JP2013038203A - Electric cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent exhaust of cooling air from negatively affecting a temperature of a device installation room even when the cooling air is used in a device.SOLUTION: An electric cooling device includes: a cooling division box including cooling division means which divides a workpiece along a division planned line formed on the workpiece by expanding and cooling an extension tape to which the workpiece is applied; and an electric box for consolidating electric control units of each driving part. The cooling division box includes a cooling air for sending pipe sending the used cooling air to the electric box. This structure prevents the cooling air from being directly exhausted to a device installation room and also prevents a negative effect on a temperature of the device installation room.

Description

  The present invention relates to an electrical component cooling apparatus having a function of sending cold air from a cooling divided box for dividing and processing various workpieces to an electrical component box.

  In general, an apparatus that performs various drive controls includes an electrical box in which electronic components are housed. The electrical box has an air inlet for introducing air from the outside to the inside, and air from the inside to the outside. And an air outlet for discharging the air. A fan is installed at the air outlet, and heat released from the electronic components is discharged from the air outlet. In addition, an electronic device cooling device is also used in which an air-heat exchanger is disposed at the air outlet, and the heat blown by the fan is cooled by the air-heat exchanger and returned to the room (for example, see Patent Document 1 below). .

  For example, in the workpiece dividing apparatus described in Patent Document 2 below, when the workpiece is divided by pulling the adhesive tape attached to the workpiece subjected to laser processing, the adhesive tape is cooled using a cooling means. The workpiece is hardened so that the workpiece can be reliably broken. The cooling means provided in such a workpiece dividing device includes a nozzle that ejects cold air, and cools the adhesive tape with the cold air ejected from the nozzle (see, for example, Patent Document 2).

JP 2009-135287 A JP 2010-206136 A

  However, since the cold air used for cooling the adhesive tape is discharged outside the apparatus while maintaining the cold temperature, there is a problem that the temperature of the apparatus installation room is adversely affected.

  The present invention has been considered in view of such problems, and it is an object of the present invention to prevent the temperature of the apparatus installation room from being adversely affected even if cold air is used inside the apparatus.

  The present invention relates to a work comprising a ring-shaped frame having an opening, an expansion tape attached to the frame so as to close the opening, and a work attached to the expansion tape and held in the opening via the expansion tape. A cooling division box having a cooling division means for holding a unit and extending and cooling the expansion tape to divide the workpiece along a scheduled division line formed on the workpiece, and an electrical box in which electric control devices of each drive unit are integrated The cooling division box is provided with a cold air discharge fan provided with a cold air inlet pipe for feeding the used cold air into the electric box.

  The electrical cooling device includes a first temperature sensor for monitoring a temperature of the cool air fed into the electrical box by the cool air discharge fan, and an air introduction port for introducing air for adjusting the temperature of the cool air by mixing with the cool air And a second temperature sensor for monitoring the temperature in the electrical box.

  In the present invention, since the cooling split box is provided with a cold air discharge fan having a cold air inlet pipe for feeding the used cold air into the electrical equipment box, the cold air is effectively utilized in the electrical equipment box, and the cold air remains as it is. Will not be discharged. Therefore, adverse effects on the temperature of the apparatus installation room can be prevented.

  In addition, a first temperature sensor that monitors the temperature of the cool air sent to the electrical box by the cool air exhaust fan, an air introduction port that introduces air for mixing the cool air and adjusting the temperature of the cool air, and the electrical box And a second temperature sensor for monitoring the internal temperature, so that air is introduced from the air introduction port 400c in accordance with the temperature of the cold air or the temperature in the electrical equipment box, and the cold air of a desired temperature is sent into the electrical equipment box. The temperature in the electrical box can be set to a desired temperature.

It is a perspective view which shows an example of a workpiece | work division apparatus (electric equipment cooling device). It is a top view which shows an example of a work unit. It is sectional drawing which shows an example of a work unit. It is a perspective view which shows an example of a cooling division | segmentation means. It is a perspective view which shows an example of a heating means. It is sectional drawing which shows the adsorption | suction table which comprises a heating means. It is a perspective view which shows an example of an ultraviolet irradiation means. It is sectional drawing which shows schematically the procedure which divides | segments a wafer. It is sectional drawing which shows schematically the procedure which expand | extends an expansion tape. It is sectional drawing which shows schematically the procedure which heats the non-sticking part of an expansion tape. It is explanatory drawing which shows the state which looked at the electrical equipment box, the cooling division | segmentation box, and the cool air exhaust fan from upper direction. It is explanatory drawing which shows the state which looked at the electrical equipment box, the cooling division | segmentation box, and the cold air exhaust fan from the side.

