CN102474991B - Substrate-bonding device and method and substrate bonding head - Google Patents
Substrate-bonding device and method and substrate bonding head Download PDFInfo
- Publication number
- CN102474991B CN102474991B CN201080032985.6A CN201080032985A CN102474991B CN 102474991 B CN102474991 B CN 102474991B CN 201080032985 A CN201080032985 A CN 201080032985A CN 102474991 B CN102474991 B CN 102474991B
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- substrate
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- make
- hardening resin
- base plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/36—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of semiconductors, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Wire Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Disclosed is a device that positions a first substrate , which has a wiring/electrode pattern formed on the surface thereof, and a second substrate, which has a wiring/electrode pattern formed on the surface thereof, such that the wiring/electrode patterns on the substrates face each other, and then bonds the substrates together. The disclosed device is provided with: a means for holding the second substrate; a means for bending the held second substrate; and a means for bringing the first substrate and the second substrate close to each other, one of said substrates being coated with a curable resin, and pressing the second substrate towards the first substrate. The disclosed device and method minimize the amount of curable resin coating while preventing the incorporation of voids and increasing the contact area between opposing wiring/electrode patterns with respect to the comparatively large total surface area of the substrates on which wiring/electrode patterns are formed.
Description
Technical field
The present invention relates to the substrate bonding apparatus and method that use hardening resin to be bonded to each other by the substrate being formed with wiring electrode pattern on surface.
Background technology
Surface be formed wiring electrode pattern substrate on assembling be formed with the semiconductor chip of electronic circuit, the device and method of substrate is always widely used.And then, in recent years, along with the thin space of the wiring electrode pattern on above-mentioned semiconductor chip, substrate, only can not guarantee sufficient intensity in the welding of electrode engagement part, the surrounding being therefore used in bonding part flows into hardening resin makes its underfill hardening to improve bond strength (under fill) construction method.
The thin spaceization progress of wiring electrode pattern, requires high assembly precision, and on the other hand, the maximization/large areaization progress of above-mentioned semiconductor chip, substrate, substrate assembles the substrate of larger area.
When adhered thereto substrate at substrate, the material of each substrate, thickness, the difference such as thermal history in the production phase, when therefore producing warpage on each substrate, warpage degree can be different because of variations in temperature, required above external force (following, stress) can be applied to composition surface.By continuing to repeat to produce this stress, also can on substrate, the wiring pattern stress application of substrate inside, the product bug of stripping etc. on the fracture of wiring, disrumpent feelings, composition surface can be involved.
Above-mentioned underfill construction method etc. utilize the bonding each other of the substrate of hardening resin be warpage degree in order to solve each substrate because said temperature change the effective technology of different problems, can product bug be prevented.
In substrate bonding each other, be always widely used by the device and method carrying out bonding at bonding part or its periphery coating hardening resin, pressing substrate.The first substrate being coated with hardening resin carries out the bonding of second substrate, when the surface of at least one party of aforesaid substrate has ripple etc., cause the bubble of entrained air between the substrate of both sides (following, space (void)) sometimes.Because the above-mentioned space be mixed into is surrounded around it by the hardening resin that viscosity is high, even if so pressing aforesaid substrate, be also difficult to remove completely.
Refer to that comprising having of following resin starts to keep mobility but the resin of the characteristic of being hardened by physical change or chemical reaction etc. at this said hardening resin, above-mentioned resin comprises: keep mobility at normal temperatures but keep mobility but the ultraviolet hardening resin hardened by the light of irradiation ultraviolet radiation etc. or light-hardening resin etc. before the light of the thermosetting resin, irradiation ultraviolet radiation etc. that harden by heating.
When being mixed into above-mentioned space, there is chemical reaction in the nitrogen, oxygen, moisture, impurity etc. that comprise in electrode and space, becomes the reason of corroding electrode.In addition, when being mixed into above-mentioned space, when the temperature of substrate changes, because aforesaid substrate material is different with the thermal coefficient of expansion of above-mentioned gap, so the degree of substrate deformation is different.Said temperature changes the substrate deformation degree difference caused and becomes the reason producing stress in wiring electrode pattern on aforesaid substrate, aforesaid substrate composition surface each other.When producing above-mentioned stress, the product bug of stripping etc. on the fracture of wiring, disrumpent feelings, composition surface can be involved.
Therefore, prevent being mixed into of space from being to prevent the necessary item of product bug when carrying out base plate bonding.
According to patent documentation 1, disclose a kind of multiple maintenance that uses and to be formed on substrate with hardening resin to bond the method for protective substrate in organic EL element.According to the method, can realize being difficult to the bonding producing bubble, the thickness of hardening resin be regulation thickness and evenly.
According to patent documentation 2, disclose a kind of manufacture method of EL display unit, the manufacture method of described EL display unit makes substrate be that convex-shaped warpage contacts with resinoid bond, and return to even shape from the top of convex surface successively towards outer region, bond substrate.According to the method, can the whole surface of bonding, non-involvement bubble ground.
Prior art document
Patent documentation
Patent documentation 1: JP 2005-317273 publication;
Patent documentation 2: Unexamined Patent 11-283739 publication.
Summary of the invention
Invent problem to be solved
As the substrate of organic EL, the wiring electrode pattern that the substrate surface of a side is formed and when cutting off with extraneous air, as long as focus on being mixed into of space when preventing adhesive base plate.Therefore, in order to the bonding of substrate, more can use hardening resin, also easily prevent being mixed into of space.
But, when being bonded to each other by the substrate being formed with wiring electrode pattern, the whole wiring electrode pattern on substrate in opposite directions must be made reliably to contact each other, and preferably increase the contact area of above-mentioned wiring electrode pattern.Therefore, the hardening resin of megohmite insulant is more used as to involve loose contact, therefore, not preferably.
If when being bonded to each other by ripply for surface substrate, then the residual hardening resin as megohmite insulant between wiring electrode pattern in opposite directions, can hinder interelectrode energising in opposite directions, the possibility as product cisco unity malfunction uprises.Therefore, when ripply for surface substrate is bonded to each other, need to prevent entering of space, suitably remove hardening resin on one side and bond.
