JP2002222820A - Article assembling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve precision in inclination adjustment at the time of attaching a member holding part, to eliminate bonding defects and to improve the quality reliability of a bonded article. SOLUTION: A die bonding device for bonding a semiconductor chip 1 to a lead frame 36 and assembling a semiconductor device is provided with a collect holder 5 for holding the semiconductor chip 1, a bonding arm 10 for moving the semiconductor chip 1 held by the collect holder 5 onto the lead frame 36 and pressing the semiconductor chip 1 to the side of the lead frame 36, and a stress absorption mechanism 15 for an X axis and a stress absorption mechanism 16 for a By axis for absorbing ineffective stress pressed to the semiconductor chip 1 by the bonding arm 10. The stress absorption mechanism 15 for the X axis and the stress absorption mechanism 16 for the By axis are attached between the collect holder 5 and the bonding arm 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an article assembling apparatus suitable for application to a die bonding apparatus or the like for mounting a semiconductor chip by pressing a semiconductor chip against a die pad to which an Ag paste has been previously applied.

[0002]

2. Description of the Related Art In recent years, the reliability of quality of semiconductor devices has been required to be higher and higher. The mounting process of semiconductor devices is closely related to the reliability of wiring and packaging, and the devices used in the process also require increasingly higher levels of operation accuracy to increase their reliability. .

FIG. 8 is a perspective view showing a configuration example of a die bonding apparatus 50 which is an example of a conventional article assembling apparatus. The die bonding apparatus 50 is a semiconductor chip 1
Is held by vacuum suction at the tip of the collet holder 55,
The held semiconductor chip 1 is moved onto the lead frame 36, and this is a bonding surface of the lead frame 36, which is pressed against a die pad to which an Ag paste is applied to bond.

The die bonding apparatus 50 has a collet holder 55 for holding the semiconductor chip 1. Although not shown, the collet holder 55 is provided with a vacuum suction mechanism, and a suction hole connected to the vacuum suction mechanism is provided at the tip thereof. The semiconductor chip 1 is sucked and held at the tip of the collet holder 55 by sucking air from the suction holes.

Next, the die bonding apparatus 50 has a bonding arm 56. The bonding arm 56 moves the semiconductor chip 1 held by the collet holder 55 onto the die pad and presses the semiconductor chip 1 against the die pad. Although not shown, the bonding arm 56 is driven by a motor.
It is made to move in the direction and the Z direction.

The die bonding apparatus 50 further includes an X-axis tilt adjusting mechanism 57 and a Y-axis tilt adjusting mechanism 58 between the collet holder 55 and the bonding arm 56. The X-axis tilt adjustment mechanism 57 and the Y-axis tilt adjustment mechanism 58 are arranged in advance so that the collet holder 55 and the die pad are parallel to each other and the collet holder 55 reaches a predetermined position on the die pad. It is done by fine-tuning.

The X-axis tilt adjusting mechanism 57 has an X-axis base member 63, which is fitted and fixed to the collet holder 55.
In addition, the X-axis base member 63 is provided from below in FIG.
A fulcrum pin 59, a fixing screw 60, and an eccentric pin 61 for inclination are provided, and are adapted to engage with the inclination adjustment mechanism 58 for Y axis. The collet holder 55 fitted to the X-axis base member 63 is adjusted to be perpendicular to the X direction of the die pad with the fulcrum pin 59 provided on the X-axis base member 63 as a fulcrum.

The Y-axis tilt adjusting mechanism 58 has a Y-axis base member 64. The Y-axis base member 64 has a configuration similar to that of the X-axis base member 63, and is configured to engage with the bonding arm 56. Collet holder 55
Is adjusted to be perpendicular to the Y direction of the die pad with a fulcrum pin 59 provided on the Y-axis base member 64 as a fulcrum.

[0009]

According to the conventional die bonding apparatus 50, each time the size of the semiconductor chip 1 to be suction-held is changed, the collet holder 55 is required.
Need to be replaced.

This replacement involves adjusting the mounting position and inclination of the collet holder 55 with respect to the die pad. The collet holder 55 is repeatedly adjusted until the semiconductor chip suction surface of the collet holder 55 is brought into contact with the die pad and the indentation of the contour of the suction surface is evenly applied to a predetermined position of the die pad. This adjustment requires a high level of adjustment skill (skill) for the operator, and has a problem that the required time is long.

