JP2024044401A - Resin supplying device, resin molding device, and method for manufacturing resin molded product - Google Patents

Abstract

[Problem] To solve problems such as clogging caused by the passage of vertically oriented resin tablets with a simple structure. [Solution] A resin supplying device 8 for supplying cylindrical resin tablets T used in resin molding includes a resin delivery section 81 for delivering the resin tablets T by vibration, a resin passage section 821 through which the resin tablets T delivered by the delivery section 81 pass, and a resin delivery section 822 for delivering the resin tablets T that have moved through the resin passage section 821. The resin passage section 821 has a guide groove 111 that contacts the outer peripheral surface of the horizontally oriented resin tablets T and guides the horizontally oriented resin tablets T to pass to the resin delivery section 822 side, and an inclined contact surface 121 that is formed at an angle with respect to the passing direction X that passes to the resin delivery section 822 side and can come into contact with the outer peripheral surface of the vertically oriented resin tablets T. [Selected Figure] FIG.

Description

The present invention relates to a resin supply device, a resin molding device, and a method for manufacturing a resin molded product.

Some conventional resin molding apparatuses supply a cylindrical resin tablet to a mold and perform resin molding using the resin tablet. In this resin molding apparatus, a plurality of resin tablets are held by a loader and transported to a mold, and the resin tablets are supplied to the loader by a resin supply device.

Here, when supplying resin tablets to the loader, the resin tablets must be aligned to match the loader, and if horizontal and vertical resin tablets are mixed, there is a risk of problems such as clogging before being supplied to the loader.

For this reason, it has been considered to align the resin tablets in one direction before supplying them to the loader. For example, Patent Document 1 discloses a tablet supply device that stores a tablet in an upright position in a tablet holder, moves the tablet holder to a molding die, and supplies the tablet to the molding die.

This tablet supply device has a tablet scraping section that scrapes up tablets arranged in random directions, and a tablet alignment section that aligns the scraped up tablets, and the tablet alignment section is provided with a lift mechanism that puts tablets in a horizontal position into an upright position. Specifically, the tablet alignment section is provided with a confirmation sensor that determines whether the tablet is in a horizontal or upright position, and when the confirmation sensor determines that the tablet is in a horizontal position, the lift mechanism lifts the end of the tablet to put it into an upright position.

JP 2000-317984 A

However, the mechanism for aligning the tablet to one position, such as changing the tablet's horizontal position to an upright position as described above, is complex and requires space to install.

The present invention was made to solve the above problems, and its main objective is to use a simple structure to eliminate problems such as clogging that occurs when a vertically oriented resin tablet enters a section where a horizontally oriented resin tablet should pass through.

That is, the resin supplying device according to the present invention is a resin supplying device that supplies cylindrical resin tablets used in resin molding, and is equipped with a resin delivery section that delivers the resin tablets by vibration, a resin passage section through which the resin tablets delivered by the resin delivery section pass, and a resin delivery section that delivers the resin tablets that have moved through the resin passage section, and is characterized in that the resin passage section has a guide groove that contacts the outer peripheral surface of the horizontally oriented resin tablet to guide the horizontally oriented resin tablet to pass toward the resin delivery section, and an inclined contact surface that is formed at an angle with respect to the passing direction passing toward the resin delivery section and contacts the outer peripheral surface of the vertically oriented resin tablet.

The present invention, configured in this way, can easily eliminate problems such as clogging caused by a vertically oriented resin tablet entering an area where a horizontally oriented resin tablet should pass through.

1 is a schematic diagram showing the configuration of a resin molding apparatus according to an embodiment of the present invention. FIG. 2 is a partial cross-sectional view showing a main part of a press unit according to the embodiment. FIG. 2 is a plan view showing a schematic configuration of a resin supplying device (resin supplying module) of the embodiment. 4 is a front view showing a schematic configuration of the resin supply module of the embodiment. FIG. It is a perspective view showing the unit member of the same embodiment. They are (a) a plan view of the unit member, (b) a view seen from the passing direction X of the unit member, and (c) a diagram showing the relationship between the center of gravity of the resin tablet and the notch portion of the same embodiment. A diagram showing (a) a passing region R1 for a horizontally oriented resin tablet, (b) a passing region R2 for a vertically oriented resin tablet, and (c) a region R3 in which an inclined contact surface can be provided in the unit member of the same embodiment. It is. It is a perspective view and a top view showing how a horizontally oriented resin tablet passes through a unit member in the same embodiment. 11A and 11B are a perspective view and a plan view showing a state in which a vertically oriented resin tablet passes through a unit member in the embodiment. FIG. 11 is a perspective view showing a unit member of a modified embodiment. 1A is a perspective view showing a unit member of a modified embodiment, FIG. 1B is a view seen from the passing direction X (showing a passing region R1), and FIG. 1C is a view seen from the passing direction X (showing a passing region R2).

