TW202139341A - Processing device and processing method characterized by easily restarting from the unprocessed processing when processing is resumed from replacing the cassette receiving a workpiece therein - Google Patents
Processing device and processing method characterized by easily restarting from the unprocessed processing when processing is resumed from replacing the cassette receiving a workpiece therein Download PDFInfo
- Publication number
- TW202139341A TW202139341A TW110111204A TW110111204A TW202139341A TW 202139341 A TW202139341 A TW 202139341A TW 110111204 A TW110111204 A TW 110111204A TW 110111204 A TW110111204 A TW 110111204A TW 202139341 A TW202139341 A TW 202139341A
- Authority
- TW
- Taiwan
- Prior art keywords
- processing
- cassette
- workpiece
- processed
- processed object
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Factory Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
Description
本發明是有關於一種加工裝置及加工方法。The invention relates to a processing device and a processing method.
已知有以下裝置:當確認到裝置的異常時即中止處理,且之後執行:解決所確認到的異常之處理及後續處理(參照專利文獻1、2)。
先前技術文獻
專利文獻The following devices are known: when an abnormality of the device is confirmed, the processing is suspended, and then the processing is executed: the processing for solving the confirmed abnormality and the subsequent processing (refer to
專利文獻1:日本特開2006-203145號公報 專利文獻2:日本特開2004-319961號公報Patent Document 1: Japanese Patent Application Publication No. 2006-203145 Patent Document 2: Japanese Patent Application Publication No. 2004-319961
發明欲解決之課題The problem to be solved by the invention
通常在1個片匣內會容置有相同批的複數個被加工物,並進行自動地重複搬送與加工之全自動加工。但是,加工中發生某種問題時,有時會暫時停止全自動加工。此時,由於裝置會成為沒有運作的狀況而浪費,因此有時會有對另外的片匣進行加工的情況。但是,雖然在連續地進行加工的全自動加工的當中取得加工歷程,但由於在更換片匣並開始進行新的片匣的加工之時間點會導致全自動加工用的加工歷程被重設(reset)一次,所以在重新開始時,操作人員要確認原本在加工中的被加工物已加工到什麼程度、或片匣的第幾層起為未處理等,而從中途重新開始全自動加工,因此有產生差錯之疑慮。Usually, multiple processed objects of the same batch are contained in one cassette, and automatic processing is performed that automatically repeats transportation and processing. However, when a certain problem occurs during processing, the fully automatic processing may be temporarily stopped. At this time, since the device becomes inoperative and wasteful, there may be cases in which another cassette is processed. However, although the processing history is obtained during the continuous processing of fully automatic processing, the processing history for fully automatic processing will be reset when the cassette is replaced and the processing of the new cassette is started. ) Once, so when restarting, the operator must confirm to what extent the processed object originally being processed has been processed, or which layer of the cassette is unprocessed, etc., and restart the fully automatic processing from the middle, so There are doubts about making mistakes.
本發明是有鑒於所述之問題點而作成的發明,其目的在於提供一種加工裝置及加工方法,其可以在更換了容置被加工物之片匣的情況下,在加工重新開始時容易地從未處理的加工起重新開始。 用以解決課題之手段The present invention was made in view of the above-mentioned problems, and its object is to provide a processing device and a processing method that can easily restart processing when the cassette containing the object to be processed is replaced Restart from unprocessed processing. Means to solve the problem
為了解決上述之課題並達成目的,本發明的加工裝置至少具備:保持工作台,保持被加工物;加工單元,對已保持在該保持工作台之被加工物進行加工;片匣載置台,讓容置複數個被加工物之片匣載置;搬送臂,在已放置於該片匣載置台之該片匣與加工區域之間搬送被加工物;讀取機,讀取顯示被加工物的資訊之資訊傳輸媒介,且前述被加工物容置於片匣;加工歷程記錄部,將從該資訊傳輸媒介讀取到的被加工物的資訊與加工歷程建立連繫並記錄;及控制單元,控制各機構, 前述加工裝置的特徵在於: 該控制單元在第1片匣容置有未處理的被加工物的狀態下加工中斷,且已實施第2片匣的加工後,將該第1片匣再次設置於該片匣載置台而重新開始加工時,會進行以下處理:依據以該讀取機讀取到的被加工物的資訊來從加工歷程記錄部調用相符合的加工歷程,並從未處理的被加工物起進行加工。In order to solve the above-mentioned problems and achieve the objective, the processing device of the present invention at least has: a holding table to hold the object to be processed; a processing unit to process the object to be processed that has been held on the holding table; A film cassette containing a plurality of processed objects; a transport arm, which conveys the processed object between the cassette and the processing area that has been placed on the cassette placing table; a reader, which reads and displays the processed object The information transmission medium of the information, and the aforementioned processed object is contained in the cassette; the processing history recording unit establishes and records the information of the processed object read from the information transmission medium and the processing history; and the control unit, Control various agencies, The aforementioned processing device is characterized by: The control unit interrupts processing in a state where the first cassette contains unprocessed objects, and after the processing of the second cassette has been performed, the first cassette is placed on the cassette mounting table again and restarted. When processing is started, the following processing is performed: according to the information of the processed object read by the reader, the corresponding processing history is called from the processing history recording unit, and the processing is performed from the unprocessed object.