Further, if the above adjustment is insufficient,
When the semiconductor chip 1 is bonded to the die pad by using the die bonding apparatus 50, A
The thickness of the g paste becomes uneven, and the semiconductor chip 1 is inclined with respect to the die pad. As described above, when the semiconductor chip 1 is bonded in a state inclined with respect to the die pad, a bonding failure between the semiconductor chip 1 and the wire is likely to occur in the next wire bonding step, and the quality reliability of the semiconductor device is greatly increased. There is a problem that it will be damaged.

In view of the above, the present invention has been made to solve such a conventional problem, and improves the accuracy of tilt adjustment at the time of attaching a member holding portion, and improves the quality reliability of a bonded article by eliminating defective bonding. It is an object of the present invention to provide an article assembling apparatus that can be used.

[0013]

In order to solve the above-mentioned problems, an article assembling apparatus according to the present invention is an apparatus for assembling an article by joining an arbitrary member to be joined to a predetermined receiving member. A member holding portion that holds the joining member, a moving pressing unit that moves the member to be joined held by the member holding unit onto the receiving member, and presses the member to be joined toward the receiving member side; A stress absorbing mechanism for absorbing the reactive stress pressed to the member, wherein the stress absorbing mechanism is mounted between the member holding portion and the moving pressing means.

According to the article assembling apparatus of the present invention, the member holding portion is provided with the stress absorbing means, and when the member to be joined is pressed against the receiving member, the invalid stress pressed against the member to be joined is absorbed. It is made to do.

Therefore, for example, even when the member holding portion holds the member to be joined with an inclination, stress other than the stress for correcting the inclination can be absorbed by the stress absorbing means. The surface and the joining surface of the receiving member can be joined in a self-aligned and uniform manner with good adhesion.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an article assembling apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a die bonding apparatus 100 to which an article assembling apparatus according to an embodiment of the present invention is applied.

In this embodiment, the member holding portion for holding the member to be joined is provided with a stress absorbing means, so that even if the member holding portion for holding the member to be joined is inclined, it absorbs the pressed invalid stress, Along with enabling the joining surface of the joining member and the joining surface of the receiving member to be joined in self-alignment
Even when replacement of the member holding portion is involved, the replacement work of the member holding portion can be reduced.

A die bonding apparatus 100 shown in FIG.
Is a semiconductor chip 1 which is an example of an arbitrary member to be joined,
This is an apparatus for assembling a semiconductor device by joining to a lead frame 36 which is an example of a predetermined receiving member.

The die bonding apparatus 100 has a collet holder 5 which is an example of a member holding section. The collet holder 5 holds the semiconductor chip 1 and is connected to a vacuum suction mechanism (not shown). A suction hole connected to this vacuum suction mechanism is provided at the tip of the collet holder 5. By sucking air from the suction holes, the semiconductor chip 1 is vacuum-adsorbed at the tip of the collet holder 5. The size of the suction surface of the collet holder 5 varies depending on the size of the semiconductor chip to be held. For example, the length is about 25 mm, and the tip for vacuum suction of the semiconductor chip 1 has a square with a side of about 6 mm. are doing. The material is stainless steel or the like, and the tip is coated with polyimide or the like, so that the semiconductor chip is protected.

Next, the die bonding apparatus 100 has a bonding arm 10 which is an example of the moving and pressing means. The bonding arm 10 moves the semiconductor chip 1 sucked and held by the collet holder 5 toward the lead frame 36 and presses the semiconductor chip 1 against a die pad, which is a bonding surface of the lead frame 36. Although not shown, the bonding arm 10 is driven by a motor, and is movable in the Y and Z directions. The size of the bonding arm 10 is, for example, about 110 mm in length, 10 mm in width, and about 50 mm in height, and the material is iron or the like.

