JP2021049598A - Machining device - Google Patents

Abstract

To provide a machining device capable of suppressing the lowering of cleanliness in a clean room.SOLUTION: A machining device 1 is equipped with a chuck table 10 that has a holding surface 11, a cutting unit 20 that cuts and machines a workpiece 200 held by the chuck table 10, and a control apparatus 101 that controls the chuck table 10 and the cutting unit 20. In an apparatus storage area 9 in which the control apparatus 101 is disposed, an exhaust fan 80 is disposed, which exhausts atmosphere in the apparatus storage area 9 downward and generates an airflow of a down flow for cooling the control apparatus 101. The machining device 1 is further equipped with a down flow exhaust path 81 that guides exhaust from the exhaust fan 80 to an opening 303 inside a lattice of a grating 302 configuring a floor surface 301 of a clean room 300 on which the machining device 1 is raised.SELECTED DRAWING: Figure 1

Description

The present invention relates to a processing apparatus having a control device including an electronic device that controls each component.

Various processing equipment that cuts, grinds, and cleans the workpiece held on the chuck table, especially when processing a semiconductor wafer on which a semiconductor device is formed, is a device due to the adhesion of foreign matter. It is often placed in a clean room to suppress abnormalities. In a clean room, the floor surface may be composed of a lid material called grating, which is a grid of steel materials so that dust and the like can be efficiently discharged, and the atmosphere inside the clean room is exhausted through the grating, so-called down. Forming a flow.

In the processing equipment arranged in such factory equipment, the atmosphere of the processing room where a large amount of processing waste is generated is exhausted from the exhaust duct directly connected to the dedicated duct, so that the processing equipment is not scattered in the clean room. However, in a processing device, a cooling fan that cools a control device such as a motor driver generally exhausts the device laterally from the side wall of the device (see, for example, Patent Document 1 and Patent Document 2).

Japanese Unexamined Patent Publication No. 2000-124165 Japanese Unexamined Patent Publication No. 2013-08081

In the processing equipment shown in Patent Document 1 and Patent Document 2 described above, dust generated from the control equipment is laterally scattered in the down-flow clean room, so that the cleanliness of the clean room (also referred to as air cleanliness) can be determined. It may be a factor to reduce it.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing apparatus capable of suppressing a decrease in cleanliness of a clean room.

In order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention includes a chuck table having a holding surface, a processing unit for processing an workpiece held on the chuck table, and the chuck table. A processing device including a control device for controlling the processing unit, and in the device accommodation area where the control device is arranged, the atmosphere of the device accommodation area is exhausted downward to cool the control device. An exhaust fan for generating an inflow air flow is arranged, and a downflow exhaust path for guiding the exhaust from the exhaust fan to the floor exhaust port of the factory equipment on which the processing apparatus is erected is further provided.

The processing apparatus may include an exterior side wall that surrounds the chuck table, the processing unit, and the control device and serves as a side wall of the apparatus, and the downflow exhaust passage may be arranged in an area surrounded by the exterior side wall.

The invention of the present application has an effect that a decrease in cleanliness of a clean room can be suppressed.

FIG. 1 is a perspective view showing an example of a configuration example of the processing apparatus according to the first embodiment. FIG. 2 is a plan view schematically showing the configuration of the processing apparatus shown in FIG.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The processing apparatus according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a configuration example of the processing apparatus according to the first embodiment. FIG. 2 is a plan view schematically showing the configuration of the processing apparatus shown in FIG.

The processing device 1 shown in FIG. 1 according to the first embodiment is a cutting device that cuts (corresponds to processing) the workpiece 200. In the first embodiment, the workpiece 200 to be processed by the processing apparatus 1 is a wafer such as a semiconductor wafer or an optical device wafer having a circular shape and having silicon, sapphire, gallium or the like as a base material. The workpiece 200 is formed in a disk shape, and the device 203 is formed in a region partitioned in a grid pattern by a plurality of scheduled division lines 202 formed in a grid pattern on the surface 201. In the first embodiment, the device 203 is an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), that is, a semiconductor device.

The workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which a central portion is thinned and a thick portion is formed on an outer peripheral portion. In addition to the wafer, a plurality of devices sealed with resin are used. A rectangular package substrate, a ceramic plate, a glass plate, or the like may be used. In the first embodiment, the workpiece 200 is attached to a disk-shaped adhesive tape 205 on the back surface 204, and an annular frame 206 having an inner diameter larger than the outer diameter of the workpiece 200 on the outer peripheral edge of the adhesive tape 205. Is affixed and supported by an opening inside the annular frame 206.