又,為了解決上述之課題並達成目的,本發明之加工方法的特徵在於具備以下步驟: 讀取步驟,讀取顯示被加工物的資訊之資訊傳輸媒介,且前述被加工物容置在容置有複數個被加工物之第1片匣; 片匣設置步驟,將該第1片匣設置於加工裝置; 加工步驟,將已容置於該第1片匣之被加工物搬送到保持工作台,並藉由加工單元來加工; 加工歷程記錄步驟,將被加工物的加工歷程和被加工物的資訊建立連繫並記錄; 加工中止步驟,根據某種原因而中斷加工並從該加工裝置卸除該第1片匣; 片匣更換步驟,將容置有不同的被加工物之第2片匣設置於該加工裝置,並開始已容置於該第2片匣之被加工物的加工; 重新開始時條碼讀取步驟,將該第1片匣再次設置於加工裝置,並讀取該資訊傳輸媒介;及 加工重新開始步驟,依據所讀取到的該加工歷程來從未處理的被加工物起重新開始加工。 發明效果In addition, in order to solve the above-mentioned problems and achieve the objective, the processing method of the present invention is characterized by having the following steps: In the reading step, the information transmission medium that displays the information of the processed object is read, and the processed object is contained in a first cassette containing a plurality of processed objects; A cassette setting step: setting the first cassette in the processing device; In the processing step, the processed object contained in the first cassette is transported to the holding table and processed by the processing unit; The processing history recording step is to establish a connection and record the processing history of the processed object and the information of the processed object; In the processing suspension step, processing is interrupted for some reason and the first cassette is removed from the processing device; In the cassette replacement step, a second cassette containing a different processed object is set in the processing device, and the processing of the processed object already contained in the second cassette is started; When restarting the barcode reading step, set the first cassette in the processing device again, and read the information transmission medium; and The processing restart step is to restart processing from the unprocessed object according to the read processing history. Invention effect
本發明可以在更換了容置被加工物之片匣的情況下,在加工重新開始時容易地從未處理的加工起重新開始。The present invention can easily restart the unprocessed processing when the processing is restarted when the cassette accommodating the processed object is replaced.
用以實施發明之形態The form used to implement the invention
針對用於實施本發明之形態(實施形態),參照圖式並且詳細地說明。本發明並非因以下的實施形態所記載之內容而受到限定之發明。又,在以下所記載之構成要素中,包含所屬技術領域中具有通常知識者可以輕易地設想得到的構成要素、及實質上相同的構成要素。此外,以下所記載之構成是可適當組合的。又,在不脫離本發明之要旨的範圍內,可進行構成之各種省略、置換或變更。The form (embodiment) for implementing the present invention will be described in detail with reference to the drawings. This invention is not limited by the content described in the following embodiment. In addition, the constituent elements described below include constituent elements that can be easily imagined by a person having ordinary knowledge in the technical field, and constituent elements that are substantially the same. In addition, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.
[實施形態1]
依據圖式來說明本發明之實施形態1之加工裝置1及實施形態1之加工方法。圖1是顯示實施形態1之加工裝置1的構成例的立體圖。如圖1所示,實施形態1之加工裝置1具備:保持工作台10、加工單元20、拍攝單元30、片匣載置台40、搬送臂50、讀取機60、顯示單元65、輸入單元66、加工歷程記錄部70、控制單元80及洗淨單元90。[Embodiment 1]
The