In addition, when the hardening resin in order to prevent being mixed into of space to be more used as megohmite insulant, when wiring electrode pattern being reliably adjacent to each other, needing with sizable power pressing substrate each other, or increasing compressing time.If when the pressure of pressing increases, then can apply required above compression stress to substrate, likely crack in substrate, wiring electrode pattern.If the time of pressing is when increasing, then can reduce by treatable piece of number in official hour, productivity ratio declines.
Not only to prevent being mixed into of space, still will need to give one's full attention to for the way of pressurizeing again.In the pushing utilizing multiple maintenance, uniform load can not be applied to substrate entirety, cause the deviation of contact area to produce.In addition, only keeping in the maintaining body of surrounding, the load of central portion is not enough, not only can not enlarge active surface, but also the burden of periphery can be caused to increase, and likely involves substrate damage.
Also exist and first carry out void-free bonding at the beginning, the method of pressurizeing again in other operation afterwards, but, once the load that release applies, now hardening resin enters between electrode, even if produce pressurization more thoroughly can not remove the problem of hardening resin etc.
Therefore, in the prior art, it is very difficult for prevent space to be mixed into the substrate being formed with wiring electrode pattern being bonded to each other.
Therefore, the object of the invention is to, there is provided a kind of while the coating amount of hardening resin can be suppressed to Min., while prevent being mixed into of space, to the whole surface of substrate of larger area being formed with wiring electrode pattern, increase the device and method that wiring electrode pattern contact area each other in opposite directions bonds.
For solving the means of problem
In order to solve above problem, the invention that scheme 1 is recorded is a kind of substrate bonding apparatus, it is that first substrate surface being formed with wiring electrode pattern carries out to make mutual described electrode wiring pattern mode toward each other the device bonded with the surperficial second substrate with the electrode pattern that connects up, it is characterized in that possessing:
Keep the unit of described second substrate;
Its bending unit is made under the state keeping described second substrate;
Apply hardening resin at least one party of described first substrate or described second substrate, make described first substrate and the close unit of described second substrate;
Make the unit that described second substrate presses towards described first substrate.
The invention that scheme 2 is recorded is the substrate bonding apparatus as described in scheme 1, it is characterized in that,
Possess in the unit making described second substrate press towards described first substrate and keep the unit of described second substrate and make the unit that described second substrate is bending,
Described substrate bonding apparatus possesses when described second substrate is pressed against described first substrate, makes described second substrate imitate the unit of the surface configuration of described first substrate.
The invention substrate bonding apparatus as described in solution 1 and 2 that scheme 3 is recorded, is characterized in that, under the state that described second substrate is pressed against described first substrate, described hardening resin is hardened.
The invention that scheme 4 is recorded is a kind of base plate bonding method, a kind of base plate bonding method, it is that first substrate surface with wiring electrode pattern carries out to make mutual described electrode wiring pattern mode toward each other the method bonded with the surperficial second substrate with the electrode pattern that connects up, it is characterized in that
Have:
Keep the step of described second substrate;
Its bending step is made under the state keeping described second substrate,
Have:
Apply hardening resin at least one party of described first substrate or described second substrate, make described first substrate and the close step of described second substrate;
While make described second substrate imitate the surface configuration of described first substrate, described second substrate and described first substrate are carried out the step bonded;
Make the step that described second substrate presses towards described first substrate.
The invention that scheme 5 is recorded is the base plate bonding method as described in scheme 4, it is characterized in that, under having the state being pressed against described first substrate at described second substrate, makes the step that described hardening resin hardens.
The invention that scheme 6 is recorded is a kind of base plate bonding head, and it is made up of the framework of structure of container, and at least 1 face is elastomer, it is characterized in that possessing:
Use the unit of described elastomeric maintenance second substrate;
Make the facial disfigurement of the described second substrate of maintenance and make the unit that described second substrate is bending.
The invention that scheme 7 is recorded is the base plate bonding head as described in scheme 6, it is characterized in that,
Possess the unit of the facial disfigurement making the described second substrate of maintenance,
Have and make the facial disfigurement of the described second substrate of maintenance and make the structure that described second substrate is bending.
The invention that scheme 8 is recorded is the base plate bonding head as described in scheme 6, it is characterized in that,
Possess the unit of the pressure regulating framework inside,
There is the described pressure of adjustment, make the described elastomeric facial disfigurement of the described second substrate of maintenance and make the structure that described second substrate is bending.
The invention that scheme 9 is recorded is the base plate bonding head as described in scheme 6 ~ 8, it is characterized in that,
Have when described second substrate is pushed to first substrate, make described second substrate imitate the surface configuration of described first substrate, and the structure of impartial load can be applied described second substrate.
Invention effect
Use substrate bonding apparatus of the present invention and method, be bonded to each other by the substrate via hardening resin surface with wiring electrode pattern, thus can while prevent being mixed into of space, increase the whole surface of substrate, wiring electrode pattern contact area each other in opposite directions.Its result, improves the reliability of wiring conducting, can prevent the product bug that poor flow causes.
Accompanying drawing explanation
Fig. 1 is the stereogram of the example representing embodiments of the present invention;
Fig. 2 is the front view of the primary structure equipment of the example representing embodiments of the present invention;
Fig. 3 is the system construction drawing of the example representing embodiments of the present invention;
Fig. 4 is the flow chart of the base plate bonding order of the example representing embodiments of the present invention;
Head profile when Fig. 5 (a) ~ (e) is the base plate bonding based on embodiments of the present invention.
Embodiment
About for implementing mode of the present invention, accompanying drawing is used to be described.
［ apparatus structure ］
Fig. 1 is the stereogram of the example representing embodiments of the present invention.
Fig. 2 is the front view of the primary structure equipment of the example representing embodiments of the present invention.
In the various figures, 3 of rectangular coordinate system axles are set to X, Y, Z, XY plane are set to horizontal plane, Z-direction is set to vertical.Particularly, Z-direction represents with the direction of arrow, under representing with its rightabout.
