 4 from the bottom among the plurality of squares 131 .

如此，加工裝置1是在顯示單元110的顯示畫面111上的進行狀況顯示畫面112的卡匣內地圖130的各方格131顯示有對應於被收容在方格131所示的卡匣60的收容架64的被加工物200的現在位置之對應區域121，122，123，124，125的色301，302，303，304，305。又，加工裝置1是在表示從卡匣60搬出之後再度回到卡匣60的被加工物200所被收容的收容架64之方格131顯示有表示搬入完了的色306。In this way, the processing apparatus 1 displays, on each square 131 of the cassette map 130 of the progress status display screen 112 on the display screen 111 of the display unit 110, the contents corresponding to the cassettes 60 accommodated in the squares 131. The colors 301, 302, 303, 304, and 305 of the regions 121, 122, 123, 124, and 125 correspond to the current position of the workpiece 200 on the rack 64. In addition, in the processing apparatus 1, the color 306 indicating that the loading is completed is displayed on the square 131 of the storage rack 64 indicating that the workpiece 200 that is returned to the cassette 60 after being carried out from the cassette 60 is stored.

又，加工裝置1是將被加工物200從卡匣60依序搬送至暫置單元80的軌道81上、第1搬送單元91、吸盤10、第2搬送單元92、旋轉器台72、第1搬送單元91、暫置單元80的軌道81上、卡匣60，而切削加工。在實施形態1中，控制單元100是從卡匣60內下依序切削加工被加工物200，一旦檢測感測器82檢測出被收容於被暫置在軌道81上的從下面算起第10個的收容架64-10的切削加工完了的被加工物200-10，則如圖15所示，在進行狀況顯示畫面112的暫置對應區域121重疊顯示表示被收容於從下面算起第10個的收容架64-10的被加工物200-10的被加工物標記141-10。又，控制單元100是在對應於複數的方格131之中從下面算起第10個的收容架64-10之方格131-10顯示與暫置對應區域121相同的色301。此時，控制單元100是如圖15所示般，在從對應於複數的方格131之中最下的收容架64-1之方格131-1到對應於從下面算起第9個的收容架64-9之方格131-9顯示表示搬入完了的色306。控制單元100是在卡匣升降機50使卡匣60定位於收容被載置於軌道81上的被加工物200-10的最上的收容架64-10的上面會成為與軌道81的上面同一平面上的位置。控制單元100是在暫置單元80的搬出入單元83使軌道81上的被加工物200-10搬入至最上的收容架64-10。如此，加工裝置1的控制單元100是一旦卡匣60內的全部的被加工物200的切削加工完了，則結束加工動作。In addition, the processing device 1 sequentially transports the workpiece 200 from the cassette 60 to the rail 81 of the temporary storage unit 80, the first transport unit 91, the suction cup 10, the second transport unit 92, the rotator table 72, and the first The conveying unit 91 and the cassette 60 are placed on the rail 81 of the temporary unit 80 for cutting processing. In Embodiment 1, the control unit 100 sequentially cuts the workpiece 200 from the inside of the cassette 60 . Once the detection sensor 82 detects that the workpiece 200 is contained in the cassette 60 and is temporarily placed on the rail 81 , the workpiece 200 is processed at the 10th position from the bottom. As shown in FIG. 15 , the workpiece 200 - 10 that has been processed by the storage rack 64 - 10 is superimposed and displayed in the temporary corresponding area 121 of the progress status display screen 112 to indicate that it is stored in the tenth position from the bottom. The processed object mark 141-10 of the processed object 200-10 of the receiving rack 64-10. Furthermore, the control unit 100 displays the same color 301 as the temporary corresponding area 121 in the square 131 - 10 corresponding to the tenth storage rack 64 - 10 from the bottom among the plural squares 131 . At this time, as shown in FIG. 15 , the control unit 100 moves from the square 131 - 1 corresponding to the lowermost storage rack 64 - 1 among the plurality of squares 131 to the ninth square from the bottom. The square 131-9 of the storage rack 64-9 displays the color 306 indicating that the move-in is completed. The control unit 100 causes the cassette lift 50 to position the cassette 60 on the uppermost storage rack 64-10 that accommodates the workpiece 200-10 placed on the rail 81, so that the upper surface of the cassette 60 is on the same plane as the upper surface of the rail 81. s position. The control unit 100 carries the workpiece 200 - 10 on the rail 81 into the uppermost storage rack 64 - 10 in the loading/unloading unit 83 of the temporary storage unit 80 . In this way, the control unit 100 of the processing device 1 ends the processing operation once all the workpieces 200 in the cassette 60 have been cut.

