JPS52156551A - Semiconductor wafer breaking method - Google Patents

Semiconductor wafer breaking method

Info

Publication number
JPS52156551A
JPS52156551A JP7414576A JP7414576A JPS52156551A JP S52156551 A JPS52156551 A JP S52156551A JP 7414576 A JP7414576 A JP 7414576A JP 7414576 A JP7414576 A JP 7414576A JP S52156551 A JPS52156551 A JP S52156551A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
wafer
breaking method
cracking
wafer breaking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7414576A
Other languages
Japanese (ja)
Inventor
Mitsuo Kobayashi
Mitsugi Kusaka
Masashi Yoneyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7414576A priority Critical patent/JPS52156551A/en
Publication of JPS52156551A publication Critical patent/JPS52156551A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To evade the rupture of wafers by beforehand providing space fillers on the outside of opposing faces in placing a semiconductor wafer provided on its surface with a scribe along scribing lines, with its back lining paper being faced upward, on a plate body by way of backing paper and cracking the wafer to pellets by pressing the wafer with a cracking roll from the top side of the lining paper.
COPYRIGHT: (C)1977,JPO&Japio
JP7414576A 1976-06-23 1976-06-23 Semiconductor wafer breaking method Pending JPS52156551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7414576A JPS52156551A (en) 1976-06-23 1976-06-23 Semiconductor wafer breaking method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7414576A JPS52156551A (en) 1976-06-23 1976-06-23 Semiconductor wafer breaking method

Publications (1)

Publication Number Publication Date
JPS52156551A true JPS52156551A (en) 1977-12-27

Family

ID=13538700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7414576A Pending JPS52156551A (en) 1976-06-23 1976-06-23 Semiconductor wafer breaking method

Country Status (1)

Country Link
JP (1) JPS52156551A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53153859U (en) * 1977-05-10 1978-12-04
JP2011046045A (en) * 2009-08-26 2011-03-10 Mitsubishi Materials Corp Apparatus and method for manufacturing divided body
CN103811422A (en) * 2014-02-25 2014-05-21 福建安特微电子有限公司 Cmos silicon wafer lobe processing device and processing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53153859U (en) * 1977-05-10 1978-12-04
JP2011046045A (en) * 2009-08-26 2011-03-10 Mitsubishi Materials Corp Apparatus and method for manufacturing divided body
CN103811422A (en) * 2014-02-25 2014-05-21 福建安特微电子有限公司 Cmos silicon wafer lobe processing device and processing method thereof

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