JPH0878442A - Die bonding equipment - Google Patents

Abstract

PURPOSE: To provide a new die bonding equipment which prevents the lifting-up of a dicing tape at the time of pickup of an object to be treated which is indispensable to a bonding process, reduces shock, and prevents rolling and interference of an object adjacent to a semiconductor chip to be picked up. CONSTITUTION: The diameter of a suction hole 11 of a pepper pot 10 and the length of one side are made greater than or equal to 3 times the short side width of a nearly rectangular object 12 to be treated. The centers of the suction holes 11 are arranged on the center line of the short side of the object 12 to be treated which is picked up. Hence the suction force is increased, and the edges of the suction holes 11 of the pepper pot 10 are coincided with the margin of the cutting of the object 12 to be treated. Thereby the shock and the movement of the object 12 at the time of sucking are restrained, and an injector pin is stably pushed up.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a die bonding apparatus for a long linear or substantially rectangular semiconductor chip such as a CCD linear image sensor and a printer LED.

[0002]

2. Description of the Related Art The automation of semiconductor device assembly process has made remarkable progress in recent years. In particular, the wafer test process, the dicing process, the die bonding process, the wire bonding process, and the like process the automatically transferred workpiece. The method of processing by each auto machine is adopted.
Among them, in the die bonding step, the semiconductor chip after the dicing step and the package or the lead frame are automatically conveyed to a predetermined position. Next, the adhesive is automatically dropped on the package or the lead frame, and a semiconductor chip (hereinafter referred to as a processed object) automatically picked up separately from the semiconductor wafer is attached to the dropped adhesive to be integrated. The die-bonding equipment that does this is becoming the mainstream.

In such a die bonding process, in addition to the method A in which the semiconductor chips divided from the semiconductor wafer by the breaking process and arranged in a tray or the like are adsorbed by a nozzle connected to a pressure reducing device, a synthetic resin dicing tape is used. There is also known a method B in which each semiconductor chip attached to the substrate is lifted by a needle-shaped member and then sucked by a nozzle connected to a pressure reducing device.

In order to pick up an object to be processed which is divided by the method B and has a rectangular planar shape, a large number of holes having a diameter of about 1 mm are opened on the back surface of the pepper pot and suction-fixed for each dicing tape. After that, one or more needles called injector pins break the dicing tape through the suction holes, lift the semiconductor chip from the dicing tape, and vacuum suction the transfer nozzle to carry it to a predetermined place. There is.

As shown in FIG. 3, a rectangular object 1 to be processed is provided.
FIG. 4 is a sectional view showing how the dicing tape 3 is pushed up by the injector pin 14 after fixing the semiconductor chip 1 as the object to be processed after fixing the same to the pepper pot 2.

[0006]

Among semiconductor chips such as CCD linear image sensors and LEDs for printers, the die bonding process is being automated even for objects to be processed whose length exceeds 15 mm and whose width is 1 mm or less. . However, since it is difficult to automatically pick up semiconductor chips from a semiconductor wafer, it is the current situation that semiconductor chips are rearranged and supplied to a chip tray by a manual operation.

In the pepper pot 2 in the steps shown in FIGS. 3 and 4, since the formed suction holes 4 and the workpiece 1 have the same width, the force for sucking the dicing tape 3 is the injector pin at the time of pickup. Becomes weaker than the force of breaking through the dicing tape 3. As a result, there is a problem that the object to be processed 1 is lifted up together with the dicing tape 3, and the object to be processed 1 adjacent thereto is peeled off from the dicing tape 3 or interferes with the object to be processed 1 adjacent to the object to be scratched. occured. Further, even when the suction holes 4 are larger than the object to be processed 1, if the edge thereof does not match the short-side direction, that is, the width direction of the object to be processed 1, the object to be processed 1 adjacent to the object to be processed may be impacted during adsorption and the adjacent object to be processed 1 may peel off. There was a problem of tilting and interfering with each other.

The present invention has been made in view of the above circumstances, and in particular, the lifting and impact of the dicing tape at the time of picking up an object to be processed, which is indispensable in the die bonding process, is reduced, and the object is adjacent to the object to be processed. Provided is a novel die bonding apparatus that prevents rolling and interference of objects.

[0009]

Means for Solving the Problems Pepper pots for adsorbing dicing tapes each having a substantially rectangular object to be treated attached thereto, and adsorption holes for the object to be treated and the dicing tape located in the pepper pot, An injector head for breaking the dicing tape through the suction holes and lifting the object to be processed, and a nozzle for conveying the lifted object to be processed to a predetermined position are provided. In the die bonding apparatus according to the present invention, the center is located on a line intersecting the short side direction of the object to be processed and the diameter is 3 times or more the width formed by the short side direction of the object to be processed. There are features.

Further, the suction hole has a rectangular planar shape, the center line of which is on the center line of the short side of the substantially rectangular object to be processed, and the length of one side of the hole is the object to be processed. Another feature is that the width is three times or more the width of the short side of the object.