實施形態1的加工裝置1是在被顯示於顯示單元110的顯示畫面111的進行狀況顯示畫面112設定裝置內地圖120及卡匣內地圖130。加工裝置1是先在裝置內地圖120的各對應區域121，122，123，124，125設定彼此相異的色301，302，303，304，305，在卡匣內地圖130是設定對應於卡匣60內的被加工物200之方格131。加工裝置1是在各方格131顯示對應於被收容在方格131所對應的卡匣60的收容架64的被加工物200的現在位置之對應區域121，122，123，124，125的色301，302，303，304，305。因此，加工裝置1是可使操作員藉由方格131的色301，302，303，304，305來一眼就能辨識從卡匣60的各收容架64搬出的被加工物200位於裝置內地圖的何處。其結果，加工裝置1是取得可掌握被加工物200的加工的進行狀況的效果。In the processing device 1 of Embodiment 1, the in-device map 120 and the in-cassette map 130 are set on the progress status display screen 112 displayed on the display screen 111 of the display unit 110 . The processing device 1 first sets different colors 301, 302, 303, 304, 305 in each corresponding area 121, 122, 123, 124, 125 of the map 120 in the device. The map 130 in the card cassette is set to correspond to the card. The square 131 of the workpiece 200 in the box 60. The processing device 1 displays in each square 131 the color corresponding to the corresponding area 121, 122, 123, 124, 125 of the current position of the workpiece 200 stored in the storage rack 64 of the cassette 60 corresponding to the square 131. 301, 302, 303, 304, 305. Therefore, the processing device 1 enables the operator to identify at a glance the location of the processed object 200 unloaded from each receiving rack 64 of the cassette 60 by using the colors 301, 302, 303, 304, 305 of the grid 131. Where. As a result, the processing device 1 has the effect of being able to grasp the progress of processing of the workpiece 200 .

又，由於加工裝置1是在各對應區域121，122，123，124，125重疊顯示被加工物標記140，141，因此藉由確認對應區域121，122，123，124，125，可使操作員一眼就能辨識各被加工物200的現在位置。In addition, since the processing device 1 displays the workpiece marks 140 and 141 in the respective corresponding areas 121, 122, 123, 124, and 125, the operator can confirm the corresponding areas 121, 122, 123, 124, and 125. The current position of each workpiece 200 can be identified at a glance.

又，加工裝置1是將對應於搬送單元91，92的搬送單元對應區域122，125設定在進行狀況顯示畫面112。其結果，加工裝置1是藉由確認方格131的色301，302，303，304，305等，可使操作員一眼就能辨識在加工裝置1內搬送中的被加工物200的狀況。Furthermore, the processing device 1 sets the transport unit corresponding areas 122 and 125 corresponding to the transport units 91 and 92 on the progress status display screen 112 . As a result, the processing device 1 can enable the operator to recognize the status of the workpiece 200 being transported in the processing device 1 at a glance by checking the colors 301, 302, 303, 304, 305, etc. of the grid 131.

又，由於加工裝置1是在對應於收容從卡匣60搬出且被施以切削加工的搬入至卡匣60內的被加工物200的收容架64之方格131顯示表示搬入完了的色306，因此藉由確認卡匣內地圖130，可使操作員一眼就能辨識加工完了的被加工物200。Furthermore, since the processing device 1 displays the color 306 indicating that the loading is completed in the square 131 corresponding to the storage rack 64 that accommodates the workpiece 200 that has been carried out from the cassette 60 and subjected to cutting processing, and is loaded into the cassette 60, Therefore, by checking the map 130 in the cassette, the operator can identify the processed object 200 at a glance.