Substrate bonding apparatus 1 is configured to, and comprises: objective table portion 2, head 3, pallet delivery section 4, coating element portion 5, hardening unit portion 6, bulb (balloon head) portion 7 and control part 9.
Objective table portion 2 is configured to, and comprises: be arranged on the X1 axle objective table 21 on the device pedestal 20 of substrate bonding apparatus 1 and be arranged on the first substrate mounting workbench 22 on X1 axle objective table 21.X1 axle objective table 21 can make first substrate mounting workbench 22 move in X-direction.
First substrate mounting workbench 22 can load the carrier 60 for loading first substrate 11.Carrier 60 be in order to handle first substrate 11 and use framework, disk-like structure parts.Carrier 60 has a carrier to the situation of a first substrate 11, a carrier to various ways such as the situations of multiple first substrate 11, and has and do not change overall dimension and effect size or the different first substrate 11 of size can handled as the substrate of same size.
Carrier 60 be positioned in first substrate mounting workbench 22 on, even if with apply external force position also unswerving mode be kept.As keeping method, there is following various ways, that is, by making smooth face contact with each other, and pre-setting groove, hole in the part connected, making above-mentioned groove, hole is communicated with vacuum source, thus this part is carried out to the method for negative-pressure adsorption; Pre-set groove, hole, thrust at first substrate mounting workbench 22, embedded the method in the projection of the carrier 60 corresponding with it, groove, hole; And then, keep etc. with negative-pressure adsorption etc. after above-mentioned embedding.
Objective table portion 2, owing to adopting device structure as above, so can use carrier 60 that first substrate 11 is placed in substrate-placing workbench, and makes it move in X-direction.
Head 3 is configured to, and comprises: the Y1 axle objective table 33 installed on the door type structure body be made up of the pillar 31 be arranged on device pedestal 20 and beam 32, the head reciprocating mechanism 34 be arranged on Y1 axle objective table 33, the ball head 7 being arranged on the θ axle motor 36 on a reciprocating mechanism 34 and being arranged on θ axle motor 36.
Y1 axle objective table 33 can make mounting head reciprocating mechanism 34 thereon move in the Y direction.In addition, be equipped with motor 35 at head reciprocating mechanism 34, θ axle motor 36 and ball head 7 can be made to move in Z-direction.
In addition, θ axle motor 36 can make ball head 7 rotate around θ direction.
Pallet delivery section 4 is configured to, and comprises: be arranged on the X2 axle objective table 41 on device pedestal 40, be positioned in the second substrate mounting workbench 42 on X2 axle objective table 41, the pillar 43 be arranged on device pedestal 40, the beam 44 be arranged on pillar 43, the Y2 axle objective table 45 being arranged on beam 44, the Z2 axle objective table 46 be positioned on Y2 axle objective table 45, handle (hand) portion 47 be positioned on Z2 axle objective table 46.
X2 axle objective table 41 can make second substrate mounting workbench 42 move in X-direction.Y2 axle objective table 45 can make Z2 axle objective table 46 move in the Y direction.Z2 axle objective table 46 can make handle portion 47 move in Z-direction.
Second substrate mounting workbench 42 can load the pallet 48 for making second substrate 12 be arranged.Pallet 48 adopts following structure, that is, by arranging multiple second substrate 12, and then by pallet 48 also multiple overlap, can once handle.
Pallet 48 be positioned in second substrate mounting workbench 42 on, even if with apply external force position also unswerving mode be kept.As keeping method, there is following various ways, that is, by making smooth face contact with each other, and pre-setting groove, hole in the part connected, making above-mentioned groove, hole is communicated with vacuum source, thus this part is carried out to the method for negative-pressure adsorption; Pre-set groove, hole, thrust at second substrate mounting workbench 42, embedded the method in the projection of the pallet 48 corresponding with it, groove, hole; And then, keep etc. with negative-pressure adsorption etc. after above-mentioned embedding.
Pallet delivery section 4 is owing to adopting device structure as above, so can use pallet 48 that second substrate 12 is placed in substrate-placing workbench, make it move in X-direction, and handle portion 47 can be made to move with Z-direction in the Y direction, (pick up) second substrate 12 can be picked up out.
Device pedestal 20 is provided with temporary placing table 26, the second substrate 12 picked up out by the handle portion 47 of pallet delivery section 4 can be placed temporarily.In addition, the mode that temporary placing table 26 can be picked up out by the tip portion of ball head 7 with the second substrate 12a placed temporarily configures.
The upper surface of temporary placing table 26 is general plane, and surface is provided with many holes, groove.Above described holes, groove are communicated with vacuum source via valve, therefore can carry out absorption by negative pressure to the interim second substrate 12a placed and keep.The second substrate 12a of interim placement owing to being adsorbed maintenance by negative pressure, so when the transfer based on handle 47, during being placed on temporary placing table 26, can not from the upper surface landing of temporary placing table 26.
Coating element portion 5 is configured to, and comprises: the distributor (dispenser) 53 being disposed side by side on the z-stage 51 on the Y1 axle objective table 33 of head 3 and being arranged in z-stage 51.Z-stage 51 is equipped with motor 52, and distributor 53 adopts can in the structure of Z-direction movement.Because z-stage 51 can move in the Y direction, so distributor 53 can be made to move to the optional position of Y-direction and Z-direction.
Distributor 53 is made up of such as lower part: fill the syringe (syringe) of hardening resin 55, by the hardening resin 55 of filling extrude piston (piston) portion, for hardening resin 55 being coated in pin (needle) portion of the assigned position on first substrate 11.
As hardening resin 55, the resin of epoxy, phenolic aldehyde, melamine, polyester, polyurethane, polyimides etc. can be exemplified, above-mentioned resin is added with to the resin of curing agent.
The coating condition of the composition, viscosity, coating amount etc. of hardening resin 55 suitably sets according to the area of the second substrate 12 of the intensity after the sclerosis expected, bonding.
If the hardening resin in syringe 55 is finished, then suitably supplement.When supplementary, when switch the valve of transfusion line pressurize force feed come supplementary time, can prevent from syringe, produce space (void).In addition, by carrying out deaeration process to the hardening resin 55 of coating in advance, thus can prevent from producing space after coating.
