JP2022142633A - Positioning mechanism and semiconductor processing device - Google Patents

Abstract

To suppress dust emission.SOLUTION: A positioning mechanism 70 is a mechanism for positioning a cassette 50 housing a plate-like material processed by a semiconductor processing device 1 on an upper surface 61 of a cassette stage 60. The cassette 50 includes: opposite side plates; an upper plate and a bottom plate, for coupling side plates; a plurality of housing shelves which is formed in the side plate and houses the plate-like material; an open part to/from which the plate-like material is carried-in/out; and a back-surface plate opposite to the open part. The positioning mechanism 70 includes: an open part positioning part 73 that positions a corner part as an edge of the open part to/from which the plate-like material is carried-in/out; a back-surface roller 71 in contact with the back surface plate; an open part positioning part 73; and a bottom surface roller 72 that is installed in a space from the back surface roller 71 so as to be in contact with the back surface roller 71, and supports an end part on the back surface plate side of the bottom plate of the cassette 50.SELECTED DRAWING: Figure 3

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning mechanism and a semiconductor processing apparatus for positioning a cassette containing plate-like objects on a cassette stage.

2. Description of the Related Art In a process for processing semiconductor wafers, a plate-like object such as a semiconductor wafer is accommodated in a cassette (see, for example, Patent Document 1). In a semiconductor wafer processing process, a semiconductor processing apparatus places a cassette containing a plate-shaped object to be processed on a cassette stage, carries in and out the plate-shaped object from the cassette stage by an arbitrary transport unit, and carries out various processes. process.

Therefore, in the semiconductor processing apparatus, it is necessary to install the cassette at a predetermined position on the cassette stage.

JP 2014-78656 A

However, when the cassette is positioned on the cassette stage, the corners of the cassette rub against each other, dust is generated, and there is a risk that the dust floating in the semiconductor processing apparatus will adhere to the wafer.

SUMMARY OF THE INVENTION An object of the present invention is to provide a positioning mechanism and a semiconductor processing apparatus capable of suppressing dust generation.

In order to solve the above-described problems and achieve the object, a positioning mechanism of the present invention positions a cassette containing a plate-like object to be processed by a semiconductor processing apparatus on the upper surface of a cassette stage on which the cassette is installed. A mechanism, wherein the cassette includes side plates facing each other, a top plate and a bottom plate connecting the side plates, a plurality of storage shelves formed on the side plates for storing plate-like objects, and the plate-like objects being carried in and out. The positioning mechanism has an opening and a back face facing the opening, and the positioning mechanism contacts the back face and the opening positioning part for positioning the opening through which the plate-like object is carried in and out. A back surface roller, the opening positioning part, and a bottom surface roller installed between the back surface roller and the back surface roller in the vicinity of the back surface roller to support the back surface side of the cassette. .

In the positioning mechanism, the opening positioning part includes an opening roller that contacts the edge of the opening into which the plate-shaped object is carried in and out, the opening roller, and the back roller. a support block positioned adjacent to the aperture roller and having the same height as the bottom roller to support the aperture side of the cassette.

A semiconductor processing apparatus according to the present invention is a semiconductor processing apparatus for processing a plate-like object, comprising: a cassette stage on which a cassette containing the plate-like object is installed; a positioning mechanism for positioning the cassette on the upper surface of the cassette stage; and the positioning mechanism is provided as the positioning mechanism.

ADVANTAGE OF THE INVENTION This invention is effective in the ability to suppress dust generation.