Further, the die bonding apparatus 100
An X-axis stress absorbing mechanism 15 and a Y-axis stress absorbing mechanism 16, which are examples of a stress absorbing mechanism, are provided between the collet holder 5 and the bonding arm 10. The X-axis stress absorbing mechanism 15 and the Y-axis stress absorbing mechanism 16 correspond to the X direction and the Y direction pressed against the semiconductor chip 1 by the bonding arm 10.
It absorbs the reactive stress in each direction.

Each of the X-axis stress absorbing mechanism 15 and the Y-axis stress absorbing mechanism 16 operates independently. The die bonding apparatus 100 includes the X-axis stress absorbing mechanism 15 and the Y-axis stress absorbing mechanism 16 so that even if the collet holder 5 is inclined with respect to the pressing direction, the die-bonding surface of the semiconductor chip 1 and the die pad Can be joined in a self-aligned manner.

The X-axis stress absorbing mechanism 15 and the Y-axis stress absorbing mechanism 16 provided in the die bonding apparatus 100 are provided.
Are provided with protective cases 32 indicated by broken lines in FIG. The protective case 32 is made of a strong stainless metal or the like, and is detachably fixed with screws or the like. Hereinafter, FIGS. 2A and 2B to FIGS. 7A and 7
In B, illustration of the protective case 32 is omitted.

Next, the stress absorbing mechanism of the die bonding apparatus 100 will be described in more detail. 2A and 2B
FIG. 3 is a front view showing a configuration example of an X-axis stress absorbing mechanism 15 and a Y-axis stress absorbing mechanism 16. FIGS. 3A and 3B are cross-sectional views showing a configuration example of the X-axis stress absorbing mechanism 15 and the Y-axis stress absorbing mechanism 16.

First, referring to FIGS. 2A and 3A,
The configuration of the X-axis stress absorbing mechanism 15 will be described. FIG.
A and the X-axis stress absorbing mechanism 15 shown in FIG.
have. Since the X-axis base member 7 is integrated with the collet holder 5, the X-axis
All the reactive stresses in the directions are transmitted to the X-axis stress absorbing mechanism 15 attached to the X-axis base member 7 via the X-axis base member 7.

The X-axis base member 7 has
, And a first opening 8 and a second opening 9 that reach the Y-axis base member 41 (see FIG. 3A) of the adjacent Y-axis stress absorbing mechanism 16 are provided. The first opening 8 has a diameter of 2
It has a size of about mm. The second opening 9 has two diameters, for example, a diameter of about 6 mm from the opening side (the right side shown in FIG. 3A) to a depth of 8 mm, and a remaining 2 m.
m has a size of about 12 mm in diameter. X-axis base member is 45mm long, 10mm wide and 40m high
m, stainless metal or the like is used.

Next, the X-axis stress absorbing mechanism 15 has a fulcrum shaft 12. The fulcrum shaft 12 attaches the X-axis base member 7 to the Y-axis base member 41 and makes the X-axis base member 7 and the collet holder 5 movable in the X direction with the fulcrum shaft 12 as a fulcrum. is there. The fulcrum shaft 12 is engaged with the Y-axis base member 41 through the first opening 8. The fulcrum shaft 12 has a length of about 22 mm and a diameter of about 2 mm, and is made of stainless steel or the like.

Further, the X-axis stress absorbing mechanism 15 has an eccentric member 14. The eccentric member 14 finds the inclination of the collet holder 5 in the X direction with respect to the pressing direction (see FIGS. 7A and 7B). The eccentric member 14 has a shaft, and the shaft is inserted into the second opening. The eccentric member 14 is composed of five members as described below.

Referring to FIG. 3A, the structure of the eccentric member 14 will be described. First, the eccentric member 14 is the eccentric plate 2
It has 0. The eccentric plate 20 is rotated by a predetermined angle with respect to the inclination of the collet holder 5 in the X direction with respect to the pressing direction. The eccentric plate 20 is disk-shaped and has a size of about 28 mm in diameter and about 2 mm in thickness. Further, the eccentric plate 20 has a pair of protrusions 21 at its outer peripheral end. The projection 21 plays a role of locking one end of a pair of springs 17 constituting the X-axis stress absorbing mechanism 15.

