JP4347932B2 - Resin sealing device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin sealing device for manufacturing a semiconductor device.
[0002]
[Prior art]
A resin sealing device conventionally used for manufacturing a semiconductor device will be described with reference to FIG. In FIG. 6, reference numeral 101 denotes a mold die provided at the center of the apparatus main body. In the mold 101, a lead frame, a BGA circuit board, a resin tablet, or the like, which is a molded product, is carried. On the upper and lower mold surfaces of the mold 101, lock blocks 102 for positioning the upper mold and the lower mold in the XY directions are provided on four sides.
A molding product supply unit 103 is provided on one side (left side of the drawing) of the mold 101 and a molded product storage unit 104 is provided on the other side (right side of the drawing).
[0003]
The molded product supply unit 103 is provided with a supply magazine for storing the lead frame 106 and a parts feeder 108 for storing the resin tablet 107 with the supply table 105 interposed therebetween.
The lead frames 106 accommodated in the supply magazine are sent out one by one by a pusher and further supplied onto the supply table 105 by a transport carrier. Further, the resin tablet 107 is held on the holder from the parts feeder 108 by the amount of resin sealing once and supplied onto the supply table 105. Then, the lead frame 106 and the resin tablet 107 are conveyed to the mold 101 while being held by a loader 109 that reciprocates between the supply table 105 and the mold 101.
[0004]
The molded product storage unit 104 is equipped with a degate unit 111 for gate-breaking the molded product 110 and a storage magazine 112 for storing only the molded product 110 from which unnecessary resin is removed. The molded product after resin sealing is held by the unloader 113 that reciprocates between the mold 101 and the degate unit 111 and placed on the degate unit 111. Then, after the gate break at the degate unit 111 and the unnecessary resin is collected in the scrap box, only the molded product 110 is held by the storage hand and stored in the storage magazine 112.
The unloader 113 is equipped with an air suction port 113a and a cleaning brush 113b for cleaning the mold surface when the molded product is held and retracted from the mold 101, and these are arranged along the mold surface. The rest of the sealing resin and dust are removed by suction when sliding.
Reference numeral 114 denotes a control unit that controls the operation of the resin sealing device.
[0005]
[Problems to be solved by the invention]
However, the conventional resin sealing device shown in FIG. 6 has the following problems. That is, if you want to use granular resin from a resin tablet, if you want to resin seal the heat sink and the like together with the lead frame 106 that is to be molded, or if you want to resin seal using a release film, Due to the growing needs for low-volume production of products, as well as the need to improve the quality of semiconductor devices and reduce manufacturing costs, it is necessary to add various functions to the resin sealing device and change the existing device configuration. is there. In this case, in the conventional apparatus layout, the installation space for the extension unit is scarce and a large design change is required, so that it has been difficult to realize the apparatus form in response to the above needs.
[0006]
Further, when the product to be molded is changed from a lead frame to a circuit board for BGA, the storage magazine 112 is changed to a slit magazine (bonder magazine) 115 in which a slit is formed for each molded product, so that the storage space is on the front side. In addition to the fact that the installation area of the apparatus increases, a storage pusher for pushing the molded product 110 into the slit magazine 115 from the degate part 111 is also required, and the apparatus configuration must be greatly changed.
[0007]
Further, at least three kinds of hands such as a loader 109 for loading and unloading a molded product and a molded product, a chuck hand mounted on the unloader 113, and a storage hand stored in the storage magazine 112 from the degate unit 111 are used. Since it is used, the chuck position of the molded product changes when the molded product is changed. Therefore, each hand must be replaced according to the product, and it takes time to change the product. In addition, since the hand changes according to the transport route, a transfer area and a drive source are required for each of the three types of hands, leading to an increase in the size of the apparatus.
Also, the long distance from the supply port of the resin tablet 107 to the holder of the conventional parts feeder 108 to the delivery to the loader 109 has led to an increase in the size of the apparatus.
[0008]
In addition, according to the conventional apparatus layout, replenishment and replacement of molded products such as lead frames and circuit boards for BGA, replenishment and replacement of resin tablets, replacement of scrap boxes containing unnecessary resin, replacement of storage magazines, etc. Since the maintenance work is performed from different sides of the apparatus, a sufficient space must be secured around the apparatus in advance, the apparatuses cannot be arranged close to each other, and the floor area of the clean room cannot be used effectively.
[0009]
Further, since the lock block 101a protrudes from the mold surface of the mold 101, the suction port 113a of the cleaner provided in the unloader 113 interferes and the dust attached to the mold surface cannot be sufficiently removed by suction. Further, a relief (recess) is formed on the mold surface for the chuck hands of the loader 109 and the unloader 113 to place the molded product or hold the molded product. If it accumulates, it cannot be removed. If it is left as it is, there is a risk of causing a chuck failure of the chuck hand.