FIG. 1 is a perspective view showing a configuration example of a semiconductor processing apparatus according to Embodiment 1. FIG. FIG. 2 is a perspective view showing a configuration example of a cassette installed on the cassette stage of the semiconductor processing apparatus shown in FIG. 3 is a plan view schematically showing the positioning mechanism according to the first embodiment; FIG. 4 is a side view schematically showing the positioning mechanism shown in FIG. 3. FIG. 5 is a plan view schematically showing a positioning mechanism according to a modification of the first embodiment; FIG.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A positioning mechanism and a semiconductor processing apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a semiconductor processing apparatus according to Embodiment 1. FIG. FIG. 2 is a perspective view showing a configuration example of a cassette installed on the cassette stage of the semiconductor processing apparatus shown in FIG. 3 is a plan view schematically showing the positioning mechanism according to the first embodiment; FIG. 4 is a side view schematically showing the positioning mechanism shown in FIG. 3. FIG.

A semiconductor processing apparatus 1 according to Embodiment 1 is an apparatus for processing a plate-like object 200 . In the first embodiment, the plate-like object 200 to be processed by the semiconductor processing apparatus 1 is a disk whose substrate is silicon (Si), sapphire (Al ₂ O ₃ ), gallium arsenide (GaAs), silicon carbide (SiC), or the like. It is a wafer such as a shaped semiconductor wafer, an optical device wafer, or the like.

As shown in FIG. 1, the plate-like object 200 has a device 203 formed in each region of a surface 202 partitioned by a plurality of intersecting dividing lines 201 . The device 203 is, for example, an integrated circuit such as an IC (Integrated Circuit) or LSI (Large Scale Integration), a CCD (Charge Coupled Device), an image sensor such as a CMOS (Complementary Metal Oxide Semiconductor), or a MEMS (Micro Electro Mechanical Systems), etc. In the present invention, the plate-like object 200 is not limited to a wafer, and may be a rectangular resin package substrate having a plurality of resin-sealed devices, a ceramic plate, a glass plate, or the like.

In the first embodiment, the plate-like object 200 has a tape 205 having a larger diameter than the outer diameter of the plate-like object 200 and is attached to the back surface 204 of the front surface 202, and the outer edge of the tape 205 has an inner diameter of the plate-like object. It is attached to an annular frame 206 having a diameter larger than the outer diameter of 200 and supported by a tape 205 within an opening inside the annular frame 206 . The plate-like object 200 is divided into individual devices 203 along dividing lines 201 .

The semiconductor processing apparatus 1 shown in FIG. 1 holds a plate-like object 200 on a chuck table 10 and performs cutting (corresponding to processing) with a cutting blade 21 along a dividing line 201 to cut the plate-like object 200. It is a cutting device that divides into individual devices 203 . The semiconductor processing apparatus 1 includes a chuck table 10 that holds a plate-like object 200 , a cutting unit 20 (corresponding to a processing unit that processes the plate-like object 200 ), an imaging unit 30 , and a control unit 100 . As shown in FIG. 1, the semiconductor processing apparatus 1 is provided with two cutting units 20, that is, a two-spindle dicer, a so-called facing dual type cutting apparatus.

The semiconductor processing apparatus 1 also includes a moving unit 40 for relatively moving the chuck table 10 and the cutting unit 20, as shown in FIG. The movement unit 40 is an X-axis movement unit 41 which is a processing feed unit for processing and feeding the chuck table 10 in the X-axis direction parallel to the horizontal direction, and an indexing feed direction parallel to the horizontal direction and perpendicular to the X-axis direction. A Y-axis moving unit 42, which is an indexing feed unit that moves the cutting unit 20 in the Y-axis direction, and a cutting unit in the Z-axis direction, which is a cutting feed direction parallel to the vertical direction orthogonal to the X-axis direction and the Y-axis direction. 20, and a rotation movement unit 44 that rotates the chuck table 10 around an axis parallel to the Z-axis direction. That is, the moving unit 40 relatively moves the chuck table 10 and the cutting unit 20 in the X-axis direction, the Y-axis direction, and the Z-axis direction.

The X-axis movement unit 41 moves the chuck table 10 along with the rotary movement unit 44 in the X-axis direction, which is the processing feed direction, thereby moving the chuck table 10 in the X-axis direction with respect to the cutting unit 20 . The X-axis movement unit 41 moves between the processing area where the cutting unit 20 cuts the plate-like object 200 held on the chuck table 10 and the loading/unloading area where the plate-like object 200 is loaded/unloaded from the chuck table 10. The chuck table 10 is moved along the X-axis direction.