Next, the technology according to the present invention will be described in more detail by giving examples. However, the present invention is not limited to the following techniques.

The resin supplying device of technology 1 according to the present invention is a resin supplying device that supplies cylindrical resin tablets used in resin molding, and is equipped with a resin delivery section that delivers the resin tablet by vibration, a resin passage section through which the resin tablet delivered by the resin delivery section passes, and a resin delivery section that delivers the resin tablet that has moved through the resin passage section, and is characterized in that the resin passage section has a guide groove that contacts the outer peripheral surface of the horizontally oriented resin tablet and guides the horizontally oriented resin tablet to pass toward the resin delivery section, and an inclined contact surface that is formed at an angle with respect to the passing direction passing toward the resin delivery section, and contacts the outer peripheral surface of the vertically oriented resin tablet.
With this resin supply device, the resin passage section is provided with a guide groove for guiding the passage of the horizontal resin tablet, so that the horizontal resin tablet can be stably passed. In addition, since an inclined contact surface is provided that is inclined with respect to the passing direction of the resin discharge section and contacts the outer peripheral surface of the vertical resin tablet, the vertical resin tablet moves in a direction deviating from the passing direction while contacting the inclined contact surface as it proceeds through the resin passage section, and is removed from the resin passage section. This makes it possible to eliminate problems such as clogging caused by a vertical resin tablet entering a section where a horizontal resin tablet should pass. Therefore, the resin tablet can be stably supplied to the loader. Furthermore, the present invention is configured to send out the resin tablet by vibration, and is particularly effective for resin tablets having a shape that is easily turned vertical by vibration (for example, a resin tablet whose axial length is less than one time its diameter).

In addition to the configuration of the resin supplying device of the second technique according to the present invention, it is preferable that the inclined contact surface is formed so as to cross the guide groove in a plan view of the guide groove.
With this configuration, since the inclined contact surface is formed so as to cross the guide groove, it is possible to easily remove a vertically oriented resin tablet from the resin passage portion.

In the resin supply device of Technology 3 according to the present invention, in addition to the configuration of Technology 1 or 2 described above, it is desirable that the resin passage portion has a cutout portion on the side where the vertically oriented resin tablet moves in contact with the inclined contact surface, for allowing the vertically oriented resin tablet to fall from the resin passage portion.
Providing such a cutout portion makes it easier to remove a vertically oriented resin tablet from the resin passage portion.

In addition to the configuration of any one of the above-mentioned technologies 1 to 3, it is desirable that the resin supplying device of technology 4 according to the present invention is arranged so that the inclined contact surface is provided outside the passing area of the horizontally oriented resin tablet when viewed from the passing direction in the resin passage section.
With this configuration, the inclined contact surface can allow the resin tablet to pass through without coming into contact with the resin tablet.

A cylindrical resin tablet has a circular shape when viewed from the axial direction, and a rectangular shape when viewed from a direction perpendicular to the axial direction. The passage area of the tablet is circular, and the passage area of the vertically oriented resin tablet is rectangular. In order to suitably remove vertically oriented resin tablets by taking advantage of this, the resin supply device of technique 5 according to the present invention has the structure of any one of techniques 1 to 4 described above, as well as the tilted resin tablet. It is desirable that the contact surface contacts the lower or upper portion of the outer peripheral surface of the vertically oriented resin tablet.

In addition to the configuration of any one of the above-mentioned techniques 1 to 5, the resin supply device of technique 6 according to the present invention is such that the resin passage portion is vertically oriented until the vertically oriented resin tablet comes into contact with the inclined contact surface. It is desirable to have a flat part that contacts the bottom surface of the resin tablet in the orientation.
With this configuration, the vertically oriented resin tablet moves to the inclined contact surface while remaining vertically oriented and comes into contact with the inclined contact surface, ensuring that the vertically oriented resin tablet is removed by the inclined contact surface. be able to.

In the resin supply device of Technology 7 according to the present invention, in addition to the configuration of any one of Technologies 1 to 6 described above, it is desirable that the guide groove and the inclined contact surface are formed in a unit member that constitutes a part of the resin passage portion.
With this configuration, it is possible to easily provide a mechanism for removing vertically oriented resin tablets in the resin passage section by simply providing the unit member in the resin passage section.

The following can be considered as specific embodiments of the guide groove and the inclined contact surface in the unit member.
That is, in addition to the configuration of the above-mentioned technique 6, the resin supply device of technique 8 according to the present invention has the guide groove extending from one end of the unit member along the passing direction passing toward the resin discharging section side. The inclined contact surface is formed over the other end, and the inclined contact surface is provided on each side of the guide groove in the unit member, and is considered to contact a lower portion of the outer circumferential surface of the vertically oriented resin tablet. .

