JP2011204868A - Method of transferring semiconductor chip and semiconductor device manufacturing apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve bonding strength and provide stable bonding force between a semiconductor chip and a sheet for loading the semiconductor chip without consideration on chip size.SOLUTION: A part of loading area of a semiconductor chip 51 in an adhesive sheet material 44 that is held in the peripheral edge with a flat ring 42 in the moving side to have elasticity is pushed up with a pushing pin 27 from the lower side thereof. Thereafter, the semiconductor chip 51 is brought into contact on the top surface of the loading area where a part of the sheet material 44 is pushed up. Subsequently, the semiconductor chip 51 is held on the chip loading area 44a of the sheet material 44 by simultaneously moving downward the loaded semiconductor chip 51 and the upper surface of pushing pin 27.

Description

  The present invention relates to a semiconductor chip transfer method and a semiconductor manufacturing apparatus using the same, and in particular, a transfer of transferring a semiconductor chip separated from a semiconductor wafer and held on a flat ring sheet or the like to another flat ring sheet. The present invention relates to a method and a semiconductor manufacturing apparatus using the method.

  In recent years, semiconductor wafers have become mainstream from a wafer size of 12.7 cm (5 inches) to 20.32 cm (8 inches) to a wafer size of 30.5 cm (12 inches) in the trend of increasing the diameter. It is changing. In response to such a change in wafer size, in the subsequent process of the manufacturing process, an assembly apparatus capable of handling a semiconductor wafer having a wafer size of 30.5 cm was introduced, and the semiconductor wafer having a size of 30.5 cm was separated into pieces. An increasing number of processes are required for transferring the semiconductor chip to a flat ring size sheet.

  In the manufacturing process of a semiconductor device, a semiconductor chip is cut out from a semiconductor wafer divided into a large number of pieces. The semiconductor chip is cut out with the semiconductor wafer attached to the adhesive sheet. The cut-out semiconductor chip is peeled off from the sheet, and the whole sheet, non-defective product or defective product is held on the other sheet held by the flat ring. A transfer chip mount for selecting and transferring and arranging is selected.

JP 2007-200767 A

  FIG. 6A to FIG. 6D schematically show a cross section and a bottom surface of a main part of a chip mounting apparatus for transferring (mounting) a chip on a conventional flat ring sheet in the order of steps.

  First, as shown in FIG. 6A, the semiconductor chip 2 adsorbed by the chip pressing nozzle 1 is brought close to the upper surface of the sheet 4 attached to the flat ring 3 on the transfer side.

  Furthermore, as shown in FIG. 6B, the sucked semiconductor chip 2 is pressed against the upper surface of the sheet 4 and placed at a predetermined position on the sheet 4. At this time, as shown in the bottom view of FIG. 6B, the semiconductor chip 2 is bonded at the bonding region 4 a on the upper surface of the sheet 4. At this time, air is entrained between the back surface of the semiconductor chip 2 and the surface of the sheet 4, and relatively large bubbles 7 are formed between the back surface of the semiconductor chip 2 and the surface of the sheet 4.

  Next, when the semiconductor chip 2 placed by the chip pressing nozzle 1 is further pressed as shown in FIG. 6 (c), the back surface of the semiconductor chip 2 and the sheet 4 are shown in the bottom view of FIG. 6 (c). The adhesion force increases at the adhesion region 4a between the surface and the large bubble 7 is compressed into a small bubble 7a, but the bubble 7a remains.

  As a result, as shown in FIG. 6 (d), when the semiconductor chip 2 is transferred onto the sheet 4 attached to the flat ring 3, almost all between the back surface of the semiconductor chip 2 and the surface of the sheet 4. There is a problem in that air entrainment occurs in the semiconductor chip 2 and bubbles 7a remain.

  Thus, even if the bubble 7a generated when transferring to the sheet 4 is small, a portion that is not bonded remains between the back surface of the semiconductor chip 2 and the front surface of the sheet 4, so that the semiconductor chip The adhesive force of 2 decreases and the adhesive force varies. When the decrease and variation in the adhesive force occur, the semiconductor chip 2 is detached from the sheet 4 during transportation and transportation of the flat ring 3, or when the semiconductor chips 2 are picked up from the sheet 4 due to the variation in adhesive force, The height of each semiconductor chip 2 varies. Due to such a pickup error, there is a limit in improving the quality of the semiconductor device.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to improve the adhesive strength between a semiconductor chip and a sheet on which the semiconductor chip is placed and stabilize the adhesive force regardless of the chip size.

  In order to achieve the above-mentioned object, the present invention pushes up a part of the mounting area of the semiconductor chip on the sheet material from below, before the semiconductor chip is mounted on the sheet material. Thus, a part of the placement area is protruded upward.

