JP2020136489A - Transport device - Google Patents

Abstract

To enable a low cost and suppression of duration required for completion.SOLUTION: A division device 1 at least comprises: a cutting unit that divides a processed material 200 held by a holding table into a plurality of device chips; a cleaning unit 70 that cleans the processed material 200 to be divided; a drying unit 80 that dries the processed material 200 after the cleaning; a housing tray 90 housing the processed material 200 after the drying; and a first transfer arm 120 and a second transfer arm 130 that transfer the processed material 200. The first transfer arm 120 and the second transfer arm 130 are supported by the same ball screw, and a third interval 303 in which the first transfer arm 120 and the second transfer arm 130 are arranged and intervals 301 and 302 in which the cleaning unit 70, the drying unit 80, and the housing tray 90 are arranged are equivalent.SELECTED DRAWING: Figure 5

Description

The present invention relates to a transport device.

In semiconductor package technologies such as CSP (Chip Size Package) and QFN (Quad Flat Non-leaded Package), a dividing device that divides a package substrate in which a plurality of device chips are sealed with resin or the like into individual device chips is used. (See, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2014-116461

The splitting device shown in Patent Document 1 that has been conventionally used includes a first transport arm that transports the divided device chips from the holding table to the cleaning means, from the cleaning means to the drying means, and from the drying means to the storage tray. A second transfer arm that conveys the divided device chip was supported by separate ball screws. Therefore, in the dividing device shown in Patent Document 1, the number of parts increases, and it takes a lot of cost and time to procure a ball screw that meets the customer's specifications.

The present invention has been made in view of such problems, and an object of the present invention is to provide a transport device capable of reducing the cost and the time required for completion.

In order to solve the above-mentioned problems and achieve the object, the transport device of the present invention cleans the divided means for dividing the workpiece held on the holding table into a plurality of chips and the divided workpieces. Each of the cleaning means, the drying means for drying the work piece after washing, the storage tray for storing the work piece after drying, the holding table, the washing means, the drying means, and the storage tray adjacent to each other. A transport device including at least a first transport arm and a second transport arm that transport the work piece to the mechanism, and the first transport arm and the second transport arm have the same ball screw. It is characterized in that the distance between the first transport arm and the second transport arm that is supported and the spacing between the cleaning means, the drying means, and the storage tray is equal.

In the transport device, the first transport arm transports the workpiece from the holding table to the cleaning means and from the cleaning means to the drying means, and the second transport arm is the drying. The workpiece may be conveyed from the means to the storage tray.

The invention of the present application has the effect of reducing the cost and suppressing the time required for completion.

FIG. 1 is a perspective view showing a configuration example of a division device which is a transfer device according to the first embodiment. FIG. 2 is a perspective view showing an example of a work piece to be processed by the dividing device shown in FIG. FIG. 3 is a perspective view showing a configuration example of a storage tray of the dividing device shown in FIG. FIG. 4 is a perspective view showing a first transport arm, a second transport arm, and a moving mechanism of the dividing device shown in FIG. FIG. 5 is a diagram schematically showing the relative positional relationship between the first transport arm, the second transport arm, the washing unit, the drying unit, and the storage tray of the dividing device shown in FIG. FIG. 6 is a diagram schematically showing a state in which the cleaning unit finishes cleaning the work piece and the drying unit finishes drying the work piece during the machining operation of the dividing device shown in FIG. FIG. 7 schematically shows a state in which the suction pad of the first transfer arm is opposed to the cleaning unit and the suction pad of the second transfer arm is opposed to the drying unit during the processing operation of the dividing device shown in FIG. It is a figure which shows. FIG. 8 shows that the workpiece on the cleaning unit is sucked and held by the suction pad of the first transport arm during the machining operation of the dividing device shown in FIG. 7, and the workpiece on the drying unit is sucked and held in the second transport. It is a figure which shows typically the state which sucked and held by the suction pad of an arm. FIG. 9 is a diagram schematically showing a state in which the suction pad of the first transfer arm is raised and the suction pad of the second transfer arm is raised during the machining operation of the dividing device shown in FIG. .. FIG. 10 schematically shows a state in which the suction pad of the first transport arm is opposed to the drying unit and the suction pad of the second transport arm is opposed to the storage tray during the processing operation of the dividing device shown in FIG. It is a figure which shows. FIG. 11 is a diagram schematically showing a state in which the suction pad of the first transfer arm is lowered and the suction pad of the second transfer arm is lowered during the machining operation of the dividing device shown in FIG. .. FIG. 12 shows that during the machining operation of the dividing device shown in FIG. 11, the suction holding of the suction pad of the first transfer arm is released and raised, and the suction holding of the suction pad of the second transfer arm is released. It is a figure which shows typically the raised state.

The embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The transport device according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a division device which is a transfer device according to the first embodiment. FIG. 2 is a perspective view showing an example of a work piece to be processed by the dividing device shown in FIG. FIG. 3 is a perspective view showing a configuration example of a storage tray of the dividing device shown in FIG. FIG. 4 is a perspective view showing a first transport arm, a second transport arm, and a moving mechanism of the dividing device shown in FIG. FIG. 5 is a diagram schematically showing the relative positional relationship between the first transport arm, the second transport arm, the cleaning unit, the drying unit, and the storage tray of the dividing device shown in FIG.

The dividing device 1 shown in FIG. 1, which is a conveying device according to the first embodiment, is an apparatus for cutting the workpiece 200 shown in FIG. As shown in FIG. 2, the workpiece 200 to be processed by the dividing device 1 shown in FIG. 1 according to the first embodiment is formed into a flat plate having a rectangular planar shape. In the first embodiment, as shown in FIG. 2, the workpiece 200 is configured by mounting a plurality of semiconductor chips on a frame substrate 201 such as a lead frame and bonding them, and sealing each semiconductor chip with a resin. It is a so-called package substrate.

The electrodes of each semiconductor chip are connected to a plurality of bumps 202, respectively. A plurality of scheduled division lines 203 are formed in a grid pattern on the surface of the workpiece 200, and semiconductor chips are mounted in each region partitioned by the scheduled division lines 203. The workpiece 200 configured as described above is divided into individual device chips (corresponding to the chips described in the claims) 204 by cutting the planned division line 203 by the dividing device 1 shown in FIG. To.

The dividing device 1 is an device that holds the workpiece 200 on the holding table 10 and cuts along a plurality of scheduled division lines 203. In the first embodiment, the dividing device 1 is a device that holds the workpiece 200 to which the dicing tape is not attached on the holding table 10 and divides the workpiece 200 into device chips 204 by so-called full cutting.

As shown in FIG. 2, the dividing device 1 cuts the holding table 10 that sucks and holds the workpiece 200 on the holding surface 11 and the scheduled division line 203 of the workpiece 200 that is sucked and held by the holding table 10 by the cutting blade 21. A cutting unit 20 and a control unit 100, which are dividing means for dividing the workpiece 200 into a plurality of device chips 204, are provided.

The holding table 10 is formed in a rectangular shape and includes a holding surface 11 for holding the workpiece 200. The holding surface 11 is provided with a suction hole (not shown) for sucking the workpiece 200 and the device tip 204, and a relief groove (not shown) for letting the cutting blade 21 escape. The suction hole is provided at a position overlapping the device chip 204 and is open to the holding surface 11. In the first embodiment, the suction holes correspond one-to-one with the device chip 204. The relief groove is provided at a position corresponding to the planned division line 203 and is formed concave from the holding surface 11.

The holding table 10 has a suction hole connected to a vacuum suction source (not shown), and the suction hole is sucked by the vacuum suction source to suck and hold the workpiece 200 on the holding surface 11. Further, the holding table 10 is movably provided in the X-axis direction by a machining feed unit (not shown) and rotatably around the axis parallel to the Z-axis direction by the rotation drive source 12. In the first embodiment, one holding table 10 is installed on the rotary drive source 12.

The cutting unit 20 cuts the workpiece 200. The cutting unit 20 includes a spindle (not shown) equipped with a cutting blade 21 for cutting the workpiece 200 held on the holding table 10.

The cutting blade 21 is an ultra-thin cutting grindstone having a substantially ring shape. The spindle cuts the workpiece 200 by rotating the cutting blade 21. The spindle is housed in the spindle housing 22. The axes of the spindle of the cutting unit 20 and the cutting blade 21 are set parallel to the Y-axis direction.