Further, the following is considered as another specific embodiment of the guide groove and the inclined contact surface in the unit member.
In other words, in the resin supplying device of Technology 9 according to the present invention, in addition to the configuration of Technology 6 described above, the guide portion is formed in the unit member from one end to the other end along the passing direction passing through to the resin discharge portion side, and the inclined contact surface is provided above the guide groove in the unit member and is thought to contact the upper part of the outer peripheral surface of the vertically oriented resin tablet.

In addition to the configuration of any one of the above techniques 1 to 9, it is preferable that the resin supply device of technique 10 according to the present invention further includes a recovery box for recovering the resin tablets removed by the inclined contact surface. .
With this configuration, not only can the resin tablets be collected, but also the collected resin tablets can be reused by returning them to the resin delivery section.

A resin molding device having a resin supply device according to any one of the above techniques 1 to 10 is also an aspect of the present invention.

In addition, the present invention also provides a method for manufacturing a resin molded product by resin molding on a molding object, the method including a resin supplying step of supplying the resin tablet to the loader by a resin supplying device of any one of the above techniques 1 to 10, a transporting step of transporting the resin tablet and the molding object to a molding die by the loader, and a molding step of clamping the molding die to perform resin molding.

<One embodiment of the present invention>
Hereinafter, an embodiment of a resin molding apparatus according to the present invention will be described with reference to the drawings. In addition, in all of the drawings shown below, for ease of understanding, some parts are omitted or exaggerated as appropriate. The same components are given the same reference numerals and the description thereof is omitted as appropriate.

<Overall configuration of resin molding equipment>
The resin molding apparatus 100 of this embodiment molds a molding object W1 to which an electronic component is fixed, by transfer molding using a resin material. Further, this resin molding apparatus 100 uses, as a resin material, a cylindrical tablet-shaped composite material containing, for example, a thermosetting resin (hereinafter referred to as "resin tablet T"). Further, the resin tablet T has, for example, an axial length L that is not more than one time the diameter D (L/D≦1.0). Note that the shape of the resin tablet T is not limited to L/D≦1.0.

The molding object W1 may be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, or the like, with or without wiring. The electronic component may be, for example, an electronic element such as a semiconductor chip, a resistor element, or a capacitor element, or an electronic component in which at least one of these electronic elements is sealed with resin.

Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes a supply module 2 that supplies a molding object W1 and a resin tablet T before molding, two resin molding modules 3A and 3B that mold resin, A storage module 4 that accommodates a subsequent molded object W2 (hereinafter referred to as "resin molded product W2") is provided as a component. Note that the supply module 2, resin molded modules 3A, 3B, and storage module 4, which are components, can be attached to and removed from other components, and can be replaced.

The resin molding apparatus 100 also includes a transport mechanism 5 (hereinafter referred to as "loader 5") that transports the molding object W1 and resin tablet T supplied by the supply module 2 to the resin molding modules 3A and 3B, and a resin molding It includes a transport mechanism 6 (hereinafter referred to as "unloader 6") that transports the resin molded product W2 resin-molded by the modules 3A and 3B to the storage module 4.

The supply module 2 of this embodiment is a module in which a molding object supply module 7 and a resin supply module 8 are integrated.

The molding object supplying module 7 includes a molding object sending section 71 and a molding object supplying section 72. The molding object delivery section 71 sends out the molding object W1 in the magazine to the molding object supply section 72. The molding object supply section 72 receives the molding object W1 from the molding object sending section 71, aligns the received molding object W1 in a predetermined direction, and delivers it to the loader 5.

The resin supply module 8 is a resin supply device that supplies the resin tablets T to the loader 5, and includes a resin delivery section 81 and a resin supply section 82. The resin delivery section 81 receives the resin tablets T from the stocker 83 that accommodates a plurality of resin tablets T, and sends out the resin tablets T to the resin supply section 82. The resin supply section 82 receives the resin tablets T from the resin delivery section 81, aligns the received resin tablets T in a predetermined direction, and delivers them to the loader 5. Note that the detailed configuration of the resin supply module 8 will be described later.

The resin molding modules 3A and 3B each have a press section 31. As shown in FIG. 2, each press section 31 has a lower die 311, which is a molding die that can be raised and lowered, an upper die 312, which is a molding die fixed above the lower die 311 in an opposing relationship, and a clamping mechanism 313 for clamping the lower die 311 and the upper die 312. The lower die 311 is fixed to the upper surface of a movable platen 314, and the upper die 312 is fixed to the lower surface of an upper fixed platen 315. The clamping mechanism 313 clamps or opens the upper die 312 and the lower die 311 by moving the movable platen 314 up and down.