  A workpiece dividing apparatus 1 shown in FIG. 1 is an apparatus that divides various workpieces (works) such as semiconductor wafers into individual chips. A wafer 100 shown in FIG. 2 is an example of a workpiece that is divided into chips by the workpiece dividing apparatus 1 shown in FIG. 1, and on the surface 100a, division planned lines 101 are formed vertically and horizontally. By breaking along 101, the chip is divided into individual chips 102.

  As shown in FIG. 3, a DAF (Die Attach Film) 103 which is a film for die bonding is attached to the back surface 100 b of the wafer 100. The DAF 103 is attached to the expansion tape 104. The expansion tape 104 is attached to the ring-shaped frame 105 having the opening 105a so as to close the opening 105a. Therefore, the wafer 100 is supported by the frame 105 via the expansion tape 104 in the opening 105a. The expansion tape 104 has a non-adhering portion 104a that is a portion where the wafer 100 or the frame 105 is not attached. The wafer 100 supported by the frame 105 via the expansion tape 104 in this way is referred to as a work unit 1000.

  The expansion tape 104 has elasticity at room temperature, and an adhesive layer is formed on one side of the base material. As the substrate, synthetic resins such as polyvinyl chloride, polypropylene, and polyolefin are used. Further, as the adhesive layer, an ultraviolet curable resin that is cured by being irradiated with ultraviolet rays is used.

  The wafer 100 is subjected to cutting processing or laser processing along the division planned line 101. In the case of cutting, for example, half-cut processing for forming a groove with a predetermined depth that does not penetrate to the back surface 100b on the front surface 100a side, processing for completely cutting only the wafer 100 leaving the DAF 103, complete cutting of the wafer 100 and DAF 103 There are half-cut processing. On the other hand, in laser processing, a pulse laser beam having a wavelength that is transmissive to the wafer 100 is condensed inside the wafer 100 to form a modified layer in the waste portion, or a pulse laser is applied to the surface 100 a of the wafer 100. For example, there is an ablation process in which light is collected to form grooves in the surface 100a. In this way, the wafer 100 has been subjected to dicing processing in advance and is divided by the workpiece dividing apparatus 1 shown in FIG. 1 to become a chip with the DAF 103 attached to the back surface.

  The work unit 1000 is accommodated in the cassette 2a shown in FIG. A front part of the work dividing apparatus 1 is provided with a cassette table 2 on which a cassette 2a is placed, and the cassette table 2 can be moved up and down.

  On the rear side of the cassette table 2, there is provided first transport means 3 that holds the frame 105 of the work unit 1000 and carries it out of the cassette 2 a. The 1st conveyance means 3 can move to the front-back direction (Y-axis direction).

  Positioning cleaning means 4 for cleaning the work unit 1000 and positioning the work unit 1000 at a fixed position is disposed in the movable range of the first transport means 3. The positioning cleaning means 4 includes a pair of rails 40 extending in the Y-axis direction. The pair of rails 40 can move in synchronization with the direction in which they approach or away from each other. Between the pair of rails 40, a spinner table 41 that can rotate while holding the wafer 100, and a frame fixing portion 42 that fixes the frame 105 are disposed. Further, a nozzle (not shown) that ejects cleaning liquid and air to the wafer 100 held on the spinner table 41 is also provided.

  A relay stage 5 on which the work unit 1000 is temporarily placed is disposed on the side of the positioning cleaning means 4 in the X-axis direction. The relay stage 5 includes a pair of rails 50 extending in the Y-axis direction. The pair of rails 50 can move in synchronization with the direction in which they approach or away from each other.

  In the vicinity of the positioning cleaning unit 4 and the relay stage 5, a second transport unit 7 is disposed that transports the work unit 1000 between the positioning cleaning unit 4 and the relay stage 5. The second transport unit 7 includes a suction unit 70 that sucks the frame 105.

  Cooling division means 6 for dividing the wafer 100 constituting the work unit 1000 is provided behind the relay stage 5 in the Y-axis direction. As shown in FIG. 4, the cooling division means 6 includes a holding unit 60 that holds the work unit 1000, a frame pressing portion 61 that holds the frame 105 between the holding units 60, and an extension that is held by the holding unit 60. A cold air jet part 62 for jetting cold air to the tape 104 to cool the tape 104 is provided. The cold air ejection part 62 is configured to be able to enter below the holding unit 60.