[變形例1] 根據圖面來說明本發明的實施形態1的變形例1的加工裝置。圖16是表示被顯示於實施形態1的變形例1的加工裝置的顯示單元的顯示畫面的進行狀況顯示畫面的圖。另外，圖16是在與實施形態1同樣的部分附上同樣的符號而省略說明。[Modification 1] A processing device according to Modification 1 of Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 16 is a diagram showing a progress status display screen displayed on the display screen of the display unit of the processing device according to Modification 1 of Embodiment 1. FIG. In addition, in FIG. 16 , the same parts as those in Embodiment 1 are assigned the same reference numerals, and description thereof is omitted.

實施形態1的變形例1的加工裝置1是卡匣升降機50會將複數(在變形例1是2個)的卡匣60重疊於Z軸方向而支撐。變形例1的加工裝置1的進行狀況顯示畫面112是如圖16所示般，除了卡匣內地圖130具備對應於2個的卡匣60之中下方的卡匣60的第1卡匣內地圖130-1及對應於上方的卡匣60的第2卡匣內地圖130-2以外，與實施形態1的進行狀況顯示畫面112相同構成。變形例1的加工裝置1的進行狀況顯示畫面112的各卡匣內地圖130-1，130-2是與實施形態1的卡匣內地圖130同等構成。In the processing device 1 according to the modification 1 of the first embodiment, the cassette lift 50 supports a plurality of cassettes 60 (two in the modification 1) in the Z-axis direction. The progress status display screen 112 of the processing device 1 in Modification 1 is as shown in FIG. 16 , except that the in-cassette map 130 includes a first in-cassette map corresponding to the lower cassette 60 among the two cassettes 60 . 130 - 1 and the second cassette in-cassette map 130 - 2 corresponding to the upper cassette 60 have the same configuration as the progress status display screen 112 of the first embodiment. The in-cassette maps 130-1 and 130-2 of the progress status display screen 112 of the processing device 1 in the first modification example have the same structure as the in-cassette map 130 in the first embodiment.

變形例1的加工裝置1是與實施形態1同樣，在進行狀況顯示畫面112設定裝置內地圖120與卡匣內地圖130-1，130-2，在卡匣內地圖130-1，130-2的各方格131顯示對應於被收容在方格131所對應的卡匣60的收容架64的被加工物200的現在位置之對應區域121，122，123，124，125的色301，302，303，304，305。因此，變形例1的加工裝置1是可使操作員藉由方格131的色301，302，303，304，305來一眼就能辨識從卡匣60的各收容架64搬出的被加工物200位於裝置內地圖的何處，取得可掌握被加工物200的加工的進行狀況的效果。The processing device 1 of the modified example 1 is the same as the first embodiment. The in-device map 120 and the in-cassette maps 130-1, 130-2 are set on the progress status display screen 112, and the in-cassette maps 130-1, 130-2 are set. Each square 131 displays the color 301, 302 corresponding to the corresponding area 121, 122, 123, 124, 125 of the current position of the workpiece 200 stored in the storage rack 64 of the cassette 60 corresponding to the square 131, 303, 304, 305. Therefore, the processing device 1 of the modified example 1 enables the operator to recognize at a glance the workpiece 200 carried out from each storage rack 64 of the cassette 60 by the colors 301, 302, 303, 304, 305 of the grid 131. The effect of being able to grasp the progress status of the processing of the workpiece 200 is obtained where it is located on the map in the device.

[變形例2] 根據圖面來說明本發明的實施形態1的變形例2的加工裝置。圖17是表示被顯示於實施形態1的變形例2的加工裝置的顯示單元的顯示畫面的進行狀況顯示畫面的圖。另外，圖17是在與實施形態1同樣的部分附上同樣的符號而省略說明。[Modification 2] A processing device according to Modification 2 of Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 17 is a diagram showing a progress display screen displayed on the display screen of the display unit of the processing device according to Modification 2 of Embodiment 1. FIG. In addition, in FIG. 17 , the same parts as those in Embodiment 1 are assigned the same reference numerals, and description thereof is omitted.