  Specifically, in the method for transferring a semiconductor chip according to the present invention, the mounting region is placed on the mounting region by a chip adhesion promoting member from the lower side of the mounting region of the semiconductor chip in the sheet material having a peripheral edge held and having elasticity and adhesiveness. A step (a) of pushing up a part, a step (b) of bringing a semiconductor chip into contact with the top surface of the mounting region where a part of the sheet material is pushed up after the step (a), and a step (b) ), The semiconductor chip and the upper surface of the chip adhesion promoting member are simultaneously lowered to hold the semiconductor chip on the sheet material placement region (c).

  According to the semiconductor chip transfer method of the present invention, a part of the mounting area is pushed up by the chip adhesion promoting member from the lower side of the semiconductor chip mounting area in the sheet material having a peripheral edge held and having elasticity and adhesiveness. A semiconductor chip is brought into contact with the top surface of the mounting area where a part of the sheet material is pushed up. Thereafter, the semiconductor chip that is in contact with the upper surface of the chip adhesion promoting member is simultaneously lowered to hold the semiconductor chip on the sheet material placement region. For this reason, when lowering the placed semiconductor chip and the upper surface of the chip adhesion promoting member at the same time, the adhesion area between the lower surface of the semiconductor chip and the sheet material gradually increases, and the lower surface of the semiconductor chip and the sheet material Can expel the air between. That is, since air bubbles between the semiconductor chip and the sheet material can be removed, there is no unbonded portion between the semiconductor chip and the sheet material, so that the bonding strength of the semiconductor chip to the sheet material is improved and bonded. The power can be stabilized.

  In the semiconductor chip transfer method of the present invention, in step (a), the chip adhesion promoting member may be in contact with the central portion of the semiconductor chip mounting region on the lower surface of the sheet material.

  In the semiconductor chip transfer method of the present invention, in step (a), the chip adhesion promoting member may be in contact with a part of the end portion of the semiconductor chip mounting region on the lower surface of the sheet material.

  In the semiconductor chip transfer method of the present invention, the chip adhesion promoting member may be a push-up pin whose contact area with the sheet material is smaller than the lower surface of the semiconductor chip.

  In the semiconductor chip transfer method of the present invention, the chip adhesion promoting member may be made of a flexible elastic body.

  The semiconductor manufacturing apparatus of the present invention has a chip pressing nozzle that can move at least in the vertical direction with the upper surface of the semiconductor chip adsorbed, a semiconductor chip mounting area on the upper surface, and a peripheral portion that is held and detachable. A provided sheet material having elasticity and adhesiveness, and a chip adhesion promoting portion that is provided so as to be movable at least in the vertical direction below the sheet material and has a contact portion that contacts a part of the lower surface of the sheet material on the upper end surface; The chip adhesion promoting part is brought into contact with the lower surface of the sheet material before the semiconductor chip is placed on the upper surface of the sheet material by the chip pressing nozzle, and the sheet material is deformed into a convex shape or a mountain shape in cross section. The chip pressing nozzle makes the semiconductor chip contact on the part where the sheet material is deformed, and the upper surface of the contact portion in the chip adhesion promoting portion is at the descending speed of the chip pressing nozzle. Descends Te Align.

  According to the semiconductor manufacturing apparatus of the present invention, the chip adhesion promoting portion has a cross-sectional convex shape in contact with the lower surface of the sheet material before the semiconductor chip is placed on the upper surface of the sheet material by the chip pressing nozzle. Or it deform | transforms into a cross-sectional mountain shape, a chip | tip press nozzle makes a semiconductor chip contact on the part which the sheet | seat material deform | transformed, and the upper surface of a chip | tip adhesion promotion part descend | falls according to the descending speed of a chip | tip press nozzle. For this reason, when the upper surface of the chip adhesion promoting portion descends at the same speed as the semiconductor chip, the adhesion area between the lower surface of the semiconductor chip and the sheet material gradually increases. At this time, air bubbles between the semiconductor chip and the sheet material are removed, and there is no unbonded portion between the semiconductor chip and the sheet material. Can be stabilized.

  In the semiconductor manufacturing apparatus of the present invention, the chip adhesion promoting portion may be provided so as to be able to be aligned with the placement area of the semiconductor chip in the sheet material.

  In the semiconductor manufacturing apparatus of the present invention, the contact portion of the chip adhesion promoting portion may be in contact with the central portion of the semiconductor chip mounting region on the lower surface of the sheet material.

  In the semiconductor manufacturing apparatus of the present invention, the contact portion of the chip adhesion promoting portion may contact a part of the end portion of the semiconductor chip mounting region on the lower surface of the sheet material.

  In these cases, the contact portion of the chip adhesion promoting portion that deforms the sheet material into a convex cross section may be a push-up pin having a smaller contact area than the lower surface of the semiconductor chip.

  In these cases, the contact portion of the chip adhesion promoting portion that deforms the sheet material into a cross-sectional mountain shape may be made of an elastic body having flexibility.