In the execution mode shown in Fig. 1, head 3 and coating element portion 5 are disposed side by side on Y1 axle objective table 33, but also can arrange can the objective table of movement in the Y direction, and this objective table is installed coating element portion 5, and head 3 and coating element portion 5 are just placed in different Y-direction mobile units respectively.
In addition, also can install coating element portion 5 at head 3, head 3 and coating element portion 5 move integratedly in the Y direction.
Control part 9 is configured to, and comprises: information input unit 91, information output unit 92, alarm unit 93, adopt can with the structure of outside exchange message.
Fig. 2 is the figure of the capital equipment observing embodiments of the present invention from front.Hardening unit portion 6 is configured in the below of first substrate mounting workbench 22, and is configured on X1 axle objective table 21.As hardening unit portion 6, can exemplify the ultraviolet irradiation unit for irradiation ultraviolet radiation of UV lamp etc., infrared heater etc. for irradiating ultrared infrared radiation unit etc., irradiate the hardening unit portion of the light of provision wavelengths of comprising.Hardening resin 55 absorbs the light irradiated from hardening unit portion 6, starts sclerosis.
Substrate bonding apparatus 1 is owing to adopting structure as above, so in order to by by be positioned at head 3 ball head 7 top keep second substrate 12b be pasted on first substrate 11, and then above-mentioned second substrate 12b is pushed towards first substrate 11, hardening resin is made to harden in this condition, and can irradiation ultraviolet radiation or heat.About the detailed structure of ball head 7, describe later.
First substrate mounting workbench 22 structure is comprise middle body by the framework dug through.Therefore, the part that second substrate 12 and first substrate 11 bond become the energy 61 that irradiates from hardening unit portion 6 through and irradiated structure.The part dug through can be not only the situation in simple space, and the combinations such as permeable in fact for energy 61 such clathrate or cancellous strengthening part, transparent material can be used.
Carrier 60 can exemplify framework in outside and the carrier of the structure of composition transparent glass material, the carrier etc. in the structure of the parts of the framework in outside and the shape that lattices inside it inside it.
Carrier 60 forms all modes according to the layout of the size of first substrate 11, thickness, stickup second substrate, but for produce the structure of sufficient reaction force to the pressurization from head 3, and be from the energy 61 of hardening unit portion 6 irradiation through material or structure.
As shown in Figure 3, control computer 90, information input unit 91, information output unit 92, alarm unit 93, information recording unit 94 and device control cell 95 carried out connecting in control part 9 and comprise above-mentioned each unit.
As control computer 90, the computer of the numerical operation unit having carried microcomputer, PC, work station etc. can be exemplified.As information input unit 91, keyboard, mouse, switch etc. can be exemplified.As information output unit 92, image display, lamp etc. can be exemplified.
As alarm unit 93, the alarm unit that operator can be caused to note of buzzer, loud speaker, lamp etc. can be exemplified.As information recording unit 94, the semiconductor recording medium of storage card, data disk etc., magnetic recording media, Magnetooptic recording medium etc. can be exemplified.As device control cell 95, Programmable Logic Controller can be exemplified, the be called movement controller equipment etc. of (motion controller).
Device control cell 95 is connected with X1 axle objective table 21, Y1 axle objective table 33, Z1 axle objective table, θ axle motor 36, X2 axle objective table 41, Y2 axle objective table 45 and Z2 axle objective table 46 via control amplifier (not shown).
And then, be also connected with other control appliance (not shown).Device control cell 95 by applying control signal to the control amplifier of each equipment of above-mentioned connection, thus can make above-mentioned each device action or static.
The setting of the coating condition of hardening resin 55, change, use the information input unit 91 be connected with computer for controlling 90 of control part 9 to carry out, and confirm by information display unit 92.
In addition, the above-mentioned coating condition of setting can be registered in the information recording unit 94 be connected with computer for controlling 90, and suitably can read, edits, changes.
［ base plate bonding flow process ］
Fig. 4 is to represent the flow chart of the order of adhesive base plate according to each step.First substrate 11 is placed in substrate carrier 60(s101), substrate carrier 60 is positioned on first substrate mounting workbench 22 (s102), vacuum suction is carried out to substrate carrier 60 and makes it keep (s103).
Then, utilize view camera (not shown) to read alignment mark (not shown) (s104) that be positioned on first substrate 11, obtain the positional information of the alignment mark be positioned on first substrate 11.The positional information of the alignment mark be arranged on first substrate 11 obtained is sent to the control computer 90 of control part 9, in order to the position of the first substrate 11 be positioned on substrate-placing workbench 22, posture and using are asked in computing.
Based on the position of first substrate 11 of asking for as mentioned above, the information of posture, first substrate 11 is made to move to resin coating position (s105), the hardening resin (s106) of coating ormal weight.
Then, the bond locations (s107) first substrate 11 of the hardening resin 55 being coated with ormal weight being moved to register in advance.
On the other hand, the second substrate 12 of regulation piece number is placed in pallet 48(s111), pallet 48 is positioned in above second substrate mounting workbench 42 (s112), vacuum suction is carried out to pallet 48 and makes it keep (s113).
Then, second substrate 12(s114 is picked up by the transfer handle 47 of pallet delivery section 4), make second substrate 12 be placed in temporary placing table 26(s115).
Next, the head 3 in objective table portion 2 is moved, is kept the second substrate 12a(s116 be temporarily placed on temporary placing table 26 by the top of the ball head 7 of head 3).
Utilize view camera (not shown) to read alignment mark (not shown) (s117) on the surface being positioned at the second substrate 12b kept by ball head 7, obtain the positional information of the above-mentioned alignment mark be positioned on above-mentioned second substrate 12b.The positional information of the above-mentioned alignment mark obtained is sent to the control computer 90 of control part 9, in order to the position of the first substrate 11 be positioned on substrate-placing workbench 22, posture and using are asked in computing.
