JPS52156551A - Semiconductor wafer breaking method - Google Patents
Semiconductor wafer breaking methodInfo
- Publication number
- JPS52156551A JPS52156551A JP7414576A JP7414576A JPS52156551A JP S52156551 A JPS52156551 A JP S52156551A JP 7414576 A JP7414576 A JP 7414576A JP 7414576 A JP7414576 A JP 7414576A JP S52156551 A JPS52156551 A JP S52156551A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wafer
- breaking method
- cracking
- wafer breaking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To evade the rupture of wafers by beforehand providing space fillers on the outside of opposing faces in placing a semiconductor wafer provided on its surface with a scribe along scribing lines, with its back lining paper being faced upward, on a plate body by way of backing paper and cracking the wafer to pellets by pressing the wafer with a cracking roll from the top side of the lining paper.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7414576A JPS52156551A (en) | 1976-06-23 | 1976-06-23 | Semiconductor wafer breaking method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7414576A JPS52156551A (en) | 1976-06-23 | 1976-06-23 | Semiconductor wafer breaking method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52156551A true JPS52156551A (en) | 1977-12-27 |
Family
ID=13538700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7414576A Pending JPS52156551A (en) | 1976-06-23 | 1976-06-23 | Semiconductor wafer breaking method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52156551A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53153859U (en) * | 1977-05-10 | 1978-12-04 | ||
JP2011046045A (en) * | 2009-08-26 | 2011-03-10 | Mitsubishi Materials Corp | Apparatus and method for manufacturing divided body |
CN103811422A (en) * | 2014-02-25 | 2014-05-21 | 福建安特微电子有限公司 | Cmos silicon wafer lobe processing device and processing method thereof |
-
1976
- 1976-06-23 JP JP7414576A patent/JPS52156551A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53153859U (en) * | 1977-05-10 | 1978-12-04 | ||
JP2011046045A (en) * | 2009-08-26 | 2011-03-10 | Mitsubishi Materials Corp | Apparatus and method for manufacturing divided body |
CN103811422A (en) * | 2014-02-25 | 2014-05-21 | 福建安特微电子有限公司 | Cmos silicon wafer lobe processing device and processing method thereof |
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