The Y-axis movement unit 42 moves the chuck table 10 relative to the cutting unit 20 in the Y-axis direction by moving the cutting unit 20 in the Y-axis direction, which is the index feed direction, with respect to the chuck table 10 . It is. The Z-axis movement unit 43 moves the chuck table 10 relative to the cutting unit 20 in the Z-axis direction by moving the cutting unit 20 in the Z-axis direction, which is the cutting feed direction. The rotary movement unit 44 is moved in the X-axis direction by the X-axis movement unit 41 to rotate the chuck table 10 around an axis parallel to the Z-axis direction.

The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 are a well-known ball screw provided rotatably around the axis, a well-known motor for rotating the ball screw around the axis, and the chuck table 10. Alternatively, a well-known guide rail that supports the cutting unit 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction is provided.

The chuck table 10 has a disk shape, and a holding surface 11 for holding the plate-like object 200 is made of a porous material such as porous ceramic. The chuck table 10 is provided to be movable in the X-axis direction over the loading/unloading area and the machining area by the X-axis movement unit 41, and is rotated around the axis parallel to the Z-axis direction by the rotation movement unit 44. freely set. The holding surface 11 of the chuck table 10 is connected to a vacuum suction source (not shown) and sucked from the vacuum suction source to suck and hold the plate-like object 200 placed on the holding surface 11 . In Embodiment 1, the chuck table 10 sucks and holds the plate-like object 200 via the tape 205 . A plurality of clamping portions 12 for clamping the annular frame 206 are provided around the chuck table 10, as shown in FIG.

The cutting unit 20 is a processing unit that cuts the plate-like object 200 held by the chuck table 10 . The cutting units 20 are provided to be relatively movable in the Y-axis direction with respect to the chuck table 10 by the Y-axis moving unit 42, and are relatively movable in the Z-axis direction by the Z-axis moving unit 43. is provided.

As shown in FIG. 1, the cutting unit 20 is provided on a gate-shaped support frame 3 erected from the apparatus main body 2 via a Y-axis movement unit 42, a Z-axis movement unit 43, and the like. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the chuck table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43 .

As shown in FIG. 1, the cutting unit 20 includes a cutting blade 21 that cuts a plate-like object 200 held by the chuck table 10, and a Y-axis moving unit 42 and a Z-axis moving unit 43 that move the cutting blade 21 in the Y-axis direction and the Z-axis moving unit 43, respectively. A spindle housing 22 is provided movably in the Z-axis direction, and a spindle 23 is provided rotatably about the axis of the spindle housing 22, is rotated by a motor (not shown), and has a cutting blade 21 attached to its tip. , and a cutting fluid supply nozzle 24 for supplying cutting fluid to the cutting blade 21 .

In the first embodiment, the cutting blades 21 are so-called hub blades each having an annular base and an annular cutting edge disposed on the outer peripheral edge of the circular base for cutting the plate-like object 200. is. The cutting edge is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride), and a bonding material (bonding material) that fixes the abrasive grains such as metal or resin, and is formed in a ring shape with a constant thickness. Further, in the present invention, the cutting blade 21 may be a so-called washer blade composed only of a cutting edge.

The imaging unit 30 is fixed to the cutting unit 20 so as to move together with the cutting unit 20 . The imaging unit 30 includes an imaging element that captures an area to be divided of the plate-like object 200 before cutting held on the chuck table 10 . The imaging device is, for example, a CCD (Charge-Coupled Device) imaging device or a CMOS (Complementary MOS) imaging device. The imaging unit 30 captures an image of the plate-like object 200 held on the chuck table 10, obtains an image for performing alignment for aligning the position of the plate-like object 200 and the cutting blade 21, and obtains the obtained image. Output to control unit 100 .