實施形態1的變形例2的加工裝置1是卡匣升降機50會將複數(在變形例1是2個)的卡匣60重疊於Z軸方向而支撐。變形例2的加工裝置1的進行狀況顯示畫面112是如圖17所示般，除了顯示對應於2個的卡匣60之中下方的卡匣60的第1卡匣內地圖130-1及對應於上方的卡匣60的第2卡匣內地圖130-2的其中一方，且可切換顯示的第1卡匣內地圖130-1及第2卡匣內地圖130-2以外，與實施形態1的進行狀況顯示畫面112相同構成。變形例2的加工裝置1的進行狀況顯示畫面112的各卡匣內地圖130-1，130-2是除實施形態1的卡匣內地圖130的構成之外，還設定有表示顯示中的卡匣60之卡匣識別區域132。在變形例2中，加工裝置1的顯示資訊設定部101是一旦受理操作員對於卡匣識別區域132的操作，則切換在進行狀況顯示畫面112顯示的卡匣內地圖130-1，130-2，但在本發明中，切換在進行狀況顯示畫面112顯示的卡匣內地圖130-1，130-2的方法是不被限定於此方法。In the processing device 1 according to the second modification of the first embodiment, the cassette elevator 50 supports a plurality of cassettes 60 (two in the first modification) by stacking them in the Z-axis direction. The progress status display screen 112 of the processing device 1 in Modification 2 is as shown in FIG. 17 , except that the first cassette inner map 130 - 1 corresponding to the lower cassette 60 of the two cassettes 60 and the corresponding One of the map 130-2 in the second cartridge of the upper cartridge 60, and other than the map 130-1 in the first cartridge and the map 130-2 in the second cartridge that can be switched, is the same as in Embodiment 1 The progress status display screen 112 has the same structure. In the progress status display screen 112 of the processing device 1 according to the second modification, each of the in-cassette maps 130-1 and 130-2 has the structure of the in-cassette map 130 of the first embodiment, and is set to indicate the card being displayed. The cassette identification area 132 of the cassette 60. In Modification 2, the display information setting unit 101 of the processing device 1 switches the in-cassette maps 130-1 and 130-2 displayed on the progress status display screen 112 upon receiving the operator's operation on the cassette identification area 132. , however, in the present invention, the method of switching the in-cassette maps 130-1 and 130-2 displayed on the progress status display screen 112 is not limited to this method.

變形例2的加工裝置1是與實施形態1同樣，在進行狀況顯示畫面112設定裝置內地圖120與卡匣內地圖130-1，130-2，在卡匣內地圖130-1，130-2的各方格131顯示對應於被收容在方格131所對應的卡匣60的收容架64的被加工物200的現在位置之對應區域121，122，123，124，125的色301，302，303，304，305。因此，變形例2的加工裝置1是可使操作員藉由方格131的色301，302，303，304，305來一眼就能辨識從卡匣60的各收容架64搬出的被加工物200位於裝置內地圖的何處，取得可掌握被加工物200的加工的進行狀況的效果。The processing device 1 of the modified example 2 is the same as the first embodiment. The in-device map 120 and the in-cassette maps 130-1, 130-2 are set on the progress status display screen 112, and the in-cassette maps 130-1, 130-2 are set. Each square 131 displays the color 301, 302 corresponding to the corresponding area 121, 122, 123, 124, 125 of the current position of the workpiece 200 stored in the storage rack 64 of the cassette 60 corresponding to the square 131, 303, 304, 305. Therefore, the processing device 1 of Modification 2 allows the operator to recognize at a glance the workpiece 200 carried out from each storage rack 64 of the cassette 60 by the colors 301, 302, 303, 304, 305 of the grid 131. The effect of being able to grasp the progress status of the processing of the workpiece 200 is obtained where it is located on the map in the device.

另外，本發明是不被限定於上述實施形態及變形例。亦即，可在不脫離本發明的主旨範圍實施各種變形。前述的實施形態1等是在進行狀況顯示畫面112的各對應區域121，122，123，124，125顯示彼此相異的色301，302，303，304，305，在各方格131顯示對應於被加工物200的現在位置之對應區域121，122，123，124，125的色301，302，303，304，305。然而，本發明是亦可在進行狀況顯示畫面112的各對應區域121，122，123，124，125顯示彼此相異的識別標記，在各方格131顯示對應於被加工物200的現在位置之對應區域121，122，123，124，125的識別標記。又，實施形態1等是顯示加工裝置1為切削裝置的例子，但本發明是加工裝置1不被限定於切削裝置，亦可為研削裝置、雷射加工裝置、平面刨床等，將各種的加工實施於被加工物200的裝置。In addition, the present invention is not limited to the above-mentioned embodiments and modifications. That is, various modifications can be made without departing from the scope of the present invention. In the first embodiment and others described above, different colors 301, 302, 303, 304, 305 are displayed in the corresponding areas 121, 122, 123, 124, and 125 of the progress status display screen 112, and the corresponding colors are displayed in each grid 131. The colors 301, 302, 303, 304, and 305 of the areas 121, 122, 123, 124, and 125 corresponding to the current position of the workpiece 200. However, the present invention can also display mutually different identification marks in each corresponding area 121, 122, 123, 124, 125 of the progress status display screen 112, and display a corresponding current position of the workpiece 200 in each grid 131. Identification marks corresponding to areas 121, 122, 123, 124, and 125. Furthermore, Embodiment 1 and others show an example in which the processing device 1 is a cutting device. However, in the present invention, the processing device 1 is not limited to a cutting device, and may be a grinding device, a laser processing device, a planer, etc., and can perform various processing operations. A device implemented on the workpiece 200.