  The holding unit 60 is formed in a cylindrical shape and supports a workpiece from below and can be moved up and down, and a frame that is disposed on the outer peripheral side of the workpiece support 600 and supports the frame 105 from below on a support surface 601a. A support 601, a work elevating unit 602 that elevates and lowers the work held by the work support unit 600 by elevating and lowering the work support unit 600, and a frame elevating unit 603 that elevates and lowers the frame support unit 601.

  The frame support portion 601 is formed with a circular through hole 601b penetrating in the vertical direction, and the frame pressing portion 61 has a diameter larger than that of the work support portion 600 and substantially the same as the through hole 601b of the frame support portion 601. A diameter opening 610 is formed.

  The frame lifting / lowering means 603 is composed of at least three (four in the illustrated example) air cylinders, and is composed of a cylinder tube 603a and a piston rod 603b. The upper end of the piston rod 603b is fixed to the lower surface of the frame support portion 601, and the frame support portion 601 is raised and lowered by raising and lowering the piston rod 603b.

  As shown in FIG. 1, a heating unit 8 that heats the expansion tape 104 is disposed on the Y axis direction front side of the relay stage 5. As shown in FIG. 5, the heating means 8 includes a frame support plate 80 that supports the mounted frame 105, and a frame pressing plate 81 that can move between the lower side of the relay stage 5 and the upper side of the frame support plate 80. A suction table 82 that sucks the wafer 100, a push-up member 83 that is formed in a cylindrical shape on the outer peripheral side of the suction table 82 and that can be raised and lowered, a frame lifting / lowering means 84 that lifts and lowers the frame support plate 80, and a suction table 82 And a table raising / lowering means 85 to be moved.

  An opening 80 a having an inner diameter equivalent to the inner diameter of the frame 105 is formed in the frame support plate 80. A plurality of positioning pins 80b that are movable in the X-axis direction are provided on the outer peripheral side of the opening 80a, and the work unit 1000 is fixed by moving the positioning pins 80b toward each other in the X-axis direction. It can be positioned at the position.

  The frame pressing plate 81 includes an opening 81a having an inner diameter equivalent to the opening 80a of the frame support plate 80, and a hole 81b through which a positioning pin 80b protruding upward from the frame support plate 80 is inserted. . The frame pressing plate 81 is connected to the piston rod 81c, and is driven by the cylinder tube 81d to move the piston rod 81c in the Y-axis direction, so that the frame pressing plate 81 also moves in the Y-axis direction. .

  A heater 86 is disposed above the suction table 82. The heater 86 includes an annular heating body 860 and can be moved up and down. The heating body 860 has an inner diameter and an outer diameter corresponding to the non-sticking portion 104 a of the expansion tape 104. The heating body 860 has a function of irradiating infrared rays downward, for example.

  As shown in FIG. 6, the suction table 82 includes a suction part 820 formed of a porous member, a frame body 821 surrounding the suction part 820, a suction hole 822 communicating with the suction part 820, and a suction hole 822. The suction source 823 is connected.

  The work unit 1000 is conveyed between the cooling division unit 6, the relay stage 5, and the heating unit 8 by the third conveyance unit 9. The third transport unit 9 can hold the frame 105 and move in the Y-axis direction.

  As shown in FIG. 1, ultraviolet irradiation means 10 is disposed on the rear side in the Y-axis direction of the positioning cleaning means 4. As shown in FIG. 7, in the ultraviolet irradiation means 10, a plurality of ultraviolet lamps 10a are arranged in parallel, and a work in which a frame 105 is held by the first conveying means 3 in a space above the ultraviolet lamp 10a. The unit 1000 can enter.

  In the work dividing apparatus 1 shown in FIG. 1, a plurality of work units 1000 shown in FIGS. 2 and 3 are accommodated in a cassette 2 a and the cassette 2 a is placed on the cassette base 2. Then, the cassette table 2 is moved up and down to position the cassette 2 a at a predetermined height, and the work unit 1000 is carried out by the first conveying means 3.

  The unloaded work unit 1000 is placed on the rail 40 of the positioning cleaning means 4. Then, after the rails 40 move toward each other and the work unit 1000 is positioned at a fixed position, the frame 105 is attracted by the second transport unit 7 and the work unit 1000 is transported to the relay stage 5. In the relay stage 5, the work unit 1000 is placed on the pair of rails 50, and the work unit 1000 is positioned at a certain position as the rails 50 approach each other.

  Next, the work unit 1000 is transferred to the cooling division unit 6 by the third transfer unit 9. In the cooling division means 6, as shown in FIG. 8A, the frame 105 is placed on the frame support 601 and the expansion tape 104 and the wafer 100 are in a floating state.