The cutting unit 20 is provided so as to be movable in the Y-axis direction by an indexing feed unit (not shown) with respect to the workpiece 200 held on the holding table 10, and is movable in the Z-axis direction by a cutting feed unit (not shown). It is provided in. The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the holding table 10 by the indexing feed unit and the cutting feed unit. The cutting unit 20 is a workpiece 200 held on a holding table 10 which is moved in the Y-axis direction and the Z-axis direction by the indexing feed unit and the cutting feed unit, and is moved in the X-axis direction by the machining feed unit. The planned division line 203 is cut to divide the workpiece 200 into a plurality of device chips 204.

Further, the dividing device 1 includes a cassette 30 for accommodating a plurality of workpieces 200 before cutting, a carry-out unit 40 for taking out the workpiece 200 from the cassette 30, and a workpiece 200 before machining taken out from the cassette 30. The package transport unit 50 that transports the machine to the holding table 10, the imaging unit 60 that captures the image of the workpiece 200 before processing and acquires an image for alignment, and the workpiece 200 divided into individual device chips 204. It is divided into a cleaning unit 70 which is a cleaning means for cleaning the lower surface of the device, a drying unit 80 which is a drying means for drying the workpiece 200 after cleaning by the cleaning unit 70, and individual device chips 204 after drying by the drying unit 80. A storage tray 90 shown in FIG. 3 for storing the work piece 200, a storage tray mounting portion 91 on which the storage tray 90 is mounted, and a transport unit 110 as a transport means are provided.

The cassette 30 accommodates a plurality of workpieces 200. The cassette 30 accommodates a plurality of workpieces 200 at intervals in the Z-axis direction. The cassette 30 includes an opening 31 that allows the work piece 200 to be taken in and out freely. The cassette 30 is provided so as to be able to move up and down in the Z-axis direction by a cassette elevator (not shown).

The unloading unit 40 includes a unloading stage 41 for taking out one work piece 200 before processing from the cassette 30, and a pair of rails 42 for temporarily placing the work piece 200 taken out from the cassette 30. The package transfer unit 50 sucks and holds the workpiece 200 on the pair of rails 42, conveys the suction-held workpiece 200 to the holding table 10, and places it on the holding surface 11 of the holding table 10.

The image pickup unit 60 outputs the image obtained by taking a picture to the control unit 100. In the first embodiment, the imaging unit 60 is attached to the package transport unit 50. The cleaning unit 70 is provided between the holding table 10 and the storage tray mounting portion 91. The drying unit 80 is provided between the cleaning unit 70 and the storage tray mounting portion 91.

The storage tray mounting portion 91 mounts the storage tray 90 on the upper surface 92. The upper surface 92 of the storage tray mounting portion 91 is formed flat along the horizontal direction, and is formed larger than the planar shape of the workpiece 200 and the storage tray 90. The storage tray mounting unit 91 may be designed so that a plurality of storage trays 90 are stacked and stored, and the plurality of storage trays 90 can be pulled out from the front surface of the device. Further, in this case, the storage tray mounting portion 91 may further include a driving means for moving the storage tray mounting portion 91 up and down in order to mount the storage tray 90 below.

The storage tray 90 mounted on the upper surface 92 of the storage tray mounting portion 91 accommodates and conveys a plurality of device chips 204 formed by dividing the workpiece 200 along the planned division line 203. belongs to. As shown in FIG. 3, the storage tray 90 includes a tray main body 93 and a tack layer 94.

The tray body 93 is formed in a flat plate shape having a rectangular flat surface shape, and is formed by surrounding a device support portion 95 having a recess having a size capable of accommodating a workpiece 200 and an outer circumference of the device support portion 95. It includes a frame body 96.

The device support portion 95 is formed of a concave recess from the upper surface of the storage tray 90, and in the first embodiment, the device support portion 95 is formed in a rectangular shape larger than the planar shape of the workpiece 200. The device support 95 has a surface at the bottom that supports the plurality of device chips 204 via the tack layer 94. The surface is formed flat along the horizontal direction. The surface of the device support portion 95 is set so that all of the device chips 204 separated from the workpiece 200 can be accommodated at one time.