  The semiconductor manufacturing apparatus of the present invention may further include a sorting unit that sorts the semiconductor chip when the chip pressing nozzle sucks the semiconductor chip.

  According to the semiconductor chip transfer method and the semiconductor manufacturing apparatus using the same according to the present invention, it is possible to improve the adhesive strength between the semiconductor chip and the sheet on which the semiconductor chip is placed and to stabilize the adhesive force. For this reason, it is possible to prevent the semiconductor chip from dropping from the sheet material when the semiconductor chip is placed and the sheet material held by, for example, the flat ring is conveyed. Furthermore, when the semiconductor chip is picked up (pick up) from the sheet material, the adhesive force is stabilized, so that there is no variation in the height of the semiconductor chip after picking up, so that pick-up mistakes can be prevented.

1 is a schematic cross-sectional view showing a semiconductor manufacturing apparatus according to a first embodiment of the present invention. (A)-(e) shows the principal part of the chip transfer method using the semiconductor manufacturing apparatus which concerns on the 1st Embodiment of this invention in order of a process, Each left figure is sectional drawing, Each right figure is a bottom face FIG. It is sectional drawing of one process of the principal part which shows the chip transfer method using the semiconductor manufacturing apparatus concerning the 1st Embodiment of this invention. (A)-(e) shows the principal part of the chip transfer method using the semiconductor manufacturing apparatus based on the 2nd Embodiment of this invention in order of a process, Each left figure is sectional drawing, Each right figure is a bottom face FIG. (A)-(e) shows the principal part of the chip transfer method using the semiconductor manufacturing apparatus concerning the modification of the 2nd Embodiment of this invention in order of a process, Each left figure is sectional drawing, The right figure is a bottom view. (A)-(d) shows the principal part of the chip mounting method using the conventional chip mounting apparatus in order of a process, each left figure is sectional drawing, and each right figure is a bottom view.

(First embodiment)
A semiconductor manufacturing apparatus according to a first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the chip transfer apparatus which is a semiconductor manufacturing apparatus according to the first embodiment of the present invention includes a chip supply system 10, a chip transfer system 20, and a chip transport system 30.

  In the chip supply system 10, a sheet material 43 made of an elastic body whose peripheral portion is held by the supply-side flat ring 41 is carried. A plurality of semiconductor chips 51 in which a semiconductor wafer is divided into solid pieces by dicing or the like are bonded to the upper surface of the sheet material 43 carried together with the supply side flat ring 41. One semiconductor chip 51 among the plurality of semiconductor chips 51 bonded to the upper surface of the sheet material 43 is peeled off by suction by the chip pressing nozzle 34 of the chip transport system 30. Thereafter, the peeled semiconductor chip 51 is transported above the chip transfer system 20 by the chip transport system 30, and is formed on the upper surface of the sheet material 44 made of an elastic body whose peripheral edge is held by the transfer-side flat ring 42. Transferred and arranged.

  Specifically, the chip supply system 10 includes a supply side XY table 11, a supply side bracket 12 provided on the supply side XY table 11, and a supply side provided at the upper end of the supply side bracket 12. And a holding table 13. On the supply side holding table 13, a supply side flat ring 41 having an adhesive sheet material 43 attached to the upper surface thereof is detachably supported. When the supply-side flat ring 41 is carried into the chip supply system 10, a plurality of semiconductor chips 51 are bonded and held on the upper surface of the sheet material 43.

  The chip transfer system 20 includes a transfer side XY table 21, a transfer side bracket 22 provided on one end of the transfer side XY table 21, and an upper end portion of the transfer side bracket 22. And a transfer-side holding table 23 provided. On the transfer side holding table 23, a transfer side flat ring 42 having an adhesive sheet material 44 attached on the upper surface thereof is detachably supported. Furthermore, the chip transfer system 20 according to the present embodiment includes a chip adhesion promoting XY table 24 placed on the other end of the transfer side XY table 21, and the chip adhesion promoting XY table 24. A chip adhesion promoting lift unit 25 provided on the top, and an arm provided on the side surface on the transfer side bracket 22 side of the chip adhesion promotion lift unit 25 so as to be movable up and down and extending parallel to the table surface on the transfer side bracket 22 side. And a chip-adhesion promoting portion 26 having a shape. The chip adhesion promoting portion 26 has an arm-shaped tip portion bent vertically and upward with respect to the table surface, and the bent upper end surface is made of, for example, a hard metal pin such as cemented carbide or a flexibility such as rubber. A push-up pin 27 made of an elastic body is provided. The push-up pin 27 provided in the chip adhesion promoting part 26 of the chip adhesion promoting lifting part 25 is located below the sheet material 44 held by the transfer side flat ring 42, and an arbitrary position on the lower surface of the sheet material 44. Is movable.

  Therefore, the chip transfer apparatus according to the present embodiment can push up the sheet material 44 in the chip transfer system 20 from below, and the semiconductor chip 51 can be placed at an arbitrary position of the sheet material 44 as described later. It can be placed and bonded without leaving bubbles.