The semiconductor processing apparatus 1 also includes an X-axis position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, and a Y-axis direction detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction. A position detection unit and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction are provided. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction using motor pulses. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the position of the chuck table 10 in the X-axis direction and the cutting unit 20 in the Y-axis direction or Z-axis direction to the control unit 100. . In the first embodiment, the positions of the chuck table 10 and the cutting unit 20 of the semiconductor processing apparatus 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on a predetermined origin position (not shown). be done.

The semiconductor processing apparatus 1 also includes a cassette stage 60 on which a cassette 50 for accommodating a plurality of plate-shaped objects 200 before and after cutting is installed on the upper surface 61 and which moves the cassette 50 in the Z-axis direction, and a plate-shaped object after cutting. and a washing unit 62 for washing the object 200 .

The cassette 50 is a storage container capable of accommodating a plurality of plate-like objects 200 cut by the semiconductor processing apparatus 1 while being spaced apart in the Z-axis direction. As shown in FIG. 2, the cassette 50 has a pair of side plates 51 facing each other, a top plate 52 and a bottom plate 53, a plurality of storage shelves 54, and a back plate 55 as a back portion. A pair of side plates 51, top plate 52, bottom plate 53 and rear plate 55 are formed in a flat plate shape.

When the cassette 50 is placed on the upper surface 61 of the cassette stage 60, the pair of side plates 51 face each other with a gap along the X-axis direction. The upper plate 52 connects the upper ends of the pair of side plates 51 together, and the bottom plate 53 connects the lower ends of the pair of side plates 51 together. The upper plate 52 and the bottom plate 53 face each other with a gap along the Z-axis direction. The back plate 55 connects the ends of the pair of side plates 51, the top plate 52 and the bottom plate 53 on the central side in FIG. In Embodiment 1, the rear plate 55 covers the entire space between the ends of the pair of side plates 51, the top plate 52 and the bottom plate 53, but in the present invention it may not necessarily cover the whole but only a part. In the first embodiment, the upper plate 52 and the bottom plate 53 are formed of plates that cover the entire gap between the side plates 51. However, the pair of side plates 51 are not necessarily closed entirely, and only a portion of the pair of side plates 51 are connected. may be closed to reduce the weight of the cassette 50.

The cassette 50 also forms an opening 56 through which the plate-like object 200 is carried in and out between the other ends of the pair of side plates 51, top plate 52, and bottom plate 53 on the back side in FIG. For this purpose the cassette 50 has an opening 56 . Further, when the cassette 50 is placed on the cassette stage 60, the back plate 55 horizontally faces the opening 56 along the Y-axis direction. The back plate 55 contacts the plate-like object 200 accommodated in the cassette 50 through the opening 56 and supports the plate-like object 200 on the front side in FIG.

A plurality of storage racks 54 are formed on the inner surfaces of the pair of side plates 51 facing each other. When the cassette 50 is placed on the cassette stage 60, the housing racks 54 are formed in a bar shape parallel to the Y-axis direction, and are arranged on the inner surfaces of the side plates 51 at intervals in the Z-axis direction. When the cassette 50 is installed on the cassette stage 60, the storage shelf 54 formed on one side plate 51 faces the storage shelf 54 formed on the other side plate 51 in the X-axis direction. When the cassette 50 is installed on the cassette stage 60, the storage racks 54 have the annular frames 206 placed on the upper surfaces of the shelves facing each other in the X-axis direction to position and store the plate-like object 200 in the cassette 50. do. The cassette 50 also has a handle 59 on the upper surface of the upper plate 52 that can be gripped by an operator or the like.

The control unit 100 controls each of the above-described units of the semiconductor processing apparatus 1 to cause the semiconductor processing apparatus 1 to perform processing operations on the plate-like object 200 . Note that the control unit 100 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input/output unit. A computer having an interface device. The arithmetic processing unit of the control unit 100 performs arithmetic processing according to a computer program stored in a storage device, and outputs a control signal for controlling the semiconductor processing device 1 to a semiconductor device via an input/output interface device. Output to the above-described components of the processing device 1 .