加工裝置1將已載置於片匣載置台40之片匣200所容置之1批份量(在實施形態1中為25片)的被加工物100依序以搬送臂50搬送至保持工作台10,並以保持工作台10保持,且以加工單元20對已保持在保持工作台10之被加工物100的上表面進行加工,並在加工後以洗淨單元90洗淨後,以搬送臂50搬入片匣200。The
在實施形態1中,如圖1所示,加工裝置1所加工之被加工物100為例如以矽、藍寶石、碳化矽(SiC)、砷化鎵等作為母材之圓板狀的半導體晶圓或光器件晶圓等之晶圓。被加工物100在平坦的正面101中,在藉由複數條分割預定線102所區劃出的區域中形成有器件103,前述分割預定線102分別沿著第1方向、及和第1方向交叉之第2方向而形成。在實施形態1中,雖然被加工物100進一步在正面101使形成複數條分割預定線102之第1方向與第2方向互相正交而形成為格子狀,但在本發明並非限定於此。In
被加工物100在正面101的背側之背面104貼附有黏著膠帶105,並且於黏著膠帶105的外緣部裝設有環狀框架106。又,在本發明中,被加工物100亦可為具有被樹脂所密封的複數個器件之矩形狀的封裝基板、陶瓷板、或玻璃板等。The to-
保持工作台10是以保持面11來將被加工物100讓正面101側朝向上側而保持背面104側。保持工作台10是具備有圓盤形狀的吸附部與框體之圓盤形狀,前述吸附部在上表面形成有保持被加工物100之平坦的保持面11且由具備有多數個多孔(porous)孔的多孔陶瓷等所構成,前述框體將吸附部嵌入並固定於上表面的中央部之凹陷部。保持面11形成為平行於水平面即XY平面。保持工作台10藉由未圖示之X軸移動單元而在水平方向的一個方向即X軸方向上移動自如地設置,且藉由未圖示之旋轉驅動源而繞著Z軸旋轉自如地設置。保持工作台10透過未圖示之真空吸引路徑來將吸附部和未圖示之真空吸引源連接,並以保持面11整體來吸引保持被加工物100。The holding table 10 holds the
加工單元20對已保持在保持工作台10之被加工物100進行加工。加工單元20在實施形態1中是切削加工單元,且具有切削刀片21。切削刀片21被施加繞著和水平方向的另一個方向即正交於X軸方向之Y軸方向平行的軸心的旋轉動作,而對已保持在保持工作台10之被加工物100進行切削。加工單元20相對於已保持在保持工作台10之被加工物100,藉由未圖示之Y軸移動單元而在Y軸方向上移動自如地設置,且藉由未圖示之Z軸移動單元而在鉛直方向即Z軸方向上移動自如地設置。The
加工裝置1一邊使切削刀片21旋轉一邊藉由未圖示之X軸移動單元、Y軸移動單元及Z軸移動單元來使切削刀片21相對於已保持在保持工作台10之被加工物100沿著分割預定線102相對地移動,藉此對被加工物100進行切削加工來形成沿著分割預定線102之切削溝。The
拍攝單元30對已保持在保持工作台10之被加工物100的正面101進行攝影。在實施形態1中,拍攝單元30被固定在加工單元20,以和加工單元20一體地移動。拍攝單元30具備有拍攝元件,前述拍攝元件是對已保持在保持工作台10之切削加工前的被加工物100的分割預定線102、以及切削加工後的被加工物100的加工痕跡即切削溝進行拍攝。拍攝元件可為例如CCD(電荷耦合器件,Charge-Coupled Device)拍攝元件或CMOS(互補式金屬氧化物半導體,Complementary MOS)拍攝元件。The photographing
拍攝單元30對已保持在保持工作台10之切削加工前的被加工物100的正面101進行拍攝,而得到用於完成校準等之圖像,並將所得到的圖像輸出至控制單元80,其中前述校準是進行被加工物100與切削刀片21的對位。又,拍攝單元30對已保持在保持工作台10之切削加工後的被加工物100的正面101進行拍攝,而得到用於完成所謂的刀痕檢查等之圖像,並將所得到的圖像輸出至控制單元80,前述刀痕檢查是自動地確認切削溝是否落在分割預定線102之內、是否未產生有較大的缺損等。The photographing
片匣載置台40是載置用於容置複數個被加工物100之容置器即片匣200的載置台,且使所載置之片匣200在Z軸方向上升降。片匣200透過圖1中的近前側的開口201而設成可讓被加工物100進出,並且具備有複數個在Z軸方向上隔著間隔來保持被加工物100之槽202。在加工裝置1中,可將容置於片匣200之被加工物100以容置之槽202的層數,來1片1片管理、區別並處理。片匣200以開口201相向於搬入搬出區域53的狀態來載置於片匣載置台40的上表面。The cassette mounting table 40 is a mounting table on which the
在片匣200的上表面設置有條碼210,前述條碼210是顯示容置於片匣200之被加工物100的資訊之資訊傳輸媒介。在此,容置於片匣200之被加工物100的資訊,可為例如附加於複數個被加工物100之一群的批號。再者,條碼210雖然在實施形態1中如圖1所示地為一維碼,但在本發明中並非限定於此,亦可為矩陣型二維碼之所謂QR(快速回應,Quick Response)碼。又,在本發明中,此資訊傳輸媒介並不限定於條碼210,亦可為RFID(無線射頻識別,Radio Frequency IDentifier)標籤。又,資訊傳輸媒介亦可不設置於片匣,而是設置在保持被加工物100之環狀框架106或被加工物100本身。A
搬送臂50在已放置於片匣載置台40之片匣200與加工區域即保持工作台10的保持面11上之間搬送被加工物100。在實施形態1中,搬送臂50具備搬送臂51與搬送臂52。搬送臂51將切削加工前的被加工物100從片匣200搬出至搬入搬出區域53。搬送臂51將切削加工後的被加工物100從搬入搬出區域53搬入到片匣200。搬送臂52將被搬送臂51所搬出之切削加工前的被加工物100搬送到保持工作台10上。搬送臂52將切削加工後的被加工物100從保持工作台10上搬送到洗淨單元90,並從洗淨單元90朝向搬入搬出區域53搬送。洗淨單元90將切削加工後的被加工物100洗淨,並將附著於被加工物100的切削屑等的異物去除。The
讀取機60讀取顯示容置於片匣200之被加工物100的資訊之資訊傳輸媒介。讀取機60在實施形態1中是讀取條碼210的條碼讀取器。讀取機60讀取條碼210而取得容置於片匣200之被加工物100的資訊,並將所取得的資訊輸出至控制單元80。The
顯示單元65會顯示拍攝單元30所拍攝到的圖像或加工裝置1的加工條件的設定的畫面、校準或刀痕檢查的結果的畫面等。顯示單元65在實施形態1中是藉由液晶顯示裝置等所構成。輸入單元66可在操作人員輸入有關於加工裝置1的加工條件之資訊等之時使用。在本實施形態中,輸入單元66是藉由設置於顯示單元65之觸控面板、與鍵盤等當中至少一種所構成。The