Based on the position of second substrate 12b of asking for as mentioned above, the information of posture, the bond locations (s118) second substrate 12b being moved to register in advance.Now, under the state that first substrate 11 and the mutual contraposition of second substrate 12b complete, the wiring electrode pattern contacted with each other toward each other.
Make the second substrate 12b bending (s121) kept by the top of ball head 7.About the mechanism making second substrate 12b bend and flow process, carry out open in the detailed description of the ball head 7 described later.
Second substrate 12b is declined (s122) down in Z-direction, contacts (s123) with the hardening resin 55 be coated on first substrate 11.
And then, second substrate 12b is declined (s124) down in Z-direction, imitates first substrate 11(s125).About the mechanism and the flow process that make second substrate 12b imitate first substrate 11, carry out open in the detailed description of the ball head 7 described later.
And then, second substrate 12b is pressed into (s126) towards first substrate 11, under the state on the whole surface of pressing second substrate 12b, only irradiates the ultraviolet (s127) of stipulated time, hardening resin 55 is hardened.
After hardening resin 55 hardens, the absorption removing second substrate 12b keeps, and makes head 3 rise (s128).
Afterwards, in order to paste next second substrate being set in next bond locations on first substrate 11, and as described above, pick up next second substrate from pallet 48, and be placed on temporary placing table 26.Next, be repeated below work: pickup is positioned over next second substrate of temporary placing table 26 temporarily, read alignment mark, carry out contraposition, paste first substrate.
As mentioned above, making after the second substrate 12 of regulation piece number is bonded on first substrate 11, together with carrier 60, first substrate 11 loaded workbench 22 from first substrate and unload.Afterwards, by not yet paste second substrate, the first substrate that is placed in next carrier is positioned on first substrate mounting workbench 22.
The first substrate 11 being pasted with the second substrate of regulation piece number is fetched into outside substrate bonding apparatus 1 together with carrier 60.The above-mentioned first substrate be removed is unloaded from carrier 60, transports to subsequent processing.By repeating above-mentioned operation, the first substrate being pasted with second substrate of piece number of expectation can be produced.
due towhen having picked up the second substrate of regulation piece number, the pallet 48 being accommodated with second substrate 12 has become empty, so taken out from device by empty pallet, supplements next pallet being accommodated with second substrate 12.
［ ball head ］
Fig. 5 (a) ~ (e) be the profile of the internal structure representing ball head 7 and show base plate bonding time situation.Fig. 5 (a) is the figure representing the state being kept second substrate 12b by the top of ball head 7.Ball head 7 adopts the structure of container of case, tubular, be configured to, comprise: at least the framework 70 of the mode of its opening, the substrate deformation mechanism part 71 being configured in the inside of framework 70 and the substrate installed in the mode of the above-mentioned peristome blocking framework 70 keep film 72.
Keep film 72 as substrate, use the elastomeric material of the free-extension such as rubber, soft resin, can be flexible in 3 dimension directions by metal material and appropriately combined such of above-mentioned elastomeric material elastomer.Substrate keep film 72 when with second substrate 12b overlook measure-alike or less also can implement, but preferably than second substrate 12b to overlook size large.If doing so, even if the interim second substrate 12a placed is placed on temporary placing table 26 with being departed from, the state that the whole surface of second substrate 12b is kept film 72 to cover by substrate can also be become.
Substrate keeps the substrate possessed in film 72 for carrying out attracting holding to second substrate 12b to keep film connected entrance 721, is connected with the attraction unit (not shown) of the outside of ball head 7 via transfer valve.
The air chamber 73 of ball head 7, via the air chamber connected entrance 731 being arranged at framework 70, is communicated with the pressure regulating unit (not shown) of outside.Above-mentioned pressure regulating unit is configured to, and suitably comprises the pressure feed unit of device outside, decompressing unit, the transfer valve unit that is connected with extraneous air.
Substrate deformation mechanism part 71 is configured to, and comprises: cylinder 711, piston 712, the press head 713 being installed on piston, the piston that is communicated with cylinder 711 pushes side connected entrance 714 and piston pulls side mouth 715.
Piston pushing side connected entrance 714 pulls side mouth 715 with piston and is communicated with the pressure regulating unit (not shown) of outside respectively.Above-mentioned pressure regulating unit is configured to, and suitably comprises the pressure feed unit of device outside, decompressing unit, the transfer valve unit that is connected with extraneous air.
Such as, if the pressure that the pressure ratio piston of piston pushing side connected entrance 714 pulls side mouth 715 is high, then piston 712 moves down in Z-direction.On the contrary, if the pressure that the pressure ratio piston of piston pushing side connected entrance 714 pulls side mouth 715 is low, then piston 712 moves upward in Z-direction.
Substrate keeps film 72 in the structure being become distortion by substrate deformation mechanism part 71 down when Z-direction presses.Therefore, the second substrate 12b kept by the top of ball head 7 can be made to bend.
Above-mentioned action is corresponding with the step (s121) that the second substrate 12b making to be kept by the top of above-mentioned ball head 7 bends.
Fig. 5 (b) be represent the second substrate 12b making to be kept by ball head 7 bend after the figure of state.
Pressure in air chamber 73 is identical pressure because air chamber connected entrance 731 is communicated with extraneous air with extraneous air.On the other hand, make piston pull side connected entrance 715 and be communicated with extraneous air, piston pushing side connected entrance 714 is pressurized to the pressure (such as, 0.3MPa) of regulation.
Therefore, piston 712 and the press head 713 that is linked to piston 712 become and move down and static state in Z-direction.Substrate keeps film 72 to be out of shape because piston 712 is pushed down, and meanwhile, the second substrate 12 that remain bends.Now, under the state to the reaction force balance bent pushing the power of piston 712, the reaction force of substrate maintenance film 72 inside and second substrate 12, distortion stops, and becomes equilibrium state.
Next, close air chamber connected entrance 731, make air chamber inside become air-tight state.Now, also can be pressurized to the air of authorized pressure (such as, 0.2MPa) to air chamber 73 delivered inside, become pressurized state.