[0010]
The present invention has been made to solve the above-described problems of the prior art, and the object of the present invention is to realize a device layout in which various function expansion units can be easily added, and to change the device configuration in accordance with a change in molding type. Easier operation, maintenance work such as replenishment and replacement of molded products and molded products, etc. from the same side, improving workability and downsizing the device to effectively use the installation area, cleaning performance An object of the present invention is to provide a resin sealing device that can be improved.
[0011]
[Means for Solving the Problems]
  The present invention has the following configuration in order to achieve the above object.
  That is, a supply unit that supplies a molded product, a storage unit that stores the molded product, and a supply storage area that includes a delegate unit that separates the molded product and unnecessary resin are on one side with respect to the molding area that has the resin sealing unit. Next to each otherLinearlyCentrally placed around the molding areaAn expansion area in which an expansion unit can be added is formed in the empty area of the product, and the transfer operation of the molded product from the supply unit to the resin sealing unit, the transfer operation of the molded product and unnecessary resin to the delegation unit, the molded product At least two of the transfer operations from the delegation section to the storage section are performed using the same transport bodyIt is characterized by that.
[0012]
  Also, the aboveIn the supply storage area, the molded product stored in the supply magazine, the molded product stored in the storage magazine, the scrap box for collecting unnecessary resin, and the dust box in the molding area are replaced from the same side as the mold chase pull-out direction. The feature is that work can be done.
  Further, the supply section, the storage section, the degate section and the resin sealing section of the molding area in the supply / storage area are linearly arranged adjacent to each other in this order.
  Further, the chuck hand mounted on the transport body has a rail shape with an L-shaped cross section so that the distance between the hands can be varied.It is characterized by being provided.
  Moreover, the said conveyance body reciprocates between a said supply part and the said resin sealing part along a guide rail, It is characterized by the above-mentioned.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a resin sealing device for manufacturing a semiconductor device according to the present invention will be described in detail with reference to the accompanying drawings. 1 is a plan view showing a layout configuration of the resin sealing device, FIG. 2 is a front view of the resin sealing device of FIG. 1, FIG. 3 is a left side view of the resin sealing device of FIG. 1, and FIG. FIGS. 5A and 5B are plan views of the upper mold and the lower mold of the mold. FIG. 5A and FIG.
[0014]
First, a schematic configuration of the resin sealing device will be described with reference to FIGS. 1 to 3.
In FIG. 1, the layout configuration of the resin sealing device will be described. A supply storage area P having a supply portion A for supplying a molded product 1 such as a lead frame or a circuit board for BGA, a storage portion B for storing a molded product 2, and a delegate portion C for separating the molded product 2 and unnecessary resin is provided. Further, they are concentratedly arranged adjacent to each other on one side (left side in FIG. 1) with respect to the molding area Q having the resin sealing portion D. That is, an extension unit R having various functions can be added by forming an extension area R in an empty area formed around the molding area Q. Supply section A, storage section B, degate section C in supply storage area P and resin sealing section D in molding area Q are arranged linearly. This is because the moving distance of the transfer body 17 to be described later can be made the shortest, and by arranging these adjacently, the installation area can be made efficient and downsizing can be realized.
In addition, the arrangement order of the supply unit A, the storage unit B, and the degate unit C in the supply storage area P arranged in a straight line is not necessarily limited to the order shown in FIG. May be.
[0015]
Examples of expansion units that can be added to the expansion area R include film transport units such as long or strip-like release films, granule resin supply units, cleaning brushes, cleaning sheets, and UV irradiation methods. Cleaner unit for cleaning, supply unit for molded products such as heat sink, vacuum unit for vacuum forming and film suction, ejector pin drive that pushes down or pulls up the upper ejector pin plate, or both push-down and pull-up functions A plurality of units or the like may be provided in combination.
[0016]
Next, a specific configuration of the resin sealing device will be described. The configuration of the supply unit A that supplies the molded product 1 will be described. Reference numeral 3 denotes a supply magazine that accommodates the product 1 to be molded. In this embodiment, the supply magazine is provided in two upper and lower stages as shown in FIG. The supply magazine 3 is raised intermittently by an elevation mechanism (not shown) every time the articles 1 to be formed are supplied one by one. In FIG. 3, reference numeral 4 denotes a drawer chuck hand, which pulls out the molded product 1 from the supply magazine 3 to the supply table 5. This drawer chuck hand 4 is mounted on a supply table 5 and is integrally mounted on a movable body having a nut connected to a screw shaft (ball screw) that is rotationally driven by a drawer motor 6. It is designed to reciprocate vertically. The supply magazine 3 can be replenished with the product 1 from the direction of arrow F in FIG. 1, which is the same direction as the mold chase withdrawing direction.