The frame body 96 is formed so as to surround the outer periphery of the surface of the device support portion 95. The tack layer 94 is provided on the surface of the device support portion 95 of the tray body 93 and is mounted on the surface of the device support portion 95. The tack layer 94 is exposed on the device support 95.

The tack layer 94 has an adhesive force (that is, a tack force) for adhering a plurality of device chips 204. In the first embodiment, the tack layer 94 is arranged on the entire surface of the device support portion 95, and has a constant thickness. The tack layer 94 can be made of, for example, a temperature-sensitive adhesive sheet Intellimar (registered trademark) tape manufactured by Nitta Corporation.

In the storage tray 90, a plurality of device chips 204 that have been cut into pieces by cutting the work piece 200 are attached to the tack layer 94 and housed at one time. In the storage tray 90 accommodating the plurality of device chips 204 in this way, since each device chip 204 is attached to the tack layer 94, the device chip 204 housed in the device support portion 95 moves during transportation to move the other device chips 204. It is possible to prevent the device chip 204 from coming into contact with the device chip 204 and causing a chip on the outer periphery of the device chip 204, or to prevent the device chip 204 from protruding from the device support portion 95 and being damaged.

Further, the dividing device 1 includes a top surface cleaning unit (not shown) that cleans the upper surface of the workpiece 200 before the drying unit 80 dries the workpiece 200.

The transport unit 110 mounts the work piece 200 after cutting, that is, a plurality of device chips 204 on the holding table 10, the cleaning unit 70, the drying unit 80, and the upper surface 92 of the storage tray mounting portion 91 along the Y-axis direction. It is transported to and from the placed storage tray 90. That is, in the first embodiment, in the Y-axis direction, the holding table 10, the cleaning unit 70, the drying unit 80, and the storage tray 90 mounted on the upper surface 92 of the storage tray mounting portion 91 are processed. This is the direction in which the object 200 is transported (moved).

As shown in FIGS. 1 and 4, the transport unit 110 includes a first transport arm 120, a second transport arm 130, and a moving mechanism 140 (shown only in FIG. 4). The first transport arm 120 and the second transport arm 130 are adjacent to each other between the holding table 10, the cleaning unit 70, the drying unit 80, and the storage tray 90 mounted on the upper surface 92 of the storage tray mounting portion 91. The workpiece 200 is conveyed to each mechanism to be processed.

The first transfer arm 120 transfers the work piece 200 after cutting, that is, a plurality of device chips 204 from the holding table 10 to the cleaning unit 70. The first transfer arm 120 transfers the work piece 200 after cutting, that is, a plurality of device chips 204 from the cleaning unit 70 to the drying unit 80. The first transfer arm 120 is attached to an arm body 121 that is moved in the Y-axis direction by the moving mechanism shown in FIG. 4, an air cylinder 122 attached to the tip of the arm body 121, and a lower end of a rod 123 of the air cylinder 122. It is provided with an attached suction pad 124.

The arm body 121 extends upward from the moving mechanism 140 in parallel with the X-axis direction, above the holding table 10, the cleaning unit 70, and the drying unit 80. In the air cylinder 122, the cylinder body 125 is attached to the tip of the arm body 121. The rod 123 is formed in a rod shape in the Z-axis direction, is expandable and contractible from the cylinder body 125, and extends downward when extended from the cylinder body 125. The suction pad 124 sucks and holds the workpiece 200 after cutting, that is, a plurality of device chips 204.

The second transport arm 130 transports the work piece 200 after cutting, that is, a plurality of device chips 204 from the drying unit 80 to the storage tray 90 mounted on the upper surface 92 of the storage tray mounting portion 91. The second transfer arm 130 is attached to an arm body 131 that is moved in the Y-axis direction by the moving mechanism shown in FIG. 4, an air cylinder 132 attached to the tip of the arm body 131, and a rod 133 of the air cylinder 132. It is provided with an attached suction pad 134.

The arm body 131 extends upward from the moving mechanism 140 in parallel with the X-axis direction, above the holding table 10, the cleaning unit 70, and the drying unit 80. In the air cylinder 132, the cylinder body 135 is attached to the tip of the arm body 131. The rod 133 is formed in a rod shape in the Z-axis direction, is expandable and contractible from the cylinder body 135, and extends downward when extended from the cylinder body 135. The suction pad 134 sucks and holds the workpiece 200 after cutting, that is, a plurality of device chips 204.