控制單元80是分別控制加工裝置1的各機構(各構成要素),而使加工裝置1實施對被加工物100的切削加工處理之單元。控制單元80在第1片匣200容置有未處理的被加工物100的狀態下加工中斷,且已實施第2片匣200的加工後,將第1片匣200再次設置於片匣載置台40並重新開始加工時,會進行以下處理:依據以讀取機60讀取到的被加工物100的資訊來從加工歷程記錄部70調用相符合的加工歷程,並從未處理的被加工物100起進行加工。在此,未處理的被加工物100是指:尚未完成全部的加工處理之任何狀態的被加工物100,包含例如,任一條分割預定線102都未被加工處理之被加工物100,也包含加工處理已經進展到只要再對1條分割預定線102進行加工處理便完成全部的加工處理之被加工物100。又,在實施形態1中,所謂針對某個被加工物100已完成全部的加工處理之狀態是指:已將全部的分割預定線102切削完成而完成切削溝的形成之狀態。The
在實施形態1中,控制單元80包含電腦系統。控制單元80具有運算處理裝置、記憶裝置及輸入輸出介面裝置,前述運算處理裝置具有如CPU(中央處理單元,Central Processing Unit)之微處理器,前述記憶裝置具有如ROM(唯讀記憶體,Read Only Memory)或RAM(隨機存取記憶體,Random Access Memory)之記憶體。運算處理裝置依照已記憶於記憶裝置的電腦程式來實施運算處理,並透過輸入輸出介面裝置將用於控制加工裝置1的控制訊號輸出至加工裝置1的各構成要素。In
圖2是顯示圖1之加工裝置1的加工歷程記錄部70所記錄的加工歷程資料71之一例的圖。加工歷程記錄部70將讀取機60從條碼210讀取到之容置於片匣200的被加工物100的資訊和加工歷程建立連繫,並記錄為如圖2所示之加工歷程資料71。FIG. 2 is a diagram showing an example of processing
具體而言,如圖2所示,加工歷程記錄部70是將容置於片匣200之被加工物100的資訊(在圖2的例子中為批號)、收納有各被加工物100之槽02的層數的編號、對各被加工物100進行加工之日期時間、及各被加工物100的加工歷程(加工完成狀況),依每個被加工物100建立對應,並記錄為加工歷程資料71。Specifically, as shown in FIG. 2, the processing
加工歷程資料71在圖2所示的例子中顯示有以下情形:在附加有批號「DS150-000001」之片匣200中,針對容置在編號為1~6之槽202的被加工物100為:沿著全部的分割預定線102將切削加工實施完畢;針對容置在編號為7之槽202的被加工物100為:沿著第1方向的分割預定線102當中到第5條為止將切削加工實施完畢,且沿著第1方向的分割預定線102當中沿著第6條以後及沿著第2方向的全部的分割預定線102並未實施切削加工;針對容置在編號為8、9及其以後的編號之槽202的被加工物100為:沿著全部的分割預定線102未實施切削加工。The
每當加工單元20實施被加工物100的加工處理時,加工歷程記錄部70會以即時的方式記錄、更新加工歷程資料71。若完成容置於片匣200之全部的被加工物100的加工後,加工歷程記錄部70會將已和容置於該片匣200之被加工物100的資訊建立對照之加工歷程資料71消除。Whenever the
加工歷程記錄部70包含RAM、ROM、快閃記憶體、EPROM(可抹除可程化唯讀記憶體,Erasable Programmable Read Only Memory)、EEPROM(註冊商標)(電子可抹除可程式化唯讀記憶體,Electrically Erasable Programmable Read Only Memory)等之非揮發性或揮發性的半導體記憶體等。再者,加工歷程記錄部70亦可與控制單元80一體化而作為一台電腦系統。The processing
接著,本說明書依據圖式來說明實施形態1之加工裝置1的動作之一例即實施形態1之加工方法。圖3是顯示實施形態1之加工方法的處理的順序之一例的流程圖。如圖3所示,實施形態1之加工方法具備讀取步驟1001、片匣載置步驟1002、加工步驟1003、加工歷程記錄步驟1004、加工中止步驟1005、片匣更換步驟1006、重新開始時條碼讀取步驟1007及加工重新開始步驟1008。Next, this specification describes the processing method of the first embodiment, which is an example of the operation of the
讀取步驟1001是讀取顯示被加工物100的資訊之資訊傳輸媒介之步驟,且前述被加工物100容置於容置有複數個被加工物100之第1片匣200。在讀取步驟1001中,讀取機60朝向片匣200的上表面的條碼210來讀取條碼210,藉此取得容置於第1片匣200之被加工物100的資訊,並將已取得之容置於第1片匣200之被加工物100的資訊輸出至控制單元80。The
片匣載置步驟1002是將第1片匣200設置於加工裝置1之步驟。在片匣載置步驟1002中,將設置有在讀取步驟1001中讀取到之條碼210的第1片匣200載置於片匣載置台40的上表面。The
在實施形態1中,雖然是在實施讀取步驟1001後實施片匣載置步驟1002,但在本發明中並非限定於此,亦可在實施片匣載置步驟1002後實施讀取步驟1001。In
加工步驟1003是在讀取步驟1001及片匣載置步驟1002的實施後,將已容置於第1片匣200之被加工物100搬送到保持工作台10,並藉由加工單元20進行加工之步驟。在加工步驟1003中,是控制單元80控制加工裝置1的各機構,且搬送臂50將已容置於第1片匣200之被加工物100搬送到保持工作台10,且保持工作台10以保持面11吸引保持此已被搬送之被加工物100,並藉由加工單元20對保持工作台10上的被加工物100進行加工。In the
在實施形態1中,是在加工步驟1003中,控制單元80控制加工裝置1的各機構,並讓已使其旋轉之切削刀片21相對於已保持在保持工作台10之被加工物100沿著分割預定線102相對地移動,藉此對被加工物100進行切削加工並形成沿著分割預定線102的切削溝。In the first embodiment, in the
又,在實施形態1中,是在加工步驟1003中,依照容置有被加工物100之槽202的編號,將被加工物100一片片地依序切削加工。具體而言,在加工步驟1003中,首先,對容置於編號為1之槽202的被加工物100沿著全部的分割預定線102,一條條地依序進行切削加工來形成切削溝,接著,對容置於編號為2之槽202的被加工物100同樣地進行切削加工,並對容置於編號為3、4、…之槽202的被加工物100依編號順序一片片地進行切削加工。In addition, in the first embodiment, in the
加工歷程記錄步驟1004是將被加工物100的加工歷程和被加工物100的資訊建立連繫並記錄之步驟。在加工歷程記錄步驟1004中,加工歷程記錄部70會記錄被加工物100的加工歷程資料71,前述被加工物100的加工歷程資料71是已和在讀取步驟1001中讀取並取得之容置於第1片匣200的被加工物100的資訊建立連繫之資料。在加工歷程記錄步驟1004中,每當在加工步驟1003中對被加工物100進行加工後,加工歷程記錄部70即以即時方式記錄、更新加工歷程資料71。The processing
