TWI650238B - Vacuum filming device and method - Google Patents

Abstract

The invention proposes a vacuum film sticking device, which includes a vacuum chamber module, a film pressing module, a carrying module and a heating platform, wherein the film pressing module includes a film pressing plate, and the bearing module includes a bearing disk And a spring device. In the vacuum device, when the film is activated, the film pressing plate presses the film downwards to actuate the carrier plate to the heating platform to heat the film to solidify the bonding glue. After the heating is completed, the film pressing plate starts to move upward. The spring position stored during the previous compression can be released and the carrier plate can be actuated upward to return it to its original initial position. The invention also proposes a vacuum die-casting method, which can reduce the bonding defects caused by air bubbles between the diaphragm and the film-to-be-adhered component, and improve the bonding force between the diaphragm and the film-to-be-adhered component.

Description

   Vacuum filming device and method   

The invention relates to a film sticking device and method, in particular to a vacuum film sticking device and method.

In the electronics industry, it is often necessary to attach various types of soft or hard diaphragms to electronic components such as semiconductor elements, circuit elements (resistors or capacitors), or liquid crystal display panels to give these electronic devices specific functions or Protect electronic devices and make them waterproof.

In addition to providing protection or waterproof functions, soft or rigid films (such as resin films) can also be made into optical films with properties such as light transmission, semi-light transmission, or light conversion. For example, the film can be added with dyes, light-scattering particles, fluorescent materials and other materials to obtain the desired optical properties such as filtering, color conversion, brightening or uniform diffusion, so that the film can be used as a filter film, Optical film such as fluorescent film, brightness enhancement film or diffusion film. This type of optical film is bonded to a variety of different optoelectronic devices to achieve the optical characteristics required by electronic devices.

Among them, fluorescent materials (such as quantum dots or fluorescent powders) are added to resin materials to form fluorescent film with color conversion function, which can be used in conjunction with light-emitting diode (LED) light sources and applied to the following Generation display. Alternatively, a fluorescent film having a color conversion function is directly bonded to a blue LED chip to make a package such as a white LED, so that the package can have good photoelectric characteristics and excellent product performance.

Taking the fluorescent film used with the LED light source as an example, the method of bonding the fluorescent film to the LED chip can be roughly divided into "die level bonding" and "wafer level bonding." The two categories are explained below.

"Wafer level bonding" is the bonding of a fluorescent film whose size corresponds to the size of a single LED chip to the LED chip. Since the size of the fluorescent film is small and just corresponds to the size of the LED chip, a high-precision laminating machine (or placement machine) is required to accurately attach the fluorescent film to the LED chip. However, because of the need for a high-precision placement machine, the cost of "wafer-level bonding" equipment is high; in addition, because it must be accurately aligned and a single fluorescent film must be bonded to a single LED chip one by one, The manufacturing process is difficult, resulting in a low wafer yield and production efficiency.

"Wafer-level bonding" is the bonding of a fluorescent film that can correspond to multiple LED chips in size to multiple LED chips at one time. "Wafer-level bonding" does not require high alignment precision, and multiple LED chips can be filmed in batches at the same time, so its equipment cost is low and production efficiency is high.

It can be seen from the above that "wafer-level bonding" has advantages in terms of equipment cost and production efficiency. However, in the process of "wafer-level bonding", the larger-sized film is bonded to the film to be bonded. It is easy to be caused by uneven thickness of the film, angular deviation during bonding, and poor surface characteristics of the film. , Resulting in air bubbles remaining between the film and the film to be pasted in the bonding glue, causing bonding defects, thereby reducing the production yield. Furthermore, there is a certain step when the film sheet is bonded to the film to be pasted. Generally, a bonding adhesive is first applied to at least one of the bonding surfaces of the two, and then a pressing force is applied so that the two bonding surfaces can pass through the bonding adhesive. Laminating, and thereafter, the adhesive is heated to be cured, so that the film is firmly attached to the film to be pasted. However, if the appropriate bonding equipment and filming procedures are not used, before the film and the film to be pasted are fully bonded, the bonding adhesive has been preheated and partially cured, and the bonding strength between the film and the film to be pasted will be affected. , Resulting in poor fit.

In view of this, how to provide an effective vacuum device and an appropriate filming method to improve the above-mentioned defects is a problem to be solved in the industry.

An object of the present invention is to provide a vacuum filming device and method, which can improve the bonding defect caused by air bubbles between a film sheet and a film to be filmed. The vacuum film filming device can completely adhere the film sheet to the film to be filmed first. Then, the bonding glue is heated and cured, so that it can have better bonding quality and production yield.

Yet another object of the present invention is to provide a vacuum film bonding device and method, which can realize "wafer-level bonding", thereby having lower equipment cost and / or better production efficiency.

In order to achieve at least one of the above objects, the vacuum film sticking device disclosed in the present invention includes: a vacuum chamber module, a film pressing module, a carrying module and a heating platform. The vacuum chamber module includes a cavity, and the cavity defines an accommodating space, and the pressure in the accommodating space can be set and controlled; the lamination module is connected to and penetrates the cavity, and includes a film pressing plate and a film pressing plate. It can be actuated by an actuator outside the cavity so that it can move vertically in the accommodating space; the bearing module is arranged in the accommodating space and includes a bearing plate and a spring device, wherein the bearing plate is arranged on the spring device, And has an initial position, the carrier plate is maintained at an initial distance from the film lamination plate before the film lamination procedure starts and is activated; the heating platform is also arranged in the accommodating space and is before the film lamination program starts and is activated Maintain an initial distance; wherein, the carrier plate is arranged to be actuated by the pressing plate in the accommodation space by being pressed down by the film plate, and the spring device is arranged to be stored when the carrier plate is actuated by the pressing down of the film. A spring-position energy, heating platform is set to support the carrier plate which is actuated by the pressed film to heat the carrier plate, so that the bonding glue between the film sheet and the film to be pasted is cured, and the film sheet and the film to be pasted are completed. After lamination, the lamination plate will move up The spring device can be released by the spring position energy stored in the previous compression, and the carrier plate is actuated upward and returned to the initial position.