In the processing apparatus 1 shown in FIG. 1, the workpiece 200 is held by the chuck table 10 and cut (corresponding to machining) by the cutting blade 21 along the scheduled division line 202, and the workpieces 200 are individually processed (corresponding to machining). It is a cutting device that divides into device 203. That is, the processing apparatus 1 is an apparatus for manufacturing a semiconductor device. The processing device 1 is installed on the floor surface 301 of the clean room 300, which is a factory facility for manufacturing semiconductor devices. As shown in FIG. 1, the clean room 300 has a floor surface 301 composed of grid-like gratings 302. Note that FIG. 1 shows only a part of the grid of the grating 302 constituting the floor surface 301, and omits the others.

In the clean room 300, various pipes and wirings for driving the processing device 1 are arranged under the floor surface 301, and the processing device 1 is installed on the floor surface 301. Further, in the first embodiment, in the clean room 300, the atmosphere in the clean room 300 is exhausted through the opening 303 inside the lattice of the grating 302 constituting the floor surface 301, and a downward air flow, that is, a downflow is generated in the clean room 300. It is formed. For this reason, the opening 303 inside the lattice of the grating 302 constituting the floor surface 301 constitutes a floor surface exhaust port for exhausting the atmosphere in the clean room 300. In this way, the opening 303 inside the lattice of the grating 302, which is the floor exhaust port, is provided on the floor 301 of the clean room 300.

As shown in FIG. 1, the processing apparatus 1 cuts a chuck table 10 having a holding surface 11 that sucks and holds the workpiece 200 and a workpiece 200 held by the chuck table 10 with a cutting blade 21. It includes a cutting unit 20 which is a unit, an imaging unit 30 for photographing a workpiece 200 held by a chuck table 10, and a control unit 100.

Further, as shown in FIG. 1, the processing apparatus 1 includes a moving unit 40 that moves the cutting unit 20 relative to the chuck table 10. The moving unit 40 has an X-axis moving unit 41 that processes and feeds the chuck table 10 in the horizontal direction and the X-axis direction parallel to the lateral direction of the device main body 2, and the cutting unit 20 in the horizontal direction and the longitudinal direction of the device main body 2. The Y-axis moving unit 42, which is parallel and is indexed and fed in the Y-axis direction orthogonal to the X-axis direction, and the cutting unit 20 are cut in the Z-axis direction parallel to the vertical direction orthogonal to both the X-axis direction and the Y-axis direction. The Z-axis moving unit 43 to be fed and the rotary moving unit 44 that rotates the chuck table 10 around the axis parallel to the Z-axis direction and is machined and fed in the X-axis direction together with the chuck table 10 by the X-axis moving unit 41. Be prepared. As shown in FIG. 1, the processing apparatus 1 is a cutting apparatus provided with two cutting units 20, that is, a two-spindle dier, a so-called facing dual type cutting apparatus.

The chuck table 10 holds the workpiece 200 on the holding surface 11. The holding surface 11 has a disk shape formed of porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). The chuck table 10 sucks and holds the workpiece 200 placed on the holding surface 11. In the first embodiment, the holding surface 11 is a plane parallel to the horizontal direction. A plurality of clamp portions 12 for sandwiching the annular frame 206 that supports the workpiece 200 in the opening are arranged around the chuck table 10. Further, the chuck table 10 is rotated around the axis parallel to the Z-axis direction by the rotational movement unit 44 of the moving unit 40. The rotary movement unit 44 and the chuck table 10 are moved in the X-axis direction by the X-axis movement unit 41 of the movement unit 40.

The cutting unit 20 cuts the workpiece 200 held on the chuck table 10. Each of the cutting units 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 42 with respect to the workpiece 200 held by the chuck table 10, and is provided in the Z-axis direction by the Z-axis moving unit 43. It is provided so that it can be moved.

As shown in FIG. 1, the pair of cutting units 20 are provided on the gate-shaped support frame 3 erected from the apparatus main body 2 via the Y-axis moving unit 42, the Z-axis moving unit 43, and the like. The pair of cutting units 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the chuck table 10 by the Y-axis moving unit 42 and the Z-axis moving unit 43.