Air chamber 73 is the spaces keeping film 72 airtight by framework 70 and substrate, and when sending into the fluid after pressurization to air chamber connected entrance 731, the pressure of air chamber 73 inside is just higher than extraneous air, and substrate keeps film 72 to be out of shape in the mode of externally bulging.When pressure and the distortional elastomer of air chamber 73 under the state of the equalization of strain of elastomer inside generation, substrate keeps the distortion of film 72 to stop, and becomes equilibrium state.
Next, head 3 is moved (that is, declining) down in Z-direction, the second substrate after distortion 12 is contacted with the hardening resin 55 be coated on first substrate 11.Fig. 5 (c) is the figure of the state after the second substrate 12 after representing above-mentioned distortion contacts with the hardening resin 55 be coated on first substrate 11.
And then, head 3 is declined, the second substrate after distortion 12 is contacted with first substrate 11.Fig. 5 (d) is the second substrate 12 after representing above-mentioned distortion and the figure of the state that first substrate 11 contacts.
Now, the hardening resin 55 be coated on first substrate 11 spreads out towards periphery, penetrates in the gap of the minute asperities between first substrate 11 and second substrate 12, the ground coating of thinner extension on one side.Now, the wiring electrode pattern in opposite directions of first substrate 11 and second substrate 12 contacts with each other, and also prevent being mixed into of space.
And then make head 3 decline, the periphery of second substrate 12 contacts with first substrate 11.Now, hardening resin 55 arrives the outside of the periphery of second substrate 12, is pressed into second substrate 12 towards first substrate 11, the small gap of clogging both sides' substrate.
Above-mentioned action imitates the step of first substrate 11 (s125) corresponding with the above-mentioned second substrate 12 that makes.
Now, air chamber 73 is air-tight state, and inner pressure raises, and second substrate keeps film 72 to be overlook the elastomer that size is greater than second substrate 12, therefore applies impartial power to the whole surface of the second substrate 12 kept.
Even if when second substrate 12 and second substrate keep being mixed into foreign matter between film 72, also can prevent pressing force from concentrating on foreign matter part, impartial power can be applied to the whole surface of second substrate 12.
Afterwards, the air that will be pressurized to authorized pressure (such as, 0.4MPa) is further sent in air chamber 73, and carrying out pressurizes also can.
Fig. 5 (e) is the figure of the state representing the state after being pressed into second substrate 12 towards first substrate 11 and hardening resin 55 is hardened.The ultraviolet 61 of stipulated time is only irradiated from ultraviolet irradiation unit 6.
Under the state be pressed into towards first substrate 11 by second substrate 12, only irradiate the stipulated time ultraviolet 91 of (such as 5 seconds) from ultraviolet irradiation unit 90.As long as the energy intensity of the ultraviolet 91 irradiated, irradiation time suitably regulate according to the hardening characteristics of the hardening resin 55 after coating.
After hardening resin absorbs ultraviolet 91 sclerosis, make piston push side connected entrance 714 to atmosphere opening, pull side connected entrance 715 to piston and carry forced air, piston 712 is moved (that is, rising) upward in Z-direction.
Next, make substrate keep film connected entrance 721 to atmosphere opening, according to circumstances, the air suitably after conveying compression, keeps removing by the absorption of substrate.
Afterwards, make air chamber connected entrance 731 to atmosphere opening, the pressurized state of air chamber 731 is removed, makes ball head 7 increase.
As mentioned above, ball head 7 is made up of the framework of structure of container, adopts at least 1 face to be the elastomeric structure as base plate bonding head.Therefore, make second substrate 12 bending after, can bond with first substrate 11, imitate surface configuration, and can give the load of equalization.Therefore, when making second substrate 12 bond with first substrate 11, being mixed into of space can be prevented.
And then ball head 7 just can carry out the distortion of second substrate 12 and the structure of pressurization owing to have employed continuously with a head, so just can carry out substrate bonding each other at short notice.Its result, can increase the production quantity of time per unit.
In addition, due to second substrate 12 is pressed towards first substrate 11 as described above by ball head 7, so the contact area of the wiring electrode pattern in opposite directions of first substrate 11 and second substrate 12 increases.Afterwards, by making hardening resin harden, thus maintaining the adaptation of first substrate and second substrate, also maintaining the contact area of above-mentioned wiring electrode pattern.Its result, improves the reliability of conducting further.
And then, by selecting to have the material of the character of adjoint thermal expansion to hardening resin 55, thus make with high-temperature heating its harden after return to normal temperature time, the adhesion of first substrate and second substrate improves further.Or by selecting to have the material of the character of ageing ground volume contraction to hardening resin 55, thus making after it hardens, the adaptation of first substrate and second substrate also improves further.Thus, the contact area of the wiring electrode pattern in opposite directions of first substrate and second substrate increases further.Its result, improves the reliability of conducting further.
Different from above-mentioned execution mode, in above-mentioned steps s121 ~ s123, second substrate 12 is declined down in Z-direction, contacting slightly before with first substrate 11, stopping above-mentioned decline, afterwards, second substrate 12 is bent, contacts with the hardening resin 55 be coated on above-mentioned first substrate 11 and also can.Thus, by the power of lower piston 712, substrate keep the reaction force of film 72 inside, second substrate 12 to bending reaction force and balance from the reaction force of first substrate 11, can stable equilibrium state be formed.
Therefore, can prevent from keeping the reaction force of film 72 inside, the uneven to bending reaction force of second substrate 12 by the power of lower piston 712, substrate, make second substrate too bending, cause plastic deformation, or the state of affairs of breaking occur.
In above-mentioned steps s127, under the state on the whole surface of pressing second substrate 12, the time of preferred irradiation ultraviolet radiation applies above-mentioned hardening resin to harden completely the required time.But, when until resin hardens completely required time longer (such as 1 hour), the electrode wiring pattern that also only can carry out first substrate 11 and second substrate 12 is the ultraviolet of the time (such as 5 seconds) required for temporary transient sclerosis of unseparated degree, heating each other, take out substrate afterwards, use other device flower official hour (such as 1 hour) to make it harden completely.
