JPS5753946A - Collet for die bonding - Google Patents

Collet for die bonding

Info

Publication number
JPS5753946A
JPS5753946A JP12793180A JP12793180A JPS5753946A JP S5753946 A JPS5753946 A JP S5753946A JP 12793180 A JP12793180 A JP 12793180A JP 12793180 A JP12793180 A JP 12793180A JP S5753946 A JPS5753946 A JP S5753946A
Authority
JP
Japan
Prior art keywords
collet
pellet
inferiority
chipping
die bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12793180A
Other languages
Japanese (ja)
Inventor
Yutaka Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12793180A priority Critical patent/JPS5753946A/en
Publication of JPS5753946A publication Critical patent/JPS5753946A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Abstract

PURPOSE:To prevent generation of inferiority because of chipping off of edge of pellet, etc., and to enhance yield and workability of the pellet by a method wherein an elastic layer formed in a plane is coated on the pellet drawing part of a collet, and a positioning means is provided on the collet. CONSTITUTION:The tip end of the collet 11 being provided at the center with a penetrating hole 7 to be connected to a vacuum pump is made as flat, and a resin layer of Teflon, etc., for example, having elasticity is applied thereon and is formed to provide the drawing part 9. The positioning means being movalbe upward and downward against the collet 11 and being consisted of an outside frame 10 having taper at the inside of the lower end can be provided in this collet 11. For example, when die bonding of pellet on a mounting pedestal having protective walls 12 is to be performed, the pellet is made to be adhered by guiding the outside circumference of the protective walls 12 with the taper faces of the outside frame 10 of the collet 11 drawing the pellet 4. Accordingly chipping off of edge or inferiority of mounting can be prevented, and precise bonding can be peformed having high efficiency.
JP12793180A 1980-09-17 1980-09-17 Collet for die bonding Pending JPS5753946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12793180A JPS5753946A (en) 1980-09-17 1980-09-17 Collet for die bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12793180A JPS5753946A (en) 1980-09-17 1980-09-17 Collet for die bonding

Publications (1)

Publication Number Publication Date
JPS5753946A true JPS5753946A (en) 1982-03-31

Family

ID=14972171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12793180A Pending JPS5753946A (en) 1980-09-17 1980-09-17 Collet for die bonding

Country Status (1)

Country Link
JP (1) JPS5753946A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149632U (en) * 1983-03-26 1984-10-06 富士通株式会社 Collection
JPS6167931A (en) * 1984-09-11 1986-04-08 Rohm Co Ltd Chucking device for die-bonding semiconductor pellet
JPH11163004A (en) * 1997-11-28 1999-06-18 Tosok Corp Collet for die bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149632U (en) * 1983-03-26 1984-10-06 富士通株式会社 Collection
JPS6167931A (en) * 1984-09-11 1986-04-08 Rohm Co Ltd Chucking device for die-bonding semiconductor pellet
JPH11163004A (en) * 1997-11-28 1999-06-18 Tosok Corp Collet for die bonding device

Similar Documents

Publication Publication Date Title
JPS56160034A (en) Impurity diffusion
EP0218873A3 (en) Film peeling apparatus
JPS5753946A (en) Collet for die bonding
JPS5740965A (en) Hybrid integrated circuit device
JPS53144265A (en) Etching device
JPS5745929A (en) Grinding method for semiconductor wafer
JPS53141369A (en) Treatment of article with thermosetting resin
JPS53111594A (en) Method of mounting workpiece on holder
JPS54148379A (en) Plating method of base ribbon for semiconductor device
JPS57120672A (en) Plasma etching method
JPS6473739A (en) Table for wafer mounting
JPS5448879A (en) Production of copper foil laminate
JPS5398374A (en) Bonding of plated resin article
JPS53139468A (en) Mounting structure of resin mold semiconductor device
JPS6484646A (en) Manufacture of semiconductor package
JPS571250A (en) Equipping structure of outside lead
JPS5329579B2 (en)
JPS6430302A (en) Flat antenna
JPS57138146A (en) Attaching method for pellet
JPS57114245A (en) Assembling of semiconductor device
JPS54102670A (en) Vacuum chucking device
JPS5776874A (en) Semiconductor element
JPS54104289A (en) Detachment of printed-substrate mounted parts
JPS57211776A (en) Manufacture of compound semiconductor device
JPS57111050A (en) Semiconductor device