加工中止步驟1005是根據某種原因而中斷全自動加工之步驟。在此,在實施形態1中,所謂的某種原因是在加工裝置1及由加工裝置1進行之加工處理中產生的錯誤或異常,可為例如在加工步驟1003的實施中完成的刀痕檢查的錯誤的頻率比通常更多等之狀況。The
片匣更換步驟1006是從加工裝置1卸除第1片匣200,並將容置有不同的被加工物100的第2片匣200設置於加工裝置1,且開始進行對容置於第2片匣200之被加工物100的全自動加工之步驟。在片匣更換步驟1006中實施的被加工物100的加工,除了容置於第2片匣200之被加工物100作為加工對象之點以外,與在加工步驟1003中實施的被加工物100的加工同樣。又,在片匣更換步驟1006中對已容置於第2片匣200之被加工物100進行加工的情況下,和對已容置於第1片匣200之被加工物100進行加工的情況同樣,也是一併實施和加工歷程記錄步驟1004同樣的加工歷程記錄處理。再者,在加工中止步驟1005的實施後可以在比較短時間內解決故障(trouble)原因而重新開始全自動加工的情況下,即不實施片匣更換步驟1006以後的作業。在此情況下,因為並未將有關於已容置於第1片匣200之被加工物100的全自動加工用的加工歷程重設(reset),所以會藉由重新開始全自動加工,並實施加工步驟1003,來藉由加工單元20對全部的被加工物100進行加工並結束加工。The
在加工中止步驟1005之後,有時操作人員會例如以顯微鏡仔細地觀察被加工物100來進行已成為加工的中斷之某種原因的查明。在此情況下,由於若成為加工裝置1未運轉的狀況的話會浪費,因此會實施片匣更換步驟1006,將和第1片匣200不同的第2片匣200載置於片匣載置台40的上表面,並對已容置於第2片匣200之被加工物100進行加工,藉此設為加工裝置1持續運轉中的狀況。After the
重新開始時條碼讀取步驟1007是將第1片匣200再次設置於加工裝置1,並讀取顯示被加工物100的資訊之資訊傳輸媒介之步驟,且前述被加工物100容置於第1片匣200。在重新開始時條碼讀取步驟1007中,讀取機60於在先前的加工中止步驟1005中止加工,並在片匣更換步驟1006實施第2片匣200的加工後,讀取再次載置於片匣載置台40而嘗試重新開始加工之第1片匣200的條碼210。藉此,在重新開始時條碼讀取步驟1007中,控制單元80依據以讀取機60讀取到的被加工物100的資訊來從加工歷程記錄部70調用符合於第1片匣200的加工歷程即加工歷程資料71,並取得容置於第1片匣200之未處理的被加工物100的資訊。When restarting, the
加工重新開始步驟1008是依據讀取到的加工歷程,從未處理的被加工物100起重新開始加工之步驟。在加工重新開始步驟1008中,控制單元80依據在重新開始時條碼讀取步驟1007中所調用並取得的加工歷程資料71,從在前次的加工步驟1003中尚未完成加工之未處理的被加工物100起進行加工。The
在加工重新開始步驟1008中實施之被加工物100的加工,和在加工步驟1003中實施之被加工物100的加工同樣。又,在加工重新開始步驟1008中對被加工物100進行加工的情況下,也是一併實施和加工歷程記錄步驟1004同樣的加工歷程記錄處理。The processing of the to-
再者,在實施形態1之加工方法中,在加工歷程記錄步驟1004的加工歷程記錄處理中,包含在片匣更換步驟1006或加工重新開始步驟1008中一併實施的情況在內,若完成容置於片匣200之全部的被加工物100的加工後,加工歷程記錄部70會將已和容置於該片匣200之被加工物100的資訊建立對照之加工歷程資料71消除。因此,加工歷程記錄部70會成為以下狀態:僅記錄有已和容置於在加工中止步驟1005中加工已被中止的片匣200之被加工物100的資訊建立連繫的加工歷程資料71。Furthermore, in the processing method of
藉此,加工歷程記錄部70在不具有已和以讀取機60讀取到之容置於片匣200之被加工物100的資訊建立連繫之加工歷程資料71的情況下,可以視為容置於該片匣200之全部的被加工物100為未處理來處理,並且將該讀取處理當作讀取步驟1001來處理。另一方面,加工歷程記錄部70在具有已和以讀取機60讀取到之容置於片匣200之被加工物100的資訊建立連繫之加工歷程資料71的情況下,可以視為容置於該片匣200之被加工物100為已在加工中止步驟1005中進行加工中止來處理,並且將該讀取處理當作重新開始時條碼讀取步驟1007來處理。Thereby, the processing
具有如以上之構成的實施形態1之加工裝置1及實施形態1之加工方法是讀取機60讀取容置於片匣200之被加工物100的資訊傳輸媒介即條碼210,且加工歷程記錄部70將以讀取機60讀取到的被加工物100的資訊與加工歷程建立連繫並記錄,控制單元80在重新開始加工時,依據以讀取機60讀取到的被加工物100的資訊來調用加工歷程記錄部70所記錄的加工歷程,並依據所調用的加工歷程來重新開始加工。因此,實施形態1之加工裝置1及實施形態1之加工方法會發揮以下的作用效果:在更換了容置被加工物100之片匣200的情況下,即使操作人員未確認未處理的被加工物100,仍然可以在加工重新開始時容易地從未處理的加工起重新開始。又,實施形態1之加工裝置1及實施形態1之加工方法可以在更換了容置被加工物100之片匣200的情況下,防止以下疑慮:因為操作人員未確認,而導致跳過未處理的被加工物100的加工處理,且導致在具有未處理的被加工物100之狀態下直接前進至下一個步驟。The
[實施形態2] 依據圖式來說明本發明之實施形態2之加工裝置1-2及實施形態2之加工方法。圖4是顯示實施形態2之加工裝置1-2的構成例的立體圖。圖4對和實施形態1相同的部分附加相同的符號而省略說明。[Embodiment 2] The processing device 1-2 of the second embodiment and the processing method of the second embodiment of the present invention will be explained based on the drawings. Fig. 4 is a perspective view showing a configuration example of the processing apparatus 1-2 of the second embodiment. In FIG. 4, the same reference numerals are assigned to the same parts as in the first embodiment, and the description thereof will be omitted.