The lower die 311 is formed with a mounting section 311a in which the molding object W1 transported by the loader 5 is mounted. The lower die 311 is formed with a plurality of pots 311b in which the resin tablets T transported by the loader 5 are mounted. The lower die 311 is also provided with a plunger 316 for injecting the resin tablets T in the pots 311b into, for example, the resin flow paths 312a and cavities 312b formed in the upper die 312.

In addition, a heating section such as a heater (see heater 317 in FIG. 2) is embedded in each of the upper mold 312 and the lower mold 311. The upper mold 312 and the lower mold 311 are normally heated to about 180° C. by this heating section.

<Resin molding operation of resin molding device 100>
Hereinafter, the basic operation of the resin molding apparatus 100 of this embodiment will be described.

The molded object delivery section 71 sends out the molded object W1 in the magazine to the molded object supply section 72 . The molding object supply unit 72 aligns the received molding objects W1 in a predetermined direction and delivers them to the loader 5. In parallel with this, the resin delivery section 81 sends out the resin tablets T received from the stocker 83 to the resin supply section 82 . The resin supply unit 82 delivers a necessary number (four in FIG. 1) of the received resin tablets T to the loader 5.

Next, the loader 5 simultaneously transports the two molding objects W1 and the four resin tablets T that it received to the press section 31. The loader 5 supplies the molding objects W1 to the mounting section 311a of the lower die 311 and the resin tablets T to the inside of the pot 311b formed in the lower die 311.

Thereafter, the upper mold 312 and the lower mold 311 are clamped using the mold clamping mechanism 313. Then, the resin tablets T in each pot 311b are heated and melted to generate molten resin, and the molten resin is pressed by the plunger 316. Thereby, the molten resin is injected into the cavity 312b formed in the upper mold 312 through the resin flow path 312a. Subsequently, by heating the molten resin for a time required for curing, the molten resin is cured to form a cured resin. As a result, the electronic component in the cavity 312b and its surrounding area are sealed in a cured resin (sealing resin) molded to correspond to the shape of the cavity 312b.

Next, after the time required for curing has elapsed, the upper mold 312 and the lower mold 311 are opened to release the resin molded product W2. Thereafter, using the unloader 6, the resin molded product W2 sealed with resin by the press section 31 is stored in the resin molded product storage section 41 of the storage module 4.

The entire operation of the resin molding apparatus 100, including the above series of operations, is controlled by the control unit 9. In FIG. 1, the control unit 9 is provided in the supply module 2, but it may be provided in another module. The control unit 9 is composed of, for example, a dedicated or general-purpose computer having a CPU, internal memory, AD converter, input/output inverter, etc.

<Specific Configuration of Resin Supply Module 8>
Next, the resin supply module 8 of this embodiment has a resin feeding section 81 that feeds out resin tablets T by vibration, and a resin supply section 82 that supplies the resin tablets T fed out by the resin feeding section 81 to the loader 5, as shown in Figures 1, 3 and 4.

The resin delivery section 81 uses a so-called parts feeder, and as shown in Figs. 1, 3 and 4, has a resin receiving section 811 that stores multiple resin tablets T, a vibration section 812 that vibrates the resin receiving section 811 to move the resin tablets T, and an arrangement section 813 that arranges the resin tablets T moved by the vibration in a line. The resin receiving section 811 is replenished with resin tablets T from a stocker 83 provided above the resin receiving section 811. The arrangement section 813 arranges the resin tablets T in a horizontal state. Here, "horizontal" can also be referred to as lying on its side or horizontal position, and the central axis of the cylindrical resin tablets T is horizontal. Note that "vertical" described later can also be referred to as standing or erect position, and the central axis of the cylindrical resin tablets T is vertical.

The arrangement section 813 is provided with a detection sensor (e.g., a light-transmitting sensor, not shown) that detects whether a predetermined number of resin tablets T are arranged in the arrangement section 813. If the detection signal from the detection sensor indicates that the predetermined number of resin tablets T are not arranged in the arrangement section 813, the control section 9 activates the vibration section 812 so that the predetermined number of resin tablets T are arranged in the arrangement section 813.

As shown in FIGS. 1, 3, and 4, the resin supply section 82 has a resin passage section 821 through which the resin tablets T sent out from the resin delivery section 81 pass, and a resin passage section 821 through which the resin tablets T that have moved through the resin passage section 821 are passed. It has a resin transport section 822 that transports the resin by delivering it to the loader 5.

The resin passage section 821 has one end provided at the exit of the arrangement section 813 of the resin delivery section 81, and is used to move the resin tablets T sent out from the arrangement section 813. Here, one end (inlet) of the resin passage section 821 is provided with a gap so as not to contact the outlet of the array section 813. This prevents the vibration of the resin delivery section 81 from being transmitted to the resin passage section 821 via the arrangement section 813. Further, the gap between the outlet of the arrangement part 813 and one end of the resin passage part 821 is such that it does not inhibit the movement of the resin tablet T from the arrangement part 813 to the resin passage part 821 (for example, 2 mm).