In order to achieve at least one of the above-mentioned objectives, the vacuum filming method disclosed in the present invention includes: maintaining a film and a film-to-be-adhered piece in an accommodation space of a cavity, wherein at least one of the film and the film-to-be-adhered piece is to be separated. One has been provided with a bonding glue; the accommodating space is evacuated to a vacuum state; in the vacuum state, the diaphragm or the film to be pasted is actuated so that the diaphragm and the film to be pasted are bonded together via the adhesive; and The actuated film and the film to be pasted are actuated to move a distance, and then they are supported by a heating platform, wherein the bonding glue is heated and cured by the heating table.

Therefore, the vacuum filming device and method of the present invention can provide at least the following beneficial effects: 1. A vacuum environment can be provided for the film to be attached to the film to be pasted, so as to reduce air bubbles generated between the film and the film to be pasted Defects, thereby increasing the gas density of the lamination, thereby improving the yield of the lamination film; 2. An initial distance can be provided to prevent the adhesive between the diaphragm and the film to be laminated before being heated by the heating platform In order to avoid premature curing of the bonding adhesive and reduce the bonding strength, thereby improving the quality and yield of the film; and 3. One-time filming of the film to be filmed including a plurality of wafers and other components can be achieved to achieve "wafer level bonding ".

In order to make the above-mentioned objects, technical features, and advantages more comprehensible, the following describes in detail the preferred embodiments in combination with the accompanying drawings.

10‧‧‧Vacuum film device

100‧‧‧vacuum chamber module

110‧‧‧ Cavity

110A‧‧‧accommodation space

111‧‧‧Top plate

112‧‧‧ floor

113‧‧‧Side

114‧‧‧ open side

115‧‧‧Actuator

116‧‧‧Event Gate

120‧‧‧Airtight Sliding Bearing

121‧‧‧ axial through hole

122‧‧‧seals

130‧‧‧Control device for vacuum system

131‧‧‧Vacuum pressure sensor

132‧‧‧Vacuum control valve

133‧‧‧ Atmospheric Pressure Sensor

134‧‧‧break vacuum control valve

135‧‧‧Vacuum Pump

136‧‧‧Vacuum pressure source

137‧‧‧ pipeline

200‧‧‧Laminated Module

210‧‧‧Laminated sheet

211‧‧‧upper

212‧‧‧lower

220‧‧‧Vertical moving lever

221‧‧‧Top

222‧‧‧ bottom

230‧‧‧Actuator

240‧‧‧ spherical bearing

300‧‧‧bearing module

310‧‧‧carry tray

311‧‧‧through hole

312‧‧‧groove

320‧‧‧ spring device

321‧‧‧ cylinder

322‧‧‧Spring

330‧‧‧Slide device

331‧‧‧Fixed section

332‧‧‧Sliding section

340‧‧‧Positioning sensor

350‧‧‧ diaphragm sensor

400‧‧‧Heating platform

410‧‧‧Temperature sensor

500‧‧‧control module

510‧‧‧program controller

520‧‧‧command input device

530‧‧‧Temperature Controller

540‧‧‧Position and Thrust Controller

600‧‧‧ diaphragm, optical diaphragm

601‧‧‧ surface

650‧‧‧Adhesive

700‧‧‧ to be filmed

700A, 700B‧‧‧‧Light-emitting semiconductor wafer array

700C‧‧‧Transparent substrate

701‧‧‧ surface

710‧‧‧ substrate

720‧‧‧light-emitting diode chip

730‧‧‧Reflective structure

800‧‧‧ diaphragm holder

811‧‧‧soft film

812‧‧‧Support frame

D1 ~ D3‧‧‧ Initial distance

Z‧‧‧ vertical axis

20‧‧‧Vacuum film method

S201 ~ S213‧‧‧step

FIG. 1 is a perspective view of a vacuum film sticking device according to a preferred embodiment of the present invention.

Fig. 2 is a perspective view of the movable door of the vacuum film device shown in Fig. 1 opened and the carrier tray sliding out.

Figure 3 is a perspective view of the vacuum chamber module shown in Figure 1.

Fig. 4 is a plan view of the air-tight sliding bearing shown in Fig. 1.

Fig. 5 is a plan view of the lamination module shown in Fig. 1.

Fig. 6A is a plan view of some components of the vacuum film-applying device shown in Fig. 1.

Fig. 6B is a partial enlarged detailed view of Fig. 6A.

FIG. 7A and FIG. 7B are schematic plan views of a film contact plate or a carrier plate shown in FIG. 1.

Fig. 8 is a functional block diagram of a control module of the vacuum film-applying device shown in Fig. 1.

FIG. 9A to FIG. 15B are schematic diagrams of each stage of a vacuum filming process realized by the vacuum filming device shown in FIG. 1.

Figure 16A shows the results of the film test at atmospheric pressure.

Figure 16B shows the results of the film test using the vacuum film process.

FIG. 17 is a flowchart of steps of a vacuum filming method according to another preferred embodiment of the present invention.

Please refer to FIG. 1 to FIG. 3, which are schematic diagrams of a vacuum filming device 10 according to a preferred embodiment of the present invention, in which FIG. 1 and FIG. 2 do not show the top plate 111 of the cavity 110 in order to examine the vacuum filming. The internal structure of the device 10. The vacuum film sticking device 10 may include a vacuum chamber module 100, a film pressing module 200, a carrying module 300, and a heating platform 400. The technical contents of these elements are described in order below.

The vacuum chamber module 100 can provide a vacuum environment for vacuum filming. The structure can include a cavity 110, an air-tight sliding bearing 120, and a control device 130 of a vacuum system. The air-tight sliding bearing 120 and the control device 130 are all disposed on the cavity 110.

Specifically, the cavity 110 defines an accommodating space 110A, and the pressure in the accommodating space 110A is controllable, that is, the pressure of the accommodating space 110A can be controlled by the vacuum device's control device 130.

The cavity 110 may include a top plate 111, a bottom plate 112, a plurality of side plates 113, and an open side 114. The top plate 111 and the bottom plate 112 are opposite and opposite to each other. The side plate 113 and the open side 114 are formed on the top plate 111 and the bottom plate 112. The top plate 111 and the bottom plate 112 are hermetically connected between them. The top plate 111, the bottom plate 112, the side plate 113, and the open side 114 collectively define the range of the accommodation space 110A, and the open side 114 allows the accommodation space 110A to communicate with the outside of the cavity 110, so the open side 114 needs to be closed to allow accommodation. The space 110A is a vacuum.

Therefore, preferably, the vacuum chamber module 110 further includes an actuator 115 and a movable door 116 to close the open side 114. The actuator 115 may be disposed on the side plate 113, and the movable door 116 may be movably disposed on the open side 114 and connected to the actuator 115; the actuator 115 (such as a pneumatic cylinder, a hydraulic cylinder, a motor lead screw group, etc.) During operation, the movable door 116 can be moved (rotated, swung, or slid, etc.) relative to the open side 114 to close the open side 114.

In other embodiments (not shown), the other side plate 113 can replace the open side 114, and the top plate 111 of the cavity 110 is movable (for example, the top plate 111 can be lifted and lowered), so as to make the accommodation space 110A is connected and isolated from the outside.

Please refer to FIG. 4 for reference. The airtight sliding bearing 120 allows the vertical moving rod 220 of the lamination module 200 described later to enter the cavity 110 from the outside without leaking and damaging the vacuum state in the cavity 110. The air-tight sliding bearing 120 can be inserted into the top plate 111 of the cavity 110 (the top plate 111 has a corresponding through hole, not shown), so that a part of the air-tight sliding bearing 120 is disposed above the top plate 111 and is located in the accommodation space 110A. In addition, another part is disposed below the top plate 111 and is located within the accommodating space 110A; the air-tight sliding bearing 120 may also be disposed above or below the top plate 111 as a whole (not shown).

Structurally, the airtight sliding bearing 120 may include an axial through-hole 121 and a seal 122, and the axial through-hole 121 is in communication with the accommodation space 110A for the vertical moving rod 220 to pass into the accommodation space 110A; A seal 122 (for example, an O-shaped rubber shaft seal, a magnetic shaft seal, a bellows, etc.) is disposed in the axial through-hole 121 and surrounds the vertical moving rod 220 to block the gas from the vertical moving rod 220 and the axial through-hole 121 Pass between.

In other embodiments (not shown), if the vertical moving rod 220 or the film pressing module 200 as a whole can be disposed in the cavity 110, the air-tight sliding bearing 120 can be omitted.

Please refer to FIG. 2 and FIG. 3 again. The control device 130 of the vacuum system can control the pressure in the accommodating space 110A. It can be arranged on the top plate 111 of the cavity 110, or on the bottom plate 112, the side plate 113, etc. The position where the cavity 110 is connected. The control device 130 may include a vacuum pressure sensor 131, a vacuum control valve 132, an atmospheric pressure sensor 133, and a vacuum control valve 134, which are respectively connected to a vacuum pump 135 and a vacuum pressure of a vacuum system. Source 136.

Specifically, the vacuum pump 135 may be disposed outside the cavity 110, and a vacuum control valve 132 and a vacuum pressure sensor 131 are sequentially connected through a line 137, and are connected to the accommodating space 110A. When the vacuum pump 135 is operated and the vacuum control valve 132 is opened (the vacuum pressure source 136 and the vacuum control valve 134 are closed), the pressure in the accommodation space 110A can be reduced to form a vacuum state. The vacuum pressure sensor 131 can sense the vacuum state. If the vacuum state reaches a set value, the vacuum control valve 132 can be closed through the control module 500 described later, and the vacuum pump 135 can be further closed.

The vacuum breaking pressure source 136 is also disposed outside the cavity 110, and can be connected to the vacuum breaking control valve 134 and the atmospheric pressure sensor 133 in sequence through another pipeline 137, and communicates with the accommodation space 110A. When the vacuum breaking pressure source 136 and the vacuum breaking control valve 134 are opened (the vacuum pump 135 and the vacuum control valve 132 are closed), air can be supplied to the accommodation space 110A to increase the pressure. The atmospheric pressure sensor 133 can sense whether the pressure in the accommodating space 110A has reached the atmospheric pressure (or a preset pressure). If so, the vacuum breaking control valve 134 can be closed through the control module 500, and the vacuum breaking can be further closed. Pressure source 136.

Next, the technical content of the lamination module 200 will be described. Please also refer to FIG. 5 (which shows one side of the lamination module 200, and the top plate 111 is shown in cross-section). The lamination module 200 can push a diaphragm 600 and a piece of film 700 (such as As shown in Figure 6B, see below for details), so that the two fit together. On the structure, the lamination module 200 may include a lamination plate 210, a vertical moving rod 220, and an actuator 230. The actuator 230 may move the vertical moving rod 220, so that the laminating plate 210 is in the accommodating space 110A. Move vertically inside.

Specifically, the film pressing plate 210 is disposed in the accommodation space 110A of the cavity 110, and the vertical moving rod 220 may include an upper end 221 and a lower end 222. The upper end 221 is located above the top plate 111 and outside the accommodation space 110A. 222 is located below the top plate 111 and in the accommodating space 110A, and the film pressing plate 210 may be disposed at the lower end 222. It can be seen that the middle portion of the vertical moving rod 220 passes through the top plate 111 and is slidably disposed in the aforementioned airtight sliding bearing 120.

The actuator 230 may be disposed on the top plate 111 and connected to the upper end 221 of the vertical moving rod 220 to drive the vertical moving rod 220 to move along a vertical axis Z, and the film pressing plate 210 may move with the vertical The lever 220 moves in the accommodation space 110A. The actuator 230 may be a moving component such as a motor lead screw group, a linear motor group, a pneumatic cylinder group, a hydraulic cylinder group, or a link slider group, which can provide at least one vertical direction (or one degree of freedom).

Preferably, the film pressing plate 210 may include an upper portion 211 and a lower portion 212. The upper portion 211 is disposed at the lower end 222 of the vertical moving rod 220, and the lower portion 212 is disposed below the upper portion 211. The upper portion 211 has sufficient rigidity, so it is not easy to bend and deform, and the lower portion 212 is made of a soft material (such as resin, rubber, etc.) as a buffer layer. In this way, when the film pressing plate 210 presses the film 600 and the film to be attached 700, the upper portion 211 can withstand the force from the vertical moving rod 220 without deformation, and the lower portion 212 as a buffer layer can make the force more uniformly act on The film 600 and the film-to-be-adhered piece 700 can improve the bonding quality, and can reduce the possibility of damage to the film 600 and / or the film-to-be-attached piece 700 due to the concentration of force.

Next, the technical content of the carrier module 300 will be described. Please refer to FIG. 6A and FIG. 6B together. The carrier module 300 can carry the diaphragm 600 and the film-to-be-adhered piece 700, wherein the diaphragm 600 and the film-to-be-adhered piece 700 can be swapped with each other and set in the accommodation space 110A The structure may include a carrier plate 310, a spring device 320, and a slide rail device 330. The carrier plate 310 is movably disposed on the spring device 320, and the spring device 320 is disposed on the slide rail device 330.

In detail, the carrier plate 310 can be used to place the film sheet 600 and the film-to-be-adhered member 700 thereon, and can be a plate body and formed with a plurality of through holes 311. The spring device 320 may have a plurality of posts 321 and a plurality of springs 322. The posts 321 pass through the through hole 311, and the spring 322 is sleeved on the post 321, and one end of the spring 322 is connected to the bearing plate 310. The spring 322 may be a compression spring or a tension spring. When no external force is applied (when the film-laminating process is not started), the carrier plate 310 may have an initial position on the spring 322, and the carrier plate 310 and the pressure plate 210 are at this time. An initial distance D1 is maintained along the vertical axis Z, and the two are not in contact with each other.

The slide rail device 330 may have a fixed portion 331 and a sliding portion 332. The fixed portion 331 is fixedly disposed in the cavity 110, and the sliding portion 332 is slidably disposed on the fixed portion 331. The cylinder 321 of the spring device 320 is fixedly disposed on the sliding portion 332, so that the bearing plate 310 and the spring device 320 can slide horizontally with the sliding portion 332 in the accommodation space 110A (the horizontal axis is perpendicular to the vertical axis Z ). In addition, when the open side 114 is not closed by the movable door 116, the carrier plate 310 can slide out of the cavity 110 for the user to place the diaphragm 600 and the film-to-be-adhered member 700 on the carrier plate 310 before or after the film is applied. It's removed.

The diaphragm 600 may be first disposed on a diaphragm holder 800, and then indirectly placed on the carrier plate 310 through the diaphragm holder 800, and the carrier plate 310 may have a groove 312 to receive the to-be-adhered member 700 so that The diaphragm 600 is separated from the to-be-adhered piece 700 by an initial distance D2. The diaphragm holder 800 includes a flexible film (also referred to as a flexible film, such as a wafer dicing film or a blue film) 811 and a support frame 812. The flexible film 811 is disposed on the support frame 812. The flexible film 811 itself is sticky, so the diaphragm 600 can be adhered to the flexible film 811 and surrounded by the support frame 812.

The carrying module 300 preferably includes a positioning sensor 340 (as shown in FIG. 1) and a diaphragm sensor 350. The positioning sensor 340 can sense whether the carrier plate 310 slides below the lamination plate 210, so it is located on or around the slide path of the carrier plate 310, and can be a light interrupt switch, a proximity switch, a reed switch, a reflection The optical transceiver switch and the like sense the position of the carrier plate 310 in a non-contact manner, and the limit switch and the like can also sense the position of the carrier plate 310 in a contact manner. The diaphragm sensor 350 can detect whether the diaphragm 600 (or the diaphragm holder 800) is placed on the carrier plate 310, and therefore it is located above the carrier plate 310.

In other embodiments (not shown), the carrier plate 310 and the spring device 320 can be fixed in the accommodating space 110A without sliding, so the slide rail device 330 and the positioning sensor 340 can be omitted. In addition, the diaphragm sensor 350 may be omitted.

Next, the technical contents of the heating platform 400 will be described. Please refer to FIG. 2 and FIG. 6A again, the heating platform 400 may be made of heat-resistant materials such as ceramics or metal, and may use electric heating, infrared heating, induction heating, etc. to maintain a high temperature state. The temperature sensor 410 senses the temperature of the heating platform 400. The heating platform 400 is disposed in the accommodating space 110A, under the carrier plate 310, and before the pressing plate 210 starts to actuate the carrier plate 310 downward at the start of the laminating process, the heating platform 400 and the carrier plate 310 maintain an initial The distance D3, the two are not in contact.

From the above, it can be known that the film pressing plate 210, the carrier plate 310 and the heating platform 400 are all disposed in the accommodation space 110A and are sequentially arranged along the vertical axis Z. The film pressing plate 210 is located on the carrier module 300 and is heated. The platforms 400 are located under the carrier plate 310, and the three maintain their respective initial distances before the vacuum filming process is performed.

When the vacuum film-laminating process starts, the film pressing plate 210 can be moved downward to actuate the carrier plate 310 to complete the vacuum bonding of the diaphragm 600 and the film-to-be-adhered component 700; then, the carrier plate 310 will continue to actuate downward for an initial distance D3 It is initially supported and heated by the heating platform 400. In this way, the adhesive can be heated and cured after the vacuum bonding is completed, thus avoiding the adhesive being heated and cured in advance before the vacuum bonding, resulting in insufficient bonding adhesive strength; at this time, The spring 322 of the spring device 320 is compressed (or stretched) by the carrier plate 310 to store a spring potential. When the adhesive is heated and cured, the pressure plate 210 will move upwards. At this time, the spring device 320 can be released by the spring position energy stored in the previous downward pressing and act on the carrier plate 310. Move it back to its original position. In this way, a vacuum film bonding device disclosed in the present invention can be used to sequentially complete vacuum bonding and then heat curing.

Please refer to FIG. 7A and FIG. 7B. The laminating module 200 preferably includes a spherical bearing 240 which is disposed at the lower end 222 of the vertical moving rod 220, and the pressing plate 210 is disposed in the spherical bearing 240 and indirectly disposed in the spherical bearing 240. Lower end 222. With this, the lamination plate 210 can be adjusted with two degrees of freedom relative to the lower end 222 to improve the following problems: the lamination plate 210 and / or the carrier plate 310 itself cannot be horizontally installed, or the film on the carrier plate 310 When the sheet 600 or the membrane holder 800 cannot be placed horizontally, only one or a part of the pressing plate 210 may be in contact with the membrane 600, resulting in uneven pressure and poor bonding.

However, with the arrangement of the spherical bearing 240, after one side of the pressing plate 210 contacts the diaphragm 600 (as shown in FIG. 7A), using this side as a fulcrum, the pressing plate 210 can be swung so that the other side can also contact To the diaphragm 600 (FIG. 7B), the diaphragm 600 can contact and press the diaphragm more comprehensively to actuate the diaphragm 600.

Referring to FIG. 8, the vacuum film sticking device 10 may further include a control module 500 to control and coordinate the actions of the vacuum chamber module 100, the film pressing module 200, the carrying module 300 and the heating platform 400, thereby automating In order to realize the vacuum filming process.

The control module 500 may include a program controller 510, a command input device 520, a temperature controller 530, a position and thrust controller 540, and other components electrically connected to the program controller 510. The vacuum pressure sensor 131, Various sensors, such as the atmospheric pressure sensor 133, the positioning sensor 340, the diaphragm sensor 350, and the temperature sensor 410, can be electrically connected to the program controller 510. Thereby, the user can cause the program controller 510 to control the respective actions of the vacuum chamber module 100, the film pressing module 200, the bearing module 300 and the heating platform 400 through the instruction input device 520 (such as a touch screen, a keyboard, etc.). , And coordinate the timing of each component through various sensors to achieve the vacuum film process.

The above is a description of the technical content of each element of the vacuum filming device 10, and then how to implement a vacuum filming process by using the vacuum filming device 10 is described.

Before the vacuum filming is started, a filming member 700 needs to be prepared in advance. Please refer to FIG. 9A. The film-to-be-adhered component 700 may include a light-emitting semiconductor wafer array 700A, which includes a substrate 710 (such as a thermally adhesive film, an ultraviolet debonding film, a release film, and the like having a softness or a substrate), or a substrate. ) And a plurality of flip-chip light-emitting diode (LED) wafers 720, the flip-chip LED wafers 720 are arranged (adhered) on the substrate 710 in a manner separated from each other. Please refer to FIG. 9B. The film-to-be-adhered component 700 may include another flip-chip light-emitting semiconductor wafer array 700B, which may include a plurality of reflective structures 730 (for example, optically scattering fine particles such as titanium dioxide are mixed with a light-transmitting resin material), They are respectively disposed beside the flip-chip LED chip 720 to block and reflect the lateral light of the LED chip 720. Referring to FIG. 9C, the film-to-be-adhered component 700 may also be a light-transmitting substrate (or wafer, glass substrate, ceramic substrate) 700C, and the like. The following description uses the to-be-adhered component 700 (light-emitting semiconductor wafer array 700B) shown in FIG. 9B as an example for subsequent description.

Please refer to FIG. 9D. One surface 701 of the to-be-adhered piece 700 may preferably be treated with a plasma surface to clean the interface and destroy the substrate bond to achieve the effect of activating free radicals. Then, please refer to FIG. 9E. A bonding adhesive 650 is provided on the surface 701 of the film bonding member 700 by spraying, coating, printing, etc. The manufacturing material of the bonding adhesive 650 may include silicon rubber, resin, rubber, and the like. Since the surface 701 of the film piece 700 to be pasted is treated with a plasma surface, the bonding adhesive 650 can better form a bond on the surface 701 to obtain better bonding strength.

An optical film 600 may be prepared at the same time or after the preparation of the to-be-attached film 700 is completed. Please refer to FIG. 10, the film 600 may include a fluorescent film, a quantum dot fluorescent film, a silicone fluorescent film, a resin film, a ceramic fluorescent film, and the like; The film or quantum dot fluorescent film can be produced by the method disclosed in the applicant's US Patent Application Publication No. US 2010 / 0119839A1 (corresponding to Taiwan Patent Publication No. I508331). The fluorescent film is usually made of silicon rubber, and the silicon rubber can be divided into a partially cured type (B-stage silicon) and a fully cured type (C-stage silicon). Fully cured fluorescent film has low production cost, can be used for multiple fluorescent materials (multi-powder), has good heat resistance, and does not cause film thickness changes during the bonding process, so it is most suitable for wafer-level bonding This method can produce the best overall production efficiency.

The surface 601 of the optical film 600 may also be treated with a plasma surface, so that the bonding adhesive 650 can be better adhered. However, if the bonding strength between the diaphragm 600 (or the film member 700 to be pasted) and the bonding adhesive 650 is sufficient, the plasma surface treatment may be omitted. In addition, the adhesive 650 may be provided on the diaphragm 600. The diaphragm 600 may be adhered to the flexible film 811 of the diaphragm holder 800, and then the plasma surface treatment or the bonding glue 650 may be applied. The flexible film 811 is usually tacky, so there is no need to apply additional adhesive to adhere and fix the film 600.

When the film 600 and the film-to-be-adhered component 700 are ready, the film-lamination process can be started. First, referring to FIG. 11, the diaphragm 600 and the member 700 to be pasted are placed on the carrier plate 310. The member 700 to be pasted may be placed in the groove 312 of the carrier 310, and the diaphragm 600 is placed on the diaphragm. The holder 800 is then placed on the carrier plate 310. At this time, the supporting frame 812 of the film holder 800 contacts the carrier plate 310, and the flexible film 811 and the film 600 thereon are located above the film member 700 to be pasted, and the two are separated by an initial distance D2. An accommodating groove (not shown) may be formed on the surface of the carrier plate 310 for the support frame 812 to be inserted and positioned.

Please refer to Fig. 2. Before placing the diaphragm 600 and the member 700 to be pasted, the carrier plate 310 can be slid to the outside of the cavity 110. After placing the diaphragm 600 and the member 700 to be pasted on the carrier plate 310, the carrier The disc 310 slides back into the cavity 110. The positioning sensor 340 and the diaphragm sensor 350 can respectively detect whether the carrier plate 310 is located under the pressing plate 210 and whether the diaphragm 600 (or the diaphragm holder 800) is placed on the carrier plate 310.

Please refer to FIG. 12 and FIG. 6A in cooperation. After the placement of the diaphragm 600 and the to-be-adhered piece 700 is completed, the air is evacuated to bring the accommodating space 110A of the cavity 110 to a vacuum state, that is, the control device of the vacuum system 130, evacuating the accommodating space 110A; the degree of vacuum may be less than 50 Torr, more preferably less than 10 Torr, and more preferably less than 1 Torr. In this way, there is only a trace amount of thin gas between the diaphragm 600 and the film-attachment member 700.

In addition, during the evacuation, the film pressing plate 210, the carrier plate 310, and the heating platform 400 are vertically separated, that is, the initial distance D3 is maintained between the carrier plate 310 and the heating platform 400. At this time, the heating platform 400 is already at a high temperature (for example, 150 degrees Celsius), and because the initial distance D3 is maintained, the bonding glue 650 on the carrier plate 310 will not reach the temperature required for curing, so it will not be in the diaphragm 600 and waiting. The film member 700 is cured before bonding.

Please refer to FIG. 13A and FIG. 13B (to simplify the drawing, the adhesive 650 is omitted), and when the accommodating space 110A is in a vacuum state, the diaphragm 600 and the member 700 to be adhered are joined. Specifically, the vertical moving lever 220 is actuated by the actuator 230 to move the pressing plate 210 downward. The pressing plate 210 first activates the flexible film 811 and the diaphragm 600 thereon to deform the flexible film 811 (that is, The two sides are flexed and the middle part is displaced.) Then, the diaphragm 600 and the to-be-adhered piece 700 are bonded by a bonding adhesive 650 (not shown); the pressing plate 210 continues to actuate the flexible film 811 and the diaphragm 600, and further The carrier plate 310 is pressed to the heating platform 400; at this time, the spring 322 of the spring device 320 disposed under the carrier plate 310 will deform and store a spring potential energy.

After the supporting plate 310 is pressed to the heating platform 400, the heating platform 400 starts to support the supporting plate 310. The supporting plate 310 cannot be further moved downward, so that the supporting plate 310 is sandwiched by the pressing plate 210 and the heating platform 400. The thermal energy of the heating platform 400 can be transmitted to the carrier plate 310, so that the bonding adhesive 650 between the film 600 and the film member 700 can be heated and cured.

Please refer to FIG. 14A (to simplify the drawing, the adhesive 650 in FIG. 14B after FIG. 14A is omitted), after the adhesive 650 is cured to a certain degree, the vertical moving rod 220 no longer presses the diaphragm 600 and is soft. The film 811 and the carrier plate 310 in turn drive the film pressing plate 210 to move upward. At this time, the film pressing plate 210 continues to move upward, please refer to FIG. 14B. Preferably, the spring device 320 can be released by the spring position energy stored in the previous pressing, and the carrier plate 310 is actuated upward and returned to the initial position, so that The carrier plate 310 (and the film sheet 600 and the film member 700 thereon) are separated from the heating platform 400 to an initial distance D3, and the bonding glue 650 is no longer heated and cured.

After the spring device 320 can be released by the spring position energy stored during the previous pressing, the carrier plate 310 can be actuated and returned to the initial position, and the pressing plate 210 can continue to move upward to end the pressing operation. Please refer to FIG. 14C (the adhesive 650 is not shown). Preferably, the flexible film 811 is restored to its undeformed state due to its elastic force, and the diaphragm 600 will move with it. 700 will also be pulled away from the carrier plate 310; thus, the film-to-be-adhered member 700 is separated from the carrier plate 310 by a distance and is no longer placed in the groove 312. Then, the film pressing plate 210 continues to move upward and returns to maintain an initial distance D1 from the carrier plate 310, as shown in FIG. 14D.

After the diaphragm 600 and the member 700 to be pasted are far from the heating platform 400, the accommodating space 110A is evacuated by using a vacuum pressure source 136, etc., and returns to atmospheric pressure. Thereafter, the carrier plate 310 is slid to the outside of the cavity 110, and the diaphragm holder 800 is taken out from the carrier plate 310, and the diaphragm 600 and the to-be-attached member 700 are taken out of the cavity 110 with the diaphragm holder 800.

If the adhesive 650 between the film 600 and the piece of film 700 is not completely cured, preferably, after taking out the film 600 and the piece of film 700, it can be placed in a heating device (such as an oven, not shown) In this way, the bonding adhesive 650 is heated again to be more solidified, and the bonding between the film 600 and the film member 700 is more stable. The heating device can reheat a plurality of groups of film sheets 600 and the film members 700 to be bonded at a time, so that the reheating process is more efficient.

However, after the bonding glue 650 is completely cured by using the heating platform 400, the film sheet 600 and the film-to-be-attached member 700 can be taken out.

Please refer to FIG. 15A, the attached film 600 and the to-be-adhered film 700 may be cut to form a plurality of light-emitting diode devices; or, see FIG. 15B, the attached film 600 and the to-be-adhered film The piece 700 can be separated from the substrate 710 and then cut.

Thereby, the vacuum film sticking device 10 can adhere the film sheet 600 to the film piece 700 in a vacuum state, so as to reduce bubble defects that may occur between the film sheet 600 and the film piece 700. The test results of a transparent silicone film and a glass substrate show that bonding under vacuum can effectively reduce the generation of bubbles. As shown in Figure 16A, when the two are bonded under atmospheric pressure, many bubbles are unavoidably generated between the transparent silicone film and the glass substrate, which reduces the bonding quality and production yield; while Figure 16B shows the use of The bonding results of the vacuum film device disclosed in this implementation show that there is no observable bubble generation during bonding under vacuum. In addition, performing plasma surface treatment on the membrane 600 and the film-to-be-adhered piece 700 can achieve the effects of cleaning the surface and activating the bonding, which can effectively increase the bonding strength between the two and further improve the bonding quality. In addition, before the contact, the carrier plate 310 and the heating platform 400 have an initial distance D3, so the bonding glue 650 is not heated and cured in advance. In addition, the vacuum filming device 10 can film a plurality of components such as LED wafers 720 at a time to realize wafer-level filming.

Referring to FIG. 17, the following describes a vacuum filming method 20 according to another preferred embodiment of the present invention, which can be completed by using the above-mentioned vacuum filming device 10, so it can be regarded as a process that can be implemented by the vacuum filming device 10. Therefore, the technical content of the vacuum filming method 20 can be referred to the technical content of the vacuum filming apparatus 10, so the description is relatively simple.

First, as shown in FIG. 11, a diaphragm 600 and a film-to-be-adhered piece 700 are provided (step S201). At least one of the film 600 and the film-to-be-adhered piece 700 has been provided with a bonding adhesive 650, and the diaphragm 600 And / or the film-to-be-adhered piece 700 may be subjected to a plasma surface treatment (step S202).

Next, as shown in FIG. 12, the diaphragm 600 and the member 700 to be pasted are kept separated in an accommodation space 110A (step S203), and then the air is evacuated to bring the accommodation space 110A to a vacuum state (step S205).

Thereafter, as shown in FIG. 13A and FIG. 13B, the diaphragm 600 is actuated in a vacuum state, so that the diaphragm 600 and the film-to-be-adhered member 700 are bonded to each other via the bonding glue 650 (step S207); The sheet 600 moves the adhered film sheet 600 and the to-be-adhered piece 700 a distance and is pressed to the heating platform 400 (step S209); thus, the bonding adhesive 650 is heated and cured by the heating platform 400.

In addition, as shown in FIGS. 14A to 14D, after the adhesive 650 is cured to a considerable extent, the diaphragm 600 can be moved in the reverse direction, and the attached diaphragm 600 and the to-be-adhered piece 700 can be kept away from the heating platform 400. In order to end the adhesive curing process (step S211). After that, the attached film sheet 600 and the to-be-adhered piece 700 are taken out, and then the bonding adhesive 650 is heated again until it is completely cured (step S213).

To sum up, the vacuum filming device and method of the present invention can improve the problem of air bubble defects between the film sheet and the film to be filmed, and can improve the problem that the adhesive between the film sheet and the film to be filmed is cured before being bonded. This has a better bonding yield, and in addition, "wafer-level bonding" can be achieved, thereby having lower equipment costs and / or better production efficiency.

The above embodiments are only used to exemplify the implementation aspects of the present invention, and to explain the technical features of the present invention, and are not intended to limit the protection scope of the present invention. Any change or equivalence arrangement that can be easily accomplished by those skilled in the art belongs to the scope claimed by the present invention, and the scope of protection of the rights of the present invention shall be subject to the scope of patent application.

Claims (14)

A vacuum film sticking device includes a vacuum chamber module including a cavity and a control device of a vacuum system. The cavity defines an accommodation space, and the control device is connected to the cavity to control the accommodation space. Internal pressure; a film pressing module connected to the cavity, and including a film pressing plate and a vertical moving rod, the vertical moving rod including an upper end and a lower end, the film pressing plate is arranged on the vertical moving rod; At the lower end, the film pressing plate can move vertically in the accommodating space through a vertical moving rod; a load module connected to the cavity and includes a load plate and a spring device, wherein the load plate is disposed on the spring device And an initial position, the carrier disk is maintained at an initial distance from the film pressing plate before being actuated by the film; and a heating platform is disposed in the accommodating space and is separated from the film before being actuated. The carrier plate maintains an initial distance; wherein the carrier plate is arranged to be actuated by the film pressing plate in the accommodating space, and the spring device is arranged to be movable to the carrier plate. Stores a spring when actuated Yes, the heating platform is arranged to support the carrier plate which is actuated by the pressed film, so that the thermal energy of the heating platform is transmitted to the carrier plate to heat the carrier plate; the spring device is further provided to the After the pressure plate is moved upward, the spring position stored in the previous compression can be released to actuate the bearing plate upward and return to the initial position. The vacuum filming device according to claim 1, wherein the film pressing module further comprises a spherical bearing, and the film pressing plate is disposed at the lower end of the vertical moving rod through the spherical bearing. The vacuum filming device according to claim 1, wherein the vacuum chamber module includes an air-tight sliding bearing, the upper end of the vertical moving rod is located outside the accommodation space, and the lower end is made by the air-tight sliding bearing. Located in the accommodation space. The vacuum film sticking device according to claim 1, wherein the film pressing plate includes a buffer layer. The vacuum film sticking device according to claim 1, wherein the vacuum chamber module further includes a movable door, which is disposed on an open side of the cavity and movably closes the open side. The vacuum filming device according to claim 5, wherein the carrier module further includes a slide rail device, and the carrier disk is disposed on the slide rail device to slide horizontally in the accommodation space and pass through the opening side Slide horizontally outside the cavity. The vacuum film sticking device according to any one of claims 1 to 6, further comprising a control module configured to control and coordinate the vacuum chamber module, the film pressing module, and the carrying module. And the action of the heating platform. A vacuum filming method includes: maintaining a film sheet and a film to be filmed in an accommodation space of a cavity, wherein at least one of the film sheet and the film to be filmed has a bonding adhesive; Pump down the accommodation space to a vacuum state; in the vacuum state, actuate the diaphragm to make the diaphragm and the film to be pasted together via the bonding glue; and continue to actuate the diaphragm to make After the attached film and the to-be-adhered film have moved a distance, they are supported by a heating platform, wherein the thermal energy of the heating platform is transmitted to the bonding glue, so that the bonding glue is heated by the heating platform to be cured to a considerable degree. The vacuum filming method according to claim 8, wherein before the bonding adhesive is disposed on one of the film sheet and the film to be filmed, the film sheet and / or the film to be filmed are subjected to a plasma surface treatment . The vacuum filming method according to claim 8 or 9, further comprising: after the adhesive is heated and cured, moving the film sheet to separate the pasted film sheet and the film to be pasted from the heating platform. The vacuum filming method according to claim 10, further comprising: after the pasted film and the film to be pasted are separated from the heating platform, removing the film and the film to be pasted out of the cavity. , And then heat the adhesive again until it is more cured. The vacuum filming method according to claim 8 or 9, wherein the film sheet includes a quantum dot fluorescent film sheet, and the film-to-be-adhered piece includes a light-transmitting substrate. The vacuum filming method according to claim 8 or 9, wherein the film sheet includes a fluorescent film sheet, and the film-to-be-laminated part includes a flip-chip light-emitting semiconductor wafer array, and the flip-chip light-emitting semiconductor wafer array includes a A substrate and a plurality of flip-chip light emitting diode wafers disposed on the substrate. The vacuum filming method according to claim 13, wherein the flip-chip light-emitting semiconductor wafer array further includes a plurality of reflective structures, which are respectively disposed beside the flip-chip light-emitting semiconductor wafers.