  Next, as shown in FIG. 8B, the frame support portion 601 is raised, the frame 105 is sandwiched between the frame support portion 601 and the frame pressing portion 61, and the cold air ejection portion 62 is positioned below the expansion tape 104. It moves, jets cold air toward the adhesive tape 104, and hardens the adhesive tape 104.

  Then, as shown in FIG. 8C, the work lifting / lowering means 602 raises the work support unit 600, thereby extending the expansion tape 104 radially. When it does so, it fractures | ruptures along the division | segmentation scheduled line 101 of the wafer 100, and is divided | segmented into each chip | tip 102. FIG. Since the expansion tape 104 and the DAF 103 are hardened by the cold air jetting from the cold air jetting part 62, the expansion tape 104 and the DAF 103 are easily broken and can be surely divided into the chips 102.

  After the wafer 100 is divided, the workpiece support 600 is lowered as shown in FIG. At this time, the non-sticking portion 104a of the expansion tape 104 is loosened.

  The work unit 1000 into which the wafer 100 has been divided in this way is unloaded onto the rail 50 by the third transfer unit 9 and then transferred to the heating unit 8 by the second transfer unit 7.

  In the heating means 8, as shown in FIG. 9A, the frame 105 is placed on the frame support plate 80 and is sandwiched between the frame pressing plate 81. At this time, the divided wafer 100 and the expansion tape 104 are in a floating state.

  Next, as shown in FIG. 9B, the suction table 82 is raised by the raising of the push-up member 83, and the expansion tape 104 is radially expanded again. Subsequently, the expanded expansion tape 104 is sucked and held on the suction table 82 by applying a suction force from the suction source 823.

  Next, as shown in FIG. 9C, the push-up member 83 is lowered and separated from the expansion tape 104. Further, the suction table 82 is also lowered so that the upper surface of the suction portion 82 is substantially the same height as the lower surface of the frame 105. If it does so, the non-sticking part 104a of the expansion tape 104 will be in the loose state.

  Next, as shown to Fig.10 (a), the heater 86 is lowered | hung and the heating body 860 is adjoined just above the loose non-sticking part 104a. Then, when the heating body 860 is heated to heat the non-adhering part 104a, the non-adhering part 104a contracts and is not loosened as shown in FIG. 10B. The non-sticking portion 104a is heated in a state where the expansion tape 104 is sucked by the suction table 82. Accordingly, since the portion of the expansion tape 104 that is attracted to the suction table 82 does not contract, the interval between adjacent chips 102 does not narrow, and the chips 102 do not contact each other.

  Next, the work unit 1000 is transferred to the cleaning positioning unit 4 by the second transfer unit 7 shown in FIG. 1, the wafer 100 is held on the spinner table 41, and the frame 105 is held on the frame fixing unit 42. Then, cleaning and drying processes are performed while the spinner table 41 and the frame fixing unit 42 are rotated.

  Next, the work unit 1000 is transferred to the ultraviolet irradiation means 10 by the first transfer means 3. Then, the expansion tape 104 is irradiated with ultraviolet rays by the ultraviolet lamp 10a shown in FIG. 7, and the adhesive layer is cured. Therefore, the subsequent peeling of the chip 102 from the expansion tape 104 can proceed smoothly.

  After the ultraviolet rays are applied to the expansion tape 104 in this way, the work unit 1000 is conveyed onto the rail 40 by the first conveying means 3. Then, after the work unit 1000 is positioned on the rail 40, the work unit 1000 is accommodated in the cassette 2a by the first conveying means 3.

  As shown in FIG. 11, the workpiece dividing apparatus 1 operating as described above is provided with a cassette base 2 and a heating means 8 at the front of the apparatus, and a positioning cleaning means 4 at the rear of the cassette base 2, Further, an ultraviolet irradiation means 10 is disposed behind them. A relay stage 5 is disposed behind the heating unit 8, and a cooling division unit 6 is disposed behind the relay stage 5.

  As shown in FIGS. 11 and 12, an electrical box 200 is disposed above the positioning cleaning unit 4 and the ultraviolet irradiation unit 10. The electrical box 200 has a cassette table 2 and a first transport unit 3. , Positioning cleaning means 4, relay stage 5, cooling division means 6, second transport means 7, heating means 8, third transport means 9, ultraviolet irradiation means 10, etc. Drives a motor for driving the means 3 and the third transport means 9 in the Y-axis direction, a motor for rotating the spinner table 41 constituting the positioning cleaning means 4, a motor for moving the rails 40 and 50, etc. The electric control equipment to be integrated is housed.