In addition, as shown in FIG. 4, the resin delivery section 81 is supported by the resin molding device 100 via anti-vibration rubber 85, which prevents vibrations from the resin delivery section 81 from being transmitted to the resin passage section 821 via the surrounding members. Note that FIG. 4 shows an example in which anti-vibration rubber 85 is provided on the bottom surface of the support leg 84 that supports the resin delivery section 81.

As shown in Figs. 3 and 4, the resin passage section 821 arranges the horizontally oriented resin tablets T sent out from the arrangement section 813 in a line and moves them in a straight line to the transfer position DP to the loader 5 by the resin discharge section 822. Specifically, the horizontally oriented resin tablets T sent out from the arrangement section 813 enter the resin passage section 821 one by one, and the resin tablets T sent out from the arrangement section 813 push the resin tablets T already in the resin passage section 821. As a result, the horizontally oriented resin tablets T enter the resin passage section 821 one after another, and while being arranged in a line, the horizontally oriented resin tablets T pass through the resin passage section 821 and move to the transfer position DP.

The resin discharge section 822 discharges the horizontally oriented resin tablets T that have passed through the resin passage section 821 by aligning them in groups of multiple tablets and transferring them to the loader 5. This resin discharge section 822 aligns the resin tablets T in correspondence with the resin tablet storage section 51 (see FIG. 4) provided in the loader 5. Specifically, the resin discharge section 822 aligns the horizontally oriented resin tablets T at the transfer position DP of the resin passage section 821 so that they are parallel to each other while remaining in the horizontal state. After this alignment, the resin discharge section 822 rotates the resin tablets T so that they are vertically oriented, and stores and transfers the vertically oriented aligned resin tablets T to the resin tablet storage section 51 of the loader 5.

<Configuration for removing vertically oriented resin tablet T in resin passage section 821>
The resin supply module 8 of this embodiment is configured to remove the vertically oriented resin tablet T from the resin passage section 821.

Specifically, as shown in Figures 5 and 6, the resin passage section 821 of the resin supply module 8 has a guide section 11 that contacts the outer peripheral surface of a horizontally oriented resin tablet T to guide the passage of the horizontally oriented resin tablet T, and a removal section 12 that contacts the outer peripheral surface of a vertically oriented resin tablet T to prevent the passage of the vertically oriented resin tablet T and remove it. Here, the outer peripheral surface of the resin tablet T refers to the side surface excluding both axial end faces of the resin tablet T, and is the side surface having a circular cross section perpendicular to the axial direction.

In this embodiment, as shown in Figures 3 and 4, a unit member 10 having a guide portion 11 and a removal portion 12 is provided at one end (entrance) of the resin passage portion 821. Note that the guide portion 11 and the removal portion 12 are not shown on the unit member 10 in Figures 3 and 4. The unit member 10 constitutes a part of the resin passage portion 821. Since this unit member 10 forms one end of the resin passage portion 821, the unit member 10 is provided with a gap so as not to come into contact with the outlet of the arrangement portion 813.

Further, as shown in FIGS. 5 and 6, the unit member 10 is configured such that a resin tablet T enters from one end 10a and a horizontally oriented resin tablet T exits from the other end 10b. The resin tablet T moves. Specifically, the unit member 10 is provided with a guide portion 11 and a removal portion 12 on its upper surface. In the unit member 10 of this embodiment, a guide portion 11 and a removal portion 12 are integrally formed.

As shown in FIGS. 5 and 6, the guide section 11 moves the horizontally oriented resin tablet T linearly along its axial direction on the upper surface of the unit member 10.

Specifically, the guide portion 11 is a guide formed on the upper surface of the unit member 10 from one end portion 10a to the other end portion 10b along the passage direction X passing toward the resin discharge portion 822 side of the resin passage portion 821. It has a groove 111. The cross-sectional shape of the guide groove 111 perpendicular to the passing direction It may be a polygonal groove shape having a V-shaped cross section, for example, which contacts at a point.

Further, as shown in FIGS. 6(a) and (c), the guide groove 111 has an opening width WD (width dimension perpendicular to the passing direction , less than the diameter of the resin tablet T, specifically, less than half the diameter D of the resin tablet T. Although the guide groove 111 has an opening width WD wider on the other end 10b side than the removal section 12, it may have a constant opening width from one end 10a to the other end 10b.

The removal part 12 has an inclined contact surface 121 that contacts the outer peripheral surface of the vertically oriented resin tablet T. The inclined contact surface 121 is formed to be inclined with respect to the passing direction X passing toward the resin discharge section 822 side of the resin passage section 821 in plan view. Here, the inclination angle θ (see FIG. 6(a)) of the inclined contact surface 121 with respect to the passing direction X is, for example, 20 to 60 degrees, preferably 30 to 45 degrees. The inclined contact surface 121 of this embodiment is a vertical plane formed on the upper surface of the unit member 10.