1:加工裝置 10:吸盤 20:切削單元(加工單元) 50:卡匣升降機(卡匣載置區域) 60:卡匣 64:收容架(層) 70:洗淨單元(洗淨區域) 81:軌道(暫置區域) 90:搬送單元 100:控制單元 101:顯示資訊設定部 111:顯示畫面 112:進行狀況顯示畫面(顯示資訊) 120:裝置內地圖 121:暫置對應區域 122:第1搬送單元對應區域 123:吸盤對應區域 124:洗淨對應區域 125:第2搬送單元對應區域 131:方格 140、141:被加工物標記 200:被加工物 301、302、303、304、305:色(預定的色) 306:表示搬入完了的色1: Processing device 10:Suction cup 20: Cutting unit (processing unit) 50: Cassette lift (cassette loading area) 60:cassette 64: Containment rack (layer) 70: Washing unit (washing area) 81: Track (temporary area) 90:Transport unit 100:Control unit 101: Display information setting part 111: Display screen 112: Progress status display screen (display information) 120:In-device map 121: Temporarily place the corresponding area 122: Corresponding area of the first transport unit 123: Suction cup corresponding area 124: Wash the corresponding area 125: Area corresponding to the second transport unit 131: Square 140, 141: Marking of processed objects 200: Processed object 301, 302, 303, 304, 305: color (predetermined color) 306: Color indicating the completion of moving in