[0017]
In FIG. 1, a parts feeder 8 that accommodates the resin tablet 7 is provided at the lower part of the supply unit A, the storage unit B, and the delegate unit C. As shown in FIG. 2, the parts feeder 8 aligns and feeds the resin tablets 7 one by one. Then, the fed resin tablet 7 is moved to the holding hole position of the holder 10 where the tablet elevation mechanism 9 stands by with its longitudinal direction facing up and down, and is held by the filling pusher 11 (see FIG. 3). One by one. The holder 10 holds and transports the resin tablet 7 as much as necessary for one resin sealing operation. As shown in FIG. 3, the holder 10 is supported by a holder support member 12 so as to be rotatable about a fulcrum 13, and the holder support member 12 is linked to a belt 14 that is rotationally driven by a drive source (not shown). When the guide shaft 15 rises along the guide hole 16, the holder support member 12 rotates 90 ° so that the holder 10 is supported in the horizontal direction parallel to the supply table 5 on the upper end side of the guide hole 16. Yes. The replenishment of the resin tablet 7 to the parts feeder 8 can be performed from the direction of arrow F in FIG. 1 by opening and closing the tablet replenishing door 8a shown in FIG.
Thus, the resin tablet 7 is transferred from the supply port (exit) of the parts feeder 8 to the holder 10 waiting at a close distance, and the holder 10 is moved up and down with respect to the supply table 5 from below. The transfer distance of the resin tablet 7 to the carrier to be described later is shortened, which is advantageous for downsizing the apparatus and speeding up the supply operation of the resin tablet 7.
[0018]
In FIG. 1, reference numeral 17 denotes a transport body, which transports the molded product 1 to the resin sealing portion D, transports the molded product 2 and unnecessary resin to the degate portion C, and stores the molded product 2 from the delegate portion C. Although it is desirable that at least two or more of the transport operations to the part B are performed by the same transport body 17 from the viewpoint of sharing parts, in the present embodiment, these three transport operations are performed by the same transport body 17. It is supposed to be done at.
The transport body 17 includes a chuck hand 18 (see FIG. 2) for chucking the molded product 1 and the molded product 2, a tablet holding unit 19 for holding the resin tablet 7, and an unnecessary resin for the molded product when performing a gate break. And an air suction port 21 for cleaning the surface of the mold, and the like. Since the chuck hand 18 holds the molded product 1 and the molded product 2 having different width sizes, the distance between the left and right hands can be increased or decreased. As shown in FIG. 2, the tablet holding unit 19 receives and holds the resin tablet 7 from the holder 10 supported on the supply table 5 in the horizontal direction.
[0019]
In FIG. 3, the transport body 17 is integrally attached to a movable plate 24 having a nut connected to a screw shaft (ball screw) 23 that is rotationally driven by a transport motor 22. By rotating the conveying motor 22, the movable plate 24 reciprocates between the supply portion A and the resin sealing portion D along the guide rail 25 (see FIG. 1). In FIG. 1, reference numeral 26 denotes a control unit that controls the operation of the resin sealing device.
[0020]
Next, the structure of the resin sealing part D is demonstrated. In FIG. 1, in this embodiment, a mold for taking a single frame is used as a mold 27 for producing a variety of products in small quantities. In the cavity of the mold 27, one frame of the molded product 1 and the resin tablet 7 are loaded in the pot 27a. In FIG. 2, the upper die 28 is supported by a fixed platen 29, and the lower die 30 is supported by a movable platen 31. A nut connected to a screw shaft that is rotationally driven by an electric motor (not shown) moves up and down, and a movable platen 31 supported via a toggle mechanism moves up and down along a guide post 32. Further, on the lower mold 30 side, a plunger support mechanism 35 including a plunger 33, a hydraulic closed circuit for supporting the plunger 33, an equal pressure unit 34 having a spring, and the like is provided in the pot 27a. The plunger support mechanism 35 moves up and down by a nut 37 connected to a screw shaft 36 that is rotationally driven by an electric motor (not shown).
