JP3202495B2 - Die bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a die bonding apparatus for a long semiconductor chip having a substantially rectangular shape, such as a CCD linear image sensor and an LED for a printer.

[0002]

2. Description of the Related Art In recent years, the automation of the assembling process of a semiconductor device has made remarkable progress. In particular, each process such as a wafer test process, a dicing process, a die bonding process, and a wire bonding process involves automatically transporting a workpiece. A method of processing by each automatic machine is adopted.
Among them, in the die bonding step, the semiconductor chip after the dicing step and the package or the lead frame are automatically conveyed to predetermined positions. Next, the adhesive is automatically dropped onto a package or a lead frame, and a semiconductor chip (hereinafter, referred to as an object to be processed) automatically picked up separately from the semiconductor wafer is bonded to the dropped adhesive to form an integral body. Die bonding equipment is becoming mainstream.

In such a die bonding step, a semiconductor chip divided from a semiconductor wafer by a breaking step and arranged on a tray or the like is suctioned to a nozzle connected to a decompression device, and a dicing tape made of synthetic resin is used. There is also known a B-type in which each semiconductor chip stuck on the substrate is lifted by a needle-like member and then suctioned by a nozzle connected to a decompression device.

In order to pick up an object to be processed having a rectangular planar shape divided by the B method, a large number of holes having a diameter of about 1 mm are formed on the back surface of the pepper pot and fixed by suction for each dicing tape. After that, one or more needles called injector pins break the dicing tape through the suction holes, lift the semiconductor chip from the dicing tape, further vacuum-adsorb to the transfer nozzle and transport the semiconductor chip to a predetermined place. I have.

[0005] As shown in FIG.
FIG. 4 shows a state in which the semiconductor chip 1 which is an object to be processed is fixed and then the dicing tape 3 is pushed up by the injector pins 14 in a sectional view.

[0006]

In semiconductor chips such as CCD linear image sensors and LEDs for printers, the die bonding process is being automated even for workpieces having a length exceeding 15 mm and a width of 1 mm or less. . However, since it is difficult to automatically supply semiconductor chips from a semiconductor wafer, the current situation is that the semiconductor chips are manually rearranged and arranged on a chip tray.

In the steps shown in FIGS. 3 and 4, since the width of the suction hole 4 formed is equal to the width of the processing object 1, the force for sucking the dicing tape 3 is reduced by the injector pin at the time of pickup. Is weaker than the force that breaks through the dicing tape 3. As a result, the processing object 1 is lifted together with the dicing tape 3, and the processing object 1 adjacent thereto is peeled off from the dicing tape 3 or interferes with the adjacent processing object 1 to be scratched. occured. Further, even when the suction hole 4 is larger than the workpiece 1, if the edge of the suction hole 4 does not coincide with the short side direction of the workpiece 1, that is, the width direction, the adjacent workpiece 1 may be peeled off due to an impact at the time of suction. There were problems such as tilting and interference with each other.

The present invention has been made under such circumstances, and in particular, the lifting of the dicing tape and the reduction of impact at the time of picking up an object to be processed, which is essential for the die bonding process, and the proximity of the object to be picked up. A novel die bonding apparatus for preventing rolling and interference of objects.

[0009]

Means for Solving the Problems A pepper pot which is attached to each dicing tape to which a substantially rectangular object to be processed is attached, suction holes for the object to be processed and dicing tape which are located in the pepper pot, and An injector head that lifts the workpiece by breaking the dicing tape through a suction hole, and a nozzle that carries the lifted workpiece to a predetermined position; The die bonding apparatus according to the present invention is characterized in that the center is located on a line intersecting with the short side direction of the object and the diameter is at least three times the width of the object to be constituted by the short side direction. There are features.

The planar shape of the suction hole is rectangular, the center line of which is on the center line of the short side of the substantially rectangular workpiece, and the length of one side of the hole is equal to the length of the workpiece. Another feature is that the width is at least three times the width of the short side of the object.

[0011]

The diameter and the length of one side of the suction hole of the pepper pot are set to be at least three times the short side width of the substantially rectangular object to be processed, and the center of the suction hole is set to the substantially rectangular object to be picked up. The suction force is increased by arranging on the center line of the short side of, and the edge of the suction hole of the pepper pot matches the cutting margin of the rectangular long semiconductor chip. Accordingly, the present invention has been completed based on the finding that the impact during suction and the movement of the long semiconductor chip can be suppressed, and the injector pin can be stably pushed up.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described in detail with reference to FIGS.