圖1是表示實施形態1的加工裝置的構成例的立體圖。 圖2是表示圖1所示的加工裝置的卡匣的立體圖。 圖3是表示被顯示於圖1所示的加工裝置的顯示單元的顯示畫面的進行狀況顯示畫面的圖。 圖4是表示被顯示於圖1所示的加工裝置的顯示單元的顯示畫面的被加工物標記之一例的圖。 圖5是表示被顯示於圖1所示的加工裝置的顯示單元的顯示畫面的被加工物標記的其他的例子的圖。 圖6是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被暫置於軌道上時的進行狀況顯示畫面的圖。 圖7是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被搬送於第1搬送單元時的進行狀況顯示畫面的圖。 圖8是表示被收容於圖1所示的加工裝置的卡匣的從下面算起第2個的收容架的被加工物被暫置於軌道上時的進行狀況顯示畫面的圖。 圖9是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被保持於吸盤，被收容於從下面算起第2個的收容架的被加工物被搬送於第1搬送單元時的進行狀況顯示畫面的圖。 圖10是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被搬送於第2搬送單元，被收容於從下面算起第2個的收容架的被加工物被保持於吸盤，被收容於卡匣的從下面算起第3個的收容架的被加工物被暫置於軌道上時的進行狀況顯示畫面的圖。 圖11是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被保持於旋轉器台，被收容於卡匣的從下面算起第3個的收容架的被加工物被搬送於第1搬送單元時的進行狀況顯示畫面的圖。 圖12是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被搬送於第1搬送單元，被收容於從下面算起第2個的收容架的被加工物被搬送於第2搬送單元，被收容於卡匣的從下面算起第3個的收容架的被加工物被保持於吸盤時的進行狀況顯示畫面的圖。 圖13是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被暫置於軌道上，被收容於從下面算起第2個的收容架的被加工物被保持於旋轉器台時的進行狀況顯示畫面的圖。 圖14是表示被收容於圖1所示的加工裝置的卡匣的最下的收容架的被加工物被搬入至卡匣內，被收容於從下面算起第4個的收容架的被加工物被暫置於軌道上時的進行狀況顯示畫面的圖。 圖15是表示被收容於圖1所示的加工裝置的卡匣的最上的收容架的被加工物在切削加工後被暫置於軌道上時的進行狀況顯示畫面的圖。 圖16是表示被顯示於實施形態1的變形例1的加工裝置的顯示單元的顯示畫面的進行狀況顯示畫面的圖。 圖17是表示被顯示於實施形態1的變形例2的加工裝置的顯示單元的顯示畫面的進行狀況顯示畫面的圖。Fig. 1 is a perspective view showing a structural example of a processing device according to Embodiment 1. FIG. 2 is a perspective view showing the cassette of the processing device shown in FIG. 1 . FIG. 3 is a diagram showing a progress display screen displayed on the display screen of the display unit of the processing device shown in FIG. 1 . FIG. 4 is a diagram showing an example of a workpiece mark displayed on the display screen of the display unit of the processing apparatus shown in FIG. 1 . FIG. 5 is a diagram showing another example of a workpiece mark displayed on the display screen of the display unit of the processing apparatus shown in FIG. 1 . FIG. 6 is a diagram showing a progress status display screen when the workpiece accommodated in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is temporarily placed on the rail. 7 is a diagram illustrating a progress display screen when the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is transported to the first transport unit. 8 is a diagram illustrating a progress display screen when the workpiece stored in the second storage rack from the bottom of the cassette of the processing device shown in FIG. 1 is temporarily placed on the rail. Fig. 9 is a diagram showing that the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in Fig. 1 is held by a suction cup, and the workpiece stored in the second storage rack from the bottom is held; Diagram of the progress status display screen when transporting to the first transport unit. FIG. 10 shows that the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is transported to the second transport unit, and the workpiece stored in the second storage rack from the bottom is shown. The picture of the progress display screen when the workpiece is held by the suction cup and is temporarily placed on the rail while the workpiece stored in the third storage rack from the bottom of the cassette is placed. FIG. 11 shows that the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is held on the rotator table and stored in the third storage rack from the bottom of the cassette. Diagram of the progress status display screen when the workpiece is transported to the first transport unit. FIG. 12 shows that the workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 is transported to the first transport unit, and the workpiece stored in the second storage rack from the bottom is shown. This is a diagram of the progress display screen when the workpiece is transported to the second transport unit and the workpiece stored in the third storage rack from the bottom of the cassette is held on the suction cup. FIG. 13 shows a workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 being temporarily placed on a rail and being processed in the second storage rack from the bottom. Diagram of the progress display screen when the object is held on the rotator table. FIG. 14 shows a workpiece stored in the lowermost storage rack of the cassette of the processing device shown in FIG. 1 being carried into the cassette and being processed in the fourth storage rack from the bottom. Picture of the progress display screen when the object is temporarily placed on the track. FIG. 15 is a diagram showing a progress display screen when the workpiece accommodated in the uppermost storage rack of the cassette of the processing device shown in FIG. 1 is temporarily placed on the rail after cutting processing. FIG. 16 is a diagram showing a progress status display screen displayed on the display screen of the display unit of the processing device according to Modification 1 of Embodiment 1. FIG. FIG. 17 is a diagram showing a progress display screen displayed on the display screen of the display unit of the processing device according to Modification 2 of Embodiment 1. FIG.

110:顯示單元 110:Display unit

111:顯示畫面 111: Display screen

112:進行狀況顯示畫面(顯示資訊) 112: Progress status display screen (display information)

113:開始及停止的開始停止輸入區域 113: Start and stop input area for start and stop

114:攝像畫像顯示區域 114:Camera image display area

120:裝置內地圖 120:In-device map

121:對應區域 121: Corresponding area

122:第1搬送單元對應區域 122: Corresponding area of the first transport unit

123:吸盤對應區域 123: Suction cup corresponding area

124:洗淨對應區域 124: Wash the corresponding area

125:第2搬送單元對應區域 125: Area corresponding to the second transport unit

126:空閒區域 126: Free area

130:卡匣內地圖 130: Map in the card box

131:方格 131: Square

131-1、131-2、131-10:方格 131-1, 131-2, 131-10: square

301、302、303、304、305:色(預定的色) 301, 302, 303, 304, 305: color (predetermined color)