如圖4所示,實施形態2之加工裝置1-2是在實施形態1之加工裝置1中具備讀取機61來取代讀取機60,且取代片匣200而將片匣200-2載置於片匣載置台40。As shown in FIG. 4, the processing device 1-2 of the second embodiment is equipped with a
如圖4所示,片匣200-2是在設置於實施形態1之加工裝置1的片匣200中,取代條碼210而在側面設置有RFID標籤220,前述RFID標籤220是顯示容置於片匣200之被加工物100的資訊之資訊傳輸媒介。As shown in FIG. 4, the cassette 200-2 is installed in the
讀取機61是設置在當將片匣200-2載置於片匣載置台40時,和片匣200-2的RFID標籤220相向的位置。讀取機61在將片匣200-2載置於片匣載置台40時,會讀取RFID標籤220。在實施形態2中,讀取機61是RFID讀取器。The
接著,本說明書依據圖式來說明實施形態2之加工裝置1-2的動作之一例即實施形態2之加工方法。實施形態2之加工方法是以下之加工方法:在實施形態1之加工方法中,變更了讀取步驟1001與重新開始時條碼讀取步驟1007。Next, this specification describes the processing method of the second embodiment which is an example of the operation of the processing device 1-2 of the second embodiment based on the drawings. The processing method of Embodiment 2 is the following processing method: In the processing method of
實施形態2之讀取步驟1001是在片匣載置步驟1002的實施後實施。在實施形態2之讀取步驟1001及重新開始時條碼讀取步驟1007中,無論哪個步驟都是讀取機61在已將片匣200-2載置於片匣載置台40時,讀取RFID標籤220。關於其他的部分,實施形態2之讀取步驟1001以及重新開始時條碼讀取步驟1007則與實施形態1同樣。The
具有如以上的構成之實施形態2之加工裝置1-2是以下之加工裝置:在實施形態1之加工裝置1中,取代讀取機60而具備讀取機61,且取代設置有條碼210之片匣200而變更成將設置有RFID標籤220之片匣200-2載置於片匣載置台40。又,實施形態2之加工方法是以下之加工方法:在實施形態1之加工方法中,取代以讀取機60讀取條碼210之作法,而變更成以讀取機61讀取RFID標籤220。因此,實施形態2之加工裝置1-2及實施形態2之加工方法成為可發揮和實施形態1之加工裝置1及實施形態1之加工方法同樣的作用效果之構成。The processing device 1-2 of the second embodiment having the above configuration is the following processing device: the
又,實施形態2之加工裝置1-2及實施形態2之加工方法由於可以藉由將片匣200-2載置於片匣載置台40,而以讀取機61以自動方式來讀取RFID標籤220,因此進一步發揮可以防止RFID標籤220的忘記讀取之作用效果。In addition, the processing device 1-2 of the second embodiment and the processing method of the second embodiment can automatically read the RFID by the
[實施形態3] 依據圖式來說明本發明之實施形態3之加工裝置1-3及實施形態3之加工方法。圖5是顯示實施形態3之加工裝置1-3的構成例的立體圖。圖5對與實施形態1及實施形2相同的部分附加相同的符號而省略說明。[Embodiment 3] The processing device 1-3 of the third embodiment and the processing method of the third embodiment of the present invention will be explained based on the drawings. Fig. 5 is a perspective view showing a configuration example of the processing apparatus 1-3 of the third embodiment. In FIG. 5, the same reference numerals are assigned to the same parts as in the first embodiment and the second embodiment, and the description thereof is omitted.
如圖5所示,實施形態3之加工裝置1-3是以下之加工裝置:在實施形態1之加工裝置1中,取代加工單元20而具備加工單元20-3,且伴隨於此而變更了各機構的配置佈置、或加工單元20-3與保持工作台10之相對的移動機構等。實施形態3之加工裝置1-3具備和實施形態1之加工裝置1同樣的拍攝單元30、搬送臂50、顯示單元65及輸入單元66,但在圖5中其圖示被省略。As shown in Figure 5, the processing device 1-3 of the third embodiment is the following processing device: In the
加工單元20-3在實施形態3中是雷射加工單元,並包含雷射光線照射部24。雷射光線照射部24對已保持在保持工作台10之被加工物100照射雷射光線來進行雷射加工。在實施形態3中,拍攝單元30被固定在加工單元20-3,以和加工單元20-3一體地移動。The processing unit 20-3 is a laser processing unit in the third embodiment, and includes a laser
實施形態3之加工裝置1-3一邊藉由雷射光線照射部24照射雷射光線,一邊藉由X軸移動單元及Y軸移動單元而分別沿著X軸方向及Y軸方向使已保持在保持工作台10之被加工物100相對於雷射光線照射部24相對地移動,藉此沿著分割預定線102對被加工物100進行雷射加工,而沿著分割預定線102形成雷射加工溝。The processing device 1-3 of the third embodiment is irradiated with the laser beam by the laser
具有如以上之構成的實施形態3之加工裝置1-3及實施形態3之加工方法是以下之加工裝置及加工方法:在實施形態1之加工裝置1及實施形態1之加工方法中,取代以加工單元20對被加工物100進行切削加工之作法,而變更成以加工單元20-3對被加工物100進行雷射加工。因此,實施形態3之加工裝置1-3及實施形態3之加工方法成為可發揮和實施形態1之加工裝置1及實施形態1之加工方法同樣的作用效果之構成。The processing device 1-3 of
再者,實施形態3之加工裝置1-3及實施形態3之加工方法可以採用以下形態:取代以讀取機60讀取條碼210之作法,而以和實施形態2之加工裝置1-2及實施形態2之加工方法同樣的讀取機61來讀取RFID標籤220。Furthermore, the processing device 1-3 of the third embodiment and the processing method of the third embodiment can adopt the following forms: instead of using the
[實施形態4]
依據圖式來說明本發明之實施形態4之加工裝置1-4及實施形態4之加工方法。圖6是顯示實施形態4之加工裝置1-4的構成例的立體圖。圖6對與實施形態1、實施形態2及實施形3相同的部分附加相同的符號而省略說明。[Embodiment 4]