[0021]
  The parting surface of the mold 27 may be covered with a release film 38. The release film 38 has a predetermined heat resistance that can withstand the heating temperature of the mold 27 and can be easily peeled off from the mold surface or easily deformed according to the shape of the inner surface of a resin sealing portion such as a cavity. Those with flexibility and extensibility, and those that easily peel off from the cured resin after resin sealingTheuse. For example, PTFE, ETFE, PET, FEP film and the like are preferably used. In addition, as shown in FIG. 1, a release film supply mechanism 39 that feeds a long release film 38 from the supply reel to the take-up reel may be provided in an empty space before and after the mold 27.
[0022]
In addition, as shown in FIG. 2, an ejector pin drive unit 40 may be provided in an empty space above the fixed platen 29. This ejector pin drive unit 40 has a function of pushing down or pulling up the upper die ejector pin plate 57 shown in FIG. Specifically, the ejector pin drive unit 40 may be used for releasing the molded product 2 by simply pushing down the upper die ejector pin plate 57 with the push-down rod simultaneously with (1) mold opening. ▼ At the same time as the mold is opened, the upper die ejector pin plate 57 and the upper die chase are urged to be separated by the spring force, and the molded product 2 and the surface of the upper die ejector pin 56 are peeled off, and then ▲ 1 The molded product 2 may be released in the same manner as ▼, or (3) the upper die ejector pin plate 57 may be pulled up to peel off the molded product 2 and the surface of the upper die ejector pin 56. good.
In FIG. 2, a dust box 41 is provided on the front side of the molding area Q, that is, on the front side of the resin sealing portion D so as to be drawn out. A filter unit 42 is provided above the dust box 41, and is sucked from a resin scum or fine powder sucked from an air suction port 21 mounted on the carrier 17 or a resin tablet 7 supplied from a parts feeder 8. Resin powder is sucked and removed by a filter. The filter part 42 is integrated with the dust box 41 and can be removed from the case fixing part 43. In this case, the dust box 41 and the filter can be taken out of the clean room at the same time to be cleaned and replaced, so that the fine powder adhering to the filter is not scattered in the clean room. The attachment / detachment work of the filter unit 42 and the dust box 41 can be performed from the direction of arrow F in FIG.
[0023]
Next, the configuration of the degate unit C will be described with reference to FIG. The molded product 2 after resin sealing is transported to the delegate part C while being integrated with the unnecessary resin by the transport body 17. In FIG. 2, a lower cull presser 44 is provided at the detent position so as to be movable up and down, and the molded product cull can be clamped together with the upper cull presser 20 provided in the transport body 17. Further, a protruding rod 45 that pushes up the molded product 2 in which the molded product cull is clamped by the upper cull presser 20 and the lower cull presser 44 and rotates the molded product cull around a fulcrum is provided at the delegation position. The projecting rod 45 can be moved back and forth in the vertical direction by driving the cylinder, and separates the molded product 2 and unnecessary resin such as the molded product runner 2a and the molded product cal 2b by gate breaking. The separated unnecessary resin is dropped and recovered on a scrap box 46 disposed below the lower cull presser 44. The scrap box 46 can be attached and detached from the direction of arrow F in FIG.
[0024]
Next, in FIG. 1, the structure of the storage part B will be described. The molded product 2 after the delegation is conveyed to the storage unit B by the conveyance body 17. The conveyed molded product 2 is stored in the storage magazine 47. A molded product elevation mechanism 48 is provided at the bottom of the storage magazine 47, and the bottom is lowered every time the molded product 2 is stored. When the molded product 2 is a lead frame, the molded product 2 is stored so as to be stacked on the molded product 2. When the molded product 2 is a BGA circuit board, it is replaced with a BGA storage magazine 49 as shown in FIG. 1, and is stored between the slits for each circuit board. In this case, the circuit board for BGA is supported by the storage rail 50 at the storage position, and the BGA storage magazine 49 along the storage rail 50 by the storage pusher 51 provided corresponding to the storage position. It is designed to be stored in.
The attaching / detaching operation of the storage magazine 47 and the BGA storage magazine 49 can also be performed from the direction of arrow F in FIG.
[0025]
As shown in FIG. 1, since there is sufficient space on the front side of the apparatus, even if the supply magazine 3 or the storage magazine 47 is replaced with a magazine for a circuit board for BGA from the direction of arrow F, these will remain in the apparatus. It does not protrude beyond the installation area.
In FIG. 2, a caster 60 is rotatably mounted on the bottom of the apparatus so that it can be moved on the floor surface by pressing the resin sealing device. The caster 60 can freely move the resin sealing device in the clean room. In addition, a plurality of types of extension units can be prepared and connected to a desired extension unit. When the resin sealing device is fixed at a predetermined position in the clean room, the height is adjusted by a support pillar 61 that can be moved up and down by a screw shaft so as to be horizontal on the floor of the clean room.