The control unit 100 is also connected to a display unit 101 configured by a liquid crystal display device for displaying the state of machining operations, images, etc., and an input unit used by the operator to register machining conditions and the like. The input unit is composed of at least one of a touch panel provided on the display unit 101 and an external input device such as a keyboard.

The semiconductor processing apparatus 1 unloads the plate-like object 200 from the cassette 50, loads the plate-like object 200 into the cassette 50, and conveys the plate-like object 200 between the cassette 50, the chuck table 10, and the cleaning unit 62. 3, and a positioning mechanism 70 (shown in FIGS. 3 and 4) that positions the cassette 50 containing the plate-like object 200 on the upper surface 61 of the cassette stage 60. As shown in FIG. Note that the transport unit 63 and the positioning mechanism 70 are omitted in FIG.

The positioning mechanism 70 positions the cassette 50 at a position where the chuck table 10 positioned in the loading/unloading area of the upper surface 61 of the cassette stage 60 and the opening 56 are aligned in the Y-axis direction. The positioning mechanism 70 is installed on the upper surface 61 of the cassette stage 60, as shown in FIG. and a side roller 75 .

The back roller 71 is in contact with the back plate 55 of the cassette 50 placed on the upper surface 61 of the cassette stage 60 . The back roller 71 is formed in a disk shape with an axis 711 parallel to the X-axis direction, and as shown in FIG. Supported. The lower end of the outer peripheral surface of the back roller 71 is arranged above the upper surface 61 . In addition, the back roller 71 is arranged on the side farther from the chuck table 10 in the Y-axis direction than the back plate 55 of the cassette 50 installed on the upper surface 61 of the cassette stage 60, and the back plate 55 of the cassette 50 is arranged on the outer peripheral surface. comes into contact. In the first embodiment, two rear surface rollers 71 are arranged with an interval along the X-axis direction, and each is arranged on the side farther from the chuck table 10 in the Y-axis direction than the corner of the cassette 50 . .

The bottom roller 72 is installed between the opening roller 76 of the opening positioning portion 73 and the back roller 71 and close to the back roller 71, and supports the end of the bottom plate 53 of the cassette 50 on the back plate 55 side. It is something to do. The bottom surface roller 72 is formed in a disc shape with an axis 721 parallel to the X-axis direction, and is rotatably supported on the top surface 61 about the axis 721 as shown in FIG. The bottom surface roller 72 is arranged such that the upper end of the outer peripheral surface is lower than the upper end of the outer peripheral surface of the back roller 71 . In Embodiment 1, the bottom surface roller 72 is installed in a recess (not shown) provided on the top surface 61 , and the lower end of the bottom surface roller 72 is arranged below the top surface 61 .

The bottom surface roller 72 is arranged below the rear plate 55 side end of the bottom plate 53 of the cassette 50 installed on the upper surface 61 of the cassette stage 60 , and is provided on the outer peripheral surface of the cassette 50 on the rear plate 55 side of the bottom plate 53 of the cassette 50 . are in contact with each other. In Embodiment 1, two bottom surface rollers 72 are arranged with an interval along the X-axis direction, and each is arranged at a position aligned with the back surface roller 71 in the Y-axis direction.

The opening positioning portion 73 is a corner portion 57 on the side of the opening 56 of the cassette 50 through which the plate-like object 200 is carried in and out of the cassette 50 and on the side of the bottom plate 53 (corresponding to the edge of the opening 56 shown in FIG. 4 and the like). is positioned. The opening positioner 73 has an opening roller 76 and a support block 77 .