The processing device 1-4 of the fourth embodiment and the processing method of the fourth embodiment of the present invention will be explained based on the drawings. Fig. 6 is a perspective view showing a configuration example of a processing device 1-4 of the fourth embodiment. In FIG. 6, the same reference numerals are assigned to the same parts as those in the
如圖6所示,實施形態4之加工裝置1-4是以下之加工裝置:在實施形態1之加工裝置1中,取代加工單元20而具備加工單元20-4、20-5,且伴隨於此而變更了各機構的配置佈置、或加工單元20-4、20-5與保持工作台10的相對的移動機構等。實施形態4之加工裝置1-4省略了和實施形態1之加工裝置1同樣的拍攝單元30。實施形態4之加工裝置1-4具備和實施形態1之加工裝置1同樣的顯示單元65及輸入單元66,但在圖6中其圖示被省略。As shown in Fig. 6, the processing device 1-4 of the fourth embodiment is the following processing device: In the
如圖6所示,實施形態4之加工裝置1-4具備暫置工作台13與轉台15。暫置工作台13是供已從片匣200取出之被加工物100暫置,並進行其中心對位之工作台。As shown in FIG. 6, the processing apparatus 1-4 of the fourth embodiment includes a temporary table 13 and a
如圖6所示,保持工作台10在轉台15上設置有3個。此等3個保持工作台10在轉台15上以和轉台15獨立且可在大致水平面(XY平面)內旋轉的方式設置。如圖6所示,轉台15是圓盤狀的工作台,且是設置為可在水平面內旋轉並可用預定的時序來旋轉驅動。3個保持工作台10是在轉台15上以例如120°的相位角等間隔地配設。此等3個保持工作台10,可藉由轉台15的旋轉而依序移動至搬入搬出位置、粗磨削位置、精磨削位置、搬入搬出位置。As shown in FIG. 6, three holding
如圖6所示,加工單元20-4具備主軸25-4及磨削輪26-4,前述磨削輪26-4具有配置成環狀之磨削磨石27-4。磨削輪26-4裝設在主軸25-4的下端。加工單元20-4是以下之粗磨削加工單元:一邊藉由主軸25-4使磨削輪26-4繞著Z軸旋轉,一邊沿著Z軸方向按壓於被已定位於粗磨削位置之保持工作台10的保持面11所保持之被加工物100,藉此對被加工物100進行粗磨削。As shown in Fig. 6, the processing unit 20-4 includes a spindle 25-4 and a grinding wheel 26-4. The grinding wheel 26-4 has a grinding stone 27-4 arranged in a ring shape. The grinding wheel 26-4 is installed at the lower end of the main shaft 25-4. The processing unit 20-4 is the following rough grinding processing unit: While rotating the grinding wheel 26-4 around the Z axis by the spindle 25-4, it is pressed along the Z axis direction to the rough grinding position that has been positioned The
如圖6所示,加工單元20-5具備主軸25-5及磨削輪26-5,前述磨削輪26-5具有配置成環狀之磨削磨石27-5。加工單元20-5是以下之精磨削加工單元:一邊藉由主軸25-5使磨削輪26-5繞著Z軸旋轉,一邊沿著Z軸方向按壓於被已定位於精磨削位置之保持工作台10的保持面11所保持之被加工物100,藉此對被加工物100進行精磨削。As shown in Fig. 6, the processing unit 20-5 includes a spindle 25-5 and a grinding wheel 26-5. The grinding wheel 26-5 has a grinding stone 27-5 arranged in a ring shape. The processing unit 20-5 is the following finishing grinding processing unit: while rotating the grinding wheel 26-5 around the Z axis by the spindle 25-5, it is pressed along the Z axis direction to the position which has been positioned at the finishing grinding position The
如圖6所示,實施形態4之加工裝置1-4具備片匣載置台40-4,來取代實施形態1中的片匣載置台40。在圖6所示之例中,實施形態4之加工裝置1-4雖然將片匣載置台40-4設置於2處,但在本發明中並非限定於此,亦可設置於1處,亦可設置於3處以上。片匣載置台40-4是以下之構成:在實施形態1的片匣載置台40中,不具有在Z軸方向上升降之功能。As shown in FIG. 6, the processing apparatus 1-4 of
在實施形態4,搬送臂50具備搬送臂56、搬送臂57及搬送臂58。搬送臂56將切削加工前的被加工物100從片匣200搬出至暫置工作台13。搬送臂56將切削加工後的被加工物100從洗淨單元90搬入到片匣200。搬送臂56可以藉由使被加工物100的搬送高度在Z軸方向上升降,而變更將被加工物100搬出及搬入之槽202。搬送臂57將已被搬送臂56搬出之切削加工前的被加工物100從暫置工作台13搬送到已定位在搬入搬出位置之保持工作台10上。搬送臂58將切削加工後的被加工物100從已定位在搬入搬出位置之保持工作台10上搬送到洗淨單元90。In the fourth embodiment, the
具有如以上之構成的實施形態4之加工裝置1-4及實施形態4之加工方法是以下之加工裝置及加工方法:在實施形態1之加工裝置1及實施形態1之加工方法中,取代以加工單元20對被加工物100進行切削加工之作法,而變更成以加工單元20-4、20-5對被加工物100進行粗磨削加工及精磨削加工。因此,實施形態4之加工裝置1-4及實施形態4之加工方法成為可發揮和實施形態1之加工裝置1及實施形態1之加工方法同樣的作用效果之構成。The processing device 1-4 of the fourth embodiment and the processing method of the fourth embodiment having the above-mentioned configuration are the following processing device and processing method: in the
再者,實施形態4之加工裝置1-4及實施形態4之加工方法可以採用以下形態:取代以讀取機60讀取條碼210之作法,而以和實施形態2之加工裝置1-2及實施形態2之加工方法同樣的讀取機61來讀取RFID標籤220。Furthermore, the processing device 1-4 of the fourth embodiment and the processing method of the fourth embodiment can adopt the following forms: instead of using the
再者,本發明並不限定於上述實施形態。亦即,在不脫離本發明之要點的範圍內,可以進行各種變形來實施。In addition, the present invention is not limited to the above-mentioned embodiment. That is, various modifications can be made and implemented without departing from the gist of the present invention.