  The chip transport system 30 includes a moving table 31, a chip pressing lift unit 32 provided on the moving table 31, a chip pressing unit 33 provided in the chip pressing lift unit 32, and a lower end portion of the chip pressing unit 33. And a chip pressing nozzle 34 that can hold the semiconductor chip 51 by vacuum suction.

  Below, the outline | summary of operation | movement of the chip transfer apparatus which concerns on this embodiment is demonstrated.

  First, in the chip supply system 10, the supply-side flat ring 41 having the sheet material 43 on which the plurality of semiconductor chips 51 are placed is moved in the horizontal direction (direction parallel to the table surface) by the supply-side XY table 11. Then, one semiconductor chip 51 is stopped at a position where it can be picked up by the suction of the chip pressing nozzle 34 and waits.

  Next, in the chip transport system 30, the chip pressing nozzle 34 is moved in the horizontal direction to the pickup position by the moving table 31. Subsequently, the chip pressing unit 33 lowers the chip pressing unit 33 and the chip pressing nozzle 34 to the desired upper surface of the semiconductor chip 51 by the chip pressing elevating unit 32, and sucks and holds the semiconductor chip 51 by the chip pressing nozzle 34. Subsequently, the chip pressing part 33, the chip pressing nozzle 34, and the semiconductor chip 51 are raised to a predetermined height by the chip pressing lifting part 32. Subsequently, the sucked semiconductor chip 51 is horizontally moved by the moving table 31 above the placement position of the sheet material 44 in the chip transfer system 20.

  Next, in the chip transfer system 20, the transfer side flat ring 42 to which the sheet material 44 is attached is moved in the horizontal direction by the transfer side XY table 21 together with the transfer side holding table 23 and the transfer side bracket 22. And wait. Here, the placement positions of the respective semiconductor chips 51 on the sheet material 44 have a predetermined layout, and the chip transfer device holds the transfer arrangement data.

  Next, the push-up pin 27 of the chip adhesion promoting portion 26 provided on the lower side of the sheet material 44 is raised by the chip adhesion promotion lifting / lowering portion 25, and a part of the lower surface of the sheet material 44 is raised by the raised push-up pin 27. And a part of the sheet material 44 is deformed. The deformed shape of the sheet material 44 at this time is preferably a convex curved surface shape or an angled curved surface shape. In addition, the position of the apex of the deformed sheet material 44 is a part of an end portion excluding the central portion of the bonding region or the central portion of the semiconductor chip 51 on the lower surface of the semiconductor chip 51.

  Next, the semiconductor chip 51 that is horizontally moved by the moving table 31 to above the position on the sheet material 44 in the chip transfer system 20 and attracted by the chip pressing nozzle 34 is lowered by the chip pressing lifting unit 32. As a result, the central portion or part of the end portion of the lower surface of the semiconductor chip 51 is bonded to the curved top surface of the sheet material 44.

  Subsequently, by lowering the chip pressing elevating part 32 and the chip pressing part 33, the semiconductor chip 51 held by suction on the chip pressing nozzle 34 is formed on the sheet material 44 of the chip transfer system 20 by the push-up pins 27. The curved top surface is pressed. The curved surface shape of the sheet material 44 is brought close to a flat shape while the push-up pin 27 is lowered by the chip adhesion promotion elevating unit 25 following (synchronizing) with the mounting operation (chip mount lowering operation) of the semiconductor chip 51. At this time, the sheet material 44 may be further bent downward beyond the flat shape. Thereafter, the tip pressing portion 33 and the tip pressing nozzle 34 are raised by the tip pressing lift 32 and returned to a predetermined position. Thereafter, the moving table 31 moves horizontally to the pickup position in the chip supply system 10 to complete one cycle of transfer of the semiconductor chip 51.

  By repeating the above one cycle as many times as the number of semiconductor chips 51 carried into the supply system 10, a predetermined number of semiconductor chips 51 can be transferred.

  The semiconductor chips 51 on the sheet material 43 of the chip supply system 10 are mixed with non-defective chips and defective chips. Accordingly, although not shown in the chip transport system 10, when the chip pressing nozzle 34 sucks the semiconductor chip 51, a non-defective chip or a defective chip is selected, or a plurality of semiconductors on the sheet material 43 are selected. A sorting unit for selecting all of the chips 51 is provided.

(Transfer method of the first embodiment)
The details of the method for transferring the semiconductor chip 51 according to the first embodiment using the chip adhesion promoting portion 26 and the push-up pin 27 in the chip transfer system 20 will be described below with reference to FIGS. This will be described with reference to FIG. 2 and FIG. 3 each show a schematic cross section, and each right drawing schematically shows the bottom surface of the transfer side flat ring 42 and the sheet material 44.