As shown in Figs. 5 and 6, the inclined contact surfaces 121 of this embodiment are formed to cross the guide groove 111 in a plan view of the guide groove 111, and are provided on both sides of the guide groove 111. One inclined contact surface 121a is provided on the one end 10a side (upstream side) across the guide groove 111, and the other inclined contact surface 121b is provided on the other end 10b side (downstream side) across the guide groove 111. These inclined contact surfaces 121a and 121b are formed to be in a straight line in a plan view (see Fig. 6(a)).

Here, when viewed from the passing direction X, the passage area R1 of the horizontally oriented resin tablet T in the unit member 10 is as shown in FIG. 7(a). Furthermore, when viewed from the passing direction X, the passage area R2 of the vertically oriented resin tablet T in the unit member 10 is as shown in FIG. 7(b). Therefore, the inclined contact surface 121 is provided in a region R3 outside the passage region R1 of the horizontally oriented resin tablet T and inside the passage region R2 of the vertically oriented resin tablet T, as viewed from the passing direction X. (See Figure 7(c)). Then, the inclined contact surface 121 comes into contact with the lower or upper part of the outer peripheral surface of the vertically oriented resin tablet T, and guides the removal of the vertically oriented resin tablet T. In this embodiment, it contacts the lower part of the outer peripheral surface of the vertically oriented resin tablet T.

As shown in Figs. 5 and 6, the unit member 10 of this embodiment has a flat portion 13 that contacts the bottom surface of the vertically oriented resin tablet T until the vertically oriented resin tablet T contacts the inclined contact surface 121 of the removal section 12. The flat portion 13 is formed on both sides of the guide groove 111 constituting the guide section 11 on the one end 10a (entrance) side of the inclined contact surface 121 of the removal section 12 in the unit member 10. The height position of the flat portion 13 is set to be the same as or slightly lower than the height position of the bottom surface of the arrangement section 813. The width dimension of the flat portion 13 perpendicular to the passing direction X is larger than the diameter D of the resin tablet T. This prevents the vertically oriented resin tablet T from getting caught on the unit member 10 when it enters the unit member 10 from the arrangement section 813. As described above, the opening width WD of the guide groove 111 in the width direction Y is less than the diameter of the resin tablet T (specifically, less than half the diameter D of the resin tablet T), so the vertically oriented resin tablet T moves across the guide groove 111 on the flat surface 13. The vertically oriented resin tablet T then moves toward the inclined contact surface 121 while maintaining the vertical orientation and comes into contact with the inclined contact surface 121.

Furthermore, as shown in FIGS. 5 and 6, in the unit member 10 of this embodiment, the vertically oriented resin tablet T is placed on the side where the vertically oriented resin tablet T contacts the inclined contact surface 121 and moves (the side where it is removed). It has a notch 14 for allowing the resin tablet T to fall from the unit member 10. Here, the notch portion 14 is formed by cutting out the side surface of the unit member 10 toward the guide groove 111 on the side where the vertically oriented resin tablet T is removed.

Further, the notch portion 14 of this embodiment is formed by cutting the guide groove 111 after the vertically oriented resin tablet T moves in contact with the inclined contact surface 121a on the one end side (upstream side) across the guide groove 111. It is formed so as not to engage with the corner of the inclined contact surface 121b on the other end side (downstream side). Specifically, the notch portion 14 is formed when the vertically oriented resin tablet T contacts the inclined contact surface 121a on one end side (upstream side) with the guide groove 111 in between, and moves to the other side with the guide groove 111 in between. Before moving to the end side (downstream side) inclined contact surface 121b, the center of gravity G of the vertically oriented resin tablet T is formed to be located outside the notch 14 (Fig. 6(c) )reference). As a result, the vertically oriented resin tablet T rotates outward from the cutout portion 14 and falls due to the rotational moment due to its own weight before contacting the inclined contact surface 121b on the other end side.

As shown in FIG. 4, the resin supply module 8 of this embodiment further includes a collection box 15 for collecting the resin tablets T removed by the inclined contact surface 121. Specifically, the collection box 15 is provided below the unit member 10 and receives the resin tablet T that has fallen from the unit member 10. The resin tablets T collected in the collection box 15 may be discarded or returned to the stocker 83 or the resin receiving section 811 of the resin delivery section 81.

In addition, the resin passage section 821 of the resin supply module 8 is provided with a weighing section (not shown) that measures the weight of the resin tablet T. If the weight of the resin tablet T is not within the allowable range as a result of being weighed by this weighing section, the resin tablet T is discarded from the resin passage section 821. Here, as shown in FIG. 4, an openable and closable disposal section 16 is formed at the bottom part of the resin passage section 821, and when the disposal section 16 is opened, the resin tablet T whose weight is not within the allowable range falls and is discarded in the disposal box 17. In this embodiment, the disposal section 16 is provided between the unit member 10 and the transfer position DP in the resin passage section 821. The disposal box 17 is provided separately from the collection box 15.