Second, the eccentric member 14 has a center shaft 22 fitted to the center of the eccentric plate 20. This center axis 2
2 rotates the eccentric plate 20 with respect to the X-axis base member 7 with the center axis 22 as the axis. The central shaft 22 has a columnar shape, and has a length of about 10 mm and a diameter of about 6 mm.

Third, the eccentric member 14 has a connecting plate 23. The connecting plate 23 prevents the eccentric plate 20 and the central shaft 22 from falling off the X-axis base member 7, and one end of the central shaft 22 is fitted to the central portion of the connecting plate 23. The connection plate 23 is embedded in the second opening 9 after being fitted to the center shaft 22. The connection plate 23 has a disk shape and a size of about 12 mm in diameter and about 2 mm in thickness. An opening having a diameter of about 6 mm is formed at the center of the connection plate 23 for fitting the center shaft 22.

Fourth, the eccentric member 14 has an eccentric shaft 27 having one end fixed to the outer peripheral end of the connection plate 23. The eccentric shaft 27 is joined to the outer peripheral end of the connecting plate 23 as much as possible. This is because, as the distance between the axis of the central shaft 22 and the axis of the eccentric shaft 27 increases, the movement of the X-axis stress absorbing mechanism 15 in the X direction becomes smoother thereafter.
This is because the invalid stress absorbing function is enhanced. The eccentric shaft 27 has a cylindrical shape, a length of about 10 mm and a diameter of about 2 mm.

Fifth, the eccentric member 14 has the bearing 28 embedded in the Y-axis base member 41. The bearing 28 holds the eccentric shaft 27 and makes the eccentric shaft 27 movable in the X direction. Bearing 2
Reference numeral 8 is designed to rotate the eccentric plate 20 connected to the eccentric shaft 27 by a predetermined angle with respect to the X-axis base member 7 in conjunction with the operation of the X-axis stress absorbing mechanism 15. The bearing 28 is formed in a rail shape and an elliptical arc shape having the fulcrum shaft 12 as a center. The width of the bearing 28 is 2 mm,
The depth is about 10 mm, and the length depends on the allowable inclination angle of the X-axis base member 7, but in this example, it is about 13 mm.

The eccentric member 14 is constituted by the above-mentioned first to fifth members.
Is characterized by the eccentric shaft 2 described in the fourth aspect.
7 and the bearing 28 described fifth. Eccentric shaft 27
And the bearing 28 rotate the eccentric plate 20 connected to the eccentric shaft 27 by a predetermined angle with respect to the X-axis base member 7 when the X-axis stress absorbing mechanism 15 absorbs a predetermined reactive stress. As a result, the eccentric member 14 finds the amount of displacement between the semiconductor chip 1 and the lead frame.

Further, the X-axis base member 7 shown in FIG.
Has a pair of spring fixing pins 11 at two points at a predetermined distance from the axis of the eccentric member 14. The spring fixing pin 11 has a cylindrical shape with a diameter of about 2 mm, and projects from the surface of the X-axis base member 7 by about 5 mm.

The X-axis stress absorbing mechanism 15 has a pair of springs 17. One end of the pair of springs 17 is engaged with the spring fixing pin 11, and the other end is engaged with the protrusion 21. When a stress acting in the X direction is not applied to the collet holder 5, each of the pair of springs 17 is appropriately extended to hold the collet holder 5 at a predetermined position. In addition, the collet holder 5
When an invalid stress acting in the X direction is applied to the pair of springs, the pair of springs expand and contract with each other to absorb the invalid stress.

Next, the Y-axis stress absorbing mechanism 16 will be described. 2B and 3B are a front view and a cross-sectional view showing a configuration example of the Y-axis stress absorbing mechanism 16. 2B and 3B, the Y-axis stress absorbing mechanism 16 is a Y-axis base member 41.
have. The Y-axis base member 41 is supported by the bonding arm 10 and is movable in the Y direction. Therefore, the collet holder 5 moves Y in the pressing direction.
Even if the semiconductor chip 1 is inclined in the direction, the reactive stress in the Y direction acting on the semiconductor chip 1 is absorbed by the Y-axis stress absorbing mechanism 16.

The structure of the Y-axis stress absorbing mechanism 16 has the same function with the same name and reference numeral, and a description thereof will be omitted.