  First, as shown in FIG. 2A, a chip for adsorbing and holding a semiconductor chip 51 above the sheet material 44 whose peripheral portion is held by the transfer-side flat ring 42 of the chip transfer system 20. The pressing nozzle 34 is waiting. Further, below the sheet material 44, the push-up pin 27, which is a chip adhesion promoting member provided on the upper end surface of the chip adhesion promoting portion 26, is adjusted to a position facing the central portion of the chip placement region 44 a in the sheet material 44. And starts to rise toward the sheet material 44. Accordingly, there is no change in the sheet material 44 in this step.

  Next, as shown in FIG. 2B, the push-up pin 27 is raised and the upper surface of the push-up pin 27 is brought into contact with the lower surface of the sheet material 44. Furthermore, the lower surface of the sheet material 44 is pushed up by the push-up pin 27, and a part of the chip mounting area 44a in the sheet material 44 is deformed into a curved surface shape having a convex cross section, and waits. Thereafter, the chip pressing nozzle 34 adsorbing the semiconductor chip 51 is lowered. Accordingly, also in this step, the semiconductor chip 51 is not bonded to the chip placement region 44 a of the sheet material 44. In the first embodiment, for example, general vinyl chloride or polyolefin is used for the sheet material 44, and depending on the tension at the time of applying the sheet material to the transfer side flat ring 42, the sheet The lower surface of the material 44 is deformed so as to follow the upper side surface of the push-up pin 27.

  Next, as shown in FIG. 2C, the semiconductor chip 51 is lowered toward the apex of the curved surface formed on the sheet material 44 in a state where the push-up pin 27 is in a standby state. The lower surface is pressed against the curved top surface of the sheet material 44. Accordingly, an adhesive region 51a where only the central portion of the lower surface of the semiconductor chip 51 is bonded is formed at the center of the chip placement region 44a in the sheet material 44, and the bonding area between the sheet material 44 and the semiconductor chip 51 is small.

  Next, as shown in FIG. 2D, the semiconductor chip 51 is further lowered while being pressed against the top surface of the curved surface of the sheet material 44, and the push-up pin 27 is lowered as the semiconductor chip 51 is lowered. Thereby, the curved surface shape formed by the push-up pins 27 on the sheet material 44 gradually returns to a flat cross-sectional shape. Accordingly, the bonding area of the bonding region 51a of the semiconductor chip 51 on the sheet material 44 is also gradually increased. Furthermore, it can be seen that when the bonding area of the bonding region 51a gradually increases, the air between the upper surface of the sheet material 44 and the lower surface of the semiconductor chip 51 is expelled to the outside.

  Next, as shown in FIG. 2 (e), the tip pressing nozzle 34 stops its descent when the sheet material 44 becomes flat and stops its suction operation. On the other hand, the push-up pin 27 is separated from the sheet material 44 in the middle of lowering, and the deformation of the sheet material 44 is stopped at that time. As a result, the bonding area of the bonding region 51 a is substantially the same as the area of the lower surface of the semiconductor chip 51. That is, according to the present embodiment, since the air between the semiconductor chip 51 and the sheet material 44 is surely expelled, it is possible to improve and stabilize the adhesion force of the semiconductor chip 51 to the sheet material 44. Therefore, it is possible to prevent the semiconductor chip 51 from dropping from the sheet material 44 when the sheet material 44 held by the transfer-side flat ring 42 on which the semiconductor chip 51 is placed is conveyed. Further, when the semiconductor chip 51 is picked up from the sheet material 44, the height of the semiconductor chip 51 after pick-up is stabilized by stabilizing the adhesive force, so that pick-up mistakes and the like can be prevented.

  In the step shown in FIG. 2E, the chip pressing nozzle 34 does not stop the descent when the sheet material 44 becomes flat, but until the sheet material 44 bends further downward beyond the flat shape. The chip pressing nozzle 34 may be lowered.

  Next, as shown in FIG. 3, the chip pressing nozzle 34 is raised and returned to its original position. At this time, the semiconductor chip 51 has already been bonded to the upper surface of the sheet material 44. Further, the push-up pin 27 has been lowered. The bottom view here is the same as the process shown in FIG. 2 (e), and the semiconductor chip 51 and the sheet material 44 are bonded together without leaving bubbles, and the chip mounting is completed.

  As described above, according to the semiconductor chip transfer method according to the first embodiment, the chip adhesion promoting portion 26 from the lower side of the chip placement region 44 a in the sheet material 44 held by the transfer side flat ring 42. A part of the chip mounting region 44 a is pushed up by the push-up pin 27 provided on the upper surface of the sheet material to form a curved surface shape having a convex cross section in a part of the sheet material 44. Thereafter, the semiconductor chip 51 is bonded onto the curved top surface of the sheet material 44, and the semiconductor chip 51 is mounted on the sheet material 44 while the bonded semiconductor chip 51 and the chip adhesion promoting portion 26 are simultaneously lowered. It is held on the placement area 44a.