The opening roller 76 contacts the corner 57 on the side of the opening 56 of the cassette 50 placed on the upper surface 61 of the cassette stage 60 and on the side of the bottom plate 53 . The opening roller 76 is formed in a disc shape with an axis 761 parallel to the X-axis direction, and as shown in FIG. It is rotatably supported. The lower end of the outer peripheral surface of the opening roller 76 is arranged above the upper surface 61 , and the upper end of the outer peripheral surface of the opening roller 76 is arranged below the upper end of the outer peripheral surface of the back roller 71 . In addition, the opening roller 76 is arranged closer to the chuck table 10 in the loading/unloading area in the Y-axis direction than the opening 56 of the cassette 50 installed on the upper surface 61 of the cassette stage 60, and the opening of the cassette 50 is arranged on the outer peripheral surface. A corner portion 57 on the side of the portion 56 and on the side of the bottom plate 53 contacts. In Embodiment 1, two opening rollers 76 are arranged with an interval along the X-axis direction, and each is arranged at a position aligned with the back roller 71 and the bottom roller 72 in the Y-axis direction.

The support block 77 is installed between the opening roller 76 and the rear roller 71 in the vicinity of the opening roller 76 and supports the edge of the bottom plate 53 of the cassette 50 on the opening 56 side. The support block 77 is formed to protrude from the upper surface 61 of the cassette stage 60, and the upper surface 771 is formed parallel to the horizontal direction. The upper surface 771 of the support block 77 is arranged at the same height as the upper end of the outer peripheral surface of the bottom roller 72 , and in the first embodiment, the upper surface 771 is arranged below the upper end of the outer peripheral surface of the opening roller 76 .

In addition, the support block 77 is arranged below the end of the bottom plate 53 of the cassette 50 on the side of the opening 56 of the bottom plate 53 of the cassette 50 installed on the top surface 61 of the cassette stage 60 . is placed. In Embodiment 1, two support blocks 77 are arranged with an interval along the X-axis direction, and each is arranged at a position aligned with the back roller 71, the bottom roller 72, and the opening roller 76 in the Y-axis direction. there is

The first side roller 74 and the second side roller 75 are in contact with the outer surface of the side plate 51 of the cassette 50, and are installed on the upper surface 61 of the cassette stage 60 between each other along the X-axis direction. position the cassette 50. The side rollers 74 and 75 are disc-shaped with the axes 741 and 751 parallel to the Y-axis direction, and as shown in FIG. 741 and 751 are rotatably supported. The upper ends of the outer peripheral surfaces of the side rollers 74 and 75 are arranged at the same height as the upper end of the outer peripheral surface of the bottom roller 72 and the upper surface of the support block 77, and are arranged below the upper end of the outer peripheral surface of the opening roller 76. ing. In the first embodiment, two side rollers 74 and 75 are arranged with an interval in the X-axis direction, and are arranged in the Y-axis direction of the side plate 51 of the cassette 50 installed on the upper surface 61 of the cassette stage 60 . Contact the outer surface of both ends.

In the semiconductor processing apparatus 1 configured as described above, the cassette 50 containing the plate-like object 200 is installed on the upper surface 61 of the cassette stage 60, and processing conditions are set in the control unit 100. FIG. The semiconductor processing apparatus 1 starts a machining operation when the control unit 100 receives a machining operation start instruction from an operator or the like.

When the processing operation is started, the control unit 100 controls the transfer unit 63 to take out one plate-like object 200 from the cassette 50 . 11. In the processing operation, the semiconductor processing apparatus 1 sucks and holds the plate-like object 200 on the holding surface 11 via the tape 205, clamps the annular frame 206 with the clamping part 12, rotates the spindle 23 around the axis, and cuts the workpiece. A liquid is supplied to the cutting blade 21 . In the semiconductor processing apparatus 1, the control unit 100 controls the movement unit 40 to move the chuck table 10 from the loading/unloading area toward the processing area to below the imaging unit 30, and the imaging unit 30 sucks and holds the chuck table 10. Alignment is performed by imaging the plate-like object 200 .