Next, an example of assembling the die bonding apparatus 100 will be described with reference to FIG. FIG. 4 is a perspective view showing an example of assembling the die bonding apparatus 100. FIG.
, The collet holder 5 is set in advance by an operator
It is assumed that it is attached to the shaft base member 7.

First, the fulcrum shaft 12 is engaged with the Y-axis base member 41 through the first opening 8 of the X-axis base member 7.
Next, the central shaft 22 integrated with the eccentric plate 20 is passed through the second opening 9 of the X-axis base member 7. Further, when the central axis 22 is X
The distal end is fitted into the opening of the connection plate 23 so as not to fall off the shaft base member 7. At this time, the connection plate 23 is set to X
It is completely buried in the shaft base member (see FIG. 3A). Subsequently, the eccentric shaft 27 integrated with the connection plate 23 is connected to the bearing 28 embedded in the Y-axis base member 41. After the eccentric shaft 27 and the bearing 28 are connected, the X-axis base member 7 is movable in the X direction about the fulcrum shaft 12 provided on the X-axis base member 7.

Further, a pair of spring fixing pins 11 is inserted into a pair of spring fixing pin inlets 18 of the X-axis base member 7. When the spring fixing pin 11 is completely inserted into the spring fixing pin insertion port 18, the spring fixing pin 11 projects from the surface of the X-axis base member 7 by about 5 mm. After that, the pair of springs are fixed to each other by bridging one end to a pair of projections 21 provided on the eccentric plate 20 and the other end to a pair of spring fixing pins 11. After fixation, the pair of springs are appropriately extended.

In this manner, the X-axis stress absorbing mechanism 15
Is assembled. After assembling, the X-axis stress absorbing mechanism 15 is supported by the Y-axis stress absorbing mechanism 16 and is movable in the X direction.

Similarly, the Y-axis stress absorbing mechanism is assembled. The Y-axis stress absorbing mechanism 16 is supported by the bonding arm 10 and is movable in the Y direction. The X-axis stress absorbing mechanism 15 and the Y-axis stress absorbing mechanism 16 are assembled as described above, and the die bonding apparatus 100 shown in FIG. 1 is completed.

Next, an operation example of the die bonding apparatus 100 will be described. In this example, the semiconductor chip is sucked by the tip of the collet holder provided in the die bonding apparatus 100, and the sucked semiconductor chip is moved above the lead frame by the Y and Z directions of the bonding arm. It is assumed that the semiconductor chip is placed on a die pad, which is an adhesive surface of the above, and the semiconductor chip placed here is pressed as it is to join the semiconductor chip to the die pad.

FIGS. 5A and 5B show a die bonding apparatus 1.
It is the front view and side view which show the operation example (the 1) of 00. 5A and 5B, the collet holder 5 is made to approach the semiconductor chip 1 held by the dicing tape 39 by the operation of the bonding arm 10 in the Z direction. The semiconductor chip 1 is provided with a pin holder 7.
By 0, it is pushed up to the collet holder 5 side. The pushed semiconductor chip 1 is moved by a vacuum suction mechanism (not shown) connected to the collet holder 5.
The collet holder 5 is held by suction at the tip thereof. Then, the semiconductor chip 1 sucked and held at the tip of the collet holder 5 is moved above the lead frame by the operation of the bonding arm 10 in the Z and Y directions.

FIG. 6 is a perspective view showing an operation example (part 2) of the die bonding apparatus 100. An Ag paste (not shown) is applied to the surface of the die pad 46 shown in FIG. 6 as an adhesive. The semiconductor chip 1 sucked at the tip of the collet holder 5 is made to approach the die pad 46 by the operation of the bonding arm 10 in the Z direction.

FIGS. 7A and 7B show a die bonding apparatus 1.
It is a front view which shows the operation example (the 3) of 00. 7A, the collet holder 5 holding the semiconductor chip 1 by suction has a slight inclination 30 with respect to the pressing direction. When the semiconductor chip 1 adsorbed by the collet holder 5 having the inclination 30 is pressed against the die pad 46, the semiconductor chip 1 shown in FIG.
The reactive stress 49 shown by the solid line arrow in FIG. FIG. 7B shows a state where the semiconductor chip 1 is further pressed against the die pad 46 from the state of FIG. 7A. The reactive stress 49 acting on the semiconductor chip 1 is continuously absorbed by the rotation of the eccentric member 14 and the expansion and contraction of the pair of springs 17. Finally, the semiconductor chip 1 is vertically bonded to the die pad 46.