  Therefore, when the semiconductor chip 51 placed on the sheet material 44 and the chip adhesion promoting portion 26 are simultaneously lowered, the adhesion area between the lower surface of the semiconductor chip 51 and the sheet material 44 gradually increases. The air between the lower surface of the semiconductor chip 51 and the sheet material 44 can be expelled from the bonding surface. As a result, there is no portion that is not bonded between the semiconductor chip 51 and the sheet material 44, so that it is possible to improve the bonding strength of the semiconductor chip 51 to the sheet material 44 and stabilize the bonding force.

  The contact position of the tip placement area 44a of the push-up pin 27 is not limited to the center of the chip placement area 44a, and is not particularly limited as long as it is within the area of the chip placement area 44a.

(Second Embodiment)
A semiconductor manufacturing apparatus and a chip transfer method using the same according to the second embodiment of the present invention will be described below with reference to FIGS. 4 (a) to 4 (e).

  As shown in FIG. 4A, the semiconductor manufacturing apparatus according to the second embodiment pushes up a chip adhesion promoting member (contact part) provided on the upper end surface of the chip adhesion promoting part 26 in the chip transfer system 20. Instead, for example, the elastic body 28 is rubbery and flexible and has a semispherical cross section. Here, for the elastic body 28, for example, synthetic rubber or natural rubber can be used.

  Next, a chip transfer method according to the second embodiment will be described with reference to FIG.

  First, as shown in FIG. 4A, in the chip transfer system 20, the chip pressing that holds the semiconductor chip 51 by adsorbing the semiconductor chip 51 above the sheet material 44 held by the transfer-side flat ring 42. The nozzle 34 is waiting. Further, below the sheet material 44, the elastic body 28 provided on the upper end surface of the chip adhesion promoting portion 26 is adjusted so that the center position thereof faces the central portion of the chip placement region 44a in the sheet material 44, Further, the sheet material 44 is raised while being in contact with the lower surface. Accordingly, at this time, the cross-sectional shape of the sheet material 44 is deformed into a chevron curved surface shape in the chip placement region 44a.

  Next, as shown in FIG. 4B, the semiconductor chip 51 is lowered toward the curved top surface formed on the sheet material 44 in a state where the elastic body 28 is in a standby state. The lower surface of the sheet material 44 is pressed against the top surface of the curved surface of the sheet material 44. Accordingly, an adhesive region 51a where only the central portion of the lower surface of the semiconductor chip 51 is bonded is formed at the center of the chip placement region 44a in the sheet material 44, and the bonding area between the sheet material 44 and the semiconductor chip 51 is small.

  Next, as shown in FIG. 4C, the semiconductor chip 51 is further pressed against the sheet material 44 with the elastic body 28 fixed. At this time, the curved surface shape formed by the elastic body 28 on the sheet material 44 gradually returns to a flat cross-sectional shape. Accordingly, the bonding area of the bonding region 51a of the semiconductor chip 51 on the sheet material 44 is also gradually increased. Furthermore, it can be seen that when the bonding area of the bonding region 51a gradually increases, the air between the upper surface of the sheet material 44 and the lower surface of the semiconductor chip 51 is expelled to the outside.

  Next, as shown in FIG. 4D, when the elastic body 28 is further bent and the sheet material 44 becomes flat, the lowering of the chip pressing nozzle 34 is stopped. As a result, the bonding area of the bonding region 51 a is substantially the same as the area of the lower surface of the semiconductor chip 51. That is, according to the present embodiment, since the air between the semiconductor chip 51 and the sheet material 44 is surely expelled, it is possible to improve and stabilize the adhesion force of the semiconductor chip 51 to the sheet material 44. Therefore, it is possible to prevent the semiconductor chip 51 from dropping from the sheet material 44 when the sheet material 44 held by the transfer-side flat ring 42 on which the semiconductor chip 51 is placed is conveyed. Further, when the semiconductor chip 51 is picked up from the sheet material 44, the height of the semiconductor chip 51 after pick-up is stabilized by stabilizing the adhesive force, so that pick-up mistakes and the like can be prevented. The elastic body 28 preferably has a larger area on the upper surface when the sheet material 44 is crushed until the cross-sectional shape of the sheet material 44 becomes substantially flat than the area of the chip mounting region 44a. Further, in the step shown in FIG. 4D, the chip pressing nozzle 34 does not stop the descent when the sheet material 44 becomes flat, and if possible, the sheet material 44 further exceeds the flat shape. The chip pressing nozzle 34 may be lowered until it is bent downward.

  Next, as shown in FIG. 4E, the suction operation of the chip pressing nozzle 34 is stopped, and the chip pressing nozzle 34 is raised and returned to the original position. Moreover, the chip | tip adhesion promotion part 26 provided with the elastic body 28 is dropped. The bottom view here is the same as the step shown in FIG. 4D, and the semiconductor chip 51 and the sheet material 44 are bonded together without leaving bubbles, and the chip mounting is completed.