The moving mechanism 140 integrally moves the first transport arm 120 and the second transport arm 130 in the Y-axis direction. That is, the moving mechanism 140 moves the first transport arm 120 and the second transport arm 130 integrally between the holding table 10, the cleaning unit 70, the drying unit 80, and the storage tray 90.

As shown in FIG. 4, the moving mechanism 140 includes a ball screw 141, a pulse motor 142, a moving base 143, and a guide rail 144. The ball screw 141 is rotatably provided around the axis and parallel to the Y-axis direction on the erection plate portion 3 (shown in FIG. 4) erected from the device main body 2 of the dividing device 1 in the Z-axis direction. .. The pulse motor 142 rotates the ball screw 141 around the axis. The movement base 143 moves in the Y-axis direction when the ball screw 141 rotates around the axis. In the moving base 143, the base end portion of the arm body 121 of the first transport arm 120 and the base end portion of the arm body 131 of the second transport arm 130 are fixed. In this way, the first transfer arm 120 and the second transfer arm 130 are supported by the same ball screw 141. The guide rail 144 movably supports the moving base 143 in the Y-axis direction.

In the moving mechanism 140, the pulse motor 142 rotates the ball screw 141 around the axis to integrally move the moving base 143, that is, the first transport arm 120 and the second transport arm 130 in the Y-axis direction.

Further, as shown in FIG. 5, in the dividing device 1, the cleaning unit 70 and the drying unit 80 are arranged with a first interval 301 in the Y-axis direction, and the drying unit 80 and the storage tray mounting portion 91 are arranged. The storage tray 90 placed on the upper surface is arranged with a second interval 302. In the first embodiment, the first interval 301 is a workpiece 200 (shown by a dotted line in FIG. 5) positioned at a regular position of the cleaning unit 70 and a cover positioned at a regular position of the drying unit 80. It is the distance in the Y-axis direction with the work piece 200 (indicated by the dotted line in FIG. 5). In the first embodiment, the second interval 302 is placed on the workpiece 200 (shown by the dotted line in FIG. 5) positioned at the regular position of the drying unit 80 and the upper surface 92 of the storage tray mounting portion 91. It is the distance in the Y-axis direction from the workpiece 200 (indicated by the dotted line in FIG. 5) positioned at the regular position of the storage tray 90.

Further, as shown in FIG. 5, in the dividing device 1, the first transport arm 120 and the second transport arm 130 are arranged with a third distance 303 in the Y-axis direction. In the first embodiment, the third interval 303 refers to the workpiece 200 (shown by the dotted line in FIG. 5) that is suction-held at the regular position of the suction pad 124 of the first transfer arm 120 and the second transfer. It is the distance in the Y-axis direction between the workpiece 200 (shown by the dotted line in FIG. 5) that is suction-held at the normal position of the suction pad 134 of the arm 130. In the dividing device 1, the first interval 301, the second interval 302, and the third interval 303 are the same. That is, the third interval 303 in which the first transfer arm 120 and the second transfer arm 130 are arranged and the intervals 301 and 302 in which the cleaning unit 70, the drying unit 80, and the storage tray 90 are arranged are equal. ..

The control unit 100 controls each component of the dividing device 1 to cause the dividing device 1 to perform a machining operation on the workpiece 200. The control unit 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input / output interface device. It is a computer having and. The arithmetic processing unit of the control unit 100 executes arithmetic processing according to a computer program stored in the storage device, and outputs a control signal for controlling the division device 1 to the division device 1 via the input / output interface device. Output to the specified components.

The control unit 100 is connected to a display device 105 composed of a liquid crystal display device for displaying the state of machining operation, an image, and the like, and an input device 106 used by an operator to register machining content information and the like. The input device 106 is composed of a touch panel provided on the display device 105 and an external input device 107 such as a keyboard.