In the processing operation, the control unit 100 of the semiconductor processing apparatus 1 controls the movement unit 40 and the like based on the processing conditions to relatively move the cutting blade 21 and the plate-like object 200 along the dividing line 201. The cutting blade 21 is caused to cut into the planned dividing line 201 of the plate-like object 200 until it reaches the tape 205 to perform cutting. The semiconductor processing apparatus 1 cuts the dividing lines 201 of the plate-like object 200 according to the processing conditions to divide the plate-like object 200 into individual devices 203 . After cutting all the dividing lines 201 of the plate-like object 200 , the semiconductor processing apparatus 1 moves the chuck table 10 from the processing area toward the carry-in/out area, and the transfer unit 63 moves the plate-like object 200 to the cleaning unit 62 . After the cut plate-like object 200 is washed by the washing unit 62 , the plate-like object 200 is carried into the cassette 50 by the conveying unit 63 . When the semiconductor processing apparatus 1 cuts all the plate-like objects 200 in the cassette 50, the processing operation is finished.

In the semiconductor processing apparatus 1, when the cassette 50 is placed on the upper surface 61 of the cassette stage 60, as indicated by the solid line in FIG. 55 side edge) is inserted between the back roller 71 and the bottom roller 72 , the back plate 55 is brought into contact with the back roller 71 , and the bottom plate 53 is brought into contact with the bottom roller 72 . In the semiconductor processing apparatus 1, the cassette 50 is guided with the corners 58 brought into contact with the back roller 71 and the bottom roller 72, and as shown by the two-dot chain line in FIG. The bottom plate 53 is placed on the bottom rollers 72 and the top surface 771 of the support block 77 with the bottom plate 53 side corner 57 brought closer to the top surface 61 of the cassette stage 60 . In the semiconductor processing apparatus 1, the cassette 50 contacts the opening roller 76, the back roller, and the side rollers 74 and 75, and the positioning mechanism 70 positions and installs the cassette 50 on the upper surface 61 of the cassette stage 60. .

The semiconductor processing apparatus 1 and the positioning mechanism 70 according to the first embodiment described above include the rear roller 71 that contacts the rear plate 55 of the cassette 50, and the rear roller 71 and the rear roller 71 that are adjacent to each other between the opening positioning portion 73 and the rear roller 71. and a bottom roller 72 that supports the end of the bottom plate 53 of the cassette 50 on the side of the rear plate 55 . For this purpose, the semiconductor processing apparatus 1 and the positioning mechanism 70 are guided by the corner portion 58 being inserted between the back roller 71 and the bottom roller 72 and the corner portion 58 being brought into contact with the back roller 71 and the bottom roller 72 . At the same time, the corner portion 57 is brought closer to the upper surface 61 of the cassette stage 60 with the corner portion 58 as a fulcrum, so that the cassette 50 can be positioned and installed on the upper surface 61 . The problem of dust generation can be prevented.

Conventionally, in order to prevent the corners 57 and 58 of the cassette 50 from rubbing against the cassette stage 60 to generate dust, an operator lifts the cassette 50 above the cassette stage 60 and lowers the cassette 50 horizontally. 60, the burden on the operator was increased when the size of the plate-like object 200 became large and the cassette 50 became heavy. According to the present invention, the back roller 71 and the bottom roller 72 can also be operated by first lowering the corner 58 on the operator side onto the cassette stage 60, and then lowering the corner 57 around the corner 58 with the cassette 50 tilted. This prevents the corner 58 from rubbing against the cassette stage 60 to generate dust. Therefore, the operator does not have to position the cassette 50 while lifting the entire cassette 50, thereby reducing the burden on the operator while preventing dust generation.

Therefore, the semiconductor processing apparatus 1 and the positioning mechanism 70 can suppress rubbing of the cassette 50 , particularly the corners 58 , when the cassette 50 is positioned and installed on the upper surface 61 of the cassette stage 60 . As a result, the semiconductor processing apparatus 1 and the positioning mechanism 70 have the effect of suppressing dust generation when the cassette 50 is positioned and installed.