  As described above, according to the semiconductor chip transfer method according to the second embodiment, the chip adhesion promoting portion 26 from the lower side of the chip placement region 44 a in the sheet material 44 held by the transfer-side flat ring 42. A part of the chip mounting area 44 a is pushed up by the flexible elastic body 28 provided on the upper surface of the sheet material to form a curved surface shape having a cross-sectional mountain shape on a part of the sheet material 44. Thereafter, the semiconductor chip 51 is placed on the top surface of the curved surface shape of the sheet material 44, and further, the semiconductor chip 51 is pressed against the sheet material 44 until the cross-sectional shape of the sheet material 44 becomes substantially flat. 51 is held on the chip placement area 44 a of the sheet material 44.

  Accordingly, when the semiconductor chip 51 placed on the sheet material 44 is lowered and pressed until the sheet material 44 becomes substantially flat, the adhesion area between the lower surface of the semiconductor chip 51 and the sheet material 44 gradually increases. As a result, the air between the lower surface of the semiconductor chip 51 and the sheet material 44 can be expelled from the bonding surface. As a result, there is no portion that is not bonded between the semiconductor chip 51 and the sheet material 44, so that it is possible to improve the bonding strength of the semiconductor chip 51 to the sheet material 44 and stabilize the bonding force.

  Note that the flexible elastic body 28 used in the second embodiment is hardly deformed when pressed against the sheet material 44 held by the transfer side flat ring 42, and the semiconductor chip 51 is not deformed. It preferably has a property of elastically deforming when pressed.

(One Modification of Second Embodiment)
Hereinafter, a modification of the second embodiment of the present invention will be described with reference to FIGS. 5 (a) to 5 (e).

  In this modification, the elastic body 28 that is rubbery and has a hemispherical cross section is pressed against the end portion of the chip placement region 44 a in the sheet material 44.

  Specifically, as shown in FIG. 5A, in the chip transfer system 20, the semiconductor chip 51 is attracted and held above the sheet material 44 whose peripheral portion is held by the transfer-side flat ring 42. The chip pressing nozzle 34 is waiting. Further, below the sheet material 44, the elastic body 28 provided on the upper end surface of the chip adhesion promoting portion 26 faces the end of the chip placement region 44 a of the semiconductor chip 51 in the sheet material 44. And rises while being in contact with the lower surface of the sheet material 44. Accordingly, at this time, the cross-sectional shape of the sheet material 44 is deformed into a chevron curved surface shape in the chip placement region 44a.

  Next, as shown in FIG. 5B, in a state where the elastic body 28 is in a standby state, the semiconductor chip 51 is lowered toward the curved slope portion formed on the sheet material 44, and further, the semiconductor chip 51. The lower surface of the sheet material 44 is pressed against the curved slope of the sheet material 44. Therefore, an adhesive region 51a to which only the end of the lower surface of the semiconductor chip 51 is bonded is formed at the end of the chip placement region 44a in the sheet material 44, and the bonding area between the sheet material 44 and the semiconductor chip 51 is small.

  Next, as shown in FIG. 5C, the semiconductor chip 51 is further pressed against the sheet material 44 with the elastic body 28 fixed. As a result, the portion of the curved surface shape formed on the sheet material 44 by the elastic body 28 that comes into contact with the semiconductor chip 51 returns to a flat cross-sectional shape. Accordingly, the bonding area of the bonding region 51a of the semiconductor chip 51 on the sheet material 44 is also gradually increased. Furthermore, it can be seen that when the bonding area of the bonding region 51a gradually increases, the air between the upper surface of the sheet material 44 and the lower surface of the semiconductor chip 51 is expelled to the outside.

  Next, as shown in FIG. 5D, when the elastic body 28 is further bent and the area of the elastic body 28 facing the semiconductor chip 51 becomes larger than the area of the chip mounting area 44a, the chip pressing is performed. The lowering of the nozzle 34 is stopped. As a result, the bonding area of the bonding region 51 a is substantially the same as the area of the lower surface of the semiconductor chip 51. That is, according to the present embodiment, since the air between the semiconductor chip 51 and the sheet material 44 is surely expelled, it is possible to improve and stabilize the adhesion force of the semiconductor chip 51 to the sheet material 44.

  Next, as shown in FIG. 5E, the suction operation of the chip pressing nozzle 34 is stopped, and the chip pressing nozzle 34 is raised and returned to the original position. Moreover, the chip | tip adhesion promotion part 26 provided with the elastic body 28 is dropped. The bottom view here is the same as the step shown in FIG. 5D, and the semiconductor chip 51 and the sheet material 44 are bonded together without leaving bubbles, and the chip mounting is completed.