<Behavior of Resin Tablet T in Unit Member 10>
Next, the behavior of the resin tablets T when the horizontally oriented resin tablets T and the vertically oriented resin tablets T are inserted into the unit member 10 will be briefly described.

First, when the horizontally oriented resin tablet T enters the unit member 10 (FIG. 8(a)), the horizontally oriented resin tablet T is guided by the guide groove 111 formed in the unit member 10. Then, a part of the outer peripheral surface of the sideways resin tablet T in the circumferential direction comes into contact with the guide groove 111, and passes toward the resin discharging section 822 while maintaining its sideways posture (Fig. 8(b) → (c) )). At this time, the horizontally oriented resin tablet T does not contact the inclined contact surface 121.

Next, when the vertically oriented resin tablet T enters the unit member 10 (FIG. 9(a)), the vertically oriented resin tablet T moves along the flat portion 13 formed in the unit member 10. Then, the vertically oriented resin tablet T that has moved on the flat part 13 comes into contact with the inclined contact surface 121a on the one end side (upstream side) across the guide groove 111, and moves in a direction deviating from the passing direction X ( FIG. 9(b)), it moves toward the notch 14 side. When the center of gravity G of the vertically oriented resin tablet T moves to the outside of the notch 14 (see FIG. 6(c)), it rotates outward due to the rotational moment due to its own weight and falls (FIG. 9(c)).

<Effects of this embodiment>
According to the resin molding device 100 of this embodiment, the resin passage section 821 of the resin supply module 8 is provided with a guide groove 111 for guiding the passage of the horizontal resin tablet T, so that the horizontal resin tablet T can be stably passed. In addition, since the inclined contact surface 121 is provided which is inclined with respect to the passing direction X passing through the resin discharge section 822 side and contacts the outer peripheral surface of the vertical resin tablet T, the vertical resin tablet T moves in a direction deviating from the passing direction X while contacting the inclined contact surface 121 as it proceeds through the resin passage section 821, and is removed from the resin passage section 821. In this way, the inclined contact surface 121 of the removal section 12 prevents the vertical resin tablet T from passing through the resin passage section 821 and removes it, so that problems such as clogging caused by the vertical resin tablet T entering the part where the horizontal resin tablet T should pass can be eliminated. Therefore, the resin tablet T can be stably supplied to the loader 5. In particular, this embodiment is configured to send out the resin tablet T by vibration, and is effective for resin tablets T having a shape that is likely to become vertical when vibrated (for example, resin tablets T whose axial length L is less than 1 time the diameter D (L/D≦1.0)).

<Other modified embodiments>
Note that the present invention is not limited to the above embodiments.

For example, in the unit member 10 of the embodiment, the inclined contact surfaces 121a and 121b were provided on both sides of the guide groove 111, but the inclined contact surface 121b was not provided on the other end side with the guide groove 111 interposed therebetween. Alternatively, only the inclined contact surface 121a on one end side with the guide groove 111 in between may be provided.

In the above embodiment, the unit member 10 is provided with a cutout 14, but as shown in FIG. 10, the unit member 10 may be configured without the cutout 14. In this configuration, the vertically oriented resin tablet T first contacts the inclined contact surface 121a on one end side (upstream side) through the guide groove 111 and moves in a direction deviating from the passing direction X, and then contacts the inclined contact surface 121b on the other end side (downstream side) through the guide groove 111 and falls from the unit member 10 and is removed.

Furthermore, in the unit member 10, the removal portion 12 (inclined contact surface 121) may be configured to be provided above the guide groove 111 of the guide portion 11 and to contact the upper portion of the outer peripheral surface of the vertically oriented resin tablet T, as shown in FIG. 11(a). Specifically, the unit member 10 has a lower member 10P in which the guide groove 111 of the guide portion 11 is formed, and an upper member 10Q provided on the upper portion of the lower member 10P and in which the inclined contact surface 121, which is the removal portion 12, is formed. In this configuration, the inclined contact surface 121 of the removal portion 12 is formed so as to surround the upper portion of the passage region R1 of the horizontally oriented resin tablet T when viewed from the passage direction X in the resin passage portion 821, as shown in FIG. 11(b). When a vertically oriented resin tablet T enters the unit member 10, as shown in FIG. 11(c), an inclined contact surface 121 is present in the passage area R2 of the vertically oriented resin tablet T, and the inclined contact surface 121 comes into contact with the upper part of the outer peripheral surface of the vertically oriented resin tablet T, thereby removing the vertically oriented resin tablet T.