[0026]
Here, the relationship between the configuration of the mold 27 and the chucking operation of the chuck hand 18 mounted on the transport body 17 will be described with reference to FIGS.
4A, on the lower mold 30 side, a lower mold ejector pin 52 and a frame ejector pin 53 for releasing the molded product 2, the molded product runner 2a, and the molded product cal 2b can protrude from the lower mold 30. Equipped. The lower die ejector pin 52 and the frame ejector pin 53 are erected on the lower die ejector pin plate 54. An ejector rod 55 is provided below the ejector pin plate 54. When the movable platen 31 moves downward, the ejector rod 55 hits the lower surface of the lower ejector pin plate 54, and the lower ejector pin 52 and the frame ejector pin. 53 is projected. The lower mold ejector pin 52 pushes up the molded product 2, the molded product runner 2 a and the molded product cal 2 b to release the mold, while the frame ejector pin 53 plays a role of a guide pin which is pushed up through the guide hole of the molded product 2. It's done.
Further, an upper die ejector pin 56 that pushes down the molded product 2 and the molded product cal 2b to release is also provided on the upper die 28 side so as to protrude. The upper die ejector pin 56 is erected on the upper die ejector pin plate 57. The upper die ejector pin plate 57 is pushed by a pressing rod (not shown) so that the upper die ejector pin 56 is moved to the upper die 28. It is possible to protrude more.
[0027]
In FIG. 5 (a), the upper mold cull 28a formed on the upper mold 28 is generally formed in a circular shape corresponding to the shape of the pot 27b, but a projection 28b is formed on the upper mold cull 28a. Has been. As a result, in FIG. 4A, a molded product protrusion 2c is formed on the molded product cull 2b. Reference numeral 28c denotes an upper mold cavity. 5B, the lower mold 30 is formed with a pot 27a, a mold runner 30a, a lower mold cavity 30b, and the like.
[0028]
Next, with reference to FIG. 4A, the chucking operation of the molded product 2 of the chuck hand 18 mounted on the conveyance body 17 will be described. When the resin sealing operation is completed and the mold die 27 is opened, the upper die ejector pin 56 protrudes to release the molded product 2 and the lower die 30 moves downward as the movable platen 31 descends. To do. When the lower die ejector pin plate 54 abuts against the ejector rod 55, the lower die ejector pin 52 and the frame ejector pin 53 protrude from the lower die 30 and support the molded product 2 at a position slightly lifted from the lower die surface. . At this time, the support position of the molded product 2 is not shifted because the frame ejector pin 53 is inserted and supported through the guide hole of the molded product 2.
The transport body 17 not only performs the chucking operation of the molded product 2 but also transfers the molded product 1 to the lower mold 30 in order to prevent the chuck hand 18 and the lower mold surface from interfering with each other. The pin 52 and the frame ejector pin 53 are delivered in a state of protruding from the lower mold 30. Thereafter, the lower die ejector pin plate 54 is moved downward to draw the lower die ejector pin 52 and the frame ejector pin 53 into the lower die 30 and are formed on the lower die surface in the guide holes formed in the frame of the molded product 1. The guide pin 30c is inserted and positioned and set.
[0029]
The transport body 17 enters the mold mold 27 that is opened, and holds the molded product 2 supported on the lower mold 30 side by the chuck hand 18. At this time, the distance between the left and right chuck hands 18 is widened because the interval is different for chucking the molded product runner 2a, the molded product cal 2b, and the like in which the unnecessary resin is integrated with the molded product 1 and the molded product 2. Thus, the frame end 2d and the end portion of the molded product cull 2b are clamped by a claw portion 18a formed in an L shape. Thus, since the molded product 2 is pushed up from the lower mold 30 and delivered to the chuck hand 18 of the transport body 17, the nail of the chuck hand 18 that is normally formed on the surface of the conventional lower mold 30. The escape (concave portion) for entering the portion 18a is not necessary.
[0030]
The chuck hand 18 may be provided at a plurality of locations in the longitudinal direction of the molded product 2 in accordance with the position of the molded product runner 2a. However, when the mold die 27 is replaced by replacement of the molded product, the carrier 17 It is necessary to change the mounting position of the chuck hand 18 on the side. On the other hand, as shown in FIG. 4B, it is desirable that the claw portion 18 a of the chuck hand 18 has a L-shaped cross section and has a rail shape continuous in the longitudinal direction of the molded product 2. Similarly, the distance between the chuck hands 18 is variable.