Next, the machining operation of the dividing device 1 according to the first embodiment will be described. FIG. 6 is a diagram schematically showing a state in which the cleaning unit finishes cleaning the work piece and the drying unit finishes drying the work piece during the machining operation of the dividing device shown in FIG. FIG. 7 schematically shows a state in which the suction pad of the first transfer arm is opposed to the cleaning unit and the suction pad of the second transfer arm is opposed to the drying unit during the processing operation of the dividing device shown in FIG. It is a figure which shows. FIG. 8 shows that the workpiece on the cleaning unit is sucked and held by the suction pad of the first transport arm during the machining operation of the dividing device shown in FIG. 7, and the workpiece on the drying unit is sucked and held in the second transport. It is a figure which shows typically the state which sucked and held by the suction pad of an arm. FIG. 9 is a diagram schematically showing a state in which the suction pad of the first transfer arm is raised and the suction pad of the second transfer arm is raised during the machining operation of the dividing device shown in FIG. .. FIG. 10 schematically shows a state in which the suction pad of the first transport arm is opposed to the drying unit and the suction pad of the second transport arm is opposed to the storage tray during the processing operation of the dividing device shown in FIG. It is a figure which shows. FIG. 11 is a diagram schematically showing a state in which the suction pad of the first transfer arm is lowered and the suction pad of the second transfer arm is lowered during the machining operation of the dividing device shown in FIG. .. FIG. 12 shows that during the machining operation of the dividing device shown in FIG. 11, the suction holding of the suction pad of the first transfer arm is released and raised, and the suction holding of the suction pad of the second transfer arm is released. It is a figure which shows typically the raised state.

First, the operator accommodates the workpiece 200 before cutting in the cassette 30, mounts the accommodation tray 90 on the accommodation tray mounting unit 91, and operates the input device 106 to transfer the processing content information to the control unit 100. sign up. When the control unit 100 receives an instruction to start the machining operation from the operator, the dividing device 1 starts the machining operation.

In the machining operation, the dividing device 1 causes the unloading unit 40 to take out one workpiece 200 from the cassette 30, and causes the package transport unit 50 to transport the workpiece 200 from the rail 42 onto the holding table 10. In the machining operation, the dividing device 1 sucks and holds the workpiece 200 on the holding surface 11 of the holding table 10 at the vacuum suction source, and the machining feed unit moves the holding table 10 downward of the imaging unit 60. The image pickup unit 60 is made to image the workpiece 200, and the alignment is performed.

In the machining operation, the dividing device 1 divides the cutting unit 20 and the holding table 10 by the machining feed unit, the index feed unit, the cut feed unit, and the rotary drive source 12 along the scheduled division line 203 based on the machining content information. The cutting blade 21 is cut into the planned division line 203 until it reaches the relief groove, and the planned division line 203 is cut.

In the machining operation, after the cutting blade 21 cuts all the scheduled division lines 203, the dividing device 1 causes the first transfer arm 120 to suck and hold the device chip 204 on the holding table 10. The device chip 204 is sucked and held. The dividing device 1 releases the suction holding of the holding table 10, and causes the device chip 204 sucked and held by the first transfer arm 120 to be conveyed to the cleaning unit 70 at once.

In the processing operation, the dividing device 1 causes the cleaning unit 70 to clean the device chip 204, and then causes the first transport arm 120 to suck and hold the cleaned device chip 204 and transport it to the drying unit 80. After the splitting device 1 dries the device chip 204 on the drying unit 80, the splitting device 1 causes the second transport arm 130 to suck and hold the device chip 204 after cutting, cleaning, and drying, and places the device chip 204 on the storage tray. It is conveyed to the storage tray 90 placed on the unit 91.

The dividing device 1 presses the device chip 204 sucked and held by the second transport arm 130 against the tack layer 94 of the storage tray 90 to adhere the device chip 204 to the tack layer 94, and then the second transport arm 130. Release the suction holding.

The storage tray 90 to which the device chip 204 is attached to the tack layer 94 is transported to the next process by an operator or the like, and the storage tray mounting portion 91 to which the storage tray 90 is transported to the next process is newly transferred by the operator or the like. The storage tray 90 is placed. The device chip 204 attached to the tack layer 94 of the storage tray 90 conveyed to the next step is individually picked up from the tack layer 94.

The dividing device 1 cuts the next work piece 200, cuts the work piece 200 in the cassette 30 in order, and cuts all the work pieces 200 in the cassette 30, and ends the machining operation. ..

Further, in the processing operation of the dividing device 1, as shown in FIG. 6, after the cleaning unit 70 finishes cleaning the work piece 200 and the drying unit 80 finishes drying the work piece 200, these objects are covered. The work piece 200 is conveyed as follows. As shown in FIG. 7, the dividing device 1 makes the suction pad 124 of the first transport arm 120 face the workpiece 200 on the cleaning unit 70 in the Z-axis direction, and makes the workpiece 200 on the drying unit 80 face the workpiece 200. The suction pads 134 of the second transfer arm 130 are opposed to each other in the Z-axis direction. As shown in FIG. 8, the dividing device 1 lowers the suction pad 124 of the first transfer arm 120 to suck and hold the workpiece 200 on the cleaning unit 70 on the suction pad 124, and the second transfer arm 130. The suction pad 134 of the above is lowered to suck and hold the workpiece 200 on the drying unit 80 on the suction pad 134.

As shown in FIG. 9, the dividing device 1 raises the suction pad 124 of the first transfer arm 120 and raises the suction pad 134 of the second transfer arm 130. The dividing device 1 moves the first transport arm 120 and the second transport arm 130 in the Y-axis direction, and as shown in FIG. 10, Z the suction pad 124 of the first transport arm 120 is attached to the drying unit 80. The suction pad 134 of the second transport arm 130 is opposed to the storage tray 90 on the upper surface 92 of the storage tray mounting portion 91 in the Z-axis direction so as to face the storage tray 90 in the axial direction. As shown in FIG. 11, the dividing device 1 lowers the suction pad 124 of the first transport arm 120, places the workpiece 200 sucked and held by the suction pad 124 on the drying unit 80, and places the second work piece 200 on the drying unit 80. The suction pad 134 of the transfer arm 130 is lowered, and the workpiece 200 sucked and held by the suction pad 134 is pressed against the tack layer 94 of the storage tray 90. The dividing device 1 releases the suction holding of the suction pad 124 of the first transfer arm 120, releases the suction holding of the suction pad 134 of the second transfer arm 130, and releases the suction pad 124 as shown in FIG. ， 134 is raised.

In the dividing device 1 according to the first embodiment described above, by making the first interval 301, the second interval 302, and the third interval 303 the same, one ball screw 141 and two transfer arms 120 , 130 can be supported, but these two transfer arms 120 and 130 can transfer the workpiece 200. As a result, the dividing device 1 has the effect of reducing the number of parts, reducing the cost, and suppressing the time required for completion.

Further, the dividing device 1 transports the two workpieces 200 to the next process by one operation of the moving mechanism by making the first interval 301, the second interval 302, and the third interval 303 the same. Can be done.

The present invention is not limited to the above embodiment. That is, it can be modified in various ways without departing from the gist of the present invention. In the first embodiment, one holding table 10 is installed on the rotary drive source 12, but in the present invention, a plurality of holding tables 10 may be installed on the rotary drive source 12.

1 Partitioning device (conveying device)
10 Holding table 20 Cutting unit (splitting means)
70 Cleaning unit (cleaning means)
80 Drying unit (drying means)
90 Storage tray 120 1st transfer arm 130 2nd transfer arm 141 Ball screw 200 Work piece 204 Device chip (chip)
301 1st interval 302 2nd interval 303 3rd interval

Claims (2)

A dividing means for dividing the workpiece held on the holding table into a plurality of chips, and
Cleaning means for cleaning the divided workpieces,
A drying means for drying the work piece after cleaning,
A storage tray for storing the work piece after drying,
A first transport arm and a second transport arm that transport the workpiece to each mechanism adjacent to the holding table, the cleaning means, the drying means, and the storage tray,
It is a transport device equipped with at least
The first transfer arm and the second transfer arm are supported by the same ball screw, and are supported by the same ball screw.
The distance between the first transfer arm and the second transfer arm,
A transport device characterized in that the intervals at which the cleaning means, the drying means, and the storage tray are arranged are equal. The first transport arm
From the holding table to the cleaning means,
The workpiece is transported from the cleaning means to the drying means,
The second transport arm
The transport device according to claim 1, wherein the workpiece is transported from the drying means to the storage tray.

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