306:表示搬入完了的色 306: Color indicating the completion of moving in

Claims (4)

一種加工裝置，係具備：吸盤，其係保持被加工物；加工單元，其係加工被保持於該吸盤的被加工物；卡匣載置區域，其係載置具備複數個收容該被加工物的層的卡匣；洗淨區域，其係洗淨該被加工物；搬送單元，其係在該卡匣、該吸盤及該洗淨區域之間搬送被加工物；顯示畫面，其係顯示該被加工物的加工的進行狀況；及顯示資訊設定部，其係設定顯示於該顯示畫面的資訊，其特徵為：在該顯示資訊設定部，係設定有：裝置內地圖，其係具有對應於該吸盤的吸盤對應區域及對應於該洗淨區域的洗淨對應區域，各對應區域係彼此顯示不同的色；被加工物標記，其係將從該卡匣搬出的被加工物的現在位置重疊於該裝置內地圖而顯示；及複數的方格，其係表示該卡匣的該層，作為顯示資訊，在該方格，係顯示有與在加工動作中對應於被收容在 該方格所示的該卡匣的該層的該被加工物的現在位置之該對應區域相同的色。 A processing device is provided with: a suction cup that holds an object to be processed; a processing unit that processes the object that is held by the suction cup; and a cassette holding area that holds a plurality of cassettes to accommodate the object to be processed. The cassette of the layer; the cleaning area, which cleans the processed objects; the transport unit, which transports the processed objects between the cassette, the suction cup and the cleaning area; the display screen, which displays the processed objects The progress status of the processing of the processed object; and a display information setting part that sets the information displayed on the display screen, and is characterized in that: the display information setting part is set with: an in-device map, which has a corresponding The suction cup corresponding area of the suction cup and the cleaning corresponding area corresponding to the cleaning area are displayed in different colors; the workpiece mark overlaps with the current position of the workpiece to be carried out from the cassette. Displayed on a map in the device; and a plurality of squares, which represent the layer of the cassette, as display information, in which squares are displayed corresponding to the objects contained in the processing operation The corresponding area of the current position of the workpiece on the layer of the cassette shown in the square is the same color. 如申請專利範圍第1項之加工裝置，其中，該裝置內地圖，係包含對應於搬送該被加工物的搬送單元的搬送單元對應區域。 For example, in the processing device of claim 1, the map in the device includes a transport unit corresponding area corresponding to the transport unit that transports the object to be processed. 如申請專利範圍第1或2項之加工裝置，其中，在表示收容從該卡匣搬出之後再度回到該卡匣的被加工物的層之該方格，係顯示有表示搬入完了的色或識別標記。 For example, in the processing device of Item 1 or 2 of the patent application, the square indicating the layer containing the workpiece that has been moved out of the cassette and returned to the cassette is displayed with a color or color indicating that the loading is completed. Identification mark. 如申請專利範圍第1或2項之加工裝置，其中，該加工裝置，係更具備：暫置從被載置於該卡匣載置區域的該卡匣搬出的被加工物之暫置區域，該搬送單元係在該卡匣、該暫置區域、該吸盤及該洗淨區域之間搬送被加工物，該裝置內地圖係包含對應於該暫置區域的暫置對應區域。 For example, if the processing device of Item 1 or 2 of the patent scope is applied for, the processing device further has: a temporary storage area for temporarily storing the processed objects moved out from the cassette placed in the cassette storage area, The transport unit transports the processed object between the cassette, the temporary storage area, the suction cup and the cleaning area, and the map in the device includes a temporary storage corresponding area corresponding to the temporary storage area.
TW108144483A 2018-12-07 2019-12-05 Processing device TWI813825B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018230217A JP7162513B2 (en) 2018-12-07 2018-12-07 processing equipment
JP2018-230217 2018-12-07

Publications (2)

Publication Number Publication Date
TW202031419A TW202031419A (en) 2020-09-01
TWI813825B true TWI813825B (en) 2023-09-01

Family

ID=71012938

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108144483A TWI813825B (en) 2018-12-07 2019-12-05 Processing device

Country Status (4)