As a result, when the type of molding changes, even if the distance between the molded product runners 2a changes, the distance between the frame end 2d and the molding projection 2c is always constant, so that molding is performed without replacing the chuck hand 18. The product 2 can be securely gripped. Further, since the molded product protrusion 2c is formed on the molded product cull 2b, there is an advantage that reliable support can be performed by the claw portion 18a of the chuck hand 18 formed in a rail shape.
If the position of the runner 2a is avoided and the runner position is almost unchanged, the chuck hand 18 of the transport body 17 shares the slender bar-shaped chuck hand that is conventionally provided in the loader and unloader. Can do. Further, if the molded product 1 and the molded product 2 are in a state of being pushed up from the surface of the lower mold 30, the escape (concave) position of the lower mold 30 and the position of the guide pin 30 c do not overlap with each other. Since it is sufficient to determine the mounting position of the chuck hand 18 in consideration of the position of the molded product runner 2a, it is advantageous for sharing the loader and unloader.
[0031]
5 (a) and 5 (b), the upper mold 28 and the lower mold 30 are respectively opposed to lock blocks 58 and 59 that mesh with each other when the mold is closed to position the mold 27 in the XY direction. It is provided at the edge. The portions where the lock blocks 58 and 59 are provided are provided at positions where they do not interfere with the rubber skirt provided at the air suction port 21 when the carrier 17 chucks and retracts the molded product 2. Is preferred. Thereby, the cleaning operation by the carrier 17 can be performed effectively. Further, the lower mold 30 is not formed with a relief (recessed portion) for entering the claw portion 18a of the chuck hand 18, so there is no risk of dust such as resin powder collecting in the recessed portion. A sufficient effect can be obtained.
[0032]
Next, a resin sealing operation for one cycle of the resin sealing device configured as described above will be described with reference to FIG.
First, the transport body 17 holds the molded product 1 supplied from the supply magazine 3 on the supply table 5 in the supply unit A by the chuck hand 18 and is stored in the holder 10 by the parts feeder 8 and supplied. 7 is held by the tablet holding unit 19. And the conveyance body 17 moves to the resin sealing part D from the supply part A, and transfers the to-be-molded product 1 and the resin tablet 7 in order on the lower mold | type 30 of the mold mold 27 which was mold-opened. At this time, the molded product 1 is supported by the lower mold ejector pin 52 protruding from the lower mold 30 and is positioned and guided by the frame ejector pin 53. Thereafter, when the lower mold 30 is moved upward, the lower mold ejector pin 52 and the frame ejector pin 53 are moved downward and set on the lower mold cavity 30b. The resin tablet 7 is loaded in the pot 27a.
[0033]
Next, the conveyance body 17 moves to the delegation part C, and among the molded product 2 and the unnecessary resin that are resin-sealed in the previous cycle and the unnecessary resin, the molded product kull 2b The lower cull presser 44 is supported by pressing. Then, the molded product 2 is rotated about the molded product cull 2b by the protruding rod 45 to perform gate break. After the gate break, unnecessary resins such as the molded product runner 2a and the molded product cal 2b are dropped and recovered on the lower scrap box 46. Next, only the molded product 2 is transported from the delegate part C to the storage part B while being held by the chuck hand 18 and stored in the storage magazine 47 mounted below.
[0034]
Next, the conveyance body 17 returns from the storage part B to the delegation part C again and waits until the resin sealing operation is completed. When the resin sealing operation is completed and the mold die 27 is opened, the transfer body 17 moves to the resin sealing portion D, and as described above, the lower mold ejector pins 52 protruding from the lower mold 30 and The molded product 2 and unnecessary resin that are supported at a position slightly lifted by the frame ejector pin 53 are held with the gap between the chuck hands 18 widened, and moved to the delegation section C and placed again.
[0035]
Then, after the molded product 2 and the unnecessary resin are placed on the delegation unit C, the same operation is repeated while returning to the supply unit A and holding the molded product 1 and the resin tablet 7 supplied on the supply table 5 again. .
[0036]
In this embodiment, the transport body 17 serves as both a loader for transporting the molded product 1 and an unloader for transporting the molded product 2. For example, a loader and an unloader are used as the transport body 17. If it is arranged in two upper and lower layers and moved individually, the machine cycle can be further shortened and the speed can be increased.
When a circuit board for BGA is used as the molded product 1, the drawer chuck hand 4 that is pulled out from the supply magazine 3 onto the supply table 5 may be provided integrally with the carrier 17. In this case, when the molded product 1 is changed from a lead frame to a BGA circuit board, the change of the drawing position on the supply table 5 can be changed by the movement of the transport body 17, and the storage magazine 47 is When the storage magazine 49 is changed to the BGA storage magazine 49, the storage pusher 51 needs to be provided separately. However, the BGA storage magazine 49 is moved along the storage rail 50 by pulling the drawer chuck hand 4. There are advantages such as being able to be used for storage.