Die bonding apparatus 100 according to the present invention
The most characteristic operation is the rotation of the eccentric member 14 when the semiconductor chip 1 is pressed and the expansion and contraction of the pair of springs 17 in conjunction with the rotation. This operation will be described in more detail.

As shown in FIG. 7A, when the semiconductor chip 1 is pressed by the die pad 46 in a state where the collet holder 5 has the inclination 30 with respect to the Z direction of the die pad 46, the semiconductor chip 1 The reactive stress 49 shown by the solid arrow of 7A acts. The X-axis base member 7 integrated with the collet holder 5 receives the reactive stress 49 and receives the fulcrum shaft 12.
About the Y-axis base member 41. At this time, the eccentric shaft 27 constituting the eccentric member 14 is moved to a predetermined position in the bearing 28 along the track of the bearing 28 holding the eccentric shaft 27.

As the eccentric shaft 27 moves within the bearing 28, the eccentric plate 20 connected to the eccentric shaft 27
The shaft is rotated by a predetermined angle with respect to the shaft base member 7. Further, the pair of springs 17, one ends of which are fixed to the projections 21 of the eccentric plate 20, expand and contract in accordance with the rotation of the eccentric plate 20, and absorb the reactive stress 49.

Thereafter, as shown in FIG. 7B, when the surface to be bonded of the semiconductor chip 1 comes into close contact with the die pad 46, the reactive stress 49 becomes zero, and the pair of springs 17 keeps expanding and contracting. When the pressing operation is completed by moving the bonding arm 10 in the Z direction, the pair of springs 1
7 releases its stretched state and returns to its original moderately expanded state. Accordingly, the eccentric plate 20 connected to the pair of springs 17 and the eccentric shaft 27 connected to the eccentric plate 20 return to their original positions, so that the X-axis base member 7 and the collet holder 5 also return to their original positions. .

As described above, even when the collet holder 5 holds the semiconductor chip 1 with an inclination, a stress other than the stress for correcting the inclination is applied by the X-axis stress absorbing mechanism 15 and the Y-axis stress absorbing mechanism 16. Since it can be absorbed, the surface to be bonded of the semiconductor chip 1 and the die pad of the lead frame can always be bonded in a self-aligned manner and with good adhesion.

Therefore, it is not necessary to adjust the inclination of the collet holder 5 at the time of mounting the collet holder 5 as compared with the conventional die bonding apparatus, so that the collet holder 5 can be replaced easily and in a short time. As a result, the production efficiency of the die bonding apparatus can be improved.
In addition, the bonding failure of the semiconductor chip 1 due to the inclination adjustment error is eliminated, and the quality reliability of the bonded semiconductor device can be improved.

In this embodiment, the description has been given of the case of the die bonding apparatus with respect to the article assembling apparatus. However, the present invention is not limited to this, and is suitably applied to, for example, a glass member welding apparatus.

[0055]

According to the article assembling apparatus according to the present invention, the member holding portion for holding the member to be joined is provided with the stress absorbing means, and when the member to be joined is pressed against the receiving member, the member to be joined is It is made to absorb the reactive stress pressed to the side.

According to this configuration, for example, even if the member holding portion holds the member to be joined with an inclination, stress other than the stress for correcting the inclination can be absorbed by the stress absorbing means. The joining surface and the joining surface of the receiving member can be joined in a self-aligned and uniform manner with good adhesion.

Therefore, as compared with the conventional article assembling apparatus, it is not necessary to adjust the inclination of the member holding portion at the time of mounting the member holding portion. It can be replaced in a short time, and the production efficiency of the article assembling apparatus can be improved. In addition, it is possible to eliminate defective bonding of any members to be bonded due to an inclination adjustment error, and to improve the quality reliability of the bonded article. INDUSTRIAL APPLICABILITY The present invention is suitably applied to a die bonding apparatus or the like for joining a semiconductor chip to a die pad.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration example of a die bonding apparatus 100 to which an article assembling apparatus according to an embodiment of the present invention is applied.