  In the present modification, the center position of the elastic body 28 when contacting (contacting) the sheet material 44 only needs to deviate from the center position of the chip placement region 44 a in the sheet material 44. Further, in the step shown in FIG. 5D, as long as the area of the portion facing the semiconductor chip 51 in a state where the elastic body 28 is bent is larger than the area of the chip mounting region 44a, the center of the elastic body 28 is obtained. The position may be located outside the chip placement area 44a.

  The chip transfer method and the semiconductor manufacturing apparatus using the same according to the present invention can improve the adhesive strength between the semiconductor chip and the sheet on which the semiconductor chip is mounted and stabilize the adhesive force. The present invention is useful for a transfer method for transferring a semiconductor chip held on a sheet or the like to another flat ring sheet and a semiconductor manufacturing apparatus using the transfer method.

10 chip supply system 11 supply side XY table 12 supply side bracket 13 supply side holding table 20 chip transfer system 21 transfer side XY table 22 transfer side bracket 23 transfer side holding table 24 adhesion promoting XY table 25 chip adhesion promotion Lifting part 26 Chip adhesion promoting part 27 Push pin (chip adhesion promoting member / contact part)
28 Elastic body (chip adhesion promoting member / contact part)
30 Chip transfer system 31 Moving table 32 Chip pressing lift unit 33 Chip pressing unit 34 Chip pressing nozzle 41 Supply side flat ring 42 Transfer side flat ring 43 Sheet material 44 Sheet material 44a Chip mounting area 51 Semiconductor chip 51a Bonding area

Claims (12)

A step (a) of pushing up a part of the placement area by a chip adhesion promoting member from the lower side of the placement area of the semiconductor chip in the sheet material having a peripheral edge held and having elasticity and adhesiveness;
After the step (a), a step (b) of bringing a semiconductor chip into contact with the top surface of the placement region where a part of the sheet material is pushed up;
A step (c) of holding the semiconductor chip on the placement region of the sheet material by simultaneously lowering the semiconductor chip and the upper surface of the chip adhesion promoting member after the step (b); A method of transferring a semiconductor chip, comprising:   2. The semiconductor chip transfer method according to claim 1, wherein, in the step (a), the chip adhesion promoting member is in contact with a central portion of a mounting area of the semiconductor chip on a lower surface of the sheet material. .   2. The semiconductor chip according to claim 1, wherein in the step (a), the chip adhesion promoting member is in contact with a part of an end portion of the mounting area of the semiconductor chip on a lower surface of the sheet material. Transfer method.   4. The semiconductor chip transfer according to claim 1, wherein the chip adhesion promoting member is a push-up pin whose contact area with the sheet material is smaller than a lower surface of the semiconductor chip. 5. Method.   The semiconductor chip transfer method according to claim 1, wherein the chip adhesion promoting member is made of an elastic body having flexibility. A chip pressing nozzle that can move at least in the vertical direction while adsorbing the upper surface of the semiconductor chip; and
A sheet material having elasticity and adhesiveness provided with a mounting area of the semiconductor chip on the upper surface, a peripheral edge portion held and detachable;
A chip adhesion promoting portion that is provided so as to be movable at least in the vertical direction below the sheet material, and has a contact portion that contacts a part of the lower surface of the sheet material on the upper end surface;
The chip adhesion promoting portion contacts the lower surface of the sheet material before the semiconductor chip is placed on the upper surface of the sheet material by the chip pressing nozzle, and causes the sheet material to have a convex cross section or a cross section mountain. Transformed into a shape,
The chip pressing nozzle contacts the semiconductor chip on a portion where the sheet material is deformed,
The semiconductor manufacturing apparatus according to claim 1, wherein an upper surface of the contact portion in the chip adhesion promoting portion is lowered in accordance with a lowering speed of the chip pressing nozzle.   The semiconductor manufacturing apparatus according to claim 6, wherein the chip adhesion promoting portion is provided so as to be aligned with a placement region of the semiconductor chip in the sheet material.   The semiconductor manufacturing apparatus according to claim 7, wherein the contact portion of the chip adhesion promoting portion is in contact with a central portion of a mounting region of the semiconductor chip on a lower surface of the sheet material.   The semiconductor manufacturing apparatus according to claim 7, wherein the contact portion of the chip adhesion promoting portion is in contact with a part of an end portion of the mounting region of the semiconductor chip on the lower surface of the sheet material.   10. The semiconductor according to claim 8, wherein the contact portion of the chip adhesion promoting portion that deforms the sheet material into a convex cross section is a push-up pin having a contact area smaller than a lower surface of the semiconductor chip. Manufacturing equipment.   The semiconductor manufacturing apparatus according to claim 8, wherein the contact portion of the chip adhesion promoting portion that deforms the sheet material into a cross-sectional mountain shape is made of an elastic body having flexibility.   The semiconductor manufacturing apparatus according to any one of claims 6 to 11, further comprising a sorting unit that sorts the semiconductor chip when the chip pressing nozzle sucks the semiconductor chip.

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