1,1-2,1-3,1-4:加工裝置
10:保持工作台
11:保持面
13:暫置工作台
15:轉台
20,20-3,20-4,20-5:加工單元
21:切削刀片
24:雷射光線照射部
25-4,25-5:主軸
26-4,26-5:磨削輪
27-4,27-5:磨削磨石
30:拍攝單元
40,40-4:片匣載置台
50,51,52,56,57,58:搬送臂
53:搬入搬出區域
60,61:讀取機
65:顯示單元
66:輸入單元
70:加工歷程記錄部
71:加工歷程資料
80:控制單元
90:洗淨單元
100:被加工物
101:正面
102:分割預定線
103:器件
104:背面
105:黏著膠帶
106:環狀框架
200,200-2:片匣
201:開口
202:槽
210:條碼
220:RFID標籤
X,Y,Z:方向
1001:讀取步驟
1002:片匣載置步驟
1003:加工步驟
1004:加工歷程記錄步驟
1005:加工中止步驟
1006:片匣更換步驟
1007:重新開始時條碼讀取步驟
1008:加工重新開始步驟1,1-2,1-3,1-4: processing device
10: Keep the workbench
11: Keep the noodles
13: Temporary workbench
15:
圖1是顯示實施形態1之加工裝置的構成例的立體圖。 圖2是顯示圖1之加工裝置的加工歷程記錄部所記錄的加工歷程資料之一例的圖。 圖3是顯示實施形態1之加工裝置的處理的順序之一例的流程圖。 圖4是顯示實施形態2之加工裝置的構成例的立體圖。 圖5是顯示實施形態3之加工裝置的構成例的立體圖。 圖6是顯示實施形態4之加工裝置的構成例的立體圖。Fig. 1 is a perspective view showing a configuration example of the processing apparatus of the first embodiment. Fig. 2 is a diagram showing an example of processing history data recorded by a processing history recording unit of the processing device of Fig. 1. Fig. 3 is a flowchart showing an example of the processing procedure of the processing apparatus of the first embodiment. Fig. 4 is a perspective view showing a configuration example of the processing apparatus of the second embodiment. Fig. 5 is a perspective view showing a configuration example of the processing apparatus of the third embodiment. Fig. 6 is a perspective view showing a configuration example of the processing apparatus of the fourth embodiment.
1:加工裝置1: Processing device
10:保持工作台10: Keep the workbench
11:保持面11: Keep the noodles
20:加工單元20: Processing unit
21:切削刀片21: Cutting blade
30:拍攝單元30: Shooting unit
40:片匣載置台40: Cassette mounting table
50,51,52:搬送臂50, 51, 52: transfer arm
53:搬入搬出區域53: Moving in and out of the area
60:讀取機60: Reader
65:顯示單元65: display unit
66:輸入單元66: input unit
70:加工歷程記錄部70: Processing History Recording Department
80:控制單元80: control unit
90:洗淨單元90: Washing unit
100:被加工物100: processed objects
101:正面101: front
102:分割預定線102: Divide the pre-determined line
103:器件103: Device
104:背面104: back
105:黏著膠帶105: Adhesive tape
106:環狀框架106: ring frame
200:片匣200: film cassette
201:開口201: opening
202:槽202: Slot
210:條碼210: Barcode
X,Y,Z:方向X, Y, Z: direction
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-069873 | 2020-04-08 | ||
JP2020069873A JP2021166275A (en) | 2020-04-08 | 2020-04-08 | Processing device and processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202139341A true TW202139341A (en) | 2021-10-16 |
Family
ID=77997492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110111204A TW202139341A (en) | 2020-04-08 | 2021-03-26 | Processing device and processing method characterized by easily restarting from the unprocessed processing when processing is resumed from replacing the cassette receiving a workpiece therein |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2021166275A (en) |
KR (1) | KR20210125417A (en) |
CN (1) | CN113496922A (en) |
TW (1) | TW202139341A (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004319961A (en) | 2003-03-31 | 2004-11-11 | Tokyo Electron Ltd | Substrate processing equipment, substrate processing method, and program for carrying out its method |
JP4569956B2 (en) | 2005-01-24 | 2010-10-27 | 東京エレクトロン株式会社 | Substrate processing apparatus restoration processing method, substrate processing apparatus, and program |
-
2020
- 2020-04-08 JP JP2020069873A patent/JP2021166275A/en active Pending
-
2021
- 2021-03-17 KR KR1020210034343A patent/KR20210125417A/en active Search and Examination
- 2021-03-26 TW TW110111204A patent/TW202139341A/en unknown
- 2021-04-02 CN CN202110360510.XA patent/CN113496922A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20210125417A (en) | 2021-10-18 |
JP2021166275A (en) | 2021-10-14 |
CN113496922A (en) | 2021-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI757264B (en) | Processing device | |
KR102345188B1 (en) | Processing apparatus | |
JP5389580B2 (en) | Cutting equipment | |
TWI732933B (en) | Processing device | |
JP6957096B2 (en) | Dressing board, how to use it and cutting equipment | |
TW202139341A (en) | Processing device and processing method characterized by easily restarting from the unprocessed processing when processing is resumed from replacing the cassette receiving a workpiece therein | |
TWI813825B (en) | Processing device | |
JP2018117003A (en) | Wafer processing device | |
JP6105308B2 (en) | Processing equipment | |
JP2014154633A (en) | Processing device | |
TW202407780A (en) | Processing device | |
JP7442342B2 (en) | Export method and equipment | |
JP3222726U (en) | Cutting equipment | |
JP7229640B2 (en) | cutting equipment | |
JP2024073263A (en) | Processing Equipment | |
JP2021169135A (en) | Cutting method and cutting device | |
JP2023163591A (en) | Inspection method of workpiece, inspection device, processing method, and processing device | |
JP2022059155A (en) | Cutting device | |
JP2022083252A (en) | Processing device and processing method | |
TW202215572A (en) | Processing device and using method of the processing device Capable of preventing input errors of information | |
TW202412155A (en) | Installation method and cutting device | |
JP2021030320A (en) | Dressing plate and dressing method for cutting blade | |
CN116779472A (en) | Method for treating workpiece | |
TW202408707A (en) | Inspection method and inspection device of workpiece, processing method, processing device | |
TW202145326A (en) | Processing apparatus which comprises a movable unit, an input unit, a display unit, and a control unit |