  As shown in FIG. 11, the cooling division means 6 is provided in the cooling division box 300. The cooling division box 300 is provided with a cold air discharge fan 400 provided with a cold air inlet pipe 400a for feeding the used cold air, which is ejected from the cold air ejection portion 62 of the cooling division means 6 shown in FIG. It is installed. As described above, the workpiece dividing device 1 functions as an electrical component cooling device including the electrical component box 200 and the cooling divided box 300.

  The cool air discharge fan 400 includes a first temperature sensor 400 b that monitors the temperature of the cool air sent into the electrical box 200. As shown in FIG. 12, the cold air inlet tube 400a is provided with an air inlet 400c for introducing air for adjusting the temperature of the cold air. In addition, the electrical box 200 is provided with a second temperature sensor 400d that monitors the temperature inside the electrical box 200.

  As shown in FIG. 8B, when cold air is ejected from the cold air ejection portion 62, the cold air is passed through the cold air inlet pipe 400a by the cold air discharge fan 400 provided in the cooling division box 300, and the electrical box. 200. Since the electrical box 200 includes various electrical control devices, that is, circuit components, ICs, LSIs, etc., the sent cool air is used for cooling the electrical control device, and the temperature in the electrical box 200 is adjusted. Can do.

  The first temperature sensor 400b always measures the temperature of the cold air sent to the electrical box 200 through the cold air inlet pipe 400a. For example, when the temperature is too low, air can be introduced from the air inlet 400c, the temperature of the cold air can be adjusted, and the temperature-adjusted cold air can be sent into the electrical box 200.

  On the other hand, in the electrical box 200, since the second temperature sensor 400d constantly monitors the temperature in the electrical box, the introduction of air from the air inlet 400c is adjusted according to the temperature in the electrical box 200, The temperature inside the electrical box 200 can be set to a desired temperature. For example, if the temperature inside the electrical box 200 becomes too low, problems such as condensation may occur. Therefore, such problems can be avoided in advance by introducing air from the air inlet 400c.

  In this way, the cool air used in the cooling division box 300 is effectively used, and the cool air is not discharged into the device installation room as it is, so that the temperature of the device installation room is not adversely affected.

1000: Work unit 100: Wafer 100a: Front surface 100b: Back surface 101: Line to be divided 102: Chip 103: DAF
104: Expansion tape 104a: Non-adhering part 105: Frame 105a: Opening part 1: Work dividing device (electric equipment cooling device)
2: cassette base 2a: cassette 3: first transport means 4: positioning cleaning means 40: rail 41: spinner table 42: frame fixing part 5: relay stage 50: rail 6: dividing means 60: holding unit 600: work support 601: Frame support 601a: Support surface 601b: Through hole 602: Work lifting / lowering means 603: Frame lifting / lowering means 603a: Cylinder tube 603b: Piston rod 61: Frame pressing part 610: Opening 62: Cold air ejection part 7: Second Conveying means 70: suction part 8: heating means 80: frame support plate 80a: opening 80b: positioning pin 81: frame pressing plate 81a: opening 81b: hole 81c: piston rod 81d: cylinder tube 82: suction table 83: Push-up member 84: frame raising / lowering Step 85: Table elevating means 86: Heater 860: Heating body 9: Third transport means 10: Ultraviolet irradiation means 10a: Ultraviolet lamp 200: Electrical box 300: Cooling division box 400: Cold air discharge fan 400a: Cold air inlet pipe 400b : First temperature sensor 400c: Air inlet 400d: Second temperature sensor

Claims (2)

A ring-shaped frame having an opening, an expansion tape attached to the frame so as to close the opening, and a work attached to the expansion tape and held in the opening via the expansion tape A cooling division box having cooling division means for holding the work unit, and extending and cooling the expansion tape to divide the workpiece along a division division line formed on the workpiece;
An electrical box that integrates the electrical control equipment of each drive unit,
An electrical equipment cooling device disposed in a workpiece dividing device including:
An electrical component cooling apparatus in which the cooling division box is provided with a cold air discharge fan provided with a cold air inlet pipe for feeding the used cold air into the electrical box.   A first temperature sensor for monitoring the temperature of the cool air sent to the electrical box by the cool air discharge fan, an air introduction port for introducing air for mixing with the cool air and adjusting the temperature of the cool air; The electrical component cooling device according to claim 1, further comprising a second temperature sensor that monitors a temperature in the electrical component box.

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