The pair of cutting units 20 are provided in a spindle housing 22 movably provided in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 42 and the Z-axis moving unit 43, and rotatably provided in the spindle housing 22 around the axis. A spindle 23 that is rotated by a spindle motor and has a cutting blade 21 attached to the tip, a cutting blade 21 that cuts a workpiece 200 held by a chuck table 10, and a cutting blade 21 that cuts during cutting. It is provided with a cutting water supply nozzle 24 for supplying water. The cutting blade 21 is an ultra-thin cutting grindstone having a substantially ring shape. The axes of the spindle 23 and the cutting blade 21 of the cutting unit 20 are set parallel to the Y-axis direction.

The X-axis moving unit 41 moves the chuck table 10 in the X-axis direction, which is the machining feed direction, so that the chuck table 10 and the cutting unit 20 are machined and fed relatively along the X-axis direction. The X-axis moving unit 41 has a loading / unloading area 401 shown in FIG. 2 in which the workpiece 200 is loaded / unloaded from the chuck table 10, and a workpiece 200 held by the chuck table 10 is machined by the cutting unit 20. It is moved in the X-axis direction over the processing region 402 shown in 2.

The Y-axis moving unit 42 moves the cutting unit 20 in the Y-axis direction, which is the indexing feed direction, so that the chuck table 10 and the cutting unit 20 are indexed and fed relatively along the Y-axis direction. The Z-axis moving unit 43 cuts and feeds the chuck table 10 and the cutting unit 20 relatively along the Z-axis direction by moving the cutting unit 20 in the Z-axis direction, which is the cutting and feeding direction.

The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 include a well-known ball screw rotatably provided around the axis, a well-known motor for rotating the ball screw around the axis, and a chuck table 10. Alternatively, a well-known guide rail that movably supports the cutting unit 20 in the X-axis direction, the Y-axis direction, or the Z-axis direction is provided.

Further, the processing apparatus 1 has an X-axis direction position detection unit (not shown) for detecting the position of the chuck table 10 in the X-axis direction, and a Y-axis direction position (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction. It includes a detection unit and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction by the pulse of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the position of the chuck table 10 in the X-axis direction, the cutting unit 20 in the Y-axis direction, or the Z-axis direction to the control unit 100. .. In the first embodiment, each position is determined by the distance in the X-axis direction, the Y-axis direction, and the Z-axis direction from the predetermined reference position.

Further, as shown in FIGS. 1 and 2, the processing apparatus 1 includes a cassette elevator 50 on which a cassette 51 accommodating a workpiece 200 before and after cutting is placed and moves the cassette 51 in the Z-axis direction, and a cassette elevator 50 after cutting. A cleaning unit 60 for cleaning the workpiece 200 and a transport unit 70 (shown only in FIG. 1) for moving the workpiece 200 in and out of the cassette 51 and transporting the workpiece 200 are provided. In the first embodiment, the transport unit 70 includes a pair of transport arms 71 for transporting the workpiece 200.

The imaging unit 30 images the workpiece 200 held by the holding surface 11 of the chuck table 10. In the first embodiment, the imaging unit 30 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. The image pickup unit 30 includes an image pickup element that images a region to be divided of the workpiece 200 before cutting held on the chuck table 10. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The image pickup unit 30 takes an image of the workpiece 200 held on the chuck table 10 and obtains an image for performing alignment for aligning the scheduled division line 202 of the workpiece 200 with the cutting blade 21. , The obtained image is output to the control unit 100.

The control unit 100 controls each of the above-mentioned units of the processing device 1 to cause the processing device 1 to perform a processing operation on the workpiece 200. The control unit 100 is an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and input / output. A computer having an interface device. In the arithmetic processing unit of the control unit 100, the arithmetic processing unit executes arithmetic processing according to a computer program stored in the storage device, and outputs a control signal for controlling the processing apparatus 1 to a control device 101 which is an input / output interface device. It is output to the above-mentioned components of the processing apparatus 1 via (shown in FIG. 1).

The control device 101 is provided corresponding to each configuration gist of the processing device 1 and controls the corresponding components. That is, the control device 101 controls the chuck table 10 and the cutting unit 20. Further, the control device 101 whose control targets are the cutting unit 20, the X-axis moving unit 41, the Y-axis moving unit 42, the Z-axis moving unit 43, the rotary moving unit 44, and the like is, for example, a so-called motor driver that controls the operation of the motor. To be equipped.

Further, the control unit 100 is connected to a display unit 102 composed of a liquid crystal display device or the like for displaying a processing operation state, an image, or the like, and an input unit used by an operator when registering processing content information or the like. .. The input unit is composed of at least one of a touch panel provided on the display unit 102 and an external input device such as a keyboard.