As mentioned above, by the hardening process of hardening resin being divided into temporarily sclerosis and hardening completely, the shortening of device of the present invention, method can be used thus for the time of adhesive base plate.So just can increase fertile quantity in time per unit.
As the another way of above-mentioned ball head 7, following structure can be exemplified, that is, omit substrate deformation mechanism part 71, regulate the pressure of air chamber 73, make substrate keep film 72 to be out of shape, thus kept second substrate 12b is bent.If adopt this structure, even if then omit substrate deformation mechanism part 71, second substrate 12b also can be made to bend, bond with first substrate 11.Therefore, the bonding of substrate being carried out with simple structure, also preventing from being mixed into space when bonding.
In the above-described embodiment, the method of hardening as making hardening resin, mainly record the method using the material that hardened by ultraviolet to come its irradiation ultraviolet radiation, the material hardened by heating is used to carry out the method heated, but also can make with the following method, or following each method is carried out appropriately combined enforcement, wherein said method comprises: to use by heating the softening and material hardened by cooling to carry out the method heating/cool, the material hardened by humidification is used to carry out the method for humidification, the material of the sclerosis by drying is used to carry out dry method.
As the material hardened by ultraviolet, there is the polymerization reaction take place when irradiation ultraviolet radiation, form high molecular network structure and harden and non-restoring character, epoxy resin, polymercaptan resin, unsaturated polyester resin, urethane resin etc. can be exemplified.
As the material hardened by heating, there is polymerization reaction take place when heated, form high molecular network structure and harden and non-restoring character, phenolic resins, epoxy resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resins, urethane resin, thermosetting polyimides etc. can be exemplified.
As softening by heating and the material hardened by cooling, have and be heated to fusing point and soften, the character of solidifying by cooling afterwards, can exemplify the thermoplastic resin of polyethylene, polypropylene, polyvinyl chloride, polystyrene, PTFE, ABS resin, acrylic resin, polyamide, polyimides, polyamidoimide, nylon, Merlon, PET etc.
As the material hardened by humidification, have and absorb moisture and the character of hardening, can silicones etc. be exemplified.
As the material hardened by drying, there is the character of solidifying by externally being released by the moisture in material, the material of natural drying can be exemplified.
Than that described above, as hardening resin 55, also can use by applying the energy of microwave, X ray etc. and the material hardened from external forced.
Different from the embodiment described above, when be placed in first substrate mounting workbench 22 on carrier 60, first substrate 11 position easily depart from, X1 axle objective table 21 and first substrate mounting workbench 22 between add make first substrate load workbench 22 θ direction angle change unit also can.In this case, read and be positioned at the position of the alignment mark of first substrate 11, regulate the θ direction of first substrate mounting workbench 22, can make first substrate 11 with specify towards consistent.
In the above-described embodiment, carrier 60 is used to be illustrated, but, if first substrate 11 has the intensity producing sufficient reaction force to the pressurization from head 3, and directly can be placed in first substrate mounting workbench 22, then not use carrier 60 also can.
As another execution mode again, even if first substrate 11 is the sheet materials in rolling cylindrical wound, if make above-mentioned sheet material extend on carrier 60, substrate-placing workbench 22 and flatly keep, be then similarly also counted as substrate, the present invention can be used to paste second substrate 12.
Industry utilizes possibility
The present invention surface be formed wiring electrode pattern substrate on assemble identical surface be formed wiring electrode pattern substrate time etc. can utilize.
The explanation of Reference numeral
1 substrate bonding apparatus;
2 objective table portions;
3 heads;
4 pallet delivery section;
5 coating element portions;
6 hardening unit portions;
7 ball heads;
9 control parts;
11 first substrates;
12 second substrates;
The second substrate that 12a places temporarily;
The second substrate that 12b is kept by ball head;
The second substrate that 12c has bonded;
20 device pedestals;
21 X1 axle objective tables;
22 first substrate mounting workbench;
26 temporary placing table;
31 pillars;
32 beams;
33 Y1 axle objective tables;
34 reciprocating mechanisms;
35 motor;
36 θ axle motor;
40 device pedestals;
41 X2 axle objective tables;
42 second substrate mounting workbench;
43 pillars;
44 beams;
45 Y2 axle objective tables;
46 Z2 axle objective tables;
47 handle portion;
48 pallets;
51 z-stage;
52 motor;
53 distributors;
55 hardening resins;
60 substrate carriers;
61 ultraviolets;
70 frameworks;
71 substrate deformation mechanism part;
72 substrates keep film;
73 air chambers;
80 syringes;
81 z-stage;
82 motor;
90 control computers;
91 information input units;
92 information display units;
93 alarm unit;
94 information recording units;
95 device control cells;
96 image information input parts;
711 cylinders;
712 pistons;
713 press heads;
714 piston pushing side connected entrances;
715 pistons pull side connected entrance;
721 substrates keep film connected entrance;
731 air chamber connected entrances.
Claims (9)
1. a substrate bonding apparatus, it is that first substrate surface being formed with wiring electrode pattern carries out to make mutual described electrode wiring pattern mode toward each other the device bonded with the surperficial second substrate with the electrode pattern that connects up, it is characterized in that possessing:
Keep the unit of described second substrate;
Read the alignment mark that is positioned on the surface of described second substrate, obtain for computing ask for the position of described first substrate and posture, the unit of the positional information of described alignment mark;
Its bending unit is made under the state keeping described second substrate;
Hardening resin is applied at least one party of described first substrate or described second substrate, according to the positional information of acquired described second substrate, described second substrate and described first substrate are carried out contraposition, makes described first substrate and the close unit of described second substrate;
Make the unit that described second substrate presses towards described first substrate.
2. substrate bonding apparatus as claimed in claim 1, is characterized in that,
Possess in the unit making described second substrate press towards described first substrate and keep the unit of described second substrate and make the unit that described second substrate is bending,
Described substrate bonding apparatus possesses when described second substrate is pressed against described first substrate, makes described second substrate imitate the unit of the surface configuration of described first substrate.
3. substrate bonding apparatus as claimed in claim 1 or 2, is characterized in that,
Under the state that described second substrate is pressed against described first substrate, described hardening resin is hardened.