[0037]
According to the above configuration, the supply storage area P having the supply portion A for supplying the molded product 1, the storage portion B for storing the molded product 2, and the delegate portion C for separating the molded product 2 and unnecessary resin is resin-sealed. Since it is centrally located adjacent to each other on the one side with respect to the molding area Q having the part D, an additional area formed around the molding area with changes in the device configuration and changes in the device configuration accompanying the exchange of the molding type Since an extension unit having various functions can be added to R, the apparatus can be multi-functionalized, and the apparatus configuration can be easily modified particularly in response to the needs for high-mix low-volume production.
[0038]
  Moreover, since the supply part A, the storage part B, the delegation part C, and the resin sealing part D of the molding area Q in the supply storage area P are linearly adjacent to each other, the moving path of the transport body 17 is the shortest distance. Therefore, the machine cycle can be shortened. In addition, the same carrier 17 can supply the molded product 1 to the resin sealing portion D, take out the molded product 2 to the delegate portion C, and transport the molded product 2 from the delegate portion C to the storage portion B. Therefore, even if the molding type is exchanged, the parts can be shared as much as possible. In particular, the chuck hand 18 mounted on the transport body 17 has a rail shape with an L-shaped cross section. If the distance between them is variable, the molded product 1 and the molded product 2 can be held by changing the distance between the hands, and the type of the molded product can be changed. However, it is not necessary to replace the chuck hand 18 one by one. Further, the chuck hand 18 mounted on the transport body 17 can be delivered at a position where the molded product 2 is pushed up from the lower mold 30 by the lower mold ejector pin 52 and the frame ejector pin 53 and released from the lower mold 30. It is no longer necessary to form a relief (recessed portion) on the surface of the substrate, and the manufacturing cost can be reduced. In addition, accumulation of dust such as resin powder in the recessed portion can be prevented, which can contribute to an improvement in cleaning performance. In particular, the air suction port 21 provided in the transport body 17 and the lock blocks 58 and 59 for positioning the XY direction provided in the upper mold 28 and the lower mold 30 are arranged so as not to interfere with each other. The cleaning effect can be enhanced, and the function can be simplified by using a cleaning brush as an option. Further, in the supply storage area P, the molded product 1 stored in the supply magazine 3, the molded product 2 stored in the storage magazine 47, the scrap BOX 46, and the dust BOX 46 in the molding area Q are the same as the drawing direction of the mold chase. Each side can be replaced from the side, making maintenance work extremely easy and working space around the device.etcSince no empty space is required, it is possible to effectively use the installation area in the clean room.
[0039]
In this embodiment, the mold 27 is described as a mold having one frame, but the present invention can be applied to a mold having two frames or more. Further, the resin sealing portion D may be equipped with a plurality of mold dies 27 and press units.
Moreover, although it has the apparatus structure using the solid resin tablet 7 as sealing resin, if an extension unit is provided as mentioned above, granular resin, powdery resin, liquid resin, sheet Resin, jelly resin, etc. can also be used.
In addition, if the structure using the release film 38 is used, the mold surface can be cleaned and the molding quality can be improved. In addition, when a circuit board for BGA is clamped to the mold 27, terminals such as solder balls are used. This is effective because the resin can be sealed without damaging the formation surface.
[0040]
【The invention's effect】
According to the resin sealing device according to the present invention, the supply storage area having the supply portion for supplying the molded product, the storage portion for storing the molded product, and the degate portion for separating the molded product and the unnecessary resin is the resin sealing portion. Since there is a concentrated arrangement adjacent to each other on the one side with respect to the molding area having a variety of types, there are various modifications to the expansion area R formed around the molding area in accordance with changes in the equipment form and changes in the form of the equipment. Since an extension unit having functions can be added, the apparatus can be multi-functionalized, and in particular, the apparatus configuration can be easily modified to meet the needs for high-mix low-volume production.