Further, the processing apparatus 1 includes a plurality of exterior side walls 4 that surround the upper part of the apparatus main body 2, and a ceiling wall 5 that is connected to the upper ends of the plurality of exterior side walls 4 and closes the upper openings of the plurality of exterior side walls 4. The exterior side wall 4 is a wall that surrounds the support frame 3, the chuck table 10, the cutting unit 20, the imaging unit 30, the moving unit 40, the cassette elevator 50, the cleaning unit 60, and the transport unit 70, and serves as a side wall of the processing device 1 itself. The ceiling wall 5 is a wall that closes the upper openings of the plurality of exterior side walls 4 and serves as the ceiling of the processing apparatus 1 itself. A display unit 102 is attached to the outer surface of one of the plurality of exterior side walls 4.

Further, as shown in FIG. 2, the processing apparatus 1 includes a processing chamber wall 6 provided in a plurality of exterior side walls 4 and surrounding the outside of the processing area 402 to suppress diffusion of cutting water, an upper partition wall 7, and an upper partition wall 7. It is provided with an exhaust duct 8 for a processing room. In the first embodiment, the processing chamber wall 6 is provided on the loading / unloading area 401 side of the cutting unit 20 and on the outside of the processing area 402. The upper partition wall 7 closes the opening above the processing chamber wall 6. The surface of the upper partition wall 7 is arranged parallel to the horizontal direction, is connected to the inner surface of the exterior side wall 4, and surrounds the upper side of the processed region 402. The upper partition wall 7 supports the control device 101 on the surface and suppresses the adhesion of cutting water to the control device 101. For this purpose, the exterior side wall 4 surrounds the outside of the control device 101. One end of the exhaust duct 8 is connected to the processing chamber wall 6 and the atmosphere inside the processing chamber wall 6 is exhausted to the outside of the processing apparatus 1 by an exhaust fan or the like (not shown). The space surrounded by the upper partition wall 7, the exterior side wall 4, and the ceiling wall 5 is the device accommodating area 9 in which the control device 101 is arranged.

Further, the processing device 1 includes an exhaust fan 80 and a downflow exhaust passage 81. The exhaust fan 80 cools the control device 101 by exhausting the atmosphere in the device accommodating area 9 downward. In the first embodiment, the exhaust fan 80 is provided on both ends of the upper partition wall 7 in the Y-axis direction, sucks the atmosphere in the equipment accommodating area 9, and forms a downflow airflow that blows out downward.

The downflow exhaust passage 81 is a duct that guides the exhaust gas from the exhaust fan 80 to the opening 303 inside the grid of the grating 302 that constitutes the floor surface 301 of the clean room 300 in which the processing device 1 stands. The downflow exhaust passage 81 is formed in a duct shape parallel to the Z-axis direction, one end thereof is connected to the upper partition wall 7, and the other end is arranged on the floor surface 301. Further, the downflow exhaust passage 81 is arranged in a region surrounded by a plurality of exterior side walls 4, that is, an area inside the plurality of exterior side walls 4.

In the first embodiment, the downflow exhaust passage 81 is provided in a one-to-one correspondence with the exhaust fan 80, one end thereof is attached to both ends of the upper partition wall 7 in the Y-axis direction, and the corresponding exhaust fan 80 is ejected. The atmosphere is passed through the inside to guide the opening 303 inside the lattice of the grating 302 constituting the floor surface 301.

In the processing apparatus 1 having the above-described configuration, the operator registers the processing content information in the control unit 100, places the cassette 51 containing the workpiece 200 on the cassette elevator 50, and controls the operation start instruction from the operator. When the unit 100 receives it, the machining operation is started. When the machining operation is started, the machining apparatus 1 rotates the spindle 23 around the axis, the transport unit 70 takes out one workpiece 200 from the cassette 51, and the adhesive tape 205 is attached to the holding surface 11 of the chuck table 10. The back surface 204 side is placed via.

The processing apparatus 1 sucks and holds the workpiece 200 on the holding surface 11 via the adhesive tape 205, and clamps the annular frame 206 with the clamp portion 12. The processing device 1 moves the chuck table 10 to the lower part of the image pickup unit 30 by the moving unit 40, images the workpiece 200 sucked and held by the chuck table 10 by the image pickup unit 30, and performs alignment.