In the above embodiment, the unit member 10 is provided at one end of the resin passage portion 821, but the position at which the unit member 10 is provided can be changed as appropriate as long as it is upstream of the transfer position DP of the resin passage portion 821.

In addition, in the above embodiment, a unit member 10 having a guide portion 11 and a removal portion 12 is used, but the configuration may be such that the guide portion 11 and the removal portion 12 are each provided in the resin passage portion 821 without using the unit member 10.

In the above embodiment, the resin discharge section 822 aligns the horizontally oriented resin tablets T that have passed through the resin passage section 821 in groups of several tablets and delivers them to the loader 5 for discharge, but other configurations are also possible. For example, the resin discharge section 822 may discharge the horizontally oriented resin tablets T that have passed through the resin passage section 821 through a conveying path formed of, for example, a resin tube. In this configuration, the horizontally oriented resin tablets T that have passed through the resin passage section 821 are sent out to the conveying path. The multiple tablets T sent out to the conveying path are conveyed through the conveying path by suction force due to negative pressure. In this case, it is possible to configure the resin supply device 8 having the resin discharge section 822 and the resin molding device 100 to be placed in separate locations. For example, even if the resin molding device 100 is installed in a clean room, the resin tablets T can be supplied to the resin molding device 100 from the resin supply device 8 installed outside the clean room through the conveying path.

In addition, it goes without saying that the present invention is not limited to the embodiments described above, and that various modifications can be made without departing from the spirit thereof.

100: Resin molding device W1: Molding object W2: Resin molded product T: Resin tablet 311: Lower die (molding die)
5 ... Loader 8 ... Resin supply module (resin supply device)
Reference Signs List 81: Feed-out section 821: Resin passage section 822: Resin discharge section 10: Unit member X: Passing direction 11: Guide section 111: Guide groove 12: Removal section 121: Inclined contact surface R1: Passing area R2 for horizontally oriented resin tablets Passing area R2 for vertically oriented resin tablets 13: Plane section 14: Cutout section 15: Collection box

Claims (12)

A resin supplying device that supplies cylindrical resin tablets used in resin molding,
A resin delivery section that delivers the resin tablets by vibration;
a resin passage portion through which the resin tablet sent out by the resin sending portion passes;
a resin discharge section that discharges the resin tablet that has moved through the resin passage section,
The resin passage portion is
A guide groove that contacts an outer peripheral surface of the horizontally oriented resin tablet and guides the horizontally oriented resin tablet to pass through the resin discharge section.
A resin supplying device having an inclined contact surface that is formed at an angle with respect to the passing direction toward the resin discharge section and that contacts the outer peripheral surface of the vertically oriented resin tablet. The resin supply device according to claim 1, wherein the inclined contact surface is formed so as to cross the guide groove in a plan view of the guide groove. The resin passage section has a cutout section on a side where the vertically oriented resin tablet moves in contact with the inclined contact surface for allowing the vertically oriented resin tablet to fall from the resin passage section. 2. The resin supply device according to 1 or 2. The resin supply device according to any one of claims 1 to 3, wherein the inclined contact surface is provided outside a passage area of the horizontally oriented resin tablet when viewed from the passage direction in the resin passage section. The resin supply device according to any one of claims 1 to 4, wherein the inclined contact surface contacts a lower part or an upper part of an outer circumferential surface of the vertically oriented resin tablet. The resin passage portion has a flat portion that contacts the bottom surface of the vertically oriented resin tablet until the vertically oriented resin tablet contacts the inclined contact surface. Resin supply device. The resin supply device according to any one of claims 1 to 6, wherein the guide groove and the inclined contact surface are formed in a unit member that constitutes a part of the resin passage section. The guide groove is formed in the unit member from one end to the other end along a passing direction passing through the unit member toward the resin discharge portion,
The resin supplying device according to claim 7 , wherein the inclined contact surfaces are provided on both sides of the guide groove in the unit member and come into contact with a lower portion of an outer peripheral surface of the resin tablet oriented vertically. The guide groove is formed in the unit member from one end to the other end along a passing direction passing toward the resin discharge section,
The resin supply device according to claim 7, wherein the inclined contact surface is provided above the guide groove in the unit member and contacts an upper portion of an outer peripheral surface of the vertically oriented resin tablet. The resin supplying device according to any one of claims 1 to 9, further comprising a collection box for collecting the resin tablets removed by the inclined contact surface. A resin molding device having a resin supply device according to any one of claims 1 to 10. A method for manufacturing a resin molded product by resin molding on a molding object, comprising the steps of:
a resin supplying step of supplying the resin tablet to the loader by the resin supplying device according to any one of claims 1 to 10;
a conveying step of conveying the resin tablet and the molding object to a molding die by the loader;
and a molding step of clamping the mold to perform resin molding.