[0011]

The diameter and the length of one side of the adsorption hole of the pepper pot are set to be at least three times the width of the short side of the substantially rectangular object to be treated, and the center of the adsorption hole is further picked up to the approximately rectangular object. By arranging on the center line of the short side, the suction force is increased and the edge of the suction hole of the pepper pot coincides with the cutting margin of the rectangular long semiconductor chip. Along with this, the present invention has been completed based on the finding that the impact at the time of adsorption and the movement of the long semiconductor chip can be suppressed and the injector pin can be stably pushed up.

[0012]

Embodiments of the present invention will be described in detail with reference to FIGS.

As is apparent from the plan view of FIG. 1, the pepper pot 10 is provided with a large number of suction holes 11, the diameter of which is approximately three times the width of the object 12 to be processed in the lateral direction. Thus, the center of the suction hole 11 and the center of the width of the object 12 to be processed in the lateral direction coincide with each other. Further, the workpiece 12 having a substantially rectangular plane has a width of 1.0 mm to 1.5 mm.
The length is about 15 mm.

FIG. 2 shows the pepper pot 10 shown in FIG.
It is a partial cross section figure of the process of lifting with the injector pin 14.

In the process of assembling a semiconductor element, the object 12 to be processed is attached to the dicing tape 13 and is diced, and the dicing tape 13 is adsorbed to the pepper pot 10 and then the injector pin 1 is used.
Lifted by 4.

However, as described above, a large number of suction holes 11 having a diameter of about 1 mm are formed in the pepper pot, and the dicing tape is fixed by suction. After that, the injector pin 14 composed of one to a plurality of needles is attached to the suction hole 1.
The dicing tape 13 is broken through 1 and the object 12 to be processed is lifted from the dicing tape, further vacuum sucked by a transfer nozzle (not shown), and conveyed to a predetermined place.

In the die bonding apparatus according to the present invention, the planar shape of the suction hole 11 is circular or rectangular, and the shape of the suction hole 11 formed in the pepper pot 10 and the position of the workpiece to be sucked are regulated. Thus, it was confirmed that the adsorption power can be increased.

That is, as shown in FIG. 1, the suction hole 11 has a plane shape of a circle or a rectangle (rectangle), and its center a is located on a line c intersecting the short side direction b of the object to be treated 12. A die bonding apparatus in which the diameter d is three times or more of the width formed by the short side direction of the object to be processed.

That is, the suction holes 11 of the pepper pot 10 are
The suction force is increased by increasing the width of the object 12 to be three times the width in the lateral direction, and the resistance force when the injector pin 14 breaks through the dicing tape 13 is also increased, so that the object 12 is difficult to lift. .

Further, since the edge portion of the suction hole 11 coincides with the object 12 to be treated, the shock at the time of suction due to the increase in suction force is also reduced. Therefore, the object 12 to be processed stuck to the dicing tape 13 can be stably picked up without rolling or interference between adjacent semiconductor chips.

Further, the diameter of the suction hole 11 and the length of the side of the rectangle are tripled in the embodiment, but any length of 3 times or more can be adopted.

[0022]

According to the present invention, even when the object to be processed, that is, the long semiconductor chip 12, is picked up from the semiconductor wafer, the dicing tape is lifted up or the object 12 is rolled on the dicing tape to be adjacent to the object. Inconvenience such as causing interference with the object to be processed 12 is eliminated, and die bonding of the long semiconductor chip 12 is possible with a good yield.

[Brief description of drawings]

FIG. 1 is a top view showing a main part of a die bonding apparatus according to the present invention.

FIG. 2 is a sectional view of a pepper pot applied to the die bonding apparatus of FIG.

FIG. 3 is a top view of a pepper pot of a conventional die bonding apparatus.

FIG. 4 is a diagram showing a state in which a conventional semiconductor chip is pushed up by an injector pin.

[Explanation of symbols]

 1, 12: Object to be treated, 2, 10: Pepper pot, 3, 13: Dicing tape, 4, 11: Adsorption hole, 14: Injector turpin.

Claims (2)

[Claims] 1. A pepper pot or a backup holder (hereinafter referred to as a pepper pot) for adsorbing a dicing tape to which a substantially rectangular object is attached, and the object and the dicing tape located in the pepper pot. Of the suction holes, an injector head for breaking the dicing tape through the suction holes to lift the object to be processed, and a nozzle for conveying the lifted object to the predetermined position. The planar shape is circular, the center is located on a line intersecting the short side direction of the object to be processed, and the diameter is three times or more of the width formed by the short side of the object to be processed. Die bonding machine 2. The planar shape of the suction hole is rectangular,
The center line is located on the center line of the short side of the substantially rectangular object to be processed, and the length of one side of the hole is three times or more the width forming the short side direction of the object to be processed. A die bonding apparatus characterized in that