In the semiconductor processing apparatus 1 and the positioning mechanism 70, the opening positioning part 73 has the opening roller 76, so that the cassette 50 can be positioned by the back roller 71, the opening roller 76, and the like. Friction at the time of positioning is reduced and dust generation can be prevented.

[Modification]
A positioning mechanism according to a modification of Embodiment 1 of the present invention will be described with reference to the drawings. 5 is a plan view schematically showing a positioning mechanism according to a modification of the first embodiment; FIG. In addition, in FIG. 5, the same reference numerals are assigned to the same parts as those in the first embodiment, and the description thereof is omitted.

In the positioning mechanism 70-1 according to the modification of the first embodiment, the rear roller 71, the bottom roller 72, the opening roller 76 and the side rollers 74 and 75 are arranged on the X axis of the cassette 50 as shown in FIG. It is the same as Embodiment 1 except that it is formed in a roller shape substantially equal to the total length in the direction or the total length in the Y-axis direction, and the support block 77 is formed substantially equal to the total length in the X-axis direction of the cassette 50 . As in the first embodiment, the positioning mechanism 70 according to the modification positions the cassette 50 by the rear roller 71 and the opening roller 76 of the opening positioning portion 73, etc., so that the friction when positioning the cassette 50 is reduced. It is possible to prevent dust generation and to suppress dust generation.

It should be noted that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the present invention. For example, in the present invention, the semiconductor processing apparatus 1 is not limited to a cutting apparatus. A grinding device for grinding the plate 200 , a polishing device for polishing the plate-like object 200 , a tool cutting device for cutting the plate-like object 200 with a tool, a plasma device for performing plasma etching or the like on the plate-like object, and a tape 205 affixed to the plate-like object 200 . An apparatus for performing various processes on the plate-like object 200, such as a tape sticking device to hold the plate-like object 200 with a transparent body and an inspection device for inspecting the front surface 202 and the back surface 204 of the plate-like object 200, may be used.

Further, in the present invention, the cassette 50 may include a stopper with which the end of the back side of the annular frame 206 on which the storage rack 54 supports the plate-shaped object 200 abuts. It is desirable that the rear surface roller 71 contacts the surface of the side plate 51 on the rear surface side (corresponding to the rear portion).

Reference Signs List 1 semiconductor processing equipment 50 cassette 51 side plate 52 upper plate 53 bottom plate 54 storage shelf 55 rear plate (back portion)
56 opening 57 corner (edge on opening side)
60 cassette stage 61 upper surface 70, 70-1 positioning mechanism 71 rear roller 72 bottom roller 73 opening positioning portion 76 opening roller 77 support block 200 plate-like object

Claims (3)

A positioning mechanism for positioning a cassette containing plate-shaped objects to be processed by a semiconductor processing apparatus on the upper surface of a cassette stage on which the cassette is installed,
The cassette is
opposing side plates;
a top plate and a bottom plate connecting the side plates;
a plurality of storage racks formed on the side plate for storing plate-like objects;
an opening through which the plate-like object is carried in and out;
a rear portion facing the opening;
The positioning mechanism is
an opening positioning part for positioning the opening side through which the plate-like object is carried in and out;
a back roller in contact with the back portion;
a bottom roller disposed between the opening positioning portion and the back roller and adjacent to the back roller to support the back side of the cassette;
A positioning mechanism comprising: The opening locator comprises:
an opening roller that contacts the edge of the opening on which the plate-like object is carried in and out;
a support block positioned between the opening roller and the back roller and proximate to the opening roller and having the same height as the bottom roller for supporting the opening side of the cassette; 2. The positioning mechanism of claim 1, comprising: A semiconductor processing apparatus for processing plate-shaped objects,
a cassette stage on which a cassette containing a plate-like object is installed;
a positioning mechanism that positions the cassette on the upper surface of the cassette stage,
A semiconductor processing apparatus comprising the positioning mechanism according to claim 1 or 2 as the positioning mechanism.

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