As is apparent from the plan view of FIG. 1, a large number of suction holes 11 are provided in the pepper pot 10, and the diameter of the suction holes 11 is approximately three times as large as the width of the object 12 in the short direction. The center of the suction hole 11 coincides with the center of the width of the workpiece 12 occupying the widthwise direction. The workpiece 12 having a substantially rectangular planar shape has a width of 1.0 mm to 1.5 mm.
And the length is about 15 mm.

FIG. 2 shows the pepper pot 10 shown in FIG.
FIG. 4 is a partial cross-sectional view of a step of lifting by an injector pin 14.

In the process of assembling the semiconductor device, the object to be processed 12 is diced while being attached to a dicing tape 13, and is sucked together with the dicing tape 13 into a pepper pot 10.
Lifted by 4.

However, a large number of suction holes 11 having a diameter of about 1 mm are formed in the pepper pot as described above, and the dicing tape is fixed by suction. Thereafter, the injector pin 14 composed of one or a plurality of needles
1, the dicing tape 13 is broken, and the workpiece 12 is lifted from the dicing tape.

In the die bonding apparatus according to the present invention, the planar shape of the suction hole 11 is made circular or rectangular, and the shape of the suction hole 11 formed in the pepper pot 10 and the position of the workpiece to be sucked are regulated. It was thus confirmed that the adsorption force could be increased.

That is, as shown in FIG. 1, the suction hole 11 has a circular shape or a rectangular shape (rectangular shape), and its center a is positioned on a line c intersecting the short side direction b of the processing object 12. And a diameter d of which is three times or more the width of the object to be processed defined by the short side direction.

That is, the adsorption hole 11 of the pepper pot 10 is
The suction force is increased by increasing the width of the processing object 12 to three times the width occupying the widthwise direction of the processing object 12, and the resistance when the injector pin 14 breaks through the dicing tape 13 also increases, making it difficult for the processing object 12 to lift. .

Further, since the edge portion of the suction hole 11 coincides with the object to be processed 12, an impact at the time of suction due to an increase in suction force is reduced. Therefore, stable pick-up can be achieved without rolling of the workpiece 12 adhered to the dicing tape 13 or interference of adjacent semiconductor chips.

Furthermore, the diameter of the suction hole 11 and the length of the side of the rectangle are three times in the embodiment, but any three times or more can be adopted.

[0022]

According to the present invention, when the object to be processed, that is, the long semiconductor chip 12, is picked up from the semiconductor wafer, the dicing tape is lifted, or the object to be processed 12 rolls on the dicing tape and is placed next to the dicing tape. Inconvenience such as causing interference to the object to be processed 12 is eliminated, and die bonding of the long semiconductor chip 12 can be performed with a good yield.

[Brief description of the drawings]

FIG. 1 is a top view showing a main part of a die bonding apparatus according to the present invention.

FIG. 2 is a cross-sectional view of a pepper pot applied to the die bonding apparatus of FIG.

FIG. 3 is a top view of a pepper pot of a conventional die bonding apparatus.

FIG. 4 is a diagram illustrating a state where a conventional semiconductor chip is pushed up by an injector pin.

[Explanation of symbols]

 1, 12: Workpiece, 2, 10: Pepper pot, 3, 13: Dicing tape, 4, 11: Suction hole, 14: Injector pin.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/52 H01L 21/60 H01L 21/301 H01L 21/68

Claims (2)

(57) [Claims] 1. A pepper pot or a backup holder (hereinafter, referred to as a pepper pot) for adsorbing a dicing tape having a substantially rectangular workpiece attached thereto, and a workpiece and a dicing tape positioned on the pepper pot. A suction hole, an injector head that lifts the workpiece by breaking the dicing tape through the suction hole, and a nozzle that conveys the lifted workpiece to a predetermined position. The planar shape is circular, and its center is located on a line intersecting the short side direction of the object to be processed, and the diameter is at least three times the width formed by the short side of the object to be processed. Die bonding equipment 2. The planar shape of the suction hole is rectangular,
The center line is located on the center line of the short side of the substantially rectangular workpiece, and the length of one side of the hole is at least three times the width of the short side of the workpiece. Die bonding apparatus characterized by the following: