TWI650238B - Vacuum filming device and method - Google Patents

Vacuum filming device and method Download PDF

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Publication number
TWI650238B
TWI650238B TW106101525A TW106101525A TWI650238B TW I650238 B TWI650238 B TW I650238B TW 106101525 A TW106101525 A TW 106101525A TW 106101525 A TW106101525 A TW 106101525A TW I650238 B TWI650238 B TW I650238B
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film
vacuum
plate
module
diaphragm
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TW106101525A
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Chinese (zh)
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TW201827234A (en
Inventor
傑 陳
廖俊旭
吳秉霖
王秀文
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行家光電股份有限公司
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Priority to TW106101525A priority Critical patent/TWI650238B/en
Priority to US15/863,761 priority patent/US10730276B2/en
Priority to EP18150691.6A priority patent/EP3348400B1/en
Priority to KR1020180005324A priority patent/KR102111112B1/en
Priority to JP2018005468A priority patent/JP6833737B2/en
Publication of TW201827234A publication Critical patent/TW201827234A/en
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Publication of TWI650238B publication Critical patent/TWI650238B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0008Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/422Luminescent, fluorescent, phosphorescent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00Treatment by energy or chemical effects
    • B32B2310/14Corona, ionisation, electrical discharge, plasma treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)

Abstract

本發明提出一真空貼膜裝置,其包含一真空腔室模組、一壓膜模組、一承載模組及一加熱平台,其中壓膜模組包含一壓膜板,承載模組包含一承載盤及一彈簧器件。該真空裝置於貼膜作動時,壓膜板向下壓膜而致動承載盤至加熱平台以加熱膜片使接合膠固化貼合,加熱結束後,壓膜板開始向上移動,此時彈簧器件可由先前壓合時所儲存之彈簧位能釋放,並將承載盤向上致動使其回復至原初始位置。本發明另提出一真空貼模方法,其與上述真空貼膜裝置皆可減少膜片與待貼膜件之間因氣泡所產生之貼合缺陷,並提升膜片與待貼膜件之間的接合力。 The invention proposes a vacuum film sticking device, which includes a vacuum chamber module, a film pressing module, a carrying module and a heating platform, wherein the film pressing module includes a film pressing plate, and the bearing module includes a bearing disk And a spring device. In the vacuum device, when the film is activated, the film pressing plate presses the film downwards to actuate the carrier plate to the heating platform to heat the film to solidify the bonding glue. After the heating is completed, the film pressing plate starts to move upward. The spring position stored during the previous compression can be released and the carrier plate can be actuated upward to return it to its original initial position. The invention also proposes a vacuum die-casting method, which can reduce the bonding defects caused by air bubbles between the diaphragm and the film-to-be-adhered component, and improve the bonding force between the diaphragm and the film-to-be-adhered component.

Description

真空貼膜裝置及方法    Vacuum filming device and method   

本發明有關一種貼膜裝置及方法,特別關於一種真空貼膜裝置及方法。 The invention relates to a film sticking device and method, in particular to a vacuum film sticking device and method.

在電子產業中,常需要將各類軟性或硬性膜片貼合於半導體元件、電路元件(電阻或電容器等)或液晶顯示面板等電子器件上,以賦予該些電子器件特定之功能,或達到保護電子器件、使電子器件防水等目的。 In the electronics industry, it is often necessary to attach various types of soft or hard diaphragms to electronic components such as semiconductor elements, circuit elements (resistors or capacitors), or liquid crystal display panels to give these electronic devices specific functions or Protect electronic devices and make them waterproof.

除提供保護或防水功能之外,軟性或硬性膜片(例如樹脂膜片)亦可被製作成具有透光、半透光或光轉換等性質之光學膜片。舉例而言,膜片可被加入染料、光散射微粒、螢光材料等物質,以獲得所需的濾光、顏色轉換、增亮或均勻擴散等光學性質,使得膜片可作為濾光膜、螢光膜、增亮膜或擴散膜等光學膜片。將此類光學膜片貼合至各種不同之光學電子器件上,以達到電子器件所需之光學特性。 In addition to providing protection or waterproof functions, soft or rigid films (such as resin films) can also be made into optical films with properties such as light transmission, semi-light transmission, or light conversion. For example, the film can be added with dyes, light-scattering particles, fluorescent materials and other materials to obtain the desired optical properties such as filtering, color conversion, brightening or uniform diffusion, so that the film can be used as a filter film, Optical film such as fluorescent film, brightness enhancement film or diffusion film. This type of optical film is bonded to a variety of different optoelectronic devices to achieve the optical characteristics required by electronic devices.

其中,將螢光材料(例如量子點「quantum dots」或螢光粉)加入樹脂材料而形成具色彩轉換功能之螢光膜片,可與發光二極體(LED)光源搭配使用,應用於下世代顯示器。或者,將具有色彩轉換功能之螢光膜片直接貼合於藍光LED晶片上,以製作成白光LED等封裝體,可使封裝體 具有良好的光電特性及優異的產品性能。 Among them, fluorescent materials (such as quantum dots or fluorescent powders) are added to resin materials to form fluorescent film with color conversion function, which can be used in conjunction with light-emitting diode (LED) light sources and applied to the following Generation display. Alternatively, a fluorescent film having a color conversion function is directly bonded to a blue LED chip to make a package such as a white LED, so that the package can have good photoelectric characteristics and excellent product performance.

以搭配LED光源使用之螢光膜片為例,將螢光膜片貼合至LED晶片的方式大致可分為「晶片級(die level)貼合」與「晶圓級(wafer level)貼合」兩種類別,其說明如下。 Taking the fluorescent film used with the LED light source as an example, the method of bonding the fluorescent film to the LED chip can be roughly divided into "die level bonding" and "wafer level bonding." The two categories are explained below.

「晶片級貼合」是將尺寸上對應於單一個LED晶片大小的螢光膜片貼合至LED晶片上。由於螢光膜片之尺寸較小且剛好對應於LED晶片之尺寸,需要高精密度的貼膜機(或貼片機)才能使螢光膜片準確地貼合至LED晶片上。然而,由於需要高精密度的貼片機,故「晶片級貼合」的設備成本高;此外,由於必須準確地對位,且須將單一螢光膜片逐一貼合至單一LED晶片,導致製程困難,造成「晶片級貼合」的貼合良率與生產效率較低。 "Wafer level bonding" is the bonding of a fluorescent film whose size corresponds to the size of a single LED chip to the LED chip. Since the size of the fluorescent film is small and just corresponds to the size of the LED chip, a high-precision laminating machine (or placement machine) is required to accurately attach the fluorescent film to the LED chip. However, because of the need for a high-precision placement machine, the cost of "wafer-level bonding" equipment is high; in addition, because it must be accurately aligned and a single fluorescent film must be bonded to a single LED chip one by one, The manufacturing process is difficult, resulting in a low wafer yield and production efficiency.

「晶圓級貼合」則是將尺寸上可對應於多個LED晶片的一螢光膜片一次貼合至多個LED晶片上。「晶圓級貼合」不須高對位精密度,且一次可對多個LED晶片進行批次貼膜,故其設備成本低,且生產效率高。 "Wafer-level bonding" is the bonding of a fluorescent film that can correspond to multiple LED chips in size to multiple LED chips at one time. "Wafer-level bonding" does not require high alignment precision, and multiple LED chips can be filmed in batches at the same time, so its equipment cost is low and production efficiency is high.

由上可知,在設備成本及生產效率上,「晶圓級貼合」皆較具優勢。然而,「晶圓級貼合」將尺寸較大之膜片貼合於待貼膜件的過程中,容易因為膜片的厚度不均、貼合時的角度偏差、膜片表面特性不佳等因素,導致膜片與待貼膜件之間產生氣泡殘留於接合膠中,造成貼合缺陷,進而降低生產良率。再者,膜片與待貼膜件貼合時具有一定的步驟,通常會先塗佈一接合膠於兩者的至少一接合面上,再施予壓合力,使兩接合面可透過接合膠初步貼合,爾後,接合膠被加熱而固化,使得膜片與待貼膜件穩固地貼合。然而,若未使用適當之貼合設備與貼膜程序,膜片與待貼膜件 在完全貼合前,接合膠已被預先加熱而部分固化,膜片與待貼膜件之間的接合強度將受影響,造成貼合不良。 It can be seen from the above that "wafer-level bonding" has advantages in terms of equipment cost and production efficiency. However, in the process of "wafer-level bonding", the larger-sized film is bonded to the film to be bonded. It is easy to be caused by uneven thickness of the film, angular deviation during bonding, and poor surface characteristics of the film. , Resulting in air bubbles remaining between the film and the film to be pasted in the bonding glue, causing bonding defects, thereby reducing the production yield. Furthermore, there is a certain step when the film sheet is bonded to the film to be pasted. Generally, a bonding adhesive is first applied to at least one of the bonding surfaces of the two, and then a pressing force is applied so that the two bonding surfaces can pass through the bonding adhesive. Laminating, and thereafter, the adhesive is heated to be cured, so that the film is firmly attached to the film to be pasted. However, if the appropriate bonding equipment and filming procedures are not used, before the film and the film to be pasted are fully bonded, the bonding adhesive has been preheated and partially cured, and the bonding strength between the film and the film to be pasted will be affected. , Resulting in poor fit.

有鑒於此,如何提供一有效益之真空裝置與適當貼膜方法,以改善上述的缺失,為業界待解決的問題。 In view of this, how to provide an effective vacuum device and an appropriate filming method to improve the above-mentioned defects is a problem to be solved in the industry.

本發明之一目的在於提供一種真空貼膜裝置及方法,其可改善膜片與待貼膜件之間因氣泡所產生之貼合缺陷,其真空貼膜裝置可先將膜片完全密合於待貼膜件上,再將接合膠進行加熱固化,藉此可具有較佳的貼合品質與生產良率。 An object of the present invention is to provide a vacuum filming device and method, which can improve the bonding defect caused by air bubbles between a film sheet and a film to be filmed. The vacuum film filming device can completely adhere the film sheet to the film to be filmed first. Then, the bonding glue is heated and cured, so that it can have better bonding quality and production yield.

本發明之又一目的在於提供一種真空貼膜裝置及方法,其可實現「晶圓級貼合」,藉此具有較低的設備成本、及/或較佳的生產效率。 Yet another object of the present invention is to provide a vacuum film bonding device and method, which can realize "wafer-level bonding", thereby having lower equipment cost and / or better production efficiency.

為達上述之至少一目的,本發明所揭露的真空貼膜裝置包含:一真空腔室模組、一壓膜模組、一承載模組及一加熱平台。真空腔室模組包含一腔體,腔體定義有一容置空間,容置空間內的壓力可被設定控制;壓膜模組連接並貫穿該腔體、且包含一壓膜板,壓膜板可由腔體外之致動器作動,使其可於容置空間內垂直地移動;承載模組設置於容置空間內,且包含一承載盤及一彈簧器件,其中承載盤設置於彈簧器件上,且具有一初始位置,承載盤在壓膜程序開始而致動前係與壓膜板保持一初始距離;加熱平台亦設置於容置空間內、並與壓膜程序開始而致動前的承載盤保持一初始距離;其中,承載盤係設置成可於容置空間內被壓膜板向下壓膜而致動者,彈簧器件係設置成可於承載盤被向下壓膜而致動時儲存一彈簧位能,加熱平台係設置成可支撐被壓膜而致動後的承載盤,以加熱承載 盤,使膜片與待貼膜件間之接合膠固化接合,於膜片與待貼膜件完成貼合後,壓膜板將向上移動,該彈簧器件可由先前壓合時儲存之彈簧位能釋放,而將承載盤向上致動並回復至初始位置。 In order to achieve at least one of the above objects, the vacuum film sticking device disclosed in the present invention includes: a vacuum chamber module, a film pressing module, a carrying module and a heating platform. The vacuum chamber module includes a cavity, and the cavity defines an accommodating space, and the pressure in the accommodating space can be set and controlled; the lamination module is connected to and penetrates the cavity, and includes a film pressing plate and a film pressing plate. It can be actuated by an actuator outside the cavity so that it can move vertically in the accommodating space; the bearing module is arranged in the accommodating space and includes a bearing plate and a spring device, wherein the bearing plate is arranged on the spring device, And has an initial position, the carrier plate is maintained at an initial distance from the film lamination plate before the film lamination procedure starts and is activated; the heating platform is also arranged in the accommodating space and is before the film lamination program starts and is activated Maintain an initial distance; wherein, the carrier plate is arranged to be actuated by the pressing plate in the accommodation space by being pressed down by the film plate, and the spring device is arranged to be stored when the carrier plate is actuated by the pressing down of the film. A spring-position energy, heating platform is set to support the carrier plate which is actuated by the pressed film to heat the carrier plate, so that the bonding glue between the film sheet and the film to be pasted is cured, and the film sheet and the film to be pasted are completed. After lamination, the lamination plate will move up The spring device can be released by the spring position energy stored in the previous compression, and the carrier plate is actuated upward and returned to the initial position.

為達上述之至少一目的,本發明另揭露的真空貼膜方法包含:使一膜片與一待貼膜件於一腔體之一容置空間內保持分離,其中膜片及待貼膜件之至少其中一者上已設置有一接合膠;使容置空間抽氣至一真空狀態;在真空狀態下,致動膜片或待貼膜件,使膜片與待貼膜件經由接合膠相貼合;以及持續致動貼合後之膜片與待貼膜件,使其移動一距離後,始被一加熱平台支撐,其中接合膠被加熱台加熱而固化。 In order to achieve at least one of the above-mentioned objectives, the vacuum filming method disclosed in the present invention includes: maintaining a film and a film-to-be-adhered piece in an accommodation space of a cavity, wherein at least one of the film and the film-to-be-adhered piece is to be separated. One has been provided with a bonding glue; the accommodating space is evacuated to a vacuum state; in the vacuum state, the diaphragm or the film to be pasted is actuated so that the diaphragm and the film to be pasted are bonded together via the adhesive; and The actuated film and the film to be pasted are actuated to move a distance, and then they are supported by a heating platform, wherein the bonding glue is heated and cured by the heating table.

藉此,本發明之真空貼膜裝置及方法至少可提供以下有益效果:1.可提供一真空環境來供膜片與待貼膜件貼合,以減少膜片與待貼膜件之間所產生的氣泡缺陷,藉此提高貼合之氣密度,進而提升貼膜的良率;2.可提供一初始距離來使膜片與待貼膜件在貼合前,兩者間的接合膠不被加熱平台預熱,藉此避免接合膠提早固化而降低接合強度,進而提升貼膜的品質與良率;及3.可對包含複數個晶片等元件的待貼膜件進行一次貼膜,得以實現出「晶圓級貼合」。 Therefore, the vacuum filming device and method of the present invention can provide at least the following beneficial effects: 1. A vacuum environment can be provided for the film to be attached to the film to be pasted, so as to reduce air bubbles generated between the film and the film to be pasted Defects, thereby increasing the gas density of the lamination, thereby improving the yield of the lamination film; 2. An initial distance can be provided to prevent the adhesive between the diaphragm and the film to be laminated before being heated by the heating platform In order to avoid premature curing of the bonding adhesive and reduce the bonding strength, thereby improving the quality and yield of the film; and 3. One-time filming of the film to be filmed including a plurality of wafers and other components can be achieved to achieve "wafer level bonding ".

為讓上述目的、技術特徵及優點能更明顯易懂,下文係以較佳之實施例配合所附圖式進行詳細說明。 In order to make the above-mentioned objects, technical features, and advantages more comprehensible, the following describes in detail the preferred embodiments in combination with the accompanying drawings.

10‧‧‧真空貼膜裝置 10‧‧‧Vacuum film device

100‧‧‧真空腔室模組 100‧‧‧vacuum chamber module

110‧‧‧腔體 110‧‧‧ Cavity

110A‧‧‧容置空間 110A‧‧‧accommodation space

111‧‧‧頂板 111‧‧‧Top plate

112‧‧‧底板 112‧‧‧ floor

113‧‧‧側板 113‧‧‧Side

114‧‧‧開口側 114‧‧‧ open side

115‧‧‧致動器 115‧‧‧Actuator

116‧‧‧活動門 116‧‧‧Event Gate

120‧‧‧氣密滑動軸承 120‧‧‧Airtight Sliding Bearing

121‧‧‧軸向貫穿孔 121‧‧‧ axial through hole

122‧‧‧密封件 122‧‧‧seals

130‧‧‧真空系統之控制器件 130‧‧‧Control device for vacuum system

131‧‧‧真空氣壓感測器 131‧‧‧Vacuum pressure sensor

132‧‧‧抽真空控制閥 132‧‧‧Vacuum control valve

133‧‧‧大氣氣壓感測器 133‧‧‧ Atmospheric Pressure Sensor

134‧‧‧破抽真空控制閥 134‧‧‧break vacuum control valve

135‧‧‧真空幫浦 135‧‧‧Vacuum Pump

136‧‧‧破真空氣壓源 136‧‧‧Vacuum pressure source

137‧‧‧管線 137‧‧‧ pipeline

200‧‧‧壓膜模組 200‧‧‧Laminated Module

210‧‧‧壓膜板 210‧‧‧Laminated sheet

211‧‧‧上部 211‧‧‧upper

212‧‧‧下部 212‧‧‧lower

220‧‧‧垂直移動桿 220‧‧‧Vertical moving lever

221‧‧‧上端 221‧‧‧Top

222‧‧‧下端 222‧‧‧ bottom

230‧‧‧致動器 230‧‧‧Actuator

240‧‧‧球面軸承 240‧‧‧ spherical bearing

300‧‧‧承載模組 300‧‧‧bearing module

310‧‧‧承載盤 310‧‧‧carry tray

311‧‧‧貫穿孔 311‧‧‧through hole

312‧‧‧凹槽 312‧‧‧groove

320‧‧‧彈簧器件 320‧‧‧ spring device

321‧‧‧柱體 321‧‧‧ cylinder

322‧‧‧彈簧 322‧‧‧Spring

330‧‧‧滑軌器件 330‧‧‧Slide device

331‧‧‧固定部 331‧‧‧Fixed section

332‧‧‧滑動部 332‧‧‧Sliding section

340‧‧‧定位感測器 340‧‧‧Positioning sensor

350‧‧‧膜片感測器 350‧‧‧ diaphragm sensor

400‧‧‧加熱平台 400‧‧‧Heating platform

410‧‧‧溫度感測器 410‧‧‧Temperature sensor

500‧‧‧控制模組 500‧‧‧control module

510‧‧‧程序控制器 510‧‧‧program controller

520‧‧‧指令輸入裝置 520‧‧‧command input device

530‧‧‧溫度控制器 530‧‧‧Temperature Controller

540‧‧‧位置與推力控制器 540‧‧‧Position and Thrust Controller

600‧‧‧膜片、光學膜片 600‧‧‧ diaphragm, optical diaphragm

601‧‧‧表面 601‧‧‧ surface

650‧‧‧接合膠 650‧‧‧Adhesive

700‧‧‧待貼膜件 700‧‧‧ to be filmed

700A、700B‧‧‧發光半導體晶片陣列 700A, 700B‧‧‧‧Light-emitting semiconductor wafer array

700C‧‧‧透光基板 700C‧‧‧Transparent substrate

701‧‧‧表面 701‧‧‧ surface

710‧‧‧基材 710‧‧‧ substrate

720‧‧‧發光二極體晶片 720‧‧‧light-emitting diode chip

730‧‧‧反射結構 730‧‧‧Reflective structure

800‧‧‧膜片保持件 800‧‧‧ diaphragm holder

811‧‧‧軟性膜 811‧‧‧soft film

812‧‧‧支撐框 812‧‧‧Support frame

D1~D3‧‧‧初始距離 D1 ~ D3‧‧‧ Initial distance

Z‧‧‧垂直軸向 Z‧‧‧ vertical axis

20‧‧‧真空貼膜方法 20‧‧‧Vacuum film method

S201~S213‧‧‧步驟 S201 ~ S213‧‧‧step

第1圖為依據本發明之一較佳實施例之真空貼膜裝置之立體圖。 FIG. 1 is a perspective view of a vacuum film sticking device according to a preferred embodiment of the present invention.

第2圖為第1圖所示之真空貼膜裝置之活動門開啟且承載盤滑出之立體圖。 Fig. 2 is a perspective view of the movable door of the vacuum film device shown in Fig. 1 opened and the carrier tray sliding out.

第3圖為第1圖所示之真空腔室模組之立體圖。 Figure 3 is a perspective view of the vacuum chamber module shown in Figure 1.

第4圖為第1圖所示之氣密滑動軸承之平面圖。 Fig. 4 is a plan view of the air-tight sliding bearing shown in Fig. 1.

第5圖為第1圖所示之壓膜模組之平面圖。 Fig. 5 is a plan view of the lamination module shown in Fig. 1.

第6A圖為第1圖所示之真空貼膜裝置的部分元件之平面圖。 Fig. 6A is a plan view of some components of the vacuum film-applying device shown in Fig. 1.

第6B圖為第6A圖之局部放大詳圖。 Fig. 6B is a partial enlarged detailed view of Fig. 6A.

第7A圖及第7B圖為第1圖所示之壓膜板接觸膜片或承載盤之平面示意圖。 FIG. 7A and FIG. 7B are schematic plan views of a film contact plate or a carrier plate shown in FIG. 1.

第8圖為第1圖所示之真空貼膜裝置之控制模組的功能方塊圖。 Fig. 8 is a functional block diagram of a control module of the vacuum film-applying device shown in Fig. 1.

第9A圖至第15B圖為藉由第1圖所示之真空貼膜裝置所實現出之一真空貼膜製程之各階段之示意圖。 FIG. 9A to FIG. 15B are schematic diagrams of each stage of a vacuum filming process realized by the vacuum filming device shown in FIG. 1.

第16A圖為大氣壓力下之貼膜測試結果。 Figure 16A shows the results of the film test at atmospheric pressure.

第16B圖為採用真空貼膜製程之貼膜測試結果。 Figure 16B shows the results of the film test using the vacuum film process.

第17圖為依據本發明之另一較佳實施例之真空貼膜方法的步驟流程圖。 FIG. 17 is a flowchart of steps of a vacuum filming method according to another preferred embodiment of the present invention.

請參閱第1圖至第3圖所示,其為依據本發明之一較佳實施例之真空貼膜裝置10的示意圖,其中第1及2圖未顯示腔體110的頂板111,以便審視真空貼膜裝置10之內部結構。真空貼膜裝置10可包含一真 空腔室模組100、一壓膜模組200、一承載模組300及一加熱平台400,該些元件的技術內容依序說明如下。 Please refer to FIG. 1 to FIG. 3, which are schematic diagrams of a vacuum filming device 10 according to a preferred embodiment of the present invention, in which FIG. 1 and FIG. 2 do not show the top plate 111 of the cavity 110 in order to examine the vacuum filming. The internal structure of the device 10. The vacuum film sticking device 10 may include a vacuum chamber module 100, a film pressing module 200, a carrying module 300, and a heating platform 400. The technical contents of these elements are described in order below.

真空腔室模組100可提供一真空環境來供真空貼膜進行,其在構造上可包含一腔體110、一氣密滑動軸承120及一真空系統之控制器件130,氣密滑動軸承120與控制器件130皆設置於腔體110上。 The vacuum chamber module 100 can provide a vacuum environment for vacuum filming. The structure can include a cavity 110, an air-tight sliding bearing 120, and a control device 130 of a vacuum system. The air-tight sliding bearing 120 and the control device 130 are all disposed on the cavity 110.

具體而言,腔體110定義有一容置空間110A,其內的壓力為可控制者,也就是,容置空間110A的壓力可通過真空系統之控制器件130來控制其真空度。 Specifically, the cavity 110 defines an accommodating space 110A, and the pressure in the accommodating space 110A is controllable, that is, the pressure of the accommodating space 110A can be controlled by the vacuum device's control device 130.

腔體110結構上可包含一頂板111、一底板112、複數個側板113及一開口側114,頂板111及底板112為相對且相反地設置,側板113及開口側114形成於頂板111與底板112之間、且氣密地連接頂板111與底板112。頂板111、底板112、側板113及開口側114共同界定容置空間110A之範圍,而開口側114可使容置空間110A與腔體110之外部連通,故開口側114需閉合才得使容置空間110A為真空。 The cavity 110 may include a top plate 111, a bottom plate 112, a plurality of side plates 113, and an open side 114. The top plate 111 and the bottom plate 112 are opposite and opposite to each other. The side plate 113 and the open side 114 are formed on the top plate 111 and the bottom plate 112. The top plate 111 and the bottom plate 112 are hermetically connected between them. The top plate 111, the bottom plate 112, the side plate 113, and the open side 114 collectively define the range of the accommodation space 110A, and the open side 114 allows the accommodation space 110A to communicate with the outside of the cavity 110, so the open side 114 needs to be closed to allow accommodation. The space 110A is a vacuum.

因此,較佳地真空腔室模組110更包含有一致動器115及一活動門116來使開口側114閉合。致動器115可設置於側板113上,而活動門116可活動地設置於開口側114上、並與致動器115連接;致動器115(例如氣壓缸、液壓缸、馬達導螺桿組等)運作時,可使活動門116相對開口側114活動(旋轉、擺動或滑動等),以閉合開口側114。 Therefore, preferably, the vacuum chamber module 110 further includes an actuator 115 and a movable door 116 to close the open side 114. The actuator 115 may be disposed on the side plate 113, and the movable door 116 may be movably disposed on the open side 114 and connected to the actuator 115; the actuator 115 (such as a pneumatic cylinder, a hydraulic cylinder, a motor lead screw group, etc.) During operation, the movable door 116 can be moved (rotated, swung, or slid, etc.) relative to the open side 114 to close the open side 114.

於其他實施例中(圖未示),另一側板113可取代開口側114,而腔體110的頂板111為可活動者(例如頂板111可上掀及下蓋),藉此使容置空間110A與外部連通及隔離。 In other embodiments (not shown), the other side plate 113 can replace the open side 114, and the top plate 111 of the cavity 110 is movable (for example, the top plate 111 can be lifted and lowered), so as to make the accommodation space 110A is connected and isolated from the outside.

請配合參閱第4圖所示,氣密滑動軸承120可使後述的壓膜模組200的垂直移動桿220從外部進入腔體110內,且不會洩漏而破壞腔體110內之真空狀態。氣密滑動軸承120可插設於腔體110之頂板111(頂板111具有一對應的貫穿孔,圖未示),使得氣密滑動軸承120的一部分設置於頂板111之上方而位於容置空間110A之外,而另一部分設置於頂板111之下方而位於容置空間110A之內;氣密滑動軸承120亦可整體設置於頂板111之上方或下方(圖未示)。 Please refer to FIG. 4 for reference. The airtight sliding bearing 120 allows the vertical moving rod 220 of the lamination module 200 described later to enter the cavity 110 from the outside without leaking and damaging the vacuum state in the cavity 110. The air-tight sliding bearing 120 can be inserted into the top plate 111 of the cavity 110 (the top plate 111 has a corresponding through hole, not shown), so that a part of the air-tight sliding bearing 120 is disposed above the top plate 111 and is located in the accommodation space 110A. In addition, another part is disposed below the top plate 111 and is located within the accommodating space 110A; the air-tight sliding bearing 120 may also be disposed above or below the top plate 111 as a whole (not shown).

結構上,氣密滑動軸承120可包含一軸向貫穿孔121及一密封件122,軸向貫穿孔121與容置空間110A相連通,供垂直移動桿220通過而進入至容置空間110A內;密封件122(例如為O型橡膠軸封、磁性軸封、波紋管等)設置於軸向貫穿孔121內,且環繞垂直移動桿220,以阻隔氣體從垂直移動桿220與軸向貫穿孔121之間通過。 Structurally, the airtight sliding bearing 120 may include an axial through-hole 121 and a seal 122, and the axial through-hole 121 is in communication with the accommodation space 110A for the vertical moving rod 220 to pass into the accommodation space 110A; A seal 122 (for example, an O-shaped rubber shaft seal, a magnetic shaft seal, a bellows, etc.) is disposed in the axial through-hole 121 and surrounds the vertical moving rod 220 to block the gas from the vertical moving rod 220 and the axial through-hole 121 Pass between.

於其他實施例中(圖未示),若垂直移動桿220或壓膜模組200整體能設置於腔體110內,氣密滑動軸承120可省略設置。 In other embodiments (not shown), if the vertical moving rod 220 or the film pressing module 200 as a whole can be disposed in the cavity 110, the air-tight sliding bearing 120 can be omitted.

請復參閱第2圖及第3圖,真空系統之控制器件130可控制容置空間110A內的壓力,其可設置於腔體110之頂板111,也可設置於底板112、側板113等可與腔體110連接之位置。控制器件130可包含一真空氣壓感測器131、一抽真空控制閥132、一大氣氣壓感測器133及一破真空控制閥134,分別連接真空系統之一真空幫浦135及一破真空氣壓源136。 Please refer to FIG. 2 and FIG. 3 again. The control device 130 of the vacuum system can control the pressure in the accommodating space 110A. It can be arranged on the top plate 111 of the cavity 110, or on the bottom plate 112, the side plate 113, etc. The position where the cavity 110 is connected. The control device 130 may include a vacuum pressure sensor 131, a vacuum control valve 132, an atmospheric pressure sensor 133, and a vacuum control valve 134, which are respectively connected to a vacuum pump 135 and a vacuum pressure of a vacuum system. Source 136.

具體而言,真空幫浦135可設置於腔體110之外部,藉由一管線137依序連接抽真空控制閥132及真空氣壓感測器131,連通至容置空間110A中。當真空幫浦135運作及抽真空控制閥132開啟時(破真空氣壓 源136及破真空控制閥134為關閉),可使容置空間110A之壓力減小而形成真空狀態。真空氣壓感測器131可感測該真空狀態,若真空狀態達到設定值時,可透過後述的控制模組500來關閉抽真空控制閥132,也可進一步關閉真空幫浦135。 Specifically, the vacuum pump 135 may be disposed outside the cavity 110, and a vacuum control valve 132 and a vacuum pressure sensor 131 are sequentially connected through a line 137, and are connected to the accommodating space 110A. When the vacuum pump 135 is operated and the vacuum control valve 132 is opened (the vacuum pressure source 136 and the vacuum control valve 134 are closed), the pressure in the accommodation space 110A can be reduced to form a vacuum state. The vacuum pressure sensor 131 can sense the vacuum state. If the vacuum state reaches a set value, the vacuum control valve 132 can be closed through the control module 500 described later, and the vacuum pump 135 can be further closed.

破真空氣壓源136亦設置於腔體110外部,可藉由另一管線137依序連接破真空控制閥134及大氣氣壓感測器133,連通至容置空間110A中。當破真空氣壓源136及破真空控制閥134開啟(真空幫浦135及真空控制閥132為關閉),可提供空氣至容置空間110A而使壓力增加。大氣氣壓感測器133可感測容置空間110A內之壓力是否已達大氣壓力(或預設壓力),若是,可透過控制模組500來關閉破真空控制閥134,也可進一步關閉破真空氣壓源136。 The vacuum breaking pressure source 136 is also disposed outside the cavity 110, and can be connected to the vacuum breaking control valve 134 and the atmospheric pressure sensor 133 in sequence through another pipeline 137, and communicates with the accommodation space 110A. When the vacuum breaking pressure source 136 and the vacuum breaking control valve 134 are opened (the vacuum pump 135 and the vacuum control valve 132 are closed), air can be supplied to the accommodation space 110A to increase the pressure. The atmospheric pressure sensor 133 can sense whether the pressure in the accommodating space 110A has reached the atmospheric pressure (or a preset pressure). If so, the vacuum breaking control valve 134 can be closed through the control module 500, and the vacuum breaking can be further closed. Pressure source 136.

接著說明壓膜模組200之技術內容。請一併參閱第5圖(其顯示壓膜模組200的一側,而頂板111係以剖視表示),壓膜模組200可推壓一膜片600及一待貼膜件700(如第6B圖所示,詳參後述),使兩者得相貼合。於結構上壓膜模組200可包含一壓膜板210、一垂直移動桿220及一致動器230,致動器230可使垂直移動桿220移動,進而使壓膜板210於容置空間110A內垂直移動。 Next, the technical content of the lamination module 200 will be described. Please also refer to FIG. 5 (which shows one side of the lamination module 200, and the top plate 111 is shown in cross-section). The lamination module 200 can push a diaphragm 600 and a piece of film 700 (such as As shown in Figure 6B, see below for details), so that the two fit together. On the structure, the lamination module 200 may include a lamination plate 210, a vertical moving rod 220, and an actuator 230. The actuator 230 may move the vertical moving rod 220, so that the laminating plate 210 is in the accommodating space 110A. Move vertically inside.

具體而言,壓膜板210設置於腔體110之容置空間110A內,而垂直移動桿220可包含一上端221及一下端222,上端221位於頂板111之上方及容置空間110A外,下端222位於頂板111之下方及容置空間110A內,而壓膜板210可設置於下端222。由此可知,垂直移動桿220之中間部分係穿過頂板111,且可滑動地設置於前述的氣密滑動軸承120中。 Specifically, the film pressing plate 210 is disposed in the accommodation space 110A of the cavity 110, and the vertical moving rod 220 may include an upper end 221 and a lower end 222. The upper end 221 is located above the top plate 111 and outside the accommodation space 110A. 222 is located below the top plate 111 and in the accommodating space 110A, and the film pressing plate 210 may be disposed at the lower end 222. It can be seen that the middle portion of the vertical moving rod 220 passes through the top plate 111 and is slidably disposed in the aforementioned airtight sliding bearing 120.

致動器230可設置於頂板111上,且與垂直移動桿220之上端221連接,用以驅動垂直移動桿220,使其沿一垂直軸向Z運動,而壓膜板210可隨著垂直移動桿220在容置空間110A內移動。致動器230可為馬達導螺桿滑軌組、線性馬達滑軌組、氣壓缸組、液壓缸組或連桿滑塊組等可提供至少一垂直方向(或一自由度)之運動組件。 The actuator 230 may be disposed on the top plate 111 and connected to the upper end 221 of the vertical moving rod 220 to drive the vertical moving rod 220 to move along a vertical axis Z, and the film pressing plate 210 may move with the vertical The lever 220 moves in the accommodation space 110A. The actuator 230 may be a moving component such as a motor lead screw group, a linear motor group, a pneumatic cylinder group, a hydraulic cylinder group, or a link slider group, which can provide at least one vertical direction (or one degree of freedom).

較佳地,壓膜板210可包含一上部211及下部212,上部211設置於垂直移動桿220之下端222,下部212設置於上部211之下。上部211具有足夠之剛性,故不易彎曲變形,而下部212以軟性材料(例如樹脂、橡膠等)製成,以作為一緩衝層。如此,壓膜板210在推壓膜片600及待貼膜件700時,上部211可承受來自垂直移動桿220之力量而不變形,而作為緩衝層的下部212可使該力量較均勻地作用於膜片600及待貼膜件700上,可提升貼合品質,並可減少力量集中而造成膜片600及/或待貼膜件700損壞的可能性。 Preferably, the film pressing plate 210 may include an upper portion 211 and a lower portion 212. The upper portion 211 is disposed at the lower end 222 of the vertical moving rod 220, and the lower portion 212 is disposed below the upper portion 211. The upper portion 211 has sufficient rigidity, so it is not easy to bend and deform, and the lower portion 212 is made of a soft material (such as resin, rubber, etc.) as a buffer layer. In this way, when the film pressing plate 210 presses the film 600 and the film to be attached 700, the upper portion 211 can withstand the force from the vertical moving rod 220 without deformation, and the lower portion 212 as a buffer layer can make the force more uniformly act on The film 600 and the film-to-be-adhered piece 700 can improve the bonding quality, and can reduce the possibility of damage to the film 600 and / or the film-to-be-attached piece 700 due to the concentration of force.

接著說明承載模組300之技術內容。請一併參閱第6A圖及第6B圖,承載模組300可承載膜片600及待貼膜件700,其中膜片600及待貼膜件700可相互對換位置,並設置於容置空間110A中,且結構上可包含一承載盤310、一彈簧器件320及一滑軌器件330;承載盤310可移動地設置於彈簧器件320上,彈簧器件320設置於滑軌器件330上。 Next, the technical content of the carrier module 300 will be described. Please refer to FIG. 6A and FIG. 6B together. The carrier module 300 can carry the diaphragm 600 and the film-to-be-adhered piece 700, wherein the diaphragm 600 and the film-to-be-adhered piece 700 can be swapped with each other and set in the accommodation space 110A The structure may include a carrier plate 310, a spring device 320, and a slide rail device 330. The carrier plate 310 is movably disposed on the spring device 320, and the spring device 320 is disposed on the slide rail device 330.

詳細而言,承載盤310可供膜片600及待貼膜件700放置於其上,且可為一板體、並形成有複數個貫穿孔311。彈簧器件320可具有複數個柱體321及複數個彈簧322,柱體321穿過貫穿孔311,而彈簧322套設於柱體321上,且彈簧322之一端連接承載盤310。彈簧322可為壓縮彈 簧或拉伸彈簧,在不被施加任何外力時(未開始貼膜製程時),承載盤310可於彈簧322上具有一初始位置,且承載盤310此時與壓膜板210沿著垂直軸向Z保持一初始距離D1,兩者並不相接觸。 In detail, the carrier plate 310 can be used to place the film sheet 600 and the film-to-be-adhered member 700 thereon, and can be a plate body and formed with a plurality of through holes 311. The spring device 320 may have a plurality of posts 321 and a plurality of springs 322. The posts 321 pass through the through hole 311, and the spring 322 is sleeved on the post 321, and one end of the spring 322 is connected to the bearing plate 310. The spring 322 may be a compression spring or a tension spring. When no external force is applied (when the film-laminating process is not started), the carrier plate 310 may have an initial position on the spring 322, and the carrier plate 310 and the pressure plate 210 are at this time. An initial distance D1 is maintained along the vertical axis Z, and the two are not in contact with each other.

滑軌器件330可具有一固定部331及一滑動部332,固定部331固定地設置於腔體110內,而滑動部332可滑動地設置於固定部331上。彈簧器件320之柱體321固定地設置於滑動部332上,使得承載盤310及彈簧器件320可隨著滑動部332於容置空間110A內水平地滑動(水平軸向係垂直於垂直軸向Z)。此外,當開口側114未被活動門116閉合時,承載盤310可滑動至腔體110外,供使用者將膜片600及待貼膜件700於貼膜前放置於承載盤310上或貼膜後將其取出。 The slide rail device 330 may have a fixed portion 331 and a sliding portion 332. The fixed portion 331 is fixedly disposed in the cavity 110, and the sliding portion 332 is slidably disposed on the fixed portion 331. The cylinder 321 of the spring device 320 is fixedly disposed on the sliding portion 332, so that the bearing plate 310 and the spring device 320 can slide horizontally with the sliding portion 332 in the accommodation space 110A (the horizontal axis is perpendicular to the vertical axis Z ). In addition, when the open side 114 is not closed by the movable door 116, the carrier plate 310 can slide out of the cavity 110 for the user to place the diaphragm 600 and the film-to-be-adhered member 700 on the carrier plate 310 before or after the film is applied. It's removed.

膜片600可先設置於一膜片保持件800上,再通過膜片保持件800間接地放置於承載盤310上,而承載盤310可具有一凹槽312來容置待貼膜件700,使得膜片600與待貼膜件700相隔一初始距離D2。膜片保持件800包含一軟性膜(或稱可撓性膜,例如晶圓切割膠膜或藍膜)811及一支撐框812,軟性膜811設置於支撐框812上。軟性膜811本身具有黏性,故膜片600可黏於軟性膜811上、且被支撐框812圍繞。 The diaphragm 600 may be first disposed on a diaphragm holder 800, and then indirectly placed on the carrier plate 310 through the diaphragm holder 800, and the carrier plate 310 may have a groove 312 to receive the to-be-adhered member 700 so that The diaphragm 600 is separated from the to-be-adhered piece 700 by an initial distance D2. The diaphragm holder 800 includes a flexible film (also referred to as a flexible film, such as a wafer dicing film or a blue film) 811 and a support frame 812. The flexible film 811 is disposed on the support frame 812. The flexible film 811 itself is sticky, so the diaphragm 600 can be adhered to the flexible film 811 and surrounded by the support frame 812.

承載模組300較佳地包含一定位感測器340(如第1圖所示)及一膜片感測器350。定位感測器340可感測承載盤310是否滑動至壓膜板210之下方,故其位於承載盤310之滑動路徑上或周圍,且可為光遮斷開關、近接開關、磁簧開關、反射式光收發開關等以非接觸方式感測承載盤310之位置,亦可為極限開關等以接觸方式來感測承載盤310之位置。膜片感測器350可感測膜片600(或膜片保持件800)是否放置於承載盤310上, 故其位於承載盤310之上方。 The carrying module 300 preferably includes a positioning sensor 340 (as shown in FIG. 1) and a diaphragm sensor 350. The positioning sensor 340 can sense whether the carrier plate 310 slides below the lamination plate 210, so it is located on or around the slide path of the carrier plate 310, and can be a light interrupt switch, a proximity switch, a reed switch, a reflection The optical transceiver switch and the like sense the position of the carrier plate 310 in a non-contact manner, and the limit switch and the like can also sense the position of the carrier plate 310 in a contact manner. The diaphragm sensor 350 can detect whether the diaphragm 600 (or the diaphragm holder 800) is placed on the carrier plate 310, and therefore it is located above the carrier plate 310.

於其他實施例中(圖未示),承載盤310及彈簧器件320可固定於容置空間110A內,不需滑動,故滑軌器件330及定位感測器340可省略。另外,膜片感測器350亦可省略。 In other embodiments (not shown), the carrier plate 310 and the spring device 320 can be fixed in the accommodating space 110A without sliding, so the slide rail device 330 and the positioning sensor 340 can be omitted. In addition, the diaphragm sensor 350 may be omitted.

接著說明加熱平台400之技術內容。請復參閱第2圖及第6A圖,加熱平台400可由陶瓷或金屬等耐熱材料製成,並可利用電氣加熱、紅外線加熱、感應加熱等方式,使其維持一高溫狀態,並可藉由一溫度感測器410感測加熱平台400之溫度。加熱平台400設置於容置空間110A中,位在承載盤310之下方,且在壓膜板210於壓膜程序開始而向下致動承載盤310前,加熱平台400與承載盤310保持一初始距離D3,兩者並不相接觸。 Next, the technical contents of the heating platform 400 will be described. Please refer to FIG. 2 and FIG. 6A again, the heating platform 400 may be made of heat-resistant materials such as ceramics or metal, and may use electric heating, infrared heating, induction heating, etc. to maintain a high temperature state. The temperature sensor 410 senses the temperature of the heating platform 400. The heating platform 400 is disposed in the accommodating space 110A, under the carrier plate 310, and before the pressing plate 210 starts to actuate the carrier plate 310 downward at the start of the laminating process, the heating platform 400 and the carrier plate 310 maintain an initial The distance D3, the two are not in contact.

由上述可知,壓膜板210、承載盤310及加熱平台400皆設置於容置空間110A內,並沿著垂直軸向Z依序地設置,壓膜板210位於承載模組300之上,加熱平台400位於承載盤310之下,且三者在真空貼膜製程尚未進行前保持各自的初始距離。 From the above, it can be known that the film pressing plate 210, the carrier plate 310 and the heating platform 400 are all disposed in the accommodation space 110A and are sequentially arranged along the vertical axis Z. The film pressing plate 210 is located on the carrier module 300 and is heated. The platforms 400 are located under the carrier plate 310, and the three maintain their respective initial distances before the vacuum filming process is performed.

當真空貼膜製程開始,壓膜板210可向下移動,以致動承載盤310至膜片600與待貼膜件700完成真空貼合;接著,承載盤310將繼續向下致動一初始距離D3後,始被加熱平台400支撐及加熱,如此,接合膠可於真空貼合完成後始被加熱固化,因而避免接合膠於真空貼合前被預先加熱固化,造成貼合黏著強度不足;此時,彈簧器件320之彈簧322會受承載盤310之擠壓(或拉伸)而儲存一彈簧位能。於接合膠加熱固化完畢時,壓膜板210將向上移動,此時,彈簧器件320可由先前向下壓合時 所儲存之彈簧位能釋放並作用於承載盤310上,將承載盤310向上致動使其回復至初始位置。如此,可經由本發明所揭露之一真空貼膜裝置,依序先完成真空貼合,再完成加熱固化之步驟。 When the vacuum film-laminating process starts, the film pressing plate 210 can be moved downward to actuate the carrier plate 310 to complete the vacuum bonding of the diaphragm 600 and the film-to-be-adhered component 700; then, the carrier plate 310 will continue to actuate downward for an initial distance D3 It is initially supported and heated by the heating platform 400. In this way, the adhesive can be heated and cured after the vacuum bonding is completed, thus avoiding the adhesive being heated and cured in advance before the vacuum bonding, resulting in insufficient bonding adhesive strength; at this time, The spring 322 of the spring device 320 is compressed (or stretched) by the carrier plate 310 to store a spring potential. When the adhesive is heated and cured, the pressure plate 210 will move upwards. At this time, the spring device 320 can be released by the spring position energy stored in the previous downward pressing and act on the carrier plate 310. Move it back to its original position. In this way, a vacuum film bonding device disclosed in the present invention can be used to sequentially complete vacuum bonding and then heat curing.

請參閱第7A圖及第7B圖,壓膜模組200較佳地包含一球面軸承240,其設置於垂直移動桿220之下端222,而壓膜板210設置於球面軸承240而間接地設置於下端222。藉此,壓膜板210可相對於下端222進行二自由度之水平調整,以改善下述問題:壓膜板210及/或承載盤310本身未能水平設置,或是承載盤310上的膜片600或膜片保持件800未能水平放置時,壓膜板210可能僅有其中一側或一部分接觸到膜片600,導致壓力不均,造成貼合不良等。 Please refer to FIG. 7A and FIG. 7B. The laminating module 200 preferably includes a spherical bearing 240 which is disposed at the lower end 222 of the vertical moving rod 220, and the pressing plate 210 is disposed in the spherical bearing 240 and indirectly disposed in the spherical bearing 240. Lower end 222. With this, the lamination plate 210 can be adjusted with two degrees of freedom relative to the lower end 222 to improve the following problems: the lamination plate 210 and / or the carrier plate 310 itself cannot be horizontally installed, or the film on the carrier plate 310 When the sheet 600 or the membrane holder 800 cannot be placed horizontally, only one or a part of the pressing plate 210 may be in contact with the membrane 600, resulting in uneven pressure and poor bonding.

然而,藉由球面軸承240的設置,壓膜板210的一側接觸到膜片600後(如第7A圖),以該側為支點,壓膜板210可擺動使其另一側亦可接觸到膜片600(第7B圖),使得壓膜板210可較全面地接觸及壓膜而致動膜片600。 However, with the arrangement of the spherical bearing 240, after one side of the pressing plate 210 contacts the diaphragm 600 (as shown in FIG. 7A), using this side as a fulcrum, the pressing plate 210 can be swung so that the other side can also contact To the diaphragm 600 (FIG. 7B), the diaphragm 600 can contact and press the diaphragm more comprehensively to actuate the diaphragm 600.

請參閱第8圖,真空貼膜裝置10更可包含一控制模組500,以控制與協調真空腔室模組100、壓膜模組200、承載模組300及加熱平台400之作動,藉此自動化地實現真空貼膜製程。 Referring to FIG. 8, the vacuum film sticking device 10 may further include a control module 500 to control and coordinate the actions of the vacuum chamber module 100, the film pressing module 200, the carrying module 300 and the heating platform 400, thereby automating In order to realize the vacuum filming process.

控制模組500可包含一程序控制器510、指令輸入裝置520、溫度控制器530、位置與推力控制器540等與程序控制器510電性連接之元件,而上述之真空氣壓感測器131、大氣氣壓感測器133、定位感測器340、膜片感測器350、溫度感測器410等各種感測器可電性連接至程序控制器510。藉此,使用者可透過指令輸入裝置520(如觸控螢幕、鍵盤等)致使 程序控制器510控制真空腔室模組100、壓膜模組200、承載模組300及加熱平台400之各自作動,並透過各種感測器來協調各元件之作動時機,以實現真空貼膜製程。 The control module 500 may include a program controller 510, a command input device 520, a temperature controller 530, a position and thrust controller 540, and other components electrically connected to the program controller 510. The vacuum pressure sensor 131, Various sensors, such as the atmospheric pressure sensor 133, the positioning sensor 340, the diaphragm sensor 350, and the temperature sensor 410, can be electrically connected to the program controller 510. Thereby, the user can cause the program controller 510 to control the respective actions of the vacuum chamber module 100, the film pressing module 200, the bearing module 300 and the heating platform 400 through the instruction input device 520 (such as a touch screen, a keyboard, etc.). , And coordinate the timing of each component through various sensors to achieve the vacuum film process.

以上是真空貼膜裝置10的各元件的技術內容的說明,接著說明如何藉由該真空貼膜裝置10來實現一真空貼膜製程。 The above is a description of the technical content of each element of the vacuum filming device 10, and then how to implement a vacuum filming process by using the vacuum filming device 10 is described.

在開始真空貼膜前,需預先準備一待貼膜件700。請參閱第9A圖,待貼膜件700可包含一發光半導體晶片陣列700A,其包含一基材710(如熱解膠膜、紫外線解黏膜、離型膜等軟性具有黏性者、或為一基板)及複數個覆晶式發光二極體(LED)晶片720,該等覆晶式LED晶片720以彼此分隔的方式,將電極面設置(黏接)於基材710上。請參閱第9B圖,待貼膜件700可包含另一種覆晶式發光半導體晶片陣列700B,其可包含複數個反射結構730(例如以透光之樹脂材料中混合例如二氧化鈦等光學散射性微粒),分別設置於覆晶式LED晶片720旁,以阻擋及反射LED晶片720之側向光線。請參閱第9C圖,待貼膜件700也可為一種透光基板(或晶圓、玻璃基板、陶瓷基板)700C等。以下以第9B圖所示的待貼膜件700(發光半導體晶片陣列700B)為例進行後續說明。 Before the vacuum filming is started, a filming member 700 needs to be prepared in advance. Please refer to FIG. 9A. The film-to-be-adhered component 700 may include a light-emitting semiconductor wafer array 700A, which includes a substrate 710 (such as a thermally adhesive film, an ultraviolet debonding film, a release film, and the like having a softness or a substrate), or a substrate. ) And a plurality of flip-chip light-emitting diode (LED) wafers 720, the flip-chip LED wafers 720 are arranged (adhered) on the substrate 710 in a manner separated from each other. Please refer to FIG. 9B. The film-to-be-adhered component 700 may include another flip-chip light-emitting semiconductor wafer array 700B, which may include a plurality of reflective structures 730 (for example, optically scattering fine particles such as titanium dioxide are mixed with a light-transmitting resin material), They are respectively disposed beside the flip-chip LED chip 720 to block and reflect the lateral light of the LED chip 720. Referring to FIG. 9C, the film-to-be-adhered component 700 may also be a light-transmitting substrate (or wafer, glass substrate, ceramic substrate) 700C, and the like. The following description uses the to-be-adhered component 700 (light-emitting semiconductor wafer array 700B) shown in FIG. 9B as an example for subsequent description.

請參閱第9D圖,待貼膜件700之一表面701較佳地可經電漿表面處理,以清潔介面並破壞基材鍵結以達到活化自由基等功效;爾後,請參閱第9E圖,待貼膜件700之表面701藉由噴灑、塗佈、印刷等方式被設置一接合膠650,接合膠650的製造材料可包含矽膠、樹脂、橡膠等。由於待貼膜件700之表面701經電漿表面處理,接合膠650可更佳地於表面701形成鍵結,以獲得更佳之接合強度。 Please refer to FIG. 9D. One surface 701 of the to-be-adhered piece 700 may preferably be treated with a plasma surface to clean the interface and destroy the substrate bond to achieve the effect of activating free radicals. Then, please refer to FIG. 9E. A bonding adhesive 650 is provided on the surface 701 of the film bonding member 700 by spraying, coating, printing, etc. The manufacturing material of the bonding adhesive 650 may include silicon rubber, resin, rubber, and the like. Since the surface 701 of the film piece 700 to be pasted is treated with a plasma surface, the bonding adhesive 650 can better form a bond on the surface 701 to obtain better bonding strength.

於準備待貼膜件700之同時或完成後,可準備一光學膜片600。請參閱第10圖,膜片600可包含一螢光膜片、一量子點螢光膜片、一矽膠螢光膜片、樹脂膜片、陶瓷螢光膜片等各種膜片;其中,螢光膜片或量子點螢光膜片可藉由申請人所有的公開號US 2010/0119839A1之美國專利申請案(對應於公告號I508331之台灣專利)所揭露之方法來製作。而螢光膜片通常由矽膠作為基材,而矽膠又可分為部分固化型(B-stage矽膠)與全固化型(C-stage矽膠)。全固化型螢光膜片製作成本低、可適用多重螢光材料(多粉)、耐熱性佳、在貼合製程中不會造成膜厚改變,因此最為適合晶圓級(wafer-level)貼合方法,可產生最佳的整體生產綜效。 An optical film 600 may be prepared at the same time or after the preparation of the to-be-attached film 700 is completed. Please refer to FIG. 10, the film 600 may include a fluorescent film, a quantum dot fluorescent film, a silicone fluorescent film, a resin film, a ceramic fluorescent film, and the like; The film or quantum dot fluorescent film can be produced by the method disclosed in the applicant's US Patent Application Publication No. US 2010 / 0119839A1 (corresponding to Taiwan Patent Publication No. I508331). The fluorescent film is usually made of silicon rubber, and the silicon rubber can be divided into a partially cured type (B-stage silicon) and a fully cured type (C-stage silicon). Fully cured fluorescent film has low production cost, can be used for multiple fluorescent materials (multi-powder), has good heat resistance, and does not cause film thickness changes during the bonding process, so it is most suitable for wafer-level bonding This method can produce the best overall production efficiency.

光學膜片600之表面601亦可經電漿表面處理,以使接合膠650能更佳地附著。然而,若膜片600(或待貼膜件700)與接合膠650之間的接合強度已足夠,電漿表面處理可省略。另外,接合膠650也可設置於膜片600上。膜片600可黏貼至膜片保持件800之軟性膜811上,再進行電漿表面處理或塗佈接合膠650。軟性膜811通常本身具有黏性,故不需額外塗佈黏著膠來黏貼及固定膜片600。 The surface 601 of the optical film 600 may also be treated with a plasma surface, so that the bonding adhesive 650 can be better adhered. However, if the bonding strength between the diaphragm 600 (or the film member 700 to be pasted) and the bonding adhesive 650 is sufficient, the plasma surface treatment may be omitted. In addition, the adhesive 650 may be provided on the diaphragm 600. The diaphragm 600 may be adhered to the flexible film 811 of the diaphragm holder 800, and then the plasma surface treatment or the bonding glue 650 may be applied. The flexible film 811 is usually tacky, so there is no need to apply additional adhesive to adhere and fix the film 600.

當膜片600及待貼膜件700準備完成,可開始進行貼膜製程。首先,請參閱第11圖所示,將膜片600及待貼膜件700放置於承載盤310上,待貼膜件700可放置於承載盤310之凹槽312中,而膜片600放置於膜片保持件800後再倒置於承載盤310上。此時,膜片保持件800之支撐框812接觸承載盤310,而軟性膜811及其上的膜片600位於待貼膜件700之上方,兩者相隔一初始距離D2。承載盤310之表面亦可形成有一容置槽(圖未示)來供支撐框812置入而定位。 When the film 600 and the film-to-be-adhered component 700 are ready, the film-lamination process can be started. First, referring to FIG. 11, the diaphragm 600 and the member 700 to be pasted are placed on the carrier plate 310. The member 700 to be pasted may be placed in the groove 312 of the carrier 310, and the diaphragm 600 is placed on the diaphragm. The holder 800 is then placed on the carrier plate 310. At this time, the supporting frame 812 of the film holder 800 contacts the carrier plate 310, and the flexible film 811 and the film 600 thereon are located above the film member 700 to be pasted, and the two are separated by an initial distance D2. An accommodating groove (not shown) may be formed on the surface of the carrier plate 310 for the support frame 812 to be inserted and positioned.

請配合參閱第2圖,放置膜片600及待貼膜件700前,可將承載盤310滑動至腔體110外部;將膜片600及待貼膜件700放置於承載盤310完成後,再將承載盤310滑動回腔體110內。定位感測器340及膜片感測器350可分別感測承載盤310是否位於壓膜板210之下,膜片600(或膜片保持件800)是否放置於承載盤310。 Please refer to Fig. 2. Before placing the diaphragm 600 and the member 700 to be pasted, the carrier plate 310 can be slid to the outside of the cavity 110. After placing the diaphragm 600 and the member 700 to be pasted on the carrier plate 310, the carrier The disc 310 slides back into the cavity 110. The positioning sensor 340 and the diaphragm sensor 350 can respectively detect whether the carrier plate 310 is located under the pressing plate 210 and whether the diaphragm 600 (or the diaphragm holder 800) is placed on the carrier plate 310.

請參閱第12圖、並配合參閱第6A圖,膜片600及待貼膜件700放置完成後,抽氣使腔體110之容置空間110A至一真空狀態,也就是,通過真空系統之控制器件130,對容置空間110A抽真空;真空度較佳地可小於50托爾(Torr),再佳地小於10托爾,更佳地小於1托爾。如此,膜片600及待貼膜件700之間僅有微量稀薄氣體。 Please refer to FIG. 12 and FIG. 6A in cooperation. After the placement of the diaphragm 600 and the to-be-adhered piece 700 is completed, the air is evacuated to bring the accommodating space 110A of the cavity 110 to a vacuum state, that is, the control device of the vacuum system 130, evacuating the accommodating space 110A; the degree of vacuum may be less than 50 Torr, more preferably less than 10 Torr, and more preferably less than 1 Torr. In this way, there is only a trace amount of thin gas between the diaphragm 600 and the film-attachment member 700.

另外,於抽真空時,壓膜板210、承載盤310及加熱平台400皆垂直分離,即承載盤310與加熱平台400之間保持初始距離D3。此時,加熱平台400已處於高溫狀態(例如攝氏150度),而由於保持初始距離D3,承載盤310上的接合膠650不會達到固化所需之溫度,故不會在膜片600及待貼膜件700貼合前固化。 In addition, during the evacuation, the film pressing plate 210, the carrier plate 310, and the heating platform 400 are vertically separated, that is, the initial distance D3 is maintained between the carrier plate 310 and the heating platform 400. At this time, the heating platform 400 is already at a high temperature (for example, 150 degrees Celsius), and because the initial distance D3 is maintained, the bonding glue 650 on the carrier plate 310 will not reach the temperature required for curing, so it will not be in the diaphragm 600 and waiting. The film member 700 is cured before bonding.

請參閱第13A圖及第13B圖(為簡化圖式,將接合膠650省略顯示),當容置空間110A為真空狀態後,使膜片600及待貼膜件700接合。具體而言,藉由致動器230致動垂直移動桿220使壓膜板210向下移動,壓膜板210先致動軟性膜811及其上之膜片600,使軟性膜811變形(即兩側部分撓曲而中間部分位移),然後膜片600與待貼膜件700藉由接合膠650(圖未示)貼合;壓膜板210持續致動軟性膜811及膜片600,進而將承載盤310壓至加熱平台400;此時,設置於承載盤310下之彈簧器件320之彈 簧322將會變形而儲存一彈簧位能。 Please refer to FIG. 13A and FIG. 13B (to simplify the drawing, the adhesive 650 is omitted), and when the accommodating space 110A is in a vacuum state, the diaphragm 600 and the member 700 to be adhered are joined. Specifically, the vertical moving lever 220 is actuated by the actuator 230 to move the pressing plate 210 downward. The pressing plate 210 first activates the flexible film 811 and the diaphragm 600 thereon to deform the flexible film 811 (that is, The two sides are flexed and the middle part is displaced.) Then, the diaphragm 600 and the to-be-adhered piece 700 are bonded by a bonding adhesive 650 (not shown); the pressing plate 210 continues to actuate the flexible film 811 and the diaphragm 600, and further The carrier plate 310 is pressed to the heating platform 400; at this time, the spring 322 of the spring device 320 disposed under the carrier plate 310 will deform and store a spring potential energy.

當承載盤310被壓至加熱平台400後,加熱平台400開始支撐承載盤310,承載盤310無法繼續被向下移動,使得承載盤310被壓膜板210及加熱平台400夾制。加熱平台400之熱能可傳導至承載盤310,使得膜片600與待貼膜件700之間的接合膠650可被加熱而固化。 After the supporting plate 310 is pressed to the heating platform 400, the heating platform 400 starts to support the supporting plate 310. The supporting plate 310 cannot be further moved downward, so that the supporting plate 310 is sandwiched by the pressing plate 210 and the heating platform 400. The thermal energy of the heating platform 400 can be transmitted to the carrier plate 310, so that the bonding adhesive 650 between the film 600 and the film member 700 can be heated and cured.

請參閱第14A圖(為簡化圖式,第14A圖爾後的第14B圖之接合膠650省略顯示),待接合膠650達一定程度固化後,垂直移動桿220不再壓合膜片600、軟性膜811及承載盤310,轉而帶動壓膜板210向上移動。此時,壓膜板210持續向上移動,請參閱第14B圖,較佳地,彈簧器件320可由先前壓合時儲存之彈簧位能釋放,將承載盤310向上致動並回復至初始位置,使得承載盤310(及其上之膜片600與待貼膜件700)脫離加熱平台400至初始距離D3,接合膠650不再被加熱固化。 Please refer to FIG. 14A (to simplify the drawing, the adhesive 650 in FIG. 14B after FIG. 14A is omitted), after the adhesive 650 is cured to a certain degree, the vertical moving rod 220 no longer presses the diaphragm 600 and is soft. The film 811 and the carrier plate 310 in turn drive the film pressing plate 210 to move upward. At this time, the film pressing plate 210 continues to move upward, please refer to FIG. 14B. Preferably, the spring device 320 can be released by the spring position energy stored in the previous pressing, and the carrier plate 310 is actuated upward and returned to the initial position, so that The carrier plate 310 (and the film sheet 600 and the film member 700 thereon) are separated from the heating platform 400 to an initial distance D3, and the bonding glue 650 is no longer heated and cured.

彈簧器件320可由先前壓合時儲存之彈簧位能釋放而將承載盤310致動並回復至初始位置後,壓膜板210可持續向上移動,以結束壓合動作。請參閱第14C圖(接合膠650省略顯示),較佳地,軟性膜811因本身的彈力而恢復到未變形狀態,而膜片600會隨之移動,與膜片600貼合的待貼膜件700亦會被拉離承載盤310;如此,待貼膜件700與承載盤310相隔一距離,不再放置於凹槽312內。接著,壓膜板210持續向上移動,回復至與承載盤310保持一初始距離D1,如第14D圖所示。 After the spring device 320 can be released by the spring position energy stored during the previous pressing, the carrier plate 310 can be actuated and returned to the initial position, and the pressing plate 210 can continue to move upward to end the pressing operation. Please refer to FIG. 14C (the adhesive 650 is not shown). Preferably, the flexible film 811 is restored to its undeformed state due to its elastic force, and the diaphragm 600 will move with it. 700 will also be pulled away from the carrier plate 310; thus, the film-to-be-adhered member 700 is separated from the carrier plate 310 by a distance and is no longer placed in the groove 312. Then, the film pressing plate 210 continues to move upward and returns to maintain an initial distance D1 from the carrier plate 310, as shown in FIG. 14D.

在膜片600與待貼膜件700遠離加熱平台400後,利用破真空氣壓源136等將容置空間110A破真空,回到大氣壓力。爾後,使承載盤310滑動至腔體110外,將膜片保持件800從承載盤310取出,而膜片600 與待貼膜件700隨著膜片保持件800被取出至腔體110外。 After the diaphragm 600 and the member 700 to be pasted are far from the heating platform 400, the accommodating space 110A is evacuated by using a vacuum pressure source 136, etc., and returns to atmospheric pressure. Thereafter, the carrier plate 310 is slid to the outside of the cavity 110, and the diaphragm holder 800 is taken out from the carrier plate 310, and the diaphragm 600 and the to-be-attached member 700 are taken out of the cavity 110 with the diaphragm holder 800.

若膜片600與待貼膜件700之間的接合膠650未完全固化,較佳地,取出膜片600與待貼膜件700後,可將其放置於一加熱裝置(例如烤箱,圖未示)中使接合膠650再次被加熱而更為固化,俾以膜片600與待貼膜件700的貼合更為穩固。該加熱裝置可一次對多組相貼合的膜片600與待貼膜件700進行再加熱,使再加熱製程更有效益。 If the adhesive 650 between the film 600 and the piece of film 700 is not completely cured, preferably, after taking out the film 600 and the piece of film 700, it can be placed in a heating device (such as an oven, not shown) In this way, the bonding adhesive 650 is heated again to be more solidified, and the bonding between the film 600 and the film member 700 is more stable. The heating device can reheat a plurality of groups of film sheets 600 and the film members 700 to be bonded at a time, so that the reheating process is more efficient.

然而,亦可利用加熱平台400將接合膠650完全固化後,再將膜片600與待貼膜件700取出。 However, after the bonding glue 650 is completely cured by using the heating platform 400, the film sheet 600 and the film-to-be-attached member 700 can be taken out.

請參閱第15A圖,相貼合的膜片600與待貼膜件700爾後可被切割而形成複數個發光二極體裝置;或者,請參閱第15B圖,相貼合的膜片600與待貼膜件700可與基材710分離後,再被切割。 Please refer to FIG. 15A, the attached film 600 and the to-be-adhered film 700 may be cut to form a plurality of light-emitting diode devices; or, see FIG. 15B, the attached film 600 and the to-be-adhered film The piece 700 can be separated from the substrate 710 and then cut.

藉此,真空貼膜裝置10可在真空狀態下進行膜片600與待貼膜件700的貼合,以減少膜片600與待貼膜件700之間可能產生的氣泡缺陷。由一透明矽膠膜片與一玻璃基板之貼膜測試結果顯示,在真空狀態下進行貼合可有效減少氣泡的產生。如第16A圖所示,在大氣壓力下進行兩者貼合時,透明矽膠膜片與玻璃基板之間難以避免地產生許多氣泡,使貼合品質與生產良率下降;而第16B圖為採用本實施所揭露之真空貼膜裝置之貼合結果,其顯示在真空狀態下貼合無可觀察到之氣泡產生。此外,對膜片600及待貼膜件700進行電漿表面處理可達到清潔表面及活化鍵結之功效,可有效增加兩者之間貼合後的接合強度,進一步改善貼合品質。又,於接觸前,承載盤310與加熱平台400具有初始距離D3,故接合膠650不會被預先加熱而固化。再者,真空貼膜裝置10可一次對於複數個LED晶 片720等元件進行貼膜,以實現晶圓級貼膜。 Thereby, the vacuum film sticking device 10 can adhere the film sheet 600 to the film piece 700 in a vacuum state, so as to reduce bubble defects that may occur between the film sheet 600 and the film piece 700. The test results of a transparent silicone film and a glass substrate show that bonding under vacuum can effectively reduce the generation of bubbles. As shown in Figure 16A, when the two are bonded under atmospheric pressure, many bubbles are unavoidably generated between the transparent silicone film and the glass substrate, which reduces the bonding quality and production yield; while Figure 16B shows the use of The bonding results of the vacuum film device disclosed in this implementation show that there is no observable bubble generation during bonding under vacuum. In addition, performing plasma surface treatment on the membrane 600 and the film-to-be-adhered piece 700 can achieve the effects of cleaning the surface and activating the bonding, which can effectively increase the bonding strength between the two and further improve the bonding quality. In addition, before the contact, the carrier plate 310 and the heating platform 400 have an initial distance D3, so the bonding glue 650 is not heated and cured in advance. In addition, the vacuum filming device 10 can film a plurality of components such as LED wafers 720 at a time to realize wafer-level filming.

請參閱第17圖,以下說明依據本發明另一較佳實施例的真空貼膜方法20,其可利用上述真空貼膜裝置10來完成,故其可視為是真空貼膜裝置10所能實現的一種製程。因此,真空貼膜方法20之技術內容可參照真空貼膜裝置10的技術內容,故說明上較為簡潔。 Referring to FIG. 17, the following describes a vacuum filming method 20 according to another preferred embodiment of the present invention, which can be completed by using the above-mentioned vacuum filming device 10, so it can be regarded as a process that can be implemented by the vacuum filming device 10. Therefore, the technical content of the vacuum filming method 20 can be referred to the technical content of the vacuum filming apparatus 10, so the description is relatively simple.

首先,如第11圖所示,提供一膜片600及一待貼膜件700(步驟S201),膜片600及待貼膜件700之至少其中之一者已設置一接合膠650,且膜片600及/或待貼膜件700可經電漿表面處理(步驟S202)。 First, as shown in FIG. 11, a diaphragm 600 and a film-to-be-adhered piece 700 are provided (step S201). At least one of the film 600 and the film-to-be-adhered piece 700 has been provided with a bonding adhesive 650, and the diaphragm 600 And / or the film-to-be-adhered piece 700 may be subjected to a plasma surface treatment (step S202).

接著,如第12圖所示,使膜片600及待貼膜件700於一容置空間110A中保持分離(步驟S203),然後抽氣使容置空間110A至一真空狀態(步驟S205)。 Next, as shown in FIG. 12, the diaphragm 600 and the member 700 to be pasted are kept separated in an accommodation space 110A (step S203), and then the air is evacuated to bring the accommodation space 110A to a vacuum state (step S205).

爾後,如第13A圖及第13B圖所示,在真空狀態下致動膜片600,使膜片600與待貼膜件700經由接合膠650相貼合(步驟S207);然後,持續致動膜片600,使相貼合的膜片600與待貼膜件700移動一距離後,被壓至加熱平台400(步驟S209);如此,接合膠650將被加熱平台400加熱而固化。 Thereafter, as shown in FIG. 13A and FIG. 13B, the diaphragm 600 is actuated in a vacuum state, so that the diaphragm 600 and the film-to-be-adhered member 700 are bonded to each other via the bonding glue 650 (step S207); The sheet 600 moves the adhered film sheet 600 and the to-be-adhered piece 700 a distance and is pressed to the heating platform 400 (step S209); thus, the bonding adhesive 650 is heated and cured by the heating platform 400.

此外,如第14A圖至第14D圖所示,待接合膠650相當程度固化後,可使膜片600反向移動,並使相貼合的膜片600與待貼膜件700遠離加熱平台400,以結束接合膠固化程序(步驟S211)。之後,將相貼合的膜片600與待貼膜件700取出,然後再次加熱接合膠650至其完全固化(步驟S213)。 In addition, as shown in FIGS. 14A to 14D, after the adhesive 650 is cured to a considerable extent, the diaphragm 600 can be moved in the reverse direction, and the attached diaphragm 600 and the to-be-adhered piece 700 can be kept away from the heating platform 400. In order to end the adhesive curing process (step S211). After that, the attached film sheet 600 and the to-be-adhered piece 700 are taken out, and then the bonding adhesive 650 is heated again until it is completely cured (step S213).

綜合上述,本發明的真空貼膜裝置及方法可改善膜片與待貼 膜件之間的氣泡缺陷之問題,且可改善膜片與待貼膜件之間的接合膠未接合前被預先固化之問題,藉此具有較佳的貼合良率,此外可實現「晶圓級貼合」,藉此具有較低的設備成本、及/或較佳的生產效率。 To sum up, the vacuum filming device and method of the present invention can improve the problem of air bubble defects between the film sheet and the film to be filmed, and can improve the problem that the adhesive between the film sheet and the film to be filmed is cured before being bonded. This has a better bonding yield, and in addition, "wafer-level bonding" can be achieved, thereby having lower equipment costs and / or better production efficiency.

上述之實施例僅用來例舉本發明之實施態樣,以及闡釋本發明之技術特徵,並非用來限制本發明之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本發明所主張之範圍,本發明之權利保護範圍應以申請專利範圍為準。 The above embodiments are only used to exemplify the implementation aspects of the present invention, and to explain the technical features of the present invention, and are not intended to limit the protection scope of the present invention. Any change or equivalence arrangement that can be easily accomplished by those skilled in the art belongs to the scope claimed by the present invention, and the scope of protection of the rights of the present invention shall be subject to the scope of patent application.

Claims (14)

一種真空貼膜裝置,包含:一真空腔室模組,包含一腔體及一真空系統之控制器件,該腔體定義有一容置空間,該控制器件連接至該腔體,以控制該容置空間內的壓力;一壓膜模組,連接該腔體、且包含一壓膜板及一垂直移動桿,該垂直移動桿包含一上端及一下端,該壓膜板設置於該垂直移動桿之該下端,該壓膜板經由垂直移動桿可於該容置空間內垂直地移動;一承載模組,連接該腔體、且包含一承載盤及一彈簧器件,其中該承載盤設置於該彈簧器件上,且具有一初始位置,該承載盤在被壓膜而致動前係與該壓膜板保持一初始距離;以及一加熱平台,設置於該容置空間內、並與被致動前的該承載盤保持一初始距離;其中,該承載盤係設置成可於該容置空間內被該壓膜板向下壓膜而致動者,該彈簧器件係設置成可於該承載盤被向下致動時儲存一彈簧位能,該加熱平台係設置成可支撐被壓膜而致動後的該承載盤者,以使該加熱平台之熱能傳導至該承載盤而加熱該承載盤;該彈簧器件更設置成可於該壓膜板向上移動後,可由先前壓合時儲存之該彈簧位能釋放而將該承載盤向上致動並回復至該初始位置。A vacuum film sticking device includes a vacuum chamber module including a cavity and a control device of a vacuum system. The cavity defines an accommodation space, and the control device is connected to the cavity to control the accommodation space. Internal pressure; a film pressing module connected to the cavity, and including a film pressing plate and a vertical moving rod, the vertical moving rod including an upper end and a lower end, the film pressing plate is arranged on the vertical moving rod; At the lower end, the film pressing plate can move vertically in the accommodating space through a vertical moving rod; a load module connected to the cavity and includes a load plate and a spring device, wherein the load plate is disposed on the spring device And an initial position, the carrier disk is maintained at an initial distance from the film pressing plate before being actuated by the film; and a heating platform is disposed in the accommodating space and is separated from the film before being actuated. The carrier plate maintains an initial distance; wherein the carrier plate is arranged to be actuated by the film pressing plate in the accommodating space, and the spring device is arranged to be movable to the carrier plate. Stores a spring when actuated Yes, the heating platform is arranged to support the carrier plate which is actuated by the pressed film, so that the thermal energy of the heating platform is transmitted to the carrier plate to heat the carrier plate; the spring device is further provided to the After the pressure plate is moved upward, the spring position stored in the previous compression can be released to actuate the bearing plate upward and return to the initial position. 如請求項1所述的真空貼膜裝置,其中,該壓膜模組更包含一球面軸承,該壓膜板通過該球面軸承設置於該垂直移動桿之該下端。The vacuum filming device according to claim 1, wherein the film pressing module further comprises a spherical bearing, and the film pressing plate is disposed at the lower end of the vertical moving rod through the spherical bearing. 如請求項1所述的真空貼膜裝置,其中,該真空腔室模組包含一氣密滑動軸承,該垂直移動桿之該上端位於該容置空間外,並通過該氣密滑動軸承而使該下端位於該容置空間內。The vacuum filming device according to claim 1, wherein the vacuum chamber module includes an air-tight sliding bearing, the upper end of the vertical moving rod is located outside the accommodation space, and the lower end is made by the air-tight sliding bearing. Located in the accommodation space. 如請求項1所述的真空貼膜裝置,其中,該壓膜板包含一緩衝層。The vacuum film sticking device according to claim 1, wherein the film pressing plate includes a buffer layer. 如請求項1所述的真空貼膜裝置,其中,該真空腔室模組更包含一活動門,該活動門設置於該腔體之一開口側、且可活動地使該開口側閉合。The vacuum film sticking device according to claim 1, wherein the vacuum chamber module further includes a movable door, which is disposed on an open side of the cavity and movably closes the open side. 如請求項5所述的真空貼膜裝置,其中,該承載模組更包含一滑軌器件,該承載盤設置於該滑軌器件上,以於該容置空間內水平地滑動及通過該開口側水平地滑動至該腔體外。The vacuum filming device according to claim 5, wherein the carrier module further includes a slide rail device, and the carrier disk is disposed on the slide rail device to slide horizontally in the accommodation space and pass through the opening side Slide horizontally outside the cavity. 如請求項1至6任一項所述的真空貼膜裝置,更包含一控制模組,該控制模組設置成可控制與協調該真空腔室模組、該壓膜模組、該承載模組與該加熱平台之作動。The vacuum film sticking device according to any one of claims 1 to 6, further comprising a control module configured to control and coordinate the vacuum chamber module, the film pressing module, and the carrying module. And the action of the heating platform. 一種真空貼膜方法,包含:使一膜片與一待貼膜件於一腔體之一容置空間內保持分離,其中該膜片及該待貼膜件之至少其中一者上已設置有一接合膠;抽氣使該容置空間至一真空狀態;在該真空狀態下,致動該膜片,使該膜片與該待貼膜件經由該接合膠相貼合;以及持續致動該膜片,使相貼合的該膜片與該待貼膜件移動一距離後,始被一加熱平台支撐,其中該加熱平台之熱能傳導至該接合膠而使該接合膠被該加熱平台加熱而相當程度固化。A vacuum filming method includes: maintaining a film sheet and a film to be filmed in an accommodation space of a cavity, wherein at least one of the film sheet and the film to be filmed has a bonding adhesive; Pump down the accommodation space to a vacuum state; in the vacuum state, actuate the diaphragm to make the diaphragm and the film to be pasted together via the bonding glue; and continue to actuate the diaphragm to make After the attached film and the to-be-adhered film have moved a distance, they are supported by a heating platform, wherein the thermal energy of the heating platform is transmitted to the bonding glue, so that the bonding glue is heated by the heating platform to be cured to a considerable degree. 如請求項8所述的真空貼膜方法,其中,在該接合膠被設置於該膜片及該待貼膜件之其中一者之前,該膜片及/或該待貼膜件係經電漿表面處理。The vacuum filming method according to claim 8, wherein before the bonding adhesive is disposed on one of the film sheet and the film to be filmed, the film sheet and / or the film to be filmed are subjected to a plasma surface treatment . 如請求項8或9所述的真空貼膜方法,更包含:於該接合膠被加熱而固化後,移動該膜片使已貼合的該膜片與該待貼膜件脫離該加熱平台。The vacuum filming method according to claim 8 or 9, further comprising: after the adhesive is heated and cured, moving the film sheet to separate the pasted film sheet and the film to be pasted from the heating platform. 如請求項10所述的真空貼膜方法,更包含:於已貼合之該膜片與該待貼膜件脫離該加熱平台後,取出相貼合的該膜片與該待貼膜件至該腔體外,然後再次加熱該接合膠至其更為固化。The vacuum filming method according to claim 10, further comprising: after the pasted film and the film to be pasted are separated from the heating platform, removing the film and the film to be pasted out of the cavity. , And then heat the adhesive again until it is more cured. 如請求項8或9所述的真空貼膜方法,其中,該膜片包含一量子點螢光膜片,而該待貼膜件包含一透光基板。The vacuum filming method according to claim 8 or 9, wherein the film sheet includes a quantum dot fluorescent film sheet, and the film-to-be-adhered piece includes a light-transmitting substrate. 如請求項8或9所述的真空貼膜方法,其中,該膜片包含一螢光膜片,而該待貼膜件包含一覆晶式發光半導體晶片陣列,該覆晶式發光半導體晶片陣列包含一基材及設置於該基材上之複數個覆晶式發光二極體晶片。The vacuum filming method according to claim 8 or 9, wherein the film sheet includes a fluorescent film sheet, and the film-to-be-laminated part includes a flip-chip light-emitting semiconductor wafer array, and the flip-chip light-emitting semiconductor wafer array includes a A substrate and a plurality of flip-chip light emitting diode wafers disposed on the substrate. 如請求項13所述的真空貼膜方法,其中,該覆晶式發光半導體晶片陣列更包含複數個反射結構,分別設置於該等覆晶式發光半導體晶片旁。The vacuum filming method according to claim 13, wherein the flip-chip light-emitting semiconductor wafer array further includes a plurality of reflective structures, which are respectively disposed beside the flip-chip light-emitting semiconductor wafers.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI700972B (en) * 2019-11-28 2020-08-01 群翊工業股份有限公司 Cavity to maintain the level of the mechanism
CN112339262A (en) * 2020-10-22 2021-02-09 深圳市纳泽光电有限公司 Attaching process of PTFE (Polytetrafluoroethylene) film on LED (light-emitting diode) module
TWI788032B (en) * 2021-09-28 2022-12-21 天虹科技股份有限公司 Shielding mechanism and film deposition machine platform with the shielding mechanism
CN115874158A (en) * 2021-09-28 2023-03-31 天虹科技股份有限公司 Opening-closing type shielding mechanism and film deposition machine

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110024102B (en) 2019-02-26 2020-10-30 长江存储科技有限责任公司 Method and device for sticking adhesive film on surface of wafer
CN110267458A (en) * 2019-06-10 2019-09-20 邓旭辉 A kind of online hot press
JP7292138B2 (en) * 2019-07-23 2023-06-16 株式会社ジャパンディスプレイ Display device repair system
TWI775083B (en) 2020-05-26 2022-08-21 毅力科技有限公司 Vacuum lamination system and vacuum lamination method
CN113370543B (en) * 2021-04-27 2023-07-21 重庆强鸿科技有限公司 Halogen-free flame-retardant polyethylene plastic-wood composite board processing device
KR102471249B1 (en) * 2021-10-01 2022-11-25 (주)성일이노텍 Method for manufacturing vacuum laminated glass
CN116056361B (en) * 2023-03-31 2023-06-13 新乡职业技术学院 Photosensitive film laminating machine for circuit board production
CN116475011B (en) * 2023-04-25 2023-09-19 芯朋半导体科技(如东)有限公司 Auxiliary heating seat for dispensing chip copper substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201323214A (en) * 2011-12-06 2013-06-16 Fujikoshi Machinery Corp Method for adhering works and work adhering apparatus
TW201347971A (en) * 2012-05-17 2013-12-01 Asustek Comp Inc Processing method of metal-glass multilayer material and processing system thereof
TWI560062B (en) * 2015-10-06 2016-12-01 Yongfa Joyful Industry Co Ltd Vacuum bonding device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4408172B2 (en) * 2000-07-21 2010-02-03 ニチゴー・モートン株式会社 Lamination method
JP3472963B1 (en) 2002-05-30 2003-12-02 ミカドテクノス株式会社 Vacuum press for high temperature
JP2004157451A (en) 2002-11-08 2004-06-03 Seiko Epson Corp Manufacturing device and manufacturing method for electrooptical panel
WO2007142290A1 (en) * 2006-06-07 2007-12-13 Nichigo-Morton Co., Ltd. Laminating apparatus and method of laminating therewith
JP5196795B2 (en) 2007-01-30 2013-05-15 国立大学法人東京工業大学 Vacuum heating press machine
KR20100081864A (en) * 2009-01-07 2010-07-15 삼성테크윈 주식회사 Method for manufaturing circuit substrate and for laminating the such, and apparatus for manufaturing the such
JP5745319B2 (en) * 2011-04-14 2015-07-08 日東電工株式会社 Fluorescent reflection sheet and method for manufacturing light emitting diode device
JP2015056300A (en) * 2013-09-12 2015-03-23 パナソニック株式会社 Manufacturing apparatus of flat light emitter and manufacturing method
KR102468894B1 (en) * 2014-10-24 2022-11-22 다우 실리콘즈 코포레이션 Vacuum lamination method for forming a conformally coated article and associated conformally coated articles formed therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201323214A (en) * 2011-12-06 2013-06-16 Fujikoshi Machinery Corp Method for adhering works and work adhering apparatus
TW201347971A (en) * 2012-05-17 2013-12-01 Asustek Comp Inc Processing method of metal-glass multilayer material and processing system thereof
TWI560062B (en) * 2015-10-06 2016-12-01 Yongfa Joyful Industry Co Ltd Vacuum bonding device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI700972B (en) * 2019-11-28 2020-08-01 群翊工業股份有限公司 Cavity to maintain the level of the mechanism
CN112339262A (en) * 2020-10-22 2021-02-09 深圳市纳泽光电有限公司 Attaching process of PTFE (Polytetrafluoroethylene) film on LED (light-emitting diode) module
TWI788032B (en) * 2021-09-28 2022-12-21 天虹科技股份有限公司 Shielding mechanism and film deposition machine platform with the shielding mechanism
CN115874158A (en) * 2021-09-28 2023-03-31 天虹科技股份有限公司 Opening-closing type shielding mechanism and film deposition machine

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