FIGS. 2A and 2B are front views showing configuration examples of an X-axis stress absorbing mechanism 15 and a Y-axis stress absorbing mechanism 16. FIGS.

FIGS. 3A and 3B are cross-sectional views showing configuration examples of an X-axis stress absorbing mechanism 15 and a Y-axis stress absorbing mechanism 16. FIGS.

FIG. 4 is a perspective view showing an example of assembling the die bonding apparatus 100.

FIGS. 5A and 5B are a front view and a side view showing an operation example (part 1) of the die bonding apparatus 100. FIGS.

FIG. 6 is a perspective view showing an operation example (part 2) of the die bonding apparatus 100.

FIGS. 7A and 7B are front views showing an operation example (part 3) of the die bonding apparatus 100. FIGS.

FIG. 8 is a perspective view showing a configuration example of a die bonding apparatus 50 according to a conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip (member to be joined), 5 ... Collet holder (member holding part), 7 ... X-axis base member, 1
0: bonding arm (moving and pressing means), 12
..Fulcrum shaft, 14 ... eccentric member, 15 ... stress absorbing means for X axis, 16 ... stress absorbing means for Y axis, 17 ...
・ A pair of springs, 36 ・ ・ ・ Lead frame (receiving member), 46 ・ ・ ・ Die pad

Claims (5)

[Claims] An apparatus for assembling an article by joining an arbitrary member to be joined to a predetermined receiving member, comprising: a member holding portion for holding the member to be joined; and a member to be held held by the member holding portion. A moving pressing unit that moves the receiving member toward the receiving member while moving the receiving member on the receiving member side, and a stress absorbing mechanism that absorbs an invalid stress pressed by the moving pressing unit toward the receiving member, The article assembling apparatus, wherein the stress absorbing mechanism is attached between the member holding unit and the moving pressing unit. 2. The stress absorbing mechanism according to claim 1, wherein the X-axis stress absorbing mechanism absorbs an X-direction reactive stress applied to the member to be joined, and a Y-direction invalid stress applied to the member to be joined. The article assembling apparatus according to claim 1, further comprising a stress absorbing mechanism for absorbing the Y-axis. 3. The X-axis stress absorbing mechanism includes a first position at a predetermined position for mounting the stress absorbing mechanism.
And a base member having a second opening and integrated with the member holding portion; and a first opening for the Y axis through the first opening of the base member to make the member holding portion movable with respect to the X axis. A fulcrum shaft engaged with the stress absorbing mechanism, and a shaft for finding the amount of displacement of the member holding portion, engaged with the Y-axis stress absorbing mechanism through the second opening of the base member. An eccentric member, and one end is fixed at an outer peripheral end portion of the eccentric member, and is constituted by an urging means having the other end attached to the base member, and the reactive stress in the X direction pressed to the member to be joined is reduced. 2. The article assembling apparatus according to claim 1, wherein said eccentric member is adapted to be absorbed by rotation and biasing means. 4. The Y-axis stress absorbing mechanism includes a first position at a predetermined position for mounting the stress absorbing mechanism.
And a base member integrated with the member holding portion having a second opening, and the movement pressing means through the first opening of the base member to make the member holding portion movable with respect to the Y axis. An engaged fulcrum shaft, an eccentric member having a shaft for finding the amount of displacement of the member holding portion and being engaged with the moving pressing means through a second opening of the base member; One end is fixed at the outer peripheral end, and the other end is attached to the base member. The biasing means is configured to rotate and bias the eccentric member against the reactive stress in the Y direction pressed by the member to be joined. 2. The article assembling apparatus according to claim 1, wherein the article is absorbed by means. 5. A semiconductor chip is held by the member holding portion, and thereafter, the semiconductor chip is moved onto a lead frame by the moving and pressing means, and the semiconductor chip is pressed against the lead frame side. The article assembling apparatus according to claim 1, wherein the article assembling apparatus is applied to a die bonding apparatus that absorbs an invalid stress applied to a semiconductor chip by the stress absorbing mechanism.