The machining apparatus 1 supplies cutting water from the cutting water supply nozzle 24 while relatively moving the cutting blade 21 and the workpiece 200 along the scheduled division line 202 by the moving unit 40 based on the machining content information. At the same time, the cutting blade 21 is cut into the planned division line 202 of the workpiece 200 until it reaches the adhesive tape 205, and the cutting is performed. When the processing apparatus 1 cuts all the scheduled division lines 202 of the workpiece 200, the workpiece 200 is transported to the cleaning unit 60 by the transport unit 70, cleaned by the cleaning unit 60, and then the cassette 51 is transported by the transport unit 70. Bring it in.

The processing apparatus 1 sequentially cuts the workpiece 200 in the cassette 51. When the processing apparatus 1 cuts all the workpieces 200 in the cassette 51, the processing operation ends. Further, while the processing device 1 is performing the processing operation, the atmosphere inside the processing chamber wall 6 is exhausted from the exhaust duct 8 to the outside of the processing device 1, and the exhaust fan 80 creates the atmosphere inside the equipment accommodating area 9. It is sucked in and blown out downward, and is exhausted to the opening 303 inside the lattice of the grating 302 constituting the floor surface 301 through the downflow exhaust passage 81.

As described above, in the processing apparatus 1 according to the first embodiment, the processing apparatus 1 is erected without scattering the atmosphere in the equipment accommodating area 9 other than the inside of the processing chamber wall 6 from the exterior side wall 4 to the side. An exhaust fan 80 that exhausts the atmosphere in the equipment accommodating area 9 downward is provided in the equipment accommodating area 9 so that the air can be exhausted toward the opening 303 inside the grid forming the grating 302 constituting the floor surface 301 of the clean room 300. It is arranged. Further, since the processing device 1 includes a downflow exhaust passage 81 that guides the atmosphere blown out by the exhaust fan 80 to the opening 303 inside the lattice forming the grating 302, the atmosphere in the equipment accommodating area 9 is processed. Since the downflow is generated in the device 1 and exhausted to the opening 303 inside the grid constituting the grating 302 through the downflow exhaust passage 81, the atmosphere in the equipment accommodating area 9 can be scattered in the clean room 300. Absent. As a result, the processing apparatus 1 has the effect of suppressing a decrease in the cleanliness (also referred to as air cleanliness) of the clean room 300.

Further, in the processing apparatus 1 according to the first embodiment, the exhaust gas from the equipment accommodating area 9 is surely guided to the downflow exhaust passage 81 by arranging the exhaust fan 80 or the like, so that the processing chamber wall 6 and the upper part thereof. It is possible to prevent foreign matter from entering the processing chamber surrounded by the partition wall 7. In particular, the processing apparatus 1 has an effect of preventing dust and oil components originally adhering to the control device 101 from entering the processing chamber.

The present invention is not limited to the above embodiment. That is, it can be modified in various ways without departing from the gist of the present invention. In the first embodiment, as the processing device 1, a cutting device for cutting the workpiece 200 with the cutting unit 20 is shown, but in the present invention, the processing device 1 is not limited to the cutting device. In the present invention, for example, the processing apparatus 1 supplies grinding water to a chuck table that sucks and holds the front surface 201 side of the work piece 200 with a holding surface and a back surface 204 of the work piece 200 that is sucked and held by the chuck table. A grinding device including a grinding unit which is a processing unit for grinding (corresponding to processing) with a grinding wheel may be used.

1 Machining equipment 4 Exterior side wall 9 Equipment accommodating area 10 Chuck table 11 Holding surface 20 Cutting unit (machining unit)
80 Exhaust fan 81 Downflow exhaust passage 101 Control equipment 200 Work piece 300 Clean room (factory equipment)
303 opening (floor exhaust port)

Claims (2)

A processing apparatus including a chuck table having a holding surface, a processing unit for processing an workpiece held on the chuck table, and a control device for controlling the chuck table and the processing unit.
In the equipment accommodating area where the control equipment is arranged, an exhaust fan that exhausts the atmosphere of the equipment accommodating area downward and generates a down-flow airflow that cools the control equipment is arranged.
A processing device further provided with a downflow exhaust path that guides the exhaust from the exhaust fan to the floor exhaust port of the factory equipment on which the processing device is erected. The processing device according to claim 1, further comprising an exterior side wall that surrounds the chuck table, the processing unit, and the control device and serves as a side wall of the device, and the downflow exhaust passage is arranged in an area surrounded by the exterior side wall. ..

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