4. a base plate bonding method, it is that first substrate surface with wiring electrode pattern carries out to make mutual described electrode wiring pattern mode toward each other the method bonded with the surperficial second substrate with the electrode pattern that connects up, and it is characterized in that,
Have:
Keep the step of described second substrate;
Read the alignment mark that is positioned on the surface of described second substrate, obtain for computing ask for the position of described first substrate and posture, the step of the positional information of described alignment mark; With
Its bending step is made under the state keeping described second substrate,
Have:
Hardening resin is applied at least one party of described first substrate or described second substrate, according to the positional information of acquired described second substrate, described second substrate and described first substrate are carried out contraposition, makes described first substrate and the close step of described second substrate;
While make described second substrate imitate the surface configuration of described first substrate, described second substrate and described first substrate are carried out the step bonded;
Make the step that described second substrate presses towards described first substrate.
5. base plate bonding method as claimed in claim 4, is characterized in that having:
Under the state that described second substrate is pressed against described first substrate, make the step that described hardening resin hardens.
6. for the base plate bonding head in substrate bonding apparatus according to claim 1, it is made up of the framework of structure of container, and at least 1 face is elastomer, it is characterized in that, possesses:
Use the unit of described elastomeric maintenance second substrate;
Make the facial disfigurement of the described second substrate of maintenance and make the unit that described second substrate is bending.
7. base plate bonding head as claimed in claim 6, is characterized in that,
Possess the unit of the facial disfigurement making the described second substrate of maintenance,
Have and make the facial disfigurement of the described second substrate of maintenance and make the structure that described second substrate is bending.
8. base plate bonding head as claimed in claims 6 or 7, is characterized in that,
Possess the unit of the pressure regulating framework inside,
There is the described pressure of adjustment, make the described elastomeric facial disfigurement of the described second substrate of maintenance and make the structure that described second substrate is bending.
9. base plate bonding head as claimed in claim 6, is characterized in that,
Have when described second substrate is pushed to first substrate, make described second substrate imitate the surface configuration of described first substrate, and the structure of impartial load can be applied described second substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009173003A JP5314523B2 (en) | 2009-07-24 | 2009-07-24 | Substrate laminating apparatus and method, and substrate laminating head |
| JP2009-173003 | 2009-07-24 | ||
| PCT/JP2010/062453 WO2011010729A1 (en) | 2009-07-24 | 2010-07-23 | Substrate-bonding device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102474991A CN102474991A (en) | 2012-05-23 |
| CN102474991B true CN102474991B (en) | 2015-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080032985.6A Expired - Fee Related CN102474991B (en) | 2009-07-24 | 2010-07-23 | Substrate-bonding device and method and substrate bonding head |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5314523B2 (en) |
| KR (1) | KR101726899B1 (en) |
| CN (1) | CN102474991B (en) |
| TW (1) | TWI494220B (en) |
| WO (1) | WO2011010729A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101367668B1 (en) * | 2011-11-23 | 2014-02-28 | 엘아이지에이디피 주식회사 | Apparatus and method for attaching substrates |
| JP6188123B2 (en) | 2012-12-28 | 2017-08-30 | 芝浦メカトロニクス株式会社 | Bonding device and bonding processing method |
| CN108664171A (en) * | 2018-05-22 | 2018-10-16 | 新辉开科技（深圳）有限公司 | A kind of method of plastic cover plate and glass gluing |
| CN109633945A (en) * | 2019-01-21 | 2019-04-16 | 信利半导体有限公司 | A kind of full applying method of display module |
| CN112670215B (en) * | 2020-12-31 | 2023-06-20 | 北京中电科电子装备有限公司 | Device for bonding and debonding wafers and wafer bonding and debonding method |
| TWI823702B (en) * | 2022-12-05 | 2023-11-21 | 斯託克精密科技股份有限公司 | Device configured to push electronic substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4927479A (en) * | 1983-11-02 | 1990-05-22 | Boeck Josef | Process and plant for pressing flexible sheets |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3069511B2 (en) * | 1995-07-14 | 2000-07-24 | 松下電工株式会社 | Stacking equipment for laminate production |
| JP3997585B2 (en) * | 1998-01-26 | 2007-10-24 | 松下電工株式会社 | Multilayer board manufacturing method |
| JP3932660B2 (en) * | 1998-03-30 | 2007-06-20 | 株式会社デンソー | Manufacturing method of EL display device |
| JP4289912B2 (en) * | 2003-03-12 | 2009-07-01 | キヤノン株式会社 | Inter-substrate wiring electrode bonding method |
| JP2004296139A (en) * | 2003-03-25 | 2004-10-21 | Sony Corp | Sticking device, sticking method, and manufacturing method of display device |
| JP2005209704A (en) * | 2004-01-20 | 2005-08-04 | Fujikura Ltd | Bonding structure and bonding method for circuit board |
| JP4300476B2 (en) * | 2004-04-27 | 2009-07-22 | セイコーエプソン株式会社 | Manufacturing method of organic EL device |
-
2009
- 2009-07-24 JP JP2009173003A patent/JP5314523B2/en not_active Expired - Fee Related
-
2010
- 2010-07-23 CN CN201080032985.6A patent/CN102474991B/en not_active Expired - Fee Related
- 2010-07-23 KR KR1020127004711A patent/KR101726899B1/en active IP Right Grant
- 2010-07-23 TW TW099124227A patent/TWI494220B/en not_active IP Right Cessation
- 2010-07-23 WO PCT/JP2010/062453 patent/WO2011010729A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4927479A (en) * | 1983-11-02 | 1990-05-22 | Boeck Josef | Process and plant for pressing flexible sheets |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101726899B1 (en) | 2017-04-13 |
| CN102474991A (en) | 2012-05-23 |
| JP2011029368A (en) | 2011-02-10 |
| KR20120037500A (en) | 2012-04-19 |
| TW201107138A (en) | 2011-03-01 |
| WO2011010729A1 (en) | 2011-01-27 |
| TWI494220B (en) | 2015-08-01 |
| JP5314523B2 (en) | 2013-10-16 |
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