[0041]
  In addition, since the supply section, the storage section, the degate section in the supply storage area, and the resin sealing section D in the molding area are arranged linearly adjacent to each other, the moving path of the transport body is sufficient in the shortest distance. Can be shortened, and the apparatus can be downsized. In addition, it is possible to transport the molded product from the supply section to the resin sealing section and the molded product from the resin sealing section to the storage section with the same transport body. Parts can be shared as much as possible, especially when the chuck hand mounted on the transport body has a rail shape with an L-shaped cross section and the distance between the hands is variable In addition, it is possible to hold the molded product and the molded product by changing the distance between the hands, and it is not necessary to replace the chuck hand one by one even if the type of the molded product is changed. In addition, the chuck hand equipped on the transport body can be delivered at a position where the molded product is pushed up from the lower mold and released, so there is no need to form a relief (concave part) on the surface of the lower mold, and the manufacturing cost is reduced. In addition to being able to reduce, it is possible to prevent dust such as resin powder from accumulating in the recess, which can contribute to improvement in cleaning performance. In particular, the cleaning effect can be enhanced by disposing the air suction port provided in the transport body and the lock block for positioning the XY direction provided in the upper mold and the lower mold so as not to interfere with each other. At the same time, it is possible to simplify the function by using a cleaning brush as an option. Also, in the supply storage area, the molded product stored in the supply magazine, the molded product stored in the storage magazine, the scrap BOX, and the dust BOX in the molding area can be exchanged from the same side as the mold chase pull-out direction. Because it can be done, it is extremely easy to perform maintenance work, and the work space around the deviceetcSince no empty space is required, it is possible to effectively use the installation area in the clean room.
[Brief description of the drawings]
FIG. 1 is a plan view showing a layout configuration of a resin sealing device.
FIG. 2 is a front view of the resin sealing device of FIG.
FIG. 3 is a left side view of the resin sealing device of FIG. 1;
FIG. 4 is an explanatory view showing configurations of a mold and a chuck hand.
FIG. 5 is a plan view of an upper mold and a lower mold of a mold.
FIG. 6 is a plan view showing a layout configuration of a conventional resin sealing device.
[Explanation of symbols]
A Supply section
B storage
C degate
D Resin sealing part
P Supply storage area
Q Molding area
R Additional area
1 Molded product
2 Molded products
2a Molded product runner
2b Cal
2c Projection part
3 Supply magazine
4 Drawer chuck hand
5 Supply table
6 Drawer motor
7 resin tablets
8 Parts feeder
9 Tablet elevation mechanism
10 Holder
11 Filling pusher
12 Holder support member
13 fulcrum
14 Belt
15 Guide shaft
16 Guide hole
17 Carrier
18 Chuck hand
18a Claw
19 Tablet holder
20 Top hold
21 Air suction port
22 Transport motor
23, 36 Screw shaft
24 Movable plate
25 guide rail
26 Control unit
27 Mold
27a pot
28 Upper mold
28a Upper Cal
28b Protrusion
28c Upper mold cavity
29 Fixed platen
30 Lower mold
30a Lower runner
30b Lower mold cavity
30c guide pin
31 Movable platen
32 Guide post
33 Plunger
34 Uniform pressure unit
35 Plunger vertical movement mechanism
37 nuts
38 release film
39 Release film supply mechanism
40 Ejector pin drive unit
41 Dust BOX
42 Filter section
43 Case fixing part
44 Lower presser
45 Extruding rod
46 Scrap Box
47 Storage magazine
48 Molded product elevation mechanism
49 Storage magazine for BGA
50 rails for storage
51 Pusher for storage
52 Lower Ejector Pin
53 Frame ejector pin
54 Lower Ejector Pin Plate
55 Ejector rod
56 Upper Ejector Pin
57 Upper ejector pin plate
58, 59 Lock block
60 casters
61 Support pillar

Claims (5)

A supply section for supplying a molded product, a storage section for storing a molded product, and a supply storage area having a delegate section for separating a molded product and unnecessary resin are adjacent to each other on one side with respect to a molding area having a resin sealing portion and are linearly focused arranged, additional possible expansion area the extension unit in the empty area of the periphery of the shaped areas are formed, the transport operation from a supply of the molded article to the resin sealing portion, the Resin sealing characterized in that at least two operations among the conveying operation of the molded product and the unnecessary resin to the delegation unit and the conveying operation of the molded product from the delegation unit to the storage unit are performed using the same conveyance body. Stop device. In the supply storage area, the molded product stored in the supply magazine, the molded product stored in the storage magazine, the scrap box for collecting unnecessary resin, and the dust box in the molding area are respectively from the same side as the mold chase drawing direction. 2. The resin sealing device according to claim 1, wherein the replacement work can be performed . 3. The resin seal according to claim 1, wherein the supply portion, the storage portion, the degate portion, and the resin sealing portion of the molding area in the supply and storage area are linearly arranged adjacent to each other in this order. Stop device. 4. The chuck hand mounted on the transport body has a rail shape with an L-shaped cross section, and is provided so that a distance between the hands is variable. A resin sealing device according to claim 1. 5. The resin sealing device according to claim 1, wherein the transport body reciprocates between the supply unit and the resin sealing unit along a guide rail .

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