Country Link
JP (1) JP7162513B2 (en)
KR (1) KR20200070102A (en)
CN (1) CN111293055A (en)
TW (1) TWI813825B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023119405A1 (en) * 2021-12-21 2023-06-29 株式会社Fuji Machine tool

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11354398A (en) * 1998-06-08 1999-12-24 Kokusai Electric Co Ltd Method of processing wafer
US6165051A (en) * 1998-10-29 2000-12-26 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
TW200916251A (en) * 2007-07-18 2009-04-16 Hamamatsu Photonics Kk Machining information supply equipment and supply system
TW201033773A (en) * 2009-03-11 2010-09-16 Inotera Memories Inc Method for monitoring fabrication parameters
TW201703928A (en) * 2015-02-16 2017-02-01 Disco Corp Machining device
TW201731627A (en) * 2016-03-14 2017-09-16 Disco Corp Defect detection method capable of appropriately determining poor injection of addition agent
TW201805860A (en) * 2016-07-11 2018-02-16 迪思科股份有限公司 Management system which automatically records the behaviors of an operator without forcing the operator to behave in a special way
JP2018122421A (en) * 2017-02-03 2018-08-09 株式会社ディスコ Processing device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3973238B2 (en) * 1995-01-11 2007-09-12 株式会社日立国際電気 Display method in semiconductor manufacturing equipment
JP4279689B2 (en) * 2004-01-08 2009-06-17 株式会社荏原製作所 Electron beam equipment
JP4797108B2 (en) 2010-03-16 2011-10-19 株式会社日立国際電気 Display method in semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
JP6433178B2 (en) 2014-07-02 2018-12-05 株式会社ディスコ Processing equipment
JP6767253B2 (en) * 2016-12-13 2020-10-14 株式会社ディスコ Laser processing equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11354398A (en) * 1998-06-08 1999-12-24 Kokusai Electric Co Ltd Method of processing wafer
US6165051A (en) * 1998-10-29 2000-12-26 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
TW200916251A (en) * 2007-07-18 2009-04-16 Hamamatsu Photonics Kk Machining information supply equipment and supply system
TW201033773A (en) * 2009-03-11 2010-09-16 Inotera Memories Inc Method for monitoring fabrication parameters
TW201703928A (en) * 2015-02-16 2017-02-01 Disco Corp Machining device
TW201731627A (en) * 2016-03-14 2017-09-16 Disco Corp Defect detection method capable of appropriately determining poor injection of addition agent
TW201805860A (en) * 2016-07-11 2018-02-16 迪思科股份有限公司 Management system which automatically records the behaviors of an operator without forcing the operator to behave in a special way
JP2018122421A (en) * 2017-02-03 2018-08-09 株式会社ディスコ Processing device

Also Published As

Publication number Publication date
KR20200070102A (en) 2020-06-17
JP2020091804A (en) 2020-06-11
JP7162513B2 (en) 2022-10-28
CN111293055A (en) 2020-06-16
TW202031419A (en) 2020-09-01

Similar Documents

Publication Publication Date Title
KR101266373B1 (en) Cutting Machine
JP6935168B2 (en) Processing equipment
KR102345188B1 (en) Processing apparatus
JP6873712B2 (en) Dressing board, cutting blade dressing method and cutting equipment
KR20200099488A (en) Chuck table and inspection apparatus
TWI813825B (en) Processing device
JP7304709B2 (en) Workpiece processing method
JP2018117003A (en) Wafer processing device
JP7229640B2 (en) cutting equipment
CN113555296A (en) Processing device
JP2021061381A (en) Workpiece housing mechanism
JP7344655B2 (en) processing equipment
JP2021032619A (en) Measurement method and testing device
JP7271181B2 (en) diagnostic method
JP2014154633A (en) Processing device
JP2013158880A (en) Grinding device
TWI849189B (en) processing method
JP2024039510A (en) Mounting method and cutting device
JP2024114393A (en) Processing equipment and storage jigs
TW202140193A (en) Processing device capable of precisely grasping the condition in the processing device
TW202139341A (en) Processing device and processing method characterized by easily restarting from the unprocessed processing when processing is resumed from replacing the cassette receiving a workpiece therein
JP2020136489A (en) Transport device
JP2022142633A (en) Positioning mechanism and semiconductor processing device
JP2020191426A (en) Processing device
JP2022083252A (en) Processing device and processing method